BUH150G [ONSEMI]
SWITCHMODE NPN Silicon Planar Power Transistor; 开关模式? NPN硅平面功率晶体管型号: | BUH150G |
厂家: | ONSEMI |
描述: | SWITCHMODE NPN Silicon Planar Power Transistor |
文件: | 总10页 (文件大小:234K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
BUH150G
SWITCHMODEt NPN
Silicon Planar Power
Transistor
The BUH150G has an application specific state−of−art die designed
for use in 150 Watts Halogen electronic transformers.
This power transistor is specifically designed to sustain the large
inrush current during either the startup conditions or under a short
circuit across the load.
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POWER TRANSISTOR
15 AMPERES
700 VOLTS, 150 WATTS
Features
• Improved Efficiency Due to the Low Base Drive Requirements:
High and Flat DC Current Gain h
Fast Switching
FE
• Robustness Thanks to the Technology Developed to Manufacture
this Device
• ON Semiconductor Six Sigma Philosophy Provides Tight and
Reproducible Parametric Distributions
• These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
TO−220AB
CASE 221A−09
STYLE 1
Rating
Symbol
Value
400
Unit
Vdc
Vdc
Collector−Emitter Sustaining Voltage
Collector−Base Breakdown Voltage
V
CEO
CBO
V
700
1
2
3
Collector−Emitter Breakdown Voltage
Emitter−Base Voltage
V
V
700
10
Vdc
Vdc
Adc
CES
EBO
Collector Current − Continuous
− Peak (Note 1)
I
C
15
25
I
MARKING DIAGRAM
CM
Base Current
− Continuous
− Peak (Note 1)
I
6
12
Adc
B
I
BM
Total Device Dissipation @ T = 25_C
P
150
1.2
W
W/_C
_C
C
D
Derate above 25°C
BUH150G
AY WW
Operating and Storage Temperature
THERMAL CHARACTERISTICS
T , T
J
−65 to 150
stg
Characteristics
Symbol
Max
Unit
_C/W
_C/W
_C
Thermal Resistance, Junction−to−Case
R
q
JC
0.85
BUH150 = Device Code
Thermal Resistance, Junction−to−Ambient
R
q
JA
62.5
260
A
Y
= Assembly Location
= Year
Maximum Lead Temperature for Soldering
Purposes 1/8″ from Case for 5 Seconds
T
L
WW
G
= Work Week
= Pb−Free Package
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Pulse Test: Pulse Width = 5 ms, Duty Cycle ≤ 10%.
ORDERING INFORMATION
Device
Package
Shipping
50 Units / Rail
BUH150G
TO−220
(Pb−Free)
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
©
Semiconductor Components Industries, LLC, 2010
1
Publication Order Number:
April, 2010 − Rev. 5
BUH150/D
BUH150G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Collector−Emitter Sustaining Voltage
V
400
700
10
460
860
12.3
Vdc
Vdc
CEO(sus)
(I = 100 mA, L = 25 mH)
C
Collector−Base Breakdown Voltage
V
V
CBO
EBO
CEO
(I
CBO
= 1 mA)
Emitter−Base Breakdown Voltage
(I = 1 mA)
Vdc
EBO
Collector Cutoff Current
I
100
mAdc
mAdc
mAdc
mAdc
(V = Rated V
, I = 0)
CEO B
CE
Collector Cutoff Current
@ T = 25°C
I
100
1000
C
CES
CBO
(V = Rated V
, V = 0)
CES EB
@ T = 125°C
CE
C
Collector Base Current
