MC10H351FNG [ONSEMI]
TTL, NMOS to ECL Translator, 20 LEAD PLLC, 46-TUBE;
| 型号： | MC10H351FNG |
| 厂家： | 
ONSEMI |
| 描述： | TTL, NMOS to ECL Translator, 20 LEAD PLLC, 46-TUBE 接口集成电路 锁存器 |
| 文件： | 总5页 (文件大小：121K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
MC10H351
Quad TTL/NMOS to PECL*
Translator
Description
The MC10H351 is a quad translator for interfacing data between a
saturated logic section and the PECL section of digital systems when
only a +5.0 Vdc power supply is available. The MC10H351 has
TTL/NMOS compatible inputs and PECL complementary
open-emitter outputs that allow use as an inverting/non-inverting
translator or as a differential line driver. When the common strobe
input is at a low logic level, it forces all true outputs to the PECL low
logic state (≈ +3.2 V) and all inverting outputs to the PECL high logic
state (≈ +4.1 V).
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20
1
PLCC−20
FN SUFFIX
CASE 775−02
The MC10H351 can also be used with the MC10H350 to transmit
and receive TTL/NMOS information differentially via balanced
twisted pair lines.
MARKING DIAGRAMS*
Features
• Single +5.0 Power Supply
1 20
• All V Pins Isolated On Chip
CC
• Differentially Drive Balanced Lines
• t = 1.3 nsec Typical
pd
10H351G
AWLYYWW
• These Devices are Pb-Free, Halogen Free and are RoHS Compliant
A
= Assembly Location
WL
YY
WW
G
= Wafer Lot
= Year
= Work Week
= Pb-Free Package
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
†
Device
Package
Shipping
MC10H351FNG
PLCC−20
46 Units/Tube
(Pb-Free)
MC10H351FNR2G
PLCC−20
500/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications, in-
cluding part orientation and tape sizes, please refer
to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
August, 2016 − Rev. 9
MC10H351/D
MC10H351
B OUT
B OUT
N.C.
1
2
20
19
18
17
16
15
14
13
12
11
ECL V
CC
C OUT
C OUT
D OUT
D OUT
B IN
A IN
7
8
1
2
5
4
B OUT
B OUT
3
2
1 20 19
3
4
5
6
7
8
18
17
16
15
14
A
A
C
D
OUT
OUT
OUT
A OUT
A OUT
4
A OUT
A OUT
OUT
5
V
D
V
MC10H351
CC
OUT
D IN 12
16 D OUT
D OUT
V
CC
6
V
CC
2
B
IN
CC2
17
7
C IN
N.C.
D IN
B IN
C
A
IN
IN
C IN 14
19 C OUT
18 C OUT
A IN
COMMON
STROBE
GND
8
9
10 11 12 13
COMMON
STROBE
9
9
V
CC
(+5.0 VDC) = PINS 6, 11, 15, 20
GND = PIN 10 (DIP)
10
TTL V
CC
Figure 1. Logic Diagram
Figure 2. Dip Pin Assignment
Figure 3. PLCC−20 Pin Assignment
Table 1. MAXIMUM RATINGS
Symbol
Characteristic
Rating
Unit
Vdc
Vdc
mA
V
CC
Power Supply
0 to +7.0
V
I
Input Voltage (V = 5.0 V)
0 to V
CC
CC
I
Output Current
Continuous
Surge
out
50
100
T
Operating Temperature Range
0 to +75
°C
°C
A
T
stg
Storage Temperature Range
Plastic
−55 to +150
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
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2
MC10H351
Table 2. ELECTRICAL CHARACTERISTICS (V = V
= V
= 5.0 V 5.0%)†
CC
CC1
CC2
0°
25°
75°
Symbol
ECL
Characteristic
Power Supply
Min
−
Max
Min
−
Max
45
Min
−
Max
50
Unit
mA
mA
mA
50
20
TTL
Current
−
−
15
−
20
Reverse Current
Pins 7, 8, 12, 14
Pin 9
I
−
−
25
100
−
−
20
80
−
−
25
100
R
I
INH
Forward Current
Pins 7, 8, 12, 14
Pin 9
mA
I
−
−
−0.8
−3.2
−
−
−0.6
−2.4
−
−
−0.8
−3.2
F
I
INL
V
Input Breakdown
Voltage
5.5
−
5.5
−
5.5
−
Vdc
Vdc
Vdc
Vdc
(BR)in
V
I
Input Clamp Voltage
−
−1.5
4.16
3.37
−
−1.5
4.19
3.37
−
−1.5
4.27
3.37
(I = −18 mA)
in
V
High Output
Voltage (Note 1.)
