BF862,235 [NXP]

BF862 - N-channel junction FET TO-236 3-Pin;
BF862,235
型号: BF862,235
厂家: NXP    NXP
描述:

BF862 - N-channel junction FET TO-236 3-Pin

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DISCRETE SEMICONDUCTORS  
DATA SHEET  
ook, halfpage  
BF862  
N-channel junction FET  
Product specification  
2000 Jan 05  
Supersedes data of 1999 Jun 29  
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
FEATURES  
PINNING SOT23  
PIN  
High transition frequency for excellent sensitivity in  
AM car radios  
DESCRIPTION  
1
2
3
source  
High transfer admittance.  
drain  
gate  
APPLICATIONS  
Pre-amplifiers in AM car radios.  
handbook, age  
2
1
DESCRIPTION  
d
s
Silicon N-channel symmetrical junction field-effect  
transistor in a SOT23 package. Drain and source are  
interchangeable.  
g
3
Top view  
MAM036  
Marking code: 2Ap.  
Fig.1 Simplified outline and symbol.  
QUICK REFERENCE DATA  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS MIN.  
TYP. MAX. UNIT  
20  
V
VGSoff  
IDSS  
Ptot  
yfs  
gate-source cut-off voltage  
drain-source current  
total power dissipation  
transfer admittance  
0.3  
10  
0.8  
1.2  
25  
V
mA  
mW  
mS  
°C  
Ts 90 °C  
300  
35  
45  
Tj  
junction temperature  
150  
CAUTION  
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport  
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.  
2000 Jan 05  
2
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN. MAX. UNIT  
20  
V
VDG  
VGS  
IDS  
IG  
drain-gate voltage  
20  
V
gate-source voltage  
drain-source current  
forward gate current  
total power dissipation  
storage temperature  
junction temperature  
20  
40  
V
mA  
mA  
mW  
10  
Ptot  
Tstg  
Tj  
Ts 90 °C; note 1  
300  
65  
+150 °C  
150  
°C  
Note  
1. Main heat transfer is via the gate lead.  
THERMAL CHARACTERISTICS  
SYMBOL  
Rth j-s  
PARAMETER  
CONDITIONS  
VALUE  
200  
UNIT  
thermal resistance from junction to soldering  
point  
note 1  
K/W  
Note  
1. Soldering point of the gate lead.  
MCD808  
400  
handbook, halfpage  
P
tot  
(mW)  
300  
200  
100  
0
0
40  
80  
120  
160  
T
(°C)  
s
Fig.2 Power derating curve.  
2000 Jan 05  
3
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
STATIC CHARACTERISTICS  
Tj = 25 °C; unless otherwise specified.  
SYMBOL  
V(BR)GSS  
PARAMETER  
CONDITIONS  
MIN.  
20  
TYP.  
MAX.  
UNIT  
gate-source breakdown voltage IGS = 1 µA; VDS = 0  
V
VGS  
gate-source forward voltage  
gate-source cut-off voltage  
reverse gate current  
VDS = 0; IG = 1 mA  
VDS = 8 V; ID = 1 µA  
VGS = 15 V; VDS = 0  
VGS = 0; VDS = 8 V  
1
V
VGSoff  
IGSS  
IDSS  
0.3  
0.8  
1.2  
1  
25  
V
nA  
mA  
drain-source current  
10  
DYNAMIC CHARACTERISTICS  
Common source; Tamb = 25 °C; VGS = 0; VDS = 8 V; unless otherwise specified.  
SYMBOL  
yfs  
PARAMETER  
CONDITIONS  
Tj = 25 °C  
MIN.  
TYP.  
MAX.  
UNIT  
common source forward transfer  
admittance  
35  
45  
mS  
gos  
Ciss  
Crss  
en  
common source output conductance  
input capacitance  
Tj = 25 °C  
f = 1 MHz  
f = 1 MHz  
f = 100 kHz  
180  
10  
400  
µS  
pF  
reverse transfer capacitance  
equivalent noise input voltage  
transition frequency  
1.9  
0.8  
715  
pF  
nV/Hz  
MHz  
fT  
2000 Jan 05  
4
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
MCD810  
MCD809  
40  
300  
handbook, halfpage  
handbook, halfpage  
I
DSS  
g
os  
(mA)  
(µS)  
30  
200  
20  
10  
0
100  
0
0
0
0.5  
1  
1.5  
10  
20  
30  
V
(V)  
I
(mA)  
DSS  
GSoff  
VDS = 8 V; Tj = 25 °C.  
VDS = 8 V; Tj = 25 °C.  
Fig.4 Common-source output conductance as a  
function of drain saturation current;  
typical values.  
Fig.3 Drain saturation current as a function of  
gate-source cut-off voltage; typical values.  
MCD812  
MCD811  
60  
60  
handbook, halfpage  
handbook, halfpage  
y
fs  
y
fs  
(mS)  
(mS)  
50  
40  
40  
30  
20  
20  
0
0
10  
20  
30  
0
10  
20  
30  
I
(mA)  
I
(mA)  
D
DSS  
VDS = 8 V; Tj = 25 °C.  
VDS = 8 V; Tj = 25 °C.  
Fig.5 Forward transfer admittance as a function  
of drain saturation current; typical values.  
Fig.6 Forward transfer admittance as a function  
of drain current; typical values.  
2000 Jan 05  
5
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
MCD813  
MCD814  
30  
20  
handbook, halfpage  
handbook, halfpage  
V
= 0 V  
I
GS  
D
I
(mA)  
16  
D
(mA)  
max  
0.1 V  
20  
12  
0.2 V  
0.3 V  
typ  
8
4
10  
0.4 V  
0.5 V  
min  
0
0
0
1  
0.8  
0.6  
0.4  
0.2  
0
4
8
12  
V
(V)  
DS  
V
(V)  
GS  
VDS = 8 V; Tj = 25 °C.  
VDS = 8 V; Tj = 25 °C.  
