LM3224MM-ADJ/NOPB [NSC]

IC 2.8 A SWITCHING REGULATOR, 1500 kHz SWITCHING FREQ-MAX, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8, Switching Regulator or Controller;
LM3224MM-ADJ/NOPB
型号: LM3224MM-ADJ/NOPB
厂家: National Semiconductor    National Semiconductor
描述:

IC 2.8 A SWITCHING REGULATOR, 1500 kHz SWITCHING FREQ-MAX, PDSO8, ROHS COMPLIANT, PLASTIC, MSOP-8, Switching Regulator or Controller

开关 光电二极管
文件: 总18页 (文件大小:906K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
September 2005  
LM3224  
615kHz/1.25MHz Step-up PWM DC/DC Converter  
General Description  
Features  
n Operating voltage range of 2.7V to 7V  
The LM3224 is a step-up DC/DC converter with a 0.15  
(typ.), 2.45A (typ.) internal switch and pin selectable operat-  
ing frequency. With the ability to convert 3.3V to multiple  
outputs of 8V, -8V, and 23V, the LM3224 is an ideal part for  
biasing TFT displays. With the high current switch it is also  
ideal for driving high current white LEDs for flash applica-  
tions. The LM3224 can be operated at switching frequencies  
of 615kHz and 1.25MHz allowing for easy filtering and low  
noise. An external compensation pin gives the user flexibility  
in setting frequency compensation, which makes possible  
the use of small, low ESR ceramic capacitors at the output.  
An external soft-start pin allows the user to control the  
amount of inrush current during start up. The LM3224 is  
available in a low profile 8-lead MSOP package.  
n 615kHz/1.25MHz pin selectable frequency operation  
n Over temperature protection  
n Optional soft-start function  
n 8-Lead MSOP package  
Applications  
n TFT Bias Supplies  
n Handheld Devices  
n Portable Applications  
n GSM/CDMA Phones  
n Digital Cameras  
n White LED Flash/Torch Applications  
Typical Application Circuit  
20097631  
© 2005 National Semiconductor Corporation  
DS200976  
www.national.com  
Connection Diagram  
Top View  
20097604  
8-Lead Plastic MSOP  
NS Package Number MUA08A  
Ordering Information  
Order Number  
LM3224MM-ADJ  
LM3224MMX-ADJ  
LM3224MM-ADJ  
LM3224MMX-ADJ  
Spec.  
Package  
Type  
NSC Package  
Drawing  
Supplied As  
Package Top Mark  
SEKB  
MSOP-8  
MUA08A  
MUA08A  
MUA08A  
MUA08A  
1000 Units, Tape and  
Reel  
MSOP-8  
MSOP-8  
MSOP-8  
3500 Units, Tape and  
SEKB  
SEKB  
SEKB  
Reel  
NOPB  
NOPB  
1000 Units, Tape and  
Reel  
3500 Units, Tape and  
Reel  
Pin Descriptions  
Pin  
1
Name  
VC  
Function  
Compensation network connection. Connected to the output of the voltage error amplifier.  
Output voltage feedback input.  
2
FB  
3
SHDN  
Shutdown control input, active low. This pin has an internal pulldown resistor so the  
default condition is off. The pin must be pulled high to turn on the device.  
Analog and power ground.  
4
5
6
7
8
GND  
SW  
Power switch input. Switch connected between SW pin and GND pin.  
Analog power input.  
VIN  
FSLCT  
SS  
Switching frequency select input. VIN = 1.25MHz. Ground = 615kHz.  
Soft-start Pin.  
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2
Block Diagram  
20097603  
inductor current then flows through the schottky diode to the  
load and output capacitor, cycle 2 of Figure 1 (b). The NMOS  
power device is then set by the oscillator at the end of the  
period and current flows through the NMOS power device  
once again.  
General Description  
The LM3224 utilizes a PWM control scheme to regulate the  
output voltage over all load conditions. The operation can  
best be understood referring to the block diagram and Figure  
1 of the Operation section. At the start of each cycle, the  
oscillator sets the driver logic and turns on the NMOS power  
device conducting current through the inductor, cycle 1 of  
Figure 1 (a). During this cycle, the voltage at the VC pin  
controls the peak inductor current. The VC voltage will in-  
crease with larger loads and decrease with smaller. This  
voltage is compared with the summation of the SW voltage  
and the ramp compensation. The ramp compensation is  
used in PWM architectures to eliminate the sub-harmonic  
oscillations that occur during duty cycles greater than 50%.  
