NBXDBB017LN1TAG [ONSEMI]
Clock Oscillator; 时钟振荡器
| 型号： | NBXDBB017LN1TAG |
| 厂家： | 
ONSEMI |
| 描述： | Clock Oscillator |
| 文件： | 总8页 (文件大小：127K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
NBXDBB017, NBXDBA017,
NBXHBA017, NBXSBA017
3.3 V, 156.25 MHz /
312.5ꢀMHz LVPECL Clock
Oscillator
The single and dual frequency crystal oscillator (XO) is designed to
meet today’s requirements for 3.3 V LVPECL clock generation
applications. The device uses a high Q fundamental crystal and Phase
Lock Loop (PLL) multiplier to provide selectable 156.25 MHz or
312.5 MHz, ultra low jitter and phase noise LVPECL differential
output.
http://onsemi.com
6 PIN CLCC
LN SUFFIX
CASE 848AB
This device is a member of ON Semiconductor’s PureEdget clock
family that provides accurate and precision clock solutions.
Available in 5 mm x 7 mm SMD (CLCC) package on 16 mm tape
and reel in quantities of 1,000. Frequency stability options available as
either 50 PPM NBXDBA017, NBXSBA017, NBXHBA017
(Industrial Temperature Range) or 20 PPM NBXDBB017
(Commercial Temperature Range).
MARKING DIAGRAMS
NBXDBA017
NBXDBB017
156.25/312.50
AWLYYWWG
156.25/312.50
AWLYYWWG
Features
NBXSBA017
312.5
AWLYYWWG
NBXHBA017
156.25
AWLYYWWG
• LVPECL Differential Output
• Uses High Q Fundamental Mode Crystal and PLL Multiplier
• Ultra Low Jitter and Phase Noise − 0.4 ps (12 kHz − 20 MHz)
• Selectable Output Frequency − 156.25 MHz (default) / 312.5 MHz
• Hermetically Sealed Ceramic SMD Package
• RoHS Compliant
156.25/312.5 = Output Frequency (MHz)
A
WL
YY
WW
G
= Assembly Location
= Wafer Lot
• Operating Range 3.3 V 10%
• Total Frequency Stability − 20 PPM or 50 PPM
• This is a Pb−Free Device
= Year
= Work Week
= Pb−Free Package
Applications
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 7 of this data sheet.
• Networking
• 10 Gigabit Ethernet
V
CLK CLK
DD
6
5
4
PLL
Clock
Multiplier
Crystal
1
2
3
OE
FSEL/NC*
GND
Figure 1. Simplified Logic Diagram
* NBXSBA017 and NBXHBA017 only
©
Semiconductor Components Industries, LLC, 2009
1
Publication Order Number:
March, 2009 − Rev. 2
NBXDBB017/D
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
OE
FSEL
GND
1
2
3
6
5
4
V
OE
NC
1
2
3
6
5
4
V
DD
DD
CLK
CLK
CLK
CLK
GND
NBXDBA017/NBXDBB017
NBXSBA017/NBXHBA017
Figure 2. Pin Connections (Top View)
Table 1. PIN DESCRIPTION
Pin No.
Symbol
I/O
Description
1
OE
LVTTL/LVCMOS
Control Input
Output Enable Pin. When left floating pin defaults to logic HIGH and output is active.
See OE pin description Table 2.
2
FSEL/
NC*
LVTTL/LVCMOS
Control Input
Output Frequency Select Pin. Pin will default to logic HIGH when left open. See Output
Frequency Select pin description Table 3.
3
4
GND
CLK
Power Supply
Ground 0 V
LVPECL Output
Non−Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
V
TT
= V − 2 V.
DD
5
CLK
LVPECL Output
Inverted Clock Output. Typically loaded with 50 W receiver termination resistor to
= V − 2 V.
V
TT
DD
6
V
DD
Power Supply
Positive power supply voltage. Voltage should not exceed 3.3 V 10%.
*NBXSBA017 and NBXHBA017 only.
