74AHCT2G08GM [NXP]

Dual 2-input AND gate; 双路2输入与门
74AHCT2G08GM
型号: 74AHCT2G08GM
厂家: NXP    NXP
描述:

Dual 2-input AND gate
双路2输入与门

栅极 触发器 逻辑集成电路 光电二极管
文件: 总17页 (文件大小:88K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
74AHC2G08; 74AHCT2G08  
Dual 2-input AND gate  
Rev. 02 — 18 October 2004  
Product data sheet  
1. General description  
The 74AHC2G08; 74AHCT2G08 is a high-speed Si-gate CMOS device.  
The 74AHC2G08; 74AHCT2G08 provides two 2-input AND gates.  
2. Features  
Symmetrical output impedance  
High noise immunity  
ESD protection:  
HBM EIA/JESD22-A114-B exceeds 2000 V  
MM EIA/JESD22-A115-A exceeds 200 V  
CDM EIA/JESD22-C101 exceeds 1000 V.  
Low power dissipation  
Balanced propagation delays  
Multiple package options  
Specified from 40 °C to +80 °C and from 40 °C to +125 °C.  
3. Quick reference data  
Table 1:  
Quick reference data  
GND = 0 V; Tamb = 25 °C; tr = tf 3.0 ns.  
Symbol  
Parameter  
Conditions  
Min Typ Max Unit  
Type 74AHC2G08  
tPHL, tPLH  
propagation delay  
CL = 15 pF; VCC = 5 V  
-
3.2  
5.9  
ns  
A and B to Y  
CI  
input capacitance  
-
-
1.5  
17  
10  
-
pF  
pF  
[1] [2]  
CPD  
power dissipation  
capacitance  
CL = 50 pF; fi = 1 MHz  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
Table 1:  
Quick reference data …continued  
GND = 0 V; Tamb = 25 °C; tr = tf 3.0 ns.  
Symbol  
Parameter  
Conditions  
Min Typ Max Unit  
Type 74AHCT2G08  
tPHL, tPLH  
propagation delay  
CL = 15 pF; VCC = 5 V  
-
3.6  
6.2  
ns  
A and B to Y  
CI  
input capacitance  
-
-
1.5  
19  
10  
-
pF  
pF  
[1] [2]  
CPD  
power dissipation  
capacitance  
CL = 50 pF; fi = 1 MHz  
[1] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = number of inputs switching;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
[2] The condition is Vi = GND to VCC  
.
4. Ordering information  
Table 2:  
Ordering information  
Type number  
Package  
Temperature range Name  
Description  
Version  
74AHC2G08DP  
74AHCT2G08DP  
74AHC2G08DC  
74AHCT2G08DC  
74AHC2G08GM  
74AHCT2G08GM  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
40 °C to +125 °C  
TSSOP8  
plastic thin shrink small outline package; 8 leads;  
body width 3 mm; lead length 0.5 mm  
SOT505-2  
TSSOP8  
VSSOP8  
VSSOP8  
XSON8  
plastic thin shrink small outline package; 8 leads;  
body width 3 mm; lead length 0.5 mm  
SOT505-2  
SOT765-1  
SOT765-1  
SOT833-1  
SOT833-1  
plastic very thin shrink small outline package;  
8 leads; body width 2.3 mm  
plastic very thin shrink small outline package;  
8 leads; body width 2.3 mm  
plastic extremely thin small outline package;  
no leads; 8 terminals; body 0.95 × 1.95 × 0.5 mm  
XSON8  
plastic extremely thin small outline package;  
no leads; 8 terminals; body 0.95 × 1.95 × 0.5 mm  
5. Marking  
Table 3:  
Marking  
Type number  
Marking code  
74AHC2G08DP  
74AHCT2G08DP  
74AHC2G08DC  
74AHCT2G08DC  
74AHC2G08GM  
74AHCT2G08GM  
A08  
C08  
A08  
C08  
A08  
C08  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
2 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
6. Functional diagram  
1
&
7
3
2
1
2
1A  
1B  
1Y  
2Y  
7
3
5
6
5
6
2A  
2B  
&
mna724  
mna725  
Fig 1. Logic symbol.  
