B300D44A102XXG [ONSEMI]
Audio Processor for Portable Communication Devices DFNâ44 D SUFFIX; 音频处理器的便携式通信设备DFNA ???? 44 ð后缀
| 型号： | B300D44A102XXG |
| 厂家： | 
ONSEMI |
| 描述： | Audio Processor for Portable Communication Devices DFNâ44 D SUFFIX |
| 文件： | 总31页 (文件大小：485K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BelaSigna 300
Audio Processor for Portable
Communication Devices
Introduction
®
BelaSigna 300 is a DSP−based mixed−signal audio processing
system that delivers superior audio clarity without compromising size
or battery life. The processor is specifically designed for monaural
portable communication devices requiring high performance audio
processing capabilities and programming flexibility when form−factor
and power consumption are key design constraints.
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The efficient dual−MAC 24−bit CFX DSP core, together with the
HEAR configurable accelerator signal processing engine, high speed
debugging interface, advanced algorithm security system, state−of−
the−art analog front end, Class D output stage and much more,
constitute an entire system on a single chip, which enables
manufacturers to create a range of advanced and unique products. The
system features a high level of instructional parallelism, providing
highly efficient computing capability. It can simultaneously execute
multiple advanced adaptive noise reduction and echo cancellation
algorithms, and uses an asymmetric dual−core patented architecture to
allow for more processing in fewer clock cycles, resulting in reduced
power consumption.
DFN−44
D SUFFIX
CASE 506BU
WLCSP−35
W SUFFIX
CASE 567AG
MARKING DIAGRAM
BELASIGNA300
35−02−G
XXXXYZZ
BelaSigna 300 is supported by a comprehensive suite of
development tools, hands−on training, full technical support and a
network of solution partners offering software and engineering
services to help speed product design and shorten time to market.
BELASIGNA300 = Device Code
35
02
= Number of Balls
= Revision of Die
G
XXXX
Y
= Pb−Free
= Date Code
= Assembly Plant Identifier
= (May be Two Characters)
= Traceability Code
Key Features
• Flexible DSP−based System: a complete DSP−based, mixed−signal
audio system consisting of the CFX core, a fully programmable,
highly cycle−efficient, dual−Harvard architecture 24−bit DSP
utilizing explicit parallelism; the HEAR configurable accelerator for
optimized signal processing; and an efficient input/output controller
(IOC) along with a full complement of peripherals and interfaces,
which optimize the architecture for audio processing at extremely
low power consumption
ZZ
ORDERING INFORMATION
Device
Package
Shipping
B300W35A102XYG
WLCSP
(Pb−Free)
2500 Units /
Reel
• Ultra−low−power:typically 1−5 mA
• Excellent Audio Fidelity: up to 110 dB input dynamic range,
exceptionally low system noise and low group delay
B300D44A102XXG
DFN
(Pb−Free)
2500 Units /
Reel
• Miniature Form Factor: available in a miniature 3.63 mm x
2.68 mm x 0.92 mm (including solder balls) WLCSP package. In
addition, BelaSigna 300 is also available in a bigger DFN package
allowing easier assembly and PCB routing
• Multiple Audio Input Sources: four input channels from five input
sources (depends on package selection) can be used simultaneously
for multiple microphones or direct analog audio inputs
2
• Full Range of Configurable Interfaces: including a fast I C−based
interface for download, debug and general communication, a highly
configurable PCM interface to stream data into and out of the device,
a high−speed UART, an SPI port and 5 GPIOs
© Semiconductor Components Industries, LLC, 2011
1
Publication Order Number:
March, 2011 − Rev. 7
B300/D
BelaSigna 300
• Integrated A/D Converters and Powered Output:
• Data Security: sensitive program data can be
encrypted for storage in external NVRAM to prevent
unauthorized parties from gaining access to proprietary
software intellectual property, 128−bit AES encryption
minimize need for external components
• Flexible Clocking Architecture: supports speeds up to
40 MHz
• Development Tools: interface hardware with USB
support as well as a full IDE that can be used for every
step of program development including testing and
debugging
• These Devices are Pb−Free, Halogen Free/BFR Free
and are RoHS Compliant
• “Smart” Power Management: including low current
standby mode requiring only 0.06 mA
• Diverse Memory Architecture: 4864x48−bit words of
shared memory between the CFX core and the HEAR
accelerator plus 8−Kword DSP core data memory,
12−Kwords of 32−bit DSP core program memory as
well as other memory banks
Contents
Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Figures and Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Mechanical Information and Circuit Design Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Architecture Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Application Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Assembly Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Miscellaneous . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
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2
BelaSigna 300
Figures and Data
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Min
−0.3
0.9
Max
2.0
2.0
85
Unit
V
Voltage at any input pin
Operating supply voltage (Note 1)
Operating temperature range (Note 2)
Storage temperature range (Note 3)
V
−40
−55
°C
°C
85
Caution: Class 2 ESD Sensitivity, JESD22−A114−B (2000 V)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Functional operation only guaranteed below 0°C for digital core (VDDC) and system voltages above 1.0 V.
2. Parameters may exceed listed tolerances when out of the temperature range 0 to 50°C.
3. Extended range −55 to 125°C for storage temperature is under qualification.
Electrical Performance Specifications
The tests were performed at 20°C with a clean 1.8 V supply voltage. BelaSigna 300 was running in low voltage mode (VDDC = 1.2 V).
The system clock (SYS_CLK) was set to 5.12 MHz and the sampling frequency is 16 kHz unless otherwise noted.
Parameters marked as screened are tested on each chip. Other parameters are qualified but not tested on every part.
Table 2. ELECTRICAL SPECIFICATIONS
Description
OVERALL
Symbol
Conditions
Min
Typ
Max
Units
Screened
Supply voltage
V
BAT
The WLCSP package option
will not operate properly below
1.8 V if it relies on an external
EEPROM powered by VBAT.
0.9
1.8
2.0
V
√
Current consumption
I
Filterbank, 100% CFX usage,
5.12 MHz, 16 kHz
−
−
−
−
−
−
750
600
2.1
10
−
−
√
√
√
mA
mA
BAT
Ambient room temperature
WDRC, VBAT = 1.8 V
Excludes output drive current
Ambient room temperature
AEC, VBAT = 1.8 V
Excludes output drive current
Ambient room temperature
−
mA
mA
mA
Theoretical maximum
Excludes output drive current
Ambient room temperature
−
Deep Sleep current
Ambient room temperature,
VBAT = 1.25 V
26
40
160
Deep Sleep current
Ambient room temperature,
VBAT = 1.8 V
62
mA
√
VREG (1 mF External Capacitor)
Regulated voltage output
V
0.95
50
−
1.00
55
−
1.05
−
V
dB
√
√
√
REG
Regulator PSRR
Load current
V
1 kHz
REG_PSRR
I
2
mA
LOAD
Load regulation
LOAD
−
6.1
2
6.5
5
mV/mA
mV/V
REG
Line regulation
LINE
−
REG
VDBL (1 mF External Capacitor)
