MC74LVX74M [ONSEMI]

LOW-VOLTAGE CMOS; 低电压CMOS
MC74LVX74M
型号: MC74LVX74M
厂家: ONSEMI    ONSEMI
描述:

LOW-VOLTAGE CMOS
低电压CMOS

触发器 逻辑集成电路 光电二极管
文件: 总7页 (文件大小:157K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SEMICONDUCTOR TECHNICAL DATA  
The MC74LVX74 is an advanced high speed CMOS D–type flip–flop.  
The inputs tolerate voltages up to 7V, allowing the interface of 5V systems  
to 3V systems.  
The signal level applied to the D input is transferred to O output during  
the positive going transition of the Clock pulse.  
LOW–VOLTAGE CMOS  
Clear (CD) and Set (SD) are independent of the Clock (CP) and are  
accomplished by setting the appropriate input Low.  
High Speed: f  
= 145MHz (Typ) at V  
= 3.3V  
max  
Low Power Dissipation: I  
CC  
= 2µA (Max) at T = 25°C  
CC  
A
D SUFFIX  
14–LEAD SOIC PACKAGE  
CASE 751A–03  
Power Down Protection Provided on Inputs  
Balanced Propagation Delays  
Low Noise: V  
= 0.5V (Max)  
OLP  
Pin and Function Compatible with Other Standard Logic Families  
Latchup Performance Exceeds 300mA  
ESD Performance: HBM > 2000V; Machine Model > 200V  
DT SUFFIX  
14–LEAD TSSOP PACKAGE  
CASE 948G–01  
V
CD2  
13  
D2  
12  
CP2 SD2  
O2  
9
O2  
8
CC  
14  
11  
10  
M SUFFIX  
14–LEAD SOIC EIAJ PACKAGE  
CASE 965–01  
1
2
3
4
5
6
7
CD1  
D1  
CP1  
SD1  
O1  
O1  
GND  
PIN NAMES  
Figure 1. 14–Lead Pinout (Top View)  
Pins  
Function  
CP1, CP2  
D1, D2  
Clock Pulse Inputs  
Data Inputs  
CD1, CD2  
SD1, SD2  
On, On  
Direct Clear Inputs  
Direct Set Inputs  
Outputs  
6/97  
Motorola, Inc. 1997  
REV 0  
MC74LVX74  
4
SD1  
SD  
CD  
2
3
5
6
D1  
D
O1  
O1  
Q
Q
CP1  
CP  
1
CD1  
SD2  
10  
SD  
CD  
12  
11  
9
8
D2  
D
O2  
O2  
Q
Q
CP2  
CP  
13  
CD2  
Figure 2. Logic Diagram  
OUTPUTS  
INPUTS  
SDn  
CDn  
CPn  
Dn  
On  
On  
OPERATING MODE  
L
H
H
L
X
X
X
X
H
L
L
H
Asynchronous Set  
Asynchronous Clear  
L
L
X
X
H
H
Undetermined  
H
H
H
H
h
l
H
L
L
H
Load and Read Register  
H
H
X
NC  
NC  
Hold  
H = High Voltage Level; h = High Voltage Level One Setup Time Prior to the Low–to–High Clock Transition; L = Low Voltage Level; l = Low  
Voltage Level One Setup Time Prior to the Low–to–High Clock Transition; NC = No Change; X = High or Low Voltage Level or Transitions  
are Acceptable; = Low–to–High Transition; = Not a Low–to–High Transition; For I  
Reasons DO NOT FLOAT Inputs  
CC  
MOTOROLA  
2
MC74LVX74  
MAXIMUM RATINGS*  
Symbol  
Parameter  
Value  
Unit  
V
V
V
DC Supply Voltage  
DC Input Voltage  
–0.5 to +7.0  
–0.5 to +7.0  
CC  
V
in  
V
DC Output Voltage  
Input Diode Current  
Output Diode Current  
DC Output Current, per Pin  
–0.5 to V  
+0.5  
V
out  
CC  
I
I
I
I
–20  
mA  
mA  
mA  
mA  
mW  
C
IK  
±20  
±25  
OK  
out  
CC  
DC Supply Current, V  
Power Dissipation  
and GND Pins  
±50  
CC  
P
D
180  
T
stg  
Storage Temperature  
–65 to +150  
* Absolute maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or  
conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute–maximum–rated conditions is  
not implied.  
RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.0  
0
Max  
3.6  
Unit  
V
V
CC  
DC Supply Voltage  
V
in  
DC Input Voltage  
5.5  
V
V
out  
DC Output Voltage  
0
V
CC  
V
T
Operating Temperature, All Package Types  
Input Rise and Fall Time  
–40  
0
+85  
100  
C
A
t/V  
ns/V  
DC ELECTRICAL CHARACTERISTICS  
T
A
= 25°C  
T = – 40 to 85°C  
A
V
CC  
V
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Min  
Max  
V
IH  
High–Level Input Voltage  
2.0  
3.0  
3.6  
1.5  
2.0  
2.4  
1.5  
2.0  
2.4  
V
V
V
V
Low–Level Input Voltage  
2.0  
3.0  
3.6  
0.5  
0.8  
0.8  
0.5  
0.8  
0.8  
V
V
V
IL  
High–Level Output Voltage  
I
I
I
= –50µA  
= –50µA  
= –4mA  
2.0  
3.0  
3.0  
1.9  
2.9  
2.58  
2.0  
3.0  
1.9  
2.9  
2.48  
OH  
OL  
OH  
OH  
OH  
(V = V or V  
in IH  
)
IL  
Low–Level Output Voltage  
I
I
I
= 50µA  
= 50µA  
= 4mA  
2.0  
3.0  
3.0  
0.0  
0.0  
0.1  
0.1  
0.36  
0.1  
0.1  
0.44  
OL  
OL  
OL  
(V = V or V  
in IH  
)
IL  
I
I
Input Leakage Current  
V
= 5.5V or GND  
3.6  
3.6  
±0.1  
±1.0  
µA  
µA  
in  
in  
in  
Quiescent Supply Current  
V
= V  
or GND  
2.0  
20.0  
CC  
CC  
3
MOTOROLA  
MC74LVX74  
AC ELECTRICAL CHARACTERISTICS (Input t = t = 3.0ns)  
r
f
T
A
= 25°C  
T = – 40 to 85°C  
A
Symbol  
Parameter  
Test Conditions  
Unit  
Min  
Typ  
Max  
Min  
Max  
t
t
,
Propagation Delay  
CP to O or O  
V
V
V
V
V
V
= 2.7V  
C
C
= 15pF  
= 50pF  
7.3  
9.8  
15.0  
18.5  
1.0  
1.0  
18.5  
22.0  
ns  
PLH  
PHL  
CC  
CC  
CC  
CC  
CC  
CC  
L
L
= 3.3 ± 0.3V  
= 2.7V  
C
C
= 15pF  
= 50pF  
5.7  
8.2  
9.7  
13.2  
1.0  
1.0  
11.5  
15.0  
L
L
t
t
,
Propagation Delay  
SD or CD to O or O  
C
C
= 15pF  
= 50pF  
8.4  
10.9  
15.6  
19.1  
1.0  
1.0  
18.5  
22.0  
ns  
MHz  
ns  
PLH  
PHL  
L
L
= 3.3 ± 0.3V  
= 2.7V  
C
C
= 15pF  
= 50pF  
6.6  
9.1  
10.1  
13.6  
1.0  
1.0  
12.0  
15.5  
L
L
f
Maximum Clock Frequency  
(50% Duty Cycle)  
C
C
= 15pF  
= 50pF  
55  
45  
135  
60  
50  
40  
max  
L
L
= 3.3 ± 0.3V  
C
C
= 15pF  
= 50pF  
95  
60  
145  
85  
80  
50  
L
L
t
t
Output–to–Output Skew  
(Note 1.)  
V
CC  
V
CC  
= 2.7V  
= 3.3 ±0.3V  
C
C
= 50pF  
= 50pF  
1.5  
1.5  
1.5  
1.5  
OSHL  
OSLH  
L
L
1. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.  
