FDMS8460 [ONSEMI]

N 沟道,Power Trench® MOSFET,40V,49A,2.2mΩ;
FDMS8460
型号: FDMS8460
厂家: ONSEMI    ONSEMI
描述:

N 沟道,Power Trench® MOSFET,40V,49A,2.2mΩ

PC 开关 脉冲 光电二极管 晶体管
文件: 总7页 (文件大小:492K)
中文:  中文翻译
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MOSFET - N‐Channel,  
POWERTRENCH)  
40 V, 49 A, 2.2 mW  
FDMS8460  
General Description  
This NChannel MOSFET is produced using ON Semiconductor’s  
advanced POWERTRENCH process that has been especially  
www.onsemi.com  
®
tailored to minimize the onstate resistance and yet maintain superior  
switching performance.  
S
D
D
D
Features  
S
S
G
Max r  
Max r  
= 2.2 mW at V = 10 V, I = 25 A  
GS D  
DS(on)  
DS(on)  
= 3.0 mW at V = 4.5 V, I = 21.7 A  
GS  
D
Advanced Package and Silicon combination for low r  
MSL1 robust package design  
100% UIL tested  
DS(on)  
D
N-Channel MOSFET  
RoHS Compliant  
Applications  
DCDC Conversion  
Pin 1  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Top  
Bottom  
Power 56  
(PQFN8)  
CASE 483AE  
Symbol  
Parameter  
Drain to Source Voltage  
Gate to Source Voltage  
Drain Current:  
Value  
Unit  
V
V
DS  
V
GS  
40  
20  
V
I
D
A
MARKING DIAGRAM  
Continuous (Package limited) T = 25°C  
49  
167  
25  
C
Continuous (Silicon limited) T = 25°C  
C
Continuous T = 25°C (Note 1a)  
A
S
S
D
Pulsed  
160  
$Y&Z&3&K  
FDMS  
8460  
D
D
D
E
Single Pulse Avalanche Energy (Note 3)  
Power Dissipation:  
864  
mJ  
W
AS  
S
P
D
T
= 25°C  
104  
2.5  
C
G
T = 25°C (Note 1a)  
A
T , T  
Operating and Storage Junction Tempera-  
ture Range  
55 to  
°C  
J
STG  
$Y  
&Z  
&3  
&K  
= ON Semiconductor Logo  
= Assembly Plant Code  
= Data Code (Year & Week)  
= Lot  
+150  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
FDMS8460  
= Specific Device Code  
ORDERING INFORMATION  
See detailed ordering and shipping information on page 2 of  
this data sheet.  
© Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2020 Rev. 5  
FDMS8460/D  
FDMS8460  
PACKAGE MARKING AND ORDERING INFORMATION  
Device Marking  
Device  
Package  
Quantity  
FDMS8460  
FDMS8460  
Power 56 (PQFN8)  
(Pb-Free / Halogen Free)  
3000/Tape&Reel  
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging  
Specifications Brochure, BRD8011/D.  
THERMAL CHARACTERISTICS  
Symbol  
Parameter  
Thermal Resistance, Junction to Case  
Thermal Resistance, Junction to Ambient (Note 1a)  
Value  
1.2  
Unit  
°C/W  
R
q
JC  
R
50  
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
BV  
Drain to Source Breakdown Voltage  
I
I
= 250 mA, V = 0 V  
40  
V
DSS  
D
GS  
DBV  
Breakdown Voltage Temperature  
Coefficient  
= 250 mA, referenced to 25°C  
32  
mV/°C  
DSS  
D
/DT  
J
DSS  
GSS  
I
Zero Gate Voltage Drain Current  
V
V
= 32 V, V = 0 V  
1
mA  
DS  
GS  
I
Gate to Source Leakage Current, Forward  
=
20 V, V = 0 V  
100  
nA  
GS  
DS  
ON CHARACTERISTICS  
V
Gate to Source Threshold Voltage  
V
I
= V , I = 250 mA  
1.0  
1.9  
3.0  
V