Regulated doubled voltage
output
VDBL
1.9
2.0
2.1
V
4. DFN Package option can have higher input−referred noise up to 2 mV worse than the WLCSP. WLCSP specifications listed.
5. CDM only applies to the DFN package.
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3
BelaSigna 300
Table 2. ELECTRICAL SPECIFICATIONS (continued)
Description
VDBL (1 mF External Capacitor)
Regulator PSRR
Symbol
Conditions
Min
Typ
Max
Units
Screened
VDBL
1 kHz
35
−
41
−
−
dB
mA
PSRR
Load current
I
2.5
10
20
LOAD
Load regulation
LOAD
−
7
mV/mA
mV/V
√
√
REG
Line regulation
LINE
−
10
REG
VDDC (1 mF External Capacitor)
Digital supply voltage output
VDDC output level adjustment
Regulator PSRR
VDDC
Configured by a control register
1 kHz
0.79
27
25
−
0.95
29
25.5
−
1.25
31
26
3.5
12
8
V
mV
VDDC
VDDC
STEP
PSRR
dB
Load current
I
mA
LOAD
Load regulation
LOAD
−
3
mV/mA
mV/V
√
REG
REG
Line regulation
LINE
−
3
POWER−ON−RESET (POR)
POR startup voltage
POR shutdown voltage
POR hysteresis
VDDC
0.775
0.755
13.8
0.803
0.784
19.1
0.837
0.821
22.0
V
V
STARTUP
SHUTDOWN
HYSTERESIS
VDDC
POR
mV
ms
POR duration
T
POR
11.0
11.6
12.3
INPUT STAGE
Analog input voltage
Preamplifier gain tolerance
Input impedance
V
0
−1
−
−
2
1
V
dB
IN
PAG
1 kHz
0
√
R
0 dB preamplifer gain
Non−zero preamplifier gains
239
578
−
kW
IN
550
615
kW
√
√
Input referred noise
IN
IRN
Unweighted,
100 Hz to 10 kHz BW
Preamplifier setting:
0 dB
12 dB
15 dB
18 dB
21 dB
24 dB
27 dB
mVrms
−
−
−
−
−
−
−
−
39
10
7
6
4.5
4
50
12
9
8
5.5
5
3.5
3
4.5
4
30 dB (Note 4)
Input dynamic range
IN
DR
1 kHz, 20 Hz to 8 kHz BW
dB
Preamplifier setting:
0 dB
12 dB
15 dB
18 dB
21 dB
24 dB
27 dB
30 dB
85
84
84
83
82
81
80
78
89
88
88
87
86
85
83
81
−
−
−
−
−
−
−
−
Input peak THD+N
IN
THDN
Any valid preamplifier gain, 1 kHz
−
−70
−63
dB
√
4. DFN Package option can have higher input−referred noise up to 2 mV worse than the WLCSP. WLCSP specifications listed.
5. CDM only applies to the DFN package.
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4
BelaSigna 300
Table 2. ELECTRICAL SPECIFICATIONS (continued)
Description
DIRECT DIGITAL OUTPUT
Maximum load current
Output impedance
Symbol
Conditions
Min
Typ
Max
Units
Screened
I
Normal mode
−
−
−
−
50
5.5
−
mA
W
DO
R
Normal mode
DO
Output dynamic range
DO
Unweighted, 100 Hz to 8 kHz
BW, mono
92
95
dB
DR
Output THD+N
Output voltage
DO
DO
Unweighted, 100 Hz to 22 kHz
BW, mono
−
−79
−76
dB
V
√
THDN
−V
V
BATRCVR
VOUT
BATRCVR
ANTI−ALIASING FILTERS (Input and Output)
Preamplifier filter cut−off
Preamp not bypassed
−
−
20
−
−
kHz
√
√
frequency
Digital anti−aliasing filter
cut−off frequency
f /2
s
Passband flatness
Input stopband attenuation
LOW−SPEED A/D
Input voltage
INL
−1
−
1
dB
dB
60 kHz (12 kHz cut−off)
−
60
−
√
√
Peak input voltage
0
−
−
−
−
4
−
−
2.0
10
2
V
From GND to 2*VREG
From GND to 2*VREG
LSB
LSB
LSB
DNL
Maximum variation over tem-
perature (0°C to 50°C)
5
Sampling frequency
Channel sampling frequency
DIGITAL PADS
All channels sequentially
8 channels
−
−
12.8
1.6
−
−
kHz
kHz
Voltage level for high input
Voltage level for low input
Voltage level for high output
Voltage level for low output
V
VBAT
* 0.8
−
−
−
V
V
√
√
√
√
IH
V
−
VBAT
* 0.2
IL
V
OH
2 mA source current
2 mA sink current
VDDO
* 0.8
−
−
V
V
OL
−
−
VDDO
* 0.2
V
Input capacitance for digital
pads
C
−
4
−
pF
kW
kW
%
IN
Pull−up resistance for digital
input pads
R
220
220
−1
270
270
0
320
320
+1
√
√
UP_IN
Pull−down resistance for
digital input pads
R
DOWN_IN
Sample rate tolerance
Rise and fall time
ESD
FS
Sample rate of 16 kHz or 32 kHz
Digital output pad
Tr, Tf
Human Body Model (HBM)
Machine Model (MM)
2
kV
V
200
500
Charged Device Model (CDM)
(Note 5)
V
Latch−up
V < GNDC, V > VBAT
200
mA
4. DFN Package option can have higher input−referred noise up to 2 mV worse than the WLCSP. WLCSP specifications listed.
5. CDM only applies to the DFN package.
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5
BelaSigna 300
Table 2. ELECTRICAL SPECIFICATIONS (continued)
Description
Symbol
Conditions
Min
Typ
Max
Units
Screened
OSCILLATION CIRCUITRY
Internal oscillator frequency
SYS_CLK
SYS_CLK
0.5
−
10.24
+1
MHz
%
√
√
Calibrated internal clock
frequency
−1
0
Internal oscillator jitter
System clock: 1.28 MHz
Duty cycle
−
45
−
0.4
50
−
1
ns
%
External oscillator tolerances
EXT_CLK
55
System clock: 30 MHz
External clock; VBAT: 1.8 V
300
40
ps
Maximum working frequency
DIGITAL INTERFACES
I2C baud rate
CLK
−
MHz
√
MAX
System clock < 1.6 MHz
System clock > 1.6 MHz
System clock ≥ 5.12 MHz
−
−
−
−
−
1
100
400
−
kbps
kbps
Mbps
General−purpose UART
baud rate
4. DFN Package option can have higher input−referred noise up to 2 mV worse than the WLCSP. WLCSP specifications listed.
5. CDM only applies to the DFN package.
Environmental Characteristics
All BelaSigna 300 packages are Pb−free, RoHS−compliant and Green.
BelaSigna 300 parts are qualified against standards outlined in the following sections.
All BelaSigna 300 package options are Green (RoHS−compliant). Contact ON Semiconductor for supporting documentation.
WLCSP Package Option
DFN Package Option
The solder ball composition for the WLCSP package is
SAC266.
The DFN package has been qualified against AEC−Q100.
Contact ON Semiconductor for full details.
Table 3. WLCSP PACKAGE−LEVEL QUALIFICATION
Table 5. DFN PACKAGE−LEVEL QUALIFICATION
Packaging Level
Packaging Level
Moisture sensitivity level
JEDEC Level 1
Moisture sensitivity level
JEDEC Level 3
30°C / 60% RH for 192 hours
Thermal cycling test (TCT)
−55°C to 150°C for 500 cycles
85°C / 85% RH for 1000 hours
Thermal cycling test (TCT)
−65°C to 150°C for 500 cycles
130°C / 85% RH for 96 hours
Highly accelerated stress
test (HAST)
Highly accelerated stress
test (HAST)
High temperature stress
test (HTST)
150°C for 1000 hours
High temperature stress
test (HTST)
150°C for 1000 hours
Table 4. WLCSP BOARD−LEVEL QUALIFICATION
Table 6. DFN BOARD−LEVEL QUALIFICATION
Board Level
Board Level
Temperature
−40°C to 125°C for 2500
cycles with no failures
Temperature
−40°C to 125°C for 2500
cycles with no failures
Mechanical Information and Circuit Design Guidelines
BelaSigna 300 is available in two packages:
1. A 2.68 x 3.63 mm ultra−miniature wafer−level chip scale package (WLCSP)
2. A 8.9 x 5 mm DFN package
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6
BelaSigna 300
WLCSP Pin Out
A total of 35 active pins are present on the BelaSigna 300 WLCSP package. They are organized in a staggered array. A
description of these pins is given in Table 7.
