UPD784031_技术文档

DATA SHEET

MOS INTEGRATED CIRCUIT

µPD784031

16/8-BIT SINGLE-CHIP MICROCONTROLLER

The µPD784031 is a product of the µPD784038 sub-series in the 78K/IV series. It contains various peripheral

hardware such as RAM, I/O ports, 8-bit resolution A/D and D/A converters, timers, serial interface, and interrupt

functions, as well as a high-speed, high-performance CPU.

The µPD784031 is a ROM-less product of the µPD784035 and µPD784036.

For specific functions and other detailed information, consult the following user’s manual.

This manual is required reading for design work.

µPD784038, 784038Y Sub-Series User’s Manual, Hardware : U11316E

78K/IV Series User’s Manual, Instruction

: U10905E

Features

• Pin-compatible with the µPD78234, µPD784026, and

µPD784038Y sub-series

• Timer/counters

16-bit timer/counter × 3 units

16-bit timer × 1 unit

• Minimum instruction execution time: 125 ns

(at 32 MHz)

• Standby function

• Number of I/O ports: 46

HALT/STOP/IDLE mode

• Serial interface: 3 channels

• Clock frequency division function

• Watchdog timer: 1 channel

UART/IOE (3-wire serial I/O): 2 channels

CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel

• PWM outputs: 2

• A/D converter: 8-bit resolution × 8 channels

• D/A converter: 8-bit resolution × 2 channels

• Power supply voltage: V^DD= 2.7 to 5.5 V

Applications

LBP, automatic-focusing camera, PPC, printer, electronic typewriter, air conditioner, electronic musical instru-

ments, cellular telephone, etc.

Ordering Information

Part number

Package

Internal ROM

(bytes)

None

Internal RAM

(bytes)

2 048

µPD784031GC-3B9

µPD784031GC-8BT

µPD784031GK-BE9

80-pin plastic QFP (14 × 14 × 2.7 mm)

80-pin plastic QFP (14 × 14 × 1.4 mm)

80-pin plastic TQFP (fine pitch) (12 × 12 mm)

None

2 048

None

2 048

The information in this document is subject to change without notice.

Document No. U11507EJ1V0DS00 (1st edition)

Date Published March 1997 J

Printed in Japan

The mark

shows major revised points.

1997

©

µPD784031

78K/IV Series Product Development Diagram

: Product under mass production

: Product under development

Standard Products Development

PD784038Y sub-series

µ

Product containing for

an I²C bus interface circuit

PD784038 sub-series

µ

80-pin, 8-bit A/D, 8-bit D/A

ROM: none/48K/64K/96K/128K

µ

PD784216Y sub-series

µPD784026 sub-series

80-pin, 8-bit A/D, 8-bit D/A

ROM: none/48K/64K

Product containing for

an I²C bus interface circuit

PD784216 sub-series

µ

100-pin, 8-bit A/D, 8-bit D/A

ROM: 96K/128K

µPD784054

80-pin, 10-bit A/D

ROM: 32K

µ

PD784046 sub-series sub-set

PD784046 sub-series

µ

80-pin, 10-bit A/D

ROM: 32K/64K

ASSP Development

PD784908 sub-series

µ

100-pin, built-in IEBus^TMcontroller

ROM: 96K/128K

PD784915 sub-series

µ

VCR servo, 100-pin, built-in

analog amplifier

ROM: 48K/62K

PD78F4943 sub-series

µ

80-pin, for CD-ROM

Flash memory: 56K

2

µPD784031

Functions

Item

Function

Number of basic instructions

(mnemonics)

113

General-purpose register

8 bits × 16 registers × 8 banks, or 16 bits × 8 registers × 8 banks (memory mapping)

Minimum instruction execution 125 ns/250 ns/500 ns/1 000 ns (at 32 MHz)

time

Internal

memory

ROM

RAM

None

2 048 bytes

Memory space

I/O ports

Program and data: 1M byte

Total

46

8

Input

Input/output

Output

34

4

Additional

function

pins

Pins with pull- 32

up resistor

Note

LED direct

8

drive outputs

Transistor

8

direct drive

Real-time output ports

Timer/counter

4 bits × 2, or 8 bits × 1

Timer/counter 0:

(16 bits)

Timer register × 1

Capture register × 1

Compare register × 2

Pulse output capability

• Toggle output

• PWM/PPG output

• One-shot pulse output

Timer/counter 1:

(8/16 bits)

Timer register × 1

Capture register × 1

Pulse output capability

• Real-time output (4 bits × 2)

Capture/compare register × 1

Compare register × 1

Timer/counter 2:

(8/16 bits)

Timer register × 1

Capture register × 1

Pulse output capability

• Toggle output

Capture/compare register × 1

Compare register × 1

• PWM/PPG output

Timer 3

:

Timer register × 1

(8/16 bits)

Compare register × 1

PWM outputs

12-bit resolution × 2 channels

Serial interface

UART/IOE (3-wire serial I/O)

: 2 channels (incorporating baud rate generator)

CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel

A/D converter

D/A converter

Watchdog timer

Standby

8-bit resolution × 8 channels

8-bit resolution × 2 channels

1 channel

HALT/STOP/IDLE mode

Interrupt

Hardware source

23 (16 internal, 7 external (sampling clock variable input: 1))

BRK instruction, BRKCS instruction, operand error

1 internal, 1 external

Software source

Nonmaskable

Maskable

15 internal, 6 external

•

4-level programmable priority

3 operation statuses: vectored interrupt, macro service, context switching

Supply voltage

Package

V^DD= 2.7 to 5.5 V

80-pin plastic QFP (14 × 14 × 2.7 mm)

80-pin plastic QFP (14 × 14 × 1.4 mm)

80-pin plastic TQFP (fine pitch) (12 × 12 mm)

Note Additional function pins are included in the I/O pins.

3

µPD784031

CONTENTS

1. DIFFERENCES BETWEEN µPD784038 SUB-SERIES ............................................................

6

2. MAIN DIFFERENCES BETWEEN µPD784038, µPD784038Y, µPD784026,

AND µPD78234 SUB-SERIES ...................................................................................................

7

8

3. PIN CONFIGURATION (TOP VIEW) .........................................................................................

4. SYSTEM CONFIGURATION EXAMPLE (PPC) ........................................................................ 10

5. BLOCK DIAGRAM...................................................................................................................... 11

6. LIST OF PIN FUNCTIONS ......................................................................................................... 12

6.1 Port Pins............................................................................................................................................

6.2 Non-Port Pins ...................................................................................................................................

6.3 I/O Circuits for Pins and Handling of Unused Pins ....................................................................

12

13

15

7. CPU ARCHITECTURE................................................................................................................ 18

7.1 Memory Space ..................................................................................................................................

7.2 CPU Registers ..................................................................................................................................

18

20

21

22

7.2.1

7.2.2

7.2.3

General-purpose registers ................................................................................................

Control registers ................................................................................................................

Special function registers (SFRs) ....................................................................................

8. PERIPHERAL HARDWARE FUNCTIONS ................................................................................ 27

8.1 Ports...................................................................................................................................................

8.2 Clock Generator ...............................................................................................................................

8.3 Real-Time Output Port.....................................................................................................................

8.4 Timers/Counters...............................................................................................................................

8.5 PWM Output (PWM0, PWM1) ..........................................................................................................

8.6 A/D Converter ...................................................................................................................................

8.7 D/A Converter ...................................................................................................................................

8.8 Serial Interface .................................................................................................................................

27

28

30

31

33

34

35

36

37

39

40

8.8.1

8.8.2

Asynchronous serial interface/three-wire serial I/O (UART/IOE) ................................

Synchronous serial interface (CSI)..................................................................................

8.9 Edge Detection Function ................................................................................................................

8.10 Watchdog Timer ...............................................................................................................................

9. INTERRUPT FUNCTION ............................................................................................................ 41

9.1 Interrupt Source ...............................................................................................................................

9.2 Vectored Interrupt ............................................................................................................................

9.3 Context Switching............................................................................................................................

9.4 Macro Service ...................................................................................................................................

9.5 Examples of Macro Service Applications.....................................................................................

41

43

44

45

4

µPD784031

10. LOCAL BUS INTERFACE.......................................................................................................... 47

10.1 Memory Expansion ..........................................................................................................................

10.2 Memory Space ..................................................................................................................................

10.3 Programmable Wait .........................................................................................................................

10.4 Pseudo-Static RAM Refresh Function ..........................................................................................

10.5 Bus Hold Function ...........................................................................................................................

47

48

49

11. STANDBY FUNCTION................................................................................................................ 50

12. RESET FUNCTION ..................................................................................................................... 51

13. INSTRUCTION SET .................................................................................................................... 52

14. ELECTRICAL CHARACTERISTICS .......................................................................................... 57

15. PACKAGE DRAWINGS.............................................................................................................. 77

16. RECOMMENDED SOLDERING CONDITIONS ......................................................................... 80

APPENDIX A

APPENDIX B

DEVELOPMENT TOOLS ...................................................................................... 82

RELATED DOCUMENTS ...................................................................................... 84

5

µPD784031

1. DIFFERENCES BETWEEN µPD784038 SUB-SERIES

The only difference between the µPD784031, µPD784035, µPD784036, µPD784037, and µPD784038 is their

capacity of internal memory.

The µPD78P4038 is produced by replacing the masked ROM in the µPD784035, µPD784036, µPD784037, or

µPD784038 with 128K-byte one-time PROM or EPROM. Table 1-1 shows the differences between these products.

Table 1-1. Differences between the µPD784038 Sub-Series

Product

µPD784031

µPD784035

µPD784036

µPD78P4038

µPD784037

µPD784038

Item

(under development) (under development)

Internal ROM

96K bytes

128K bytes

None

48K bytes

64K bytes

128K bytes

(one-time PROM

or EPROM)

(masked ROM)

(masked ROM) (masked ROM)

Internal RAM

Package

2 048 bytes

3 584 bytes

4 352 bytes

80-pin plastic QFP (14 × 14 × 2.7 mm)

80-pin plastic QFP (14 × 14 × 1.4 mm)

80-pin plastic TQFP (fine pitch) (12 × 12 mm)

80-pin ceramic

WQFN

(14 × 14 mm)

6

µPD784031

2. MAIN DIFFERENCES BETWEEN µPD784038, µPD784038Y, µPD784026, AND µPD78234 SUB-

SERIES

Series

µPD784038 sub-series

µPD784038Y sub-series

µPD784026 sub-series

µPD78234 sub-series

Item

Number of basic instructions

(mnemonics)

113

65

Minimum instruction execution 125 ns

160 ns

(at 25 MHz)

333 ns

time

(at 32 MHz)

(at 12 MHz)

Memory space (program/data) 1M byte in total

64K bytes/1M byte

Timer/counter

16-bit timer/counter × 1

8-bit timer/counter × 2

8-bit timer × 1

8/16-bit timer/counter × 2

8/16-bit timer × 1

Clock output function

Watchdog timer

Available

Unavailable

Serial interface

UART/IOE (3-wire serial I/O) UART/IOE (3-wire serial I/O) UART × 1 channel

× 2 channels

CSI (3-wire serial I/O, SBI)

CSI (3-wire serial I/O, 2-wire CSI (3-wire serial I/O, SBI)

× 1 channel

2

Note

serial I/O, I C bus

)

× 1 channel

Available

4 levels

Interrupt Context switching

Priority

Unavailable

2 levels

Standby function

3 modes (HALT, STOP, IDLE)

2 modes (HALT, STOP)

Fixed to fXX/2

Operation clock switching

Selectable from fXX/2, fXX/4, fXX/8, or fXX/16

Unavailable

MODE pin

TEST pin

To specify ROM-less mode

(always in the high level for

the µPD78233 or µPD78237)

functions

Pin for testing the device

Unavailable

Low level during ordinary use

Package

80-pin plastic QFP

(14 × 14 × 2.7 mm)

80-pin plastic QFP

(14 × 14 × 1.4 mm)

80-pin plastic TQFP

(fine pitch) (12 × 12 mm)

80-pin ceramic WQFN

(14 × 14 mm):

80-pin plastic QFP

(14 × 14 × 2.7 mm)

94-pin plastic QFP

(20 × 20 mm)

(14 × 14 × 2.7 mm)

80-pin plastic TQFP

(fine pitch) (12 × 12 mm):

for the µPD784021 only

80-pin ceramic WQFN

(14 × 14 mm):

84-pin plastic QFJ

(1 150 × 1 150 mil)

94-pin ceramic WQFN

(20 × 20 mm):

for the µPD78P4026 only

for the µPD78P4038 and

µPD78P4038Y only

for the µPD78P238 only

Note For the µPD784038Y sub-series only.

7

µPD784031

3. PIN CONFIGURATION (TOP VIEW)

•

80-pin plastic QFP (14 × 14 × 2.7 mm)

µPD784031GC-3B9

80-pin plastic QFP (14 × 14 × 1.4 mm)

µPD784031GC-8BT

80-pin plastic TQFP (fine pitch) (12 × 12 mm)

µPD784031GK-BE9

80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61

P32/SCK0/SCL

P33/SO0/SDA

P34/TO0

P74/ANI4

1

2

60

59

58

57

56

55

54

53

52

51

50

49

48

47

46

45

44

43

42

41

P73/ANI3

P72/ANI2

P71/ANI1

P70/ANI0

3

P35/TO1

4

P36/TO2

5

P37/TO3

V

DD0

6

RESET

P17

7

V

DD1

X2

X1

P16

8

P15

9

P14/T

XD2/SO2

10

11

12

13

14

15

16

17

18

19

20

VSS1

P13/R

XD2/SI2

P00

P01

P02

P03

P04

P05

P06

P07

P12/ASCK2/SCK2

P11/PWM1

P10/PWM0

TEST^Note

V

SS0

ASTB

AD0

AD1

AD2

P67/REFRQ/HLDAK

21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40

Note Connect the TEST pin to V^SS0directly.