Fig.7 Drain current as a function of gate-source  
voltage; typical values.  
Fig.8 Drain current as a function of drain-source  
voltage; typical values.  
MCD815  
MCD816  
4
10  
12  
handbook, halfpage  
handbook, halfpage  
10 mA  
I
= 20 mA  
I
D
G
1 mA  
C
(nA)  
(pF)  
0.1 mA  
2
10  
8
1  
C
is  
4
I
GSS  
2  
4  
10  
10  
C
rs  
0
8  
0
5
10  
15  
20  
V
25  
(V)  
6  
4  
2  
0
V
(V)  
GS  
DG  
VDS = 8 V; f = 1 MHz; Tj = 25 °C.  
VDS = 8 V; Tj = 25 °C.  
Fig.10 Input and reverse transfer capacitance as  
functions of gate-source voltage; typical  
values.  
Fig.9 Gate current as a function of drain-gate  
voltage; typical values.  
2000 Jan 05  
6
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
MCD817  
MCD818  
2
3
10  
10  
10  
handbook, halfpage  
handbook, halfpage  
y
is  
(mS)  
y
rs  
y
ϕ
rs  
rs  
10  
(mS)  
(deg)  
b
is  
ϕ
rs  
2
1
1
10  
1  
10  
g
is  
1  
2  
10  
10  
10  
1  
2
3
1  
2
3
10  
1
10  
10  
10  
10  
1
10  
10  
10  
f (MHz)  
f (MHz)  
VDS = 5 V; VG2 = 4 V.  
D = 15 mA; Tamb = 25 °C.  
VDS = 8 V; VGS = 0; Tamb = 25 °C.  
I
Fig.11 Common-source input admittance as a  
function of frequency; typical values.  
Fig.12 Common-source reverse admittance as a  
function of frequency; typical values.  
MCD819  
MCD820  
2
2
2
10  
10  
10  
handbook, halfpage  
handbook, halfpage  
y
y
os  
fs  
(mS)  
y
ϕ
fs  
fs  
(mS)  
(deg)  
10  
ϕ
fs  
b
os  
10  
10  
1
g
os  
1  
1
10  
1  
10  
1  
2
3
1  
2
3
1
10  
10  
10  
10  
1
10  
10  
10  
f (MHz)  
f (MHz)  
VDS = 8 V; VGS = 0; Tamb = 25 °C.  
VDS = 8 V; VGS = 0; Tamb = 25 °C.  
Fig.13 Common-source forward transfer  
admittance as a function of frequency;  
typical values.  
Fig.14 Common-source output admittance as a  
function of frequency; typical values.  
2000 Jan 05  
7
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
1
b
p
w M  
B
L
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
max.  
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
JEDEC  
EIAJ  
97-02-28  
99-09-13  
SOT23  
TO-236AB  
2000 Jan 05  
8
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
2000 Jan 05  
9
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
NOTES  
2000 Jan 05  
10  
Philips Semiconductors  
Product specification  
N-channel junction FET  
BF862  
NOTES  
2000 Jan 05  
11  
Philips Semiconductors – a worldwide company  
Argentina: see South America  
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,  
Tel. +31 40 27 82785, Fax. +31 40 27 88399  
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220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773  
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Belgium: see The Netherlands  
Brazil: see South America  
Philippines: Philips Semiconductors Philippines Inc.,  
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Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474  
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Romania: see Italy  
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Tel. +65 350 2538, Fax. +65 251 6500  
Slovakia: see Austria  
Slovenia: see Italy  
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Tel. +55 11 821 2333, Fax. +55 11 821 2382  
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Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
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Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
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Tel. +91 22 493 8541, Fax. +91 22 493 0966  
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Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
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TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007  
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,  
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Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,  
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Uruguay: see South America  
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Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,  
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087  
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,  
Middle East: see Italy  
Tel. +381 11 3341 299, Fax.+381 11 3342 553  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
69  
SCA  
© Philips Electronics N.V. 2000  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
125004/03/pp12  
Date of release: 2000 Jan 05  
Document order number: 9397 750 06562  

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