UPD784035 [NEC]
16/8-BIT SINGLE-CHIP MICROCONTROLLER; 8分之16位单芯片微控制器型号: | UPD784035 |
厂家: | NEC |
描述: | 16/8-BIT SINGLE-CHIP MICROCONTROLLER |
文件: | 总90页 (文件大小:387K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD784035(A), 784036(A)
16/8-BIT SINGLE-CHIP MICROCONTROLLER
The µPD784036(A) is a product of the µPD784038 sub-series in the 78K/IV series. A stricter quality assurance
program applies to the µPD784036(A) than the µPD784036 (standard product). In terms of the NEC quality, the
µPD784036(A) is classified as the special grade.
The µPD784036(A) contains various peripheral hardware such as ROM, RAM, I/O ports, 8-bit resolution A/D and
D/A converters, timers, serial interface, and interrupt functions, as well as a high-speed, high-performance CPU.
In addition, the µPD78P4038(A) (one-time PROM or EPROM product), which can be operated within the same
power supply voltage ranges as masked-ROM products, and development tools are supported.
For specific functions and other detailed information, consult the following user’s manual.
This manual is required reading for design work.
µPD784038, 784038Y Sub-Series User’s Manual, Hardware : U11316E
78K/IV Series User’s Manual, Instruction
: U10905E
FEATURES
• Higher reliability than the µPD784036 (Refer to Qual-
ity Grade on NEC Semiconductor Devices (Document
number C11531E).)
• PWM outputs: 2
• Serial interface: 3 channels
UART/IOE (3-wire serial I/O): 2 channels
CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel
• Clock frequency division function
• Watchdog timer: 1 channel
• Minimum instruction execution time: 125 ns
(at 32 MHz)
• Number of I/O ports: 64
• Timer/counters
• Clock output function
16-bit timer/counter × 3 units
16-bit timer × 1 unit
Selected from fCLK, fCLK/2, fCLK/4, fCLK/8, or fCLK/16
• Power supply voltage: VDD = 2.7 to 5.5 V
• A/D converter: 8-bit resolution × 8 channels
• D/A converter: 8-bit resolution × 2 channels
• Standby function
HALT/STOP/IDLE mode
APPLICATIONS
Controllers for automobile electronic control systems, gas detector circuit-breakers, various types of safety
equipment, etc.
This manual describes the µPD784036(A) unless otherwise specified.
The information in this document is subject to change without notice.
Document No. U13010EJ1V0DS00 (1st edition)
Date Published December 1997 J
Printed in Japan
©
1997
µPD784035(A), 784036(A)
ORDERING INFORMATION
Part number
Package
Internal ROM
(bytes)
48K
Internal RAM
(bytes)
µPD784035GC(A)-×××-3B9
µPD784036GC(A)-×××-3B9
80-pin plastic QFP (14 × 14 mm)
80-pin plastic QFP (14 × 14 mm)
2 048
64K
2 048
Remark ××× is a ROM code suffix.
QUALITY GRADE
Part number
Package
Quality grade
Special
µPD784035GC(A)-×××-3B9
µPD784036GC(A)-×××-3B9
80-pin plastic QFP (14 × 14 mm)
80-pin plastic QFP (14 × 14 mm)
Special
Remark ××× is a ROM code suffix.
Please refer to "Quality Grades on NEC Semiconductor Devices" (Document No. C11531E) published by
NEC Corporation to know the specification of quality grade on the devices and its recommended applications.
2
µPD784035(A), 784036(A)
78K/IV SERIES PRODUCT DEVELOPMENT DIAGRAM
: Under mass production
: Under development
2
2
I C bus supported
Multimaster I C bus supported
µ
PD784038Y
PD784038
Enhanced internal memory capacity,
µ
PD784225Y
Standard models
µ
µPD784225
80 pins,
PD784026
µ
pin compatible with the PD784026
added ROM correction
µ
Enhanced A/D,
16-bit timer,
and power
2
2
Multimaster I C bus supported
Multimaster I C bus supported
µ
PD784216Y
µ
PD784218Y
management
µPD784216
µPD784218
100 pins,
enhanced I/O and
internal memory capacity
Enhanced internal memory capacity,
added ROM correction
µ
PD784054
µ
PD784046
ASSP models
Equipped with 10-bit A/D
µ
PD784955
For DC inverter control
µ
PD784908
TM
Equipped with IEBus
controller
2
µ
PD784943
Multimaster I C bus supported
For CD-ROM
µ
PD784928Y
PD784928
Enhanced function of the
µ
µPD784915
µ
PD784915
For software servo control,
equipped with analog circuit
for VCR,
enhanced timer
3
µPD784035(A), 784036(A)
FUNCTIONS
Product
µPD784035(A)
µPD784036(A)
Item
Number of basic instructions
(mnemonics)
113
General-purpose register
8 bits × 16 registers × 8 banks, or 16 bits × 8 registers × 8 banks (memory mapping)
Minimum instruction execution 125 ns/250 ns/500 ns/1 000 ns (at 32 MHz)
time
Internal
memory
48K bytes
64K bytes
ROM
RAM
2 048 bytes
Memory space
I/O ports
Program and data: 1M byte
64
8
Total
Input
56
54
Input/output
Additional
function
pins
Pins with pull-
up resistor
Note
24
LED direct
drive outputs
8
Transistor
direct drive
Real-time output ports
Timer/counter
4 bits × 2, or 8 bits × 1
Timer/counter 0:
(16 bits)
Timer register × 1
Capture register × 1
Compare register × 2
Pulse output capability
• Toggle output
• PWM/PPG output
• One-shot pulse output
Timer/counter 1:
(8/16 bits)
Timer register × 1
Capture register × 1
Pulse output capability
• Real-time output (4 bits × 2)
Capture/compare register × 1
Compare register × 1
Timer/counter 2:
(8/16 bits)
Timer register × 1
Capture register × 1
Pulse output capability
• Toggle output
Capture/compare register × 1
Compare register × 1
• PWM/PPG output
Timer 3
:
Timer register × 1
(8/16 bits)
Compare register × 1
PWM outputs
12-bit resolution × 2 channels
Serial interface
UART/IOE (3-wire serial I/O)
: 2 channels (incorporating baud rate generator)
CSI (3-wire serial I/O, 2-wire serial I/O): 1 channel
A/D converter
D/A converter
Clock output
Watchdog timer
Standby
8-bit resolution × 8 channels
8-bit resolution × 2 channels
Selected from fCLK, fCLK/2, fCLK/4, fCLK/8, fCLK/16 (can be used as a 1-bit output port)
1 channel
HALT/STOP/IDLE mode
Interrupt
Hardware source
23 (16 internal, 7 external (sampling clock variable input: 1))
BRK instruction, BRKCS instruction, operand error
1 internal, 1 external
Software source
Nonmaskable
Maskable
15 internal, 6 external
•
•
4-level programmable priority
3 operation statuses: vectored interrupt, macro service, context switching
Supply voltage
Package
VDD = 2.7 to 5.5 V
80-pin plastic QFP (14 × 14 mm)
Note Additional function pins are included in the I/O pins.
4
µPD784035(A), 784036(A)
CONTENTS
1. DIFFERENCES BETWEEN µPD784038 SUB-SERIES SPECIAL PRODUCTS ....................
7
7
8
2. DIFFERENCES BETWEEN STANDARD AND SPECIAL PRODUCTS ..................................
3. PIN CONFIGURATION (TOP VIEW) .........................................................................................
