MC10EP32DTR2 [ONSEMI]

3.3V 5V ECL / 2 Divider; 3.3V 5V ECL / 2分频器
MC10EP32DTR2
型号: MC10EP32DTR2
厂家: ONSEMI    ONSEMI
描述:

3.3V 5V ECL / 2 Divider
3.3V 5V ECL / 2分频器

预分频器 多谐振动器
文件: 总10页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
MC10EP32, MC100EP32  
3.3V / 5VꢀECL B2 Divider  
The MC10/100EP32 is an integrated B2 divider with differential  
CLK inputs.  
The V pin, an internally generated voltage supply, is available to  
BB  
this device only. For single−ended input conditions, the unused  
differential input is connected to V as a switching reference voltage.  
BB  
http://onsemi.com  
MARKING DIAGRAMS*  
V
BB  
may also rebias AC coupled inputs. When used, decouple V  
BB  
and V via a 0.01 mF capacitor and limit current sourcing or sinking  
CC  
to 0.5 mA. When not used, V should be left open.  
BB  
The reset pin is asynchronous and is asserted on the rising edge.  
Upon power−up, the internal flip−flops will attain a random state; the  
reset allows for the synchronization of multiple EP32’s in a system.  
The 100 Series contains temperature compensation.  
8
8
8
HEP32  
ALYW  
KEP32  
ALYW  
1
SOIC−8  
D SUFFIX  
CASE 751  
350 ps Typical Propagation Delay  
Maximum Frequency > 4 GHz Typical (Figure 3)  
1
1
PECL Mode Operating Range:  
8
1
8
1
V
= 3.0 V to 5.5 V with V = 0 V  
EE  
CC  
8
1
NECL Mode Operating Range:  
= 0 V with V = −3.0 V to −5.5 V  
HP32  
ALYW  
KP32  
ALYW  
TSSOP−8  
DT SUFFIX  
CASE 948R  
V
CC  
EE  
Open Input Default State  
Safety Clamp on Inputs  
Q Output Will Default LOW with Inputs Open or at V  
Pb−Free Package is Available  
L = Wafer Lot  
Y = Year  
W = Work Week  
H = MC10  
K = MC100  
A = Assembly Location  
EE  
*For additional marking information, refer to  
Application Note AND8002/D.  
ORDERING INFORMATION  
See detailed ordering and shipping information in the package  
dimensions section on page 7 of this data sheet.  
Semiconductor Components Industries, LLC, 2004  
1
Publication Order Number:  
June, 2004 − Rev. 7  
MC10EP32/D  
MC10EP32, MC100EP32  
Table 1. PIN DESCRIPTION  
Pin  
RESET  
CLK  
1
2
8
7
V
CC  
Function  
R
CLK, CLK*  
Reset*  
ECL Clock Inputs  
ECL Asynchronous Reset  
Reference Voltage Output  
ECL Data Outputs  
Q
Q
V
BB  
B2  
Q, Q  
V
CC  
Positive Supply  
CLK  
3
4
6
5
V
EE  
Negative Supply  
*Pins will default LOW when left open.  
V
BB  
V
EE  
Table 2. TRUTH TABLE  
CLK  
CLK  
RESET  
Q
Q
Figure 1. 8−Lead Pinout (Top View) and Logic  
Diagram  
X
Z
X
Z
Z
L
L
F
H
F
Z = LOW to HIGH Transition  
Z = HIGH to LOW Transition  
F = Divide by 2 Function  
CLK  
t
RR  
RESET  
Q
Figure 2. Timing Diagram  
Table 3. ATTRIBUTES  
Characteristics  
Value  
75 kW  
N/A  
Internal Input Pulldown Resistor  
Internal Input Pullup Resistor  
ESD Protection  
Human Body Model  
Machine Model  
Charged Device Model  
> 4 kV  
> 200 V  
> 2 kV  
Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1)  
