AFGHL50T65RQDN [ONSEMI]

IGBT - 650 V 50 A - Short circuit rated FS4  - Automotive qualified;
AFGHL50T65RQDN
型号: AFGHL50T65RQDN
厂家: ONSEMI    ONSEMI
描述:

IGBT - 650 V 50 A - Short circuit rated FS4  - Automotive qualified

双极性晶体管
文件: 总9页 (文件大小:239K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DATA SHEET  
www.onsemi.com  
IGBT for Automotive  
Application  
650 V, 50 A  
50 A, 650 V,  
CE(Sat) = 1.6 V (Typ.)  
V
C
AFGHL50T65RQDN  
Using novel field stop IGBT technology, onsemi’s new series of  
th  
field stop 4 generation IGBTs offer the optimum performance for  
G
solar inverter, UPS, welder, telecom, ESS and PFC applications where  
low conduction and switching losses are essential.  
E
Features  
Maximum Junction Temperature: T = 175°C  
J
Positive Temperature Coefficient for Easy Parallel Operation  
High Current Capability  
Low Saturation Voltage: V  
= 1.6 V (Typ.) @ I = 50 A  
C
100% of the Parts Tested for I (Note 2)  
CE(Sat)  
LM  
TO2473L  
CASE 340CX  
High Input Impedance  
Fast Switching  
Tightened Parameter Distribution  
This Device is PbFree and RoHS Compliant  
MARKING DIAGRAM  
Typical Applications  
Solar Inverter, UPS, Welder, Telecom, ESS, PFC  
AYWWZZ  
AFGHL50  
T65RQDN  
MAXIMUM RATINGS  
Rating  
Symbol  
Value  
Unit  
V
CollectortoEmitter Voltage  
V
CES  
V
GES  
650  
GatetoEmitter Voltage  
Transient GatetoEmitter Voltage  
20  
30  
V
Collector Current (Note 1)  
I
A
C
A
WW  
Y
= Assembly Site  
@ T = 25°C  
78  
50  
C
= Work Week Number  
= Year of Production,  
Last Number  
@ T = 100°C  
C
Pulsed Collector Current (Note 2)  
Pulsed Collector Current (Note 3)  
Diode Forward Current (Note 1)  
I
200  
200  
A
A
A
LM  
I
CM  
ZZ  
= Assembly Lot Number  
I
AFGHL50T65RQDN= Specific Device Code  
F
@ T = 25°C  
54  
40  
C
@ T = 100°C  
C
Pulsed Diode Maximum Forward Current  
I
I
160  
A
A
FM  
ORDERING INFORMATION  
NonRepetitive Forward Surge Current  
FM  
(HalfSine Pulse, tp = 8.3 ms, T = 25°C)  
160  
140  
C
Device  
Package  
Shipping  
(HalfSine Pulse, tp = 8.3 ms, T = 50°C)  
C
AFGHL50T65RQDN  
TO2473L 30 Units / Rail  
(PbFree)  
Short Circuit Withstand Time  
t
ms  
SC  
V
= 15 V, V = 400 V, T 150°C  
5
GE  
CC  
J
Maximum Power Dissipation  
P
D
W
@ T = 25°C  
346  
173  
C
@ T = 100°C  
C
Operating Junction/Storage  
Temperature Range  
T , T  
55 to +175  
°C  
°C  
J
STG  
Maximum Lead Temp. for Soldering Purpos-  
es, 1/8from case for 5 s  
T
L
265  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Value limited by bond wire.  