Once the summation of the ramp compensation and switch  
voltage equals the VC voltage, the PWM comparator resets  
the driver logic turning off the NMOS power device. The  
The LM3224 has dedicated protection circuitry running dur-  
ing normal operation to protect the IC. The Thermal Shut-  
down circuitry turns off the NMOS power device when the  
die temperature reaches excessive levels. The UVP com-  
parator protects the NMOS power device during supply  
power startup and shutdown to prevent operation at voltages  
less than the minimum input voltage. The OVP comparator is  
used to prevent the output voltage from rising at no loads  
allowing full PWM operation over all load conditions. The  
LM3224 also features a shutdown mode decreasing the  
supply current to 0.1µA (typ.).  
3
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Absolute Maximum Ratings (Note 1)  
If Military/Aerospace specified devices are required,  
please contact the National Semiconductor Sales Office/  
Distributors for availability and specifications.  
Vapor Phase (60 sec.)  
Infrared (15 sec.)  
ESD Susceptibility  
(Note 5)  
215˚C  
220˚C  
VIN  
7.5V  
21V  
Human Body Model  
Machine Model  
2kV  
SW Voltage  
200V  
FB Voltage (Note 2)  
VC Voltage (Note 3)  
SHDN Voltage  
FSLCT  
7V  
1.26V 0.3V  
7.5V  
Operating Conditions  
Operating Junction  
Temperature Range (Note 6)  
Storage Temperature  
Supply Voltage  
7.5V  
−40˚C to +125˚C  
−65˚C to +150˚C  
2.7V to 7V  
Maximum Junction  
Temperature  
150˚C  
Power Dissipation(Note 4)  
Lead Temperature  
Internally Limited  
300˚C  
Maximum Output Voltage  
20V  
Electrical Characteristics  
Specifications in standard type face are for TJ = 25˚C and those with boldface type apply over the full Operating Tempera-  
ture Range ( TJ = −40˚C to +125˚C). VIN = 2.7V, FSLCT = SHDN = VIN, and IL = 0A, unless otherwise specified.  
Min  
(Note 6)  
Typ  
(Note 7)  
1.3  
Max  
(Note 6)  
2.0  
Symbol  
Parameter  
Conditions  
Units  
IQ  
Quiescent Current  
FB = 2V (Not Switching)  
VSHDN = 0V  
mA  
µA  
V
0.1  
2.0  
VFB  
Feedback Voltage  
1.2285  
1.26  
2.45  
2.1  
1.2915  
2.8  
I
CL(Note 8) Switch Current Limit  
VIN = 2.7V (Note 9)  
VIN = 3V, VOUT = 8V  
VIN = 3V, VOUT = 5V  
2.7V VIN 7V  
1.9  
A
2.2  
%VFB/VIN Feedback Voltage Line  
0.085  
35  
0.15  
%/V  
Regulation  
IB  
FB Pin Bias Current (Note  
10)  
250  
nA  
µA  
ISS  
VSS  
VIN  
gm  
SS Pin Current  
SS Pin Voltage  
Input Voltage Range  
7.5  
1.2090  
2.7  
11  
13  
1.2622  
7
1.2430  
V
µmho  
V/V  
%
Error Amp Transconductance I = 5µA  
Error Amp Voltage Gain  
40  
87  
78  
135  
AV  
DMAX  
fS  
Maximum Duty Cycle  
85  
450  
0.9  
92.5  
615  
1.25  
2.4  
0.3  
0.2  
0.15  
0.8  
0.8  
2.5  
2.6  
Switching Frequency  
Shutdown Pin Current  
FSLCT = Ground  
750  
1.5  
5.0  
1.2  
8.0  
0.4  
kHz  
MHz  
µA  
FSLCT = VIN  
VSHDN = 2.7V  
VSHDN = 0.3V  
VSW = 20V  
ISHDN  
IL  
Switch Leakage Current  
Switch RDSON  
µA  
V
RDSON  
ThSHDN  
VIN = 2.7V, ISW = 1A  
Output High  
Shutdown Threshold  
1.2  
2.3  
Output Low  
0.3  
2.7  
V
UVP  
On Threshold  
Off Threshold  
V
V
Note 1: Absolute maximum ratings are limits beyond which damage to the device may occur. Operating Ratings are conditions for which the device is intended to  
be functional, but device parameter specifications may not be guaranteed. For guaranteed specifications and test conditions, see the Electrical Characteristics.  