Table 2. OUTPUT ENABLE TRI−STATE FUNCTION
Table 3. OUTPUT FREQUENCY SELECT
OE Pin
Open
Output Pins
Active
FSEL Pin
Output Frequency (MHz)
Open
(pin will float high)
156.25
HIGH Level
LOW Level
Active
HIGH Level
LOW Level
156.25
312.5
High Z
Table 4. ATTRIBUTES
Characteristic
Input Default State Resistor
ESD Protection
Value
170 kW
Human Body Model
Machine Model
2 kV
200 V
Meets or Exceeds JEDEC Standard EIA/JESD78 IC Latchup Test
1. For additional Moisture Sensitivity information, refer to Application Note AND8003/D.
Table 5. MAXIMUM RATINGS
Symbol
Parameter
Positive Power Supply
Condition 1
Condition 2
Rating
Units
V
V
GND = 0 V
4.6
DD
out
I
LVPECL Output Current
Continuous
Surge
25
50
mA
T
Operating Temperature Range
Storage Temperature Range
Wave Solder
−40 to +85
−55 to +120
260
°C
°C
°C
A
T
stg
T
sol
See Figure 6
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
http://onsemi.com
2
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
Table 6. DC CHARACTERISTICS (V = 3.3 V 10%, GND = 0 V, T = −40°C to +85°C) (Note 2)
DD
A
Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
I
Power Supply Current (Note 2)
OE and FSEL Input HIGH Voltage
OE and FSEL Input LOW Voltage
78
100
mA
DD
V
2000
V
DD
mV
mV
mA
IH
V
GND − 300
800
IL
I
Input HIGH Current
OE
−100
−100
+100
+100
IH
FSEL
I
Input LOW Current
OE
FSEL
−100
−100
+100
+100
mA
mV
mV
mV
IL
V
OH
Output HIGH Voltage (Note 2)
Output LOW Voltage (Note 2)
V
−1195
DD
V
−945
DD
V
V
= 3.3 V
2105
2355
DD
V
OL
V
−1945
DD
V
−1600
DD
= 3.3 V
1355
1700
DD
V
Output Voltage Amplitude (Note 2)
660
OUTPP
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
2. Measurement taken with outputs terminated with 50 ohm to V −2 V. See Figure 5.
DD
http://onsemi.com
3
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
Table 7. AC CHARACTERISTICS (V = 3.3 V 10%, GND = 0 V, T = −40°C to +85°C) (Note 3)
DD
A
Symbol
Characteristic
Conditions
Min.
Typ.
Max.
Units
f
Output Clock Frequency
FSEL = HIGH
FSEL = LOW
156.25
MHz
CLKOUT
312.5
Df
Frequency Stability − NBXDBB017
− NBXDBA017/NBXSBA017/NBXHBA017
0°C to +70°C
−40°C to +85°C
(Note 4)
20
50
ppm
F
Phase−Noise Performance
CLKout
(See Figures 3 and 4)
100 Hz of Carrier
1 kHz of Carrier
10 kHz of Carrier
100 kHz of Carrier
1 MHz of Carrier
10 MHz of Carrier
12 kHz to 20 MHz
1000 Cycles
−108/−102
−122/−115
−129/−122
−129/−122
−137/−131
−161/−159
0.4
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
ps
NOISE
f
= 156.25 MHz/312.5 MHz
t (F)
jit
RMS Phase Jitter
0.9
8
t
Cycle−to−Cycle, RMS
Cycle−to−Cycle, Peak−to−Peak
Period, RMS
1
ps
jitter
1000 Cycles
7
30
4
ps
10,000 Cycles
0.6
ps
Period, Peak−to−Peak
Output Enable/Disable Time
10,000 Cycles
5
20
200
52
ps
t
ns
OE/OD
t
Output Clock Duty Cycle
(Measured at Cross Point)
48
50
%
DUTY_CYCLE
t
Output Rise Time (20% and 80%)
Output Fall Time (80% and 20%)
Start−up Time
250
250
1
400
400
5
ps
ps
R
t
F
t
ms
start
st
Aging
1
Year
3
ppm
ppm
st
Every Year After 1
1
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 Ifpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
