MMG3010NT1 [NXP]

0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, 4.5 X 2.5 MM, 1.5 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-89, CASE 1514-02, 4 PIN;
MMG3010NT1
型号: MMG3010NT1
厂家: NXP    NXP
描述:

0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, 4.5 X 2.5 MM, 1.5 MM HEIGHT, ROHS COMPLIANT, PLASTIC, SOT-89, CASE 1514-02, 4 PIN

放大器 射频 微波 功率放大器
文件: 总15页 (文件大小:360K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Document Number: MMG3010NT1  
Rev. 5, 3/2008  
Freescale Semiconductor  
Technical Data  
Heterojunction Bipolar Transistor  
(InGaP HBT)  
Broadband High Linearity Amplifier  
MMG3010NT1  
The MMG3010NT1 is a General Purpose Amplifier that is internally  
input and output matched. It is designed for a broad range of Class A,  
small-signal, high linearity, general purpose applications. It is suitable  
for applications with frequencies from 0 to 6000 MHz such as Cellular,  
PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general  
small-signal RF.  
0-6000 MHz, 15 dB  
17 dBm  
Features  
InGaP HBT  
Frequency: 0 to 6000 MHz  
P1dB: 17 dBm @ 900 MHz  
Small-Signal Gain: 15 dB @ 900 MHz  
Third Order Output Intercept Point: 31 dBm @ 900 MHz  
Single 5 Volt Supply  
Internally Matched to 50 Ohms  
Low Cost SOT-89 Surface Mount Package  
RoHS Compliant  
1
2
3
CASE 1514-02, STYLE 1  
SOT-89  
In Tape and Reel. T1 Suffix = 1000 Units per 12 mm, 7 inch Reel.  
PLASTIC  
Table 1. Typical Performance (1)  
Table 2. Maximum Ratings  
Characteristic  
Symbol 900 2140 3500 Unit  
Rating  
Supply Voltage  
Symbol  
Value  
Unit  
V
MHz MHz  
MHz  
V
7
300  
CC  
CC  
Small-Signal Gain  
(S21)  
G
15  
-15  
-25  
17  
14  
-17  
-25  
16.5  
30  
12  
dB  
dB  
dB  
p
Supply Current  
I
mA  
dBm  
°C  
RF Input Power  
P
10  
in  
Input Return Loss  
(S11)  
IRL  
ORL  
P1db  
IP3  
-22  
-15  
Storage Temperature Range  
T
stg  
-65 to +150  
150  
(2)  
Junction Temperature  
T
°C  
Output Return Loss  
(S22)  
J
2. For reliable operation, the junction temperature should not  
exceed 150°C.  
Power Output @1dB  
Compression  
15.5 dBm  
Third Order Output  
Intercept Point  
31  
28  
dBm  
1. V = 5 Vdc, T = 25°C, 50 ohm system  
CC  
C
Table 3. Thermal Characteristics (V = 5 Vdc, I = 54 mA, T = 25°C)  
CC  
CC  
C
(3)  
Characteristic  
Symbol  
Value  
Unit  
Thermal Resistance, Junction to Case  
R
θ
JC  
83  
°C/W  
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.  
Select Documentation/Application Notes - AN1955.  
© Freescale Semiconductor, Inc., 2005-2009. All rights reserved.  