GS(th)  
GS  
DS  
D
DV  
/DT  
Gate to Source Threshold Voltage  
Temperature Coefficient  
= 250 mA, referenced to 25°C  
7.5  
mV/°C  
GS(th)  
J
D
r
Static Drain to Source On Resistance  
Forward Transconductance  
V
GS  
V
GS  
V
GS  
V
DS  
= 10 V, I = 25 A  
2.0  
2.6  
2.6  
137  
2.2  
3.0  
3.3  
mW  
DS(on)  
D
= 4.5 V, I = 21.7 A  
D
= 10 V, I = 25 A, T = 125°C  
D
J
g
FS  
= 5 V, I = 25 A  
S
D
DYNAMIC CHARACTERISTICS  
C
Input Capacitance  
V
= 20 V, V = 0 V, f = 1 MHz  
5415  
1470  
170  
7205  
1955  
250  
pF  
pF  
pF  
W
iss  
DS  
GS  
C
Output Capacitance  
Reverse Transfer Capacitance  
Gate Resistance  
oss  
C
rss  
R
f = 1MHz  
0.1  
1.4  
3.1  
g
SWITCHING CHARACTERISTICS  
t
Turn-On Delay Time  
Rise Time  
V
= 20 V, I = 25 A, V = 10 V,  
GEN  
19  
9
35  
19  
ns  
ns  
ns  
ns  
nC  
d(on)  
DD  
D
GS  
R
= 6 W  
t
r
t
Turn-Off Delay Time  
Fall Time  
48  
7
78  
d(off)  
t
f
14  
Q
Total Gate Charge  
V
= 0 V to 10 V, V = 20 V,  
78  
110  
g
GS  
GS  
DD  
DD  
I
D
= 25 A  
V
= 0 V to 4.5 V, V = 20 V,  
36  
51  
nC  
DD  
I
D
= 25 A  
Q
Gate to Source Charge  
V
= 20 V, I = 25 A  
15  
10  
nC  
nC  
gs  
D
Q
Gate to Drain “Miller” Charge  
gd  
www.onsemi.com  
2
FDMS8460  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (continued)  
J
Symbol  
Parameter  
Test Condition  
Min  
Typ  
Max  
Unit  
DRAIN-SOURCE DIODE CHARACTERISTICS  
V
Source to Drain Diode Forward Voltage  
V
V
= 0 V, I = 25 A (Note 2)  
0.8  
0.7  
53  
1.3  
1.2  
85  
V
SD  
GS  
S
= 0 V, I = 2.1 A (Note 2)  
GS  
S
t
Reverse Recovery Time  
I = 25 A, di/dt = 100 A/ms  
F
ns  
rr  
Q
Reverse Recovery Charge  
40  
64  
nC  
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
2
1. R  
is determined with the device mounted on a 1 in pad 2 oz copper pad on a 1.5 × 1.5 in. board of FR4 material. R  
is determined  
CA  
q
q
JA  
by the user’s board design.  
NOTES:  
a. 50 °C/W when mounted on a  
1 in pad of 2 oz copper.  
b. 125 °C/W when mounted on a  
minimum pad of 2 oz copper.  
2
2. Pulse Test: Pulse Width < 300 ms, Duty cycle < 2.0%.  
3. Starting T = 25°C, L = 0.3 mH, I = 24 A, V = 40 V, V = 10 V  
J
AS  
DD  
GS  
TYPICAL CHARACTERISTICS  
(T = 25°C unless otherwise noted)  
J
160  
120  
80  
40  
0
5
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5%MAX  
VGS = 4V  
VGS = 3V  
VGS = 3.5V  
PULSE DURATION = 80ms  
4
3
2
VGS = 3.5V  
VGS = 4.5V  
VGS = 10V  
DUTY CYCLE = 0.5%MAX  
VGS = 4V  
VGS =4.5V  
VGS =10V  
1
VGS = 3V  
0.5  
0
1
2
, DRAIN TO SOURCE VOLTAGE (V)  
3
0
40  
80  
120  
160  
V
I
, DRAIN CURRENT (A)  
D
DS  
Figure 1. On Region Characteristics  
Figure 2. Normalized OnResistance  
vs. Drain Current and Gate Voltage  
www.onsemi.com  
3
 
FDMS8460  
TYPICAL CHARACTERISTICS (continued)  
(T = 25°C unless otherwise noted)  
J
1.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
10  
8
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5%MAX  