The specification applies to any outputs switching in the same direction, either HIGH–to–LOW (t  
guaranteed by design.  
) or LOW–to–HIGH (t  
OSHL  
); parameter  
OSLH  
TIMING REQUIREMENTS (Input t = t = 3.0ns)  
r
f
Guaranteed Limit  
V
CC  
V
T
A
= – 40 to  
85 C  
Symbol  
Parameter  
Unit  
T
A
= 25 C  
t
t
t
t
t
Minimum Pulse Width, CP  
2.7V  
3.3V ±0.3  
8.5  
6.0  
10.0  
7.0  
ns  
w
Minimum Pulse Width, CD or SD  
Minimum Setup Time, D to CP  
2.7V  
3.3V ±0.3  
8.5  
6.0  
10.0  
7.0  
ns  
ns  
ns  
ns  
w
2.7V  
3.3V ±0.3  
8.0  
5.5  
9.5  
6.5  
su  
h
Minimum Hold Time, D to CP  
2.7V  
3.3V ±0.3  
0.5  
0.5  
0.5  
0.5  
Minimum Recovery Time, SD or CD to CP  
2.7V  
3.3V ±0.3  
6.5  
5.0  
7.5  
5.0  
rec  
CAPACITIVE CHARACTERISTICS  
Symbol  
T
A
= 25°C  
Typ  
4
T = – 40 to 85°C  
A
Parameter  
Unit  
pF  
Min  
Max  
Min  
Max  
C
C
Input Capacitance  
Power Dissipation Capacitance (Note 2.)  
10  
10  
in  
25  
pF  
PD  
2. C  
is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.  
PD  
Average operating current can be obtained by the equation: I  
= C  
V
f
+ I  
/2 (per flip–flop). C  
is used to determine the  
CC(OPR)  
PD  
CC in CC  
PD  
2
no–load dynamic power consumption; P = C  
V
f
+ I  
in CC  
V
.
D
PD  
CC  
CC  
NOISE CHARACTERISTICS (Input t = t = 3.0ns, C = 50pF, V  
= 3.3V, Measured in SOIC Package)  
r
f
L
CC  
T
A
= 25°C  
Symbol  
Characteristic  
Unit  
V
Typ  
Max  
0.5  
V
OLP  
Quiet Output Maximum Dynamic V  
0.3  
OL  
V
Quiet Output Minimum Dynamic V  
–0.3  
–0.5  
2.0  
V
OLV  
OL  
V
Minimum High Level Dynamic Input Voltage  
Maximum Low Level Dynamic Input Voltage  
V
IHD  
V
0.8  
V
ILD  
MOTOROLA  
4
MC74LVX74  
SWITCHING WAVEFORMS  
t
w
V
CC  
50%  
SD or CD  
GND  
t
PHL  
V
CC  
CP  
50%  
50% V  
O or O  
CC  
GND  
t
w
t
PLH  
1/f  
max  
50% V  
CC  
t
t
PHL  
O or O  
CP  
PLH  
t
rec  
50% V  
CC  
V
O or O  
CC  
50%  
GND  
Figure 3.  
Figure 4.  
VALID  
V
CC  
50%  
D
GND  
t
t
h
su  
V
CC  
50%  
CP  
GND  
Figure 5.  
TEST CIRCUIT  
TEST POINT  
OUTPUT  
DEVICE  
UNDER  
TEST  
C *  
L
* Includes all probe and jig capacitance  
Figure 6.  
