MMG3013NT1 [NXP]
0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, ROHS COMPLIANT, PLASTIC, CASE 1514-02, SOT- 89, 3 PIN;
| 型号： | MMG3013NT1 |
| 厂家： | 
NXP |
| 描述： | 0 MHz - 6000 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, ROHS COMPLIANT, PLASTIC, CASE 1514-02, SOT- 89, 3 PIN 放大器 射频 微波 功率放大器 |
| 文件： | 总15页 (文件大小：400K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Document Number: MMG3013NT1
Rev. 7, 2/2012
Freescale Semiconductor
Technical Data
Heterojunction Bipolar Transistor
Technology (InGaP HBT)
Broadband High Linearity Amplifier
MMG3013NT1
The MMG3013NT1 is a general purpose amplifier that is internally input
matched and internally output matched. It is designed for a broad range of
Class A, small--signal, high linearity, general purpose applications. It is
suitable for applications with frequencies from 0 to 6000 MHz such as
cellular, PCS, BWA, WLL, PHS, CATV, VHF, UHF, UMTS and general
small--signal RF.
0--6000 MHz, 20 dB
20.5 dBm
InGaP HBT
Features
•
•
•
•
•
•
•
•
Frequency: 0--6000 MHz
P1dB: 20.5 dBm @ 900 MHz
Small--Signal Gain: 20 dB @ 900 MHz
Third Order Output Intercept Point: 36 dBm @ 900 MHz
Single 5 Volt Supply
Internally Matched to 50 Ohms
Cost--effective SOT--89 Surface Mount Package
In Tape and Reel. T1 Suffix = 1000 Units, 12 mm Tape Width, 7 inch Reel.
1
2
3
CASE 1514--02, STYLE 1
SOT--89
PLASTIC
Table 1. Typical Performance (1)
Table 2. Maximum Ratings
Rating
Supply Voltage
Symbol
Value
Unit
V
Characteristic
Symbol 900 2140 3500 Unit
MHz MHz
MHz
V
7
300
CC
CC
Small--Signal Gain
(S21)
G
20
17
-- 1 9
-- 9
14.5
dB
dB
p
Supply Current
I
mA
dBm
°C
RF Input Power
P
12
in
Input Return Loss
(S11)
IRL
ORL
P1dB
OIP3
-- 1 7
-- 11
-- 1 5
-- 1 2
19
Storage Temperature Range
T
stg
--65 to +150
150
(2)
Junction Temperature
T
J
°C
Output Return Loss
(S22)
dB
2. For reliable operation, the junction temperature should not
exceed 150°C.
Power Output @1dB
Compression
20.5 20.5
dBm
dBm
Third Order Output
Intercept Point
36
34
32
1. V = 5 Vdc, T = 25°C, 50 ohm system.
CC
A
Table 3. Thermal Characteristics
(3)
Characteristic
Symbol
Value
Unit
Thermal Resistance, Junction to Case
R
θ
42
°C/W
JC
Case Temperature 89°C, 5 Vdc, 90 mA, no RF applied
3. Refer to AN1955, Thermal Measurement Methodology of RF Power Amplifiers. Go to http://www.freescale.com/rf.
Select Documentation/Application Notes -- AN1955.
© Freescale Semiconductor, Inc., 2005--2008, 2012. All rights reserved.
Table 4. Electrical Characteristics (V = 5 Vdc, 900 MHz, T = 25°C, 50 ohm system, in Freescale Application Circuit)
CC
A
Characteristic
Symbol
Min
Typ
Max
Unit
Small--Signal Gain (S21)
900 MHz
2140 MHz
G
19.3
16
20
17
—
—
dB
p
Input Return Loss (S11)
Output Return Loss (S22)
IRL
ORL
P1dB
OIP3
NF
—
—
—
—
—
80
—
-- 1 7
-- 11
20.5
36
—
—
dB
dB
Power Output @ 1dB Compression
Third Order Output Intercept Point
Noise Figure
—
dBm
dBm
dB
—
4
—
(1)
Supply Current
I
90
110
—
mA
V
CC
(1)