Fig 2. IEC logic symbol.  
A
Y
B
mna221  
Fig 3. Logic diagram (one gate).  
7. Pinning information  
7.1 Pinning  
08  
1A  
1B  
1
2
3
4
8
7
6
5
V
CC  
1
2
3
4
8
7
6
5
1A  
V
CC  
1Y  
2B  
2A  
1B  
2Y  
1Y  
2B  
2A  
08  
2Y  
GND  
001aab564  
GND  
001aab565  
Transparent top view  
Fig 4. Pin configuration TSSOP8 and  
VSSOP8.  
Fig 5. Pin configuration XSON8.  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
3 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
7.2 Pin description  
Table 4:  
Symbol  
1A  
Pin description  
Pin  
1
Description  
data input  
1B  
2
data input  
2Y  
3
data output  
ground (0 V)  
data input  
GND  
2A  
4
5
2B  
6
data input  
1Y  
7
data output  
supply voltage  
VCC  
8
8. Functional description  
8.1 Function table  
Table 5:  
Function table[1]  
Input  
nA  
L
Output  
nB  
L
nY  
L
L
H
L
L
H
L
H
H
H
[1] H = HIGH voltage level;  
L = LOW voltage level.  
9. Limiting values  
Table 6:  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to  
GND (ground = 0 V).  
Symbol  
VCC  
VI  
Parameter  
Conditions  
Min  
0.5  
0.5  
-
Max  
+7.0  
+7.0  
20  
Unit  
V
supply voltage  
input voltage  
V
IIK  
input diode current VI < 0.5 V  
mA  
mA  
[1]  
IOK  
output diode  
current  
VO < 0.5 V or  
VO > VCC + 0.5 V  
-
±20  
IO  
output source or  
sink current  
VO > 0.5 V and  
VO < VCC + 0.5 V  
-
±25  
mA  
ICC, IGND  
Tstg  
VCC or GND current  
-
±75  
mA  
storage  
65  
+150  
°C  
temperature  
Ptot  
power dissipation  
Tamb = 40 °C to +125 °C  
-
250  
mW  
[1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
4 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
10. Recommended operating conditions  
Table 7:  
Symbol  
Recommended operating operations  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Type 74AHC2G08  
VCC  
VI  
supply voltage  
2.0  
0
5.0  
5.5  
5.5  
VCC  
V
V
V
input voltage  
-
VO  
output voltage  
0
-
Tamb  
ambient  
temperature  
see Section 11 and  
Section 12  
40  
+25  
+125 °C  
tr, tf  
input rise and fall  
times  
VCC = 3.0 V to 3.6 V  
VCC = 4.5 V to 5.5 V  
-
-
-
-
100  
20  
ns/V  
ns/V  
Type 74AHCT2G08  
VCC  
VI  
supply voltage  
4.5  
0
5.0  
5.5  
5.5  
VCC  
V
V
V
input voltage  
-
VO  
output voltage  
0
-
Tamb  
ambient  
temperature  
see Section 11 and  
Section 12  
40  
+25  
+125 °C  
tr, tf  
input rise and fall  
times  
VCC = 4.5 V to 5.5 V  
-
-
20 ns/V  
11. Static characteristics  
Table 8:  
Static characteristics type 74AHC2G08  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Tamb = 25 °C  
VIH  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
HIGH-level input  
voltage  
VCC = 2.0 V  
1.5  
-
-
-
-
-
-
-
V
V
V
V
V
V
VCC = 3.0 V  
2.1  
-
VCC = 5.5 V  
3.85  
-
VIL  
LOW-level input  
voltage  
VCC = 2.0 V  
-
-
-
0.5  
0.9  
1.65  
VCC = 3.0 V  
VCC = 5.5 V  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
1.9  
2.0  
3.0  
4.5  
-
-
-
-
-
-
V
V
V
V
V
2.9  
4.4  
2.58  
3.94  
-
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
5 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
Table 8:  
Static characteristics type 74AHC2G08 …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VOL  
LOW-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
0
0
0
-
0.1  
V
0.1  
V
0.1  
V
0.36  
0.36  
0.1  
V
-
V
ILI  
input leakage current VI = VCC or GND; VCC = 5.5 V  
-
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
-
1.0  
V
CI  
input capacitance  
-
1.5  
10  
pF  
Tamb = 40 °C to +85 °C  
VIH HIGH-level input  
