MC74VHC1G00DFT1 [ONSEMI]
2-Input NAND Gate; 2输入与非门
| 型号： | MC74VHC1G00DFT1 |
| 厂家： | 
ONSEMI |
| 描述： | 2-Input NAND Gate |
| 文件： | 总8页 (文件大小：185K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
The MC74VHC1G00 is an advanced high speed CMOS 2–input
NAND gate fabricated with silicon gate CMOS technology. It
achieves high speed operation similar to equivalent Bipolar Schottky
TTL while maintaining CMOS low power dissipation.
The internal circuit is composed of three stages, including a buffer
output which provides high noise immunity and stable output.
The MC74VHC1G00 input structure provides protection when
voltages up to 7V are applied, regardless of the supply voltage. This
allows the MC74VHC1G00 to be used to interface 5V circuits to 3V
circuits.
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• High Speed: t
= 3.0ns (Typ) at V
= 5V
PD
• Low Power Dissipation: I
CC
= 2µA (Max) at T = 25°C
SC–88A / SOT–353
DF SUFFIX
CC
A
• Power Down Protection Provided on Inputs
CASE 419A
• Balanced Propagation Delays
• Pin and Function Compatible with Other Standard Logic Families
• Latchup Performance Exceeds 300mA
MARKING DIAGRAM
• ESD Performance: HBM > 2000V; MM > 200V, CDM > 1500V
d
V1
Pin 1
d = Date Code
1
2
3
VCC
5
IN B
IN A
GND
PIN ASSIGNMENT
1
2
3
4
5
IN B
IN A
GND
OUT Y
VCC
OUT Y
4
Figure 1. 5–Lead SOT–353 Pinout (Top View)
ORDERING INFORMATION
Seedetailedorderingandshippinginformationinthepackage
dimensions section on page 4 of this data sheet.
LOGIC SYMBOL
IN A
IN B
&
OUT Y
FUNCTION TABLE
Inputs
Output
Y
A
B
L
L
L
H
L
H
H
H
L
H
H
H
Semiconductor Components Industries, LLC, 1999
1
Publication Order Number:
December, 1999 – Rev. 2
MC74VHC1G00/D
MC74VHC1G00
MAXIMUM RATINGS*
Characteristics
Symbol
Value
Unit
V
DC Supply Voltage
DC Input Voltage
DC Output Voltage
V
CC
–0.5 to +7.0
–0.5 to +7.0
–0.5 to 7.0
V
IN
V
V
= 0
V
OUT
V
CC
High or Low State
–0.5 to V
CC
+ 0.5
Input Diode Current
I
–20
mA
mA
mA
mA
mW
°C
IK
Output Diode Current
DC Output Current, per Pin
(V
OUT
< GND; V
OUT
> V
)
I
+20
+25
CC
OK
I
OUT
DC Supply Current, V
and GND
I
+50
CC
CC
Power dissipation in still air, SC–88A †
Lead temperature, 1 mm from case for 10 s
Storage temperature
P
200
D
T
260
L
T
stg
–65 to +150
°C
* Maximum Ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those
indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is not implied. Functional
operation should be restricted to the Recommended Operating Conditions.