Table 7. WLCSP PAD DESCRIPTIONS
Pad Index
A1
BelaSigna 300 Pad Name
GNDRCVR
VBATRCVR
RCVR_HP+
RCVR+
Description
I/O
N/A
I
A/D
A
Ground for output driver
A5
Power supply for output stage
Extra output driver pad for high power mode
Output from output driver
A
B2
O
A
C3
O
A
A3
RCVR−
Output from output driver
O
A
B4
RCVR_HP−
CAP0
Extra output driver pad for high power mode
Charge pump capacitor pin 0
Charge pump capacitor pin 1
Doubled voltage
O
A
B6
N/A
N/A
O
A
C5
CAP1
A
A7
VDBL
A
B8
VBAT
Power supply
I
A
B10
A9
VREG
Regulated supply voltage
O
A
AGND
Analog ground
N/A
I
A
A11
B12
A13
B14
D14
E13
C13
D12
E11
C9
AI4
Audio signal input 4
A
AI2/LOUT2
AI1/LOUT1
AI0/LOUT0
GPIO[4]/LSAD[4]
GPIO[3]/LSAD[3]
GPIO[2]/LSAD[2]
GPIO[1]/LSAD[1]/UART−RX
GPIO[0]/UART−TX
GNDC
Audio signal input 2/output signal from preamp 2
Audio signal input 1/output signal from preamp 1
Audio signal input 0/output signal from preamp 0
General−purpose I/O 4/low speed AD input 4
General−purpose I/O 3/low speed AD input 3
General−purpose I/O 2/low speed AD input 2
General−purpose I/O 1/low speed AD input 1/and UART RX
General−purpose I/O 0/UART TX
Digital ground
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
N/A
I/O
I/O
I/O
O
A
A
A
A/D
A/D
A/D
A/D
A/D
A
C11
D10
E9
SDA (I2C)
SCL (I2C)
I2C data
D
I2C clock
D
EXT_CLK
External clock input/internal clock output
Core logic power
D
D8
VDDC
A
E7
SPI_CLK
Serial peripheral interface clock
Serial peripheral interface input
Serial peripheral interface chip select
Serial peripheral interface output
PCM interface frame
O
D
C7
SPI_SERI
SPI_CS
I
D
D6
O
D
E5
SPI_SERO
PCM_FR
O
D
D4
I/O
I
D
E3
PCM_SERI
PCM_SERO
PCM_CLK
Reserved
PCM interface input
D
D2
PCM interface output
O
D
C1
PCM interface clock
I/O
D
E1
Reserved
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BelaSigna 300
WLCSP Assembly / Design Notes
For PCB manufacture with BelaSigna 300 WLCSP,
ON Semiconductor recommends solder−on−pad (SoP)
surface finish. With SoP, the solder mask opening should be
non−solder mask−defined (NSMD) and copper pad
geometry will be dictated by the PCB vendor’s design
requirements.
1. the solder mask opening should be >0.3 mm in
diameter,
2. the copper pad will have 0.25 mm diameter, and
3. soldermask thickness should be less than 1 mil
thick above the copper surface.
ON Semiconductor can provide BelaSigna 300 WLCSP
land pattern CAD files to assist your PCB design upon
request.
Alternative surface finishes are ENiG and OSP; volume
of screened solder paste (#5) should be less than
3
0.0008 mm . If no pre−screening of solder paste is used,
then following conditions must be met:
WLCSP Weight
BelaSigna 300 WLCSP (B300W35A102XYG) has an average weight of 0.095 grams.
DFN Pin Out
A total of 44 active pins are present on the BelaSigna 300 DFN package. A description of these pins is given in Table 8.
Table 8. DFN PAD DESCRIPTIONS
Pad Index
BelaSigna 300 Pad Name
GNDRCVR
VBATRCVR
RCVR_HP+
RCVR+
Description
I/O
N/A
I
A/D
A
15,22
16,21
20
19
18
17
13
14
12
11
10
9
Ground for output driver
Power supply for output stage
Extra output driver pad for high power mode
Output from output driver
A
O
A
O
A
RCVR−
Output from output driver
O
A
RCVR_HP−
CAP0
Extra output driver pad for high power mode
Charge pump capacitor pin 0
O
A
N/A
N/A
O
A
CAP1
Charge pump capacitor pin 1
A
VDBL
Doubled voltage
A
VBAT
Power supply
I
A
VREG
Regulated supply voltage
O
A
AGND0
Analog ground 0
N/A
N/A
N/A
N/A
I
A
8
AGND1
Analog ground 1
A
2
AIR01
Input stage reference for channels 0 and 1
Input stage reference for channels 2 and 3
Audio signal input 4
A
5
AIR23
A
7
AI4
A
6
AI3/LOUT3
AI2/LOUT2
AI1/LOUT1
AI0/LOUT0
GPIO[4]/LSAD[4]
GPIO[3]/LSAD[3]
GPIO[2]/LSAD[2]
GPIO[1]/LSAD[1]/UART−RX
GPIO[0]/UART−TX
GNDC
Audio signal input 3/output signal from preamp 3
Audio signal input 2/output signal from preamp 2
Audio signal input 1/output signal from preamp 1
Audio signal input 0/output signal from preamp 0
General−purpose I/O 4/low speed AD input 4
General−purpose I/O 3/low speed AD input 3
General−purpose I/O 2/low speed AD input 2
General−purpose I/O 1/low speed AD input 1/and UART RX
General−purpose I/O 0/UART TX
Core logic ground
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
N/A
O
A
4
A
3
A
1
A
44
43
42
41
40
34
33
39
38
A/D
A/D
A/D
A/D
A/D
A
VDDC
Core logic power
A
GNDO
Digital ground
N/A
I
A
VDDO
Digital power
A
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8
BelaSigna 300
Table 8. DFN PAD DESCRIPTIONS (continued)
Pad Index
BelaSigna 300 Pad Name
VDDO_SPI
SPI_CLK
Description
I/O
I
A/D
A
28
32
31
30
29
37
36
35
27
26
25
24
23
Supply for SPI interface I/O
Serial peripheral interface clock
Serial peripheral interface input
Serial peripheral interface chip select
Serial peripheral interface output
I2C data
O
D
SPI_SERI
I
D
SPI_CS
O
D
SPI_SERO
SDA (I2C)
O
D
I/O
I/O
I/O
I/O
I
D
SCL (I2C)
I2C clock
D
EXT_CLK
External clock input/internal clock output
PCM interface frame
D
PCM_FR
D
PCM_SERI
PCM_SERO
PCM_CLK
Reserved
PCM interface input
D
PCM interface output
O
D
PCM interface clock
I/O
D
Reserved
DFN Assembly / Design Notes
There is no requirement for electrical connection to the
metal slug under the package. If the design has traces under
or routing under the PCB, the solder mask should not be so
thick that it impedes a good electrical connection on both
sides of the DFN. Exposed vias under the DFN are not
recommended.
nature of this system, the careful design of the printed circuit
board (PCB) layout is critical to maintain the high audio
fidelity of BelaSigna 300. To avoid coupling noise into the
audio signal path, keep the digital traces away from the
analog traces. To avoid electrical feedback coupling, isolate
the input traces from the output traces.
A 0.004″ solder paste stencil has shown good assembly
yield with the fine pitch on the DFN pads.
Recommended Ground Design Strategy
The ground plane should be partitioned into two: the
analog ground plane (AGND) and the digital ground plane
(DGND). These two planes should be connected together at
a single point, known as the star point. The star point should
be located at the ground terminal of a capacitor on the output
of the power regulator as illustrated in Figure 1.
More detailed assembly guidelines can be found in this
application note:
http://www.onsemi.com/pub/Collateral/AND8211−D.PDF
Recommended Circuit Design Guidelines
BelaSigna 300 is designed to allow both digital and analog
processing in a single system. Due to the mixed−signal
Figure 1. Schematic of Ground Scheme
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BelaSigna 300
Internal Power Supplies
The DGND plane is used as the ground return for digital
circuits and should be placed under digital circuits. The
AGND plane should be kept as noise−free as possible. It is
used as the ground return for analog circuits and it should
surround analog components and pins. It should not be
connected to or placed under any noisy circuits such as RF
chips, switching supplies or digital pads of BelaSigna 300
itself. Analog ground returns associated with the audio
output stage should connect back to the star point on separate
individual traces.
For details on which signals require special design
consideration, see Table 9 and Table 10.
In some designs, space constraints may make separate
ground planes impractical. In this case a star configuration
strategy should be used. Each analog ground return should
connect to the star point with separate traces.
Power management circuitry in BelaSigna 300 generates
separate digital (VDDC) and analog (VREG, VDBL)
regulated supplies. Each supply requires an external
decoupling capacitor, even if the supply is not used
externally. Decoupling capacitors should be placed as close
as possible to the power pads. The VDDC internal regulator
is a programmable power supply that allows the selection of
the lowest digital supply depending on the clock frequency
at which BelaSigna 300 will operate. See the Internal Digital
Supply Voltage section for more details on VDDC.
Two other supply pins are also available on BelaSigna 300
(VDDO and VDDO_SPI). On the WLCSP option, these two
pins are internally connected to the VBAT pin, whereas the
DFN package option considers these two pins as inputs. In
this case, they must be externally connected by the
application PCB.
Further details on these critical signals are provided in
Table 9. Non−critical signals are outlined in Table 10.
Table 9. CRITICAL SIGNALS
Pin Name
VBAT
Description
Power supply
Routing Guideline
Place 1 mF (min) decoupling capacitor close to pin.
Connect negative terminal of capacitor to DGND plane.
VREG, VDBL
Internal regulator for
analog sections
Place separate 1 mF decoupling capacitors close to each pin.
