MC74VHC157DTR2G [ONSEMI]

Quad 2-Channel Multiplexer;
MC74VHC157DTR2G
型号: MC74VHC157DTR2G
厂家: ONSEMI    ONSEMI
描述:

Quad 2-Channel Multiplexer

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MC74VHC157  
Quad 2-Channel Multiplexer  
The MC74VHC157 is an advanced highspeed CMOS quad  
2channel multiplexer, fabricated with silicon gate CMOS  
technology. It achieves highspeed operation similar to equivalent  
BipolarSchottky TTL, while maintaining CMOS lowpower  
dissipation.  
It consists of four 2input digital multiplexers with common select  
(S) and enable (E) inputs. When E is held High, selection of data is  
inhibited and all the outputs go Low.  
The select decoding determines whether the A or B inputs get routed  
to the corresponding Y outputs.  
The internal circuit is composed of three stages, including a buffer  
output which provides high noise immunity and stable output. The  
inputs tolerate voltages up to 7 V, allowing the interface of 5 V systems  
to 3 V systems.  
http://onsemi.com  
MARKING  
DIAGRAMS  
16  
1
9
8
VHC157G  
AWLYWW  
SOIC16  
D SUFFIX  
CASE 751B  
16  
9
High Speed: t = 4.1 ns (Typ) at V = 5 V  
PD  
CC  
VHC  
157  
Low Power Dissipation: I = 4 mA (Max) at T = 25°C  
CC  
A
High Noise Immunity: V  
= V  
= 28% V  
NIH  
NIL CC  
ALYW G  
TSSOP16  
DT SUFFIX  
CASE 948F  
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
G
1
8
Designed for 2 V to 5.5 V Operating Range  
Low Noise: V  
= 0.8 V (Max)  
OLP  
VHC157 = Specific Device Code  
= Assembly Location  
WL, L = Wafer Lot  
= Year  
Pin and Function Compatible with Other Standard Logic Families  
Latchup Performance Exceeds 300 mA  
ESD Performance: HBM > 2000 V; Machine Model > 200 V  
Chip Complexity: 82 FETs  
These Devices are PbFree and are RoHS Compliant  
A
Y
WW, W = Work Week  
G or G = PbFree Package  
ORDERING INFORMATION  
Device  
MC74VHC157DR2G  
Package  
Shipping  
S
1
2
16  
15  
V
E
CC  
SOIC16 2500 Units/Reel  
A0  
MC74VHC157DTR2G TSSOP16 2500 Units/Reel  
B0  
Y0  
A3  
3
4
14  
13  
B3  
Y3  
A2  
B2  
Y2  
5
12  
11  
A1  
6
B1  
7
8
10  
9
Y1  
GND  
Figure 1. Pin Assignment  
© Semiconductor Components Industries, LLC, 2011  
1
Publication Order Number:  
May, 2011 Rev. 6  
MC74VHC157/D  
MC74VHC157  
2
A0  
B0  
A1  
B1  
4
7
3
Y0  
Y1  
5
6
NIBBLE  
INPUTS  
DATA  
OUTPUTS  
11  
10  
14  
13  
A2  
B2  
A3  
B3  
9
Y2  
Y3  
12  
15  
1
E
S
Figure 2. Expanded Logic Diagram  
15  
1
E
S
EN  
G1  
2
3
5
6
MUX  
A0  
B0  
A1  
B1  
1
1
4
7
Y0  
Y1  
Y2  
Y3  
11  
10  
14  
13  
A2  
B2  
9
A3  
B3  
12  
Figure 3. IEC Logic Symbol  
FUNCTION TABLE  
Inputs  
Outputs  
E
S
Y0 Y3  
H
L
L
X
L
H
L
A0A3  
B0B3  
A0 A3, B0 B3 = the levels  
of the respective DataWord  
Inputs.  