8

µPD784031

A8-A19

: Address bus

P70-P77

: Port 7

AD0-AD7

ANI0-ANI7

ANO0, ANO1

ASCK, ASCK2

ASTB

: Address/data bus

: Analog input

PWM0, PWM1 : Pulse width modulation output

RD

: Read strobe

: Refresh request

: Reset

: Analog output

: Asynchronous serial clock

: Address strobe

: Analog power supply

: Reference voltage

: Analog ground

: Clock input

REFRQ

RESET

RxD, RxD2

SCK0-SCK2

SCL

: Receive data

: Serial clock

: Serial data

: Serial input

: Serial output

: Test

AV^DD

AV^REF1-AVREF3

AV^SS

SDA

CI

SI0-SI2

SO0-SO2

TEST

HLDAK

: Hold acknowledge

: Hold request

HLDRQ

INTP0-INTP5

NMI

: Interrupt from peripherals

: Non-maskable interrupt

: Port 0

TO0-TO3

TxD, TxD2

V^DD0, VDD1

V^SS0, VSS1

WAIT

: Timer output

: Transmit data

: Power supply

: Ground

P00-P07

P10-P17

P20-P27

P30-P37

: Port 1

: Port 2

: Wait

: Port 3

WR

: Write strobe

: Crystal

P60-P63, P66, P67 : Port 6

X1, X2

9

µPD784031

4. SYSTEM CONFIGURATION EXAMPLE (PPC)

µ

PD784031

P11

Sensing paper

Serial

RxD

TxD

Sensing paper feed

Sensing paper ejection

P15

P16

P17

communication

µ

PD27C1001A

Sensing the position of the scanner station

OE

CE

RD

SCK1

SI1

SO1

Operator

panel

A17

A8-A16

High-voltage

control circuit

Drum, toner, and charge for

transfer

O0-O7

µ

P04

P06

PD74HC573

A0-A7

AD0-AD7

ASTB

Fusing heater

control circuit

Fusing roller

P07

P66

Lamp for lighting the original

Lamp for discharging

Lamp regulator

Sensing paper transport

INTP0

ANI0

Temperature of the

fusing heater

(DC stepping motor)

PWM0

M

Main motor

P00-P03

Brightness of the lamp

ANI1

ANI2

ANI3

Clutch for stopping

the scanner station

SL

P33

P34

P35

P36

P37

Lever for adjusting

the tone of the copy

Clutch for forwarding

the scanner station

SL

Driver

Clutch for the resist

shutter

Lever for compensating

the tone of the copy

Clutch for manual

feeding

Clutch for cassette

feeding

Reset

circuit

SL

RESET

Solenoid

10

µPD784031

5. BLOCK DIAGRAM

RxD/SI1

TxD/SO1

NMI

UART/IOE2

Programmable

interrupt controller

Baud-rate

generator

INTP0-INTP5

ASCK/SCK1

RxD2/SI2

TxD2/SO2

INTP3

TO0

UART/IOE1

Timer/counter 0

(16 bits)

Baud-rate

generator

TO1

ASCK2/SCK2

SCK0/SCL

SO0/SDA

Timer/counter 1

(16 bits)

INTP0

Clocked serial

interface

SI0

INTP1

INTP2/CI

TO2

ASTB

78K/IV

CPU core

Timer/counter 2

(16 bits)

AD0-AD7

A8-A15

TO3

A16-A19

RD

Bus interface

Timer 3

(16 bits)

WR

WAIT/HLDRQ

REFRQ/HLDAK

P00-P03

P04-P07

Real-time output

port

P00-P07

P10-P17

P20-P27

Port 0

Port 1

Port 2

RAM

PWM0

PWM1

PWM

ANO0

ANO1

AVREF2

AVREF3

P30-P37

Port 3

Port 6

D/A converter

P60-P63

P66, P67

ANI0-ANI7

AVDD

P70-P77

RESET

Port 7

AVREF1

AVSS

A/D converter

Watchdog timer

TEST

INTP5

System control

X1

X2

VDD0, VDD1

VSS0, VSS1

11

µPD784031

6. LIST OF PIN FUNCTIONS

6.1 Port Pins

Dual-function

-

Function

I/O

P00-P07

Port 0 (P0):

• 8-bit I/O port.

• Functions as a real-time output port (4 bits × 2).

• Inputs and outputs can be specified bit by bit.

• The use of the pull-up resistors can be specified by software for the pins

in the input mode together.

• Can drive a transistor.

Port 1 (P1):

P10

PWM0

I/O

• 8-bit I/O port.

P11

PWM1

• Inputs and outputs can be specified bit by bit.

P12

ASCK2/SCK2

RxD2/SI2

TxD2/SO2

-

• The use of the pull-up resistors can be specified by software for the pins

P13

in the input mode together.

P14

• Can drive LED.

P15-P17

P20

Port 2 (P2):

NMI

Input

• 8-bit input-only port.

P21

INTP0

• P20 does not function as a general-purpose port (nonmaskable inter-

rupt). However, the input level can be checked by an interrupt service

routine.

P22

INTP1

P23

INTP2/CI

INTP3

P24

• The use of the pull-up resistors can be specified by software for pins

P25

INTP4/ASCK/SCK1

INTP5

P22 to P27 (in units of 6 bits).

P26

• The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 output pin by

CSIM1.

P27

SI0

Port 3 (P3):

P30

RxD/SI1

TxD/SO1

SCK0/SCL

SO0/SDA

TO0-TO3

A16-A19

WAIT/HLDRQ

REFRQ/HLDAK

I/O

• 8-bit I/O port.

P31

• Inputs and outputs can be specified bit by bit.

P32

• The use of the pull-up resistors can be specified by software for the pins

P33

in the input mode together.

P34-P37

P60-P63

P66

Port 6 (P6):

I/O

• P60 to P63 are an output-only port.

• Inputs and outputs can be specified bit by bit for pins P66 and P67.

P67

• The use of the pull-up resistors can be specified by software for the pins

in the input mode together.

Port 7 (P7):

P70-P77

ANI0-ANI7

• 8-bit I/O port.

• Inputs and outputs can be specified bit by bit.

12

µPD784031

6.2 Non-Port Pins (1/2)

TO0-TO3

CI

I/O

Dual-function

P34-P37

Function

Output

Input

Timer output

P23/INTP2

P30/SI1

Input of a count clock for timer/counter 2

Serial data input (UART0)

RXD

RXD2

TXD

P13/SI2

Serial data input (UART2)

Output

Input

P31/SO1

P14/SO2

P25/INTP4/SCK1

P12/SCK2

P33/SO0

P27

Serial data output (UART0)

TXD2

ASCK

ASCK2

SDA

SI0

Serial data output (UART2)

Baud rate clock input (UART0)

Baud rate clock input (UART2)

Serial data I/O (2-wire serial I/O)

Serial data input (3-wire serial I/O0)

Serial data input (3-wire serial I/O1)

Serial data input (3-wire serial I/O2)

Serial data output (3-wire serial I/O0)

Serial data output (3-wire serial I/O1)

Serial data output (3-wire serial I/O2)

Serial clock I/O (3-wire serial I/O0)

Serial clock I/O (3-wire serial I/O1)

Serial clock I/O (3-wire serial I/O2)

Serial clock I/O (2-wire serial I/O)

External interrupt request

I/O

Input

SI1

P30/RXD

SI2

P13/RXD2

P33/SDA

P31/TXD

SO0

Output

I/O

SO1

SO2

P14/TXD2

P32/SCL

P25/INTP4/ASCK

P12/ASCK2

P32/SCK0

P20

SCK0

SCK1

SCK2

SCL

NMI

Input

-

INTP0

INTP1

INTP2

INTP3

P21

•

Input of a count clock for timer/counter 1

Capture/trigger signal for CR11 or CR12

P22

•

Input of a count clock for timer/counter 2

Capture/trigger signal for CR22

P23/CI

P24

•

Input of a count clock for timer/counter 2

Capture/trigger signal for CR21

•

Input of a count clock for timer/counter 0

Capture/trigger signal for CR02

INTP4

INTP5

AD0-AD7

A8-A15

A16-A19

RD

P25/ASCK/SCK1

-

P26

Input of a conversion start trigger for A/D converter

Time multiplexing address/data bus (for connecting external memory)

High-order address bus (for connecting external memory)

High-order address bus during address expansion (for connecting external memory)

Strobe signal output for reading the contents of external memory

Strobe signal output for writing on external memory

Wait signal insertion

I/O

-

Output

Input

-

P60-P63

-

WR

WAIT

P66/HLDRQ

P67/HLDAK

P66/WAIT

P67/REFRQ

-

REFRQ

HLDRQ

HLDAK

ASTB

Output

Input

Refresh pulse output to external pseudo static memory

Input of bus hold request

Output

Output of bus hold response

Latch timing output of time multiplexing address (A0-A7) (for

connecting external memory)

13

µPD784031

6.2 Non-port pins (2/2)

RESET

I/O

Input

-

Dual-function

Function

-

Chip reset

X1

Crystal input for system clock oscillation (A clock pulse can also be input

to the X1 pin.)

X2

Analog voltage inputs for the A/D converter

Analog voltage inputs for the D/A converter

Application of A/D converter reference voltage

Application of D/A converter reference voltage

Positive power supply for the A/D converter

Ground for the A/D converter

ANI0-ANI7

ANO0, ANO1

AV^REF1

Input

Output

-

P70-P77

-

AVREF2, AVREF3

AVDD

AVSS

_VDD0Note 1

Positive power supply of the port part

Positive power supply except for the port part

Ground of the port part

_VDD1Note 1

_VSS0Note 2

_VSS1Note 2

Ground except for the port part

Directly connect to V^SS0. (The TEST pin is for the IC test.)

TEST

Notes 1. The potential of the VDD0 pin must be equal to that of the VDD1 pin.

2. The potential of the VSS0 pin must be equal to that of the VSS1 pin.

14

µPD784031

6.3 I/O Circuits for Pins and Handling of Unused Pins

Table 6-1 describes the types of I/O circuits for pins and the handling of unused pins.

Figure 6-1 shows the configuration of these various types of I/O circuits.

Table 6-1. Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)

I/O circuit type

5-H

I/O

Recommended connection method for unused pins

Input state : To be connected to VDD0

Output state: To be left open

P00-P07

P10/PWM0

P11/PWM1

P12/ASCK2/SCK2

P13/RxD2/SI2

P14/TxD2/SO2

P15-P17

8-C

5-H

P20/NMI

2

Input

To be connected to VDD0 or VSS0

To be connected to VDD0

P21/INTP0

P22/INTP1

2-C

P23/INTP2/CI

P24/INTP3

P25/INTP4/ASCK/SCK1 8-C

I/O

Input

I/O

Input state : To be connected to V^DD0

Output state: To be left open

To be connected to VDD0

P26/INTP5

2-C

5-H

10-B

5-H

P27/SI0

P30/RxD/SI1

P31/TxD/SO1

P32/SCK0/SCL

P33/SO0/SDA

P34/TO0-P37/TO3

AD0-AD7

Input state : To be connected to VDD0

Output state: To be left open

Note

A8-A15

Output

To be left open

P60/A16-P63/A19

RD

WR

P66/WAIT/HLDRQ

P67/REFRQ/HLDAK

P70/ANI0-P77/ANI7

I/O

Input state:

To be connected to VDD0

Output state: To be left open

Input state : To be connected to VDD0 or VSS0

Output state: To be left open

To be left open

20-A

ANO0, ANO1

ASTB

12

Output

4-B

Note These pins function as output-only pins depending on the internal circuit, though their I/O type is 5-H.

15

µPD784031

Table 6-1. Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)

I/O circuit type

I/O

Recommended connection method for unused pins

RESET

TEST

2

Input

-

1-A

To be connected to VSS0 directly

AVREF1-AVREF3

AVSS

-

To be connected to VSS0

AVDD

To be connected to VDD0

Caution When the I/O mode of an I/O dual-function pin is unpredictable, connect the pin to VDD0 through

a resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher

than that of the low level input at power-on or when I/O is switched by software).

Remark Since type numbers are consistent in the 78K series, those numbers are not always serial in each product.

(Some circuits are not included.)

16

µPD784031

Figure 6-1. I/O Circuits for Pins

Type 1

Type 2-C

V

DD0

VDD0

P

IN

Pull-up

enable

P

N

VSS0

IN

Type 2

Schmitt trigger input with hysteresis characteristics

Type 5-H

IN

VDD0

Schmitt trigger input with hysteresis characteristics

V

DD0

Type 4-B

Pull-up

enable

P

V^DD0

P

Data

P

Data

OUT

IN/OUT

Output

disable

Output

disable

N

VSS0

V

SS0

Input

enable

Push-pull output which can output high impedance

(both the positive and negative channels are off.)

Type 8-C

Type 12

VDD0

Pull-up

enable

P

VDD0

P

N

Data

P

Analog output

voltage

OUT

IN/OUT

Output

disable

N

VSS0

Type 10-B

Type 20-A

V

DD0

V

DD0

Data

P

Pull-up

enable

IN/OUT

P

Output

disable

N

V

DD0

Data

P

V

SS0

Comparator

IN/OUT

Open

P

N

drain

+

–

N

Output

disable

AVSS

V

SS0

AVREF

(Threshold voltage)

Input

enable

17

µPD784031

7. CPU ARCHITECTURE

7.1 Memory Space

A 1M-byte memory space can be accessed. By using a LOCATION instruction, the mode for mapping internal

data areas (special function registers and internal RAM) can be selected. A LOCATION instruction must always be

executed after a reset, and can be used only once.

(1) When the LOCATION 0 instruction is executed

Internal data areas are mapped to 0F700H-0FFFFH.

(2) When the LOCATION 0FH instruction is executed

Internal data areas are mapped to FF700H-FFFFFH.