3.98
3.05
4.02
3.05
4.08
3.05
OH
V
Low Output
Voltage (1)
OL
V
High Input Voltage
Low Input Voltage
2.0
−
2.0
−
2.0
−
Vdc
Vdc
IH
V
−
0.8
−
0.8
−
0.8
IL
†Each MECL 10H™ series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been
established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained.
Outputs are terminated through a 50 W resistor to V −2.0 Vdc.
CC
*Positive Emitter Coupled Logic
1. With V at 5.0 V. V /V change 1:1 with V .
CC
OH OL
CC
Table 3. AC PARAMETERS
0°
25°
75°
Symbol
Characteristic
Min
0.4
0.4
0.4
150
Max
2.2
1.9
1.9
−
Min
0.4
0.4
0.4
150
Max
2.2
2.0
2.0
−
Min
0.4
0.4
0.4
150
Max
2.1
2.1
2.1
−
Unit
ns
t
pd
Propagation Delay (Note 2)
Rise Time (20% to 80%)
Fall Time (80% to 20%)
t
r
ns
t
f
ns
f
Maximum Operating Frequency
MHz
max
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
1. Propagation delay is measured on this circuit from +1.5 V on the input waveform to the 50% point on the output waveform.
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3
MC10H351
PACKAGE DIMENSIONS
20 LEAD PLLC
CASE 775−02
ISSUE F
M
S
S
0.007 (0.180)
T
L-M
N
B
Y BRK
−N−
M
S
S
N
0.007 (0.180)
T
L-M
U
D
D
−L−
−M−
Z
W
20
1
S
S
S
0.010 (0.250)
T
L-M
N
G1
X
V
VIEW D−D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L-M
L-M
N
N
Z
T
M
S
S
N
0.007 (0.180)
T
L-M
H
C
K1
E
K
0.004 (0.100)
G
−T− SEATING
PLANE
J
M
S
S
N
0.007 (0.180)
T
L-M
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L-M
N
NOTES:
1. DIMENSIONS AND TOLERANCING PER ANSI Y14.5M,
1982.
INCHES
MIN MAX
MILLIMETERS
DIM
A
B
C
E
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.53
2. DIMENSIONS IN INCHES.
0.385
0.385
0.165
0.090
0.013
0.395
0.395
0.180
0.110
0.021
3. DATUMS −L−, −M−, AND −N− DETERMINED WHERE TOP
OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD
PARTING LINE.
4. DIMENSION G1, TRUE POSITION TO BE MEASURED AT
DATUM −T−, SEATING PLANE.
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
5. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE.
6. DIMENSIONS IN THE PACKAGE TOP MAY BE SMALLER
THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE
BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY
MISMATCH BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION
TO BE GREATER THAN 0.037 (0.940). THE DAMBAR
INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO
BE SMALLER THAN 0.025 (0.635).
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
−−−
0.032
−−−
−−−
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
−−−
2
0.81
−−−
−−−
9.04
9.04
1.21
1.21
1.42
0.50
10
0.356
0.356
0.048
0.048
0.056
0.020
10
Z
2
_
_
_
_
G1 0.310
K1 0.040
0.330
7.88
1.02
8.38
−−−
−−−
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4
MC10H351
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