FDMS8350LET40 [ONSEMI]

N 沟道,PowerTrench® MOSFET,40V,300A,0.85mΩ;
FDMS8350LET40
型号: FDMS8350LET40
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,40V,300A,0.85mΩ

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FDMS8350LET40  
MOSFET N‐Channel  
POWERTRENCH)  
40 V, 300 A, 0.85 mW  
General Description  
www.onsemi.com  
This N-Channel MV MOSFET is produced using  
ON Semiconductor’s advanced POWERTRENCH process that has  
been especially tailored to minimize the onstate resistance and yet  
maintain superior switching performance.  
V
R
MAX  
I MAX  
D
DS  
DS(ON)  
40 V  
0.85 mW @ 10 V  
1.2 mW @ 4.5 V  
47 A  
Features  
Max R  
Max R  
= 0.85 mW at V = 10 V, I = 47 A  
GS D  
= 1.2 mW at V = 4.5 V, I = 38 A  
DS(on)  
DS(on)  
GS  
D
S
Advanced Package and Silicon combination for Low r  
High Efficiency  
and  
DS(on)  
MSL1 Robust Package Design  
100% UIL Tested  
These Devices are PbFree and are RoHS Compliant  
G
Applications  
D
Primary DCDC MOSFET  
Secondary Synchronous Rectifier  
Load Switch  
N-CHANNEL MOSFET  
Top  
Bottom  
S
Pin 1  
Pin 1  
S
S
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
G
A
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current:  
Value  
40  
Unit  
V
D
D
V
DS  
V
GS  
D
D
PQFN8 5X6,  
1.27P  
CASE 483AG  
20  
V
I
D
300  
A
Continuous (T = 25°C) (Note 5)  
C
Continuous T = 100°C (Note 5)  
C
MARKING DIAGRAM  
Continuous, T = 25°C (Note 1a)  
212  
A
Pulsed (Note 4)  
49  
1464  
S
S
D
D
$Y&Z&3&K  
FDMS  
8350LET  
E
AS  
Single Pulse Avalanche Energy  
(Note 3)  
1176  
mJ  
W
S
D
D
G
P
D
Power Dissipation:  
T
A
= 25°C  
125  
3.33  
C
T = 25°C (Note 1a)  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
T , T  
Operating and Storage Junction  
Temperature Range  
55 to +175  
°C  
J
STG  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
FDMS8350LET40 = Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 3 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2017  
1
Publication Order Number:  
June, 2019 Rev. 2  
FDMS8350LET40/D  
FDMS8350LET40  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Value  
1.2  
Unit  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient (Note 1a)  
°C/W  
R
q
JC  
JA  
R
45  
q
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
I
I
= 250 mA, V = 0 V  
40  
V
DSS  
D
GS  
DBV  
Breakdown Voltage Temperature  
Coefficient  
= 250 mA, referenced to 25°C  
17  
mV/°C  
DSS  
D
/DT  
J
DSS  
GSS  
I
Zero Gate Voltage Drain Current  
Gate to Source Leakage Current  
V
V
= 32 V, V = 0 V  
1
mA  
DS  
GS  
I
=
20 V, V = 0 V  
100  
nA  
GS  
DS  
ON CHARACTERISTICS  
V
Gate to Source Threshold Voltage  
V
I
= V , I = 250 mA  
1.0  
1.8  
3.0  
V
GS(th)  
GS  
DS  
D
DV  
/DT  
Gate to Source Threshold Voltage  
Temperature Coefficient  
= 250 mA, referenced to 25°C  
6  
mV/°C  
GS(th)  
J
D
r
Static Drain to Source On Resistance  
Forward Transconductance  
V
GS  
V
GS  
V
GS  
V
DS  
= 10 V, I = 47 A  
0.68  
0.96  