Supply Voltage
V
5
CC
1. For reliable operation, the junction temperature should not exceed 150°C.
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
2
Table 5. Functional Pin Description
2
Pin
Pin Function
Number
1
2
3
RF
in
Ground
RF /DC Supply
out
1
2
3
Figure 1. Functional Diagram
Table 6. ESD Protection Characteristics
Test Methodology
Class
1A
Human Body Model (per JESD 22--A114)
Machine Model (per EIA/JESD 22--A115)
Charge Device Model (per JESD 22--C101)
A
IV
Table 7. Moisture Sensitivity Level
Test Methodology
Rating
Package Peak Temperature
Unit
Per JESD 22--A113, IPC/JEDEC J--STD--020
1
260
°C
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
3
50 OHM TYPICAL CHARACTERISTICS
0
25
20
15
10
T
= 85°C
C
S22
25°C
-- 1 0
-- 2 0
-- 3 0
-- 4 0 °C
S11
V
= 5 Vdc
CC
V
= 5 Vdc
CC
-- 4 0
0
1
2
3
4
0
1
2
3
4
f, FREQUENCY (GHz)
f, FREQUENCY (GHz)
Figure 2. Small--Signal Gain (S21) versus
Frequency
Figure 3. Input/Output Return Loss versus
Frequency
23
21
23
22
21
20
19
18
17
16
900 MHz
19
17
15
2140 MHz
1960 MHz
2600 MHz
3500 MHz
13
11
9
V
= 5 Vdc
3
V
= 5 Vdc
18
CC
CC
0.5
1
1.5
2
2.5
3.5
10
12
14
16
20
P
, OUTPUT POWER (dBm)
f, FREQUENCY (GHz)
out
Figure 4. Small--Signal Gain versus Output
Power
Figure 5. P1dB versus Frequency
39
180
160
140
120
100
80
36
33
30
27
24
60
40
V
= 5 Vdc
CC
20
0
100 kHz Tone Spacing
4
4.2
4.4
4.6
4.8
5
5.2
5.4
0
1
2
3
4
V
, COLLECTOR VOLTAGE (V)
f, FREQUENCY (GHz)
CC
Figure 6. Collector Current versus Collector
Voltage
Figure 7. Third Order Output Intercept Point
versus Frequency
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
4
50 OHM TYPICAL CHARACTERISTICS
39
38
37
36
33
36
35
34
33
32
30
27
24
V
= 5 Vdc
CC
f = 900 MHz
1 MHz Tone Spacing
f = 900 MHz
1 MHz Tone Spacing
31
-- 4 0
-- 2 0
0
2 0
4 0
6 0
8 0
100
4.9
4.95
5
5.05
5.1
T, TEMPERATURE (_C)
V
, COLLECTOR VOLTAGE (V)
CC
Figure 9. Third Order Output Intercept Point
versus Case Temperature
Figure 8. Third Order Output Intercept Point
versus Collector Voltage
5
4
3
10
10
10
-- 3 0
-- 4 0
-- 5 0
-- 6 0
-- 7 0
-- 8 0
V
= 5 Vdc
CC
f = 900 MHz
100 kHz Tone Spacing
120
125
130
135
140
145
150
14
5
8
11
17 20
T , JUNCTION TEMPERATURE (°C)
J
P
, OUTPUT POWER (dBm)
out
NOTE: The MTTF is calculated with V = 5 Vdc, I = 90 mA
Figure 10. Third Order Intermodulation Distortion
versus Output Power
CC
CC
Figure 11. MTTF versus Junction Temperature
-- 2 0
8
V
= 5 Vdc, f = 2140 MHz
CC
Single--Carrier W--CDMA, 3.84 MHz Channel Bandwidth
Input Signal PAR = 8.5 dB @ 0.01% Probability (CCDF)
-- 3 0
-- 4 0
6
4
2
0
-- 5 0
-- 6 0
-- 7 0
V
= 5 Vdc
CC
0
1
2
3
4
6
8
10
12
14
16
18
f, FREQUENCY (GHz)
P
, OUTPUT POWER (dBm)
out
Figure 12. Noise Figure versus Frequency
Figure 13. Single--Carrier W--CDMA Adjacent
Channel Power Ratio versus Output Power
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
5
50 OHM APPLICATION CIRCUIT: 40--800 MHz
V
SUPPLY
R1
C3
C4
Z5
L1
RF
OUTPUT
RF
INPUT
DUT
V
Z3
Z4
Z1
Z2
C1
C2
CC
Z1, Z5
Z2
Z3
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, ε = 4.1
r
Figure 14. 50 Ohm Test Circuit Schematic
30
20
10
0
S21
R1
C4
C3
L1
-- 1 0
-- 2 0
-- 3 0
-- 4 0
C2
C1
S22
S11
MMG30XX
Rev 2
V
= 5 Vdc
CC
0
200
400
f, FREQUENCY (MHz)
600
800
Figure 15. S21, S11 and S22 versus Frequency
Figure 16. 50 Ohm Test Circuit Component Layout
Table 8. 50 Ohm Test Circuit Component Designations and Values
Part
Description
0.01 μF Chip Capacitors
Part Number