VCC = 2.0 V  
1.5  
-
-
-
-
-
-
-
V
V
V
V
V
V
voltage  
VCC = 3.0 V  
2.1  
-
VCC = 5.5 V  
3.85  
-
VIL  
LOW-level input  
voltage  
VCC = 2.0 V  
-
-
-
0.5  
0.9  
1.65  
VCC = 3.0 V  
VCC = 5.5 V  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
1.9  
2.9  
4.4  
2.48  
3.8  
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
VOL  
LOW-level output  
voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.44  
0.44  
1.0  
10  
V
V
V
V
V
ILI  
input leakage current VI = VCC or GND; VCC = 5.5 V  
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
CI  
input capacitance  
-
-
10  
pF  
Tamb = 40 °C to +125 °C  
VIH  
HIGH-level input  
voltage  
VCC = 2.0 V  
VCC = 3.0 V  
VCC = 5.5 V  
VCC = 2.0 V  
VCC = 3.0 V  
VCC = 5.5 V  
1.5  
-
-
-
-
-
-
-
V
V
V
V
V
V
2.1  
-
3.85  
-
VIL  
LOW-level input  
voltage  
-
-
-
0.5  
0.9  
1.65  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
6 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
Table 8:  
Static characteristics type 74AHC2G08 …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
1.9  
-
-
-
-
-
-
-
-
-
-
V
V
V
V
V
2.9  
4.4  
2.40  
3.70  
VOL  
LOW-level output  
voltage  
IO = 50 µA; VCC = 2.0 V  
IO = 50 µA; VCC = 3.0 V  
IO = 50 µA; VCC = 4.5 V  
IO = 4.0 mA; VCC = 3.0 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.1  
0.1  
0.1  
0.55  
0.55  
2.0  
40  
V
V
V
V
V
ILI  
input leakage current VI = VCC or GND; VCC = 5.5 V  
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
CI  
input capacitance  
-
-
10  
pF  
Table 9:  
Static characteristics type 74AHCT2G08  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Tamb = 25 °C  
VIH  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
HIGH-level input  
voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
V
V
VIL  
LOW-level input  
voltage  
0.8  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
4.4  
4.5  
-
-
-
V
V
3.94  
VOL  
LOW-level output  
voltage  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
0
-
0.1  
0.36  
0.1  
1.0  
V
V
ILI  
input leakage current VI = VIH or VIL; VCC = 5.5 V  
-
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
-
V
ICC  
additional quiescent  
supply current per  
input pin  
VI = 3.4 V; other inputs at  
-
-
-
1.35  
10  
mA  
pF  
VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
CI  
input capacitance  
1.5  
Tamb = 40 °C to +85 °C  
VIH  
HIGH-level input  
voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
V
V
VIL  
LOW-level input  
voltage  
0.8  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
7 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
Table 9:  
Static characteristics type 74AHCT2G08 …continued  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V).  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
4.4  
3.8  
-
-
-
-
V
V
VOL  
LOW-level output  
voltage  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
-
0.1  
0.44  
1.0  
10  
V
V
ILI  
input leakage current VI = VIH or VIL; VCC = 5.5 V  
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
ICC  
additional quiescent  
supply current per  
input pin  
VI = 3.4 V; other inputs at  
-
-
-
-
1.5  
10  
mA  
pF  
VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
CI  
input capacitance  
Tamb = 40 °C to +125 °C  
VIH  
HIGH-level input  
voltage  
VCC = 4.5 V to 5.5 V  
VCC = 4.5 V to 5.5 V  
2.0  
-
-
-
-
V
V
VIL  
LOW-level input  
voltage  
0.8  
VOH  
HIGH-level output  
voltage  
VI = VIH or VIL  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
VI = VIH or VIL  
4.4  
-
-
-
