NGTB30N60L2WG [ONSEMI]
IGBT,N 沟道,带低 VF 开关二极管,600V,30A,VCE(sat)=1.4V;型号: | NGTB30N60L2WG |
厂家: | ONSEMI |
描述: | IGBT,N 沟道,带低 VF 开关二极管,600V,30A,VCE(sat)=1.4V 开关 栅 双极性晶体管 二极管 |
文件: | 总8页 (文件大小:833K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
NGTB30N60L2WG
N-Channel IGBT
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低VF开关二极管内置
600V, 30A, VCE(sat);1.4V
主要特长
IGBT V (sat)=1.4V typ. (I =30A, V =15V)
电气连接图
C
CE
C
GE
IGBT I =100A (Tc=25C)
C
IGBT t =80ns typ.
f
高频应用用开关损失低
最高结温Tj=175C
G
Diode V =1.7V typ. (I =30A)
F
F
Diode t =70ns typ.
5s 抗短路能力
rr
E
N-channel
不含铅和卤, 遵守RoHS
应用
白物家电的功率因数校正
规格
绝对最大额定值 / Ta = 25C (除非特殊指定)
G
C
TO−247
CASE 340AK
E
参数
记号
值
单位
V
集电极-发射极电压(Collector to Emitter Voltage)
栅极-发射极电压(Gate to Emitter Voltage)
V
V
600
20
100
30
CES
V
GES
印刷图
@Tc=25C *2
@Tc=100C *2
A
集电极电流(DC)
受限于Tjmax
1
I
I
C *
A
受脉冲作用的集电极电流
@Tc=100C *2
60
A
Pulsed collector current,
Cpulse
GTB30N
tp=100ms 受限于Tjmax
LOT No.
60L2
受脉冲作用的集电极电流(Pulsed collector current)
tp=1ms 受限于Tjmax
I
I
232
30
A
A
Cpeak
O
二极管平均输出电流(Diode Average Output Current)
功耗(Power Dissipation)
P
225
175
W
D
2
Tc=25C
(我司的理想散热条件) *
Tj
C
C
结温(Junction Temperature)
Tstg
55 to +175
储存温度(Storage Temperature)
注: *1 集电极电流由下式计算:
Tjmax - Tc
(j-c)×V (sat) (I (Tc))
th CE
I (Tc)=
C
R
C
*2 我司的条件为背面散热。
方法为:器件的背面涂上硅脂, 然后将该器件贴在铝制的水冷散热器上。
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed,
damage may occur and reliability may be affected.
ORDERING INFORMATION
See detailed ordering and shipping information on page 8 of this data sheet.
© Semiconductor Components Industries, LLC, 2015
September 2015 - Rev. 2
1
Publication Order Number :
NGTB30N60L2WGCN/D
NGTB30N60L2WG
电气特性/ Ta = 25C (除非特殊指定)
值
参数
记号
条件
单位
min
600
typ
max
集电极-发射极击穿电压
V(
)
I
=500A, V =0V
C GE
V
BR CES
(Collector to Emitter Breakdown Voltage)
Tc=25C
10
A
集电极-发射极截止电流
I
I
V
=600V, V =0V
GE
CES
CE
(Collector to Emitter Cutoff Current)
Tc=150C
1
mA
栅极-发射极漏电流
V
V
=20V, V
=0V
100
nA
V
GES
GE
CE
(Gate to Emitter Leakage Current)
栅极-发射极阈值电压
V
(th)
GE
=20V, I =250A
4.5
6.5
1.6
CE
C
(Gate to Emitter threshold voltage)
Tc=25C
Tc=150C
Tc=25C
1.4
V
V
集电极-发射极饱和电压
V
V
=15V, I =30A
C
GE
(Collector to Emitter Saturated Voltage)
正向二极管电压(Forward Diode Voltage)
V
V
(
)
1.7
1.65
1.7
CE sat
=15V, I =50A
V
GE
C
输入电容(Input Capacitance)
输出电容(Output Capacitance)
I =30A
F
V
F
Cies
4130
pF
集电极-发射极击穿电压
Coes
114
96
pF
pF
V
=20V, f=1MHz
(Collector to Emitter Breakdown Voltage)
反向传输电容
CE
Cres
(Reverse Transfer Capacitance)
开启迟延时间(Turn-on delay time)
t (on)
d
100
60
ns
ns
ns
ns
ns
ns
mJ
mJ
ns
ns
ns
ns
ns
ns
mJ
mJ
nC
nC
上升时间(Rise Time)
t
r
V
CC
=300V, I =30A
C
=30, L=200H
开启时间(Turn-ON Time)
ton
t (off)
540
390
80
R
G
关断迟延时间(Turn-OFF Delay Time)
下降时间(Fall Time)
d
V
GE
=0V/15V
t
f
Vclamp=400V
关断时间(Turn-OFF Time)
开启能量(Turn-ON Energy)
关断能量(Turn-OFF Energy)
开启迟延时间(Turn-on delay time)
上升时间(Rise Time)
toff
500
0.31
1.14
98
参照图1, 图2
Eon
Eoff
t (on)
d
t
85
r
V
CC
=300V, I =50A
开启时间(Turn-ON Time)
C
ton
t (off)
650
380
90
R
=30, L=200H
G
关断迟延时间(Turn-OFF Delay Time)
下降时间(Fall Time)
d
V
GE
=0V/15V
t
f
Vclamp=400V
关断时间(Turn-OFF Time)
开启能量(Turn-ON Energy)
关断能量(Turn-OFF Energy)
总栅极电荷(Total Gate Charge)
栅极-发射极电荷(Gate to Emitter charge)
toff
530
0.638
2.755
166
40
参照图1, 图2
Eon
Eoff
Qg
Qge
V
CE
=300V, V =15V, I =30A
GE
C
栅极-集电极米勒电荷
Qgc
70
70
nC
ns
(Gate to Collector “Miller” Charge)
二极管反向恢复时间
t
I =10A, di/dt=100A/s, V =50V, See Fig.3
F CC
rr
(Diode Reverse Recovery Time)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be
indicated by the Electrical Characteristics if operated under different conditions.