http://onsemi.com  
2
MC74VHC157  
MAXIMUM RATINGS (Note 1)  
Symbol  
Parameter  
Value  
Unit  
V
V
V
V
DC Supply Voltage  
*0.5 to )7.0  
CC  
I
DC Input Voltage  
*0.5 to V )7.0  
V
CC  
DC Output Voltage  
*0.5 to V )7.0  
V
O
CC  
I
I
I
I
DC Input Diode Current  
DC Output Diode Current  
DC Output Sink Current  
DC Supply Current per Supply Pin  
Storage Temperature Range  
V t GND  
*20  
mA  
mA  
mA  
mA  
_C  
IK  
I
V
t GND  
O
$20  
OK  
O
$25  
$100  
CC  
T
T
T
q
*65 to )150  
STG  
Lead Temperature, 1 mm from Case for 10 Seconds  
Junction Temperature under Bias  
Thermal Resistance  
260  
_C  
L
J
)150  
_C  
_C/W  
mW  
250  
250  
JA  
P
Power Dissipation in Still Air at 85_C  
Moisture Sensitivity  
D
MSL  
Level 1  
F
R
Flammability Rating  
Oxygen Index: 30% 35%  
UL94VO (0.125 in)  
V
ESD  
ESD Withstand Voltage  
Human Body Model (Note 2)  
Machine Model (Note 3)  
Charged Device Model (Note 4)  
>2000  
>200  
N/A  
V
I
LatchUp Performance  
Above V and Below GND at 85_C (Note 5)  
$500  
mA  
LatchUp  
CC  
1. Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Extended exposure to these  
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximumrated  
conditions is not implied.  
2. Tested to EIA/JESD22A114A.  
3. Tested to EIA/JESD22A115A.  
4. Tested to JESD22C101A.  
5. Tested to EIA/JESD78.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Characteristics  
Min  
2.0  
0
Max  
5.5  
Unit  
V
V
V
V
T
DC Supply Voltage  
DC Input Voltage  
DC Output Voltage  
CC  
IN  
(Note 6)  
5.5  
V
0
V
CC  
V
OUT  
Operating Temperature Range, all Package Types  
Input Rise or Fall Time  
*55  
125  
_C  
ns/V  
A
t , t  
V
CC  
V
CC  
= 3.3 V $ 0.3 V  
= 5.0 V $ 0.5 V  
0
0
100  
20  
r
f
6. Unused inputs may not be left open. All inputs must be tied to a highlogic voltage level or a lowlogic input voltage level.  
DEVICE JUNCTION TEMPERATURE VERSUS  
TIME TO 0.1% BOND FAILURES  
FAILURE RATE OF PLASTIC = CERAMIC  
UNTIL INTERMETALLICS OCCUR  
Junction  
Temperature _C  
Time, Hours  
1,032,200  
419,300  
178,700  
79,600  
Time, Years  
117.8  
47.9  
80  
90  
100  
110  
120  
130  
140  
20.4  
1
9.4  
37,000  
4.2  
1
10  
100  
1000  
TIME, YEARS  
17,800  
2.0  
8,900  
1.0  
Figure 4. Failure Rate vs. Time Junction Temperature  
http://onsemi.com  
3
 
MC74VHC157  
DC CHARACTERISTICS (Voltages Referenced to GND)  
V
T
A
= 25_C  
Typ  
T
v85_C  
55_C vT v125_C  
CC  
A
A
Symbol  
Parameter  
Condition  
(V)  
Min  
Max  
Min  
Max  
Min  
Max  
Unit  
V
V
V
HighLevel  
2.0  
1.5  
1.5  
1.5  
V
IH  
Input Voltage  
3.0 to 5.5 0.7 V  
0.7 V  
0.7 V  
CC  
CC  
CC  
LowLevel  
Input Voltage  
2.0  
3.0 to 5.5  
0.5  
0.5  
0.5  
V
V
IL  
0.3 V  
0.3 V  
0.3 V  
CC  
CC  
CC  
HighLevel  
Output Voltage  
V
OH  
= V or V  
2.0  
3.0  
4.5  
1.9  
2.9  
4.4  
2.0  
3.0  
