MC14521BDG [ONSEMI]

24−Stage Frequency Divider; 24级分频器
MC14521BDG
型号: MC14521BDG
厂家: ONSEMI    ONSEMI
描述:

24−Stage Frequency Divider
24级分频器

文件: 总9页 (文件大小:119K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC14521B  
24−Stage Frequency Divider  
The MC14521B consists of a chain of 24 flip−flops with an input  
circuit that allows three modes of operation. The input will function as a  
crystal oscillator, an RC oscillator, or as an input buffer for an external  
oscillator. Each flip−flop divides the frequency of the previous flip−flop  
24  
by two, consequently this part will count up to 2 = 16,777,216. The  
http://onsemi.com  
count advances on the negative going edge of the clock. The outputs of  
the last seven−stages are available for added flexibility.  
MARKING  
Features  
DIAGRAMS  
All Stages are Resettable  
16  
Reset Disables the RC Oscillator for Low Standby Power Drain  
PDIP−16  
P SUFFIX  
CASE 648  
MC14521BCP  
AWLYYWWG  
RC and Crystal Oscillator Outputs Are Capable of Driving External  
Loads  
1
1
Test Mode to Reduce Test Time  
V and V Pins Brought Out on Crystal Oscillator Inverter to  
DD  
SS  
16  
SOIC−16  
D SUFFIX  
CASE 751B  
Allow the Connection of External Resistors for Low−Power Operation  
14521BG  
AWLYWW  
Supply Voltage Range = 3.0 Vdc to 18 Vdc  
1
1
Capable of Driving Two Low−Power TTL Loads or One Low−Power  
Schottky TTL Load over the Rated Temperature Range  
Pb−Free Packages are Available*  
16  
SOEIAJ−16  
F SUFFIX  
CASE 966  
MC14521B  
ALYWG  
MAXIMUM RATINGS (Voltages Referenced to V  
)
SS  
1
1
Parameter  
Symbol  
Value  
Unit  
V
DC Supply Voltage Range  
V
0.5 to +18.0  
DD  
A
= Assembly Location  
WL, L = Wafer Lot  
YY, Y = Year  
WW, W = Work Week  
Input or Output Voltage Range  
(DC or Transient)  
V , V  
in out  
0.5 to V  
+0.5  
V
DD  
Input or Output Current (DC or Transient)  
per Pin  
I , I  
in out  
10  
mA  
G
= Pb−Free Package  
Power Dissipation, per Package (Note 1)  
Ambient Temperature Range  
P
T
500  
mW  
°C  
D
55 to +125  
65 to +150  
260  
A
ORDERING INFORMATION  
Storage Temperature Range  
T
stg  
°C  
See detailed ordering and shipping information in the package  
dimensions section on page 2 of this data sheet.  
Lead Temperature (8−Second Soldering)  
T
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Temperature Derating: Plastic “P and D/DW”  
Packages: – 7.0 mW/_C From 65_C To 125_C  
This device contains protection circuitry to guard against damage due to high  
static voltages or electric fields. However, precautions must be taken to avoid  
applications of any voltage higher than maximum rated voltages to this  
high−impedance circuit. For proper operation, V and V should be constrained  
in  
out  
to the range V v (V or V ) v V  
.
SS  
in  
out  
DD  
Unused inputs must always be tied to an appropriate logic voltage level  
(e.g., either V or V ). Unused outputs must be left open.  