热特性/ Ta = 25C (除非特殊指定)
参数
记号
条件
值
单位
热阻IGBT(结到外壳
Thermal Resistance IGBT (Junction to Case)
热阻二极管 结到外壳
Thermal Resistance Diode (Junction to Case)
热阻 结到环境
)
Tc=25C
Rth(j-c) (IGBT)
Rth(j-c) (Diode)
Rth(j-a)
0.67
1.5
41
C /W
C /W
C /W
(我司的理想散热条件)*2
Tc=25C
(
)
(我司的理想散热条件)*2
(
)
Thermal Resistance (Junction to Ambient)
注: *2 我司的条件为背面散热。
方法为:器件的背面涂上硅脂, 然后将该器件贴在铝制的水冷散热器上。.
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2
NGTB30N60L2WG
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3
NGTB30N60L2WG
www.onsemi.cn
4
NGTB30N60L2WG
www.onsemi.cn
5
NGTB30N60L2WG
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6
NGTB30N60L2WG
图1 : 开关时间测试电路
图2 : 时间图
V
GE
90%
10%
0
I
C
90%
90%
10%
10%
10%
10%
V
CE
0
t
t
f
r
t (off)
d
t (on)
d
t
t
on
off
图3 : 反向恢复时间测试电路
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7
NGTB30N60L2WG
封装尺寸
TO-247
CASE 340AK
ISSUE O
NOTES:
B
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
SEATING
PLANE
A
A
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH. MOLD FLASH SHALL NOT EXCEED 0.13 PER
SIDE. THESE DIMENSIONS ARE MEASURED AT THE
OUTERMOST EXTREME OF THE PLASTIC BODY.
4. SLOT REQUIRED, NOTCH MAY BE ROUNDED.
5. THERMAL PAD CONTOUR OPTIONAL WITHIN DIMEN-
SIONS D1 AND E1.
E
D2
A2
E1
Q
S
E2
D
4
D1
6. LEAD FINISH UNCONTROLLED WITHIN L1.
7. P TO HAVE A MAXIMUM DRAFT ANGLE OF 1.5 TO
THE TOP OF THE PART WITH A MAXIMUM DIAMETER
OF 3.91.
1
2
3
L1
MILLIMETERS
INCHES
MIN
DIM MIN
MAX
5.31
2.59
2.49
1.40
2.39
3.43
0.89
21.46
MAX
0.209
0.102
0.098
0.055
0.094
0.135
0.035
0.845
A
A1
A2
b
b2
b4
c
4.70
2.21
1.50
1.00
1.65
2.59
0.38
20.80
0.185
0.087
0.059
0.039
0.065
0.102
0.015
0.819
0.515
0.020
0.610
0.530
0.170
L
2X b2
b4
c
P
D
A1
M
M
0.635
B A
D1 13.08
3X
b
D2
E
0.51
1.35
0.053
0.640
M
M
0.25
B A
15.49
16.26
e
E1 13.46
E2
e
4.32
5.49
0.216
1 : Gate
5.46 BSC
0.215 BSC
2 : Collector
3 : Emitter
L
L1
P
Q
S
19.81
20.32
4.50
3.66
6.20
0.780
0.800
0.177
0.144
0.244
3.56
5.38
6.15 BSC
0.140
0.212
0.242 BSC
订单及封装情况
器件名称
出货包装
注解
不含铅和卤
封装
30
NGTB30N60L2WG
TO-247-3L
pcs. / tube
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