Connect negative capacitor terminal to AGND.
Keep away from digital traces and output traces.
VREG may be used to generate microphone bias.
VDBL shall not be used to supply external circuitry.
AGND
VDDC
Analog ground return
Connect to AGND plane.
Internal regulator for digital core
Place 10 mF decoupling capacitor close to pin.
Connect negative terminal of capacitor to DGND.
GNDC
VDDO
Digital ground return
Digital I/O power
Connect to digital ground.
Connect to VDDC, unless the pad ring must use different voltage levels
Not available on WLCSP option (routed internally to VBAT)
VDDO_SPI
GNDO
Supply for SPI interface I/O
Digital ground return
Audio inputs
Connect to VDDC, unless the SPI port must use different voltage levels
Not available on WLCSP option (routed internally to VBAT)
Connect to digital ground.
Not available on WLCSP option (routed internally to GNDC)
AI0/LOUT0,
AI1/LOUT1,
AI2/LOUT2,
AI3/LOUT3, AI4
Keep as short as possible.
Keep away from all digital traces and audio outputs.
Avoid routing in parallel with other traces.
Connect unused inputs to AGND.
AI3/LOUT3 not available on WLCSP option
RCVR+, RCVR−,
RCVR_HP+,
RCVR_HP−
Direct digital audio output
Output stage ground return
Keep away from analog traces, particularly audio inputs.
Corresponding traces should be of approximately the same length.
Ideally, route lines parallel to each other.
GNDRCVR
EXT_CLK
Connect to star point.
Keep away from all analog audio inputs.
External clock input / internal
clock output
Minimize trace length. Keep away from analog signals. If possible, sur-
round with digital ground.
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Table 10. NON−CRITICAL SIGNALS
Pin Name
Description
Internal charge pump − capacitor connection
I2C port
Routing Guideline
Place 100 nF capacitor close to pins
Keep as short as possible
Not critical
CAP0, CAP1
SDA, SCL
GPIO[3..0]
General−purpose I/O
General−purpose UART
PCM port
UART_RX, UART_TX
Not critical
PCM_FRAME, PCM_CLK, PCM_OUT,
PCM_IN
Keep away from analog input lines
LSAD[4..1]
Low−speed A/D converters
Not critical
SPI_CLK, SPI_CS, SPI_SERI, SPI_SERO
Serial peripheral interface port
Connect to EEPROM
Keep away from analog input lines
Audio Inputs
The audio input pad AI3 is not available on the WLCSP
package option.
The audio input traces should be as short as possible. The
input impedance of each audio input pad (e.g., AI0, AI1,
AI2, AI3, AI4) is high (approximately 500 kW); therefore a
10 nF capacitor is sufficient to decouple the DC bias. This
capacitor and the internal resistance form a first−order
analog high pass filter whose cutoff frequency can be
BelaSigna 300 provides microphone power supply
(VREG) and ground (AGND). Keep audio input traces
strictly away from output traces. A 2.0 V microphone bias
might also be provided by the VDBL power supply.
Digital outputs (RCVR) MUST be kept away from
microphone inputs to avoid cross−coupling.
calculated by f
(Hz) = 1/(R x C x 2π), which results in
3dB
~30 Hz for a 10 nF capacitor. This 10 nF capacitor value
applies when the preamplifier is being used, in other words,
when a non−unity gain is applied to the signals. When the
preamplifier is by−passed, the impedance is reduced; hence,
the cut−off frequency of the resulting high−pass filter could
be too high. In such a case, the use of a 30−40 nF serial
capacitor is recommended. In cases where line−level analog
inputs without DC bias are used, the capacitor may be
omitted for transparent bass response.
Audio Outputs
The audio output traces should be as short as possible. The
trace length of RCVR+ and RCVR− should be
approximately the same to provide matched impedances.
Recommendation for Unused Pins
The table below shows the recommendation for each pin
when they are not used.
Table 11. RECOMMENDATIONS FOR UNUSED PADS
WLCSP Ball Index
DFN Pin Index
BelaSigna 300 Signal Name
Recommended Connection when Not Used
Do not connect
B2
C3
20
19
18
17
7
RCVR_HP+
RCVR+
Do not connect
A3
RCVR−
Do not connect
B4
RCVR_HP−
AI4
Do not connect
A11
N/A
B12
A13
B14
D14
E13
C13
D12
E11
E9
Connect to AGND
Connect to AGND
Connect to AGND
Connect to AGND
Connect to AGND
Do not connect
6
AI3/LOUT3
4
AI2/LOUT2
3
AI1/LOUT1
1
AI0/LOUT0
44
43
42
41
40
35
32
31
GPIO[4]/LSAD[4]
GPIO[3]/LSAD[3]
GPIO[2]/LSAD[2]
GPIO[1]/LSAD[1]/UART−RX
GPIO[0]/UART−TX
EXT_CLK
Do not connect
Do not connect
Do not connect
Do not connect
Do not connect
E7
SPI_CLK
Do not connect
C7
SPI_SERI
Do not connect
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Table 11. RECOMMENDATIONS FOR UNUSED PADS (continued)
WLCSP Ball Index
DFN Pin Index
BelaSigna 300 Signal Name
SPI_CS
Recommended Connection when Not Used
Do not connect
D6
E5
D4
E3
D2
C1
E1
30
29
27
26
25
24
23
SPI_SERO
Do not connect
PCM_FR
Do not connect
PCM_SERI
Do not connect
PCM_SERO
PCM_CLK
Do not connect
Do not connect
Reserved
Connect to GND
Architecture Overview
The architecture of BelaSigna 300 is shown in Figure 2.
Downsampling
Preamplifier
BelaSigna 300
A/D
4 or 5*
A/D
Output
Upsampling
HEAR
Configurable
Accelerator
Driver
Analog
A/D
A/D
Inputs
Shared
2
PCM/I S
Shared
2
Shared
Memory
Interface
(Output Side)
PCM/I S
Interface
(Input Side)
4
5
LSAD
GPIO
UART
SPI
2
I C Debug
Port
CFX
24−bit DSP
Clock
Management
2
I C
IP Protection
2 or 5*
Timer 1
Timer 2
Power
Management
Data Memory
3 or 4*
Power−On
Reset
Interrupt
Program Memory
Boot ROM
Controller
Watchdog
Timer
Battery
Monitor
CRC Generator
*: Depending on package option
Figure 2. BelaSigna 300 Architecture: A Complete Audio Processing System
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CFX DSP Core
♦ Indirect with post−modification
♦ Modulo addressing
♦ Bit reverse
The CFX DSP is a user−programmable general−purpose
DSP core that uses a 24−bit fixed−point, dual−MAC,
dual−Harvard architecture. It is able to perform two MACs,
two memory operations and two pointer updates per cycle,
making it well−suited to computationally intensive
algorithms.
CFX DSP Architecture
The CFX architecture encompasses various memory
types and sizes, peripherals, interrupt controllers, and
interfaces. Figure 3 illustrates the basic architecture of the
CFX. The control lines shown exiting the PCU indicate that
control signals go from the PCU to essentially all other parts
of the CFX.
The CFX employs a parallel instruction set for
simultaneous control of multiple computation units. The
DSP can execute up to four computation operations in
parallel with two data transfers (including rounding and/or
saturation as well as complex address updates), while
simultaneously changing control flow.
The CFX features:
• Dual−MAC 24−bit load−store DSP core
• Four 56−bit accumulators
• Four 24−bit input registers
• Support for hardware loops nested up to 4 deep
• Combined XY memory space (48−bits wide)
• Dual address generator units
• Wide range of addressing modes:
♦ Direct
Internal Routing
Interrupts
Instruction Bus
X0
X1
SR
PMEM
CTRL
LR
CTRL
Direct Addr
Hardware Loop
ILSR
ILPC
Stack
Pre−adder
SP Offset
P Bus
PC
PCU
X Multiplier
CTRL
X ALU and
Shifter
XMEM
X AGU
AAccumulators
Immediate
X Bus
Y0
Y1
Y Multiplier
YMEM
Y AGU
Y ALU
B Accumulators
DCU
X Data
Y Data
X Sign/Zero
Extend
X Round/
Saturate
Y Bus
Y Bus
Y Sign/Zero
Extend
Y Round/
Saturate
X Bus
P Bus
DMU
Data registers
Address and Control registers
Internal Routing
Figure 3. CFX DSP Core Architecture
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CFX DSP Instruction Set
Table 12 shows the list of all general CFX instructions and their description. Many instructions have multiple variations not
shown in the table. Please refer to the CFX DSP Architecture Manual for more details.