Note 2: The FB pin should never exceed V  
.
IN  
Note 3: Under normal operation the V pin may go to voltages above this value. This maximum rating is for the possibility of a voltage being applied to the pin,  
C
however the V pin should never have a voltage directly applied to it.  
C
Note 4: The maximum allowable power dissipation is a function of the maximum junction temperature, T (MAX), the junction-to-ambient thermal resistance, θ  
,
.
J
JA  
JA  
and the ambient temperature, T . The maximum allowable power dissipation at any ambient temperature is calculated using: P (MAX) = (T  
− T )/θ  
A
D
J(MAX)  
A
Exceeding the maximum allowable power dissipation will cause excessive die temperature, and the regulator will go into thermal shutdown.  
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4
Electrical Characteristics (Continued)  
Note 5: The human body model is a 100 pF capacitor discharged through a 1.5kresistor into each pin. The machine model is a 200pF capacitor discharged  
directly into each pin.  
Note 6: All limits guaranteed at room temperature (standard typeface) and at temperature extremes (bold typeface). All room temperature limits are 100%  
production tested. All limits at temperature extremes are guaranteed via correlation using standard Statistical Quality Control (SQC) methods. All limits are used to  
calculate Average Outgoing Quality Level (AOQL).  
Note 7: Typical numbers are at 25˚C and represent the most likely norm.  
Note 8: Duty cycle affects current limit due to ramp generator.  
Note 9: Current limit at 0% duty cycle. See TYPICAL PERFORMANCE section for Switch Current Limit vs. V  
Note 10: Bias current flows into FB pin.  
IN  
Typical Performance Characteristics  
SHDN Pin Current vs. SHDN Pin Voltage  
SS Pin Current vs. Temperature  
20097616  
20097617  
FSLCT Pin Current vs. FSLCT Pin Voltage  
FB Pin Current vs. Temperature  
20097619  
20097618  
5
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Typical Performance Characteristics (Continued)  
NMOS RDSON vs. Input Voltage  
615kHz Non-switching IQ vs. Input Voltage  
20097620  
20097621  
1.25MHz Non-switching IQ vs. Input Voltage  
615kHz Switching IQ vs. Input Voltage  
20097622  
20097623  
1.25MHz Switching IQ vs. Input Voltage  
615kHz Switching IQ vs. Temperature  
20097624  
20097625  
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6
Typical Performance Characteristics (Continued)  
1.25MHz Switching IQ vs. Temperature  
615kHz Switching Frequency vs. Temperature  
20097626  
20097627  
1.25MHz Switching Frequency vs. Temperature  
615kHz Maximum Duty Cycle vs. Temperature  
20097628  
20097629  
1.25MHz Maximum Duty Cycle vs. Temperature  
Switch Current Limit vs. VIN  
20097651  
20097660  
7
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Typical Performance Characteristics (Continued)  
Switch Current Limit vs. Temperature  
Switch Current Limit vs. Temperature  
20097662  
20097652  
1.25MHz Efficiency vs. Load Current  
20097653  
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8
Operation  
20097602  
FIGURE 1. Simplified Boost Converter Diagram  
(a) First Cycle of Operation (b) Second Cycle Of Operation  
CONTINUOUS CONDUCTION MODE  
The LM3224 is a current-mode, PWM boost regulator. A  
boost regulator steps the input voltage up to a higher output  
voltage. In continuous conduction mode (when the inductor  
current never reaches zero at steady state), the boost regu-  
lator operates in two cycles.  
