FDBL86563-F085 [ONSEMI]

N 沟道,PowerTrench® MOSFET,60V,240A,1.5mΩ;
FDBL86563-F085
型号: FDBL86563-F085
厂家: ONSEMI    ONSEMI
描述:

N 沟道,PowerTrench® MOSFET,60V,240A,1.5mΩ

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FDBL86563-F085  
®
N-Channel PowerTrench MOSFET  
60 V, 240 A, 1.5 mΩ  
Features  
D
„ Typical R  
= 1.1 mΩ at V = 10V, I = 80 A  
GS D  
DS(on)  
„ Typical Q  
= 130 nC at V = 10V, I = 80 A  
g(tot)  
GS  
D
„ UIS Capability  
„ RoHS Compliant  
„ Qualified to AEC Q101  
G
Applications  
S
„ Automotive Engine Control  
„ PowerTrain Management  
„ Solenoid and Motor Drivers  
„ Integrated Starter/Alternator  
„ Primary Switch for 12V Systems  
MOSFET Maximum Ratings TJ = 25°C unless otherwise noted.  
Symbol  
VDSS  
Parameter  
Ratings  
60  
Units  
Drain-to-Source Voltage  
Gate-to-Source Voltage  
V
V
VGS  
±20  
Drain Current - Continuous (VGS=10) (Note 1)  
Pulsed Drain Current  
TC = 25°C  
TC = 25°C  
240  
ID  
A
See Figure 4  
614  
EAS  
PD  
Single Pulse Avalanche Energy  
(Note 2)  
(Note 3)  
mJ  
W
W/oC  
oC  
oC/W  
oC/W  
Power Dissipation  
Derate Above 25oC  
357  
2.38  
TJ, TSTG Operating and Storage Temperature  
-55 to + 175  
0.42  
RθJC  
RθJA  
Thermal Resistance, Junction to Case  
Maximum Thermal Resistance, Junction to Ambient  
43  
Notes:  
1: Current is limited by silicon.  
2: Starting T = 25°C, L = 0.3mH, I = 64A, V = 60V during inductor charging and V = 0V during time in avalanche.  
J
AS  
DD  
DD  
3: R  
is the sum of the junction-to-case and case-to-ambient thermal resistance, where the case thermal reference is defined as the solder  
θJA  
mounting surface of the drain pins.  
presented here is based on mounting on a 1 in pad of 2oz copper.  
R
is guaranteed by design, while R is determined by the board design. The maximum rating  
θJC θJA  
2
Package Marking and Ordering Information  
Device Marking  
Device  
Package  
Reel Size  
Tape Width  
Quantity  
FDBL86563  
FDBL86563-F085  
MO-299A  
13"  
24mm  
2000 units  
1
Publication Order Number:  
FDBL86563-F085/D  
©2015 Semiconductor Components Industries, LLC.  
August-2017, Rev. 2  
Electrical Characteristics TJ = 25°C unless otherwise noted.  
Symbol  
Parameter  
Test Conditions  
Min.  
Typ.  
Max.  
