MC10H351MR1 [ONSEMI]
QUAD TTL/NMOS TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO20, EIAJ, SOP-20;
| 型号： | MC10H351MR1 |
| 厂家： | 
ONSEMI |
| 描述： | QUAD TTL/NMOS TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, PDSO20, EIAJ, SOP-20 光电二极管 输出元件 接口集成电路 锁存器 |
| 文件： | 总4页 (文件大小：101K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SEMICONDUCTOR TECHNICAL DATA
L SUFFIX
CERAMIC PACKAGE
CASE 732–03
The MC10H351 is a quad translator for interfacing data between a
saturated logic section and the PECL section of digital systems when only
a +5.0 Vdc power supply is available. The MC10H351 has TTL/NMOS
compatible inputs and PECL complementary open–emitter outputs that
allow use as an inverting/non–inverting translator or as a differential line
driver. When the common strobe input is at a low logic level, it forces all
true outputs to the PECL low logic state (≈ +3.2 V) and all inverting
outputs to the PECL high logic state (≈ +4.1 V).
P SUFFIX
PLASTIC PACKAGE
CASE 738–03
FN SUFFIX
PLCC
CASE 775–02
The MC10H351 can also be used with the MC10H350 to transmit and
receive TTL/NMOS information differentially via balanced twisted pair
lines.
•
•
•
•
Single +5.0 Power Supply
All V Pins Isolated On Chip
LOGIC DIAGRAM
CC
Differentially Drive Balanced Lines
= 1.3 nsec Typical
B IN
A IN
D IN
C IN
7
1
B OUT
B OUT
2
t
pd
8
5
A OUT
A OUT
4
MAXIMUM RATINGS
12
16
17
19
18
D OUT
D OUT
C OUT
C OUT
Characteristic
Symbol
Rating
Unit
Vdc
Vdc
mA
Power Supply
V
CC
0 to +7.0
14
9
Input Voltage (V
= 5.0 V)
V
I
0 to V
50
CC
CC
COMMON
STROBE
Output Current— Continuous
— Surge
I
out
100
V
(+5.0 VDC) = PINS 6, 11, 15, 20
GND = PIN 10
CC
Operating Temperature Range
T
0 to +75
°C
°C
A
Storage Temperature Range— Plastic
— Ceramic
T
stg
–55 to +150
–55 to +165
DIP
ELECTRICAL CHARACTERISTICS (V
0°
= V
= V
CC2
25°
= 5.0 V ± 5.0%)
75°
CC
CC1
PIN ASSIGNMENT
Characteristic
Symbol Min
Max
50
Min
—
Max
Min
—
Max
50
Unit
mA
mA
µA
B OUT
B OUT
N.C.
ECL V
CC
1
2
20
19
18
17
16
15
14
13
12
11
Power Supply
Current
ECL
TTL
—
—
45
15
C OUT
C OUT
D OUT
D OUT
20
—
—
20
Reverse Current
Pins 7, 8, 12, 14
Pin 9
3
I
—
—
25
100
—
—
20
80
—
—
25
100
R
A OUT
A OUT
4
I
INH
Forward Current
Pins 7, 8, 12, 14
Pin 9
mA
5
I
—
—
–0.8
–3.2
—
—
–0.6
–2.4
—
—
–0.8
–3.2
F
V
2
I
V
6
CC
INL
CC
Input Breakdown
Voltage
V
5.5
—
5.5
—
5.5
—
Vdc
Vdc
Vdc
Vdc
(BR)in
C IN
N.C.
D IN
B IN
7
A IN
8
Input Clamp Voltage
(I = –18 mA)
in
V
I
—
–1.5
4.16
3.37
—
–1.5
4.19
3.37
—
–1.5
4.27
3.37
COMMON
STROBE
9
High Output
Voltage (1)
V
3.98
3.05
4.02
3.05
4.08
3.05
OH
TTL V
GND
10
CC
Low Output
Voltage (1)
V
OL
Pin assignment is for Dual–in–Line Package.
For PLCC pin assignment, see the Pin Conversion
Tables on page 6–36 of the Motorola MECL Data
Book (DL122/D).
High Input Voltage
Low Input Voltage
V
2.0
—
—
2.0
—
—
2.0
—
—
Vdc
Vdc
IH
V
0.8
0.8
0.8
IL
(1) With V
at 5.0 V. V /V
OH OL
change 1:1 with V
.
CC
CC
*Positive Emitter Coupled Logic
3/93
Motorola, Inc. 1996
REV 5
MC10H351
AC PARAMETERS
0°
25°
75°
Characteristic
Propagation Delay (1)
Symbol
Min
0.4
0.4
0.4
150
Max
2.2
1.9
1.9
—
Min
0.4
0.4
0.4
150
Max
2.2
2.0
2.0
—
Min
0.4
0.4
0.4
150
Max
2.1
2.1
2.1
—
Unit
ns
t
pd
Rise Time (20% to 80%)
Fall Time (80% to 20%)
Maximum Operating Frequency
t
r
ns
t
f
ns
f
MHz
max
(1) Propagation delay is measured on this circuit from +1.5 volts on the input waveform to the 50% point on the output waveform.
