2SMES-01_11 [OMRON]

RF MEMS Switch; RF MEMS开关
2SMES-01_11
型号: 2SMES-01_11
厂家: OMRON ELECTRONICS LLC    OMRON ELECTRONICS LLC
描述:

RF MEMS Switch
RF MEMS开关

开关
文件: 总8页 (文件大小:539K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
2RFSMEMMS SEwitSch -01  
Miniature, 10 GHz Band (typical)  
SPDT (transfer contacts) RF MEMS Switch  
• Superior high-frequency characteristics at  
10 GHz typical/8 GHz rated (50 Ω)  
Isolation of 30 dB  
Insertion loss of 1 dB  
• Ultra-miniature 5.2 x 3.0 x 1.8 mm (L x W x H).  
• Contact Reliability 100 million operations  
(0.5 mA at 0.5 VDC resistive load)  
• Rated power consumption of 10 μW  
• RoHS Compliant  
Application Examples  
Automatic test equipment  
RF measurement instrument  
RF component  
Ordering Information  
Standard Models with Surface-mounting Terminals  
Classification  
Structure  
Plastic sealed  
Packaging  
JEDEC Tray  
IC Pack  
Package quantity  
Model  
2SMES-01  
2SMES-01CT  
Single-side stable  
200  
50  
Note: 1. This RF MEMS Switch was developed on the assumption of cold switching. Do not exceed ratings by hot switching (greater than 0.5 mA  
at 0.5 VDC resistive load).  
2. This RF MEMS Switch is easily damaged by static electricity. When handling the RF MEMS Switch, take countermeasures against static  
electricity. Contact OMRON for handling guidelines.  
Specifications  
Contact Ratings  
Terminal Arrangement  
Load  
Resistive load  
0.5 mA at 0.5 VDC  
100 mA at 10 VDC  
+V2  
RF_1  
Rated load  
Rated carry current  
RF: 30 dBm  
0.5 VDC  
RF_Com  
RF_2  
GND  
+V1  
Maximum switching voltage  
Maximum switching current  
0.5 mADC  
Maximum switching capacity 0.25 mW  
Note: The ratings are for a V.S.W.R of 1.2 max. at the load.  
Actuator Ratings  
Rated voltage (VDC)  
Rated current (mA)  
Must operate  
voltage (V)  
Must release  
voltage (V)  
Absolute maximum  
voltage (V)  
Rated power  
consumption (μW)  
DC 34 5%  
---  
90% max. of rated  
voltage  
10% min. of rated  
voltage  
40  
10  
RF MEMS Switch 2SMES-01  
91  
High Frequency Characteristics  
Item  
2 GHz  
8 GHz  
10 GHz  
12 GHz  
Isolation  
---  
30 dB  
1 dB  
10 dB  
---  
---  
Insertion Loss  
Return Loss  
---  
1 dB (Typ.)  
3 dB  
---  
---  
Maximum peak power  
Maximum carry power  
36 dBm  
30 dBm  
---  
---  
---  
Note: 1. The impedance of the measurement system is 50 Ω.  
2. The above values are initial values.  
3. These values are for a V.S.W.R. of 1.2 max. at the load.  
Characteristics  
Item  
Single-side stable model  
2SMES-01  
Contact resistance  
Operating time  
Release time  
1500 mΩ max.  
100 μs max.  
100 μs max.  
Insulation  
resistance  
V-GND  
100 MΩ (at 40 VDC)  
100 MΩ (at 100 VDC)  
10 Hz to 500 Hz 10 G  
10 Hz to 500 Hz 10 G  
100 G  
others  
Vibration  
resistance  
Destruction  
Malfunction  
Destruction  
Malfunction  
Mechanical  
Electrical  
Shock  
resistance  
100 G  
Life  
expectancy  
100,000,000 Operations min.  
100,000,000 Operations min.  
100 V (Human body model)  
ESD  
Ambient temperature  
Ambient humidity  
Weight  
Operating: 20°C to 85°C (with no icing or condensation)  
Operating: 5% to 85%  
Approx. 0.1 g  
Note: 1. The above values are initial values.  