4.5  
1.9  
2.9  
4.4  
1.9  
2.9  
4.4  
OH  
IN  
IH  
IL  
IL  
IL  
IL  
I
= 50 mA  
V
= V or V  
IN  
IH  
I
= 4 mA  
= 8 mA  
3.0  
4.5  
2.58  
3.94  
2.48  
3.8  
2.34  
3.66  
OH  
I
OH  
V
OL  
LowLevel  
Output Voltage  
V
OL  
= V or V  
2.0  
3.0  
4.5  
0.0  
0.0  
0.0  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
0.1  
V
IN  
IH  
I
= 50 mA  
V
= V or V  
IN  
IH  
I
= 4 mA  
= 8 mA  
3.0  
4.5  
0.36  
0.36  
0.44  
0.44  
0.52  
0.52  
OH  
I
OH  
I
I
Input Leakage  
Current  
V
= 5.5 V or  
0 to 5.5  
$0.1  
$1.0  
$1.0  
mA  
mA  
IN  
IN  
GND  
Quiescent  
Supply Current  
V
IN  
= V or  
5.5  
4.0  
40.0  
40.0  
CC  
CC  
GND  
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0 ns)  
r
f
T
= 25_C  
T
v85_C  
55_C vT v125_C  
A
A
A
Symbol  
Characteristic  
Test Conditions  
Min  
Typ  
Max  
Typ  
Max  
Typ  
Max  
Unit  
t
t
,
,
,
Propagation Delay,  
A to B to Y  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.3 $ 0.3 V  
= 5.0 $ 0.5 V  
= 3.3 $ 0.3 V  
= 5.0 $ 0.5 V  
= 3.3 $ 0.3 V  
= 5.0 $ 0.5 V  
C = 15 pF  
L
6.2  
8.7  
9.7  
13.2  
1.0  
1.0  
11.5  
15.0  
1.0  
1.0  
11.5  
15.0  
ns  
PLH  
PHL  
L
C = 50 pF  
C = 15 pF  
4.1  
5.6  
6.4  
8.4  
1.0  
1.0  
7.5  
9.5  
1.0  
1.0  
7.5  
9.5  
L
C = 50 pF  
L
t
t
Propagation Delay,  
S to Y  
C = 15 pF  
8.4  
10.9  
13.2  
16.7  
1.0  
1.0  
15.5  
19.0  
1.0  
1.0  
15.5  
19.0  
ns  
ns  
PLH  
PHL  
L
C = 50 pF  
L
C = 15 pF  
5.3  
6.8  
8.1  
10.1  
1.0  
1.0  
9.5  
11.5  
1.0  
1.0  
9.5  
11.5  
L
C = 50 pF  
L
t
t
Propagation Delay,  
E to Y  
C = 15 pF  
8.7  
11.2  
13.6  
17.1  
1.0  
1.0  
16.0  
19.5  
1.0  
1.0  
16.0  
19.5  
PLH  
PHL  
L
C = 50 pF  
L
C = 15 pF  
5.6  
7.1  
8.6  
10.6  
1.0  
1.0  
10.0  
12.0  
1.0  
1.0  
10.0  
12.0  
L
C = 50 pF  
L
C
C
Input Capacitance  
4
10  
10  
10  
pF  
pF  
IN  
Typical @ 25_C, V = 5.0 V  
CC  
Power Dissipation Capacitance (Note 7)  
20  
PD  
7. C is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
) = C V f + I . C is used to determine the noload dynamic  
CC(OPR  
PD CC in CC PD  
2
power consumption: P = C V  
f + I V  
.
D
PD  
CC  
in  
CC  
CC  
http://onsemi.com  
4
 
MC74VHC157  
NOISE CHARACTERISTICS (Input t = t = 3.0 ns; C = 50 pF; V = 5.0 V)  
r
f
L
CC  
T
A
= 25_C  
Typ  
Max  
Symbol  
Characteristic  
Unit  
V
V
Quiet Output Maximum Dynamic V  
0.3  
0.8  
*0.8  
3.5  
OLP  
OLV  
IHD  
ILD  
OL  
V
V
V
Quiet Output Minimum Dynamic V  
*0.3  
V
OL  
Minimum High Level Dynamic Input Voltage  
Maximum Low Level Dynamic Input Voltage  
V
1.5  
V
V
CC  
V
CC  
E
Y
A, B, or S  
50%  
50%  
GND  
GND  
t
t
PHL  
PLH  
t
t
PHL  
PLH  
Y
50% V  
50% V  
CC  
CC  
Figure 5. Switching Waveform  
Figure 6. Inverting Switching  
TEST POINT  
OUTPUT  
DEVICE  
UNDER  
TEST  
C *  
L
*Includes all probe and jig capacitance.  