Level 1  
UL 94 V−0 @ 0.125 in  
78 Devices  
Flammability Rating  
Transistor Count  
Oxygen Index: 28 to 34  
Meets or exceeds JEDEC Spec EIA/JESD78 IC Latchup Test  
1. For additional information, see Application Note AND8003/D.  
http://onsemi.com  
2
 
MC10EP32, MC100EP32  
Table 4. MAXIMUM RATINGS  
Symbol  
Parameter  
Condition 1  
= 0 V  
Condition 2  
Rating  
Unit  
V
V
CC  
V
EE  
V
I
PECL Mode Power Supply  
NECL Mode Power Supply  
V
V
6
EE  
= 0 V  
−6  
V
CC  
PECL Mode Input Voltage  
NECL Mode Input Voltage  
V
V
= 0 V  
= 0 V  
V v V  
6
V
V
EE  
I
CC  
V w V  
−6  
CC  
I
EE  
I
Output Current  
Continuous  
Surge  
50  
mA  
mA  
out  
100  
I
V
Sink/Source  
± 0.5  
mA  
°C  
BB  
BB  
T
Operating Temperature Range  
−40 to +85  
−65 to +150  
A
T
Storage Temperature Range  
°C  
stg  
q
Thermal Resistance (Junction−to−Ambient)  
0 lfpm  
SOIC−8  
SOIC−8  
190  
130  
°C/W  
°C/W  
JA  
500 lfpm  
q
q
Thermal Resistance (Junction−to−Case)  
Thermal Resistance (Junction−to−Ambient)  
Standard Board  
SOIC−8  
41 to 44  
°C/W  
JC  
JA  
0 lfpm  
TSSOP−8  
TSSOP−8  
185  
140  
°C/W  
°C/W  
500 lfpm  
q
Thermal Resistance (Junction−to−Case)  
Wave Solder  
Standard Board  
TSSOP−8  
41 to 44  
265  
°C/W  
°C  
JC  
T
sol  
<2 to 3 sec @ 248°C  
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit  
values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,  
damage may occur and reliability may be affected.  
Table 5. 10EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 2)  
CC  
EE  
−40°C  
25°C  
Typ  
85°C  
Typ  
Min  
Typ  
30  
Max  
37  
Min  
23  
Max  
37  
Min  
23  
Max  
37  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
23  
30  
30  
V
V
V
V
V
V
Output HIGH Voltage (Note 3)  
Output LOW Voltage (Note 3)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
2165  
1365  
2090  
1365  
1790  
2.0  
2290  
1490  
2415  
1615  
2415  
1690  
1990  
3.3  
2230  
1430  
2155  
1430  
1855  
2.0  
2355  
1555  
2480  
1680  
2480  
1755  
2055  
3.3  
2290  
1490  
2215  
1490  
1915  
2.0  
2415  
1615  
2540  
1740  
2540  
1815  
2115  
3.3  
OH  
OL  
IH  
IL  
1890  
1955  
2015  
BB  
Input HIGH Voltage Common Mode  
IHCMR  
Range (Differential Configuration) (Note 4)  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
2. Input and output parameters vary 1:1 with V . V can vary +0.3 V to −2.2 V.  
CC  
EE  
3. All loading with 50 W to V − 2.0 V.  
CC  
4. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
3
 
MC10EP32, MC100EP32  
Table 6. 10EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 5)  
CC  
EE  
−40°C  
25°C  
Typ  
85°C  
Typ  
Min  
Typ  
30  
Max  
37  
Min  
23  
Max  
37  
Min  
23  
Max  
37  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
23  
30  
30  
V
V
V
V
V
V
Output HIGH Voltage (Note 6)  
Output LOW Voltage (Note 6)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
3865  
3065  
3790  
3065  
3490  
2.0  
3990  
3190  
4115  
3315  
4115  
3390  
3690  
5.0  
3930  
3130  
3855  
3130  
3555  
2.0  
4055  
3255  
4180  
3380  
4180  
3455  
3755  
5.0  
3990  
3190  
3915  
3190  
3615  
2.0  
4115  
3315  
4240  
3440  
4240  
3515  
3815  
5.0  
OH  
OL  
IH  
IL  
3590  
3655  
3715  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 7)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