3. Measurement taken with outputs terminated with 50 ohm to V −2 V. See Figure 5.
DD
4. Parameter guarantees 10 years of aging. Includes initial stability at 25°C, shock, vibration, and first year aging.
http://onsemi.com
4
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
Figure 3. Typical Phase Noise Plot at 156.25 MHz
Figure 4. Typical Phase Noise Plot at 312.5 MHz
http://onsemi.com
5
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
Table 8. RELIABILITY COMPLIANCE
Parameter
Standard
Method
Shock
Mechanical
Mechanical
Mechanical
Mechanical
Environment
Environment
MIL−STD−833, Method 2002, Condition B
MIL−STD−833, Method 2003
Solderability
Vibration
MIL−STD−833, Method 2007, Condition A
MIL−STD−202, Method 215
Solvent Resistance
Thermal Shock
MIL−STD−833, Method 1011, Condition A
MSL1 260°C per IPC/JEDEC J−STD−020D
Moisture Level Sensitivity
NBXxxxxxx
Z = 50 W
CLK
CLK
D
o
Receiver
Device
Driver
Device
Z = 50 W
o
D
50 W
50 W
V
TT
V
TT
= V − 2.0 V
DD
Figure 5. Typical Termination for Output Driver and Device Evaluation
(See Application Note AND8020/D − Termination of ECL Logic Devices.)
temp. 260°C
20 − 40 sec. max.
Temperature (°C)
6°C/sec. max.
peak
260
3°C/sec. max.
217
ramp−up
cooling
175
150
pre−heat
reflow
Time
60ꢀ 180 sec.
60ꢀ 150 sec.
Figure 6. Recommended Reflow Soldering Profile
http://onsemi.com
6
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
ORDERING INFORMATION
†
Device Order Number
NBXDBB017LN1TAG
Package Type
Shipping
CLCC−6
(Pb−Free)
1000 / Tape & Reel
1000 / Tape & Reel
1000 / Tape & Reel
1000 / Tape & Reel
100 / Tape & Reel
100 / Tape & Reel
100 / Tape & Reel
100 / Tape & Reel
NBXDBA017LN1TAG
NBXSBA017LN1TAG
NBXHBA017LN1TAG*
NBXDBB017LNHTAG
NBXDBA017LNHTAG
NBXSBA017LNHTAG
NBXHBA017LNHTAG*
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
CLCC−6
(Pb−Free)
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*Please contact sales office for availability
http://onsemi.com
7
NBXDBB017, NBXDBA017, NBXHBA017, NBXSBA017
PACKAGE DIMENSIONS
6 PIN CLCC, 7x5, 2.54P
CASE 848AB−01
ISSUE C
NOTES:
A
D
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
B
E
D1
4X
0.15 C
2. CONTROLLING DIMENSION: MILLIMETERS.
MILLIMETERS
DIM
A
A1
A2
A3
b
MIN
1.70
NOM
1.80
0.70 REF
0.36 REF
0.10
MAX
1.90
E2
H E1
TERMINAL 1
INDICATOR
0.08
1.30
0.12
1.50
1.40
D
7.00 BSC
6.20
6.81
5.08 BSC
5.00 BSC
4.40
D1
D2
D3
E
E1
E2
E3
e
6.17
6.66
6.23
6.96
D2
TOP VIEW
A3
A2
4.37
4.65
4.43
4.95
0.10
C
4.80
3.49 BSC
2.54 BSC
1.80 REF
1.27
A
H
L
1.17
1.37
R
0.70 REF
SIDE VIEW
SEATING
PLANE
A1
C
SOLDERING FOOTPRINT*
D3
e
2
3
1
6X
1.50
R
5.06
E3
0.10
0.05
C
C
A
B
6
5
4
6X b
6X L
6X
2.54
PITCH
BOTTOM VIEW
1.50
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PureEdge is a trademark of Semiconductor Components Industries, LLC (SCILLC).
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
For additional information, please contact your local
Sales Representative
NBXDBB017/D
相关型号：
©2020 ICPDF网 联系我们和版权申明