AV16260DGG [NXP]

12-bit to 24-bit multiplexed D-type latches 3-State; 12位至24位多路D型锁存三态
AV16260DGG
型号: AV16260DGG
厂家: NXP    NXP
描述:

12-bit to 24-bit multiplexed D-type latches 3-State
12位至24位多路D型锁存三态

文件: 总14页 (文件大小:95K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
74ALVT16260  
12-bit to 24-bit multiplexed D-type latches  
(3-State)  
Product specification  
IC23 Data Handbook  
1998 Jan 30  
Philips  
Semiconductors  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
FEATURES  
DESCRIPTION  
The 74ALVT16260 is a 12-bit to 24-bit multiplexed D-type latch used  
in applications where two separate data paths must be multiplexed  
onto, or demultiplexed from, a single data path. Typical applications  
include multiplexing and/or demultiplexing of address and data  
information in microprocessor or bus-interface applications. This  
device is alto useful in memory-interleaving applications.  
ESD protection exceeds 2000V per Mil-Std-883C, Method 3015;  
exceeds 200V using machine model  
Latch-up protection exceeds 500mA per JEDEC Standard  
JESD-17.  
Distributed V and GND pin configuration minimizes high-speed  
CC  
Three 12-bit I/O ports (A1–A12, 1B1–1B12, and 2B1–2B12) are  
available for address and/or data transfer. The output enable (OE1B,  
OE2B, and OEA) inputs control the bus transceiver functions. The  
OE1B and OE2B control signals also allow bank control in the A to  
B direction.  
switching noise.  
Output capability (–32mA I , 64mA I ).  
OH  
OL  
Bus hold inputs eliminate the need for external pull-up resistors.  
5V I/O compatible  
Address and/or data information can be stored using the internal  
storage latches. The latch enable (LE1B, LE2B, LEA1B, and  
LEA2B) inputs are used to control data storage. When the latch  
enable input is high, the latch is transparent. When the latch enable  
input goes low, the data present at the inputs is latched and remains  
latched until the latch enable input is returned high.  
Live insertion/extraction permitted  
Power-up 3-State  
Power-up Reset  
To ensure the high-impedance state during power-up or  
power-down, OE should be tied to V through a pull-up resistor;  
CC  
the minimum value of the resistor is determined by the current  
sinking capability of the driver.  
The 74ALVT16260 is available in a 56-pin Shrink Small Outline  
Package (SSOP) and 56-pin Thin Shrink Small Outline Package  
(TSSOP).  
QUICK REFERENCE DATA  
TYPICAL  
CONDITIONS  
= 25°C; GND = 0V  
SYMBOL  
PARAMETER  
UNIT  
T
amb  
2.5V  
3.5  
3.3  
4
3.3V  
2.8  
2.6  
4
t
t
Propagation delay  
PLH  
C = 50 pF  
L
ns  
nAx to nBx nBx to nAx  
Input capacitance  
PHL  
C
V = 0 V or V  
I CC  
pF  
pF  
µA  
IN  
C
Output capacitance  
Total supply current  
V
= 0 V or 5.0 V  
9
9
OUT  
CCZ  
I/O  
I
Outputs disabled  
100  
80  
ORDERING INFORMATION  
PACKAGES  
TEMPERATURE RANGE OUTSIDE NORTH AMERICA  
NORTH AMERICA  
AV16260 DL  
DWG NUMBER  
SOT371-1  
56-Pin Plastic SSOP Type III  