NOTE:
Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The
circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 lfpm is maintained. Outputs are terminated through
a 50–ohm resistor to V
–2.0 Vdc.
CC
MOTOROLA
2–78
MC10H351
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 775–02
ISSUE C
M
S
S
0.007 (0.180)
T
L–M
N
B
Y BRK
–M–
–N–
M
S
S
0.007 (0.180)
T
L–M
N
U
D
D
–L–
Z
W
20
1
S
S
S
0.010 (0.250)
T
L–M
N
G1
X
V
VIEW D–D
M
M
S
S
S
S
A
R
0.007 (0.180)
0.007 (0.180)
T
L–M
L–M
N
N
Z
T
M
S
S
0.007 (0.180)
T
L–M
N
H
C
K1
E
K
0.004 (0.100)
–T– SEATING
G
J
PLANE
M
S
S
0.007 (0.180)
T
L–M
N
F
VIEW S
G1
VIEW S
S
S
S
0.010 (0.250)
T
L–M
N
NOTES:
1. DATUMS –L–, –M–, AND –N– DETERMINED
INCHES
MILLIMETERS
DIM
MIN
MAX
0.395
0.395
0.180
0.110
0.019
MIN
9.78
9.78
4.20
2.29
0.33
MAX
10.03
10.03
4.57
2.79
0.48
WHERE TOP OF LEAD SHOULDER EXITS PLASTIC
BODY AT MOLD PARTING LINE.
A
B
C
E
0.385
0.385
0.165
0.090
0.013
2. DIMENSION G1, TRUE POSITION TO BE
MEASURED AT DATUM –T–, SEATING PLANE.
3. DIMENSIONS R AND U DO NOT INCLUDE MOLD
FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN THE
PACKAGE BOTTOM BY UP TO 0.012 (0.300).
DIMENSIONS R AND U ARE DETERMINED AT THE
OUTERMOST EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,
GATE BURRS AND INTERLEAD FLASH, BUT
INCLUDING ANY MISMATCH BETWEEN THE TOP
AND BOTTOM OF THE PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037 (0.940).
THE DAMBAR INTRUSION(S) SHALL NOT CAUSE
THE H DIMENSION TO BE SMALLER THAN 0.025
(0.635).
F
G
H
J
K
R
U
V
W
X
Y
0.050 BSC
1.27 BSC
0.026
0.020
0.025
0.350
0.350
0.042
0.042
0.042
–––
0.032
–––
–––
0.356
0.356
0.048
0.048
0.056
0.020
10
0.66
0.51
0.64
8.89
8.89
1.07
1.07
1.07
–––
2
0.81
–––
–––
9.04
9.04
1.21
1.21
1.42
0.50
10
Z
G1
K1
2
0.310
0.040
0.330
–––
7.88
1.02
8.38
–––
2–79
MOTOROLA
MC10H351
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 732–03
NOTES:
1. LEADS WITHIN 0.010 DIAMETER, TRUE
ISSUE E
20
1
11
10
POSITION AT SEATING PLANE, AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSIONS A AND B INCLUDE MENISCUS.
B
C
INCHES
A
DIM
A
B
C
D
F
MIN
MAX
0.990
0.295
0.200
0.022
0.065
0.940
0.260
0.150
0.015
0.055
L
F
G
H
J
K
L
0.100 BSC
0.020
0.008
0.125
0.050
0.012
0.160
N
J
0.300 BSC
H
K
M
G
M
N
0
15
D
0.010
0.040
SEATING
PLANE
P SUFFIX
PLASTIC DIP PACKAGE
CASE 738–03
ISSUE E
–A–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
20
1
11
10
B
L
C
INCHES
MILLIMETERS
DIM
A
B
C
D
MIN
MAX
1.070
0.260
0.180
0.022
MIN
25.66
6.10
3.81
0.39
MAX
27.17
6.60
4.57
0.55
1.010
0.240
0.150
0.015
–T–
SEATING
PLANE
K
E
0.050 BSC
1.27 BSC
M
0.050
0.070
1.27
1.77
F
G
J
K
L
N
E
0.100 BSC
2.54 BSC
0.008
0.110
0.015
0.140
0.21
2.80
0.38
3.55
G
F
J 20 PL
0.300 BSC
7.62 BSC
D 20 PL
0.25 (0.010)
M
M
0.25 (0.010)
T B
M
N
0
15
0
15
0.020
0.040
0.51
1.01
M
M
T
A
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MC10H351/D
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