5. Input and output parameters vary 1:1 with V . V can vary +2.0 V to −0.5 V.  
CC  
EE  
6. All loading with 50 W to V − 2.0 V.  
CC  
7. V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 7. 10EP DC CHARACTERISTICS, NECL V = 0 V; V = −5.5 V to −3.0 V (Note 8)  
CC  
EE  
−40°C  
Typ  
30  
25°C  
Typ  
30  
85°C  
Typ  
30  
Min  
23  
Max  
Min  
Max  
Min  
Max  
37  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
37  
23  
37  
23  
VOH  
Output HIGH Voltage (Note 9)  
Output LOW Voltage (Note 9)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
1135 −1010 −885 −1070 −945  
−820 −1010 −885  
−760  
V
V
V
V
V
−1935 −1810 −1685 −1870 −1745 −1620 −1810 −1685 −1560  
OL  
−1210  
−1935  
−885 −1145  
−1610 −1870  
−820 −1085  
−1545 −1810  
−760  
IH  
−1485  
IL  
−1510 −1410 −1310 −1445 −1345 −1245 −1385 −1285 −1185  
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 10)  
V
EE  
+2.0  
0.0  
V
EE  
+2.0  
0.0  
V
EE  
+2.0  
0.0  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
8. Input and output parameters vary 1:1 with V  
.
CC  
9. All loading with 50 W to V − 2.0 V.  
CC  
10.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
4
 
MC10EP32, MC100EP32  
Table 8. 100EP DC CHARACTERISTICS, PECL V = 3.3 V, V = 0 V (Note 11)  
CC  
EE  
−40°C  
25°C  
Typ  
85°C  
Typ  
Min  
23  
Typ  
30  
Max  
37  
Min  
26  
Max  
40  
Min  
28  
Max  
42  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
34  
36  
V
V
V
V
V
V
Output HIGH Voltage (Note 12)  
Output LOW Voltage (Note 12)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
2155  
1355  
2075  
1355  
1775  
2.0  
2280  
1480  
2405  
1605  
2420  
1675  
1975  
3.3  
2155  
1355  
2075  
1355  
1775  
2.0  
2280  
1480  
2405  
1605  
2420  
1675  
1975  
3.3  
2155  
1355  
2075  
1355  
1775  
2.0  
2280  
1480  
2405  
1605  
2420  
1675  
1975  
3.3  
OH  
OL  
IH  
IL  
1875  
1875  
1875  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 13)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
11. Input and output parameters vary 1:1 with V . V can vary +0.3 V to −2.2 V.  
CC  
EE  
12.All loading with 50 W to V − 2.0 V.  
CC  
13.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 9. 100EP DC CHARACTERISTICS, PECL V = 5.0 V, V = 0 V (Note 14)  
CC  
EE  
−40°C  
25°C  
Typ  
85°C  
Typ  
Min  
23  
Typ  
30  
Max  
37  
Min  
26  
Max  
40  
Min  
28  
Max  
42  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
mV  
mV  
mV  
mV  
V
I
EE  
34  
36  
V
V
V
V
V
V
Output HIGH Voltage (Note 15)  
Output LOW Voltage (Note 15)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
3855  
3055  
3775  
3055  
3475  
2.0  
3980  
3180  
4105  
3305  
4120  
3375  
3675  
5.0  
3855  
3055  
3775  
3055  
3475  
2.0  
3980  
3180  
4105  
3305  
4120  
3375  
3675  
5.0  
3855  
3055  
3775  
3055  
3475  
2.0  
3980  
3180  
4105  
3305  
4120  
3375  
3675  
5.0  
OH  
OL  
IH  
IL  
3575  
3575  
3575  
BB  
Input HIGH Voltage Common Mode Range  
(Differential Configuration) (Note 16)  
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
14.Input and output parameters vary 1:1 with V . V can vary +2.0 V to −0.5 V.  