18

µPD784031

7.2 CPU Registers

7.2.1 General-purpose registers

A set of general-purpose registers consists of sixteen general-purpose 8-bit registers. Two 8-bit general-purpose

registers can be combined to form a 16-bit general-purpose register. Moreover, four 16-bit general-purpose registers,

when combined with an 8-bit register for address extension, can be used as 24-bit address specification registers.

Eight banks of this register set are provided. The user can switch between banks by software or the context

switching function.

General-purpose registers other than the V, U, T, and W registers used for address extension are mapped onto

internal RAM.

Figure 7-2. General-Purpose Register Format

A (R1)

B (R3)

R5

X (R0)

C (R2)

R4

AX (RP0)

BC (RP1)

RP2

R7

R6

RP3

V

U

R9

R8

VVP (RG4)

R11

UUP (RG5)

D (R13)

TDE (RG6)

H (R15)

WHL (RG7)

VP (RP4)

UP (RP5)

DE (RP6)

HL (RP7)

R10

T

E (R12)

L (R14)

W

8 banks

The character strings enclosed in

parentheses represent absolute names.

Caution By setting the RSS bit of PSW to 1, R4, R5, R6, R7, RP2, and RP3 can be used as the X, A, C, B,

AX, and BC registers, respectively. However, this function must be used only when using

programs for the 78K/III series.

20

µPD784031

7.2.2 Control registers

(1) Program counter (PC)

This register is a 20-bit program counter. The program counter is automatically updated by program execution.

Figure 7-3. Format of Program Counter (PC)

19

0

PC

(2) Program Status Word (PSW)

This register holds the CPU state. The program status word is automatically updated by program execution.

Figure 7-4. Format of Program Status Word (PSW)

15

14

13

12

11

10

9

8

UF

RBS2

RBS1

RBS0

PSWH

PSWL

PSW

7

6

Z

5

4

3

2

1

0

S

RSS^Note

AC

IE

P/V

CY

Note This flag is used to maintain compatibility with the 78K/III series. This flag must be set to 0 when programs

for the 78K/III series are being used.

(3) Stack pointer (SP)

This register is a 24-bit pointer for holding the start address of the stack. The high-order 4 bits must be set

to 0.

Figure 7-5. Format of Stack Pointer (SP)

23

20

0

PC

0

21

µPD784031

7.2.3 Special function registers (SFRs)

The special function registers are registers with special functions such as mode registers and control registers

for built-in peripheral hardware. The special function registers are mapped onto the 256-byte space between 0FF00H

and 0FFFFH^Note

.

Note Applicable when the LOCATION 0 instruction is executed. FFF00H-FFFFFH when the LOCATION 0FH

instruction is executed.

Caution Never attempt to access addresses in this area where no SFR is allocated. Otherwise, the

µPD784031 may be placed in the deadlock state. The deadlock state can be cleared only by a

reset.

Table 7-1 lists the special function registers (SFRs). The titles of the table columns are explained below.

• Abbreviation ................... Symbol used to represent a built-in SFR. The abbreviations listed in the table are

reserved words for the NEC assembler (RA78K4). The C compiler (CC78K4) allows

the abbreviations to be used as sfr variables with the #pragma sfr command.

• R/W ................................. Indicates whether each SFR allows read and/or write operations.

R/W : Allows both read and write operations.

R

: Allows read operations only.

: Allows write operations only.

W

• Manipulatable bits .......... Indicates the maximum number of bits that can be manipulated whenever an SFR is

manipulated. An SFR that supports 16-bit manipulation can be described in the sfrp

operand. For address specification, an even-numbered address must be speci-

fied.

An SFR that supports 1-bit manipulation can be described in a bit manipulation

instruction.

• When reset ..................... Indicates the state of each register when RESET is applied.

22

µPD784031

Table 7-1. Special Function Registers (SFRs) (1/4)

Manipulatable bits

1 bit 8 bits 16 bits

Note

Address

Special function register (SFR) name

Abbreviation R/W

When reset

Undefined

0FF00H

0FF01H

0FF02H

0FF03H

0FF06H

0FF07H

0FF0EH

0FF0FH

0FF10H

0FF12H

0FF14H

0FF15H

0FF16H

0FF17H

0FF18H

0FF19H

0FF1AH

0FF1BH

0FF1CH

0FF1DH

0FF20H

0FF21H

0FF23H

0FF26H

0FF27H

0FF2EH

0FF30H

0FF31H

0FF32H

0FF33H

Port 0

Port 1

Port 2

Port 3

Port 6

Port 7

P0

R/W

o

-

o

-

P1

P2

R

-

P3

R/W

-

P6

-

00H

P7

Port 0 buffer register L P0L

P0H

-

Undefined

-

Port 0 buffer register H

-

Compare register (timer/counter 0)

Capture/compare register (timer/counter 0)

Compare register L (timer/counter 1)

Compare register H (timer/counter 1)

Capture/compare register L (timer/counter 1)

Capture/compare register H (timer/counter 1)

Compare register L (timer/counter 2)

Compare register H (timer/counter 2)

Capture/compare register L (timer/counter 2)

Capture/compare register H (timer/counter 2)

Compare register L (timer 3)

CR00

o

CR01

-

CR10 CR10W

-

o

-

CR11 CR11W

-

o

-

o

-

CR20 CR20W

-

o

-

CR21 CR21W

-

o

-

CR30 CR30W

-

o

-

Compare register H (timer 3)

-

Port 0 mode register

PM0

o

-

o

-

FFH

Port 1 mode register

PM1

Port 3 mode register

PM3

Port 6 mode register

PM6

Port 7 mode register

PM7

Real-time output port control register

Capture/compare control register 0

Timer output control register

RTPC

CRC0

TOC

00H

10H

00H

o

-

Capture/compare control register 1

Capture/compare control register 2

CRC1

CRC2

-

10H

Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is

executed, F0000H is added to each address.

23

µPD784031

Table 7-1. Special Function Registers (SFRs) (2/4)

Manipulatable bits

1 bit 8 bits 16 bits

Note

Address

Special function register (SFR) name

Abbreviation R/W

When reset

0000H

0FF36H

0FF38H

0FF39H

0FF3AH

0FF3BH

0FF41H

0FF43H

0FF4EH

0FF50H

0FF51H

0FF52H

0FF53H

0FF54H

0FF55H

0FF56H

0FF57H

0FF5CH

0FF5DH

0FF5EH

0FF5FH

0FF60H

0FF61H

0FF62H

0FF68H

0FF6AH

0FF70H

0FF71H

0FF72H

0FF74H

0FF7DH

0FF80H

0FF81H

0FF82H

Capture register (timer/counter 0)

Capture register L (timer/counter 1)

Capture register H (timer/counter 1)

Capture register L (timer/counter 2)

Capture register H (timer/counter 2)

Port 1 mode control register

CR02

R

-

o

-

o

CR12 CR12W

-

CR22 CR22W

-

o

-

o

-

PMC1

PMC3

PUO

TM0

R/W

R

o

-

o

-

00H

Port 3 mode control register

Register for optional pull-up resistor

Timer register 0

-

o

0000H

-

Timer register 1

Timer register 2

Timer register 3

TM1 TM1W

-

o

-

o

-

TM2 TM2W

-

o

-

TM3 TM3W

-

o

-

Prescaler mode register 0

Timer control register 0

PRM0

TMC0

PRM1

TMC1

DACS0

DACS1

DAM

R/W

-

o

-

o

-

11H

00H

11H

00H

o

-

Prescaler mode register 1

Timer control register 1

o

-

D/A conversion value setting register 0

D/A conversion value setting register 1

D/A converter mode register

A/D converter mode register

A/D conversion result register

PWM control register

-

o

-

03H

ADM

00H

ADCR

PWMC

PWPR

PWM0

PWM1

OSPC

IICC

R

Undefined

05H

R/W

o

-

PWM prescaler register

00H

PWM modulo register 0

-

Undefined

PWM modulo register 1

-

One-shot pulse output control register

o

-

o

00H

2

I C bus control register

Prescaler mode register for serial clock

Synchronous serial interface mode register

SPRM

CSIM

04H

00H

o

Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is

executed, F0000H is added to each address.

24

µPD784031

Table 7-1. Special Function Registers (SFRs) (3/4)

Manipulatable bits

1 bit 8 bits 16 bits

Note 1

Address

Special function register (SFR) name

Abbreviation R/W

When reset

00H

0FF84H

0FF85H

0FF86H

0FF88H

0FF89H

0FF8AH

0FF8BH

0FF8CH

Synchronous serial interface mode register 1

Synchronous serial interface mode register 2

Serial shift register

CSIM1

CSIM2

SIO

R/W

o

-

o

-

o

Asynchronous serial interface mode register

ASIM

o

-

Asynchronous serial interface mode register 2 ASIM2

Asynchronous serial interface status register

ASIS

R

Asynchronous serial interface status register 2 ASIS2

Serial receive buffer: UART0

Serial transmission shift register: UART0

Serial shift register: IOE1

RXB

Undefined

TXS

W

-

SIO1

R/W

R

-

0FF8DH

Serial receive buffer: UART2

Serial transmission shift register: UART2

Serial shift register: IOE2

RXB2

TXS2

SIO2

-

W

-

R/W

-

0FF90H

0FF91H

0FFA0H

0FFA1H

0FFA4H

0FFA8H

0FFAAH

0FFACH

0FFADH

0FFAEH

0FFC0H

0FFC2H

0FFC4H

0FFC5H

0FFC6H

0FFC7H

0FFC8H

Baud rate generator control register

Baud rate generator control register 2

External interrupt mode register 0

External interrupt mode register 1

Sampling clock selection register

In-service priority register

BRGC

BRGC2

INTM0

INTM1

SCS0

ISPR

-

00H

-

o

-

R

o

-

Interrupt mode control register

Interrupt mask register 0L

IMC

R/W

80H

MK0L MK0

MK0H

MK1L

STBC

WDM

MM

FFFFH

Interrupt mask register 0H

Interrupt mask register 1L

o

-

o

FFH

30H

00H

20H

00H

Note 2

Standby control register

o

Note 2

Watchdog timer mode register

Memory expansion mode register

Hold mode register

-

o

-

o

-

HLDM

CLOM

PWC1

PWC2

Clock output mode register

Programmable wait control register 1

Programmable wait control register 2

AAH

-

AAAAH

Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is

executed, F0000H is added to each address.

2. A write operation can be performed only with special instructions MOV STBC,#byte and MOV

WDM,#byte. Other instructions cannot perform a write operation.

25

µPD784031

Table 7-1. Special Function Registers (SFRs) (4/4)

Manipulatable bits

1 bit 8 bits 16 bits

Note

Address

Special function register (SFR) name

Abbreviation R/W

When reset

00H

0FFCCH

0FFCDH

0FFCFH

0FFD0H-

0FFDFH

0FFE0H

0FFE1H

0FFE2H

0FFE3H

0FFE4H

0FFE5H

0FFE6H

0FFE7H

0FFE8H

0FFE9H

0FFEAH

0FFEBH

0FFECH

0FFEDH

0FFEEH

0FFEFH

Refresh mode register

RFM

RFA

R/W

o

-

o

-

Refresh area specification register

Oscillation settling time specification register

External SFR area

OSTS

-

o

-

Interrupt control register (INTP0)

Interrupt control register (INTP1)

Interrupt control register (INTP2)

Interrupt control register (INTP3)

Interrupt control register (INTC00)

Interrupt control register (INTC01)

Interrupt control register (INTC10)

Interrupt control register (INTC11)

Interrupt control register (INTC20)

Interrupt control register (INTC21)

Interrupt control register (INTC30)

Interrupt control register (INTP4)

Interrupt control register (INTP5)

Interrupt control register (INTAD)

Interrupt control register (INTSER)

Interrupt control register (INTSR)

Interrupt control register (INTCSI1)

Interrupt control register (INTST)

Interrupt control register (INTCSI)

Interrupt control register (INTSER2)

Interrupt control register (INTSR2)

Interrupt control register (INTCSI2)

Interrupt control register (INTST2)

PIC0

o

-

43H

PIC1

PIC2

PIC3

CIC00

CIC01

CIC10

CIC11

CIC20

CIC21

CIC30

PIC4

PIC5

ADIC

SERIC

SRIC

CSIIC1

STIC

0FFF0H

0FFF1H

0FFF2H

0FFF3H

CSIIC

SERIC2

SRIC2

CSIIC2

STIC2

0FFF4H

Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is

executed, F0000H is added to each address.

26

µPD784031

8. PERIPHERAL HARDWARE FUNCTIONS

8.1 Ports

The ports shown in Figure 8-1 are provided to enable the application of wide-ranging control. Table 8-1 lists the

functions of the ports. For the inputs to port 0 to port 6, a built-in pull-up resistor can be specified by software.

Figure 8-1. Port Configuration

P00

Port 0

P07

P10

Port 1

P17

P20-P27

P30

Port 2

8

Port 3

P37

P60

Port 6

Port 7

P63

P66

P67

P70

P77

27

µPD784031

Table 8-1. Port Functions

Port name

Port 0

Function

Pull-up specification by software

P00-P07

• Bit-by-bit input/output setting supported

• Operable as 4-bit real-time outputs

(P00-P03, P04-P07)

Specified as a batch for all pins placed in

input mode.

• Capable of driving transistors

Port 1

P10-P17

• Bit-by-bit input/output setting supported

• Capable of driving LEDs

Specified as a batch for all pins placed in

input mode.

Port 2

Port 3

P20-P27

P30-P37

• Input port

Specified for the 6 bits (P22-P27) as a batch.

• Bit-by-bit input/output setting supported

Specified as a batch for all pins placed in

input mode.

Port 6

Port 7

P60-P63

P66, P67

• Output-only port

Specified as a batch for all pins placed in

input mode.

• Bit-by-bit input/output setting supported

P70-P77

• Bit-by-bit input/output setting supported

-

8.2 Clock Generator

A circuit for generating the clock signal required for operation is provided. The clock generator includes a frequency

divider; low current consumption can be achieved by operating at a lower internal frequency when high-speed

operation is not necessary.