-
V
V
3.70  
VOL  
LOW-level output  
voltage  
IO = 50 µA; VCC = 4.5 V  
IO = 8.0 mA; VCC = 4.5 V  
-
-
-
-
-
-
-
-
0.1  
0.55  
2.0  
40  
V
V
ILI  
input leakage current VI = VIH or VIL; VCC = 5.5 V  
µA  
µA  
ICC  
quiescent supply  
current  
VI = VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
ICC  
additional quiescent  
supply current per  
input pin  
VI = 3.4 V; other inputs at  
-
-
-
-
1.5  
10  
mA  
pF  
VCC or GND; IO = 0 A;  
CC = 5.5 V  
V
CI  
input capacitance  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
8 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
12. Dynamic characteristics  
Table 10: Dynamic characteristics type 74AHC2G08  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = tf 3.0 ns; see Figure 7.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 25 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
[1]  
[2]  
VCC = 3.0 V to 3.6 V; CL = 15 pF  
-
-
-
-
-
4.6  
3.2  
6.5  
4.6  
17  
8.8  
5.9  
12.3  
7.9  
-
ns  
ns  
ns  
ns  
pF  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
VCC = 3.0 V to 3.6 V; CL = 50 pF  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
[1]  
[2]  
[3] [4]  
CPD  
power dissipation CL = 50 pF; fi = 1 MHz  
capacitance  
Tamb = 40 °C to +85 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
VCC = 3.0 V to 3.6 V; CL = 15 pF  
1.0  
1.0  
1.0  
1.0  
-
-
-
-
10.5  
7.0  
ns  
ns  
ns  
ns  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
VCC = 3.0 V to 3.6 V; CL = 50 pF  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
14.0  
9.0  
Tamb = 40 °C to +125 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
VCC = 3.0 V to 3.6 V; CL = 15 pF  
1.0  
1.0  
1.0  
1.0  
-
-
-
-
12.0  
8.0  
ns  
ns  
ns  
ns  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
VCC = 3.0 V to 3.6 V; CL = 50 pF  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
16.0  
10.5  
[1] Typical values are measured at VCC = 3.3 V.  
[2] Typical values are measured at VCC = 5.0 V.  
[3] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = number of inputs switching;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
[4] The condition is VI = GND to VCC  
.
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
9 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
Table 11: Dynamic characteristics type 74AHCT2G08  
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); tr = tf 3.0 ns; see Figure 7.  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Tamb = 25 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
[1]  
[1]  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
-
-
-
3.6  
5.1  
19  
6.2  
7.9  
-
ns  
ns  
pF  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
power dissipation CL = 50 pF; fi = 1 MHz  
capacitance  
[2] [3]  
CPD  
Tamb = 40 °C to +85 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
1.0  
1.0  
-
-
7.1  
9.0  
ns  
ns  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
Tamb = 40 °C to +125 °C  
tPHL, tPLH propagation delay see Figure 6  
nA and nB to nY  
VCC = 4.5 V to 5.5 V; CL = 15 pF  
1.0  
1.0  
-
-
8.0  
ns  
ns  
VCC = 4.5 V to 5.5 V; CL = 50 pF  
10.5  
[1] Typical values are measured at VCC = 5.0 V.  
[2] CPD is used to determine the dynamic power dissipation (PD in µW).  
PD = CPD × VCC2 × fi × N + Σ(CL × VCC2 × fo) where:  
fi = input frequency in MHz;  
fo = output frequency in MHz;  
CL = output load capacitance in pF;  
VCC = supply voltage in Volts;  
N = total load switching outputs;  
Σ(CL × VCC2 × fo) = sum of the outputs.  