SOFT-START CAPACITOR  
In the first cycle of operation, shown in Figure 1 (a), the  
transistor is closed and the diode is reverse biased. Energy  
is collected in the inductor and the load current is supplied by  
The LM3224 has a soft-start pin that can be used to limit the  
inductor inrush current on start-up. The external SS pin is  
used to tailor the soft-start for a specific application but is not  
required for all applications and can be left open when not  
needed. When used, a current source charges the external  
soft-start capacitor, Css. The soft-start time can be estimated  
as:  
COUT  
.
The second cycle is shown in Figure 1 (b). During this cycle,  
the transistor is open and the diode is forward biased. The  
energy stored in the inductor is transferred to the load and  
output capacitor.  
Tss = Css*1.24V/Iss  
The ratio of these two cycles determines the output voltage.  
The output voltage is defined approximately as:  
THERMAL SHUTDOWN  
The LM3224 includes thermal shutdown protection. If the die  
temperature exceeds 140˚C the regulator will shut off the  
power switch, significantly reducing power dissipation in the  
device. The switch will remain off until the die temperature is  
reduced to approximately 120˚C. If the cause of the excess  
heating is not removed (excessive ambient temperature,  
excessive power dissipation, or both) the device will con-  
tinue to cycle on and off in this manner to protect from  
damage.  
where D is the duty cycle of the switch, D and D' will be  
required for design calculations.  
SETTING THE OUTPUT VOLTAGE  
The output voltage is set using the feedback pin and a  
resistor divider connected to the output as shown in the  
typical operating circuit. The feedback pin voltage is 1.26V,  
so the ratio of the feedback resistors sets the output voltage  
according to the following equation:  
9
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Output Capacitor ESR Compensation) and 680pF CC  
Operation (Continued)  
INTRODUCTION TO COMPENSATION  
10nF. Refer to the Applications Information section for rec-  
ommended values for specific circuits and conditions. Refer  
to the Compensation section for other design requirement.  
COMPENSATION  
This section will present a general design procedure to help  
insure a stable and operational circuit. The designs in this  
datasheet are optimized for particular requirements. If differ-  
ent conversions are required, some of the components may  
need to be changed to ensure stability. Below is a set of  
general guidelines in designing a stable circuit for continu-  
ous conduction operation, in most all cases this will provide  
for stability during discontinuous operation as well. The  
power components and their effects will be determined first,  
then the compensation components will be chosen to pro-  
duce stability.  
INDUCTOR AND DIODE SELECTION  
Although the inductor sizes mentioned earlier are fine for  
most applications, a more exact value can be calculated. To  
ensure stability at duty cycles above 50%, the inductor must  
have some minimum value determined by the minimum  
input voltage and the maximum output voltage. This equa-  
tion is:  
20097605  
FIGURE 2. (a) Inductor current. (b) Diode current.  
The LM3224 is a current mode PWM boost converter. The  
signal flow of this control scheme has two feedback loops,  
one that senses switch current and one that senses output  
voltage.  
where fs is the switching frequency, D is the duty cycle, and  
RDSON is the ON resistance of the internal switch taken from  
the graph "NMOS RDSON vs. Input Voltage" in the Typical  
Performance Characteristics section. This equation is only  
To keep a current programmed control converter stable  
above duty cycles of 50%, the inductor must meet certain  
criteria. The inductor, along with input and output voltage,  
will determine the slope of the current through the inductor  
(see Figure 2 (a)). If the slope of the inductor current is too  
great, the circuit will be unstable above duty cycles of 50%.  
A 10µH to 15µH inductor is recommended for most 615 kHz  
applications, while a 4.7µH to 10µH inductor may be used for  
most 1.25 MHz applications. If the duty cycle is approaching  
the maximum of 85%, it may be necessary to increase the  
inductance by as much as 2X. See Inductor and Diode  
Selection for more detailed inductor sizing.  
>
good for duty cycles greater than 50% (D 0.5), for duty  
cycles less than 50% the recommended values may be  
used. The corresponding inductor current ripple as shown in  
Figure 2 (a) is given by:  
The inductor ripple current is important for a few reasons.  
One reason is because the peak switch current will be the  
average inductor current (input current or ILOAD/D’) plus iL.  