C0603C103J5RAC
C0603C104J5RAC
C0603C105J5RAC
BK2125HM471--T
ERJ3GEY0R00V
Manufacturer
Kemet
C1, C2
C3
0.1 μF Chip Capacitor
1 μF Chip Capacitor
470 nH Chip Inductor
0 Ω Chip Resistor
Kemet
C4
Kemet
L1
Taiyo Yuden
Panasonic
R1
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
6
50 OHM APPLICATION CIRCUIT: 800--3600 MHz
V
SUPPLY
R1
C3
C4
Z5
L1
RF
OUTPUT
RF
INPUT
DUT
V
Z3
Z4
Z1
Z2
C1
C2
CC
Z1, Z5
Z2
Z3
0.347″ x 0.058″ Microstrip
0.575″ x 0.058″ Microstrip
0.172″ x 0.058″ Microstrip
Z4
PCB
0.403″ x 0.058″ Microstrip
Getek Grade ML200C, 0.031″, ε = 4.1
r
Figure 17. 50 Ohm Test Circuit Schematic
30
S21
20
10
R1
C4
C3
L1
0
C2
C1
S22
-- 1 0
-- 2 0
-- 3 0
S11
MMG30XX
Rev 2
V
= 5 Vdc
CC
800
1200
1600
2000
2400
2800
3200
3600
f, FREQUENCY (MHz)
Figure 18. S21, S11 and S22 versus Frequency
Figure 19. 50 Ohm Test Circuit Component Layout
Table 9. 50 Ohm Test Circuit Component Designations and Values
Part
Description
150 pF Chip Capacitors
Part Number
C0603C151J5RAC
C0603C104J5RAC
C0603C105J5RAC
HK160856NJ--T
Manufacturer
Kemet
C1, C2
C3
0.1 μF Chip Capacitor
1 μF Chip Capacitor
56 nH Chip Inductor
0 Ω Chip Resistor
Kemet
C4
Kemet
L1
Taiyo Yuden
Panasonic
R1
ERJ3GEY0R00V
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
7
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S--Parameters (V = 5 Vdc, T = 25°C, 50 Ohm System)
CC
A
S
S
S
S
22
11
21
12
f
MHz
|S
|
11
∠ φ
|S
|
21
∠ φ
|S
|
12
∠ φ
|S |
22
∠ φ
100
150
0.162717
0.160561
0.160153
0.157910
0.155640
0.152870
0.150710
0.148730
0.145840
0.143950
0.141980
0.140120
0.138450
0.137510
0.136570
0.134433
0.132707
0.131087
0.129567
0.128275
0.127137
0.125513
0.124020
0.122379
0.121234
0.120081
0.118817
0.116609
0.115374
0.113850
0.113120
0.112080
0.111350
0.110660
0.110070
0.109570
0.108940
0.107610
0.106800
0.106240
0.104410
0.103200
0.102820
0.101220
171.108
167.971
163.027
159.994
156.091
152.178
148.189
144.135
140.465
136.404
132.557
128.67
124.924
121.228
117.62
114.245
110.998
107.842
104.859
102.209
99.637
97.509
95.409
93.482
91.761
90.16
11.479238
11.415032
11.337210
11.263950
11.200930
11.160790
11.096270
11.027770
10.957540
10.876040
10.785240
10.695820
10.604510
10.504830
10.400340
10.295550
10.186390
10.073620
9.965510
9.842290
9.725320
9.610100
9.485500
9.367530
9.251560
9.129800
9.011610
8.892430
8.772640
8.708890
8.598320
8.485180
8.379040
8.273700
8.167240
8.063390
7.958390
7.856150
7.751440
7.651320
7.553170
7.452840
7.354920
7.259510
174.775
171.459
168.606
165.874
163.101
160.282
157.597
154.845
152.097
149.449
146.811
144.176
141.59
139.003
136.446
133.89
131.409
128.963
126.525
124.132
121.744
119.381
117.045
114.76
0.069393
0.069131
0.068870
0.068640
0.068460
0.068400
0.068380
0.068210
0.068260
0.068090
0.068040
0.068000
0.067790
0.067690
0.067590
0.067520
0.067420
0.067380
0.067220
0.067050
0.066970
0.066930
0.066790
0.066840
0.066710
0.066685
0.066670
0.066687
0.066764
0.066970
0.067057
0.067090
0.067170
0.067200
0.067260
0.067320
0.067420
0.067460
0.067560
0.067600
0.067810
0.067960
0.067980
0.068230
--1.296
--1.887
--2.702
--3.308
--3.908
--4.523
--5.134
--5.794
--6.391
--6.918
--7.57
0.106264
0.112247
0.118610
0.127240
0.134977
0.144410
0.154090
0.164250
0.174550
0.185240
0.195510
0.206040
0.216910
0.227810
0.238140
0.248290
0.258400
0.268360
0.277810
0.287510
0.297010
0.306110
0.314950
0.323700
0.332570
0.339940
0.348650
0.356290
0.360061
0.364627
0.369410
0.374600