56-Pin Plastic TSSOP Type II  
–40°C to +85°C  
–40°C to +85°C  
74ALVT16260 DL  
74ALVT16260 DGG  
AV16260 DGG  
SOT364-1  
2
1998 Jan 30  
853-2046-18918  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
PIN DESCRIPTION  
PIN NUMBER  
SYMBOL  
FUNCTION  
Data inputs/outputs (A)  
8, 9, 10, 12, 13, 14, 15, 16, 17, 19, 20, 21  
An  
23, 24, 26, 31, 33, 34, 36, 37, 38, 40, 41, 42  
1Bn  
Data inputs/outputs (B1)  
Data inputs/outputs (B2)  
6, 5, 3, 54, 52, 51, 49, 48, 47, 45, 44, 43  
2Bn  
OEA, OE1B, OE2B  
LE1B, LE2B, LEA1B, LEA2B  
SEL  
1, 29, 56  
2, 27, 30, 55  
Output enable input (active low)  
Latch enable inputs  
28  
B1/B2 input select input  
Ground (0V)  
4, 11, 18, 25, 32, 39, 46, 53  
7, 22, 35, 50  
GND  
V
CC  
Positive supply voltage  
PIN CONFIGURATION  
FUNCTION TABLES  
B to A (OEB = H)  
OEA  
1
56 OE2B  
INPUTS  
SEL LE1B LE2B  
OUTPUT  
A
LE1B  
2B3  
2
3
4
5
6
7
8
9
55 LEA2B  
54 2B4  
53 GND  
52 2B5  
51 2B6  
1B  
2B  
OEA  
H
L
X
X
X
H
L
H
H
H
L
H
H
L
X
X
X
H
H
L
L
L
L
L
L
L
H
H
L
GND  
2B2  
X
X
X
X
X
A0  
H
2B1  
X
X
X
X
V
50 V  
CC  
CC  
L
L
A1  
49 2B7  
48 2B8  
47 2B9  
46 GND  
45 2B10  
44 2B11  
43 2B12  
42 1B12  
41 1B11  
40 1B10  
39 GND  
38 1B9  
37 1B8  
36 1B7  
X
X
L
A0  
Z
A2  
X
X
A3 10  
A to B (OEA = H)  
GND 11  
A4 12  
INPUTS  
LEA1B LEA2B OE1B OE2B  
OUTPUT  
A5 13  
A6 14  
A7 15  
A
H
L
1B  
2B  
H
H
H
H
H
L
H
H
L
L
L
L
L
L
L
L
H
L
H
L
L
L
L
L
L
L
L
H
H
L
L
H
L
L
A8 16  
A9 17  
GND 18  
A10 19  
A11 20  
A12 21  
H
L
H
2B0  
2B0  
H
L
L
H
L
H
H
L
1B0  
1B0  
1B0  
Z
L
L
X
X
X
X
X
L
2B0  
Z
X
X
X
X
X
X
X
X
V
22  
35 V  
CC  
CC  
Active  
Z
Z
1B1 23  
1B2 24  
GND 25  
1B3 26  
LE2B 27  
SEL 28  
34 1B6  
33 1B5  
Active  
Active  
32 GND  
31 1B4  
Active  
30 LEA1B  
29 OE1B  
SA00435  
3
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
LOGIC DIAGRAM (POSITIVE LOGIC)  
2
LE1B  
27  
LE2B  
30  
LEA1B  
55  
LEA2B  
56  
OE2B  
29  
OE1B  
1
OEA  
28  
SEL  
C1  
G1  
8
23  
A1  
1
1
1D  
1B1  
C1  
1D  
6
2B1  
C1  
1D  
C1  
1D  
TO 11 OTHER CHANNELS  
SA00436  
4
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
1, 2  
ABSOLUTE MAXIMUM RATINGS  
SYMBOL  
PARAMETER  
CONDITIONS  
RATING  
UNIT  
V
V
CC  
I
IK  
DC supply voltage  
–0.5 to +4.6  
–50  
DC input diode current  
V < 0  
I
mA  
V
3
V
I
DC input voltage  
–0.5 to +7.0  
–50  
I
DC output diode current  
V
O
< 0  
mA  
V
OK  
3
V
OUT  
DC output voltage  
Output in Off or High state  
Output in Low state  
–0.5 to +7.0  
128  
I
DC output current  
mA  
OUT  
Output in High state  
–64  
T
stg  
Storage temperature range  
–65 to +150  
°C  
NOTES:  
1. Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the  
device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to  
absolute-maximum-rated conditions for extended periods may affect device reliability.  
2. The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction  
temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150°C.  