As a side note, discontinuous operation occurs when the  
inductor current falls to zero during a switching cycle, or iL  
is greater than the average inductor current. Therefore, con-  
tinuous conduction mode occurs when iL is less than the  
average inductor current. Care must be taken to make sure  
that the switch will not reach its current limit during normal  
operation. The inductor must also be sized accordingly. It  
should have a saturation current rating higher than the peak  
inductor current expected. The output voltage ripple is also  
affected by the total ripple current.  
The LM3224 provides a compensation pin (VC) to customize  
the voltage loop feedback. It is recommended that a series  
combination of RC and CC be used for the compensation  
network, as shown in the typical application circuit. For any  
given application, there exists a unique combination of RC  
and CC that will optimize the performance of the LM3224  
circuit in terms of its transient response. The series combi-  
nation of RC and CC introduces a pole-zero pair according to  
the following equations:  
The output diode for a boost regulator must be chosen  
correctly depending on the output voltage and the output  
current. The typical current waveform for the diode in con-  
tinuous conduction mode is shown in Figure 2 (b). The diode  
must be rated for a reverse voltage equal to or greater than  
the output voltage used. The average current rating must be  
greater than the maximum load current expected, and the  
peak current rating must be greater than the peak inductor  
current. During short circuit testing, or if short circuit condi-  
tions are possible in the application, the diode current rating  
where RO is the output impedance of the error amplifier,  
approximately 900k. For most applications, performance  
can be optimized by choosing values within the range 5kΩ ≤  
RC 100k(RC can be up to 200kif CC2 is used, see High  
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10  
source output. The size will generally need to be larger for  
applications where the regulator is supplying nearly the  
maximum rated output or if large load steps are expected. A  
minimum value of 10µF should be used for the less stressful  
condtions while a 22µF to 47µF capacitor may be required  
for higher power and dynamic loads. Larger values and/or  
lower ESR may be needed if the application requires very  
low ripple on the input source voltage.  
Operation (Continued)  
must exceed the switch current limit. Using Schottky diodes  
with lower forward voltage drop will decrease power dissipa-  
tion and increase efficiency.  
DC GAIN AND OPEN-LOOP GAIN  
Since the control stage of the converter forms a complete  
feedback loop with the power components, it forms a closed-  
loop system that must be stabilized to avoid positive feed-  
back and instability. A value for open-loop DC gain will be  
required, from which you can calculate, or place, poles and  
zeros to determine the crossover frequency and the phase  
margin. A high phase margin (greater than 45˚) is desired for  
the best stability and transient response. For the purpose of  
stabilizing the LM3224, choosing a crossover point well be-  
low where the right half plane zero is located will ensure  
sufficient phase margin.  
The choice of output capacitors is also somewhat arbitrary  
and depends on the design requirements for output voltage  
ripple. It is recommended that low ESR (Equivalent Series  
Resistance, denoted RESR) capacitors be used such as  
ceramic, polymer electrolytic, or low ESR tantalum. Higher  
ESR capacitors may be used but will require more compen-  
sation which will be explained later on in the section. The  
ESR is also important because it determines the peak to  
peak output voltage ripple according to the approximate  
equation:  
1
To ensure a bandwidth of  
⁄ or less of the frequency of the  
2
VOUT ) 2iLRESR (in Volts)  
RHP zero, calculate the open-loop DC gain, ADC. After this  
value is known, you can calculate the crossover visually by  
placing a −20dB/decade slope at each pole, and a +20dB/  
decade slope for each zero. The point at which the gain plot  
crosses unity gain, or 0dB, is the crossover frequency. If the  
A minimum value of 10µF is recommended and may be  
increased to a larger value. After choosing the output capaci-  
tor you can determine a pole-zero pair introduced into the  
control loop by the following equations:  
crossover frequency is less than 1⁄  
the RHP zero, the phase  
2
margin should be high enough for stability. The phase mar-  
gin can also be improved by adding CC2 as discussed later in  
this section. The equation for ADC is given below with addi-  
tional equations required for the calculation:  
Where RL is the minimum load resistance corresponding to  
the maximum load current. The zero created by the ESR of  
the output capacitor is generally very high frequency if the  
ESR is small. If low ESR capacitors are used it can be  
neglected. If higher ESR capacitors are used see the High  
Output Capacitor ESR Compensation section. Some suit-  
able capacitor vendors include Vishay, Taiyo-Yuden, and  
TDK.  