Units  
Off Characteristics  
BVDSS  
IDSS  
Drain-to-Source Breakdown Voltage  
Drain-to-Source Leakage Current  
Gate-to-Source Leakage Current  
ID = 250μA, VGS = 0V  
60  
-
-
-
-
-
-
1
V
V
DS= 6 0 V , T J = 25oC  
μA  
mA  
nA  
VGS = 0V  
TJ = 175oC (Note 4)  
-
1
IGSS  
VGS = ±20V  
-
±100  
On Characteristics  
VGS(th)  
RDS(on)  
Gate to Source Threshold Voltage  
Drain to Source On Resistance  
VGS = VDS, ID = 250μA  
2.0  
2.9  
1.1  
2.1  
4.0  
1.5  
2.9  
V
TJ = 25oC  
-
-
mΩ  
mΩ  
ID = 80A,  
TJ = 175oC (Note 4)  
V
GS= 10V  
Dynamic Characteristics  
Ciss  
Input Capacitance  
-
-
-
-
-
-
-
-
10300  
2590  
270  
4.3  
-
pF  
pF  
pF  
Ω
V
DS = 30V, VGS = 0V,  
Coss  
Crss  
Rg  
Output Capacitance  
-
f = 1MHz  
Reverse Transfer Capacitance  
Gate Resistance  
-
f = 1MHz  
-
Qg(ToT)  
Qg(th)  
Qgs  
Total Gate Charge at 10V  
Threshold Gate Charge  
Gate-to-Source Gate Charge  
Gate-to-Drain “Miller“ Charge  
VGS = 0 to 10V  
VGS = 0 to 2V  
130  
19  
169  
nC  
nC  
nC  
nC  
VDD = 48V  
ID = 80A  
-
-
-
48  
Qgd  
20  
Switching Characteristics  
ton  
td(on)  
tr  
Turn-On Time  
Turn-On Delay  
Rise Time  
-
-
-
-
-
-
-
160  
ns  
ns  
ns  
ns  
ns  
ns  
30  
77  
78  
57  
-
-
-
V
DD = 30V, ID = 80A,  
VGS = 10V, RGEN = 6Ω  
td(off)  
tf  
Turn-Off Delay  
Fall Time  
-
-
toff  
Turn-Off Time  
200  
Drain-Source Diode Characteristics  
I
SD =80A, VGS = 0V  
-
-
-
-
-
-
1.25  
1.2  
V
VSD  
Source-to-Drain Diode Voltage  
ISD = 40A, VGS = 0V  
V
trr  
Reverse-Recovery Time  
94  
131  
140  
200  
ns  
nC  
IF = 80A, dISD/dt = 100A/μs,  
VDD=48V  
Qrr  
Reverse-Recovery Charge  
Note:  
4: The maximum value is specified by design at T = 175°C. Product is not tested to this condition in production.  
J
www.onsemi.com  
2
Typical Characteristics  
400  
350  
300  
250  
200  
150  
100  
50  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
VGS = 10V  
CURRENT LIMITED  
BY SILICON  
0
0
25  
50  
75  
100  
125  
150  
175  
25  
50  
75  
100  
125  
150  
175  
200  
TC, CASE TEMPERATURE(oC)  
TC, CASE TEMPERATURE(oC)  
Figure 2. Maximum Continuous Drain Current vs.  
Case Temperature  
Figure 1. Normalized Power Dissipation vs. Case  
Temperature  
2
DUTY CYCLE - DESCENDING ORDER  
1
D = 0.50  
0.20  
P
DM  
0.10  
0.05  
0.02  
0.01  
t
1
0.1  
t
2
NOTES:  
DUTY FACTOR: D = t /t  
SINGLE PULSE  
1
2
PEAK T = P  
x Z  
x R  
+ T  
J
DM  
θJA  
θJA C  
0.01  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 3. Normalized Maximum Transient Thermal Impedance  
10000  
TC = 25oC  
VGS = 10V  
FOR TEMPERATURES  
ABOVE 25oC DERATE PEAK  
CURRENT AS FOLLOWS:  
1000  
100  
10  
175 - TC  
I = I2  
150  
SINGLE PULSE  
10-5  
10-4  
10-3  
10-2  
10-1  
100  
101  
t, RECTANGULAR PULSE DURATION(s)  
Figure 4. Peak Current Capability  
www.onsemi.com  
3
Typical Characteristics  
2000  
1000  
1000  
100  
If R = 0  
= (L)(I )/(1.3*RATED BV  
t
AV  
- V  
)
AS  
DSS  
DD  
If R  
0  
t
AV  
= (L/R)ln[(I *R)/(1.3*RATED BV  
- V ) +1]  
AS  
DSS DD  
100  
10  
1
100us  
10  
1
OPERATION IN THIS  
AREA MAY BE  
LIMITED BY r  
DS(on)  
STARTING TJ = 25oC  
1ms  
STARTING TJ = 150oC  
SINGLE PULSE  
10ms  
100ms  
T
J
= MAX RATED  
o
T
C
= 25  
C
0.1  
0.1  
0.001 0.01  
0.1  
1
10  
100 1000 10000  
1
10  
100 200  