2. The contact resistance was measured with 10 mA at 1 VDC with a voltage drop method.  
92  
RF MEMS Switch 2SMES-01  
Engineering Data (for reference)  
High Frequency Characteristics  
Insertion Loss  
Isolation  
Average value (initial)  
Average value (initial)  
0
0.0  
10  
0.5  
20  
30  
40  
50  
60  
70  
80  
1.0  
(dB)  
(dB)  
1.5  
2.0  
2.5  
3.0  
0
3
6
9
12  
15  
0
3
6
9
12  
15  
Frequency (GHz)  
Frequency (GHz)  
Return Loss  
Average value (initial)  
0
10  
20  
(dB)  
30  
40  
50  
0
3
6
9
12  
15  
Frequency (GHz)  
Note: 1. Ambient temperature condition: 23°C  
2. These high-frequency characteristics are measured with RF probe (without a mounting board).  
3. The high-frequency characteristics depend on the mounting board. Be sure to check operation including durability in actual equipment  
before use.  
RF MEMS Switch 2SMES-01  
93  
Electrical Endurance (Contact Resistance Shift)  
1000  
0.5 mA at 0.5 mVDC, Hot switch  
800  
600  
400  
200  
0
200  
400  
600  
800  
1000  
N = 125 Samples (250 contacts)  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Operating cycles (x 106 operations)  
Electrical Endurance (Pickup Voltage/Release Voltage)  
35  
Must Operate Voltage (30.6 V = 90%)  
30  
25  
20  
15  
Operate Voltage (Ave):  
10  
N = 125 Samples (250 contacts)  
Release Voltage (Ave):  
5
0
Must Release Voltage (3.4 V = 10%)  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
Operating cycles (Million operations)  
Ambient Temperature vs. Pickup voltage/Release Voltage  
34  
32  
30  
Pickup Voltage  
Release Voltage  
28  
26  
24  
22  
20  
18  
16  
N = 8 Samples  
80 90 100  
30 20 10  
0
10  
20  
30  
40  
50  
60  
70  
Ambient Temperature (°C)  
94  
RF MEMS Switch 2SMES-01  
Recommended Soldering Method  
The thickness of the solder paste is to be applied between 150 and  
200 μm and the land pattern should be based on OMRON's recom-  
mended PCB pattern.  
To maintain the correct soldering joint shown in the following dia-  
gram, we recommend applying solder with the soldering conditions  
shown on the left.  
T4  
T3  
Check the soldering in the actual mounting conditions before use.  
T2  
T1  
When washing the product after soldering the RF MEMS Switch to  
a print circuit board, use a water-based solvent or alcohol-based  
solvent and keep the solvent temperature to less than 40°C.  
Do not put the RF MEMS Switch in a cold cleaning bath immedi-  
ately after soldering.  
t1  
t2  
Preheating  
Soldering  
Time (s)  
Preheating (T1 to T2, t1)  
150°C to 180°C  
Measuring position/Item  
Terminal  
Soldering (T3, t2)  
230°C min.  
Peak value (T4)  
250°C max.  
120 s max.  
30 s max.  
Upper surface of case  
---  
---  
255°C max.  
Example of Drive Circuit for RF MEMS Switch  
+Vcc  
INPUT 1  
Vcont_1  
RF_1  
R
RF_com  
RF_2  
R
INPUT 2  
DRIVER IC  
Vcont_2  
2SMES-01  
Note: 1. Operate the driving voltage with the high-side switch (Vcont_1 & Vcont_2, not ground).  
2. It is necessary to discharge the charge that accumulates in the electrostatic actuator to turn off the RF MEMS Switch because this product  
is a MEMS Switch of an electrostatic drive type. Install the electrical discharge circuit in the drive circuit of the RF MEMS Switch with a  
resistance of 1 MΩ or less. Without an electrical discharge circuit, the RF MEMS Switch might not turn off, and the contacts could stick.  
For Reference Only  
High frequency characteristics - method and substrate for measurement  
Agilent N5230  
Vector Network  
Analyzer  
2SMES-01  
Note: Substrate: t = 1.6 mm Rogers 4350B (Dielectric constant at 10 GHz: 3.48)  
RF MEMS Switch 2SMES-01  
95  
Dimensions  
Note: All units are in millimeters unless otherwise indicated.  
