2PA1774SJT/R
更新时间：2024-09-18 13:03:05
品牌：NXP
描述：TRANSISTOR 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-89, 3 PIN, BIP General Purpose Small Signal
概述
规格参数
数据手册2PA1774SJT/R 概述
TRANSISTOR 100 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, PLASTIC, SC-89, 3 PIN, BIP General Purpose Small Signal 小信号双极晶体管
2PA1774SJT/R 规格参数
| 是否Rohs认证： | 符合 | 生命周期： | Obsolete |
| 零件包装代码： | SC-89 | 包装说明： | PLASTIC, SC-89, 3 PIN |
| 针数： | 3 | Reach Compliance Code： | unknown |
| ECCN代码： | EAR99 | 风险等级： | 5.44 |
| Is Samacsys： | N | 最大集电极电流 (IC)： | 0.1 A |
| 集电极-发射极最大电压： | 50 V | 配置： | SINGLE |
| 最小直流电流增益 (hFE)： | 270 | JESD-30 代码： | R-PDSO-F3 |
| JESD-609代码： | e3 | 元件数量： | 1 |
| 端子数量： | 3 | 封装主体材料： | PLASTIC/EPOXY |
| 封装形状： | RECTANGULAR | 封装形式： | SMALL OUTLINE |
| 峰值回流温度（摄氏度）： | NOT SPECIFIED | 极性/信道类型： | PNP |
| 认证状态： | Not Qualified | 表面贴装： | YES |
| 端子面层： | TIN | 端子形式： | FLAT |
| 端子位置： | DUAL | 处于峰值回流温度下的最长时间： | NOT SPECIFIED |
| 晶体管应用： | SWITCHING | 晶体管元件材料： | SILICON |
| 标称过渡频率 (fT)： | 100 MHz | Base Number Matches： | 1 |
2PA1774SJT/R 数据手册
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PDF下载2PA1774
PNP general-purpose transistor
Rev. 05 — 17 November 2009
Product data sheet
1. Product profile
1.1 General description
PNP transistor in a SOT416 (SC-75) plastic package. The NPN complement is 2PC4617.
1.2 Features
Low current (max. 150 mA)
Low voltage (max. 50 V)
1.3 Applications
General-purpose switching and amplification in communication, Electronic Data
Processing (EDP) and consumer applications.
2. Pinning information
Table 1.
Pinning
Pin
1
Description
base
Simplified outline
Symbol
3
3
2
emitter
3
collector
1
1
2
2
sym013
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
plastic surface mounted package; 3 leads
Version
2PA1774Q
2PA1774R
2PA1774S
SC-75
SOT416
2PA1774
NXP Semiconductors
PNP general-purpose transistor
4. Marking
Table 3.
Marking codes
Type number
2PA1774Q
2PA1774R
2PA1774S
Marking code
YQ
YR
YS
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
open emitter
open base
Min
Max
−60
Unit
V
VCBO
VCEO
VEBO
IC
collector-base voltage
-
collector-emitter voltage
emitter-base voltage
collector current (DC)
peak collector current
peak base current
-
−50
V
open collector
-
−6
V
-
−150
−200
−100
150
mA
mA
mA
mW
°C
ICM
-
IBM
-
[1]
Ptot
Tstg
Tj
total power dissipation
storage temperature
junction temperature
ambient temperature
Tamb ≤ 25 °C
-
−65
-
+150
150
°C
Tamb
−65
+150
°C
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
6. Thermal characteristics
Table 5.
Symbol Parameter
Rth(j-a) thermal resistance from
junction to ambient
Thermal characteristics
Conditions
Min
Typ
Max Unit
833 K/W
[1]
-
-
[1] Transistor mounted on an FR4 printed-circuit board, single-sided copper, tin-plated and standard footprint.
2PA1774_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 17 November 2009
2 of 7
2PA1774
NXP Semiconductors
PNP general-purpose transistor
7. Characteristics
Table 6.