Figure 8-2. Block Diagram of Clock Generator

X1

f

XX

Oscillator

1/2

X2

f

CLK

CPU

Peripheral circuits

f

XX/2

UART/IOE

INTP0 noise eliminator

Oscillation settling timer

Remark fXX : Oscillator frequency or external clock input

fCLK: Internal operating frequency

28

µPD784031

Figure 8-3. Examples of Using Oscillator

(1) Crystal/ceramic oscillation

µ

PD784031

V

SS1

X1

X2

(2) External clock

• When EXTC bit of OSTS = 1

• When EXTC bit of OSTS = 0

µPD784031

PD784031

µ

X1

X2

Open

PD74HC04, etc.

µ

Caution When using the clock generator, to avoid problems caused by influences such as stray

capacitance, run all wiring within the area indicated by the dotted lines according to the following

rules:

• Minimize the wiring length.

• Wires must never cross other signal lines.

• Wires must never run near a line carrying a large varying current.

• The grounding point of the capacitor of the oscillator circuit must always be at the same

potential as V^SS1. Never connect the capacitor to a ground pattern carrying a large current.

• Never extract a signal from the oscillator circuit.

29

µPD784031

8.3 Real-Time Output Port

The real-time output port outputs data stored in the buffer, synchronized with a timer/counter 1 match interrupt

or external interrupt. Thus, pulse output that is free of jitter can be obtained.

Therefore, the real-time output port is best suited to applications (such as open-loop control over stepping motors)

where an arbitrary pattern is output at arbitrary intervals.

As shown in Figure 8-4, the real-time output port is built around port 0 and the port 0 buffer register (P0H, P0L).

Figure 8-4. Block Diagram of Real-Time Output Port

Internal bus

4

8

Real-time output port

control register

(RTPC)

Buffer register

8

P0H

4

P0L

4

INTP0 (externally)

INTC10 (from timer/counter 1)

INTC11 (from timer/counter 1)

Output trigger

control circuit

Output latch (P0)

P00

P07

30

µPD784031

8.4 Timers/Counters

Three timer/counter units and one timer unit are incorporated.

Moreover, seven interrupt requests are supported, allowing these units to function as seven timer/counter units.

Table 8-2. Timer/Counter Operation

Name

Timer/counter 0 Timer/counter 1 Timer/counter 2

Timer 3

Item

Count pulse width 8 bits

16 bits

-

o

Operating mode

Interval timer

2ch

1ch

External event counter

One-shot timer

o

-

o

Function

Timer output

2ch

-

2ch

-

Toggle output

o

-

o

-

PWM/PPG output

One-shot pulse output

Real-time output

o

-

o

-

Note

o

-

1 input

2

o

1 input

2

-

2 inputs

2

-

Pulse width measurement

-

Number of interrupt requests

1

Note The one-shot pulse output function makes the level of a pulse output active by software, and makes the

level of a pulse output inactive by hardware (interrupt request signal).

Note that this function differs from the one-shot timer function of timer/counter 2.

31

µPD784031

Figure 8-5. Timer/Counter Block Diagram

Timer/counter 0

Clear information

Software trigger

OVF

Timer register 0

(TM0)

f

xx/8

Prescaler

Match

Compare register

(CR00)

TO0

TO1

Compare register

(CR01)

Capture register

(CR02)

Edge

detection

INTP3

INTC00

INTC01

INTP3

Timer/counter 1

Clear information

Timer register 1

(TM1/TM1W)

f

xx/8

Prescaler

OVF

Match

Event input

Compare register

(CR10/CR10W)

INTC10

To real-time

output port

INTC11

Edge

detection

Capture/compare register

(CR11/CR11W)

INTP0

Capture register

(CR12/CR12W)

Timer/counter 2

Clear information

Timer register 2

(TM2/TM2W)

f

xx/8

Prescaler

OVF

Match

Compare register

(CR20/CR20W)

TO2

TO3

Edge

detection

INTP2/CI

INTP2

Capture/compare register

(CR21/CR21W)

Capture register

(CR22/CR22W)

Edge

detection

INTP1

INTC20

INTC21

INTP1

Timer 3

Clear

Timer register 3

(TM3/TM3W)

f

xx/8

Prescaler

CSI

Match

Compare register

(CR30/CR30W)

INTC30

Remark OVF: Overflow flag

32

µPD784031

8.5 PWM Output (PWM0, PWM1)

Two channels of PWM (pulse width modulation) output circuitry with a resolution of 12 bits and a repetition

frequency of 62.5 kHz (f^CLK= 16 MHz) are incorporated. Low or high active level can be selected for the PWM output

channels, independently of each other. This output is best suited to DC motor speed control.

Figure 8-6. Block Diagram of PWM Output Unit

Internal bus

16

8

PWM modulo register

PWM control register

8

7

4 3

15

0

PWMn

(PWMC)

8

4

Reload

control

Pulse control

circuit

8-bit

down-counter

Output

control

Prescaler

f

CLK

PWMn (output pin)

4-bit counter

1/256

Remark n = 0, 1

33

µPD784031

8.6 A/D Converter

An analog/digital (A/D) converter having 8 multiplexed analog inputs (ANI0-ANI7) is incorporated.

The successive approximation system is used for conversion. The result of conversion is held in the 8-bit A/D

conversion result register (ADCR). Thus, speedy high-precision conversion can be achieved. (The conversion time

is about 7.5 µs at fCLK = 16 MHz.)

A/D conversion can be started in any of the following modes:

• Hardware start: Conversion is started by means of trigger input (INTP5).

• Software start : Conversion is started by means of bit setting the A/D converter mode register (ADM).

After conversion has started, one of the following modes can be selected:

• Scan mode : Multiple analog inputs are selected sequentially to obtain conversion data from all pins.

• Select mode: A single analog input is selected at all times to enable conversion data to be obtained

continuously.

ADM is used to specify the above modes, as well as the termination of conversion.

When the result of conversion is transferred to ADCR, an interrupt request (INTAD) is generated. Using this feature,

the results of conversion can be continuously transferred to memory by the macro service.

Figure 8-7. Block Diagram of A/D Converter

ANI0

Series resistor string

Sample-and-hold circuit

ANI1

ANI2

ANI3

ANI4

ANI5

ANI6

ANI7

AV^REF1

R/2

R

Voltage comparator

Successive conver-

sion register (SAR)

Conversion

trigger

Edge

detector

INTAD

INTP5

Control

circuit

R/2

AVSS

Trigger enable

8

A/D converter mode

register (ADM)

A/D conversion

result register (ADCR)

8

Internal bus

34

µPD784031

8.7 D/A Converter

Two digital/analog (D/A) converter channels of voltage output type, having a resolution of 8 bits, are incorporated.

An R-2R resistor ladder system is used for conversion. By writing the value to be subject to D/A conversion in

the 8-bit D/A conversion value setting register (DACSn: n = 0, 1), the resulting analog value is output on ANOn

(n = 0, 1). The range of the output voltages is determined by the voltages applied to the AV^REF2and AVREF3 pins.

Because of its high output impedance, no current can be obtained from an output pin. When the load impedance

is low, insert a buffer amplifier between the load and the converter.

The impedance of the ANOn pin goes high while the RESET signal is low. DACSn is set to 0 after a reset

is released.

Figure 8-8. Block Diagram of D/A Converter

ANOn

2R

AVREF2

R

2R

Selector

R

2R

AV^REF3

R

2R

DACEn

DACSn

Internal bus

Remark n = 0, 1

35

µPD784031

8.8 Serial Interface

Three independent serial interface channels are incorporated.

• Asynchronous serial interface (UART)/three-wire serial I/O (IOE) × 2

• Synchronous serial interface (CSI) × 1

• Three-wire serial I/O (IOE)

• Two-wire serial I/O (IOE)

So, communication with points external to the system and local communication within the system can be performed

at the same time. (See Figure 8-9.)

Figure 8-9. Example Serial Interfaces

UART + Three-wire serial I/O + Two-wire serial I/O

PD784031 (master)

PD75108 (slave)

µ

[Three-wire serial I/O]

µ

PD4711A

SO1

SI1

SI

(UART)

SO

SCK

Port

RxD

TxD

SCK1

INTPm

Port

Note

RS-232-C

driver/receiver

Port

INT

VDD

V

DD

µ

PD78014 (slave)

SDA

SCL

SB0

SCK0

Port

Note

INTPn

Port

INT

[Two-wire serial I/O]

Note Handshake line

36

µPD784031

8.8.1 Asynchronous serial interface/three-wire serial I/O (UART/IOE)

Two serial interface channels are available; for each channel, asynchronous serial interface mode or three-wire

serial I/O mode can be selected.

(1) Asynchronous serial interface mode

In this mode, 1-byte data is transferred after a start bit.

A baud rate generator is incorporated to enable communication at a wide range of baud rates.

Moreover, the frequency of a clock signal applied to the ASCK pin can be divided to define a baud rate.

With the baud rate generator, the baud rate conforming to the MIDI standard (31.25 kbps) can be obtained.

Figure 8-10. Block Diagram of Asynchronous Serial Interface Mode

Internal bus

RXB, RXB2

Receive buffer

Transmission

shift register

Receive

shift register

RxD, RxD2

TxD, TxD2

TXS, TXS2

INTSR,

Transmission

control parity

bit addition

Reception

control parity

check

INTSR2

INTSER,

INTSER2

INTST, INTST2

Baud rate generator

1/2m

f

XX/2

1/2ⁿ⁺¹

ASCK, ASCK2

Remark fXX: Oscillator frequency or external clock input

n = 0 to 11

m = 16 to 30

37

µPD784031

(2) Three-wire serial I/O mode

In this mode, the master device makes the serial clock active to start transmission, then transfers 1-byte data

in phase with the clock.

This mode is designed for communication with a device incorporating a conventional synchronous serial interface.

Basically, three lines are used for communication: the serial clock line (SCK) and the two serial data lines (SI

and SO).

In general, a handshake line is required to check the state of communication.

Figure 8-11. Block Diagram of Three-Wire Serial I/O Mode

Internal bus

Direction control

circuit

SIO1, SIO2

Shift register

Output latch

SI1, SI2

SO1, SO2

Interrupt signal

generator

INTCSI1,

INTCSI2

SCK1, SCK2

Serial clock counter

1/2ⁿ⁺¹

f

XX/2

1/m

Serial clock

control circuit

Remark fXX: Oscillator frequency or external clock input

n = 0 to 11

m = 1, 16 to 30

38

µPD784031

8.8.2 Synchronous serial interface (CSI)

With this interface, the master device makes the serial clock active to start transmission, then transfers 1-byte data

in phase with the clock.

Figure 8-12. Block Diagram of Synchronous Serial Interface

Internal bus

Direction

control circuit

Reset

Output latch

Set

SI0

Shift register

SO0/SDA

N-ch open-drain

output enabled

(when two-wire

mode is used)

Interrupt signal

generator

Serial clock

counter

SCK0/SCL

INTCSI

Timer 3 output

Serial clock

control circuit

N-ch open-drain

output enabled

(when two-wire

mode is used)

f

XX/16

CLS0

CLS1

fXX/2

Remark f^XX: Oscillator frequency or external clock input

39

µPD784031

(1) Three-wire serial I/O mode

This mode is designed for communication with a device incorporating a conventional synchronous serial interface.

Basically, three lines are used for communication: the serial clock line (SCK0) and serial data lines (SI0 and SO0).

In general, a handshake line is required to check the state of communication.

(2) Two-wire serial I/O mode

In this mode, 8-bit data is transferred using two lines: the serial clock line (SCL) and serial data bus (SDA).

In general, a handshake line is required to check the communication state.

8.9 Edge Detection Function

The interrupt input pins (NMI, INTP0-INTP5) are used to apply not only interrupt requests but also trigger signals

for the built-in circuits. As these pins are triggered by an edge (rising or falling) of an input signal, a function for edge

detection is incorporated. Moreover, a noise suppression function is provided to prevent erroneous edge detection

caused by noise.

Detectable edge

Noise suppression method

Analog delay

NMI

Rising edge or falling edge

Note

INTP0-INTP3

INTP4, INTP5

Rising edge or falling edge, or both edges

Clock sampling

Analog delay

Note INTP0 is used for sampling clock selection.

8.10 Watchdog Timer

A watchdog timer is incorporated for CPU runaway detection. The watchdog timer, if not cleared by software within

a specified interval, generates a nonmaskable interrupt. Furthermore, once watchdog timer operation is enabled,

it cannot be disabled by software. The user can specify whether priority is placed on an interrupt based on the

watchdog timer or on an interrupt based on the NMI pin.

Figure 8-13. Block Diagram of Watchdog Timer

f

CLK

Timer

f

CLK/2²¹

f

CLK/2²⁰

INTWDT

f

CLK/2¹⁹

CLK/2¹⁷

Clear signal

40

µPD784031

9. INTERRUPT FUNCTION

Table 9-1 lists the interrupt request handling modes. These modes are selected by software.

Table 9-1. Interrupt Request Handling Modes

Handling mode

Handled by

Handling

PC and PSW contents

Vectored interrupt Software

Branches to a handling routine for execution

(arbitrary handling).

The PC and PSW contents are pushed

to and popped from the stack.

Context switching

Automatically selects a register bank, and

branches to a handling routine for execution

(arbitrary handling).

The PC and PSW contents are saved to

and read from a fixed area in the

register bank.

Macro service

Firmware

Performs operations such as memory-to-I/O- Maintained

device data transfer (fixed handling).

9.1 Interrupt Source

An interrupt can be issued from any one of the interrupt sources listed in Table 9-2: execution of BRK and BRKCS

instructions, an operand error, or any of the 23 other interrupt sources.

Four levels of interrupt handling priority can be set. Priority levels can be set to nest control during interrupt handling

or to concurrently generate interrupt requests. Nested macro services, however, are performed without suspension.