2SMES-01  
Mounting PAD Dimensions  
12-Terminal Land Grid Array (LGA)  
(Top View)  
0.7  
0.7  
3.6  
2.65  
0.1  
5.2  
1.35  
0.45  
No.11  
No.7  
0.7  
0.1  
3
0.6  
1.6  
0.6  
0.45  
0.45  
1 pin mark  
1.4  
0.7  
0.15  
1.85  
0.45  
No.1  
No.5  
1
2.2  
1.1  
2.3  
No.1  
No.5  
0.4  
0.6  
0.5  
0.4  
No. Pin Arrangement  
1
2
3
4
5
6
7
8
9
GND  
GND  
RF_com  
GND  
GND  
RF_2  
GND  
Vcont_2  
GND  
0.4  
1.7  
1.5  
0.6  
0.5  
1.45  
2.55  
3.7  
No.11  
No.7  
4.9  
10 Vcont_1  
11 GND  
12 RF_1  
Terminal Arrangement  
+V2  
RF_1  
RF_Com  
RF_2  
GND  
+V1  
Evaluation Board Model: 2SMES-01-EVBA  
6
48  
13  
3.5  
3.5  
3.5  
3.5  
12.5  
2.54  
25  
25  
20  
2.54  
12.5  
3.5  
3.5  
20  
12.5  
11.5  
23  
67  
Pattern for RF correction (open)  
Device mounting area  
Pattern for RF correction (thru)  
96  
RF MEMS Switch 2SMES-01  
Ground Plane Connections  
In case of Microstrip Line  
In case of Coplanar Waveguide  
Via to internal RF  
ground plane  
#7  
#11  
#11  
#7  
Via to Internal RF ground plane  
#5  
#5  
#1  
#1  
Surface RF ground plane  
Connect ALL RF ground pads to the  
surface RF ground plane directly.  
Connect EACH RF ground pad to the  
internal RF ground plane through the  
via placed to the RF ground pad.  
*RF Ground Pad is designated as  
Safety Precautions  
Precautions for Correct Use  
Turn off power when doing the exchange and the wiring work of the  
RF MEMS Switch.  
Long-term, Continuous ON Contacts  
Using the RF MEMS Switch in a circuit where the RF MEMS Switch  
will be ON continuously for long periods (more than 24 hours)  
(rather than switching) can lead to unstable contacts. If a single-  
side stable model must be used in this kind of circuit, we recom-  
mend adding fail-safe circuits in case the contact fails.  
Do not touch the terminal of the RF MEMS Switch when energized.  
RF MEMS Switch Handling  
Use the RF MEMS Switch as soon as possible after opening the  
moisture-proof package (within one week). If the RF MEMS Switch  
is left for a long time after opening the moisture-proof package, the  
appearance may suffer and seal failure may occur after the solder  
mounting process. To store the RF MEMS Switch after opening the  
moisture-proof package, place it into the original package and seal  
the package with adhesive tape.  
Claw Securing Force During Automatic  
Mounting  
During automatic insertion of RF MEMS Switches, be sure to set  
the securing force of each claw to the following so that the RF  
MEMS Switch's characteristics will be maintained.  
When washing the product after soldering the RF MEMS Switch to  
a print circuit board, use a water-based solvent or alcohol-based  
solvent and keep the solvent temperature to less than 40°C. Do not  
put the RF MEMS Switch in a cold cleaning bath immediately after  
soldering.  
Direction C: 2.0 N max.  
Do not use an Ultrasonic wash.  
This RF MEMS Switch is easily damaged by static electricity. When  
handling the RF MEMS Switch, take countermeasure against static  
electricity (100 V or less). Contact OMRON for additional guide-  
lines.  
When handling the RF MEMS Switch, do not drop.  
Do not apply force resulting in the product to transform and change  
in quality.  
Environmental Conditions for Usage,  
Storage, and Transport  
Avoid direct sunlight when using, storing, or transporting the RF  
MEMS Switch and maintain normal temperature, humidity, and  
pressure conditions.  
Avoid caustic gases when using, storing, or transporting the RF  
MEMS Switch.  
Coating  
Do not coat the RF MEMS Switch when it is mounted to the print  
circuit board. Do not wash the print circuit board after the RF  
MEMS Switch is mounted using detergent containing silicone. Oth-  
erwise, the detergent may remain on the surface of the RF MEMS  
Switch.  
RF MEMS Switch 2SMES-01  
97  
All sales are subject to Omron Electronic Components LLC standard terms and conditions of sale, which  
can be found at http://www.components.omron.com/components/web/webfiles.nsf/sales_terms.html  
ALL DIMENSIONS SHOWN ARE IN MILLIMETERS.  
To convert millimeters into inches, multiply by 0.03937. To convert grams into ounces, multiply by 0.03527.  
OMRON ON-LINE  
Global - http://www.omron.com  
USA - http://www.components.omron.com  
OMRON ELECTRONIC  
COMPONENTS LLC  
55 E. Commerce Drive, Suite B  
Schaumburg, IL 60173  
847-882-2288  
09/11  
Specifications subject to change without notice  
Printed in USA  
Cat. No. X301-E-1b  
RF MEMS Switch 2SMES-01  

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