RIGHT HALF PLANE ZERO  
A current mode control boost regulator has an inherent right  
half plane zero (RHP zero). This zero has the effect of a zero  
in the gain plot, causing an imposed +20dB/decade on the  
rolloff, but has the effect of a pole in the phase, subtracting  
another 90˚ in the phase plot. This can cause undesirable  
effects if the control loop is influenced by this zero. To ensure  
the RHP zero does not cause instability issues, the control  
mc ) 0.072fs (in V/s)  
loop should be designed to have a bandwidth of less than 1⁄  
2
the frequency of the RHP zero. This zero occurs at a fre-  
quency of:  
where RL is the minimum load resistance, VIN is the mini-  
mum input voltage, gm is the error amplifier transconduc-  
tance found in the Electrical Characteristics table, and RD  
-
SON is the value chosen from the graph "NMOS RDSON vs.  
Input Voltage" in the Typical Performance Characteristics  
section.  
where ILOAD is the maximum load current.  
INPUT AND OUTPUT CAPACITOR SELECTION  
The switching action of a boost regulator causes a triangular  
voltage waveform at the input. A capacitor is required to  
reduce the input ripple and noise for proper operation of the  
regulator. The size used is dependant on the application and  
board layout. If the regulator will be loaded uniformly, with  
very little load changes, and at lower current outputs, the  
input capacitor size can often be reduced. The size can also  
be reduced if the input of the regulator is very close to the  
SELECTING THE COMPENSATION COMPONENTS  
The first step in selecting the compensation components RC  
and CC is to set a dominant low frequency pole in the control  
loop. Simply choose values for RC and CC within the ranges  
given in the Introduction to Compensation section to set this  
pole in the area of 10Hz to 500Hz. The frequency of the pole  
created is determined by the equation:  
11  
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changed a little more to optimize performance if desired.  
This is best done in the lab on a bench, checking the load  
step response with different values until the ringing and  
overshoot on the output voltage at the edge of the load steps  
is minimal. This should produce a stable, high performance  
circuit. For improved transient response, higher values of RC  
should be chosen. This will improve the overall bandwidth  
which makes the regulator respond more quickly to tran-  
sients. If more detail is required, or the most optimum per-  
formance is desired, refer to a more in depth discussion of  
compensating current mode DC/DC switching regulators.  
Operation (Continued)  
where RO is the output impedance of the error amplifier,  
approximately 900k. Since RC is generally much less than  
RO, it does not have much effect on the above equation and  
can be neglected until a value is chosen to set the zero fZC  
.
fZC is created to cancel out the pole created by the output  
capacitor, fP1. The output capacitor pole will shift with differ-  
ent load currents as shown by the equation, so setting the  
zero is not exact. Determine the range of fP1 over the ex-  
pected loads and then set the zero fZC to a point approxi-  
mately in the middle. The frequency of this zero is deter-  
mined by:  
POWER DISSIPATION  
The output power of the LM3224 is limited by its maximum  
power dissipation. The maximum power dissipation is deter-  
mined by the formula  
PD = (Tjmax - TA)/θJA  
where Tjmax is the maximum specidfied junction temperature  
(125˚C), TA is the ambient temperature, and θJA is the ther-  
mal resistance of the package.  
Now RC can be chosen with the selected value for CC.  
Check to make sure that the pole fPC is still in the 10Hz to  
500Hz range, change each value slightly if needed to ensure  
both component values are in the recommended range.  
LAYOUT CONSIDERATIONS  
The input bypass capacitor CIN, as shown in the typical  
operating circuit, must be placed close to the IC. This will  
reduce copper trace resistance which effects input voltage  
ripple of the IC. For additional input voltage filtering, a 100nF  
bypass capacitor can be placed in parallel with CIN, close to  
the VIN pin, to shunt any high frequency noise to ground. The  
output capacitor, COUT, should also be placed close to the  
IC. Any copper trace connections for the COUT capacitor can  
increase the series resistance, which directly effects output  
voltage ripple. The feedback network, resistors RFB1 and  
RFB2, should be kept close to the FB pin, and away from the  
inductor, to minimize copper trace connections that can in-  
ject noise into the system. Trace connections made to the  
inductor and schottky diode should be minimized to reduce  
power dissipation and increase overall efficiency. For more  
detail on switching power supply layout considerations see  
Application Note AN-1149: Layout Guidelines for Switching  
Power Supplies.  