†Derating — SC–88A Package: –3 mW/ C from 65 to 125 C
RECOMMENDED OPERATING CONDITIONS
Characteristics
Symbol
Min
2.0
0.0
0.0
–55
Max
5.5
Unit
V
DC Supply Voltage
DC Input Voltage
DC Output Voltage
V
CC
V
IN
5.5
V
V
OUT
V
CC
V
Operating Temperature Range
T
A
+85
°C
ns/V
Input Rise and Fall Time
V
V
= 3.3V ± 0.3V
= 5.0V ± 0.5V
t , t
r f
0
0
100
20
CC
CC
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2
MC74VHC1G00
DC ELECTRICAL CHARACTERISTICS
V
CC
T
A
= 25°C
T
A
≤ 85°C
T ≤ 125°C
A
Symbol
Parameter
Test Conditions
(V)
Min
Typ
Max
Min
Max
Min
Max
Unit
V
IH
Minimum High–Level
Input Voltage
2.0
3.0
4.5
5.5
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
1.5
2.1
3.15
3.85
V
V
IL
Maximum Low–Level
Input Voltage
2.0
3.0
4.5
5.5
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
0.5
0.9
1.35
1.65
V
V
I
= V or V
= –50µA
2.0
3.0
4.5
1.9
2.9
4.4
2.0
3.0
4.5
1.9
2.9
4.4
1.9
2.9
4.4
V
V
V
V
V
Minimum High–Level
Output Voltage
IN
OH
IH
IL
IL
IL
IL
OH
V
IN
= V or V
IH
IL
V
= V or V
IH
= –4mA
= –8mA
IN
OH
OH
I
I
3.0
4.5
2.58
3.94
2.48
3.80
2.34
3.66
V
I
= V or V
IH
= 50µA
2.0
3.0
4.5
0.0
0.0
0.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
V
OL
Maximum Low–Level
Output Voltage
IN
OL
V
IN
= V or V
IH
IL
V
= V or V
IH
= 4mA
= 8mA
IN
OL
OL
I
I
3.0
4.5
0.36
0.36
0.44
0.44
0.52
0.52
I
I
Maximum Input
Leakage Current
V
= 5.5V or GND
0 to
5.5
±0.1
±1.0
±1.0
µA
µA
IN
IN
Maximum Quiescent
Supply Current
V
IN
= V
or GND
5.5
2.0
20
40
CC
CC
AC ELECTRICAL CHARACTERISTICS (C
= 50 pF, Input t = t = 3.0ns)
r f
load
T
A
= 25°C
T
A
≤ 85°C
T ≤ 125°C
A
Symbol
Parameter
Test Conditions
Unit
Min
Typ
Max
Min
Max
Min
Max
t
t
,
Maximum Propogation
Delay,
Input A or B to Y
V
V
= 3.0 ± 0.3V
C
C
= 15 pF
= 50 pF
4.5
5.6
7.9
11.4
9.5
13.0
11.0
15.5
ns
PLH
PHL
CC
L
L
= 5.0 ± 0.5V
C
C
= 15 pF
= 50 pF
3.0
3.8
5.5
7.5
6.5
8.5
8.0
10.0
CC
L
L
C
Maximum Input
Capacitance
5.5
10
10
10
pF
pF
IN
Typical @ 25°C, V
= 5.0V
CC
C
Power Dissipation Capacitance (Note 1.)
10
PD
1. C
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
PD
Averageoperatingcurrentcanbeobtainedbytheequation:I
power consumption; P = C
=C isusedtodeterminetheno–loaddynamic
V
f
+I .C
CC(OPR)
CC
PD CC in CC PD
2
V
CC
f + I
in CC
V
.
D
PD
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3
MC74VHC1G00
TEST POINT
OUTPUT
V
CC
A or B
50%
DEVICE
UNDER
TEST
GND
t
t
PHL
PLH
C *
L
Y
50% V
CC
*Includes all probe and jig capacitance
Figure 2. Switching Waveforms
Figure 3. Test Circuit
DEVICE ORDERING INFORMATION
Device Nomenclature
Device
Temp
Range
Identifier
Tape &
Reel
Suffix
Circuit
Indicator
Package
Suffix
Package
Type
Tape and Reel
Size
Technology
Device Order Number
Function
SC–88A /
SOT–353
MC74VHC1G00DFT1
MC
74
VHC1G
00
DF
T1
7–Inch/3000 Unit
PACKAGE DIMENSIONS
SC–88A / SOT–353
DF SUFFIX
5–LEAD PACKAGE
CASE 419A–01
ISSUE B
NOTES:
A
G
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
INCHES
DIM MIN MAX
MILLIMETERS
V
MIN
1.80
1.15
0.80
0.10
MAX
2.20
1.35
1.10
0.30
A
B
C
D
G
H
J
K
N
S
0.071
0.045
0.031
0.004
0.087
0.053
0.043
0.012
5
4
3
0.026 BSC
0.65 BSC
–B–
S
–––
0.004
0.004
0.008 REF
0.079
0.012
0.004
0.010
0.012
–––
0.10
0.10
0.10
0.25
0.30
1
2
0.20 REF
0.087
0.016
2.00
0.30
2.20
0.40
V
M
M
D 5 PL
0.2 (0.008)
B
N
0.5 mm (min)
J
C
K
H
1.9 mm
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4
MC74VHC1G00
10 PITCHES
CUMULATIVE
TOLERANCE ON
TAPE
P
0
K
t
±0.2 mm
(±0.008”)
P
2
D
TOP
COVER
TAPE
E
A
SEE NOTE 2
+
0
F
W
+
+
K
SEE
B
1
0
B
0
D
1
NOTE 2
P
FOR COMPONENTS
2.0 mm × 1.2 mm
AND LARGER
EMBOSSMENT
USER DIRECTION OF FEED
CENTER LINES
OF CAVITY
FOR MACHINE REFERENCE
ONLY
INCLUDING DRAFT AND RADII
CONCENTRIC AROUND B
0
*TOP COVER
TAPE THICKNESS (t )
1
0.10 mm
(0.004”) MAX.