1.1  
0.85  
1.2  
mW  
DS(on)  
D
= 4.5 V, I = 38 A  
D
= 10 V, I = 47 A, T = 150°C  
1.4  
D
J
g
FS  
= 5 V, I = 47 A  
247  
S
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
DS  
= 20 V, V = 0 V, f = 1 MHz  
11850  
3430  
69  
16590  
4805  
100  
pF  
pF  
pF  
W
iss  
GS  
C
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
oss  
C
rss  
R
0.1  
1.2  
2.4  
g
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Rise Time  
V
= 20 V, I = 47 A, V = 10 V,  
GEN  
32  
19  
74  
15  
156  
73  
33  
16  
51  
34  
ns  
ns  
d(on)  
DD  
D
GS  
R
= 6 W  
t
r
t
Turn-Off Delay Time  
Fall Time  
118  
27  
ns  
d(off)  
t
f
ns  
Q
Total Gate Charge  
V
GS  
V
GS  
V
DD  
V
DD  
= 0 V to 10 V  
= 0 V to 4.5 V  
219  
102  
nC  
nC  
nC  
nC  
g
Q
Gate to Source Charge  
= 20 V, I = 47 A  
D
gs  
Q
Gate to Drain “Miller” Charge  
= 20 V, I = 47 A  
D
gd  
www.onsemi.com  
2
FDMS8350LET40  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAIN-SOURCE DIODE CHARACTERISTICS  
V
Source to Drain Diode Forward Voltage  
V
V
= 0 V, I = 2.1 A (Note 2)  
0.7  
0.8  
81  
1.2  
1.3  
V
SD  
GS  
S
= 0 V, I = 47 A (Note 2)  
GS  
S
t
Reverse Recovery Time  
I = 47 A, di/dt = 100 A/ms  
F
129  
131  
ns  
rr  
Q
Reverse Recovery Charge  
82  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 × 1.5 in. board of FR4 material. R  
is guaranteed  
JC  
q
q
JA  
by design while R  
is determined by the user’s board design.  
q
CA  
NOTES:  
a) 45°C/W when mounted on  
b) 115°C/W when mounted on  
a minimum pad of 2 oz copper.  
2
a 1 in pad of 2 oz copper.  
2. Pulse Test: Pulse Width < 300 ms, Duty cycle < 2.0%.  
3. E of 1176 mJ is based on starting T = 25°C; L = 3 mH, I = 28 A, V = 40 V, V = 10 V. 100% test at L = 0.1 mH, I = 87 A.  
AS  
J
AS  
DD  
GS  
AS  
4. Pulsed Id please refer to Fig 11 SOA graph for more details.  
5. Computed continuous current limited to Max Junction Temperature only, actual continuous current will be limited by thermal &  
electromechanical application board design.  
ORDERING INFORMATION  
Device  
Marking  
Package  
Reel Size  
Tape Width  
Quantity  
FDMS8350LET40  
FDMS8350LET  
Power 56  
13″  
12 mm  
3000 units  
www.onsemi.com  
3
 
FDMS8350LET40  
TYPICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
J
320  
240  
160  
80  
15  
VGS = 10 V  
GS = 4.5 V  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
VGS = 3 V  
V
12  
9
VGS = 3.5 V  
V
GS = 3.5 V  
VGS = 4 V  
PULSE DURATION = 80 ms  
DUTY CYCLE = 0.5% MAX  
6
VGS = 10 V  
VGS = 3 V  
3
VGS = 4.5 V  
VGS = 4 V  
0
0.0  
0
0.5  
1.0  
1.5  
2.0  
2.5  
3.0  
0
80  
160  
240  
320  
V
DS, DRAIN TO SOURCE VOLTAGE (V)  
ID, DRAIN CURRENT (A)  
Figure 1. OnRegion Characteristics  
Figure 6. Normalized OnResistance vs Drain  
Current and Gate Voltage  
1.8  
1.7  
1.6  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
20  
ID = 47 A  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
VGS = 10 V  
15  
ID = 47 A  
10  
5
TJ = 150 o  