Table 4. Electrical Characteristics (V = 5 Vdc, 900 MHz, T = 25°C, 50 ohm system, in Freescale Application Circuit)  
CC  
C
Characteristic  
Symbol  
Min  
14  
Typ  
15  
Max  
Unit  
dB  
Small-Signal Gain (S21)  
Input Return Loss (S11)  
Output Return Loss (S22)  
G
p
IRL  
ORL  
P1dB  
IP3  
-15  
-25  
17  
dB  
dB  
Power Output @ 1dB Compression  
Third Order Output Intercept Point  
Noise Figure  
dBm  
dBm  
dB  
31  
NF  
4.5  
54  
(1)  
Supply Current  
I
46  
63  
mA  
V
CC  
(1)  
Supply Voltage  
V
5
CC  
1. For reliable operation, the junction temperature should not exceed 150°C.  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
2
Table 5. Functional Pin Description  
2
Pin  
Pin Function  
Number  
1
2
3
RF  
in  
Ground  
RF /DC Supply  
out  
1
2
3
Figure 1. Functional Diagram  
Table 6. ESD Protection Characteristics  
Test Methodology  
Class  
Human Body Model (per JESD 22-A114)  
Machine Model (per EIA/JESD 22-A115)  
Charge Device Model (per JESD 22-C101)  
1A (Minimum)  
A (Minimum)  
IV (Minimum)  
Table 7. Moisture Sensitivity Level  
Test Methodology  
Rating  
Package Peak Temperature  
Unit  
Per JESD 22-A113, IPC/JEDEC J-STD-020  
1
260  
°C  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
3
50 OHM TYPICAL CHARACTERISTICS  
0
20  
15  
10  
5
T = 85°C  
C
25°C  
−10  
S11  
-40°C  
−20  
S22  
−30  
V
I
= 5 Vdc  
= 54 mA  
CC  
V
= 5 Vdc  
CC  
CC  
−40  
0
1
2
3
4
0
1
2
3
4
f, FREQUENCY (GHz)  
f, FREQUENCY (GHz)  
Figure 2. Small-Signal Gain (S21) versus  
Frequency  
Figure 3. Input/Output Return Loss versus  
Frequency  
17  
16  
15  
14  
19  
18  
17  
16  
15  
14  
13  
12  
900 MHz  
2140 MHz  
1960 MHz  
13 2600 MHz  
12  
3500 MHz  
V
= 5 Vdc  
= 54 mA  
CC  
11  
10  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
I
CC  
0.5  
1
1.5  
2
2.5  
3
3.5  
8
9
10  
11  
12  
13  
14  
15  
16  
P
, OUTPUT POWER (dBm)  
out  
f, FREQUENCY (GHz)  
Figure 4. Small-Signal Gain versus Output  
Power  
Figure 5. P1dB versus Frequency  
36  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
33  
30  
27  
24  
21  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
1 MHz Tone Spacing  
4
4.2  
4.4  
4.6  
4.8  
5
5.2  
5.4  
0
1
2
3
4
V
, COLLECTOR VOLTAGE (V)  
CC  
f, FREQUENCY (GHz)  
Figure 6. Collector Current versus Collector  
Voltage  
Figure 7. Third Order Output Intercept Point  
versus Frequency  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
4
50 OHM TYPICAL CHARACTERISTICS  
36  
33  
32  
33  
30  
31  
30  
29  
28  
27  
27  
24  
21  
V
= 5 Vdc  
f = 900 MHz  
CC  
f = 900 MHz  
1 MHz Tone Spacing  
1 MHz Tone Spacing  
26  
−40  
−20  
0
20  
40  
60  
80  
100  
4.9  
4.95  
5
5.05  
5.1  
T, TEMPERATURE (_C)  
Figure 9. Third Order Output Intercept Point  
versus Case Temperature  
V
, COLLECTOR VOLTAGE (V)  
CC  
Figure 8. Third Order Output Intercept Point  
versus Collector Voltage  
5
4
3
10  
10  
10  
−30  
−40  
−50  