3. The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed.  
RECOMMENDED OPERATING CONDITIONS  
2.5V RANGE LIMITS 3.3V RANGE LIMITS  
SYMBOL  
PARAMETER  
UNIT  
MIN  
2.3  
0
MAX  
2.7  
MIN  
3.0  
0
MAX  
3.6  
V
CC  
DC supply voltage  
Input voltage  
V
V
V
I
5.5  
5.5  
V
High-level input voltage  
Input voltage  
1.7  
2.0  
V
IH  
V
0.7  
–8  
8
0.8  
–32  
32  
V
IL  
I
High-level output current  
Low-level output current  
mA  
OH  
I
OL  
mA  
Low-level output current; current duty cycle 50%; f 1kHz  
Input transition rise or fall rate; Outputs enabled  
Operating free-air temperature range  
24  
10  
+85  
64  
t/v  
10  
ns/V  
T
amb  
–40  
–40  
+85  
°C  
5
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
DC ELECTRICAL CHARACTERISTICS (3.3V "0.3V RANGE)  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
Temp = -40°C to +85°C  
UNIT  
1
MIN  
TYP  
–0.85  
MAX  
V
Input clamp voltage  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.0V; I = –18mA  
*1.2  
V
V
IK  
IK  
= 3.0 to 3.6V; I = –100µA  
V
0.2  
V
CC  
OH  
CC–  
V
OH  
High-level output voltage  
= 3.0V; I = –32mA  
2.0  
2.3  
0.07  
0.25  
0.3  
OH  
= 3.0V; I = 100µA  
0.2  
0.4  
OL  
= 3.0V; I = 16mA  
OL  
V
OL  
Low–level output voltage  
V
= 3.0V; I = 32mA  
0.5  
OL  
= 3.0V; I = 64mA  
0.4  
0.55  
OL  
6
V
Power-up output low voltage  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3.6V; I = 1mA; V = V or GND  
0.55  
±1  
V
RST  
O
I
CC  
= 3.6V; V = V or GND  
Control pins  
0.1  
0.1  
I
CC  
= 0 or 3.6V; V = 5.5V  
10  
I
I
I
Input leakage current  
µA  
= 3.6V; V = V  
0.1  
1
I
CC  
4
Data pins  
= 3.6V; V = 0V  
0.1  
-5  
I
I
Off current  
= 0V; V or V = 0 to 4.5V  
0.1  
±100  
µA  
µA  
OFF  
I
O
= 3V; V = 0.8V  
75  
130  
–140  
I
Bus Hold current  
= 3V; V = 2.0V  
–75  
I
I
HOLD  
7
Data inputs  
= 0V to 3.6V; V = 3.6V  
±500  
CC  
Current into an output in the  
I
V
= 5.5V; V = 3.0V  
10  
1
125  
µA  
µA  
EX  
O
CC  
High state when V > V  
O
CC  
Power up/down 3-State output  
V
CC  
1.2V; V = 0.5V to V ; V = GND or V  
O CC I CC  
I
±100  
PU/PD  
3
current  
OE/OE = Don’t care  
I
3-State output High current  
3-State output Low current  
V
V
V
V
V
V
= 3.6V; V = 3.0V; V = V or V  
0.5  
0.5  
5
µA  
µA  
OZH  
CC  
CC  
CC  
CC  
CC  
CC  
O
I
IL  
IH  
IH  
I
= 3.6V; V = 0.5V; V = V or V  
*5  
0.1  
6
OZL  
O
I
IL  
I
= 3.6V; Outputs High, V = GND or V I 0  
CC, O =  
0.04  
3.7  
CCH  
I
I
Quiescent supply current  
= 3.6V; Outputs Low, V = GND or V I 0  
CC, O =  
mA  
mA  
CCL  
I
5
I
= 3.6V; Outputs Disabled; V = GND or V  
I = 0  
CC, O  
0.04  
0.1  
CCZ  
I
Additional supply current per  
= 3V to 3.6V; One input at V –0.6V,  
CC  
I  
0.04  
0.4  
CC  
2
input pin  
Other inputs at V or GND  
CC  
NOTES:  
1. All typical values are at V = 3.3V and T  
= 25°C.  
amb  
CC  
2. This is the increase in supply current for each input at the specified voltage level other than V or GND  
CC  
3. This parameter is valid for any V between 0V and 1.2V with a transition time of up to 10msec. From V = 1.2V to V = 3.3V ± 0.2V a  
CC  
CC  
CC  
transition time of 100µsec is permitted. This parameter is valid for T  
= 25°C only.  
amb  
4. Unused pins at V or GND.  
CC  
5. I  
is measured with outputs pulled up to V or pulled down to ground.  