SS  
DD  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2006  
1
Publication Order Number:  
June, 2006 − Rev. 6  
MC14521B/D  
 
MC14521B  
BLOCK DIAGRAM  
RESET  
2
STAGES  
1 THRU 17  
STAGES  
18 THRU 24  
Q18 Q19 Q20 Q21 Q22 Q23 Q24  
9
IN 1  
6
IN 2  
V
V
= PIN 16  
= PIN 8  
DD  
SS  
PIN ASSIGNMENT  
5
4
OUT2  
3
7
OUT 1  
10 11 12 13 14 15  
1
V
DD  
V
SS  
Q24  
1
2
3
4
5
6
7
8
16  
V
DD  
RESET  
15 Q23  
14 Q22  
13 Q21  
12 Q20  
11 Q19  
10 Q18  
Output  
Count Capacity  
18  
Q18  
Q19  
Q20  
Q21  
Q22  
Q23  
Q24  
2
= 262,144  
= 524,288  
V
SS  
19  
20  
21  
22  
23  
24  
2
2
2
2
2
2
OUT 2  
= 1,048,576  
= 2,097,152  
= 4,194,304  
= 8,388,608  
= 16,777,216  
V
DD  
IN 2  
V
9
IN 1  
SS  
ORDERING INFORMATION  
Device  
Package  
PDIP−16  
PDIP−16  
Shipping  
MC14521BCP  
25 Units / Rail  
MC14521BCPG  
(Pb−Free)  
MC14521BD  
SOIC−16  
48 Units / Rail  
MC14521BDG  
SOIC−16  
(Pb−Free)  
MC14521BDR2  
SOIC−16  
2500 / Tape & Reel  
50 Units / Rail  
MC14521BDR2G  
SOIC−16  
(Pb−Free)  
MC14521BF  
SOEIAJ−16  
MC14521BFG  
SOEIAJ−16  
(Pb−Free)  
MC14521BFEL  
SOEIAJ−16  
2000 / Tape & Reel  
MC14521BFELG  
SOEIAJ−16  
(Pb−Free)  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
2
MC14521B  
ELECTRICAL CHARACTERISTICS (Voltages Referenced to V  
)
SS  
− 55_C  
25_C  
125_C  
V
Typ  
DD  
(Note 2)  
Min  
Max  
Min  
Max  
Min  
Max  
Vdc  
Characteristic  
Output Voltage  
Symbol  
Unit  
“0” Level  
V
5.0  
10  
15  
0.05  
0.05  
0.05  
0
0
0
0.05  
0.05  
0.05  
0.05  
0.05  
0.05  
Vdc  
OL  
V
in  
= V or 0  
DD  
“1” Level  
V
5.0  
10  
15  
4.95  
9.95  
14.95  
4.95  
9.95  
14.95  
5.0  
10  
15  
4.95  
9.95  
14.95  
Vdc  
Vdc  
OH  
V
= 0 or V  
in  
DD  
Input Voltage  
(V = 4.5 or 0.5 Vdc)  
“0” Level  
V
IL  
5.0  
10  
15  
1.5  
3.0  
4.0  
2.25  
4.50  
6.75  
1.5  
3.0  
4.0  
1.5  
3.0  
4.0  
O
O
O
(V = 9.0 or 1.0 Vdc)  
(V = 13.5 or 1.5 Vdc)  
“1” Level  
V
Vdc  
IH  
(V = 0.5 or 4.5 Vdc)  
O
5.0  
10  
15  
3.5  
7.0  
11  
3.5  
7.0  
11  
2.75  
5.50  
8.25  
3.5  
7.0  
11  
(V = 1.0 or 9.0 Vdc)  
O
(V = 1.5 or 13.5 Vdc)  
O
Output Drive Current  
I
mAdc  
OH  
(V  
(V  
(V  
(V  
= 2.5 Vdc)  
= 4.6 Vdc)  
= 9.5 Vdc)  
= 13.5 Vdc)  
Source  
Pins 4 & 7  
5.0  
5.0  
10  
– 1.2  
– 0.25  
– 0.62  
– 1.8  
– 1.0  
– 0.2  
– 0.5  
– 1.5  
– 1.7  
– 0.36  
– 0.9  
– 3.5  
– 0.7  
– 0.14  
– 0.35  
– 1.1  
OH  
OH  
OH  
OH  
15  
(V  
(V  
(V  
(V  
= 2.5 Vdc)  
= 4.6 Vdc)  
= 9.5 Vdc) 11, 12, 13, 14  
Source  
Pins 1, 10,  
OH  
OH  
OH  
OH  
5.0  
5.0  
10  
– 3.0  
– 0.64  
– 1.6  
– 4.2  
– 2.4  
– 0.51  
– 1.3  
– 3.4  
– 4.2  
– 0.88  