ID = 25A  
GS = 10V  
ID = 25A  
V
6
TJ = 125oC  
4
2
TJ = 25oC  
0
75 50 25  
0
25 50 75 100 125 150  
2
4
6
8
10  
T , JUNCTION TEMPERATURE (5C)  
J
V , GATE TO SOURCE VOLTAGE (V)  
GS  
Figure 3. Normalized On Resistance  
vs. Junction Temperature  
Figure 4. OnResistance vs. Gate  
to Source Voltage  
160  
120  
80  
40  
0
800  
100  
PULSE DURATION = 80ms  
DUTY CYCLE = 0.5%MAX  
VGS = 0V  
VDS = 5V  
TJ = 150oC  
10  
1
TJ = 150 oC  
TJ = 25oC  
TJ = 25oC  
0.1  
o
TJ = 55 C  
0.01  
1E3  
oC  
4
TJ = 55  
0
1
GS  
2
3
5
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
V
, GATE TO SOURCE VOLTAGE (V)  
V
, BODY DIODE FORWARD VOLTAGE (V)  
SD  
Figure 5. Transfer Characteristics  
Figure 6. Source to Drain Diode  
Forward Voltage vs. Source Current  
10  
8
10000  
ID = 25A  
VDD = 15V  
Ciss  
VDD = 20V  
1000  
6
Coss  
VDD = 25V  
4
100  
30  
2
Crss  
f = 1MHz  
VGS = 0V  
0
40  
0
20  
40  
60  
80  
0.1  
1
10  
Q , GATE CHARGE (nC)  
g
V
DS  
, DRAIN TO SOURCE VOLTAGE (V)  
Figure 7. Gate Charge Characteristics  
Figure 8. Capacitance vs. Drain  
to Source Voltage  
www.onsemi.com  
4
FDMS8460  
TYPICAL CHARACTERISTICS (continued)  
(T = 25°C unless otherwise noted)  
J
200  
150  
40  
10  
TJ = 25oC  
VGS = 10V  
100  
50  
0
VGS = 4.5V  
TJ = 125oC  
Limited by Package  
R
sJC = 1.2oC/W  
1
0.01  
0.1  
t
1
10  
100  
1000  
25  
50  
75  
100  
125  
150  
o
, TIME IN AVALANCHE (ms)  
, CASE TEMPERATURE (  
T
C)  
AV  
c
Figure 9. Unclamped Inductive  
Switching Capability  
Figure 10. Maximum Continuous Drain  
Current vs. Case Temperature  
1000  
100  
10  
400  
100  
VGS = 10V  
SINGLE PULSE  
R
TA = 25oC  
s JA = 125oC/W  
1ms  
10  
1
10ms  
100ms  
1s  
THIS AREA IS  
LIMITED BY r  
DS(on)  
SINGLE PULSE  
TJ = MAX RATED  
0.1  
0.01  
R
s JA = 125oC/W  
10s  
DC  
1
TA = 25oC  
0.5  
103  
102  
101  
t, PULSE WIDTH (sec)  
1
10  
0.01  
0.1  
1
10  
100 200  
100  
1000  
V
DS  
, DRAIN to SOURCE VOLTAGE (V)  
Figure 11. Forward Bias Safe  
Operating Area  
Figure 12. Single Pulse Maximum  
Power Dissipation  
2
1
DUTY CYCLEDESCENDING ORDER  
D = 0.5  
0.2  
0.1  
0.05  
0.02  
0.01  
0.1  
0.01  
1E3  
P
DM  
t
1
t
2
SINGLE PULSE  
s JA = 125oC/W  
NOTES:  
DUTY FACTOR: D = t /t  
1
2
R
PEAK T = P x Z  
x R  
+ T  
sJA A  
J
DM  
sJA  
103  
102  
101  
t, RECTANGULAR PULSE DURATION (sec)  
1
10  
100  
1000  
Figure 13. Transient Thermal Response Curve  
POWERTRENCH is registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and or other  
countries.  
www.onsemi.com  
5
MECHANICAL CASE OUTLINE  
PACKAGE DIMENSIONS  
PQFN8 5X6, 1.27P  
CASE 483AE  
ISSUE C  
DATE 21 JAN 2022  
Electronic versions are uncontrolled except when accessed directly from the Document Repository.  
Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.  
DOCUMENT NUMBER:  
DESCRIPTION:  
98AON13655G  
PQFN8 5X6, 1.27P  
PAGE 1 OF 1  
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