−60  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
f = 900 MHz  
−70  
−80  
1 MHz Tone Spacing  
120  
125  
130  
135  
140  
145  
150  
6
−3  
0
3
9
12  
15  
T , JUNCTION TEMPERATURE (°C)  
J
P
, OUTPUT POWER (dBm)  
out  
NOTE: The MTTF is calculated with V = 5 Vdc, I = 54 mA  
CC CC  
Figure 10. Third Order Intermodulation versus  
Output Power  
Figure 11. MTTF versus Junction Temperature  
−20  
8
V
= 5 Vdc, I = 54 mA, f = 2140 MHz  
CC  
CC  
Single−Carrier W−CDMA, 3.84 MHz Channel Bandwidth  
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)  
−30  
−40  
6
4
2
0
−50  
−60  
−70  
V
= 5 Vdc  
= 54 mA  
CC  
I
CC  
0
1
2
3
4
−3  
0
3
6
9
12  
15  
f, FREQUENCY (GHz)  
P , OUTPUT POWER (dBm)  
out  
Figure 12. Noise Figure versus Frequency  
Figure 13. Single-Carrier W-CDMA Adjacent  
Channel Power Ratio versus Output Power  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
5
50 OHM APPLICATION CIRCUIT: 40-300 MHz  
V
SUPPLY  
R1  
C3  
C4  
Z5  
L1  
RF  
OUTPUT  
RF  
INPUT  
DUT  
V
Z3  
Z4  
Z1  
Z2  
C1  
C2  
CC  
Z1, Z5  
Z2  
Z3  
0.347x 0.058Microstrip  
0.575x 0.058Microstrip  
0.172x 0.058Microstrip  
Z4  
PCB  
0.403x 0.058Microstrip  
Getek Grade ML200C, 0.031, ε = 4.1  
r
Figure 14. 50 Ohm Test Circuit Schematic  
20  
10  
0
S21  
R1  
C4  
C3  
L1  
−10  
−20  
−30  
−40  
S11  
S22  
C2  
C1  
V
= 5 Vdc  
= 54 mA  
CC  
MMG30XX  
Rev 2  
I
CC  
0
100  
200  
300  
400  
500  
f, FREQUENCY (MHz)  
Figure 15. S21, S11 and S22 versus Frequency  
Figure 16. 50 Ohm Test Circuit Component Layout  
Table 8. 50 Ohm Test Circuit Component Designations and Values  
Part  
Description  
0.01 μF Chip Capacitors  
Part Number  
C0603C103J5RAC  
C0603C102J5RAC  
BK2125HM471-T  
ERJ3GEY0R00V  
Manufacturer  
Kemet  
C1, C2, C3  
C4  
L1  
R1  
1000 pF Chip Capacitor  
470 nH Chip Inductor  
0 W Chip Resistor  
Kemet  
Taiyo Yuden  
Panasonic  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
6
50 OHM APPLICATION CIRCUIT: 300-3600 MHz  
V
SUPPLY  
R1  
C3  
C4  
Z5  
L1  
RF  
OUTPUT  
RF  
INPUT  
DUT  
V
Z3  
Z4  
Z1  
Z2  
C1  
C2  
CC  
Z1, Z5  
Z2  
Z3  
0.347x 0.058Microstrip  
0.575x 0.058Microstrip  
0.172x 0.058Microstrip  
Z4  
PCB  
0.403x 0.058Microstrip  
Getek Grade ML200C, 0.031, ε = 4.1  
r
Figure 17. 50 Ohm Test Circuit Schematic  
20  
10  
0
S21  
R1  
C4  
C3  
L1  
−10  
−20  
S11  
S22  
C2  
C1  
−30  
−40  
V
= 5 Vdc  
= 54 mA  
CC  
MMG30XX  
Rev 2  
I
CC  
300  
800  
1300  
1800  
2300  
2800  
3300  
3800  
f, FREQUENCY (MHz)  
Figure 18. S21, S11 and S22 versus Frequency  
Figure 19. 50 Ohm Test Circuit Component Layout  
Table 9. 50 Ohm Test Circuit Component Designations and Values  
Part  
Description  
150 pF Chip Capacitors  
Part Number  
C0603C151J5RAC  
C0603C103J5RAC  
C0603C102J5RAC  
HK160856NJ-T  
Manufacturer  
Kemet  
C1, C2  
C3  
0.01 μF Chip Capacitor  
1000 pF Chip Capacitor  
56 nH Chip Inductor  
0 W Chip Resistor  
Kemet  
C4  
Kemet  
L1  