2. V = 600 V, V = 15 V, I = 200 A, R = 9 W, Inductive Load, 100% Tested.  
CC  
GE  
C
G
3. Repetitive Rating: pulse width limited by max. Junction temperature.  
© Semiconductor Components Industries, LLC, 2020  
1
Publication Order Number:  
November, 2021 Rev. 2  
AFGHL50T65RQDN/D  
 
AFGHL50T65RQDN  
THERMAL CHARACTERISTICS  
Rating  
Symbol  
Min  
Typ  
0.33  
0.82  
Max  
0.43  
1.06  
40  
Unit  
Thermal Resistance JunctiontoCase, for IGBT  
Thermal Resistance JunctiontoCase, for Diode  
Thermal Resistance JunctiontoAmbient  
R
°C/W  
q
JC  
R
q
JC  
R
q
JA  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
OFF CHARACTERISTICS  
Collectoremitter Breakdown Voltage,  
Gateemitter Shortcircuited  
V
V
= 0 V, I = 1 mA  
BV  
CES  
650  
V
GE  
C
Temperature Coefficient of  
Breakdown Voltage  
= 0 V, I = 1 mA  
0.6  
V/°C  
GE  
C
DBV  
CES  
DT  
J
Collectoremitter Cutoff Current,  
Gateemitter Shortcircuited  
V
= 0 V, V = V  
I
30  
mA  
GE  
CE  
CES  
CES  
Gate Leakage Current,  
Collectoremitter Shortcircuited  
V
GE  
= V  
, V = 0 V  
CE  
I
400  
nA  
GES  
GES  
ON CHARACTERISTICS  
Gateemitter Threshold Voltage  
Collectoremitter Saturation Voltage  
V
= V , I = 50 mA  
V
GE(th)  
3.2  
5.0  
6.0  
V
V
GE  
CE  
C
V
GE  
= 15 V, I = 50 A, T = 25°C  
= 15 V, I = 50 A, T = 175°C  
V
CE(sat)  
1.6  
1.9  
1.81  
GE  
C
J
V
C
J
DYNAMIC CHARACTERISTICS  
Input Capacitance  
V
= 30 V, V = 0 V, f = 1 MHz  
C
2533  
81  
pF  
CE  
GE  
ies  
Output Capacitance  
C
oes  
Reverse Transfer Capacitance  
Gate Resistance  
C
11  
res  
f = 1 MHz  
R
15.06  
65  
W
g
Gate Charge Total  
V
CC  
= 400 V, I = 50 A, V = 15 V  
Q
nC  
C
GE  
g
GateEmitter Charge  
GateCollector Charge  
Q
19  
ge  
gc  
Q
18  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
T = 25°C, V = 400 V,  
t
d(on)  
38  
23  
ns  
J
I
CC  
= 25 A, R = 2.5 W,  
C
GE  
G
t
r
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
t
78  
d(off)  
t
f
82  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
1.14  
0.411  
1.58  
41  
mJ  
ns  
E
ts  
T = 25°C, V = 400 V,  
t
t
J
C
GE  
CC  
G
d(on)  
I
= 50 A, R = 2.5 W,  
t
r
40  
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
76  
d(off)  
t
f
64  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
E
on  
E
off  
3.09  
0.83  
3.92  
mJ  
E
ts  
www.onsemi.com  
2
AFGHL50T65RQDN  
ELECTRICAL CHARACTERISTICS (T = 25°C unless otherwise noted) (Continued)  
J
Parameter  
Test Conditions  
Symbol  
Min  
Typ  
Max  
Unit  
SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Turnon Delay Time  
Rise Time  
T = 175°C, V = 400 V,  
t
t
38  
27  
ns  
J
I
CC  
d(on)  
= 25 A, R = 2.5 W,  
C
GE  
G
t
r
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
92  
d(off)  
t
f
165  
1.26  
0.99  
2.26  
45  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
Turnon Delay Time  
Rise Time  
E
on  
E
off  
mJ  
ns  
E
ts  
T = 175°C, V = 400 V,  
t
t
J
C
GE  
CC  
G
d(on)  
I
= 50 A, R = 2.5 W,  
t
r
46  
V
= 15 V, Inductive Load  
Turnoff Delay Time  
Fall Time  
86  
d(off)  
t
f
133  
3.5  
Turnon Switching Loss  
Turnoff Switching Loss  
Total Switching Loss  
DIODE CHARACTERISTICS  
Diode Forward Voltage  
E
on  
E
off  
mJ  
V
1.84  
5.34  
E
ts  
I = 40 A, T = 25°C  
V
F
1.65  
1.7  
2.20  
F
J
I = 40 A, T = 175°C  
F
J
DIODE SWITCHING CHARACTERISTICS, INDUCTIVE LOAD  
Reverse Recovery Energy  
I = 40 A, dl /dt = 1000 A/ms  
E
rec  
43  
57  
mJ  
nS  
nC  
mJ  
F
F
V
= 400 V, T = 25°C  
R
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
Reverse Recovery Energy  
T
rr  
Q
589  
215  
118  
1552  
rr  
I = 40 A, dl /dt = 1000 A/ms  
E
rec  
F
F
V
R
= 400 V, T = 175°C  
J
Diode Reverse Recovery Time  
Diode Reverse Recovery Charge  
T
rr  
nS  
nC  
Q
rr  
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product  
performance may not be indicated by the Electrical Characteristics if operated under different conditions.  