0.380650
0.386070
0.391590
0.396600
0.402290
0.407630
0.412720
0.418620
0.423200
0.428690
0.433410
0.438440
--133.221
--134.322
--135.449
--136.522
--137.648
--138.763
--139.895
--140.998
--142.085
--143.132
--144.211
--145.338
--146.461
--147.659
--148.902
--150.118
--151.55
--153.097
--154.786
--156.435
--158.367
--160.411
--162.397
--164.386
--166.443
--168.554
--170.582
--172.695
--174.724
--177.374
--179.169
179.129
177.406
175.7
200
250
300
350
400
450
500
550
600
650
--8.199
--8.743
--9.285
--9.831
--10.415
--10.866
--11.449
--11.901
--12.399
--12.949
--13.483
--13.882
--14.46
--14.928
--15.375
--15.818
--16.365
--16.815
--17.493
--17.963
--18.477
--18.984
--19.462
--19.938
--20.42
--20.891
--21.389
--21.917
--22.347
--22.888
--23.444
--23.91
--24.487
700
750
800
850
900
950
1000
1050
1100
1150
1200
1250
1300
1350
1400
1450
1500
1550
1600
1650
1700
1750
1800
1850
1900
1950
2000
2050
2100
2150
2200
2250
112.507
110.251
108.055
105.876
103.703
101.399
99.278
97.137
95.075
93.021
90.99
88.664
87.326
86.23
80.021
77.212
75.253
72.833
70.651
68.704
66.752
64.808
63.28
174.044
172.328
170.798
169.234
167.75
88.942
86.97
84.972
83.012
81.047
79.114
61.916
60.415
59.082
57.787
56.94
166.176
164.723
163.19
77.223
75.325
73.436
161.75
55.6
160.241
(continued)
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
8
50 OHM TYPICAL CHARACTERISTICS
Table 10. Common Emitter S--Parameters (V = 5 Vdc, T = 25°C, 50 Ohm System) (continued)
CC
A
S
S
S
S
22
11
21
12
f
MHz
|S
|
11
∠ φ
|S
|
21
∠ φ
|S
|
12
∠ φ
|S |
22
∠ φ
2300
2350
2400
2450
2500
2550
2600
2650
2700
2750
2800
2850
2900
2950
3000
3050
3100
3150
3200
3250
3300
3350
3400
3450
3500
3550
3600
0.100260
0.098910
0.097870
0.096530
0.095360
0.094140
0.093150
0.092180
0.091130
0.090470
0.089850
0.088790
0.088180
0.087640
0.086490
0.087170
0.086660
0.086130
0.086330
0.086760
0.086510
0.086820
0.087230
0.087680
0.087990
0.088730
0.089200
54.54
7.163530
7.072340
6.980770
6.892310
6.802480
6.719330
6.634260
6.554070
6.471630
6.392370
6.314980
6.238550
6.166300
6.088480
6.020040
5.950380
5.881680
5.814190
5.749680
5.684930
5.619060
5.557890
5.498110
5.437290
5.376810
5.319060
5.259990
71.577
69.734
67.882
66.059
64.259
62.461
60.65
0.068190
0.068480
0.068550
0.068780
0.068940
0.069120
0.069290
0.069490
0.069610
0.069850
0.070210
0.070340
0.070550
0.070750
0.071030
0.071280
0.071610
0.071920
0.072150
0.072340
0.072640
0.072800
0.073130
0.073490
0.073710
0.073970
0.074200
--24.984
--25.485
--26.108
--26.694
--27.154
--27.644
--28.295
--28.971
--29.561
--30.111
--30.649
--31.402
--32.044
--32.738
--33.388
--34.097
--34.666
--35.528
--36.302
--36.943
--37.799
--38.546
--39.319
--40.144
--40.92
0.442830
0.447010
0.451420
0.457800
0.460110
0.464930
0.469350
0.473140
0.477010
0.481850
0.485260
0.489440
0.494180
0.497180
0.501590
0.505070
0.509400
0.514040
0.518490
0.523620
0.525880
0.530230
0.534740
0.538080
0.542580
0.546650
0.550400
158.869
157.463
155.974
154.6
53.312
52.576
51.814
50.69
153.074
151.617
150.014
148.442
146.825
145.214
143.56
49.939
49.177
48.019
47.141
46.394
45.454
44.657
44.083
43.291
42.549
42.041
41.37
58.859
57.062
55.299
53.505
51.724
50.021
48.207
46.489
44.764
43.022
41.268
39.547
37.829
36.098
34.368
32.629
30.936
29.22
141.782
140.078
138.23
136.357
134.738
132.754
130.875
128.954
126.955
124.995
123.081
121.057
119.195
117.253
115.36
41.387
41.301
41.239
41.638
41.81
42.12
