2PA1774RMB,315 [NXP]
2PA1774xMB series - 40 V, 100 mA PNP general-purpose transistors DFN 3-Pin;型号: | 2PA1774RMB,315 |
厂家: | NXP |
描述: | 2PA1774xMB series - 40 V, 100 mA PNP general-purpose transistors DFN 3-Pin |
文件: | 总12页 (文件大小:334K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
2PA1774xMB series
SOT883B
40 V, 100 mA PNP general-purpose transistors
Rev. 1 — 23 March 2012
Product data sheet
1. Product profile
1.1 General description
PNP general-purpose transistors in a leadless ultra small DFN1006B-3 (SOT883B)
Surface-Mounted Device (SMD) plastic package.
Table 1.
Product overview
Type number
Package
NXP
NPN complement
JEITA
JEDEC
2PA1774QMB
2PA1774RMB
2PA1774SMB
SOT883B
SOT883B
SOT883B
-
-
-
-
-
-
2PC4617QMB
2PC4617RMB
-
1.2 Features and benefits
Leadless ultra small SMD plastic
Power dissipation comparable to SOT23
AEC-Q101 qualified
package
Low package height of 0.37 mm
1.3 Applications
General-purpose switching and amplification
Mobile applications
1.4 Quick reference data
Table 2.
Symbol
VCEO
IC
Quick reference data
Parameter
Conditions
Min Typ Max Unit
collector-emitter voltage
collector current
DC current gain
2PA1774QMB
open base
-
-
-
-
40
V
100 mA
hFE
VCE = 6 V; IC = 1 mA
120
180
270
-
-
-
270
390
560
2PA1774RMB
2PA1774SMB
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
2. Pinning information
Table 3.
Pinning
Pin
1
Description
base
Simplified outline
Graphic symbol
3
1
2
emitter
3
3
collector
1
2
Transparent
top view
2
sym013
3. Ordering information
Table 4.
Ordering information
Type number
Package
Name
Description
Version
2PA1774xMB series DFN1006B-3 leadless ultra small plastic package;
SOT883B
3 solder lands; body 1.0 0.6 0.37 mm
4. Marking
Table 5.
Marking codes
Type number
2PA1774QMB
2PA1774RMB
2PA1774SMB
Marking code[1]
0100 0000
0000 1101
0000 1110
[1] For DFN1006B-3 (SOT883B) binary marking code description see Figure 1.
4.1 Binary marking code description
PIN 1 INDICATION
READING DIRECTION
READING EXAMPLE:
0111
1011
MARKING CODE
(EXAMPLE)
READING DIRECTION
006aac673
Fig 1. DFN1006B-3 (SOT883B) binary marking code description
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
2 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCBO
VCEO
VEBO
IC
Parameter
Conditions
open emitter
open base
Min
Max
50
40
5
Unit
V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
-
-
-
-
-
V
open collector
V
100
200
mA
mA
ICM
peak collector current
single pulse;
tp 1 ms
IBM
Ptot
peak base current
single pulse;
tp 1 ms
-
100
mA
[1][2]
[3][2]
total power dissipation
Tamb 25 C
-
250
mW
mW
C
-
590
Tj
junction temperature
ambient temperature
storage temperature
-
150
Tamb
Tstg
55
65
+150
+150
C
C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, mounting pad for collector 1 cm2.
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
3 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
6. Thermal characteristics
Table 7.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max
500
212
Unit
K/W
K/W
[1][2]
[3][2]
thermal resistance from
junction to ambient
in free air
-
-
-
-
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB, single-sided copper, mounting pad for collector 1 cm2.