www.onsemi.com  
3
AFGHL50T65RQDN  
TYPICAL CHARACTERISTICS  
200  
150  
100  
50  
200  
20 V  
T = 175°C  
J
T = 25°C  
J
15 V  
20 V  
15 V  
150  
100  
50  
12 V  
10 V  
12 V  
10 V  
V
GE  
= 8 V  
V
GE  
= 8 V  
0
0
0
1
2
3
4
5
0
1
2
3
4
5
V
CE  
, CollectorEmitter Voltage (V)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 1. Typical Output Characteristics  
Figure 2. Typical Output Characteristics  
200  
150  
100  
50  
150  
100  
50  
T = 25°C  
J
V
GE  
= 15 V  
Common Emitter  
V
CE  
= 20 V  
T = 25°C  
J
T = 175°C  
J
T = 175°C  
J
0
0
0
1
2
3
4
5
0
2
4
6
8
10  
12  
V
GE  
, GateEmitter Voltage (V)  
V
CE  
, CollectorEmitter Voltage (V)  
Figure 3. Typical Saturation Voltage  
Characteristics  
Figure 4. Typical Transfer Characteristics  
3.5  
3
100000  
10000  
1000  
100  
10  
Common Emitter  
= 15 V  
C
V
iss  
GE  
I
= 100 A  
C
2.5  
2
C
oss  
I
I
= 50 A  
= 25 A  
C
C
C
rss  
1.5  
f = 1 MHz  
= 0 V  
1
V
GE  
0.1  
1
100  
50  
0
50  
100  
150  
200  
0.1  
1
10 30  
T , CollectorEmitter Case Temperature (5C)  
C
V
CE  
, CollectortoEmitter Voltage (V)  
Figure 5. Saturation Voltage vs. Case Temperature  
at Variant Current Level  
Figure 6. Capacitance Characteristics  
www.onsemi.com  
4
AFGHL50T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
200  
300  
100  
10 ms  
t
d(on)  
100 ms  
100  
DC  
10  
1
10 ms  
t
r
1 ms  
Notes:  
1. T = 25°C  
V
= 400 V, V = 15 V  
CC GE  
= 50 A  
I
C
10  
C
0
2. T = 175°C  
T = 25°C  
J
J
3. Single Pulse  
T = 175°C  
J
0.1  
1
10  
100  
1000  
0
0
0
10  
20  
30  
40  
50  
150  
50  
V
, CollectorEmitter Voltage (V)  
CE  
R , Gate Resistance (W)  
G
Figure 7. SOA Characteristics  
Figure 8. Turnon Characteristics vs.  
Gate Resistance  
1000  
100  
10  
200  
100  
V
= 400 V, V = 15 V  
GE  
CC  
t
r
I
C
= 50 A  
T = 25°C  
T = 175°C  
t
J
d(off)  
J
t
d(on)  
V
= 400 V, V = 15 V  
GE  
= 50 A  
T = 25°C  
T = 175°C  
CC  
I
C
t
f
J
J
10  
0
10  
20  
30  
40  
50  
30  
60  
90  
120  
R , Gate Resistance (W)  
G
I , Collector Current (A)  
C
Figure 9. Turnoff Characteristics vs.  
Figure 10. Turnon Characteristics vs.  
Gate Resistance  
Collector Current  
500  
100  
10  
5
T = 25°C  
T = 175°C  
J
E
on  
J
t
f
t
d(off)  
V
R
= 400 V, V = 15 V  
= 2.5 W  
T = 25°C  
T = 175°C  
E
CC  
GE  
off  
G
J
J
V
= 400 V, V = 15 V, I = 50 A  
CC  
GE  
C
10  
0.5  
10  
20  
30  
40  
0
50  
100  
150  
I , Collector Current (A)  
C
R , Gate Resistance (W)  
G
Figure 11. Turnoff Characteristics vs.  