Table 12. CFX SUMMARY INSTRUCTION SET
Instruction
ABS
Description
Calculate the absolute value of a data register or accumulator
ADD
Add values (various combinations of accumulators, pointers and data registers)
Add two XY data registers, multiply the result by a third XY data register, and store the result in an accumulator
Add two XY data registers, multiply the result by a third XY data register, and add the result to an accumulator
ADDMUL
ADDMULADD
ADDMULNEG
Add two XY data registers, multiply the result by a third XY data register, negate the result and store it in an accu-
mulator
ADDMULSUB
ADDSH
AND
Add two XY data registers, multiply the result by a third XY data register, and subtract the result from an accumulator
Add two data registers or accumulators and shift right one bit, storing the result
Perform a bitwise AND operation on the two operands
Clear a bit in the register
BITCLR
BITSET
BITTGL
BITTST
BREAKPOINT
CALL
Set a bit in the register
Toggle a bit in a data register
Test a bit in a data register
Halts the DSP for debugging if software breakpoints are enabled through the debug port
Call a subroutine
CLR
Clear a word of X memory specified by an X pointer, with update
Compare a data register or accumulator to another data register or accumulator or a value
CMP
CMPU
Compare a data register to a value or another data register as unsigned values or compare two accumulators as
unsigned values
DIVST
ENDLOOP
GOTO
Division step for dividing data register by data register and stores the result to a data register
End a hardware loop before the count has reached zero
Branch to an address or label
INTERRUPT
LOAD
Software interrupt
Load a register, accumulator or a memory location with another register, accumulator or data
Calculate the logarithm base 2 of the absolute value of a data register, storing the result in a data register
Loop with a specified count
LOG2ABS
LOOP
MAX
Determine the maximum value of two data registers or accumulators and store the result in a data register or accu-
mulator
MIN
Determine the minimum value of two data registers or accumulators and store the result in a data register or accu-
mulator
MOVE
MUL
Move a register or accumulator to a register or accumulator
Multiply two XY data registers, storing the result in an accumulator
Multiply two XY data registers, and add the result to an accumulator
Multiply two XY data registers, negate the result and store it in an accumulator
Multiply two XY data registers, and subtract the result from an accumulator
Negate a data register or accumulator, storing the result in a data register or accumulator
MULADD
MULNEG
MULSUB
NEG
NLOG2ABS
Calculate the logarithm base 2 of the absolute value of a data register, negate the result, and store the result in a
data register
NOP
OR
No operation
Perform a bitwise OR operation on two accumulators storing the result in an accumulator or on two data registers
or a data register and value, storing the result in a data register
RETURN
Return from a subroutine
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Table 12. CFX SUMMARY INSTRUCTION SET (continued)
Instruction
RETURNI
SHLL
Description
Return from an interrupt
Shift a data register left logically
Shift a data register right arithmetically
Shift a data register right logically
SHRA
SHRL
SLEEP
Enter sleep mode and wait for an interrupt and then wake up from sleep mode
STORE
Store data, a register or accumulator in a register, accumulator or memory location
SUB
Subtract two data registers or accumulators, storing the result in a data register or accumulator
Subtract two XY data registers, multiply the result by a third XY data register, and store the result in an accumulator
Subtract two XY data registers, multiply the result by a third XY data register, and add the result to an accumulator
SUBMUL
SUBMULADD
SUBMULNEG
Subtract two XY data registers, multiply the result by a third XY data register, negate the result and store it in an
accumulator
SUBMULSUB
SUBSH
Subtract two XY data registers, multiply the result by a third XY data register, and subtract the result from an accu-
mulator
Subtract two data registers or two accumulators and shift right one bit, storing the result in a data register or accu-
mulator
SUBSTEP
SWAP
Subtract a step register from the corresponding pointer
Swap the contents of two data registers, conditionally
XOR
Perform a bitwise XOR operation on two data registers or a data register and a value, storing the result in a data
register
HEAR Configurable Accelerator
♦ Vector addition/subtraction/multiplication
♦ Signal statistics (such as average, variance and
correlation)
The HEAR Configurable Accelerator is a highly
optimized signal processing engine that is configured
through the CFX. It offers high speed, high flexibility and
high performance, while maintaining low power
consumption. For added computing precision, the HEAR
supports block floating point processing. Configuration of
the HEAR is performed using the HEAR configuration tool
(HCT). For further information on the usage of the HEAR
and the HCT, please refer to the HEAR Configurable
Accelerator Reference Manual.
Input/Output Controller (IOC)
The IOC is responsible for the automated data moves of
all audio samples transferred in the system. The IOC can
manage any system configuration and route the data
accordingly. It is an advanced audio DMA unit.
Memory
The HEAR is optimized for advanced audio algorithms,
including but not limited to the following:
♦ Dynamic range compression
RAM & ROM
The size and width of each of the RAM and ROM
structures are shown in Table 13:
♦ Directional processing
Table 13. RAM AND ROM STRUCTURE
♦ Acoustic echo cancellation
♦ Noise reduction
Memory Structure
Program memory (ROM)
Program memory (RAM)
X memory (RAM)
Data Width
Memory Size
2048
To provide the ability for these algorithms to be executed
efficiently, the HEAR excels at the following:
♦ Processing using a weighted overlap add (WOLA)
filterbank or FFT
32
32
24
24
24
12288
6144
♦ Time domain filtering
♦ Subband filtering
♦ Attack/release filtering
Math library LUT (ROM)
Y memory (RAM)
128
2048
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Shared Memories
The shared CFX/HEAR memories include the following:
Table 14. SHARED MEMORIES
Type
Name
Size
Data memory (RAM)
H0MEM, H1MEM, H2MEM,
H3MEM, H4MEM, H5MEM
Each 128x48−bit words
FIFO memory (RAM)
Coefficient memory (RAM)
Data ROM
AMEM, BMEM
CMEM, DMEM
SIN/COS LUT
Each 1024x48−bit words
Each 1024x48−bit words
512x48−bit words containing the 512 point sin/cos look up table
2048x32−bit words
Microcode memory (RAM)
MICROCODE_MEM
Memories Structure
Figure 4 shows the system memory structure. The individual blocks are described in the sections that follow.
IOC
2 x 48−bits
2 x 48−bits
A and B Memory
(RAM)
2048 x 48−bit
FIFO
Controller
C and D Memory
(RAM)
2048 x 48−bit
Shared
Memory
Bus
Shared Memory Buses (2 x 48−bits)
H0, H1, H2, H3, H4 and
H5 Memory (RAM)
768 x 48−bit
Controller
HEAR
Configurable
Accelerator
SIN/COS Table
(ROM)
512 x 48−bit
Microcode Memory Buses (2 x 32−bits)
Microcode Memory
(RAM)
2048 x 32−bit
Program Memory
(ROM)
2048 x 32−bit
Instruction Memory Bus (32−bits)
P Memory Bus (32−bits)
Program Memory
(RAM)
12288 x 32−bit
X Memory (RAM)
6144 x 24−bit
CFX DSP
X Memory Bus (24−bits)
Y Memory Bus (24−bits)
Math Library LUT
(ROM)
128 x 24−bit
Y Memory (RAM)
2048 x 24−bit
Figure 4. System Memory Architecture
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FIFO Controller
The FIFO controller handles the moving of data to and
from the FIFOs, after being initially configured. Up to eight
FIFOs can be created by the FIFO controller, four in A
memory (AMEM) and four in B memory (BMEM). Each
FIFO has a block counter that counts the number of samples
read or written by the IOC. It creates a dedicated interrupt
signal, updates the block counter and updates the FIFO
pointers when a new block has been read or written.
Memory Maps
The structure of the XMEM and YMEM address spaces are shown in Figure 5.
0x10000
0x10000
D Memory
C Memory
B Memory
A Memory
0xF800
0xF000
0xE800
0xE000
BD Memory
AC Memory
CD Memory
0xD000
0xC000
0xB000
0xA000
0x9F00
0x9800
AB Memory
HEAR / FIFO Registers
SIN/COS ROM
0x9400
0x9200
0x9000
0x8E00
0x8C00
0x8B00
0x8A00
0x8900
0x8800
0x8700
0x8600
0x8400
0x8200
0x8000
H12 Memory
H03 Memory
H13 Memory
H02 Memory
H5 Memory
H4 Memory
H3 Memory
H2 Memory
H1 Memory
H0 Memory
H45 Memory
H23 Memory
H01 Memory
Math LUT ROM
0x7800
X Memory Map
X Memory / Y Memory Map
(May be used as XY Memory)
0x1800
X Memory
X Memory
Unused
0x0800
0x0000
0x0800
0x0000
Y Memory
Figure 5. XMEM and YMEM Memory Maps
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BelaSigna 300
The structure of the PMEM address space is shown in Figure 6.