– 2.25  
– 8.8  
– 1.7  
– 0.36  
– 0.9  
– 2.4  
mAdc  
mAdc  
= 13.5 Vdc)  
and 15  
15  
(V = 0.4 Vdc)  
(V = 0.5 Vdc)  
(V = 1.5 Vdc)  
Sink  
OL  
OL  
OL  
I
5.0  
10  
15  
0.64  
1.6  
4.2  
0.51  
1.3  
3.4  
0.88  
2.25  
8.8  
0.36  
0.9  
2.4  
OL  
Input Current  
Input Capacitance  
I
15  
0.1  
0.00001  
5.0  
0.1  
7.5  
1.0  
mAdc  
in  
C
pF  
in  
(V = 0)  
in  
Quiescent Current  
(Per Package)  
I
5.0  
10  
15  
5.0  
10  
20  
0.005  
0.010  
0.015  
5.0  
10  
20  
150  
300  
600  
mAdc  
mAdc  
DD  
Total Supply Current (Note 3, 4)  
(Dynamic plus Quiescent,  
Per Package)  
I
5.0  
10  
15  
I
I
I
= (0.42 mA/kHz) f + I  
= (0.85 mA/kHz) f + I  
= (1.40 mA/kHz) f + I  
T
T
T
T
DD  
DD  
DD  
(C = 50 pF on all outputs, all  
L
buffers switching)  
2. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
3. The formulas given are for the typical characteristics only at 25_C.  
4. To calculate total supply current at loads other than 50 pF: I (C ) = I (50 pF) + (C – 50) Vfk where: I is in mA (per package), C in pF,  
T
L
T
L
T
L
V = (V – V ) in volts, f in kHz is input frequency, and k = 0.003.  
DD  
SS  
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3
 
MC14521B  
SWITCHING CHARACTERISTICS (Note 5) (C = 50 pF, T = 25_C)  
L
A
V
Typ  
DD  
Vdc  
(Note 6)  
Characteristic  
Symbol  
Min  
Max  
Unit  
Output Rise and Fall Time (Counter Outputs)  
t
, t  
ns  
TLH THL  
t
t
t
, t  
= (1.5 ns/pF) C + 25 ns  
5.0  
10  
15  
100  
50  
40  
200  
100  
80  
TLH THL  
L
, t  
= (0.75 ns/pF) C + 12.5 ns  
TLH THL  
L
, t  
= (0.55 ns/pF) C + 12.5 ns  
TLH THL  
L
Propagation Delay Time  
Clock to Q18  
t
, t  
ms  
PHL PLH  
t
t
t
, t  
= (1.7 ns/pF) C + 4415 ns  
5.0  
10  
15  
4.5  
1.7  
1.3  
9.0  
3.5  
2.7  
PHL PLH  
L
, t  
= (0.66 ns/pF) C + 1667 ns  
PHL PLH  
L
, t  
= (0.5 ns/pF) C + 1275 ns  
L
PHL PLH  
Clock to Q24  
t
t
t
, t  
= (1.7 ns/pF) C + 5915 ns  
= (0.66 ns/pF) C + 2167 ns  
L
PHL PLH L  
5.0  
10  
15  
6.0  
2.2  
1.7  
12  
4.5  
3.5  
, t  
PHL PLH  
, t  
= (0.5 ns/pF) C + 1675 ns  
PHL PLH  
L
Propagation Delay Time  
Reset to Q  
t
ns  
PHL  
n
t
t
t
= (1.7 ns/pF) C + 1215 ns  
= (0.66 ns/pF) C + 467 ns  
5.0  
10  
15  
1300  
500  
375  
2600  
1000  
750  
PHL  
PHL  
PHL  
L
L
= (0.5 ns/pF) C + 350 ns  
L
Clock Pulse Width  
t
5.0  
10  
15  
385  
150  
120  
140  
55  
40  
ns  
MHz  
ms  
WH(cl)  
Clock Pulse Frequency  
Clock Rise and Fall Time  
Reset Pulse Width  
f
5.0  
10  
15  
3.5  
9.0  
12  
2.0  
5.0  
6.5  
cl  
t
, t  
5.0  
10  
15  
15  
5.0  
4.0  
TLH THL  
t
5.0  
10  
15  
1400  
600  
450  
700  
300  
225  
ns  
WH(R)  