CC  
EE  
15.All loading with 50 W to V − 2.0 V.  
CC  
16.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
http://onsemi.com  
5
 
MC10EP32, MC100EP32  
Table 10. 100EP DC CHARACTERISTICS, NECL V = 0 V; V = −5.5 V to −3.0 V (Note 17)  
CC  
EE  
−40°C  
Typ  
30  
25°C  
Typ  
34  
85°C  
Typ  
36  
Min  
Max  
37  
Min  
Max  
Min  
Max  
Symbol  
Characteristic  
Power Supply Current  
Unit  
mA  
mV  
I
EE  
23  
26  
40  
28  
42  
V
V
V
V
V
V
Output HIGH Voltage (Note 18)  
Output LOW Voltage (Note 18)  
Input HIGH Voltage (Single−Ended)  
Input LOW Voltage (Single−Ended)  
Output Voltage Reference  
1145 −1020 −895 −1145 −1020 −895 −1145 −1020 −895  
OH  
−1945 −1820 −1695 −1945 −1820 −1695 −1945 −1820 −1695 mV  
OL  
−1225  
−1945  
−880 −1225  
−1625 −1945  
−880 −1225  
−1625 −1945  
−880  
mV  
IH  
−1625 mV  
IL  
−1525 −1425 −1325 −1525 −1425 −1325 −1525 −1425 −1325 mV  
BB  
Input HIGH Voltage Common Mode  
Range (Differential Configuration)  
(Note 19)  
V
EE  
+2.0  
0.0  
V
EE  
+2.0  
0.0  
V
EE  
+2.0  
0.0  
V
IHCMR  
I
I
Input HIGH Current  
Input LOW Current  
150  
150  
150  
mA  
mA  
IH  
0.5  
0.5  
0.5  
IL  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
17.Input and output parameters vary 1:1 with V  
.
CC  
18.All loading with 50 W to V − 2.0 V.  
CC  
19.V  
min varies 1:1 with V , V  
max varies 1:1 with V . The V  
range is referenced to the most positive side of the differential  
IHCMR  
EE IHCMR  
CC  
IHCMR  
input signal.  
Table 11. AC CHARACTERISTICS V = 0 V; V = −3.0 V to −5.5 V or V = 3.0 V to 5.5 V; V = 0 V (Note 20)  
CC  
EE  
CC  
EE  
−40°C  
25°C  
85°C  
Min  
Typ  
Max  
Min  
Typ  
Max  
Min  
Typ  
Max  
Symbol  
Characteristic  
Unit  
V
OPP  
Output Voltage Amplitude  
(See Figure 3)  
mV  
f
in  
< 3.5 GHz  
@ 4.0 GHz  
700  
740  
700  
710  
700  
600  
in  
f
640  
630  
500  
t
t
,
Propagation Delay to  
Output Differential  
10 Series  
ps  
PLH  
PHL  
CLK to Q, Q  
RESET to Q, Q  
RESET to Q, Q  
250  
220  
320  
330  
290  
400  
420  
390  
480  
270  
250  
320  
350  
300  
400  
450  
390  
480  
320  
320  
375  
400  
380  
450  
480  
460  
525  
100 Series  
t
t
t
Set/Reset Recovery  
Minimum Pulse width  
200  
550  
175  
475  
200  
550  
175  
475  
200  
550  
175  
475  
ps  
ps  
ps  
RR  
RESET  
PW  
CLOCK Random Jitter (RMS)  
f
JITTER  
< 3.5 GHz  
@ v4.0 GHz  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
in  
f
in  
1.5  
1.5  
1.5  
V
Input Voltage Swing  
(Differential Configuration)  
150  
50  
800  
1200  
150  
70  
800  
1200  
150  
70  
800  
1200  
mV  
ps  
PP  
t
r
t
f
Output Rise/Fall Times  
(20% − 80%)  
Q, Q  
100  
150  
120  
170  
130  
200  
NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit  
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared  
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit  
values are applied individually under normal operating conditions and not valid simultaneously.  