Taiyo Yuden  
Panasonic  
R1  
ERJ3GEY0R00V  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
7
50 OHM TYPICAL CHARACTERISTICS  
Table 10. Common Emitter S-Parameters (V = 5 Vdc, I = 54 mA, T = 25°C, 50 Ohm System)  
CC  
CC  
C
S
S
S
S
22  
11  
21  
12  
f
MHz  
|S  
|
11  
∠ φ  
|S  
|
21  
∠ φ  
|S  
|
12  
∠ φ  
|S |  
22  
∠ φ  
100  
150  
0.18961  
0.18946  
0.18931  
0.18916  
0.18900  
0.18887  
0.18873  
0.18856  
0.18844  
0.18829  
0.18813  
0.18799  
0.18783  
0.18769  
0.18753  
0.18738  
0.18723  
0.18703  
0.18689  
0.18674  
0.18657  
0.18643  
0.18629  
0.18613  
0.18599  
0.18582  
0.18568  
0.18567  
0.18569  
0.18591  
0.18645  
0.18767  
0.18855  
0.19030  
0.19186  
0.19364  
0.19581  
0.19775  
0.20022  
0.20274  
0.20483  
0.20673  
0.21006  
0.21183  
174.356  
172.591  
170.087  
168.286  
166.103  
163.926  
161.691  
159.363  
157.207  
154.948  
152.775  
150.556  
148.43  
6.08599  
6.06991  
6.05558  
6.04027  
6.03125  
6.01832  
6.00664  
5.99750  
5.98612  
5.97231  
5.95537  
5.94078  
5.92660  
5.90891  
5.88998  
5.86905  
5.84578  
5.82588  
5.80670  
5.77963  
5.75495  
5.72982  
5.70191  
5.67762  
5.65132  
5.62394  
5.59479  
5.56625  
5.54822  
5.52432  
5.49674  
5.46526  
5.43646  
5.40925  
5.38177  
5.35341  
5.32341  
5.29221  
5.25998  
5.22900  
5.20224  
5.16895  
5.13639  
5.10466  
176.121  
173.709  
171.476  
169.492  
167.447  
165.299  
163.288  
161.184  
159.055  
157.036  
154.979  
152.921  
150.895  
148.835  
146.803  
144.751  
142.751  
140.772  
138.776  
136.782  
134.777  
132.79  
0.10045  
0.10051  
0.10055  
0.10060  
0.10065  
0.10069  
0.10073  
0.10078  
0.10085  
0.10090  
0.10098  
0.10111  
0.10103  
0.10115  
0.10113  
0.10130  
0.10126  
0.10142  
0.10134  
0.10156  
0.10146  
0.10159  
0.10169  
0.10184  
0.10183  
0.10196  
0.10201  
0.10211  
0.10220  
0.10258  
0.10272  
0.10283  
0.10301  
0.10315  
0.10333  
0.10340  
0.10356  
0.10384  
0.10401  
0.10405  
0.10413  
0.10441  
0.10441  
0.10468  
-1.147  
0.01890  
0.01961  
0.02022  
0.02108  
0.02178  
0.02240  
0.02324  
0.02417  
0.02490  
0.02589  
0.02683  
0.02784  
0.02895  
0.03030  
0.03176  
0.03328  
0.03472  
0.03683  
0.03847  
0.04077  
0.04304  
0.04551  
0.04827  
0.05112  
0.05460  
0.05759  
0.06146  
0.06306  
0.06362  
0.06362  
0.06377  
0.06570  
0.06858  
0.07094  
0.07392  
0.07711  
0.08039  
0.08395  
0.08764  
0.09155  
0.09523  
0.09969  
0.10388  
0.10812  
-117.716  
-119.073  
-121.834  
-123.647  
-125.155  
-127.572  
-129.668  
-131.224  
-133.739  
-135.854  
-137.345  
-139.784  
-141.384  
-143.84  
-145.852  
-147.52  
-148.773  
-150.721  
-153.215  
-155.358  
-159.06  
-162.691  
-166.671  
-170.497  
-174.453  
-178.275  
178.051  
174.258  
170.85  
-1.684  
200  
-2.764  
250  
-3.23  
300  
-3.883  
350  
-4.61  
400  
-5.218  
450  
-5.914  
500  
-6.577  
550  
-7.176  
600  
-7.816  
650  
-8.444  
700  
-9.124  
750  
146.278  