When interrupt requests having the same priority level are generated, they are handled according to the default

priority (fixed). (See Table 9-2.)

41

µPD784031

Table 9-2. Interrupt Sources

Source

Trigger

Default

priority

Internal/

external

Macro

Type

service

Name

Software

-

BRK instruction

BRKCS instruction

Operand error

Instruction execution

-

When the MOV STBC,#byte, MOV WDM,#byte, or LOCATION

instruction is executed, exclusive OR of the byte operand and

byte does not produce FFH.

Nonmaskable

Maskable

-

NMI

Detection of edge input on the pin

Watchdog timer overflow

External

Internal

External

-

WDT

0 (highest) INTP0

Detection of edge input on the pin (TM1/TM1W capture trigger,

TM1/TM1W event conter input)

Enabled

1

2

3

INTP1

INTP2

INTP3

Detection of edge input on the pin (TM2/TM2W capture trigger,

TM2/TM2W event conter input)

Detection of edge input on the pin (TM2/TM2W capture trigger,

TM2/TM2W event counter input)

Detection of edge input on the pin (TM0 capture trigger, TM0

event counter input)

4

5

6

INTC00

INTC01

INTC10

TM0-CR00 match signal issued

TM0-CR01 match signal issued

Internal

Enabled

TM1-CR10 match signal issued (in 8-bit operation mode)

TM1W-CR10W match signal issued (in 16-bit operation mode)

7

INTC11

INTC20

INTC21

INTC30

TM1-CR11 match signal issued (in 8-bit operation mode)

TM1W-CR11W match signal issued (in 16-bit operation mode)

8

TM2-CR20 match signal issued (in 8-bit operation mode)

TM2W-CR20W match signal issued (in 16-bit operation mode)

9

TM2-CR21 match signal issued (in 8-bit operation mode)

TM2W-CR21W match signal issued (in 16-bit operation mode)

10

TM3-CR30 match signal issued (in 8-bit operation mode)

TM3W-CR30W match signal issued (in 16-bit operation mode)

11

12

13

14

15

INTP4

Detection of edge input on the pin

External

Internal

Enabled

INTP5

Detection of edge input on the pin

INTAD

A/D converter processing completed (ADCR transfer)

ASI0 reception error

Enabled

-

INTSER

INTSR

ASI0 reception completed or CSI1 transfer completed

Enabled

INTCSI1

INTST

16

17

18

19

ASI0 transmission completed

CSI0 transfer completed

INTCSI

INTSER2

INTSR2

INTCSI2

ASI2 reception error

-

ASI2 reception completed or CSI2 transfer completed

Enabled

20 (lowest) INTST2

ASI2 transmission completed

Remark ASI: Asynchronous serial interface

CSI: Synchronous serial interface

42

µPD784031

9.2 Vectored Interrupt

When a branch to an interrupt handling routine occurs, the vector table address corresponding to the interrupt

source is used as the branch address.

Interrupt handling by the CPU consists of the following operations:

• When a branch occurs : Push the CPU status (PC and PSW contents) to the stack.

• When control is returned: Pop the CPU status (PC and PSW contents) from the stack.

To return control from the handling routine to the main routine, use the RETI instruction. The branch destination

addresses must be within the range of 0 to FFFFH.

Table 9-3. Vector Table Address

Interrupt source

BRK instruction

Vector table address

003EH

Operand error

NMI

003CH

0002H

0004H

0006H

0008H

000AH

000CH

000EH

0010H

0012H

0014H

0016H

0018H

001AH

001CH

001EH

0020H

0022H

0024H

WDT

INTP0

INTP1

INTP2

INTP3

INTC00

INTC01

INTC10

INTC11

INTC20

INTC21

INTC30

INTP4

INTP5

INTAD

INTSER

INTSR

INTCSI1

INTST

0026H

0028H

002AH

002CH

INTCSI

INTSER2

INTSR2

INTCSI2

INTST2

002EH

43

µPD784031

9.3 Context Switching

When an interrupt request is generated, or when the BRKCS instruction is executed, an appropriate register bank

is selected by the hardware. Then, a branch to a vector address stored in that register bank occurs. At the same

time, the contents of the current program counter (PC) and program status word (PSW) are stacked in the register

bank.

The branch address must be within the range of 0 to FFFFH.

Figure 9-1. Context Switching Caused by an Interrupt Request

0000B

Register bank (0-7)

<7> Transfer

Register bank n (n = 0-7)

PC19-16

PC15-0

A

B

X

C

<6> Exchange

<5> Save

R5

R7

R4

R6

<2> Save

(Bits 8 to 11 of

temporary register)

VP

UP

V

U

T

Switching between register banks

(RBS0-RBS2 ← n)

RSS ← 0

<3>

<4>

Temporary register

D

H

E

L

IE ← 0

W

<1> Save

PSW

9.4 Macro Service

The macro service function enables data transfer between memory and special function registers (SFRs) without

requiring the intervention of the CPU. The macro service controller accesses both memory and SFRs within the same

transfer cycle to directly transfer data without having to perform data fetch.

Since the CPU status is neither saved nor restored, nor is data fetch performed, high-speed data transfer is

possible.

Figure 9-2. Macro Service

Write

Read

Write

Macro service

controller

CPU

Memory

SFR

Internal bus

44

µPD784031

9.5 Examples of Macro Service Applications

(1) Serial interface transmission

Transmission data storage buffer (memory)

Data n

Data n - 1

Data 2

Data 1

Internal bus

Transmission

shift register

TXS (SFR)

TxD

Transmission control

INTST

Each time a macro service request (INTST) is generated, the next transmission data is transferred from memory

to TXS. When data n (last byte) has been transferred to TXS (that is, once the transmission data storage buffer

becomes empty), a vectored interrupt request (INTST) is generated.

(2) Serial interface reception

Reception data storage buffer (memory)

Data n

Data n - 1

Data 2

Data 1

Internal bus

Reception buffer

RXB (SFR)

Reception

shift register

RxD

Reception control

INTSR

Each time a macro service request (INTSR) is generated, reception data is transferred from RXB to memory.

When data n (last byte) has been transferred to memory (that is, once the reception data storage buffer becomes

full), a vectored interrupt request (INTSR) is generated.

45

µPD784031

(3) Real-time output port

INTC10 and INTC11 function as the output triggers for the real-time output ports. For these triggers, the macro

service can simultaneously set the next output pattern and interval. Therefore, INTC10 and INTC11 can be used

to independently control two stepping motors. They can also be applied to PWM and DC motor control.

Output pattern profile (memory)

Output timing profile (memory)

Pn

T

n

P

n–1

T

n–1

P

2

1

T

2

1

P

T

Internal bus

Match

(SFR)

P0L

CR10

TM1

(SFR)

INTC10

Output latch

P00-P03

Each time a macro service request (INTC10) is generated, a pattern and timing data are transferred to the buffer

register (P0L) and compare register (CR10), respectively. When the contents of timer register 1 (TM1) and CR10

match, another INTC10 is generated, and the P0L contents are transferred to the output latch. When Tn (last

byte) is transferred to CR10, a vectored interrupt request (INTC10) is generated.

For INTC11, the same operation as that performed for INTC10 is performed.

46

µPD784031

10. LOCAL BUS INTERFACE

The local bus interface enables the connection of external memory and I/O devices (memory-mapped I/O). It

supports a 1M-byte memory space. (See Figure 10-1.)

Figure 10-1. Example of Local Bus Interface

PD784031

µ

A16-A19

RD

WR

Kanji character

generator

PROM

PD27C1001A

Pseudo SRAM

µ

PD24C1000

REFRQ

Data bus

AD0-AD7

ASTB

Latch

Address bus

A8-A15

Gate array for I/O

expansion including

Centronics interface

circuit, etc.

10.1 Memory Expansion

By adding external memory, program memory or data memory can be expanded, 256 bytes at a time, to

approximately 1M byte (seven steps).

47

µPD784031

10.2 Memory Space

The 1M-byte memory space is divided into eight spaces, each having a logical address. Each of these spaces

can be controlled using the programmable wait and pseudo-static RAM refresh functions.

Figure 10-2. Memory Space

FFFFFH

512K bytes

80000H

7FFFFH

256K bytes

40000H

3FFFFH

128K bytes

20000H

1FFFFH

64K bytes

10000H

0FFFFH

16K bytes

0C000H

0BFFFH

16K bytes

08000H

07FFFH

16K bytes

04000H

03FFFH

16K bytes

00000H

48

µPD784031

10.3 Programmable Wait

When the memory space is divided into eight spaces, a wait state can be separately inserted for each memory

space while the RD or WR signal is active. This prevents the overall system efficiency from being degraded even

when memory devices having different access times are connected.

In addition, an address wait function that extends the ASTB signal active period is provided to produce a longer

address decode time. (This function is set for the entire space.)

10.4 Pseudo-Static RAM Refresh Function

Refresh is performed as follows:

• Pulse refresh

: A bus cycle is inserted where a refresh pulse is output on the REFRQ pin at regular

intervals. When the memory space is divided into eight, and a specified area

is being accessed, refresh pulses can also be output on the REFRQ pin as the

memory is being accessed. This can prevent the refresh cycle from suspending

normal memory access.

• Power-down self-refresh : In standby mode, a low-level signal is output on the REFRQ pin to maintain the

contents of pseudo-static RAM.

10.5 Bus Hold Function

A bus hold function is provided to facilitate connection to devices such as a DMA controller. Suppose that a bus

hold request signal (HLDRQ) is received from an external bus master. In this case, upon the completion of the bus

cycle being performed, the address bus, address/data bus, ASTB, RD, and WR pins are placed in the high-impedance

state, and the bus hold acknowledge signal (HLDAK) is made active to release the bus for the external bus master.

While the bus hold function is being used, the external wait and pseudo-static RAM refresh functions are disabled.

49

µPD784031

11. STANDBY FUNCTION

The standby function allows the power consumption of the chip to be reduced. The following standby modes are

supported:

• HALT mode : The CPU operation clock is stopped. By occasionally inserting the HALT mode during normal

operation, the overall average power consumption can be reduced.

• IDLE mode : The entire system is stopped, with the exception of the oscillator circuit. This mode consumes

only very little more power than STOP mode, but normal program operation can be restored in

almost as little time as that required to restore normal program operation from HALT mode.

• STOP mode : The oscillator is stopped. All operations in the chip stop, such that only leakage current flows.

These modes can be selected by software.

A macro service can be initiated in HALT mode.

Figure 11-1. Standby Mode Status Transition

Macro service request

End of one operation

End of macro service

Program

operation

Macro

service

Wait for

oscillation

settling

HALT

(standby)

IDLE

(standby)

STOP

(standby)

Request for masked interrupt

Notes 1. INTP4 and INTP5 are applied when not masked.

2. Only when the interrupt request is not masked

Remark NMI is enabled only by external input. The watchdog timer cannot be used to release one of the standby

modes (STOP or IDLE mode).

50

µPD784031

12. RESET FUNCTION

Applying a low-level signal to the RESET pin initializes the internal hardware (reset status).

When the RESET input makes a low-to-high transition, the following data is loaded into the program counter (PC):

• Eight low-order bits of the PC : Contents of location at address 0000H

• Intermediate eight bits of the PC : Contents of location at address 0001H

• Four high-order bits of the PC : 0

The PC contents are used as a branch destination address. Program execution starts from that address. Therefore,

a reset start can be performed from an arbitrary address.

The contents of each register can be set by software, as required.

The RESET input circuit contains a noise eliminator to prevent malfunctions caused by noise. This noise eliminator

is an analog delay sampling circuit.

Figure 12-1. Accepting a Reset

Execute instruction

at reset start address

Delay

Initialize PC

Delay

RESET

(input)

Internal reset signal

Start reset

End reset

For power-on reset, the RESET signal must be held active until the oscillation settling time (approximately 40 ms)

has elapsed.

Figure 12-2. Power-On Reset

Execute instruction at

reset start address

Oscillation settling time

Delay

Initialize PC

VDD

RESET

(input)

Internal reset signal

End reset

51

µPD784031

13. INSTRUCTION SET

(1) 8-bit instructions (The instructions enclosed in parentheses are implemented by a combination of

operands, where A is described as r.)

MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC,

ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC,

MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA

Table 13-1. Instructions Implemented by 8-Bit Addressing

Note 2

2nd operand

#byte

A

r

saddr

saddr'

sfr

!addr16

mem

r3

[WHL+]

[WHL-]

n

None

r'

!!addr24 [saddrp]

[%saddrg]

PSWL

PSWH

1st operand

Note 6

A

(MOV)

(XCH)

MOV

(MOV)

MOV

(XCH)

(MOV)

(XCH)

MOV

XCH

MOV

(MOV)

(XCH)

Note 1

Note 6

ADD

XCH

(ADD)

(XCH)

(ADD)^{Notes 1, 6}(ADD)

Note 1

(ADD)

ADD^{Note 1}ADD

Note 3

ROR

r

MOV

(MOV)

(XCH)

MOV

XCH

MOV

XCH

MOV

XCH

MOV

XCH

MULU

DIVUW

INC

Note 1

ADD

Note 1

ADD

(ADD)

ADD

ADD^{Note 1}

DEC

Note 6

saddr

sfr

MOV

(MOV)

MOV

XCH

INC

Note 1

ADD^{Note 1}(ADD)

ADD

DEC

DBNZ

Note 1

ADD

MOV

PUSH

POP

Note 1

ADD^{Note 1}(ADD)

ADD

CHKL

CHKLA

!addr16

!!addr24

MOV

(MOV)

MOV

Note 1

ADD

mem

MOV

Note 1

[saddrp]

[%saddrg]

ADD

mem3

ROR4

ROL4

r3

MOV

PSWL

PSWH

B, C

DBNZ

STBC, WDM

[TDE+]

[TDE–]

(MOV)

MOVBK^{Note 5}

Note 1

(ADD)

Note 4

MOVM

Notes 1. ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as ADD.