Reset Removal Time  
t
5.0  
10  
15  
30  
0
– 40  
– 200  
– 160  
– 110  
ns  
rem  
5. The formulas given are for the typical characteristics only at 25_C.  
6. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.  
V
DD  
0.01 mF  
CERAMIC  
500 mF  
I
D
V
V
DD  
DD  
20 ns  
90%  
10%  
20 ns  
Q18  
Q19  
PULSE  
GENERATOR  
V
C
DD  
L
IN 2  
V
in  
50%  
C
L
Q20  
Q21  
Q22  
Q23  
Q24  
0 V  
C
L
50% DUTY CYCLE  
C
L
C
L
R
C
L
C
L
V
V
SS  
SS  
Figure 1. Power Dissipation Test Circuit and Waveform  
http://onsemi.com  
4
 
MC14521B  
V
DD  
V
V ′  
DD  
DD  
20 ns  
20 ns  
90%  
20 ns  
IN 2  
Q18  
Q19  
PULSE  
GENERATOR  
C
IN 2  
L
50%  
10%  
C
L
Q20  
Q21  
Q22  
Q23  
Q24  
C
L
t
t
WH  
WL  
C
L
90%  
C
50%  
L
Q
n
R
10%  
t
C
L
t
C
PLH  
PHL  
L
V
V
SS  
SS  
t
t
THL  
TLH  
Figure 2. Switching Time Test Circuit and Waveforms  
500 kHz  
Circuit  
50 kHz  
Circuit  
Characteristic  
Unit  
Crystal Characteristics  
Resonant Frequency  
Equivalent Resistance, R  
500  
1.0  
50  
6.2  
kHz  
kW  
S
External Resistor/Capacitor Values  
V
DD  
47  
82  
20  
750  
82  
20  
kW  
pF  
pF  
R
o
C
T
C
S
R
o
R*  
V
V
DD  
DD  
18 M  
Frequency Stability  
IN 1 OUT 1  
OUT 2  
Q18  
Frequency Change as a Function  
of V (T = 25_C)  
DD  
A
+ 6.0  
+ 2.0  
+ 2.0  
+ 2.0  
ppm  
ppm  
V
V
Change from 5.0 V to 10 V  
Change from 10 V to 15 V  
DD  
DD  
Q19  
IN 2  
Q20  
Q21  
Q22  
Q23  
Q24  
Frequency Change as a Function  
– 4.0  
+ 100  
– 2.0  
+ 120  
ppm  
ppm  
of Temperature (V = 10 V)  
DD  
T Change from – 55_C to + 25_C  
A
C
C
T
S
R
MC14521 only  
Complete Oscillator*  
V
V ′  
SS  
SS  
– 2.0  
– 160  
– 2.0  
– 560  
ppm  
ppm  
T Change from +25_C to+125_C  
A
R*  
MC14521 only  
Complete Oscillator*  
*Optional for low power operation,  
10 kW R 70 kW.  
*Complete oscillator includes crystal, capacitors, and resistors.  