CCZ  
CC  
6. For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.  
7. This is the bus hold overdrive current required to force the input to the opposite logic state.  
6
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
AC ELECTRICAL CHARACTERISTICS (3.3V ± 0.3V RANGE)  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 500Ω  
R
F
L
L
T
= –40°C to +85°C  
amb  
V
PARAMETER  
= +3.3V ± 0.3V  
CC  
SYMBOL  
UNIT  
FROM (INPUT)  
TO (OUTPUT)  
MIN  
1
TYP  
2.8  
2.6  
2.9  
3.1  
2.3  
2.4  
2.4  
2.4  
2.3  
2.3  
4.4  
3.1  
MAX  
4.8  
4.6  
4.6  
4.7  
3.4  
3.8  
3.6  
3.6  
4.2  
4.0  
6.0  
5.0  
t
t
t
t
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
A or B  
B or A  
1
PHL  
PLH  
PHL  
1.1  
1.1  
1.3  
1.1  
1.5  
1.6  
1
LE  
A or B  
SEL (B1)  
SEL (B2)  
SEL (B1)  
SEL (B2)  
A
A
A
A
t
t
PLH  
PHL  
t
t
t
t
PZH  
PZL  
PHZ  
PLZ  
OE  
OE  
A or B  
A or B  
1.6  
2.2  
1.3  
AC SETUP CHARACTERISTICS (3.3V ± 0.3V RANGE)  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 500Ω  
R
F
L
L
T
= –40°C to +85°C  
amb  
V
= +3.3V ± 0.3V  
CC  
SYMBOL  
PARAMETER  
UNIT  
MIN  
3.3  
1
MAX  
t
t
t
Pulse duration, LE1B, LE2B, LEA1B, or LEA2B high  
Setup time, data before LE1B, LE2B, LEA1B, or LEA2B↓  
Hold time, data after LE1B, LE2B, LEA1B, or LEA2B↓  
ns  
ns  
ns  
w
su  
h
1
7
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
DC ELECTRICAL CHARACTERISTICS (2.5V "0.2V RANGE)  
LIMITS  
SYMBOL  
PARAMETER  
TEST CONDITIONS  
Temp = -40°C to +85°C  
UNIT  
1
MIN  
TYP  
–0.85  
MAX  
V
Input clamp voltage  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2.3V; I = –18mA  
–1.2  
V
V
IK  
IK  
= 2.3 to 3.6V; I = –100µA  
V
–0.2  
V
CC  
OH  
CC  
V
OH  
High-level output voltage  
= 2.3V; I = –8mA  
1.8  
2.1  
0.07  
0.3  
OH  
= 2.3V; I = 100µA  
0.2  
0.5  
OL  
V
OL  
Low-level output voltage  
= 2.3V; I = 24mA  
OL  
7
V
Power-up output low voltage  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2.7V; I = 1mA; V = V or GND  
0.55  
±1  
V
RST  
O
I
CC  
= 2.7V; V = V  
or GND  
CC  
Control pins  
0.1  
0.1  
0.1  
0.1  
0.1  
90  
I
= 0 or 2.7V; V = 5.5V  
10  
I
I
I
Input leakage current  
µA  
= 2.7V; V = V  
1
I
CC  
4
Data pins  
= 2.7V; V = 0  
-5  
I
I
Off current  
= 0V; V or V = 0 to 4.5V  
"100  
µA  
µA  
OFF  
I
O
Bus Hold current  
= 2.3V; V = 0.7V  
I
I
HOLD  
6
Data inputs  
= 2.3V; V = 1.7V  
–10  
I
Current into an output in the  
I
V
= 5.5V; V = 2.3V  
10  
1
125  
100  
µA  
µA  
EX  
O
CC  
High state when V > V  
O
CC  
Power up/down 3-State output  
V
CC  
1.2V; V = 0.5V to V ; V = GND or V  
;
CC  
O
CC  
I
I
PU/PD  
3
current  
OE/OE = Don’t care  
I
3-State output High current  