Characteristics
T
amb = 25 °C unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
Max
−100
−5
Unit
nA
ICBO
collector-base
cut-off current
IE = 0 A; VCB = −30 V
-
-
-
-
IE = 0 A; VCB = −30 V;
Tj = 150 °C
μA
IEBO
hFE
emitter-base
cut-off current
IC = 0 A; VEB = −4 V
-
-
−100
nA
[1]
[1]
DC current gain IC = −1 mA; VCE = −6 V
2PA1774Q
120
180
270
-
-
-
-
-
270
390
560
−200
2PA1774R
2PA1774S
VCEsat
collector-emitter IC = −50 mA;
mV
saturation
IB = −5 mA
voltage
Cc
fT
collector
capacitance
IE = ie = 0 A;
VCB = −12 V; f = 1 MHz
-
-
-
2.2
-
pF
[1]
transition
frequency
IE = −2 mA;
VCE = −12 V;
f = 100 MHz
100
MHz
[1] Pulse test: tp ≤ 300 μs; δ ≤ 0.02.
2PA1774_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 17 November 2009
3 of 7
2PA1774
NXP Semiconductors
PNP general-purpose transistor
8. Package outline
Plastic surface-mounted package; 3 leads
SOT416
D
B
E
A
X
H
v
M
A
E
3
Q
A
A
1
1
2
c
e
b
w
M
B
1
p
L
p
e
detail X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
A
UNIT
b
c
D
E
e
e
H
L
p
Q
v
w
p
1
E
max
0.30
0.15
0.25
0.10
1.8
1.4
0.9
0.7
1.75
1.45
0.45
0.15
0.23
0.13
0.95
0.60
mm
0.1
1
0.5
0.2
0.2
REFERENCES
JEDEC JEITA
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
04-11-04
06-03-16
SOT416
SC-75
Fig 1. Package outline SOT416 (SC-75)
2PA1774_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 17 November 2009
4 of 7
2PA1774
NXP Semiconductors
PNP general-purpose transistor
9. Revision history
Table 7.
Revision history
Document ID
2PA1774_5
Release date
Data sheet status
Change notice
Supersedes
20091117
Product data sheet
-
2PA1774_4
Modifications:
• This data sheet was changed to reflect the new company name NXP Semiconductors,
including new legal definitions and disclaimers. No changes were made to the technical
content.
• Figure 1 “Package outline SOT416 (SC-75)”: updated
2PA1774_4
2PA1774_3
2PA1774_2
2PA1774_1
20041124
20001212
19990601
19970709
Product data sheet
-
-
-
-
2PA1774_3
2PA1774_2
2PA1774_1
-
Product specification
Preliminary specification
Preliminary specification
2PA1774_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 17 November 2009
5 of 7
2PA1774
NXP Semiconductors
PNP general-purpose transistor
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
10.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
10.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
2PA1774_5
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 05 — 17 November 2009
6 of 7
2PA1774
NXP Semiconductors
PNP general-purpose transistor
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 1
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 5
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 6
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 6
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . . 6
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 17 November 2009
Document identifier: 2PA1774_5
2PA1774SJT/R 相关器件
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| 2PA1774SM | NXP | PNP general purpose transistor | 获取价格 |
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| 2PA1774SM | NEXPERIA | PNP general purpose transistorProduction | 获取价格 |
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| 2PA1774SM,315 | NXP | 2PA1774M series - PNP general purpose transistor DFN 3-Pin | 获取价格 |
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| 2PA1774SMB | NEXPERIA | 40 V, 100 mA PNP general-purpose transistorsProduction | 获取价格 |
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| 2PA1774ST/R | NXP | TRANSISTOR 150 mA, 50 V, PNP, Si, SMALL SIGNAL TRANSISTOR, ROHS COMPLIANT, PLASTIC, SC-75, 3 PIN, BIP General Purpose Small Signal | 获取价格 |
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| 2PA1AA1SOEMD | WINCHESTER | Board Connector, 24 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Natural Insulator, Receptacle | 获取价格 |
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| 2PA2AA1SOEMD | WINCHESTER | Board Connector, 48 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Natural Insulator, Receptacle | 获取价格 |
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| 2PA3AA1SOEMD | WINCHESTER | Board Connector, 96 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Natural Insulator, Receptacle | 获取价格 |
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| 2PA3AA3SOEMD | WINCHESTER | Board Connector, 96 Contact(s), 4 Row(s), Male, Straight, 0.079 inch Pitch, Press Fit Terminal, Natural Insulator, Receptacle | 获取价格 |
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