Figure 4. Typical Data for Crystal Oscillator Circuit  
Figure 3. Crystal Oscillator Circuit  
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5
MC14521B  
100  
50  
TEST CIRCUIT  
FIGURE 7  
8.0  
4.0  
V
= 10 V  
DD  
TEST CIRCUIT  
FIGURE 7  
V
= 15 V  
DD  
20  
10  
f AS A FUNCTION  
OF R  
TC  
(C = 1000 pF)  
(R 2R  
0
−4.0  
−8.0  
−12  
)
TC  
S
5.0  
f AS A FUNCTION  
OF C  
(R = 56 kW)  
10 V  
2.0  
1.0  
0.5  
TC  
(R = 120 k)  
S
5.0 V  
0.2  
0.1  
R
= 56 kW,  
R
R
= 0, f = 10.15 kHz @ V = 10 V, T = 25°C  
DD A  
= 120 kW, f = 7.8 kHz @ V = 10 V, T = 25°C  
DD A  
TC  
S
{
C = 1000 pF  
S
1.0 k  
10 k  
R , RESISTANCE (OHMS)  
TC  
100 k  
1.0 m  
0.1  
−16  
−55  
−25  
0
25  
50  
75  
100  
125  
T , AMBIENT TEMPERATURE (°C), DEVICE ONLY  
0.0001  
0.001  
0.01  
A
C, CAPACITANCE (mF)  
Figure 5. RC Oscillator Stability  
Figure 6. RC Oscillator Frequency as a  
Function of RTC and C  
R
R
TC  
V
V
DD  
S
DD  
C
V
DD  
V
V ′  
DD  
DD  
IN 1  
Q18  
Q19  
Q20  
Q21  
Q22  
Q23  
Q24  
IN 1 OUT 1  
OUT 2  
Q18  
Q19  
Q20  
Q21  
Q22  
Q23  
Q24  
IN 2  
R
PULSE  
GENERATOR  
IN 2  
OUT 1  
OUT 2  
R
V
V
SS  
SS  
V
V
SS  
SS  
Figure 7. RC Oscillator Circuit  
Figure 8. Functional Test Circuit  
FUNCTIONAL TEST SEQUENCE  
Inputs  
Reset In 2 Out 2  
Outputs  
Comments  
V
V
DD  
Q18  
thru  
Q24  
Counter is in three 8−stage sections  
in parallel mode Counter is reset. In 2  
and Out 2 are connected together.  
SS  
1
0
0
1
0
1
V
GND  
0
DD  
First “0” to “1” transition on In 2,  
Out 2 node.  
A test function (see Figure 8) has been included  
for the reduction of test time required to exercise all  
24 counter stages. This test function divides the  
counter into three 8−stage sections, and 255  
counts are loaded in each of the 8−stage sections  
in parallel. All flip−flops are now at a logic “1”. The  
counter is now returned to the normal 24−stages in  
series configuration. One more pulse is entered into  
Input 2 (In 2) which will cause the counter to ripple  
from an all “1” state to an all “0” state.  
0
1
0
1
255 “0” to “1” transitions are clocked  
into this In 2, Out 2 node.  
1
1
1
The 255th “0” to “1” transition.  
0
0
0
0
1
1
GND  
Counter converted back to 24−stages  
in series mode.  
1
1
0
0
1
1
V
DD  
Out 2 converts back to an output.  
Counter ripples from an all “1” state  
to an all “0” stage.  
0
1
0
http://onsemi.com  
6
MC14521B  
LOGIC DIAGRAM  
V
5
RESET  
2
DD  
9
STAGES  
1
2
8
3 THRU 7  
IN 1  
6
IN 2  
4
OUT 2  
7
OUT 1  
3
V
SS  
STAGES  
11 THRU 15  
9
10  
16  
17  
18  
19  
20  
21  
22  
23  
24  
V
V
= PIN 16  
= PIN 8  
10  
Q18  
11  
Q19  
12  
Q20  
13  
Q21  
14  
Q22  
15  
Q23  
1
Q24  
DD  
SS  
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7
MC14521B  
PACKAGE DIMENSIONS  
PDIP−16  
CASE 648−08  
ISSUE T  
NOTES:  
−A−  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: INCH.  
3. DIMENSION L TO CENTER OF LEADS  
WHEN FORMED PARALLEL.  
4. DIMENSION B DOES NOT INCLUDE  
MOLD FLASH.  