0x10000
Program Memory (RAM)
(Mirror: 0x3000−0x3FFF)
0xF000
Memory Mapped Analog
and Digital Registers
0xE000
0x8800
0x8000
Microcode Memory
0x4000
P Memory Map (Program Memory)
P Memory Map (Other)
Unused
Program Memory (RAM)
0x1000
0x0800
0x0000
Program Memory
(Boot ROM)
Figure 6. PMEM Memory Map
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Interrupts
Other Digital Blocks and Functions
The interrupt flow of the system handles interrupts
General−Purpose Timer
generated by the CFX DSP core and the HEAR accelerator.
The CFX interrupt controller receives interrupts from the
various blocks within the system. The FIFO controller can
send interrupts to the CFX. The HEAR can generate events
which are interrupts in the CFX.
The CFX DSP system contains two general−purpose
timers. These can be used for scheduling tasks that are not
part of the sample−based signal−processing scheme, such as
checking the battery voltage, and periodically asserting the
available analog and digital inputs for purposes such as
reading the value of a volume control potentiometer or
detecting input from a push button.
Hear Function Chain Controller
The HEAR function chain controller responds to
commands from the CFX, and events from the FIFO
controller. It must be configured by the CFX to enable the
triggering of particular function chains within a microcode
configuration. This is accomplished through the appropriate
setting of control registers as described in the Hardware
Reference Manual for BelaSigna 300.
The interaction between the interrupt controller, the
HEAR function chain controller and the rest of the system
are shown in Figure 7.
Watchdog Timer
The watchdog timer is a programmable hardware timer
that operates from the system clock and is used to ensure
system sanity. It is always active and must be periodically
acknowledged as a check that an application is still running.
Once the watchdog times out, it generates an interrupt. If left
to time out
a second consecutive time without
acknowledgement, a system reset will occur.
FIFO Controller
CFX Interrupt
Controller
HEAR Function
Chain Controller
CFX
HEAR
Figure 7. Interrupt Flow
Algorithm and Data Security
To protect the IP in the non−volatile memory the system
supports decoding algorithm and data sections belonging to
an application that have been encrypted using the advanced
encryption standard (AES) and stored in non−volatile
memory. While system access restrictions are in place, the
keys used in the decryption of these sections will be secured
from external access by the regular access restrictions.
When the system is externally “unlocked” these keys will be
cleared, preventing their use in decoding an application by
non−authorized parties. After un−restricting access in this
way the system may then be restored by re−programming
the decryption keys.
Algorithm software code and user data that requires
permanent retention is stored off the BelaSigna 300 chip in
separate non−volatile memory. To support this, the
BelaSigna 300 chip can gluelessly interface to an external
SPI EEPROM.
To prevent unauthorized access to the sensitive
intellectual property (IP) stored in the EEPROM, a
comprehensive system is in place to protect manufacturer’s
application code and data. When locked the system
implements an access restriction layer that prevents access
to both volatile and non−volatile system memory. When
unlocked, both memory and EEPROM are accessible.
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Analog Blocks
input of the programmable preamplifier that can be
configured for bypass or gain values of 12 to 30 dB (3 dB
steps). The input stage is shown in Figure 8.
A built−in feature allows a sampling delay to be
configured for any one or more channels. This is useful in
beam−forming applications.
Input Stage
The analog audio input stage is comprised of four
individual channels. For each channel, one input can be
selected from any of the five possible input sources
(depending on package option) and is then routed to the
Conversion
and filtering
Preamp
AI0
M
U
X
Channel 0
Channel 1
AI1
AI2
Conversion
and filtering
Preamp
IOC
M
U
X
Conversion
and filtering
Preamp
Channel 2
Channel 3
AI3*
AI4
Conversion
and filtering
Preamp
* Not available on WLCSP option
Figure 8. Input Stage
Input Dynamic Range Extension (IDRX)
separate power amplifier or can be connected to another
Digital Mic input on another system. The output stage is
shown in Figure 9.
To increase the input dynamic range for a particular
application, it is possible to pair−wise combine the four AD
converters found on BelaSigna 300. This will increase the
dynamic range up to 110 dB. When this technique is used,
the device handles the preamplifier gain configuration based
on the input level and sets it in such a way as to give the
maximum possible dynamic range. This avoids having to
make the design trade−off between sufficient amplification
for low−level signals and avoiding saturation for high−level
signals.
BelaSigna 300 has an option for high−power mode that
decreases the impedance of the output stage, thus permitting
higher possible acoustic output levels. To use this feature,
RCVR_HP+ should be connected to RCVR+, and
RCVR_HP− should be connected to RCVR−, you must
combine the synchronized output signals externally to
BelaSigna 300. Connect both RCVR+ and RCVR_HP+ to
a single terminal on an output transducer, and connect both
RCVR− and RCVR_HP− to the other terminal. An RC filter
might be required based on receiver characteristics. Figure 9
shows the connections for the output driver in high−power
mode.
Output Stage
The output stage includes a 3 −order sigma−delta
rd
modulator to produce a pulse density modulated (PDM)
output signal. The sampling frequency of the sigma delta
modulator is pre−scaled from the system clock.
The low−impedance output driver can also be used to
directly drive an output transducer without the need for a
Electrical specifications on the output stage are available
in Table 2.
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BelaSigna 300
RCVR_HP+
RCVR+
Output
Output
driver
Upsampling and
conversion
from IOC
RCVR−
RCVR_HP−
Figure 9. Output Stage
Figure 10. External Signal Routing of Connections for High−Power Output Mode
The high−frequencies in the Class−D PDM output are
filtered by an RC filter or by the frequency response of the
speaker itself. ON Semiconductor recommends a 2−pole RC
filter on the output stage if the output signal is not directly
driving a receiver. Given below is the simple schematic for
a 2−pole RC filter.
Figure 11. 2−Pole RC filter
Our recommendations for components for the RC Filter
are given below:
stand−by mode operations. On the WLCSP package option,
this internal clocking circuitry cannot be used during normal
operation; as such, an external clock signal must be present
on the EXT_CLK pin to allow BelaSigna 300 to operate.
The DFN package option can fully use the internal clocking
circuitry at all times. All other needed clocks in the system
are derived from this external clock frequency. Figure 12
shows the internal clock structure of BelaSigna 300.
For 8 KHz sampling, we recommend R = 8.2 k and C = 1 nF
(3 dB cutoff frequency at 3.3 kHz)
For 16 KHz sampling, we recommend R = 8.2 k and C =
330 pF (3 dB cutoff frequency at 9 kHz)
Clock Generation Circuitry
BelaSigna 300 is equipped with an un−calibrated internal
RC oscillator that will provide clock support for booting and
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BelaSigna 300
Figure 12. Internal Clocking Structure
Power Supply Unit
BelaSigna 300 has multiple power sources as can be seen on Figure 13. Digital and analog sections of the chip have their
own power supplies to allow exceptional audio quality.
Figure 13. Power Supply Structure
Battery Supply Voltage (VBAT)
The primary voltage supplied to a BelaSigna 300 device
is VBAT. It is typically 1.8 V. The WLCSP package option
is also using VBAT to define the I/O voltage levels, as well
as powering an external EEPROM on the SPI port.
Consequently, any voltage below 1.8 V will result in
incorrect operation of the EEPROM. On the DFN package
option, the above connection doesn’t exist, so the voltage on
VBAT can be safely used down to its minimum value of
1.25 V.
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BelaSigna 300
Internal Band Gap Reference Voltage
Voltage Mode
The band gap reference voltage has been stabilized over
temperature and process variations. This reference voltage
is used in the generation of all of the regulated voltages in the
BelaSigna 300 system and provides a nominal 1 V reference
signal to all components using the reference voltage.