3-State output Low current  
V
V
V
V
V
V
= 2.7V; V = 2.3V; V = V or V  
0.5  
0.5  
5
µA  
µA  
OZH  
CC  
CC  
CC  
CC  
CC  
CC  
O
I
IL  
IH  
IH  
I
= 2.7V; V = 0.5V; V = V or V  
–5  
OZL  
O
I
IL  
I
= 2.7V; Outputs High, V = GND or V I 0  
CC, O =  
0.04  
2.7  
0.1  
4.5  
0.1  
CCH  
I
I
Quiescent supply current  
= 2.7V; Outputs Low, V = GND or V I 0  
CC, O =  
mA  
mA  
CCL  
CCZ  
I
5
I
= 2.7V; Outputs Disabled; V = GND or V  
I 0  
CC, O =  
0.04  
I
Additional supply current per  
= 2.3V to 2.7V; One input at V –0.6V,  
CC  
I  
0.04  
0.4  
CC  
2
input pin  
Other inputs at V or GND  
CC  
NOTES:  
1. All typical values are at V = 2.5V and T  
= 25°C.  
amb  
CC  
2. This is the increase in supply current for each input at the specified voltage level other than V or GND  
CC  
3. This parameter is valid for any V between 0V and 1.2V with a transition time of up to 10msec. From V = 1.2V to V = 2.5V ± 0.3V a  
CC  
CC  
CC  
transition time of 100µsec is permitted. This parameter is valid for T  
= 25°C only.  
amb  
4. Unused pins at V or GND.  
CC  
5. I  
is measured with outputs pulled up to V or pulled down to ground.  
CCZ  
CC  
6. Not guaranteed.  
7. For valid test results, data must not be loaded into the flip-flops (or latches) after applying power.  
8
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
AC ELECTRICAL CHARACTERISTICS (2.5V ± 0.2V RANGE)  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 500Ω  
R
F
L
L
T
= –40°C to +85°C  
amb  
V
PARAMETER  
= +2.5V ± 0.2V  
CC  
SYMBOL  
UNIT  
FROM (INPUT)  
TO (OUTPUT)  
MIN  
1
TYP  
3.5  
3.3  
3.9  
4.2  
2.9  
3.3  
3.0  
3.2  
3.1  
2.0  
4.0  
2.0  
MAX  
5.3  
5.4  
6.0  
6.2  
4.5  
4.8  
4.5  
4.6  
5.0  
3.0  
6.6  
3.4  
t
t
t
t
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
PLH  
A or B  
B or A  
1
PHL  
PLH  
PHL  
1.1  
1.1  
1.3  
1.1  
1.5  
1.6  
1
LE  
A or B  
SEL (B1)  
SEL (B2)  
SEL (B1)  
SEL (B2)  
A
A
A
A
t
t
PLH  
PHL  
t
t
t
t
PZH  
PZL  
PHZ  
PLZ  
OE  
OE  
A or B  
A or B  
1.6  
2.2  
1.3  
AC SETUP CHARACTERISTICS (2.5V ± 0.2V RANGE)  
GND = 0V; t = t = 2.5ns; C = 50pF; R = 500Ω  
R
F
L
L
T
= –40°C to +85°C  
amb  
V
= +2.5V ± 0.2V  
CC  
SYMBOL  
PARAMETER  
UNIT  
MIN  
3.3  
1
MAX  
t
t
t
Pulse duration, LE1B, LE2B, LEA1B, or LEA2B high  
Setup time, data before LE1B, LE2B, LEA1B, or LEA2B↓  
Hold time, data after LE1B, LE2B, LEA1B, or LEA2B↓  
ns  
ns  
ns  
w
su  
h
1
9
1998 Jan 30  
Philips Semiconductors  
Product specification  
2.5V/3.3V 12-bit to 24-bit multiplexed D-type latches  
(3-State)  
74ALVT16260  
AC WAVEFORMS  
V
M
= 1.5V for all waveforms  
The outputs are measured one at a time with one transition per measurement.  