20.Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V − 2.0 V.  
CC  
http://onsemi.com  
6
 
MC10EP32, MC100EP32  
850  
800  
750  
700  
650  
600  
550  
500  
450  
400  
350  
300  
250  
200  
150  
100  
50  
5.0 V  
3.3 V  
0
0.0  
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
f , INPUT FREQUENCY (GHz)  
in  
Figure 3. Input Frequency (fin) versus Typical Output Voltage (VOPP  
)
Z = 50 W  
Q
Q
D
D
o
Receiver  
Device  
Driver  
Device  
Z = 50 W  
o
50 W  
50 W  
V
TT  
V
TT  
= V − 2.0 V  
CC  
Figure 4. Typical Termination for Output Driver and Device Evaluation  
(See Application Note AND8020/D − Termination of ECL Logic Devices.)  
ORDERING INFORMATION  
Device  
Package  
SOIC−8  
Shipping  
MC10EP32D  
98 Units / Rail  
98 Units / Rail  
MC10EP32DG  
MC10EP32DR2  
MC10EP32DT  
SOIC−8 (Pb−Free)  
SOIC−8  
2500 / Tape & Reel  
100 Units / Rail  
TSSOP−8  
TSSOP−8  
SOIC−8  
MC10EP32DTR2  
MC100EP32D  
2500 / Tape & Reel  
98 Units / Rail  
MC100EP32DR2  
MC100EP32DT  
MC100EP32DTR2  
SOIC−8  
2500 / Tape & Reel  
100 Units / Rail  
TSSOP−8  
TSSOP−8  
2500 / Tape & Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
http://onsemi.com  
7
MC10EP32, MC100EP32  
Resource Reference of Application Notes  
AN1405/D  
AN1406/D  
AN1503/D  
AN1504/D  
AN1568/D  
AN1642/D  
AND8001/D  
AND8002/D  
AND8020/D  
AND8066/D  
AND8090/D  
ECL Clock Distribution Techniques  
Designing with PECL (ECL at +5.0 V)  
ECLinPSt I/O SPiCE Modeling Kit  
Metastability and the ECLinPS Family  
Interfacing Between LVDS and ECL  
The ECL Translator Guide  
Odd Number Counters Design  
Marking and Date Codes  
Termination of ECL Logic Devices  
Interfacing with ECLinPS  
AC Characteristics of ECL Devices  
http://onsemi.com  
8
MC10EP32, MC100EP32  
PACKAGE DIMENSIONS  
SOIC−8 NB  
D SUFFIX  
PLASTIC SOIC PACKAGE  
CASE 751−07  
NOTES:  
ISSUE AB  
1. DIMENSIONING AND TOLERANCING PER  
ANSI Y14.5M, 1982.  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A AND B DO NOT INCLUDE  
MOLD PROTRUSION.  
−X−  
A
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)  
PER SIDE.  
8
5
4
5. DIMENSION D DOES NOT INCLUDE DAMBAR  
PROTRUSION. ALLOWABLE DAMBAR  
PROTRUSION SHALL BE 0.127 (0.005) TOTAL  
IN EXCESS OF THE D DIMENSION AT  
MAXIMUM MATERIAL CONDITION.  
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW  
STANDARD IS 751−07.  