006aab603
3
10
duty cycle =
1
Z
th(j-a)
0.75
(K/W)
0.5
0.2
0.33
2
10
0.1
0.05
0.02
10
0.01
0
1
10
−5
−4
−3
−2
−1
2
3
10
10
10
10
1
10
10
10
t
(s)
p
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
4 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
7. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
100
5
Unit
nA
ICBO
collector-base
cut-off current
VCB = 30 V; IE = 0 A
-
-
-
-
VCB = 30 V; IE = 0 A;
Tj = 150 C
A
IEBO
hFE
emitter-base
cut-off current
VEB = 4 V; IC = 0 A
-
-
100
nA
DC current gain
2PA1774QMB
2PA1774RMB
2PA1774SMB
VCE = 6 V; IC = 1 mA
120
180
270
-
-
-
-
-
270
390
560
200
[1]
VCEsat
fT
collector-emitter
saturation voltage
IC = 50 mA; IB = 5 mA
mV
MHz
pF
transition frequency VCE = 12 V; IC = 2 mA;
100
-
-
-
-
f = 100 MHz
Cc
collector capacitance VCB = 12 V; IE = ie = 0 A;
2.2
f = 1 MHz
[1] Pulse test: tp 300 s; 0.02.
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
5 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
mdb664
mdb665
3
−1200
−10
V
BE
(mV)
−1000
V
CEsat
(mV)
(1)
(2)
−800
−600
−400
−200
2
−10
(1)
(2)
(3)
(3)
−10
−10
−1
2
3
−1
2
3
−10
−1
−10
−10
−10
−1
−10
−10
−10
I
(mA)
I (mA)
C
C
VCE = 6 V
amb = 55 C
IC/IB = 10
(1) Tamb = 150 C
(1)
T
(2) Tamb = 25 C
(3) Tamb = 150 C
(2) Tamb = 25 C
(3) Tamb = 55 C
Fig 3. Base-emitter voltage as a function of collector
current; typical values
Fig 4. Collector-emitter saturation voltage as a
function of collector current; typical values
mdb668
mdb666
3
−1200
10
V
BEsat
(mV)
R
CEsat
(Ω)
-1000
2
(1)
(2)
10
−800
−600
−400
−200
(1)
(2)
10
(3)
(3)
1
−10
−1
2
−1
2
3
−10
−1
−10
−10
(mA)
−1
−10
−10
−10
I
C
I
(mA)
C
IC/IB = 10
IC/IB = 10
(1) Tamb = 55 C
(2) Tamb = 25 C
(1) Tamb = 150 C
(2) Tamb = 25 C
(3)
Tamb = 150 C
(3) Tamb = 55 C
Fig 5. Base-emitter saturation voltage as a function
of collector current; typical values
Fig 6. Collector-emitter equivalent on-resistance as a
function of collector current; typical values
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
6 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
8. Test information
8.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is
suitable for use in automotive applications.
9. Package outline
0.65
0.55
0.40
0.34
0.35
0.20
0.12
0.04 max
1
2
0.30
0.22
1.05
0.95
0.65
0.30
0.22
3
0.55
0.47
Dimensions in mm
11-11-02
Fig 7. Package outline DFN1006B-3 (SOT883B)
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
Packing quantity
10000
2PA1774xMB series DFN1006B-3 2 mm pitch, 8 mm tape and reel
(SOT883B)
-315
[1] For further information and the availability of packing methods, see Section 14.
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
7 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
11. Soldering
Footprint information for reflow soldering
SOT883B
1.3
0.7
R0.05 (8x)
0.9
0.6 0.7
0.25
(2x)
0.3
(2x)
0.3
0.4
0.4
(2x)
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
sot883b_fr
Reflow soldering is the only recommended soldering method.
Fig 8. Reflow soldering footprint DFN1006B-3 (SOT883B)
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
8 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
12. Revision history
Table 10. Revision history
Document ID
Release date
20120323
Data sheet status
Change notice
Supersedes
2PA1774XMB_SER v.1
Product data sheet
-
-
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
9 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Notwithstanding any damages that customer might incur for any reason
13.2 Definitions
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
13.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 March 2012
Document identifier: 2PA1774XMB_SER
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
2PA1774XMB_SER
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 23 March 2012
11 of 12
2PA1774xMB series
NXP Semiconductors
40 V, 100 mA PNP general-purpose transistors
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Binary marking code description. . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 7
Quality information . . . . . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
4.1
5
6
7
8
8.1
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 March 2012
Document identifier: 2PA1774XMB_SER
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