@ T = 25°C
I
100
1000
C
(V = Rated V
, V = 0)
CBO EB
@ T = 125°C
CB
C
Emitter−Cutoff Current
I
100
EBO
(V = 9 Vdc, I = 0)
EB
C
ON CHARACTERISTICS
Base−Emitter Saturation Voltage
(I = 10 Adc, I = 2 Adc)
V
V
1
1.25
Vdc
Vdc
BE(sat)
C
B
Collector−Emitter Saturation Voltage
(I = 2 Adc, I = 0.4 Adc)
@ T = 25°C
0.16
0.15
0.4
0.4
C
CE(sat)
@ T = 125°C
C
B
C
(I = 10 Adc, I = 2 Adc)
@ T = 25°C
0.45
2
1
5
Vdc
Vdc
C
B
C
(I = 20 Adc, I = 4 Adc)
@ T = 25°C
C
C
B
DC Current Gain (I = 20 Adc, V = 5 Vdc)
@ T = 25°C
h
FE
4
7
C
CE
C
−
−
@ T = 125°C
2.5
4.5
C
(I = 10 Adc, V = 5 Vdc)
@ T = 25°C
8
6
12
10
C
CE
C
@ T = 125°C
C
(I = 2 Adc, V = 1 Vdc)
@ T = 25°C
12
14
20
22
−
−
C
CE
C
@ T = 125°C
C
(I = 100 mAdc, V = 5 Vdc)
@ T = 25°C
10
20
C
CE
C
DYNAMIC SATURATION VOLTAGE
@ T = 25°C
V
1.5
2.8
2.4
5
V
V
V
V
C
CE(dsat)
I
= 5 Adc, I = 1 Adc
B1
C
Dynamic Saturation
Voltage:
V
= 300 V
CC
@ T = 125°C
C
Determined 3 ms after
@ T = 25°C
rising I reaches 90% of
C
B1
I
C
= 10 Adc, I = 2 Adc
B1
final I (see Figure 19)
B1
V
CC
= 300 V
@ T = 125°C
C
DYNAMIC CHARACTERISTICS
Current Gain Bandwidth
f
23
MHz
pF
T
(I = 1 Adc, V = 10 Vdc, f = 1 MHz)
C
CE
Output Capacitance
C
100
150
ob
(V = 10 Vdc, I = 0, f = 1 MHz)
CB
E
Input Capacitance
C
ib
1300
1750
pF
(V = 8 Vdc, f = 1 MHz)
EB
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2
BUH150G
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)
C
Characteristic
Symbol
Min
Typ
Max
Unit
SWITCHING CHARACTERISTICS: Resistive Load (D.C. ≤ 10%, Pulse Width = 40 ms)
Turn−on Time
Storage Time
Fall Time
@ T = 25°C
t
200
5.3
240
5.6
100
6.1
320
6.5
300
6.5
350
7
ns
ms
ns
ms
ns
ms
ns
ms
ns
C
on
I
= 2 Adc, I = 0.2 Adc
@ T = 25°C
t
s
C
B1
C
I
= 0.2 Adc
= 300 Vdc
B2
CC
@ T = 25°C
t
f
V
C
Turn−off Time
Turn−on Time
Storage Time
Fall Time
@ T = 25°C
t
C
off
on
@ T = 25°C
t
200
7.5
500
8
C
I
I
= 2 Adc, I = 0.4 Adc
@ T = 25°C
t
s
C
B1
C
I
= 0.4 Adc
= 300 Vdc
B2
@ T = 25°C
t
f
V
C
CC
Turn−off Time
Turn−on Time
@ T = 25°C
t
C
off
on
@ T = 25°C
t
450
800
650
C
= 5 Adc, I = 0.5 Adc
@ T = 125°C
C
B1
C
I
= 0.5 Adc
= 300 Vdc
B2
Turn−off Time
Turn−on Time
Turn−off Time
@ T = 25°C
t
2.5
3.9
3
ms
ns
ms
V
C
off
on
CC
@ T = 125°C
C
@ T = 25°C
t
500
900
700
2.75
C
I
= 10 Adc, I = 2 Adc
B1
@ T = 125°C
C
C
I
= 2 Adc
= 300 Vdc
B2
@ T = 25°C
t
2.25
2.75
V
C
off
CC
@ T = 125°C
C
SWITCHING CHARACTERISTICS: Inductive Load (V
= 300 V, V = 15 V, L = 200 mH)
CC
clamp
Fall Time
@ T = 25°C
t
110
160
250
8
ns
ms
ns
ns
ms
ns
ns
ms
ns
ns
ms
ns
C
fi
@ T = 125°C
C
I
B1
B2
= 2 Adc
= 0.2 Adc
= 0.2 Adc
C
Storage Time
Crossover Time
Fall Time
@ T = 25°C
t
si
6.5
8
C
I
I
@ T = 125°C
C
@ T = 25°C
t
235
240
350
250
7.5
C
c
fi
@ T = 125°C
C
@ T = 25°C
t
110
170
C
@ T = 125°C
C
I
C
= 2 Adc
= 0.4 Adc
= 0.4 Adc
Storage Time
Crossover Time
Fall Time