Figure 12. Switching Loss vs. Gate Resistance  
Collector Current  
www.onsemi.com  
5
AFGHL50T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
100  
10  
1
300  
V
= 400 V, V = 15 V  
GE  
= 50 A  
CC  
T = 25°C  
T = 175°C  
J
J
I
C
E
on  
250  
200  
150  
100  
50  
T = 25°C  
J
T = 175°C  
J
E
off  
0
0.1  
0
1
2
3
4
5
0
50  
100  
150  
V , Forward Voltage (V)  
F
I , Collector Current (A)  
C
Figure 14. Forward Characteristics  
Figure 13. Switching Loss vs. Collector Current  
50  
40  
30  
20  
10  
0
300  
250  
200  
150  
100  
50  
T = 25°C  
T = 175°C  
J
T = 25°C  
J
T = 175°C  
J
J
0
100  
100  
300  
500  
700  
900  
1100 1300 1500  
300  
500  
700  
900 1100 1300 1500  
dI /dt, Diode Current Slope (A/ms)  
F
dI /dt, Diode Current Slope (A/ms)  
F
Figure 15. Reverse Recovery Current  
Figure 16. Reverse Recovery Time  
3
2
1
0
T = 25°C  
T = 175°C  
J
J
100  
300  
500  
700  
900  
1100 1300 1500  
dI /dt, Diode Current Slope (A/ms)  
F
Figure 17. Stored Charge  
www.onsemi.com  
6
AFGHL50T65RQDN  
TYPICAL CHARACTERISTICS (Continued)  
0.6  
0.1  
0.5  
0.2  
P
DM  
0.1  
0.05  
t
1
t
2
0.02  
Duty Factor, D = t / t  
1
× Z  
2
0.01  
Peak T = P  
+ T  
q
J
DM  
JC C  
0.01  
Single Pulse  
R
R
2
1
i:  
1
2
3
4
ri[K/W]: 0.01067  
0.1059  
0.1465  
0.09146  
t[s]:  
3  
1.764E5 8.974E5 2.403E3 1.228E2  
C = t / R  
C = t / R  
2 2 2  
1
1
1
0.001  
5  
4  
2  
1  
0
1
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
10  
10  
10  
Figure 18. Transient Thermal Impedance of IGBT  
10  
1
0.5  
P
DM  
0.2  
0.1  
t
1
0.1  
t
2
0.05  
0.02  
Duty Factor, D = t / t  
1
× Z  
2
Peak T = P  
+ T  
q
J
DM  
JC C  
0.01  
R
R
2
Single Pulse  
0.01  
1
i:  
1
2
3
4
ri[K/W]: 0.03124  
0.2277  
0.3325  
0.1964  
t[s]:  
3  
3.230E5 9.271E5 3.987E3 3.126E2  
C = t / R  
C = t / R  
2 2 2  
1
1
1
0.001  
5  
4  
2  
1  
0
1
10  
10  
10  
10  
Rectangular Pulse Duration (s)  
10  
10  
10  
Figure 19. Transient Thermal Impedance of Diode  
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7
AFGHL50T65RQDN  
PACKAGE DIMENSIONS  
TO2473LD  
CASE 340CX  
ISSUE O  
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8
AFGHL50T65RQDN  
onsemi,  
, and other names, marks, and brands are registered and/or common law trademarks of Semiconductor Components Industries, LLC dba “onsemi” or its affiliates  
and/or subsidiaries in the United States and/or other countries. onsemi owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property.  
A listing of onsemi’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/PatentMarking.pdf. onsemi reserves the right to make changes at any time to any  
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information, product features, availability, functionality, or suitability of its products for any particular purpose, nor does onsemi assume any liability arising out of the application or use  
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and applications using onsemi products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information  
provided by onsemi. “Typical” parameters which may be provided in onsemi data sheets and/or specifications can and do vary in different applications and actual performance may  
vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. onsemi does not convey any license  
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