C
TJ = 25 o  
C
0
75 50 25  
0
25 50 75 100 125 150 175  
0
2
4
6
8
10  
TJ, JUNCTION TEMPERATUREo(C)  
V
GS, GATE TO SOURCE VOLTAGE (V)  
Figure 2. Normalized OnResistance vs Junction  
Figure 3. OnResistance vs Gate to Source  
Temperature  
Voltage  
320  
320  
VGS = 0 V  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5% MAX  
100  
240  
TJ = 175 o  
C
10  
1
VDS = 5 V  
TJ = 175 o  
C
TJ = 25 o  
C
160  
80  
0
TJ = 25 o  
C
TJ = 55oC  
0.1  
TJ = 55oC  
0.01  
0.001  
012345  
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 4. Transfer Characteristics  
Figure 5. Source to Drain Diode Forward Voltage  
vs Source Current  
www.onsemi.com  
4
FDMS8350LET40  
TYPICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
J
10  
8
100000  
10000  
ID = 47 A  
Ciss  
VDD = 15 V  
VDD = 20 V  
6
Coss  
1000  
100  
10  
VDD = 25 V  
4
2
Crss  
f = 1 MHz  
GS = 0 V  
V
0
0
34  
68  
102  
136  
170  
0.1  
1
10  
40  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Qg , GATE CHARGE (nC)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs Drain to Source Voltage  
320  
200  
100  
10  
1
240  
TJ = 25 o  
C
V
GS = 10 V  
TJ = 125 o  
C
160  
80  
0
VGS = 4.5 V  
TJ = 150 o  
C
R
qJC = 1.2 oC/W  
0.001 0.01 0.1  
1
10  
100 1000 10000  
25  
50  
75  
100  
125  
150  
175  
TC, CASE TEMPERATURE (oC)  
tAV , TIME IN AVALANCHE (ms)  
Figure 9. Unclamped Inductive Switching  
Capability  
Figure 10. Maximum Continuous Drain Current vs  
Case Temperature  
6000  
50000  
THIS AREA IS  
LIMITED BY r DS(on)  
1000  
10000  
10 ms  
100  
SINGLE PULSE  
qJC = 1.2oC/W  
C = 25 oC  
R
100 ms  
10  
T
1000  
1 ms  
SINGLE PULSE  
TJ = MAX RATED  
10 ms  
1
R
qJC = 1.2oC/W  
100 ms/ DC  
CURVE BENT TO  
MEASURED DATA  
T
C = 25oC  
0.1  
0.01  
100  
105  
104  
103  
t, PULSE WIDTH (sec)  
102  
101  
1
0.1  
1
10  
100 500  
VDS, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe Operating Area  
Figure 12. Single Pulse Maximum Power  
Dissipation  
www.onsemi.com  
5
FDMS8350LET40  
TYPICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
J
2
1
DUTY CYCLEDESCENDING ORDER  
D = 0.5  
0.2  
0.1  
P
DM  
0.1  
0.01  
0.05  
0.02  
0.01  
t
1
t
2
NOTES:  
Z
(t) = r(t) x R  
o
qJC  
qJC  
SINGLE PULSE  
R
= 1.2 C/W  
qJC  
Peak T = P  
x Z (t) + T  
J
DM  
qJC C  
Duty Cycle, D = t / t  
1
2
0.001  
105  
104  
103  
102  
101  
1
t, RECTANGULAR PULSE DURATION (sec)  
Figure 13. JunctiontoCase Transient Thermal Response Curve  
www.onsemi.com  
6
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PQFN8 5X6, 1.27P  
CASE 483AG  
ISSUE A  
DATE 25 JUN 2021  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13657G  
PQFN8 5X6, 1.27P  
PAGE 1 OF 1  
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ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding  
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© Semiconductor Components Industries, LLC, 2019  
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