@ T = 25°C
t
si
6
7.8
C
I
I
B1
B2
@ T = 125°C
C
@ T = 25°C
t
c
250
270
350
150
3.75
350
175
2.75
350
C
@ T = 125°C
C
@ T = 25°C
t
fi
110
140
C
@ T = 125°C
C
I
C
= 5 Adc
= 0.5 Adc
= 0.5 Adc
Storage Time
Crossover Time
Fall Time
@ T = 25°C
t
si
3.25
4.6
C
I
I
B1
B2
@ T = 125°C
C
@ T = 25°C
t
c
275
450
C
@ T = 125°C
C
@ T = 25°C
t
fi
110
160
C
@ T = 125°C
C
I
= 10 Adc
= 2 Adc
= 2 Adc
C
B1
B2
Storage Time
Crossover Time
@ T = 25°C
t
si
2.3
2.8
C
I
@ T = 125°C
C
I
@ T = 25°C
t
c
250
475
C
@ T = 125°C
C
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BUH150G
TYPICAL STATIC CHARACTERISTICS
100
100
V
CE
= 1 V
V
CE
= 3 V
T = 125°C
J
T = 125°C
J
T = -ꢀ20°C
J
T = -ꢀ20°C
J
10
10
T = 25°C
J
T = 25°C
J
1
0.001
1
0.001
0.01
0.1
1
10
100
0.01
0.1
1
10
100
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 1. DC Current Gain @ 1 Volt
Figure 2. DC Current Gain @ 3 Volt
100
10
1
V
CE
= 5 V
I /I = 5
C B
T = 125°C
J
T = 125°C
J
T = -ꢀ20°C
J
T = 25°C
J
T = 25°C
J
10
T = -ꢀ20°C
J
0.1
0.01
1
0.01
0.1
1
10
100
0.001
0.01
0.1
1
10
100
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 3. DC Current Gain @ 5 Volt
Figure 4. Collector−Emitter Saturation Voltage
10
1
1.5
I /I = 10
C B
I /I = 5
C B
1
T = -ꢀ20°C
J
T = 125°C
J
T = 25°C
J
0.1
0.5
T = 125°C
J
T = 25°C
J
0.01
0
0.001
0.001
0.01
0.1
1
10
100
0.01
0.1
1
10
100
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 5. Collector−Emitter Saturation Voltage
Figure 6. Base−Emitter Saturation Region
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BUH150G
TYPICAL STATIC CHARACTERISTICS
1.5
2
T = 25°C
J
I /I = 10
C B
1.5
1
1
T = -ꢀ20°C
J
T = 25°C
J
20 A
0.5
15 A
V
CE(sat)
(I = 1 A)
T = 125°C
J
0.5
10 A
C
8 A
5 A
1
0
0.001
0
0.01
0.01
0.1
1
10
100
0.1
10
100
I , COLLECTOR CURRENT (AMPS)
C
I , BASE CURRENT (A)
B
Figure 7. Base−Emitter Saturation Region
Figure 8. Collector Saturation Region
10000
1000
900
800
700
600
T = 25°C
J
T = 25°C
(test)
J
f
= 1 MHz
BVCER @ 10 mA
C (pF)
ib
BVCER(sus) @ 200 mA
C
ob
(pF)
100
10
500
400
1
10
100
10
100
(W)
1000
V , REVERSE VOLTAGE (VOLTS)
R
R
BE
Figure 9. Capacitance
Figure 10. Resistive Breakdown
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BUH150G
TYPICAL SWITCHING CHARACTERISTICS
12
10
2000
1800
1600
1400
1200
1000
800
T = 25°C
T = 125°C
J
I
= I
I
= I
J
B1 B2
B1 B2
V
= 300 V
V
= 300 V
CC
CC
I /I = 10
C B
PW = 20 ms
PW = 40 ms
25°C
8
6
4
125°C
I /I = 5
C B
125°C
600
400
2
0
I /I = 10
C B
25°C
I /I = 5
C B
200
0
0
3
6
9
12
15
15
15
0
5
10
15
10
10
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 11. Resistive Switching, ton
Figure 12. Resistive Switch Time, toff
8
7
6
5
4
3
2
1
0
8
7
6
5
4
3
2
I /I = 5
C B
I
= I
B1 B2
I /I = 10
C B
I = I
B1 B2
V
CC
V = 300 V
= 15 V
V
CC
= 15 V
V = 300 V
Z
Z
L = 200 mH
C
L = 200 mH
C