BelaSigna 300 operates in: Low voltage (LV) power
supply mode. This mode allows integration into a wide
variety of devices with a range of voltage supplies and
communications levels. BelaSigna 300 operates from a
nominal supply of 1.8 V on VBAT, but this can scale
depending on available supply. The digital logic runs on an
internally generated regulated voltage (VDDC), in the range
of 0.9 V to 1.2 V. On the WLCSP package option, all digital
I/O pads including the SPI port run from the same voltage as
supplied on VBAT. On the DFN package option, the VDDO
and VDDO_SPI power sources determine these voltage levels.
The power management on BelaSigna 300 includes the
power−on−reset (POR) functionality as well as power
supervisory circuitry. These two components work together
to ensure proper device operation under all battery conditions.
The power supervisory circuitry monitors both the battery
supply voltage (VBAT) and the internal digital supply
voltage (VDDC). This circuit is used to start the system
when VBAT reaches a safe startup voltage, and to reset the
system when either of the VBAT or VDDC voltages drops
below a relevant voltage threshold. The relevant threshold
voltages are shown in Table 15.
Internal Digital Supply Voltage (VDDC)
The internal digital supply voltage is used as the supply
voltage for all internal digital components, including being
used as the interface voltage at the low side of the level
translation circuitry attached to all of the external digital
pads. VDDC is also provided as an output pad, where a
capacitor to ground typically filters power supply noise. The
VDDC internal regulator is a programmable power supply
that allows the selection of the lowest digital supply
depending on the clock frequency at which BelaSigna 300
will operate. In the WLCSP package, the VDDC
configuration is set by the boot ROM to its maximum value
to allow for 40 MHz operation in all parts. In the DFN
package, VDDC is not set by the boot ROM. Thus, care must
be taken when using the DFN at high clock frequencies to
ensure that the VDDC configuration is properly set. Contact
ON Semiconductor for more information regarding VDDC
calibration.
Table 15. POWER MANAGEMENT THRESHOLDS
Threshold
VBAT monitor startup
VBAT startup
Voltage Level
0.70 V
External Digital Supply Voltage (VDDO)
VDDO is an externally provided power source. It is used
by the pads of BelaSigna 300. Communication with external
devices will happen at the level defined on this pin. This pin
is not available on the WLCSP option of BelaSigna 300, as
it is internally connected to VBAT.
0.82 V 50 mV
0.80 V 50 mV
VBAT and VDDC shutdown
Power−on−Reset (POR) and Booting Sequence
BelaSigna 300 uses a POR sequence to ensure proper
system behavior during start−up and proper system
configuration after start−up. At the start of the POR
sequence, the audio output is disabled and all configuration
and control registers are asynchronously reset to their
default values (as specified in the Hardware Reference
Manual for BelaSigna 300). All CFX DSP registers are
cleared and the contents of all RAM instances are
unspecified at this point.
SPI Port Digital Supply Voltage (VDDO_SPI)
VDDO_SPI is an externally provided power source
dedicated to the SPI port. Communication with external
EEPROMs will happen at the level defined on this pin. This
pin is not available on the WLCSP option of BelaSigna 300,
as it is internally connected to VBAT.
Regulated Supply Voltage (VREG)
VREG is a 1 V reference to the analog circuitry. It is
available externally to allow for additional noise filtering of
the regulated voltages within the system.
The POR sequence consists of two phases: voltage supply
stabilization and boot ROM initialization. During the
voltage supply stabilization phase, the following steps are
performed:
Regulated Doubled Supply Voltage (VDBL)
VDBL is a 2 V reference voltage generated from the
internal charge pump. It is a reference to the analog circuitry.
It is available externally to allow for additional noise
filtering of the regulated voltages within the system.
The internal charge pump uses an external capacitor that
is periodically refreshed to maintain the 2 V supply. The
charge pump refresh frequency is derived from slow clock
which assists the input stage in filtering out any noise
generated by the dynamic current draw on this supply
voltage.
1. The internal regulators are enabled and allowed to
stabilize.
2. The internal charge pump is enabled and allowed
to stabilize.
3. SYSCLK is connected to all of the system
components.
4. The system switches to external clocking mode
(WLCSP package option only)
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BelaSigna 300
Power Management Strategy
Digital Interfaces
BelaSigna 300 has a built−in power management unit that
guarantees valid system operation under any voltage supply
condition to prevent any unexpected audio output as the
result of any supply irregularity. The unit constantly
monitors the power supply and shuts down all functional
units (including all units in the audio path) when the power
supply voltage goes below a level at which point valid
operation can no longer be guaranteed.
General−Purpose Input Output (GPIO) Ports
BelaSigna 300 has five GPIO ports that can connect to
external digital inputs such as push buttons, or digital outputs
such as the control or trigger of an external companion chip
(GPIO[0..4]). The direction of these ports (input or output) is
configurable and each pin has an internal pull−up resistor
when configured as a GPIO. A read from an unconnected pin
will give a value of logic 1. Four of the five GPIO pins are
multiplexed with an LSAD (see the Low−Speed A.D
Converters section) and as such the functionality of the pin
can be either a GPIO or an LSAD depending on the
configuration. Note that GPIO0 cannot be used as an LSAD.
Once the supply voltage rises above the startup voltage of
the internal regulator that supplies the digital subsystems
(VDDC ) and remains there for the length of time
STARTUP
T
, a POR will occur. If the supply is consistent, the
POR
internal system voltage will then remain at a fixed nominal
voltage (VDDC ). If a spike occurs that causes the
NOMINAL
Inter−IC Communication (I2C) Interfaces
voltage to drop below the shutdown internal system voltage
(VDDC ), the system will shut down. If the
2
The I C interface is an industry−standard interface that
SHUTDOWN
can be used for high−speed transmission of data between
BelaSigna 300 and an external device. The interface
operates at speeds up to 400 Kbit/sec for system clocks
(EXT_CLK) higher than 1.6 MHz. In product development
voltage rises again above the startup voltage and remains
there for the length of time T , a POR will occur. If
POR
operating directly off a battery, the system will not power
down until the voltage drops below the VDDC
SHUTDOWN
2
mode, the I C interface is used for application debugging
voltage as the battery dies. This prevents unwanted resets
when the voltage is just on the edge of being too low for the
system to operate properly because the difference between
purposes, communicating with the BelaSigna 300
development tools. The interface can be configured to
operate in either master mode or slave mode.
VDDC
and VDDC
prevents oscillation
STARTUP
SHUTDOWN
around the VDDC
point.
Serial Peripheral Interface (SPI) Port
SHUTDOWN
An SPI port is available on BelaSigna 300 for applications
such as communication with a non−volatile memory
(EEPROM). The I/O levels on this port are defined by the
voltage on the VDDO_SPI pin on the DFN package option,
whereas it is defined by VBAT on the WLCSP package
option. The SPI port operates in master mode only, which
supports communications with slave SPI devices.
The SPI port on BelaSigna 300 only supports master
mode, so it will only communicate with SPI slave devices.
When connecting to an SPI slave device other than a boot
EEPROM, the SPI_CS pin should be left unconnected and
the slave device CS line should be driven from a GPIO to
avoid BelaSigna 300 boot malfunction. When connecting to
an SPI EEPROM for boot, the designer can choose to
connect the SPI_CS pin to the EEPROM or use a GPIO (high
at boot) for a design with several daisy-chained SPI devices.
Other Analog Support Blocks and Functions
Low−Speed A/D Converters (LSAD)
The BelaSigna 300 chip has four LSAD channels that
connect to external analog inputs for purposes such as for
reading the value of a potentiometer or an analog sensor
(LSAD[1..4]). The native data format for the LSAD is
10−bit two’s−complement. However, a total of eight
operation modes are provided that allow a configurable
input dynamic range in cases where certain minimum and
maximum values for the converted inputs are desired, such
as in the case of a volume control where only input values
up to a certain magnitude are allowed. Each LSAD channel
is sampled at a nominal frequency of 1.6 kHz when using the
default settings. Each LSAD pin is multiplexed with a GPIO
function (see the General−Purpose Input Output Ports
section) as such the functionality of the pin can be either a
GPIO or an LSAD depending on the configuration.
PCM Interface
BelaSigna 300 includes a highly configurable pulse code
modulation (PCM) interface that can be used to stream
signal, control and configuration data into and out of the
device. The I/O levels on this port are defined by the voltage
on the VDDO pin (VBAT on the WLCSP package option).
Battery Monitor
A programmable on−chip battery monitor is available for
overall system power management. The battery monitor
works by incrementing a counter value every time the
battery voltage goes below a desired, configurable threshold
value. This counter value can be used in an application−
specific power−management algorithm running on the
CFX. The CFX can initiate any desired actions once the
battery hits a predetermined value.