S
M
M
B
0.25 (0.010)  
Y
1
K
−Y−  
G
MILLIMETERS  
DIM MIN MAX  
INCHES  
MIN  
MAX  
0.197  
0.157  
0.069  
0.020  
A
B
C
D
G
H
J
K
M
N
S
4.80  
3.80  
1.35  
0.33  
5.00 0.189  
4.00 0.150  
1.75 0.053  
0.51 0.013  
C
N X 45  
_
SEATING  
PLANE  
−Z−  
1.27 BSC  
0.050 BSC  
0.10 (0.004)  
0.10  
0.19  
0.40  
0
0.25 0.004  
0.25 0.007  
1.27 0.016  
0.010  
0.010  
0.050  
8
0.020  
0.244  
M
J
H
D
8
0
_
_
_
_
0.25  
5.80  
0.50 0.010  
6.20 0.228  
M
S
S
X
0.25 (0.010)  
Z
Y
SOLDERING FOOTPRINT*  
1.52  
0.060  
7.0  
0.275  
4.0  
0.155  
0.6  
0.024  
1.270  
0.050  
mm  
inches  
ǒ
Ǔ
SCALE 6:1  
*For additional information on our Pb−Free strategy and soldering  
details, please download the ON Semiconductor Soldering and  
Mounting Techniques Reference Manual, SOLDERRM/D.  
http://onsemi.com  
9
MC10EP32, MC100EP32  
PACKAGE DIMENSIONS  
TSSOP−8  
DT SUFFIX  
PLASTIC TSSOP PACKAGE  
CASE 948R−02  
ISSUE A  
8x K REF  
NOTES:  
1. DIMENSIONING AND TOLERANCING PER ANSI  
Y14.5M, 1982.  
M
S
S
V
0.10 (0.004)  
T
U
S
0.15 (0.006) T U  
2. CONTROLLING DIMENSION: MILLIMETER.  
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.  
PROTRUSIONS OR GATE BURRS. MOLD FLASH  
OR GATE BURRS SHALL NOT EXCEED 0.15  
(0.006) PER SIDE.  
4. DIMENSION B DOES NOT INCLUDE INTERLEAD  
FLASH OR PROTRUSION. INTERLEAD FLASH OR  
PROTRUSION SHALL NOT EXCEED 0.25 (0.010)  
PER SIDE.  
2X L/2  
8
5
4
0.25 (0.010)  
B
−U−  
L
1
M
PIN 1  
IDENT  
5. TERMINAL NUMBERS ARE SHOWN FOR  
REFERENCE ONLY.  
6. DIMENSION A AND B ARE TO BE DETERMINED  
AT DATUM PLANE −W−.  
S
0.15 (0.006) T U  
A
−V−  
F
DETAIL E  
MILLIMETERS  
INCHES  
MIN  
DIM MIN  
MAX  
3.10  
3.10  
MAX  
0.122  
0.122  
0.043  
0.006  
0.028  
A
B
C
D
F
2.90  
2.90  
0.80  
0.05  
0.40  
0.114  
0.114  
C
1.10 0.031  
0.15 0.002  
0.70 0.016  
0.10 (0.004)  
−W−  
SEATING  
PLANE  
D
−T−  
G
G
K
L
0.65 BSC  
0.026 BSC  
0.25  
0.40 0.010  
0.016  
4.90 BSC  
0.193 BSC  
0
DETAIL E  
M
0
6
6
_
_
_
_
ECLinPS is a trademark of Semiconductor Components Industries, LLC (SCILLC).  
ON Semiconductor and  
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice  
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All  
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights  
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications  
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer  
purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,  
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal  
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.  
PUBLICATION ORDERING INFORMATION  
LITERATURE FULFILLMENT:  
N. American Technical Support: 800−282−9855 Toll Free  
USA/Canada  
ON Semiconductor Website: http://onsemi.com  
Order Literature: http://www.onsemi.com/litorder  
Literature Distribution Center for ON Semiconductor  
P.O. Box 5163, Denver, Colorado 80217 USA  
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada  
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada  
Email: orderlit@onsemi.com  
Japan: ON Semiconductor, Japan Customer Focus Center  
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051  
Phone: 81−3−5773−3850  
For additional information, please contact your  
local Sales Representative.  
MC10EP32/D  

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