2. There is no second operand, or the second operand is not an operand address.

3. ROL, RORC, ROLC, SHR, and SHL are the same as ROR.

4. XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as MOVM.

5. XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as MOVBK.

6. When saddr is saddr2 with this combination, an instruction with a short code exists.

52

µPD784031

(2) 16-bit instructions (The instructions enclosed in parentheses are implemented by a combination of

operands, where AX is described as rp.)

MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP,

ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW

Table 13-2. Instructions Implemented by 16-Bit Addressing

Note 2

2nd operand

#word

AX

rp

saddrp

saddrp'

strp

!addr16

mem

[WHL+]

byte

n

None

rp'

!!addr24 [saddrp]

[%saddrg]

1st operand

Note 3

AX

(MOVW) (MOVW) (MOVW)

(MOVW)

MOVW

(MOVW)

MOVW

XCHW

(MOVW)

(XCHW)

Note 1

ADDW

(XCHW) (XCHW)

(XCHW)^{Note 3}(XCHW) XCHW

Note 1

Notes 1,3

(ADD)

(ADDW)^{Note 1}(ADDW)

(ADDW)^{Note 1}

Note 4

MULW

rp

MOVW

(MOVW) MOVW

(XCHW) XCHW

MOVW

XCHW

MOVW

XCHW

MOVW

SHRW

SHLW

Note 1

ADDW

INCW

Note 1

ADDW

(ADDW)^{Note 1}ADDW

ADDW

DECW

saddrp

sfrp

MOVW

(MOVW)^{Note 3}MOVW

MOVW

Note 1

XCHW

INCW

Note 1

ADDW

(ADDW)^{Note 1}ADDW

DECW

Note 1

ADDW

MOVW

PUSH

POP

Note 1

(ADDW)^{Note 1}ADDW

ADDW

!addr16

!!addr24

MOVW

(MOVW) MOVW

MOVTBLW

mem

MOVW

[saddrp]

[%saddrg]

PSW

PUSH

POP

SP

ADDWG

SUBWG

post

PUSH

POP

PUSHU

POPU

[TDE+]

byte

(MOVW)

SACW

MACW

MACSW

Notes 1. SUBW and CMPW are the same as ADDW.

2. There is no second operand, or the second operand is not an operand address.

3. When saddrp is saddrp2 with this combination, an instruction with a short code exists.

4. MULUW and DIVUX are the same as MULW.

53

µPD784031

(3) 24-bit instructions (The instructions enclosed in parentheses are implemented by a combination of

operands, where WHL is described as rg.)

MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP

Table 13-3. Instructions Implemented by 24-Bit Addressing

2nd operand #imm24

WHL

rg

saddrg

!!addr24

mem1 [%saddrg]

SP

None^Note

1st operand

WHL

rg'

(MOVG) (MOVG) (MOVG) (MOVG) (MOVG) MOVG

MOVG

(ADDG)

(SUBG)

(ADDG)

(SUBG)

(ADDG)

(SUBG)

ADDG

SUBG

rg

MOVG

ADDG

SUBG

(MOVG) MOVG

MOVG

INCG

DECG

PUSH

POP

(ADDG)

(SUBG)

ADDG

SUBG

saddrg

!!addr24

mem1

(MOVG) MOVG

MOVG

[%saddrg]

SP

MOVG

INCG

DECG

Note There is no second operand, or the second operand is not an operand address.

54

µPD784031

(4) Bit manipulation instructions

MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET

Table 13-4. Bit Manipulation Instructions Implemented by Addressing

2nd operand

CY

saddr.bit sfr.bit

A.bit X.bit

/saddr.bit /sfr.bit

/A.bit /X.bit

None^Note

PSWL.bit PSWH.bit

mem2.bit

/PSWL.bit /PSWH.bit

/mem2.bit

1st operand

!addr16.bit !!addr24.bit

/!addr16.bit /!!addr24.bit

CY

MOV1

AND1

OR1

AND1

OR1

NOT1

SET1

CLR1

XOR1

saddr.bit

sfr.bit

MOV1

NOT1

SET1

CLR1

BF

A.bit

X.bit

PSWL.bit

PSWH.bit

mem2.bit

!addr16.bit

!!addr24.bit

BT

BTCLR

BFSET

Note There is no second operand, or the second operand is not an operand address.

55

µPD784031

(5) Call/return instructions and branch instructions

CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL,

BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ

Table 13-5. Call/Return and Branch Instructions Implemented by Addressing

Instruction

address

$addr20 $!addr20

!addr16 !!addr20

rp

rg

[rp]

[rg]

!addr11 [addr5]

RBn

None

operand

Basic

BC^Note

CALL

BR

CALL

BR

CALL

BR

CALL

BR

CALL

BR

CALL

BR

CALLF

BRKCS

BRK

instruction BR

BR

RET

RETCS

RETCSB

RETI

RETB

Composite BF

instruction BT

BTCLR

BFSET

DBNZ

Note BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, and BH

are the same as BC.

(6) Other instructions

ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT EI, DI, SWRS

56

µPD784031

14. ELECTRICAL CHARACTERISTICS

ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)

Parameter

Supply voltage

Symbol

Conditions

Rating

-0.5 to +7.0

AVSS to VDD + 0.5

-0.5 to +0.5

-0.5 to VDD + 0.5

15

Unit

V

VDD

AVDD

AVSS

VI

V

Input voltage

V

Output voltage

Output low current

VO

V

IOL

At one pin

mA

V

Total of all output pins

At one pin

100

Output high current

IOH

-10

Total of all output pins

-100

A/D converter reference input

voltage

AV^REF1

-0.5 to VDD + 0.3

D/A converter reference input

voltage

AVREF2

AVREF3

TA

-0.5 to VDD + 0.3

-40 to +85

V

Operating ambient temperature

Storage temperature

°C

T^stg

-65 to +150

Caution Absolute maximum ratings are rated values beyond which physical damage will be caused to the

product; if the rated value of any of the parameters in the above table is exceeded, even

momentarily, the quality of the product may deteriorate. Always use the product within its rated

values.

57

µPD784031

OPERATING CONDITIONS

• Operating ambient temperature (T^A)

: -40 to +85 °C

• Rise time and fall time (t^r, tf) (at pins which are not specified) : 0 to 200 µs

• Power supply voltage and clock cycle time : See Figure 14-1.

Figure 14-1. Power Supply Voltage and Clock Cycle Time

10 000

4 000

1 000

Guaranteed

operating

range

125

100

62.5

10

0

1

2

3

4

5

6

7

Power supply voltage [V]

CAPACITANCE (T^A= 25 °C, VDD = VSS = 0 V)

Parameter

Input capacitance

Output capacitance

I/O capacitance

Symbol

C^I

Conditions

MIN.

TYP.

MAX.

10

Unit

pF

f = 1 MHz

0 V on pins other than measured pins

CO

10

pF

CIO

10

pF

58

µPD784031

OSCILLATOR CHARACTERISTICS (TA = -40 to +85 °C, VDD = +4.5 to 5.5 V, VSS = 0 V)

Resonator

Recommended circuit

Parameter

MIN.

4

MAX.

32

Unit

Ceramic resonator

or crystal

Oscillator frequency (f^XX)

MHz

VSS1 X1

X2

C1

C2

External clock

X1 input frequency (fX)

4

0

32

10

MHz

ns

X1 input rise and fall times

(tXR, tXF)

X1

X2

X1 input high-level and low-

level widths (tWXH, tWXL)

10

125

ns

HCMOS

inverter

Caution When using the system clock generator, run wires in the portion surrounded by broken lines

according to the following rules to avoid effects such as stray capacitance:

• Minimize the wiring.

• Never cause the wires to cross other signal lines.

• Never cause the wires to run near a line carrying a large varying current.

• Cause the grounding point of the capacitor of the oscillator circuit to have the same potential

as V^SS1. Never connect the capacitor to a ground pattern carrying a large current.

• Never extract a signal from the oscillator.

59

µPD784031

OSCILLATOR CHARACTERISTICS (TA = -40 to +85 °C, VDD = +2.7 to 5.5 V, VSS = 0 V)

Resonator

Recommended circuit

Parameter

MIN.

4

MAX.

16

Unit

Ceramic resonator

or crystal

Oscillator frequency (f^XX)

MHz

VSS1 X1

X2

C1

C2

External clock

X1 input frequency (fX)

4

0

16

10

MHz

ns

X1 input rise and fall times

(tXR, tXF)

X1

X2

X1 input high-level and low-

level widths (tWXH, tWXL)

10

125

ns

HCMOS

inverter

Caution When using the system clock generator, run wires in the portion surrounded by broken lines

according to the following rules to avoid effects such as stray capacitance:

•

Minimize the wiring.

Never cause the wires to cross other signal lines.

Never cause the wires to run near a line carrying a large varying current.

Cause the grounding point of the capacitor of the oscillator circuit to have the same potential

as V^SS1. Never connect the capacitor to a ground pattern carrying a large current.

Never extract a signal from the oscillator.

•

60

µPD784031

DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V) (1/2)

Parameter

Symbol

V^IL1

Conditions

MIN.

-0.3

TYP.

MAX.

Unit

V

Input low voltage

For pins other than those described in

Notes 1, 2, 3, and 4

0.3V^DD

VIL2

VIL3

VIH1

For pins described in Notes 1, 2, 3, and

4

-0.3

0.2VDD

+0.8

V

V^DD= +5.0 V ± 10 %

For pins described in Notes 2, 3, and 4

Input high voltage

For pins other than those described in

Note 1

0.7V^DD

V^DD+ 0.3

VIH2

VIH3

For pins described in Note 1

0.8VDD

2.2

VDD + 0.3

V

V^DD= +5.0 V ± 10 %

For pins described in Notes 2, 3, and 4

Output low voltage

Output high voltage

VOL1

VOL2

I^OL= 2 mA

0.4

1.0

V

VDD = +5.0 V ± 10 %

IOL = 8 mA

For pins described in Notes 2 and 5

VOH1

VOH2

IOH = -2 mA

V^DD- 1.0

VDD - 1.4

V

VDD = +5.0 V ± 10 %

IOH = -5 mA

For pins described in Note 4

X1 input low current

X1 input high current

IIL

EXTC = 0

-30

µA

0 V ≤ V^I≤ VIL2

IIH

EXTC = 0

+30

VIH2 ≤ VI ≤ VDD

Notes 1. X1, X2, RESET, P12/ASCK2/SCK2, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3,

P25/INTP4/ASCK/SCK1, P26/INTP5, P27/SI0, P32/SCK0/SCL, P33/SO0/SDA, TEST

2. AD0-AD7, A8-A15

3. P60/A16-P63/A19, RD, WR, P66/WAIT/HLDRQ, P67/REFRQ/HLDAK

4. P00-P07

5. P10-P17

61

µPD784031

DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V) (2/2)

Parameter

Symbol

I^LI

Conditions

MIN.

TYP.

MAX.

Unit

Input leakage current

0 V ≤ V^I≤ VDD

±10

µA

For pins other than X1 when EXTC = 0

Output leakage current

V^DDsupply current

ILO

0 V ≤ VO ≤ VDD

±10

µA

IDD1

Operation mode

fXX = 32 MHz

25

12

13

8

45

mA

VDD = +5.0 V ± 10 %

f^XX= 16 MHz

25

26

12

8

mA

kΩ

VDD = +2.7 to 3.3 V

IDD2

IDD3

RL

HALT mode

fXX = 32 MHz

VDD = +5.0 V ± 10 %

fXX = 16 MHz

VDD = +2.7 to 3.3 V

IDLE mode

(EXTC = 0)

f^XX= 32 MHz

VDD = +5.0 V ± 10 %

f^XX= 16 MHz

VDD = +2.7 to 3.3 V

Pull-up resistor

VI = 0 V

15

80

62

µPD784031

AC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V)

(1) Read/write operation (1/2)

Unit

ns

Parameter

Symbol

t^SAST

Conditions

V^DD= +5.0 V ± 10 %

MIN.

MAX.

Address setup time

(0.5 + a) T - 15

(0.5 + a) T - 31

(0.5 + a) T - 17

(0.5 + a) T - 40

0.5T - 24

ASTB high-level width

tWSTH

tHSTLA

V^DD= +5.0 V ± 10 %

VDD = +5.0 V ± 10 %

Address hold time (to ASTB↓)

0.5T - 34

Address hold time (to RD↑)

Delay from address to RD↓

tHRA

tDAR

0.5T - 14

VDD = +5.0 V ± 10 %

(1 + a) T - 9

(1 + a) T - 15

Address float time (to RD↓)

tFRA

0

Delay from address to data input tDAID

V^DD= +5.0 V ± 10 %

VDD = +5.0 V ± 10 %

V^DD= +5.0 V ± 10 %

(2.5 + a + n) T - 37

(2.5 + a + n) T - 52

(2 + n) T - 40

Delay from ASTB↓ to data input

Delay from RD↓ to data input

tDSTID

tDRID

(2 + n) T - 60

(1.5 + n) T - 50

(1.5 + n) T - 70

Delay from ASTB↓ to RD↓

Data hold time (to RD↑)

tDSTR

tHRID

tDRA

0.5T - 9

0

After program

Delay from RD↑ to address active

V^DD= +5.0 V ± 10 %

0.5T - 8

is read

0.5T - 12

After data is

read

VDD = +5.0 V ± 10 %

1.5T - 8

1.5T - 12

Delay from RD↑ to ASTB↑

tDRST

tWRL

0.5T - 17

RD low-level width

VDD = +5.0 V ± 10 %

(1.5 + n) T - 30

(1.5 + n) T - 40

0.5T - 14

Address hold time (to WR↑)

Delay from address to WR↓

tHWA

tDAW

VDD = +5.0 V ± 10 %

(1 + a) T - 5

(1 + a) T - 15

Delay from ASTB↓ to data output

tDSTOD

0.5T + 19

0.5T + 35

0.5T - 11

Delay from WR↓ to data output

Delay from ASTB↓ to WR↓

tDWOD

tDSTW

0.5T - 9

Remarks T: T^CYK(system clock cycle time)

a: 1 (during address wait), otherwise, 0

n: Number of wait states (n ≥ 0)

63

µPD784031

(1) Read/write operation (2/2)

Unit

ns

Parameter

Symbol

Conditions

VDD = +5.0 V ± 10 %

MIN.