[3] The condition is VI = GND to VCC  
.
13. Waveforms  
V
I
V
nA, nB input  
GND  
M
t
t
PLH  
PHL  
V
OH  
nY output  
V
M
V
OL  
mna224  
74AHC2G08: VM = 50 % VCC; VI = GND to VCC  
74AHCT2G08: VM = 1.5 V; VI = GND to 3.0 V.  
.
Fig 6. The input (nA and nB) to output (nY) propagation delays.  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
10 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
V
CC  
V
V
O
I
PULSE  
GENERATOR  
D.U.T.  
C
L
R
T
mna101  
Definitions for test circuit:  
CL = Load capacitance including jig and probe capacitance (See Section 12 for the value).  
RT = Termination resistance should be equal to the output impedance Zo of the pulse  
generator.  
Fig 7. Load circuitry for switching times.  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
11 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
14. Package outline  
TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm; lead length 0.5 mm  
SOT505-2  
D
E
A
X
c
H
v
M
y
A
E
Z
5
8
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
detail X  
1
4
e
w
M
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
A
A
A
b
c
D
E
e
H
E
L
L
p
UNIT  
v
w
y
Z
θ
1
2
3
p
max.  
0.15  
0.00  
0.95  
0.75  
0.38  
0.22  
0.18  
0.08  
3.1  
2.9  
3.1  
2.9  
4.1  
3.9  
0.47  
0.33  
0.70  
0.35  
8°  
0°  
mm  
1.1  
0.65  
0.25  
0.5  
0.2  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-01-16  
SOT505-2  
- - -  
Fig 8. Package outline SOT505-2 (TSSOP8).  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
12 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
VSSOP8: plastic very thin shrink small outline package; 8 leads; body width 2.3 mm  
SOT765-1  
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
A
1
(A )  
3
pin 1 index  
θ
L
p
L
detail X  
1
4
e
w
M
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(2)  
(1)  
A
A
A
b
c
D
E
e
H
L
L
p
Q
UNIT  
v
w
y
Z
θ
1
2
3
p
E
max.  
0.15  
0.00  
0.85  
0.60  
0.27  
0.17  
0.23  
0.08  
2.1  
1.9  
2.4  
2.2  
3.2  
3.0  
0.40  
0.15  
0.21  
0.19  
0.4  
0.1  
8°  
0°  
mm  
1
0.5  
0.12  
0.4  
0.2  
0.13  
0.1  
Notes  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
02-06-07  
SOT765-1  
MO-187  
Fig 9. Package outline SOT765-1 (VSSOP8).  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
13 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 0.95 x 1.95 x 0.5 mm  
SOT833-1  
b
1
2
3
4
4×  
(2)  
L
L
1
e
8
7
6
5
e
1
e
1
e
1
8×  
(2)  
A
A
1
D
E
terminal 1  
index area  
0
1
2 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
A
A
1
UNIT  
b
D
E
e
e
L
L
1
1
max max  
0.25  
0.17  
2.0  
1.9  
1.0  
0.9  
0.35 0.40  
0.27 0.32  
mm  
0.5 0.04  
0.6  
0.5  
Notes  
1. Including plating thickness.  
2. Can be visible in some manufacturing processes.  
REFERENCES  
OUTLINE  
VERSION  
EUROPEAN  
PROJECTION  
ISSUE DATE  
IEC  
JEDEC  
JEITA  
- - -  
04-07-15  
04-07-22  
SOT833-1  
- - -  
MO-252  
Fig 10. Package outline SOT833_1 (XSON8).  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
14 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
15. Revision history  
Table 12: Revision history  
Document ID  
Release date Data sheet status Change notice Doc. number  
Supersedes  
74AHC_AHCT2G08_2 20041018  
Product data sheet  
-
9397 750 13735 74AHC_AHCT2G08_1  
Modifications:  
Adding features, ordering information, pinning, and package outline  
74AHC_AHCT2G08_1 20040206  
Product data sheet  
-
9397 750 12533  
-
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
15 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
16. Data sheet status  
Level Data sheet status[1] Product status[2] [3]  
Definition  
I
Objective data  
Development  
This data sheet contains data from the objective specification for product development. Philips  
Semiconductors reserves the right to change the specification in any manner without notice.  