5
MOTOROLA  
MC74LVX74  
OUTLINE DIMENSIONS  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751A–03  
ISSUE F  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
–A  
14  
1
8
7
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
–B  
P 7 PL  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
M
M
0.25 (0.010)  
B
MILLIMETERS  
INCHES  
G
F
R X 45°  
DIM  
A
B
C
D
F
G
J
MIN  
8.55  
3.80  
1.35  
0.35  
0.40  
MAX  
8.75  
4.00  
1.75  
0.49  
1.25  
MIN  
MAX  
0.344  
0.157  
0.068  
0.019  
0.049  
C
0.337  
0.150  
0.054  
0.014  
0.016  
J
M
SEATING  
PLANE  
K
D 14 PL  
1.27 BSC  
0.050 BSC  
0.19  
0.10  
0.25  
0.25  
0.008  
0.004  
0.009  
0.009  
M
S
S
0.25 (0.010)  
T
B
A
K
M
P
R
0
5.80  
0.25  
°
7
6.20  
0.50  
°
0
°
7°  
0.244  
0.019  
0.228  
0.010  
M SUFFIX  
PLASTIC SOIC EIAJ PACKAGE  
CASE 965–01  
ISSUE O  
NOTES:  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSIONS D AND E DO NOT INCLUDE MOLD  
FLASH OR PROTRUSIONS AND ARE MEASURED  
AT THE PARTING LINE. MOLD FLASH OR  
PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)  
PER SIDE.  
L
E
14  
8
7
Q
1
E H  
4
5
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
E
M
THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
L
1
DETAIL P  
Z
D
VIEW P  
e
MILLIMETERS  
INCHES  
A
DIM  
A
MIN  
---  
MAX  
2.05  
0.20  
0.50  
0.27  
10.50  
5.45  
MIN  
---  
MAX  
0.081  
0.008  
0.020  
0.011  
0.413  
0.215  
c
A
0.05  
0.35  
0.18  
9.90  
5.10  
0.002  
0.014  
0.007  
0.390  
0.201  
1
b
c
D
E
e
b
A
1
M
1.27 BSC  
0.050 BSC  
0.13 (0.005)  
0.10 (0.004)  
H
7.40  
0.50  
1.10  
0
8.20  
0.85  
1.50  
10  
0.291  
0.020  
0.043  
0
0.323  
0.033  
0.059  
10  
E
L
L
M
E
Q
Z
0.70  
---  
0.90  
1.42  
0.028  
---  
0.035  
0.056  
1
MOTOROLA  
6
MC74LVX74  
OUTLINE DIMENSIONS  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948G–01  
ISSUE O  
NOTES:  
14X K REF  
0.10 (0.004)  
1
DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
T
U
V
2
3
CONTROLLING DIMENSION: MILLIMETER.  
DIMENSION A DOES NOT INCLUDE MOLD FLASH,  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
S
0.15 (0.006) T  
U
N
0.25 (0.010)  
14  
4
5
DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED  
0.25 (0.010) PER SIDE.  
DIMENSION K DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN  
EXCESS OF THE K DIMENSION AT MAXIMUM  
MATERIAL CONDITION.  
8
7
2X L/2  
M
B
L
N
–U–  
PIN 1  
IDENT.  
F
1
6
7
TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE –W–.  
DETAIL E  
S
K
0.15 (0.006) T  
U
A
MILLIMETERS  
INCHES  
K1  
DIM  
A
B
C
D
F
G
H
J
J1  
K
MIN  
4.90  
4.30  
–––  
0.05  
0.50  
MAX  
5.10  
4.50  
1.20  
0.15  
0.75  
MIN  
MAX  
0.200  
0.177  
0.047  
0.006  
0.030  
–V–  
0.193  
0.169  
–––  
0.002  
0.020  
J J1  
SECTION N–N  
0.65 BSC  
0.026 BSC  
0.50  
0.09  
0.09  
0.19  
0.19  
0.60  
0.20  
0.16  
0.30  
0.25  
0.020  
0.004  
0.004  
0.007  
0.007  
0.024  
0.008  
0.006  
0.012  
0.010  
–W–  
C
K1  
L
6.40 BSC  
0.252 BSC  
0.10 (0.004)  
M
0
8
0
8
SEATING  
PLANE  
–T–  
H
G
DETAIL E  
D
Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding  
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and  
specificallydisclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola  
datasheetsand/orspecificationscananddovaryindifferentapplicationsandactualperformancemayvaryovertime. Alloperatingparameters,includingTypicals”  
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of  
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other  
applicationsintended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury  
ordeathmayoccur. ShouldBuyerpurchaseoruseMotorolaproductsforanysuchunintendedorunauthorizedapplication,BuyershallindemnifyandholdMotorola  
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees  
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that  
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Opportunity/Affirmative Action Employer.  
are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal  
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