T = 125°C
T = 25°C
T = 125°C
T = 25°C
J
J
1
0
J
J
1
3
5
7
9
11
13
1
4
7
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 13. Inductive Storage Time, tsi
Figure 13 Bis. Inductive Storage Time, tsi
550
450
350
250
800
700
600
500
400
300
200
I
= I
T = 125°C
T = 25°C
B1 B2
J
I
= I
T = 125°C
B1 B2
C
V
= 15 V
V = 300 V
CC
J
V = 15 V
V = 300 V
T = 25°C
C
CC
Z
Z
L = 200 mH
C
L = 200 mH
C
t
c
t
c
t
fi
t
fi
150
50
100
0
1
3
5
7
9
11
13
0
2
4
6
8
I , COLLECTOR CURRENT (AMPS)
C
I , COLLECTOR CURRENT (AMPS)
C
Figure 14. Inductive Storage Time,
tc & tfi @ IC/IB = 5
Figure 15. Inductive Storage Time,
tc & tfi @ IC/IB = 10
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BUH150G
TYPICAL SWITCHING CHARACTERISTICS
5
4
3
2
200
T = 125°C
T = 25°C
J
J
I = 5 A
C
150
100
I = 5 A
C
I
= I
I
= I
B1 B2
Boff B2
50
0
I = 10 A
C
V = 15 V
V = 300 V
V
= 15 V
1
0
CC
CC
I = 10 A
C
V = 300 V
Z
T = 125°C
T = 25°C
J
Z
J
L = 200 mH
C
L = 200 mH
C
2
4
6
8
10
3
4
5
6
7
8
9
10
h
FE
, FORCED GAIN
h
FE
, FORCED GAIN
Figure 16. Inductive Storage Time
Figure 17. Inductive Fall Time
800
I
= I
T = 125°C
T = 25°C
J
B1 B2
J
700
600
500
400
V = 15 V
V = 300 V
CC
Z
L = 200 mH
C
I = 10 A
C
I = 5 A
C
300
200
100
3
4
5
6
7
8
9
10
h
FE
, FORCED GAIN
Figure 18. Inductive Crossover Time
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BUH150G
TYPICAL SWITCHING CHARACTERISTICS
10
V
I
C
9
8
7
6
5
4
CE
90% I
C
t
fi
dyn 1 ms
t
si
dyn 3 ms
10% I
C
V
10% V
90% I
0 V
clamp
clamp
t
c
90% I
B
B1
3
2
1
0
I
B
1 ms
I
B
3 ms
0
1
2
3
4
5
6
8
7
TIME
TIME
Figure 19. Dynamic Saturation Voltage
Measurements
Figure 20. Inductive Switching Measurements
Table 1. Inductive Load Switching Drive Circuit
+15 V
I PEAK
C
100 mF
1 mF
100 W
3 W
MTP8P10
150 W
3 W
V
CE
PEAK
V
CE
MTP8P10
R
MPF930
B1
I 1
B
MUR105
MJE210
MPF930
I
I
B
+10 V
out
A
I 2
B
50
R
B2
W
COMMON
MTP12N10
150 W
3 W
V
(BR)CEO(sus)
L = 10 mH
Inductive Switching
RBSOA
L = 500 mH
L = 200 mH
R
500 mF
R
= ∞
= 20 Volts
= 100 mA
= 0
= 15 Volts
selected for
R
= 0
= 15 Volts
B2
CC
B2
B2
V
V
V
CC
1 mF
CC
I
R
B1
desired I
R selected for
B1
C(pk)
-V
off
desired I
B1
B1
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BUH150G
TYPICAL THERMAL RESPONSE
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I −V
1
0.8
0.6
0.4
C
CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate. The data of Figure 22 is
SECOND BREAKDOWN
DERATING
based on T = 25°C; T
is variable depending on power
level. Second breakdown pulse limits are valid for duty cycles
C
J(pk)
THERMAL DERATING
to 10% but must be derated when T > 25°C. Second
C
breakdown limitations do not derate the same as thermal
limitations. Allowable current at the voltages shown on
Figure 22 may be found at any case temperature by using the
appropriate curve on Figure 21.