R MIN.
TAPE AND COMPONENTS
SHALL PASS AROUND RADIUS “R”
WITHOUT DAMAGE
EMBOSSED
CARRIER
BENDING RADIUS
EMBOSSMENT
100 mm
(3.937”)
MAXIMUM COMPONENT ROTATION
10°
1 mm MAX
TYPICAL
COMPONENT CAVITY
CENTER LINE
TAPE
1 mm
(0.039”) MAX
250 mm
(9.843”)
TYPICAL
COMPONENT
CENTER LINE
CAMBER (TOP VIEW)
ALLOWABLE CAMBER TO BE 1 mm/100 mm NONACCUMULATIVE OVER 250 mm
Figure 4. Carrier Tape Specifications
EMBOSSED CARRIER DIMENSIONS (See Notes 1 and 2)
Tape
Size
B
1
Max
D
D
E
F
K
P
P
0
P
2
R
T
W
1
8 mm 4.35 mm 1.5 +0.1/
1.0 mm
Min
(0.039”)
1.75
3.5
2.4 mm
(0.094”)
4.0
4.0
2.0
25 mm
(0.98”)
0.3
8.0
(0.171”)
–0.0 mm
(0.059
±0.1 mm ±0.5 mm
±0.10 mm
(0.157
±0.1 mm
(0.156
±0.1 mm
(0.079
±0.05 mm
(0.01
±0.3 mm
(0.315
(0.069
±0.004”)
(1.38
±0.002”)
+0.004/
–0.0”)
±0.004”)
±0.004”)
±0.002”)
+0.0038/
–0.0002”)
±0.012”)
1. Metric Dimensions Govern–English are in parentheses for reference only.
2. A , B , and K are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0
0
0
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
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5
MC74VHC1G00
t MAX
13.0 mm ±0.2 mm
(0.512” ±0.008”)
1.5 mm MIN
(0.06”)
20.2 mm MIN
(0.795”)
50 mm MIN
(1.969”)
A
FULL RADIUS
G
Figure 5. Reel Dimensions
REEL DIMENSIONS
Tape
Size
A Max
G
t Max
8 mm
330 mm
(13”)
8.400 mm, +1.5 mm, –0.0
(0.33”, +0.059”, –0.00)
14.4 mm
(0.56”)
DIRECTION OF FEED
BARCODE LABEL
POCKET
HOLE
Figure 6. Reel Winding Direction
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6
MC74VHC1G00
TAPE TRAILER
(Connected to Reel Hub)
NO COMPONENTS
160 mm MIN
TAPE LEADER
NO COMPONENTS
400 mm MIN
COMPONENTS
CAVITY TOP TAPE
TAPE
DIRECTION OF FEED
Figure 7. Tape Ends for Finished Goods
SC–88A/SOT–353 (5 Pin)
“T1” PIN ONE TOWARDS
SPROCKET HOLE
DEVICE
User Direction of Feed
Figure 8. Reel Configuration
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7
MC74VHC1G00
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MC74VHC1G00/D
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