Figure 7. Test Circuit  
INPUT  
Figure 8. Input Equivalent Circuit  
http://onsemi.com  
5
MC74VHC157  
PACKAGE DIMENSIONS  
SOIC16  
CASE 751B05  
ISSUE K  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
A−  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE MOLD  
PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR PROTRUSION  
SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
16  
9
8
B−  
P 8 PL  
M
S
B
0.25 (0.010)  
1
MILLIMETERS  
INCHES  
MIN  
0.386  
DIM MIN  
MAX  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
10.00  
G
4.00 0.150  
1.75 0.054  
0.49 0.014  
1.25 0.016  
F
R X 45  
K
_
G
J
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0
0.25 0.008  
0.25 0.004  
0.009  
0.009  
7
K
M
P
R
C
7
0
_
_
_
_
T−  
SEATING  
PLANE  
5.80  
0.25  
6.20 0.229  
0.50 0.010  
0.244  
0.019  
J
M
D
16 PL  
M
S
S
A
0.25 (0.010)  
T
B
SOLDERING FOOTPRINT  
8X  
6.40  
16X  
1.12  
1
16  
16X  
0.58  
1.27  
PITCH  
8
9
DIMENSIONS: MILLIMETERS  
http://onsemi.com  
6
MC74VHC157  
PACKAGE DIMENSIONS  
TSSOP16  
CASE 948F01  
ISSUE B  
16X KREF  
NOTES:  
M
S
S
0.10 (0.004)  
T
U
V
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
S
U
0.15 (0.006) T  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD  
FLASH. PROTRUSIONS OR GATE BURRS.  
MOLD FLASH OR GATE BURRS SHALL NOT  
EXCEED 0.15 (0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE  
INTERLEAD FLASH OR PROTRUSION.  
INTERLEAD FLASH OR PROTRUSION SHALL  
NOT EXCEED 0.25 (0.010) PER SIDE.  
5. DIMENSION K DOES NOT INCLUDE  
DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08  
(0.003) TOTAL IN EXCESS OF THE K  
DIMENSION AT MAXIMUM MATERIAL  
CONDITION.  
K
K1  
16  
9
2X L/2  
J1  
SECTION NN  
B
U−  
L
J
PIN 1  
IDENT.  
N
8
0.25 (0.010)  
1
6. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
7. DIMENSION A AND B ARE TO BE  
DETERMINED AT DATUM PLANE W.  
M
S
0.15 (0.006) T  
U
MILLIMETERS  
MAX  
INCHES  
MIN MAX  
A
V−  
DIM MIN  
A
B
C
D
N
4.90  
4.30  
−−−  
0.05  
0.50  
5.10 0.193 0.200  
4.50 0.169 0.177  
1.20  
0.15 0.002 0.006  
0.75 0.020 0.030  
F
−−− 0.047  
DETAIL E  
F
G
H
J
J1  
K
K1  
L
0.65 BSC  
0.026 BSC  
0.18  
0.09  
0.09  
0.19  
0.19  
0.28 0.007 0.011  
W−  
0.20 0.004 0.008  
0.16 0.004 0.006  
0.30 0.007 0.012  
0.25 0.007 0.010  
C
0.10 (0.004)  
6.40 BSC  
0.252 BSC  
H
DETAIL E  
SEATING  
PLANE  
T−  
M
0
8
0
8
_
_
_
_
D
G
SOLDERING FOOTPRINT  
7.06  
1
0.65  
PITCH  
01.36X6  
16X  
1.26  
DIMENSIONS: MILLIMETERS  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should  
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
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USA/Canada  
Europe, Middle East and Africa Technical Support:  
Phone: 421 33 790 2910  
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Phone: 81357733850  
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Order Literature: http://www.onsemi.com/orderlit  
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For additional information, please contact your local  
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MC74VHC157/D  

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