0.2
0
T
J(pk)
may be calculated from the data in Figure 24. At any
case temperatures, thermal limitations will reduce the power
that can be handled to values less than the limitations imposed
by second breakdown. For inductive loads, high voltage and
current must be sustained simultaneously during turn−off
with the base to emitter junction reverse biased. The safe level
is specified as a reverse biased safe operating area
(Figure 23). This rating is verified under clamped conditions
so that the device is never subjected to an avalanche mode.
20
40
60
80
100
120
140
160
T , CASE TEMPERATURE (°C)
C
Figure 21. Forward Bias Power Derating
16
100
10
GAIN ≥ 5
T ≤ 125°C
C
C
14
12
10
8
1 ms
L = 4 mH
10 ms
5 ms
1 ms
DC
1
6
-5 V
0.1
4
0 V
-1.5 V
2
0
0.01
1
10
100
1000
300
400
500
600
700
800
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
V , COLLECTOR-EMITTER VOLTAGE (VOLTS)
CE
Figure 22. Forward Bias Safe Operating Area
Figure 23. Reverse Bias Safe Operating Area
1
0.5
0.2
0.1
0.1
P
(pk)
R
R
(t) = r(t) R
q
JC
q
JC
= 0.83°C/W MAX
q
JC
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
0.05
0.02
t
1
1
t
2
T
- T = P
C
R (t)
q
JC
J(pk)
(pk)
DUTY CYCLE, D = t /t
1 2
SINGLE PULSE
0.1
0.01
0.01
1
10
100
1000
t, TIME (ms)
Figure 24. Typical Thermal Response (ZqJC(t)) for BUH150
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9
BUH150G
PACKAGE DIMENSIONS
TO−220AB
CASE 221A−09
ISSUE AF
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
SEATING
PLANE
−T−
C
S
B
F
T
INCHES
DIM MIN MAX
MILLIMETERS
4
MIN
14.48
9.66
4.07
0.64
3.61
2.42
2.80
0.36
12.70
1.15
4.83
2.54
2.04
1.15
5.97
0.00
1.15
---
MAX
15.75
10.28
4.82
0.88
4.09
2.66
3.93
0.64
14.27
1.52
5.33
3.04
2.79
1.39
6.47
1.27
---
A
B
C
D
F
G
H
J
0.570
0.380
0.160
0.025
0.142
0.095
0.110
0.014
0.500
0.045
0.190
0.100
0.080
0.045
0.235
0.000
0.045
---
0.620
0.405
0.190
0.035
0.161
0.105
0.155
0.025
0.562
0.060
0.210
0.120
0.110
0.055
0.255
0.050
---
A
K
Q
Z
1
2
3
U
H
K
L
N
Q
R
S
T
U
V
Z
L
R
J
V
G
D
0.080
2.04
N
STYLE 1:
PIN 1. BASE
2. COLLECTOR
3. EMITTER
4. COLLECTOR
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
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