HIGH OUTPUT CAPACITOR ESR COMPENSATION  
When using an output capacitor with a high ESR value, or  
just to improve the overall phase margin of the control loop,  
another pole may be introduced to cancel the zero created  
by the ESR. This is accomplished by adding another capaci-  
tor, CC2, directly from the compensation pin VC to ground, in  
parallel with the series combination of RC and CC. The pole  
should be placed at the same frequency as fZ1, the ESR  
zero. The equation for this pole follows:  
To ensure this equation is valid, and that CC2 can be used  
without negatively impacting the effects of RC and CC, fPC2  
must be greater than 10fZC  
.
CHECKING THE DESIGN  
With all the poles and zeros calculated the crossover fre-  
quency can be checked as described in the section DC Gain  
and Open-loop Gain. The compensation values can be  
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12  
Application Information  
20097608  
FIGURE 3. Triple Output TFT Bias (615 kHz operation)  
TRIPLE OUTPUT TFT BIAS  
C1 charges to 8V minus a diode drop ()0.4V if using a  
Schottky). When the transistor opens in the first cycle, D3  
conducts and C1’s polarity is reversed with respect to the  
output at C2, producing -8V.  
The circuit in Figure 3 shows how the LM3224 can be  
configured to provide outputs of 8V, 8V, and 23V, conve-  
nient for biasing TFT displays. The 8V output is regulated,  
while the −8V and 23V outputs are unregulated.  
The 23V output is realized with a series of capacitor charge  
pumps. It consists of four stages: the first stage includes C4,  
D4, and the LM3224 switch; the second stage uses C5, D5,  
and D1; the third stage includes C6, D6, and the LM3224  
switch; the final stage is C7 and D7. In the first stage, C4  
charges to 8V when the LM3224 switch is closed, which  
causes D5 to conduct when the switch is open. In the second  
stage, the voltage across C5 is VC4 + VD1 - VD5 = VC4 )  
8V when the switch is open. However, because C5 is refer-  
enced to the 8V output, the voltage at C5 is 16V when  
referenced to ground. In the third stage, the 16V at C5  
appears across C6 when the switch is closed. When the  
switch opens, C6 is referenced to the 8V output minus a  
diode drop, which raises the voltage at C6 with respect to  
ground to about 24V. Hence, in the fourth stage, C7 is  
charged to 24V when the switch is open. From the first stage  
The 8V output is generated by a typical boost topology. The  
basic operation of the boost converter is described in the  
OPERATION section. The output voltage is set with RFB1  
and RFB2 by:  
The compensation network of RC and CC are chosen to  
optimally stabilize the converter. The inductor also affects  
the stability. When operating at 615 kHz, a 10uH inductor is  
recommended to insure the converter is stable at duty cycles  
greater than 50%. Refer to the COMPENSATION section for  
more information.  
The -8V output is derived from a diode inverter. During the  
second cycle, when the transistor is open, D2 conducts and  
13  
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voltage closer to 24 - 3xVDIODE (about 22.8V if a 0.4V  
forward drop is assumed).  
Application Information (Continued)  
to the last, there are three diode drops that make the output  
20097649  
FIGURE 4. PWM White LED Flash/Torch Driver  
20097650  
FIGURE 5. Continuously Operating White LED Flash/Torch Driver  
www.national.com  
14  
flash enable FET is turned on to increase the current for the  
amount of time desired. The minimum guaranteed maximum  
output current for this circuit is the same as for Figure 4.  