tAV, TIME IN AVALANCHE (ms)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
NOTE: Refer to ON Semiconductor Application Notes AN7514  
and AN7515  
Figure 5. Forward Bias Safe Operating Area  
Figure 6. Unclamped Inductive Switching  
Capability  
350  
350  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
VGS = 0 V  
100  
300  
VDD = 5V  
250  
200  
TJ = 175 o  
C
TJ = 25oC  
10  
1
TJ = 25 o  
C
150  
100  
TJ = 175oC  
TJ = -55oC  
50  
0
0.1  
2
3
4
5
6
7
8
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
VGS, GATE TO SOURCE VOLTAGE (V)  
VSD, BODY DIODE FORWARD VOLTAGE (V)  
Figure 7. Transfer Characteristics  
Figure 8. Forward Diode Characteristics  
350  
350  
VGS  
VGS  
15V Top  
10V  
8V  
7V  
6V  
5.5V  
5V Bottom  
15V Top  
10V  
8V  
7V  
6V  
300  
250  
200  
150  
100  
50  
300  
250  
5.5V  
5V Bottom  
200  
150  
80μs PULSE WIDTH  
Tj=25oC  
100  
50  
0
80μs PULSE WIDTH  
Tj=175oC  
0
0
1
2
3
4
5
0
1
2
3
4
5
VDS, DRAIN TO SOURCE VOLTAGE (V)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 9. Saturation Characteristics  
Figure 10. Saturation Characteristics  
www.onsemi.com  
4
Typical Characteristics  
50  
2.4  
2.0  
1.6  
1.2  
0.8  
0.4  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
ID = 80A  
PULSE DURATION = 80μs  
DUTY CYCLE = 0.5% MAX  
40  
30  
20  
10  
0
TJ = 25oC  
TJ = 175oC  
ID = 80A  
VGS = 10V  
2
4
6
8
10  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE(oC)  
VGS, GATE TO SOURCE VOLTAGE (V)  
Figure 11. RDSON vs. Gate Voltage  
Figure 12. Normalized RDSON vs. Junction  
Temperature  
1.5  
1.10  
VGS = VDS  
ID = 5mA  
I
D
= 250μA  
1.2  
0.9  
0.6  
0.3  
0.0  
1.05  
1.00  
0.95  
0.90  
-80  
-40  
0
40  
80  
120  
160  
200  
-80  
-40  
0
40  
80  
120  
160  
200  
TJ, JUNCTION TEMPERATURE (oC)  
TJ, JUNCTION TEMPERATURE(oC)  
Figure 13. Normalized Gate Threshold Voltage vs.  
Temperature  
Figure 14. Normalized Drain to Source  
Breakdown Voltage vs. Junction Temperature  
100000  
10  
ID = 80A  
VDD = 30V  
Ciss  
8
10000  
VDD =24V  
VDD = 36V  
6
4
2
0
1000  
100  
10  
Coss  
Crss  
f = 1MHz  
GS = 0V  
V
0.1  
1
10  
100  
0
30  
60  
90  
120  
150  
Qg, GATE CHARGE(nC)  
VDS, DRAIN TO SOURCE VOLTAGE (V)  
Figure 15. Capacitance vs. Drain to Source  
Voltage  
Figure 16. Gate Charge vs. Gate to Source  
Voltage  
www.onsemi.com  
5
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coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.  
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability  
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.  
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,  
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or  
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer  
application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not  
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification  
in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized  
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and  
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such  
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This  
literature is subject to all applicable copyright laws and is not for resale in any manner.  
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