3V  
V
TIMING INPUT  
DATA INPUT  
M
t
w
0V  
3V  
3V  
0V  
t
su  
t
h
V
V
M
INPUT  
M
V
V
M
M
0V  
SA00437  
SA00439  
Figure 1. Pulse duration  
Figure 3. Setup and hold times  
3V  
0V  
3V  
OUTPUT  
CONTROL  
V
V
V
V
M
INPUT  
M
M
M
0V  
t
t
PLZ  
t
t
PZL  
PLH  
PHL  
V
V
V
V
3.5V  
OH  
OL  
OH  
OL  
OUTPUT  
WAVEFORM 1  
S1 AT 7V  
V
V
V
V
V
M
OUTPUT  
OUTPUT  
M
M
M
M
V
V
+ 0.3V  
– 0.3V  
OL  
V
V
OL  
t
t
PHZ  
t
t
PZH  
PHL  
PLH  
OH  
OUTPUT  
WAVEFORM 2  
S1 AT OPEN  
V
M
OH  
0V  
SA00438  
SA00440  
All input pulses are supplied by generators having the following  
characteristics: PRR 10MHz, Z = 50, t 2.5ns, t 2.5ns.  
Waveform 1 is for an output with internal conditions such that the  
output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the  
output is high except when disabled by the output control.  
O
r
f
Figure 2. Propagation delay times;  
inverting and non-inverting outputs  
Figure 4. Enable and disable times;  
low- and high-level enabling  
TEST LOAD CIRCUIT  
7V  
S1  
OPEN  
GND  
500  
FROM OUTPUT UNDER TEST  
TEST  
/t  
S1  
Open  
7V  
t
PLH PHL  
C
= 50pF  
500Ω  
L
t
/t  
PLZ PZL  
(INCLUDES PROBE AND  
JIG CAPACITANCE)  
t
/t  
Open  
PHZ PZH  
Load Circuit for Outputs  
SA00441  
Figure 5. Test load circuit  
10  
1998 Jan 30  
Philips Semiconductors  
Product specification  
12-bit to 24-bit multiplexed D-type latches (3-State)  
74ALVT16260  
SSOP56: plastic shrink small outline package; 56 leads; body width 7.5 mm  
SOT371-1  
11  
1988 Jan 30  
Philips Semiconductors  
Product specification  
12-bit to 24-bit multiplexed D-type latches (3-State)  
74ALVT16260  
TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1mm  
SOT364-1  
12  
1988 Jan 30  
Philips Semiconductors  
Product specification  
12-bit to 24-bit multiplexed D-type latches (3-State)  
74ALVT16260  
NOTES  
13  
1988 Jan 30  
Philips Semiconductors  
Product specification  
12-bit to 24-bit multiplexed D-type latches (3-State)  
74ALVT16260  
Data sheet status  
[1]  
Data sheet  
status  
Product  
status  
Definition  
Objective  
specification  
Development  
This data sheet contains the design target or goal specifications for product development.  
Specification may change in any manner without notice.  
Preliminary  
specification  
Qualification  
This data sheet contains preliminary data, and supplementary data will be published at a later date.  
Philips Semiconductors reserves the right to make chages at any time without notice in order to  
improve design and supply the best possible product.  
Product  
specification  
Production  
This data sheet contains final specifications. Philips Semiconductors reserves the right to make  
changes at any time without notice in order to improve design and supply the best possible product.  
[1] Please consult the most recently issued datasheet before initiating or completing a design.  
Definitions  
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one  
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or  
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended  
periods may affect device reliability.  
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips  
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or  
modification.  
Disclaimers  
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications  
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.  
RighttomakechangesPhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard  
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless  
otherwise specified.  
Philips Semiconductors  
811 East Arques Avenue  
P.O. Box 3409  
Copyright Philips Electronics North America Corporation 1998  
All rights reserved. Printed in U.S.A.  
Sunnyvale, California 94088–3409  
Telephone 800-234-7381  
print code  
Date of release: 05-96  
9397-750-03337  
Document order number:  
Philips  
Semiconductors  

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