MAX.

Data setup time (to WR↑)

tSODW

(1.5 + n) T - 30

(1.5 + n) T - 40

0.5T - 5

Note

Data hold time (to WR↑)

tHWOD

VDD = +5.0 V ± 10 %

0.5T - 25

Delay from WR↑ to ASTB↑

tDWST

tWWL

0.5T - 12

WR low-level width

(1.5 + n) T - 30

(1.5 + n) T - 40

Note The hold time includes the time during which V^OH1and VOL1 are held under the load conditions of

CL = 50 pF and RL = 4.7 kΩ.

Remarks T: T^CYK(system clock cycle time)

n: Number of wait states (n ≥ 0)

(2) Bus hold timing

Unit

ns

Parameter

Symbol

t^FHQC

Conditions

MIN.

MAX.

(6 + a + n) T + 50

(7 + a + n) T + 30

(7 + a + n) T + 40

1T + 30

Delay from HLDRQ↑ to float

Delay from HLDRQ↑ to HLDAK↑

tDHQHHAH VDD = +5.0 V ± 10 %

Delay from float to HLDAK↑

tDCFHA

Delay from HLDRQ↓ to HLDAK↓ tDHQLHAL VDD = +5.0 V ± 10 %

2T + 40

2T + 60

Delay from HLDAK↓ to active

tDHAC

V^DD= +5.0 V ± 10 %

1T - 20

1T - 30

Remarks T: T^CYK(system clock cycle time)

a: 1 (during address wait), otherwise, 0

n: Number of wait states (n ≥ 0)

64

µPD784031

(3) External wait timing

Symbol

t^DAWT

Unit

ns

Parameter

Conditions

VDD = +5.0 V ± 10 %

MIN.

MAX.

Delay from address to WAIT↓ input

(2 + a) T - 40

(2 + a) T - 60

1.5T - 40

tDSTWT

tHSTWTH

tDSTWTH

tDRWTL

tHRWT

Delay from ASTB↓ to WAIT↓ input

Hold time from ASTB↓ to WAIT

Delay from ASTB↓ to WAIT↑

Delay from RD↓ to WAIT↓ input

Hold time from RD↓ to WAIT↓

Delay from RD↓ to WAIT↑

VDD = +5.0 V ± 10 %

V^DD= +5.0 V ± 10 %

VDD = +5.0 V ± 10 %

V^DD= +5.0 V ± 10 %

VDD = +5.0 V ± 10 %

1.5T - 60

(0.5 + n) T + 5

(0.5 + n) T +10

(1.5 + n) T - 40

(1.5 + n) T - 60

T - 50

T - 70

nT + 5

nT + 10

tDRWTH

tDWTID

(1 + n) T - 40

(1 + n) T - 60

0.5T - 5

Delay from WAIT↑ to data input

0.5T - 10

tDWTW

tDWTR

tDWWTL

Delay from WAIT↑ to WR↑

Delay from WAIT↑ to RD↑

Delay from WR↓ to WAIT↓ input

0.5T

VDD = +5.0 V ± 10 %

T - 50

T - 75

tHWWT

Hold time from WR↓ to WAIT

Delay from WR↓ to WAIT↑

nT + 5

nT + 10

tDWWTH

(1 + n) T - 40

(1 + n) T - 70

Remarks T: T^CYK(system clock cycle time)

a: 1 (during address wait), otherwise, 0

n: Number of wait states (n ≥ 0)

(4) Refresh timing

Symbol

tRC

Unit

ns

Parameter

Conditions

MIN.

MAX.

Random read/write cycle time

REFRQ low-level pulse width

3T

tWRFQL

VDD = +5.0 V ± 10 %

1.5T - 25

1.5T - 30

0.5T - 9

1.5T - 9

0.5T - 15

1.5T - 25

1.5T - 30

tDSTRFQ

tDRRFQ

tDWRFQ

tDRFQST

tWRFQH

Delay from ASTB↓ to REFRQ

Delay from RD↑ to REFRQ

Delay from WR↑ to REFRQ

Delay from REFRQ↑ to ASTB

REFRQ high-level pulse width

VDD = +5.0 V ± 10 %

Remark T: TCYK (system clock cycle time)

65

µPD784031

SERIAL OPERATION (TA = -40 to +85 °C, VDD = +2.7 to 5.5 V, AVSS = VSS = 0 V)

(1) CSI

Unit

ns

Parameter

Symbol

Conditions

MIN.

MAX.

Serial clock cycle time (SCK0)

tCYSK0

Input External clock

10/fXX + 380

When SCK0 and SO0 are CMOS I/O

µs

Output

T

ns

Serial clock low-level width

(SCK0)

tWSKL0

tWSKH0

Input External clock

5/f^XX+ 150

When SCK0 and SO0 are CMOS I/O

µs

Output

0.5T - 40

ns

Serial clock high-level width

(SCK0)

Input External clock

5/fXX + 150

When SCK0 and SO0 are CMOS I/O

µs

ns

Output

0.5T - 40

SI0 setup time (to SCK0↑)

SI0 hold time (to SCK0↑)

tSSSK0

tHSSK0

tDSBSK1

40

5/f^XX+ 40

0

SO0 output delay time

CMOS push-pull output

(3-wire serial I/O mode)

5/fXX + 150

5/fXX + 400

(to SCK0↓)

ns

tDSBSK2

Open-drain output

0

(2-wire serial I/O mode), RL = 1 kΩ

Remarks 1. The values in this table are those when CL is 100 pF.

2. T Serial clock cycle set by software. The minimum value is 16/f^XX.

3. fXX : Oscillator frequency

:

66

µPD784031

(2) IOE1, IOE2

Unit

Parameter

Symbol

t^CYSK1

Conditions

MIN.

250

MAX.

ns

Serial clock cycle time

(SCK1, SCK2)

Input

V^DD= +5.0 V ± 10 %

500

Output

Input

Internal, divided by 16

T

Serial clock low-level width

(SCK1, SCK2)

tWSKL1

tWSKH1

VDD = +5.0 V ± 10 %

85

210

Output

Input

Internal, divided by 16

0.5T - 40

85

Serial clock high-level width

(SCK1, SCK2)

VDD = +5.0 V ± 10 %

210

Output

Internal, divided by 16

0.5T - 40

40

Setup time for SI1 and SI2

tSSSK1

tHSSK1

(to SCK1, SCK2↑)

ns

Hold time for SI1 and SI2

40

(to SCK1, SCK2↑)

ns

Output delay time for SO1 and tDSOSK

0

50

SO2 (to SCK1, SCK2↓)

Output hold time for SO1 and

tHSOSK

When data is transferred

0.5t^CYSK1- 40

SO2 (to SCK1, SCK2↑)

Remarks 1. The values in this table are those when C^Lis 100 pF.

2. T: Serial clock cycle set by software. The minimum value is 16/f^XX.

(3) UART, UART2

Unit

ns

Parameter

Symbol

t^CYASK

Conditions

V^DD= +5.0 V ± 10 %

MIN.

125

250

52.5

85

MAX.

ASCK clock input cycle time

ns

ASCK clock low-level width

ASCK clock high-level width

tWASKL

tWASKH

VDD = +5.0 V ± 10 %

ns

52.5

85

ns

67

µPD784031

OTHER OPERATIONS

Unit

µs

Parameter

NMI low-level width

NMI high-level width

INTP0 low-level width

INTP0 high-level width

Symbol

tWNIL

Conditions

MIN.

10

MAX.

µs

tWNIH

10

ns

tWIT0L

tWIT0H

tWIT1L

3t^CYSMP+ 10

3tCYSMP + 10

3t^CYCPU+ 10

ns

Low-level width for INTP1-

INTP3 and CI

ns

µs

High-level width for INTP1-

INTP3 and CI

tWIT1H

tWIT2L

tWIT2H

3tCYCPU + 10

Low-level width for INTP4 and

INTP5

10

High-level width for INTP4 and

INTP5

µs

RESET low-level width

RESET high-level width

tWRSL

tWRSH

10

Remarks t^CYSMP: Sampling clock set by software

t^CYCPU: CPU operation clock set by software in the CPU

A/D CONVERTER CHARACTERISTICS

(T^A= -40 to +85 °C, VDD = AVDD = AVREF1 = +2.7 to 5.5 V, VSS = AVSS = 0 V)

Parameter

Resolution

Symbol

Conditions

MIN.

8

TYP.

MAX.

Unit

bit

Note

%

Total error

1.0

0.8

Note

Linearity calibration

Quantization error

Conversion time

%

±1/2

LSB

t^CYK

tCYK

t^CONV

FR = 1

FR = 0

FR = 1

FR = 0

120

180

24

Sampling time

tSAMP

36

VIAN

-0.3

AVREF1 + 0.3

V

Analog input voltage

Analog input impedance

AV^REF1current

RAN

1 000

0.5

MΩ

mA

µA

AIREF1

AIDD1

AIDD2

1.5

5.0

20

AVDD supply current

f^XX= 32 MHz, CS = 1

STOP mode, CS = 0

2.0

1.0

Note Quantization error is not included. This parameter is indicated as the ratio to the full-scale value.

Remark t^CYK: System clock cycle time

68

µPD784031

D/A CONVERTER CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V)

Parameter

Resolution

Symbol

Conditions

MIN.

8

TYP.

MAX.

0.6

Unit

bit

Total error

Load conditions: VDD = AVDD = AVREF2

%

4 MΩ, 30 pF

= +2.7 to 5.5 V

AVREF3 = 0 V

V

DD = AVDD = +2.7 to 5.5 V

0.8

1.0

10

%

AVREF2 = 0.75VDD

AVREF3 = 0.25VDD

Load conditions: VDD = AVDD = AVREF2

2 MΩ, 30 pF

= +2.72.7 to 5.5 V

AVREF3 = 0 V

VDD = AVDD = +2.7 to 5.5 V

AVREF2 = 0.75VDD

AVREF3 = 0.25VDD

Settling time

Load conditions: 2 MΩ, 30 pF

µs

kΩ

V

Output resistance

Analog reference voltage

R^O

DACS0, 1 = 55 H

10

8

AVREF2

AVREF3

RAIREF

0.75V^DD

VDD

0

4

0.25VDD

V

Resistance of AV^REF2and

DACS0, 1 = 55 H

kΩ

AVREF3

Reference power supply

input current

AIREF2

AIREF3

0

5

0

mA

-5

69

µPD784031

DATA RETENTION CHARACTERISTICS (TA = -40 to +85 °C)

Parameter

Symbol

VDDDR

IDDDR

Conditions

MIN.

2.5

TYP.

MAX.

5.5

50

Unit

V

Data retention voltage

Data retention current

STOP mode

VDDDR = +2.7 to 5.5 V

VDDDR = +2.5 V

10

2

µA

µs

10

VDD rise time

V^DDfall time

tRVD

tFVD

tHVD

200

0

µs

VDD hold time

ms

(to STOP mode setting)

STOP clear signal input time tDREL

0

ms

V

Oscillation settling time

tWAIT

Crystal

30

Ceramic resonator

5

0

Note

Input low voltage

Input high voltage

VIL

VIH

Specific pins

0.1V^DDDR

0.9V^DDDR

VDDDR

V

Note RESET, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3, P25/INTP4/ASCK/SCK1,

P26/INTP5, P27/SI0, P32/SCK0/SCL, and P33/SO0/SDA pins

AC TIMING TEST POINTS

V

DD - 1 V

0.8VDD or 2.2 V

0.8 V

0.8VDD or 2.2 V

0.8 V

Test points

0.45 V

70

µPD784031

TIMING WAVEFORM

(1) Read operation

t

WSTH

ASTB

t

SAST

t

DRST

t

DSTID

t

HSTLA

A8-A19

t

DAID

t

HRA

AD0-AD7

t

DSTR

t

FRA

t

HRID

t

DAR

t

DRID

t

DRA

RD

t

WRL

(2) Write operation

t

WSTH

ASTB

t

SAST

t

DWST

t

DSTOD

t

HSTLA

A8-A19

t

HWA

AD0-AD7

t

DSTW

t

HWOD

t

DAW

t

DWOD

t

DSODW

WR

t

WWL

71

µPD784031

HOLD TIMING

ADTB, A8-A19,

AD0-AD7, RD, WR

t

FHQC

t

DCFHA

t

DHAC

HLDRQ

HLDAK

t

DHQLHAL

t

DHQHHAH

EXTERNAL WAIT SIGNAL INPUT TIMING

(1) Read operation

ASTB

t

DSTWTH

t

HSTWTH

t

DSTWT

A8-A19

AD0-AD7

RD

t

DAWT

t

DWTID

t

DRWTL

t

DWTR

WAIT

t

HRWT

t

DRWTH

(2) Write operation

ASTB

tDSTWTH

tHSTWTH

tDSTWT

A8-A19

AD0-AD7

WR

tDAWT

tDWWTL

tDWTW

WAIT

tHWWT

tDWWTH

72

µPD784031

REFRESH TIMING WAVEFORM

(1) Random read/write cycle

t

RC

ASTB

WR

t

RC

t

RC

t

RC

t

RC

RD

(2) When refresh memory is accessed for a read and write at the same time

ASTB

RD, WR

t

DSTRFQ

t

DRFQST

t

WRFQH

REFRQ

t

WRFQL

(3) Refresh after a read

ASTB

t

DRFQST

RD

t

DRRFQ

REFRQ

t

WRFQL

(4) Refresh after a write

ASTB

t

DRFQST

WR

t

DWRFQ

REFRQ

t

WRFQL

73

µPD784031

SERIAL OPERATION

(1) CSI

t

WSKL0

t

WSKH0

SCK

tSSSK0

t

HSSK0

t

CYSK0

SI

Input data

t

HSBSK1

t

DSBSK1

SO

Output data

(2) IOE1, IOE2

t

WSKL1

t

WSKH1

SCK

tSSSK1

t

HSSK1

t

CYSK1

SI

Input data

t

HSOSK

t

DSOSK

SO

Output data

(3) UART, UART2

tWASKH

tWASKL

ASCK,

ASCK2

tCYASK

74

µPD784031

INTERRUPT INPUT TIMING

t

WNIH

t

WNIL

NMI

t

WIT0H

WIT1H

WIT2H

t

WIT0L

WIT1L

WIT2L

INTP0

CI,

INTP1-INTP3

INTP4, INTP5

RESET INPUT TIMING

t

WRSH

t

WRSL

RESET

75

µPD784031

EXTERNAL CLOCK TIMING

t

WXH

t

WXL

X1

t

XR

t

XF

t

CYX

DATA RETENTION CHARACTERISTICS

STOP mode setting

V

DD

V

DDDR

t

DREL

t

WAIT

t

HVD

t

FVD

t

RVD

RESET

NMI

(Clearing by falling edge)

NMI

(Clearing by rising edge)

76

µPD784031

15. PACKAGE DRAWINGS

80 PIN PLASTIC QFP (14×14)

A

B

60

61

41

40

detail of lead end

S

C D

R

Q

21

20

80

1

F

P

J

G

M

H

I

K

M

N

L

NOTE

ITEM MILLIMETERS

INCHES

Each lead centerline is located within 0.13 mm (0.005 inch) of

its true position (T.P.) at maximum material condition.