UART Interface
A general−purpose two−pin UART interface is available
for RS−232 compatible communications. The baud rate
(bits/second) of this interface is typically configurable within
a range of 0.4 to 320 kbps, depending on the application’s
system clock. The I/O levels on this port are defined by the
voltage on the VDDO pin (VBAT on the WLCSP option).
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BelaSigna 300
Application Diagrams
The application diagram of BelaSigna 300 (WLCSP Option) is shown in Figure 14.
2.2 kW
10 mF
1 mF
+
_
1 mF
1.8 V
1 mF
GNDC
GNDC
AGND
10 nF
AGND
Speaker
Receiver
Speaker
Amp
Filtering
RCVR+
RCVR−
MIC−INP
AI4
Filtering
MIC−INM
PCM_FR**
PCM/I S
PCM_CLK**
PCM_SERI**
PCM_SERO**
2
PCM or I2S
Baseband
GPIO[0]**
(Wake−Up Signal)
GPIOs
I2C
GPIO[1]**
(Service Request)
2
I C
SDA**
SCL**
Management
EXT_CLK**
Management
Reset
Battery
Monitor
** Level Translation may be
required (1.8 V on BelaSigna 300)
100 nF
Figure 14. BelaSigna 300 WLCSP Application Diagram
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BelaSigna 300
The application diagram of BelaSigna 300 (DFN Option) is shown in Figure 15.
2.2 kW
1.8 V
1 mF
10 mF
1 mF
+
−
1 mF
AGND
GNDC
AGND
GNDC
10 nF
Speaker
Speaker
Filtering
RCVR_HP+
Amp
Receiver
RCVR+
AI2
AI3
AI4
Upsampling
RCVR−
RCVR_HP−
MIC−INP
MIC−INM
Filtering
PCM_FR**
PCM_CLK**
PCM_SERI**
PCM_SERO**
2
PCM/I S
PCM or I2S
SPI_CS
SPI_CLK
SPI_SERI
Baseband
GPIO[0]**
(Wake−Up Signal)
Optional
EEPROM
or Bluetooth
GPIOs
I2C
SPI_SERO
GPIO[1]**
(Service Request)
2
I C
SDA**
SCL**
Management
EXT_CLK**
Power
Timer
** Level Translation may be
required (1.8 V on BelaSigna 300)
Generator
100 nF
Figure 15. BelaSigna 300 DFN Application Diagram
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BelaSigna 300
Assembly Information
CARRIER DETAILS
2.6 x 3.8 mm WLCSP
ON Semiconductor offers tape and reel packing for BelaSigna 300 WLCSP. The packing consists of a pocketed carrier tape,
a cover tape, and a molded anti−static polystyrene reel. The carrier and cover tape create an ESD safe environment, protecting
the components from physical and electrostatic damage during shipping and handling.
Pin 1
Quantity per Reel: 2500 units
Pin 1 Orientation: Upper Left, Bumps down
Tape Brand / Width: Advantek / 12 mm
Pocket Pitch: 8 mm
A = 13 inches
B = 12 mm
C = 4 inches
D = 13 mm
ꢀ
P/N: BCB043
Reel Brand / Width: Advantek Lokreel / 13 in
Cover Tape: 3M 2666 PSA 9.3 mm
Figure 16. Package Orientation on Tape for WLCSP Package Option
10 sprockets hole pitch cumulative tolerance 0.1.
Camber in compliance with EIA 763.
Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.
Figure 17. WLCSP Carrier Tape Drawing
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BelaSigna 300
8.9 x 5 mm DFN
ON Semiconductor offers tape and reel packing for BelaSigna 300 DFN. The packing consists of a pocketed carrier tape,
a cover tape, and a molded anti−static polystyrene reel. The carrier and cover tape create an ESD safe environment, protecting
the components from physical and electrostatic damage during shipping and handling.
Pin 1
Quantity per Reel: 2500 units
Pin 1 Orientation: Upper Left
Tape Brand / Width: C−PAK / 16 mm
Pocket Pitch: 8 mm
A = 13 inches
B = 16 mm
C = 4 inches
D = 14 mm
P/N: QFN0500X0890
Reel Brand / Width: PEAK / 13 in
Cover Tape: Sumitomo 13.3 mm (Z7302−13.3)
Figure 18. Package Orientation on Tape for DFN Package Option
Figure 19. DFN Carrier Tape Drawing
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BelaSigna 300
Sample Shipping Label
Figure 20. Sample Shipping Label
Re−Flow Information
(see CAA instruction manual). For BelaSigna 300, the key
identifier components and values are as follows for the
different package options:
The re−flow profile depends on the equipment that is used
for the re−flow and the assembly that is being re−flowed.
Information from JEDEC Standard 22−A113D and
J−STD−020D.01can be used as a guideline.
Package
Option
Chip
Family
Chip
Version
Chip
Revision
Electrostatic Discharge (ESD) Sensitive Device
WLCSP
DFN
0x03
0x03
0x02
0x01
0x0100
0x0200
CAUTION: ESD sensitive device. Permanent damage may
occur on devices subjected to high−energy electrostatic
discharges. Proper ESD precautions in handling, packaging
and testing are recommended to avoid performance
degradation or loss of functionality. Device is 2 kV HBM
ESD qualified.
Support Software
A full suite of comprehensive tools is available to assist
software developers from the initial concept and technology
assessment through to prototyping and product launch.
Simulation, application development and communication
tools as well as an Evaluation and Development Kit (EDK)
facilitate the development of advanced algorithms on
BelaSigna 300.
Miscellaneous
Ordering Information
To order BelaSigna 300 WLCSP, please contact your
account manager and ask for part number
B300W35A102XYG.
To order BelaSigna 300 DFN, please contact your account
manager and ask for part number B300D44A102XXG.
Training
To facilitate development on the BelaSigna 300 platform,
training is available upon request. Contact your account
manager for more information.
Chip Identification
Company or Product Inquiries
For more information about ON Semiconductor products
or services visit our Web site at http://onsemi.com.
Chip identification information can be retrieved by using
the Communications Accelerator Adaptor (CAA) tool along
with the protocol software provided by ON Semiconductor
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29
BelaSigna 300
PACKAGE DIMENSIONS
WLCSP35, 3.63x2.68
CASE 567AG−01
ISSUE B
D
A
NOTES:
B
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
PIN A1
REFERENCE
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM
A
A1
A2
b
MIN
0.84
0.17
0.72 REF
0.24
MAX
1.00
0.23
E
0.29
C
D
E
eD
eE
0.125 BSC
3.63 BSC
2.68 BSC
0.25 BSC
0.433 BSC
2X
0.10
C
2X
0.10
C
TOP VIEW
A2
0.10
C
A
0.05
C
SEATING
PLANE
NOTE 3
C
A1
SIDE VIEW
C
eD
35X
b
0.05
0.03
C
C
A B
E
D
C
B
A
eE
14 13 12 11 10
9 8 7 6 5 4 3 2 1
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
PACKAGE
OUTLINE
A1
0.433
PITCH
35X
0.25
0.250
PITCH
0.125
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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BelaSigna 300
PACKAGE DIMENSIONS
DFN44 8.9x5, 0.4P
CASE 506BU−01
ISSUE O
A
B
NOTES:
L
L
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
D
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM TERMINAL
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTIONS
PIN ONE
LOCATION
E
MILLIMETERS
DIM MIN
0.80
A1 0.00
MAX
0.90
0.05
0.15
0.15
C
A
EXPOSED Cu
MOLD CMPD
A3
b
0.20 REF
0.15
8.90 BSC
C
TOP VIEW
0.25
D
D2 8.20
8.40
3.70
(A3)
DETAIL B
DETAIL B
E
5.00 BSC
0.10
C
C
ALTERNATE
E2 3.50
CONSTRUCTIONS
e
K
L
0.40 BSC
0.20
0.30
A
−−−
0.50
0.15
0.08
A1
L1 0.00
SEATING
NOTE 4
C
SIDE VIEW
D2
PLANE
M
0.10
C A B
DETAIL A
1
M
0.10
C A B
K
SOLDERING FOOTPRINT*
E2
PACKAGE
OUTLINE
44X
0.63
8.40
44X
b
0.07
e
e/2
44X
L
M
M
C
C
A B
3.70
5.30
0.05
NOTE 3
BOTTOM VIEW
0.40
PITCH
44X
0.26
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
BelaSigna is a registered trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
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