Application Information (Continued)  
The LM3224 can be configured to drive high current white  
LEDs for the flash and torch functions of a digital camera,  
camera phone, or any other similar light source. The flash/  
torch can be set up with the circuit in Figure 4 by using the  
resistor RSET to determine the amount of current that will  
flow through the LED using the equation:  
TABLE 1. Maximum LED Drive current  
(FSW=1.25MHz, L=4.7µH, LED VFMAX=4V (VOUT=5.26V)  
VIN  
4.2  
4.1  
4.0  
3.9  
3.8  
3.7  
3.6  
3.5  
3.4  
3.3  
3.2  
3.1  
3.0  
2.9  
2.8  
2.7  
LED Drive Current (mA)  
ILED = VFB/RSET  
1077  
1047  
1017  
987  
958  
929  
900  
871  
842  
814  
785  
757  
729  
701  
673  
646  
If the flash and torch modes will both be used the resistor  
RSET can be chosen for the higher current flash value. To  
flash the circuit pull the SHDN high for the time duration  
needed for the flash. To enable a lower current torch mode a  
PWM signal can be applied to the SHDN pin. The torch  
current would then be approximately the percent ON time of  
the PWM signal multiplied by the flash (or maximum) cur-  
rent. The optional disconnect FET can be used to eliminate  
leakage current through the LEDs when the part is off and  
also to disconnect the LED when the input voltage exceeds  
the forward voltage drop of the LED. The maximum output  
current the LM3224 can supply in this configuration is shown  
in Table 1.  
Figure 5 is another method of driving a high current white  
LED. This circuit has a higher component count but allows  
the switcher to remain on continuously for torch mode reduc-  
ing stress on the supply. The two FETs also double for a  
disconnect function as described above. In this circuit the  
device and the torch enable FET are turned on setting a  
lower current through the LED. When flash is needed the  
Some Recommended Inductors (Others May Be Used)  
Manufacturer  
Inductor  
Contact Information  
www.coilcraft.com  
800-3222645  
Coilcraft  
DO3316 and DT3316 series  
TDK  
SLF10145 series  
www.component.tdk.com  
847-803-6100  
Pulse  
P0751 and P0762 series  
www.pulseeng.com  
www.sumida.com  
Sumida  
CDRH8D28 and CDRH8D43 series  
Some Recommended Input And Output Capacitors (Others May Be Used)  
Manufacturer  
Capacitor  
Contact Information  
Vishay Sprague  
293D, 592D, and 595D series tantalum  
www.vishay.com  
407-324-4140  
Taiyo Yuden  
High capacitance MLCC ceramic  
www.t-yuden.com  
408-573-4150  
ESRD seriec Polymer Aluminum Electrolytic  
SPV and AFK series V-chip series  
High capacitance MLCC ceramic  
Cornell Dubilier  
MuRata  
www.cde.com  
www.murata.com  
15  
www.national.com  
Application Information (Continued)  
20097661  
FIGURE 6. 1.25MHz, 5V Output  
20097663  
FIGURE 7. 1.25MHz, 8V Output  
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16  
Application Information (Continued)  
20097664  
FIGURE 8. 1.25MHz, 12V Output  
20097665  
FIGURE 9. 1.25MHz, 15V Output  
17  
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Physical Dimensions inches (millimeters) unless otherwise noted  
National does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and National reserves  
the right at any time without notice to change said circuitry and specifications.  
For the most current product information visit us at www.national.com.  
LIFE SUPPORT POLICY  
NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS  
WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNSEL OF NATIONAL SEMICONDUCTOR  
CORPORATION. As used herein:  
1. Life support devices or systems are devices or systems  
which, (a) are intended for surgical implant into the body, or  
(b) support or sustain life, and whose failure to perform when  
properly used in accordance with instructions for use  
provided in the labeling, can be reasonably expected to result  
in a significant injury to the user.  
2. A critical component is any component of a life support  
device or system whose failure to perform can be reasonably  
expected to cause the failure of the life support device or  
system, or to affect its safety or effectiveness.  
BANNED SUBSTANCE COMPLIANCE  
National Semiconductor manufactures products and uses packing materials that meet the provisions of the Customer Products  
Stewardship Specification (CSP-9-111C2) and the Banned Substances and Materials of Interest Specification (CSP-9-111S2) and contain  
no ‘‘Banned Substances’’ as defined in CSP-9-111S2.  
Leadfree products are RoHS compliant.  
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Americas Customer  
Support Center  
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Fax: +49 (0) 180-530 85 86  
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