16  
1
9
8
B
S
5. ROUNDED CORNERS OPTIONAL.  
INCHES  
DIM MIN MAX  
0.740 0.770 18.80 19.55  
MILLIMETERS  
F
C
L
MIN MAX  
A
B
C
D
F
0.250 0.270  
0.145 0.175  
0.015 0.021  
6.35  
3.69  
0.39  
1.02  
6.85  
4.44  
0.53  
1.77  
SEATING  
PLANE  
−T−  
0.040  
0.70  
G
H
J
K
L
0.100 BSC  
2.54 BSC  
1.27 BSC  
K
M
H
0.050 BSC  
0.008 0.015  
0.110 0.130  
0.295 0.305  
J
0.21  
0.38  
3.30  
7.74  
10  
G
2.80  
7.50  
0
D 16 PL  
M
M
0.25 (0.010)  
T A  
M
S
0
10  
_
_
_
_
0.020 0.040  
0.51  
1.01  
SOIC−16  
CASE 751B−05  
ISSUE J  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
−A−  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSIONS A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
16  
9
8
−B−  
P 8 PL  
M
S
B
0.25 (0.010)  
1
MILLIMETERS  
INCHES  
G
DIM MIN  
MAX  
10.00  
4.00  
1.75  
0.49  
1.25  
MIN  
MAX  
0.393  
0.157  
0.068  
0.019  
0.049  
A
B
C
D
F
9.80  
3.80  
1.35  
0.35  
0.40  
0.386  
0.150  
0.054  
0.014  
0.016  
F
R X 45  
K
_
G
J
1.27 BSC  
0.050 BSC  
C
0.19  
0.10  
0
0.25  
0.25  
7
0.008  
0.004  
0
0.009  
0.009  
7
−T−  
SEATING  
PLANE  
K
M
P
R
J
_
_
_
_
M
5.80  
0.25  
6.20  
0.50  
0.229  
0.010  
0.244  
0.019  
D
16 PL  
M
S
S
0.25 (0.010)  
T B  
A
http://onsemi.com  
8
MC14521B  
PACKAGE DIMENSIONS  
SOEIAJ−16  
CASE 966−01  
ISSUE A  
NOTES:  
ꢀꢁ1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
L
16  
9
E
ꢀꢁ2. CONTROLLING DIMENSION: MILLIMETER.  
ꢀꢁ3. DIMENSIONS D AND E DO NOT INCLUDE  
MOLD FLASH OR PROTRUSIONS AND ARE  
MEASURED AT THE PARTING LINE. MOLD FLASH  
OR PROTRUSIONS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
Q
1
H
E
E
M
_
ꢀꢁ4. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
1
8
L
ꢀꢁ5. THE LEAD WIDTH DIMENSION (b) DOES NOT  
INCLUDE DAMBAR PROTRUSION. ALLOWABLE  
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)  
TOTAL IN EXCESS OF THE LEAD WIDTH  
DIMENSION AT MAXIMUM MATERIAL CONDITION.  
DAMBAR CANNOT BE LOCATED ON THE LOWER  
RADIUS OR THE FOOT. MINIMUM SPACE  
BETWEEN PROTRUSIONS AND ADJACENT LEAD  
TO BE 0.46 ( 0.018).  
DETAIL P  
Z
D
VIEW P  
e
A
c
MILLIMETERS  
INCHES  
MIN MAX  
−−− 0.081  
DIM MIN  
MAX  
2.05  
0.20  
0.50  
0.20  
10.50  
5.45  
A
−−−  
0.05  
0.35  
0.10  
9.90  
5.10  
A
A
1
0.002  
0.008  
0.020  
0.011  
0.413  
0.215  
1
b
0.13 (0.005)  
b
c
0.014  
0.007  
0.390  
0.201  
0.10 (0.004)  
M
D
E
e
1.27 BSC  
0.050 BSC  
H
7.40  
0.50  
1.10  
8.20  
0.85  
1.50  
0.291  
0.020  
0.043  
0.323  
0.033  
0.059  
E
L
L
E
0
10  
10  
0.035  
M
Q
0
0.028  
_
_
_
_
0.70  
−−−  
0.90  
0.78  
1
Z
−−− 0.031  
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are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
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