II  
Preliminary data  
Qualification  
This data sheet contains data from the preliminary specification. Supplementary data will be published  
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in  
order to improve the design and supply the best possible product.  
III  
Product data  
Production  
This data sheet contains data from the product specification. Philips Semiconductors reserves the  
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant  
changes will be communicated via a Customer Product/Process Change Notification (CPCN).  
[1]  
[2]  
Please consult the most recently issued data sheet before initiating or completing a design.  
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at  
URL http://www.semiconductors.philips.com.  
[3]  
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.  
17. Definitions  
18. Disclaimers  
Short-form specification The data in a short-form specification is  
extracted from a full data sheet with the same type number and title. For  
detailed information see the relevant data sheet or data handbook.  
Life support — These products are not designed for use in life support  
appliances, devices, or systems where malfunction of these products can  
reasonably be expected to result in personal injury. Philips Semiconductors  
customers using or selling these products for use in such applications do so  
at their own risk and agree to fully indemnify Philips Semiconductors for any  
damages resulting from such application.  
Limiting values definition Limiting values given are in accordance with  
the Absolute Maximum Rating System (IEC 60134). Stress above one or  
more of the limiting values may cause permanent damage to the device.  
These are stress ratings only and operation of the device at these or at any  
other conditions above those given in the Characteristics sections of the  
specification is not implied. Exposure to limiting values for extended periods  
may affect device reliability.  
Right to make changes — Philips Semiconductors reserves the right to  
make changes in the products - including circuits, standard cells, and/or  
software - described or contained herein in order to improve design and/or  
performance. When the product is in full production (status ‘Production’),  
relevant changes will be communicated via a Customer Product/Process  
Change Notification (CPCN). Philips Semiconductors assumes no  
responsibility or liability for the use of any of these products, conveys no  
license or title under any patent, copyright, or mask work right to these  
products, and makes no representations or warranties that these products are  
free from patent, copyright, or mask work right infringement, unless otherwise  
specified.  
Application information Applications that are described herein for any  
of these products are for illustrative purposes only. Philips Semiconductors  
make no representation or warranty that such applications will be suitable for  
the specified use without further testing or modification.  
19. Contact information  
For additional information, please visit: http://www.semiconductors.philips.com  
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com  
9397 750 13735  
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.  
Product data sheet  
Rev. 02 — 18 October 2004  
16 of 17  
74AHC2G08; 74AHCT2G08  
Philips Semiconductors  
Dual 2-input AND gate  
20. Contents  
1
2
3
4
5
6
General description . . . . . . . . . . . . . . . . . . . . . . 1  
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1  
Ordering information. . . . . . . . . . . . . . . . . . . . . 2  
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3  
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 3  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4  
8
8.1  
9
Functional description . . . . . . . . . . . . . . . . . . . 4  
Function table . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Recommended operating conditions. . . . . . . . 5  
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5  
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9  
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 15  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 16  
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 16  
Contact information . . . . . . . . . . . . . . . . . . . . 16  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
© Koninklijke Philips Electronics N.V. 2004  
All rights are reserved. Reproduction in whole or in part is prohibited without the prior  
written consent of the copyright owner. The information presented in this document does  
not form part of any quotation or contract, is believed to be accurate and reliable and may  
be changed without notice. No liability will be accepted by the publisher for any  
consequence of its use. Publication thereof does not convey nor imply any license under  
patent- or other industrial or intellectual property rights.  
Date of release: 18 October 2004  
Document number: 9397 750 13735  
Published in The Netherlands  

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