A

B

17.2±0.4

14.0±0.2

0.677±0.016

+0.009

0.551

–0.008

+0.009

0.551

C

14.0±0.2

–0.008

D

F

17.2±0.4

0.825

0.677±0.016

0.032

G

0.825

0.032

+0.004

0.012

H

0.30±0.10

–0.005

I

0.13

0.005

J

K

0.65 (T.P.)

1.6±0.2

0.026 (T.P.)

0.063±0.008

+0.009

0.031

L

0.8±0.2

–0.008

+0.004

0.006

+0.10

0.15

M

–0.003

–0.05

N

P

Q

R

S

0.10

0.004

2.7

0.106

0.1±0.1

5°±5°

3.0 MAX.

0.004±0.004

5°±5°

0.119 MAX.

S80GC-65-3B9-4

Remark The shape and material of the ES version are the same as those of the corresponding mass-produced

product.

77

µPD784031

80 PIN PLASTIC QFP (14×14)

A

B

60

61

41

40

detail of lead end

S

C

D

R

Q

80

1

21

20

F

J

M

G

P

H

I

K

L

M

N

NOTE

ITEM MILLIMETERS

INCHES

Each lead centerline is located within 0.13 mm (0.005 inch) of

its true position (T.P.) at maximum material condition.

A

B

17.20±0.20

14.00±0.20

0.677±0.008

+0.009

0.551

–0.008

+0.009

0.551

C

D

14.00±0.20

17.20±0.20

–0.008

0.677±0.008

F

0.825

0.032

G

+0.002

0.013

H

0.32±0.06

–0.003

I

0.13

0.005

J

K

0.65 (T.P.)

1.60±0.20

0.026 (T.P.)

0.063±0.008

+0.009

0.031

L

0.80±0.20

–0.008

+0.03

0.17

+0.001

0.007

M

–0.07

–0.003

N

P

Q

0.10

0.004

1.40±0.10

0.125±0.075

0.055±0.004

0.005±0.003

+7°

3°

+7°

3°

R

S

–3°

1.70 MAX.

0.067 MAX.

P80GC-65-8BT

Remark The shape and material of the ES version are the same as those of the corresponding mass-produced

product.

78

µPD784031

80 PIN PLASTIC TQFP (FINE PITCH) ( 12)

A

B

60

41

61

40

detail of lead end

80

21

1

20

G

M

I

J

H

K

N

L

NOTE

ITEM MILLIMETERS

INCHES

Each lead centerline is located within 0.10 mm (0.004 inch) of

its true position (T.P.) at maximum material condition.

+0.009

A

B

C

D

14.0±0.2

12.0±0.2

14.0±0.2

0.551

0.472

0.551

–0.008

+0.009

–0.008

+0.009

–0.008

+0.009

–0.008

F

1.25

0.049

G

+0.05

0.22

H

0.009±0.002

–0.04

I

0.10

0.004

J

0.5 (T.P.)

0.020 (T.P.)

+0.009

0.039

K

L

1.0±0.2

0.5±0.2

–0.008

+0.008

0.020

–0.009

+0.055

M

0.145

0.006±0.002

–0.045

N

P

Q

R

S

0.10

1.05

0.004

0.041

0.05±0.05

5°±5°

0.002±0.002

5°±5°

1.27 MAX.

0.050 MAX.

P80GK-50-BE9-4

Remark The shape and material of the ES version are the same as those of the corresponding mass-produced

product.

79

µPD784031

16. RECOMMENDED SOLDERING CONDITIONS

The conditions listed below shall be met when soldering the µPD784031.

For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting

Technology Manual (C10535E).

Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under

different conditions.

Table 16-1. Soldering Conditions for Surface-Mount Devices (1/2)

(1) µPD784031GC-3B9: 80-pin plastic QFP (14 × 14 × 2.7 mm)

Soldering process

Infrared ray reflow

Soldering conditions

Symbol

IR35-00-3

Peak package's surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 3

VPS

Peak package's surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 3

VP15-00-3

WS60-00-1

Wave soldering

Solder temperature: 260 °C or less

Flow time: 10 seconds or less

Number of flow processes: 1

Preheating temperature

: 120 °C max. (measured on the package surface)

Partial heating method

Terminal temperature: 300 °C or less

-

Heat time: 3 seconds or less (for one side of a device)

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

(2) µPD784031GC-8BT: 80-pin plastic QFP (14 × 14 × 1.4 mm)

Soldering process

Infrared ray reflow

Soldering conditions

Symbol

IR35-00-2

Peak package's surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 2

VPS

Peak package's surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 2

VP15-00-2

WS60-00-1

Wave soldering

Solder temperature: 260 °C or less

Flow time: 10 seconds or less

Number of flow processes: 1

Preheating temperature

: 120 °C max. (measured on the package surface)

Partial heating method

Terminal temperature: 300 °C or less

-

Heat time: 3 seconds or less (for one side of a device)

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

80

µPD784031

Table 16-1. Soldering Conditions for Surface-Mount Devices (2/2)

(3) µPD784031GK-BE9: 80-pin plastic TQFP (fine pitch) (12 × 12 mm)

Soldering process

Infrared ray reflow

Symbol

Soldering conditions

IR35-107-2

Peak package’s surface temperature: 235 °C

Reflow time: 30 seconds or less (210 °C or more)

Maximum allowable number of reflow processes: 2

Note

Exposure limit: 7 days

(10 hours of pre-baking is required at 125 °C

afterward)

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

VPS

VP15-107-2

Peak package’s surface temperature: 215 °C

Reflow time: 40 seconds or less (200 °C or more)

Maximum allowable number of reflow processes: 2

Note

Exposure limit: 7 days

afterward)

(10 hours of pre-baking is required at 125 °C

Non-heat-resistant trays, such as magazine and taping trays, cannot be

baked before unpacking.

Partial heating method

-

Terminal temperature: 300 °C or less

Heat time: 3 seconds or less (for one side of a device)

Note Maximum number of days during which the product can be stored at a temperature of 25 °C and a relative

humidity of 65 % or less after dry-pack package is opened.

Caution Do not apply two or more different soldering methods to one chip (except for partial heating

method for terminal sections).

81

µPD784031

APPENDIX A DEVELOPMENT TOOLS

The following development tools are available for system development using the µPD784031.

Language Processing Software

Note 1

RA78K4

Assembler package for all 78K/IV series models

C compiler package for all 78K/IV series models

C compiler library source file for all 78K/IV series models

Note 1

CC78K4

CC78K4-L

PROM Write Tools

PG-1500

PROM programmer

PA-78P4026GC

PA-78P4038GK

PA-78P4026KK

Programmer adaptor, connects to PG-1500

Note 2

PG-1500 controller

Control program for PG-1500

Debugging Tools

IE-784000-R

In-circuit emulator for all 78K/IV sub-series models

Break board for all 78K/IV series models

IE-784000-R-BK

IE-784038-R-EM1

IE-784000-R-EM

Emulation board for evaluating µPD784038 sub-series models

IE-70000-98-IF-B

Interface adapter when the PC-9800 series computer (other than a notebook)

is used as the host machine

IE-70000-98N-IF

Interface adapter and cable when a PC-9800 series notebook is used as the

host machine

TM

IE-70000-PC-IF-B

IE-78000-R-SV3

EP-78230GC-R

Interface adapter when the IBM PC/AT is used as the host machine

Interface adapter and cable when the EWS is used as the host machine

Emulation probe for 80-pin plastic QFP (GC-3B9 and GC-8BT types) for

all µPD784038 sub-series

EP-78054GK-R

Emulation probe for 80-pin plastic TQFP (fine pitch) (GK-BE9 type) for all

µPD784038 sub-series

EV-9200GC-80

TGK-080SDW

Socket for mounting on target system board made for 80-pin plastic QFP

(GC-3B9 and GC-8BT types)

Adapter for mounting on target system board made for 80-pin plastic TQFP

(fine pitch) (GK-BE9 type)

EV-9900

Tool used to remove the µPD78P4038KK-T from the EV-9200GC-80

System simulator for all 78K/IV series models

Note 3

SM78K4

Note 3

ID78K4

Integrated debugger for IE-784000-R

Note 4

DF784038

Device file for all µPD784038 sub-series models

Real-Time OS

Note 4

RX78K/IV

Real-time OS for 78K/IV series models

OS for all 78K/IV series models

Note 2

MX78K4

82

µPD784031

Notes 1. • Based on PC-9800 series (MS-DOS^TM

• Based on IBM PC/AT and compatibles (PC DOS^TM, Windows^TM, MS-DOS, and IBM DOS^TM

• Based on HP9000 series 700^TM(HP-UX^TM

• Based on SPARCstation^TM(SunOS^TM

• Based on NEWS^TM(NEWS-OS^TM

2. • Based on PC-9800 series (MS-DOS)

)

• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)

3. • Based on PC-9800 series (MS-DOS + Windows)

• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)

• Based on HP9000 series 700 (HP-UX)

• Based on SPARCstation (SunOS)

4. • Based on PC-9800 series (MS-DOS)

• Based on IBM PC/AT and compatibles (PC DOS, Windows, MS-DOS, and IBM DOS)

• Based on HP9000 series 700 (HP-UX)

• Based on SPARCstation (SunOS)

Remarks 1. The RA78K4, CC78K4, SM78K4, and ID78K4 are used with the DF784038.

2. The TGK-080SDW is a product of TOKYO ELETECH CORPORATION (Tokyo, 03-5295-1661).

Consult the NEC sales representative for purchasing.

83

µPD784031

APPENDIX B RELATED DOCUMENTS

Documents Related to Devices

Document No.

Document name

Japanese

U11507J

U10847J

U10848J

U11316J

English

This manual

U10847E

U10848E

U11316E

µPD784031 Data Sheet

µPD784035, 784036, 784037, 784038 Data Sheet

µPD78P4038 Data Sheet

µPD784038, 784038Y Sub-Series User's Manual, Hardware

µPD784038 Sub-Series Special Function Registers

78K/IV Series User's Manual, Instruction

78K/IV Series Instruction Summary Sheet

78K/IV Series Instruction Set

U11090J

U10905J

U10594J

U10595J

U10095J

-

U10905E

-

78K/IV Series Application Note, Software Basic

Documents Related to Development Tools (User’s Manual)

Document No.

Document name

Japanese

U11334J

U11162J

EEU-817

EEU-960

EEU-961

EEU-777

EEU-651

EEU-704

EEU-5008

EEU-5004

U11383J

EEU-985

EEU-932

U10093J

U10092J

English

U11334E

-

RA78K4 Assembler Package

Operation

Language

RA78K Series Structured Assembler Preprocessor

CC78K4 Series

EEU-1402

-

Operation

Language

-

CC78K Series Library Source File

PG-1500 PROM Programmer

PG-1500 Controller PC-9800 Series (MS-DOS) Base

PG-1500 Controller IBM PC Series (PC DOS) Base

IE-784000-R

-

EEU-1335

EEU-1291

U10540E

EEU-1534

U11383E

EEU-1515

EEU-1468

U10093E

U10092E

IE-784038-R-EM1

EP-78230

EP-78054GK-R

SM78K4 System Simulator Windows Base

SM78K Series System Simulator

Reference

External Parts User Open

Interface Specifications

ID78K4 Integrated Debugger Windows Base

Reference

U10440J

U10440E

Caution The above documents may be revised without notice. Use the latest versions when you design

application systems.

84

µPD784031

Documents Related to Software to Be Incorporated into the Product (User’s Manual)

Document No.

Document name

Japanese

U10603J

U10604J

U10364J

U11779J

English

78K/IV Series Real-Time OS

Basic

-

Installation

Debugger

Basic

OS for 78K/IV Series MX78K4


型号：	UPD784031
厂家：	NEC
描述：	16/8-BIT SINGLE-CHIP MICROCONTROLLER 8分之16位单芯片微控制器微控制器
文件：	总90页 (文件大小：367K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

UPD784031 [NEC]

相关型号：

UPD784031A

UPD784031GC-3B9

UPD784031GC-8BT

UPD784031GC-8BT-A

UPD784031GCA-3B9

UPD784031GK-BE9

UPD784031Y

UPD784031YGC-3B9

UPD784031YGC-8BT

UPD784031YGC-8BT-A

UPD784031YGK-BE9

UPD784035