42.727
43.424
44.082
45.12
27.529
25.838
--41.673
--42.467
113.481
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
9
1.7
7.62
0.305 diameter
2.49
3.48
0.58
5.33
2.54
1.27
1.27
0.86
0.64
3.86
NOTES:
1. THERMAL AND RF GROUNDING CONSIDERATIONS SHOULD BE
USED IN PCB LAYOUT DESIGN.
Recommended Solder Stencil
2. DEPENDING ON PCB DESIGN RULES, AS MANY VIAS AS
POSSIBLE SHOULD BE PLACED ON THE LANDING PATTERN.
3. IF VIAS CANNOT BE PLACED ON THE LANDING PATTERN, THEN
AS MANY VIAS AS POSSIBLE SHOULD BE PLACED AS CLOSE TO
THE LANDING PATTERN AS POSSIBLE FOR OPTIMAL THERMAL
AND RF PERFORMANCE.
4. RECOMMENDED VIA PATTERN SHOWN HAS 0.381 x 0.762 MM
PITCH.
Figure 20. Recommended Mounting Configuration
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
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PACKAGE DIMENSIONS
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
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MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
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MMG3013NT1
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PRODUCT DOCUMENTATION AND SOFTWARE
Refer to the following documents and software to aid your design process.
Application Notes
•
•
AN1955: Thermal Measurement Methodology of RF Power Amplifiers
AN3100: General Purpose Amplifier and MMIC Biasing
Software
.s2p File
Development Tools
•
•
Printed Circuit Boards
For Software, do a Part Number search at http://www.freescale.com, and select the “Part Number” link. Go to the Software &
Tools tab on the part’s Product Summary page to download the respective tool.
REVISION HISTORY
The following table summarizes revisions to this document.
Revision
Date
Description
4
Mar. 2007
•
•
Corrected and updated Part Numbers in Tables 8 and 9, Component Designations and Values, to RoHS
compliant part numbers, p. 6, 7
5
6
July 2007
Mar. 2008
Replaced Case Outline 1514--01 with 1514--02, Issue D, p. 1, 11--13. Case updated to add missing
dimension for Pin 1 and Pin 3.
•
•
•
Removed Footnote 2, Continuous voltage and current applied to device, from Table 2, Maximum Ratings,
p. 1
Corrected Fig. 13, Single--Carrier W--CDMA Adjacent Channel Power Ratio versus Output Power y--axis
(ACPR) unit of measure to dBc, p. 5
Corrected S--Parameter table frequency column label to read “MHz” versus “GHz” and corrected
frequency values from GHz to MHz, p. 8, 9
7
Feb. 2012
•
•
Corrected temperature at which ThetaJC is measured from 25°C to 89°C and added “no RF applied” to
Thermal Characteristics table to indicate that thermal characterization is performed under DC test with no
RF signal applied, p. 1
Table 6, ESD Protection Characterization, removed the word “Minimum” after the ESD class rating. ESD
ratings are characterized during new product development but are not 100% tested during production. ESD
ratings provided in the data sheet are intended to be used as a guideline when handling ESD sensitive
devices, p. 3
•
•
Removed I bias callout from applicable graphs and Table 10, Common Emitter S--Parameters heading
CC
as bias is not a controlled value, p. 4--9
Added .s2p File and printed Circuit Boards availability to Product Software, p. 14
MMG3013NT1
RF Device Data
Freescale Semiconductor, Inc.
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Document Number: MMG3013NT1
Rev. 7,2/2012
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