144.103  
142.071  
140.126  
138.174  
136.334  
134.574  
132.862  
131.57  
-9.76  
800  
-10.388  
-11.106  
-11.715  
-12.347  
-13.049  
-13.635  
-14.317  
-14.945  
-15.594  
-16.271  
-16.958  
-17.615  
-18.236  
-18.888  
-19.552  
-20.344  
-20.962  
-21.702  
-22.327  
-23.09  
850  
900  
950  
1000  
1050  
1100  
1150  
1200  
1250  
1300  
1350  
1400  
1450  
1500  
1550  
1600  
1650  
1700  
1750  
1800  
1850  
1900  
1950  
2000  
2050  
2100  
2150  
2200  
2250  
130.147  
128.841  
127.621  
126.515  
125.418  
124.471  
123.602  
122.392  
120.668  
119.047  
117.338  
115.719  
114.043  
112.379  
110.938  
109.449  
108.079  
106.526  
105.054  
103.673  
102.263  
100.83  
130.817  
128.866  
126.933  
124.986  
123.074  
121.175  
119.257  
117.274  
115.354  
113.429  
111.53  
163.521  
160.673  
158.125  
155.716  
153.133  
151.055  
148.881  
147.016  
145.259  
143.574  
141.882  
140.434  
138.992  
137.594  
136.199  
109.673  
107.795  
105.878  
104.011  
102.117  
100.28  
-23.804  
-24.547  
-25.192  
-25.884  
-26.62  
98.422  
-27.296  
-28.065  
-28.819  
-29.517  
-30.238  
96.556  
94.728  
92.885  
91.074  
(continued)  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
8
50 OHM TYPICAL CHARACTERISTICS  
Table 10. Common Emitter S-Parameters (V = 5 Vdc, I = 54 mA, T = 25°C, 50 Ohm System) (continued)  
CC  
CC  
C
S
S
S
S
22  
11  
21  
12  
f
MHz  
|S  
|
11  
∠ φ  
|S  
|
21  
∠ φ  
|S  
|
12  
∠ φ  
|S |  
22  
∠ φ  
2300  
2350  
2400  
2450  
2500  
2550  
2600  
2650  
2700  
2750  
2800  
2850  
2900  
2950  
3000  
3050  
3100  
3150  
3200  
3250  
3300  
3350  
3400  
3450  
3500  
3550  
3600  
0.21443  
0.21661  
0.21882  
0.22193  
0.22303  
0.22524  
0.22731  
0.22921  
0.23072  
0.23259  
0.23443  
0.23625  
0.23786  
0.23979  
0.24125  
0.24422  
0.24610  
0.24792  
0.25072  
0.25383  
0.25590  
0.25874  
0.26159  
0.26531  
0.26829  
0.27180  
0.27525  
99.385  
98.005  
96.635  
95.395  
93.907  
92.5  
5.07001  
5.03818  
5.00516  
4.97224  
4.93831  
4.90747  
4.87540  
4.84438  
4.81170  
4.77720  
4.74514  
4.71210  
4.68334  
4.64992  
4.61988  
4.58846  
4.55812  
4.52495  
4.49699  
4.46681  
4.43561  
4.40430  
4.37458  
4.34458  
4.31385  
4.28470  
4.25389  
89.25  
87.453  
85.611  
83.821  
82.052  
80.256  
78.504  
76.72  
0.10472  
0.10489  
0.10502  
0.10521  
0.10527  
0.10541  
0.10567  
0.10587  
0.10582  
0.10600  
0.10623  
0.10637  
0.10648  
0.10664  
0.10700  
0.10702  
0.10736  
0.10733  
0.10748  
0.10765  
0.10784  
0.10813  
0.10814  
0.10821  
0.10846  
0.10856  
0.10871  
-30.97  
0.11217  
0.11632  
0.12050  
0.12557  
0.12957  
0.13384  
0.13842  
0.14269  
0.14690  
0.15188  
0.15645  
0.16075  
0.16529  
0.16969  
0.17439  
0.17909  
0.18404  
0.18914  
0.19427  
0.19983  
0.20478  
0.21036  
0.21586  
0.22115  
0.22678  
0.23264  
0.23850  
134.891  
133.499  
132.176  
130.946  
129.503  
128.151  
126.605  
