BF862T/R [NXP]

TRANSISTOR 40 mA, 20 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, FET General Purpose Small Signal;
BF862T/R
型号: BF862T/R
厂家: NXP    NXP
描述:

TRANSISTOR 40 mA, 20 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, FET General Purpose Small Signal

晶体 小信号场效应晶体管 光电二极管 放大器
文件: 总7页 (文件大小:83K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DISCRETE SEMICONDUCTORS  
DATA SHEET  
ook, halfpage  
BF862  
N-channel junction FET  
Preliminary specification  
1999 Jun 29  
Philips Semiconductors  
Preliminary specification  
N-channel junction FET  
BF862  
FEATURES  
PINNING SOT23  
PIN  
High transition frequency for excellent sensitivity in  
AM car radios  
DESCRIPTION  
1
2
3
source  
High transfer admittance.  
drain  
gate  
APPLICATIONS  
Pre-amplifiers in AM car radios.  
handbook, halfpage  
3
DESCRIPTION  
Silicon N-channel symmetrical junction field-effect  
transistor in a SOT23 package.  
Drain and source are interchangeable.  
1
2
Top view  
MSB003  
Fig.1 SOT23.  
QUICK REFERENCE DATA  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN.  
TYP. MAX. UNIT  
20  
V
VGS (off)  
IDSS  
Ptot  
gate-source cut-off voltage  
drain-source current  
total power dissipation  
transfer admittance  
0.7  
V
10  
25  
225  
mA  
mW  
mS  
°C  
Ts 92 °C  
|yfs|  
30  
40  
Tj  
junction temperature  
150  
CAUTION  
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport  
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.  
1999 Jun 29  
2
Philips Semiconductors  
Preliminary specification  
N-channel junction FET  
BF862  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134)  
SYMBOL  
VDS  
PARAMETER  
drain-source voltage  
CONDITIONS  
MIN.  
MAX.  
20  
UNIT  
V
V
V
VDG  
VGS  
IDS  
IG  
drain-gate voltage  
20  
gate-source voltage  
drain-source current  
forward gate current  
total power dissipation  
storage temperature  
junction temperature  
20  
40  
mA  
mA  
mW  
°C  
10  
Ptot  
Tstg  
Tj  
Ts 92 °C  
225  
+150  
150  
65  
°C  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
CONDITIONS  
note 1  
VALUE  
260  
UNIT  
Rth j-s  
thermal resistance from junction to soldering point  
K/W  
Notes  
1. Soldering point of the gate lead.  
MGS298  
250  
handbook, halfpage  
P
tot  
(mW)  
200  
150  
100  
50  
0
0
40  
80  
120  
160  
T
(°C)  
s
Fig.2 Power derating curve.  
1999 Jun 29  
3
Philips Semiconductors  
Preliminary specification  
N-channel junction FET  
BF862  
STATIC CHARACTERISTICS  
Tj = 25 °C unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
20  
TYP. MAX.  
UNIT  
V(BR)GSS  
VGS  
VGS (off)  
IGSS  
gate-source breakdown voltage IGS = 1 µA; VDS = 0  
V
gate-source forward voltage  
gate-source cut-off voltage  
reverse gate current  
VDS = 0; IG = 1 mA  
VDS = 8 V; ID = 1 µA  
VGS = 15 V; VDS = 0  
VGS = 0; VDS = 8 V  
1
V
0.7  
V
1  
25  
nA  
mA  
IDSS  
drain-source current  
10  
DYNAMIC CHARACTERISTICS  
Common source; Tamb = 25 °C; VGS = 0; VDS = 8 V; unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP. MAX.  
UNIT  
yfs  
common source forward transfer Tj = 25 °C  
admittance  
30  
40  
mS  
gos  
common source output  
conductance  
Tj = 25 °C  
400  
µS  
Ciss  
Crss  
en  
input capacitance  
f = 1 MHz  
f = 1 MHz  
10  
pF  
reverse transfer capacitance  
equivalent noise input voltage  
transition frequency  
2.5  
0.8  
640  
pF  
f = 100 kHz  
nV/Hz  
MHz  
fT  
1999 Jun 29  
4
Philips Semiconductors  
Preliminary specification  
N-channel junction FET  
BF862  
PACKAGE OUTLINE  
Plastic surface mounted package; 3 leads  
SOT23  
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
c
1
2
e
b
w M  
B
1
L
p
p
e
detail X  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
max.  
1
UNIT  
b
c
D
E
e
e
H
L
Q
v
w
A
p
p
1
E
1.1  
0.9  
0.48  
0.38  
0.15  
0.09  
3.0  
2.8  
1.4  
1.2  
2.5  
2.1  
0.45  
0.15  
0.55  
0.45  
mm  
0.1  
1.9  
0.95  
0.2  
0.1  
REFERENCES  
JEDEC  
EUROPEAN  
PROJECTION  
OUTLINE  
VERSION  
ISSUE DATE  
IEC  
EIAJ  
97-02-28  
SOT23  
1999 Jun 29  
5
Philips Semiconductors  
Preliminary specification  
N-channel junction FET  
BF862  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1999 Jun 29  
6
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Slovenia: see Italy  
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Tel. +33 1 4099 6161, Fax. +33 1 4099 6427  
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Tel. +49 40 2353 60, Fax. +49 40 2353 6300  
Spain: Balmes 22, 08007 BARCELONA,  
Tel. +34 93 301 6312, Fax. +34 93 301 4107  
Hungary: see Austria  
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,  
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745  
India: Philips INDIA Ltd, Band Box Building, 2nd floor,  
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Tel. +91 22 493 8541, Fax. +91 22 493 0966  
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,  
Tel. +41 1 488 2741 Fax. +41 1 488 3263  
Indonesia: PT Philips Development Corporation, Semiconductors Division,  
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,  
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080  
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Uruguay: see South America  
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Middle East: see Italy  
Tel. +381 11 62 5344, Fax.+381 11 63 5777  
For all other countries apply to: Philips Semiconductors,  
Internet: http://www.semiconductors.philips.com  
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,  
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825  
© Philips Electronics N.V. 1999  
SCA66  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.  
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed  
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license  
under patent- or other industrial or intellectual property rights.  
Printed in The Netherlands  
125004/00/01/pp7  
Date of release: 1999 Jun 29  
Document order number: 9397 750 06154  

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