125.06  
-31.768  
-32.469  
-33.265  
-34.008  
-34.706  
-35.467  
-36.255  
-37.021  
-37.804  
-38.579  
-39.349  
-40.152  
-41.004  
-41.819  
-42.586  
-43.392  
-44.248  
-45.078  
-45.892  
-46.753  
-47.687  
-48.565  
-49.382  
-50.314  
-51.229  
-52.108  
91.106  
89.599  
88.26  
74.931  
73.147  
71.382  
69.615  
67.904  
66.078  
64.334  
62.607  
60.863  
59.115  
57.356  
55.612  
53.877  
52.133  
50.384  
48.649  
46.916  
45.167  
43.44  
123.585  
122.036  
120.364  
118.48  
86.873  
85.515  
84.122  
82.84  
116.779  
114.827  
112.861  
111.23  
81.448  
80.072  
78.711  
77.547  
76.337  
75.174  
73.947  
72.848  
71.738  
70.666  
69.68  
109.114  
107.101  
105.076  
102.924  
100.877  
98.897  
96.818  
94.763  
68.707  
67.687  
66.773  
92.769  
90.836  
88.858  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
9
1.7  
7.62  
0.305 diameter  
2.49  
3.48  
0.58  
5.33  
2.54  
1.27  
1.27  
0.86  
0.64  
3.86  
NOTES:  
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE  
USED IN PCB LAYOUT DESIGN.  
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS  
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.  
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN  
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO  
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL  
AND RF PERFORMANCE.  
Recommended Solder Stencil  
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM  
PITCH.  
Figure 20. Recommended Mounting Configuration  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
10  
PACKAGE DIMENSIONS  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
11  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
12  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
13  
PRODUCT DOCUMENTATION  
Refer to the following documents to aid your design process.  
Application Notes  
AN1955: Thermal Measurement Methodology of RF Power Amplifiers  
AN3100: General Purpose Amplifier Biasing  
REVISION HISTORY  
The following table summarizes revisions to this document.  
Revision  
Date  
Description  
3
Mar. 2007  
Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS  
compliant part numbers, p. 6, 7  
4
5
July 2007  
Mar. 2008  
Replaced Case Outline 1514-01 with 1514-02, Issue D, p. 1, 11-13. Case updated to add missing  
dimension for Pin 1 and Pin 3.  
Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,  
p. 1  
Corrected Fig. 13, Single-Carrier W-CDMA Adjacent Channel Power Ratio versus Output Power y-axis  
(ACPR) unit of measure to dBc, p. 5  
Corrected S-Parameter table frequency column label to read “MHz” versus “GHz” and corrected  
frequency values from GHz to MHz, p. 8, 9  
Aug. 2009  
Data sheet archived. Part no longer manufactured.  
MMG3010NT1  
RF Device Data  
Freescale Semiconductor  
14  
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Document Number: MMG3010NT1  
Rev. 5,3/2008

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