4. BLOCK DIAGRAM ..................................................................................................................... 10
5. LIST OF PIN FUNCTIONS ......................................................................................................... 11
5.1 Port Pins............................................................................................................................................
5.2 Non-Port Pins ...................................................................................................................................
5.3 I/O Circuits for Pins and Handling of Unused Pins ....................................................................
11
13
15
6. CPU ARCHITECTURE ............................................................................................................... 18
6.1 Memory Space ..................................................................................................................................
6.2 CPU Registers ..................................................................................................................................
6.2.1 General-purpose registers ................................................................................................
6.2.2 Control registers ................................................................................................................
6.2.3 Special function registers (SFRs) ....................................................................................
18
21
21
22
23
7. PERIPHERAL HARDWARE FUNCTIONS ................................................................................ 28
7.1 Ports...................................................................................................................................................
7.2 Clock Generator ...............................................................................................................................
7.3 Real-Time Output Port.....................................................................................................................
7.4 Timers/Counters...............................................................................................................................
7.5 PWM Output (PWM0, PWM1) ..........................................................................................................
7.6 A/D Converter ...................................................................................................................................
7.7 D/A Converter ...................................................................................................................................
7.8 Serial Interface .................................................................................................................................
7.8.1 Asynchronous serial interface/three-wire serial I/O (UART/IOE) ................................
7.8.2 Synchronous serial interface (CSI)..................................................................................
7.9 Clock Output Function ....................................................................................................................
7.10 Edge Detection Function ................................................................................................................
7.11 Watchdog Timer ...............................................................................................................................
28
29
31
32
34
35
36
37
38
40
41
42
42
8. INTERRUPT FUNCTION ............................................................................................................ 43
8.1 Interrupt Source ...............................................................................................................................
8.2 Vectored Interrupt ............................................................................................................................
8.3 Context Switching............................................................................................................................
8.4 Macro Service ...................................................................................................................................
8.5 Examples of Macro Service Applications.....................................................................................
43
45
46
46
47
5
µPD784035(A), 784036(A)
9. LOCAL BUS INTERFACE ......................................................................................................... 49
9.1 Memory Expansion ..........................................................................................................................
9.2 Memory Space ..................................................................................................................................
9.3 Programmable Wait .........................................................................................................................
9.4 Pseudo-Static RAM Refresh Function ..........................................................................................
9.5 Bus Hold Function ...........................................................................................................................
49
50
51
51
51
10. STANDBY FUNCTION ............................................................................................................... 52
11. RESET FUNCTION..................................................................................................................... 53
12. INSTRUCTION SET.................................................................................................................... 54
13. ELECTRICAL CHARACTERISTICS ......................................................................................... 59
14. PACKAGE DRAWINGS ............................................................................................................. 80
15. RECOMMENDED SOLDERING CONDITIONS ........................................................................ 81
APPENDIX A DEVELOPMENT TOOLS.......................................................................................... 82
APPENDIX B RELATED DOCUMENTS ......................................................................................... 85
6
µPD784035(A), 784036(A)
1. DIFFERENCES BETWEEN µPD784038 SUB-SERIES SPECIAL PRODUCTS
The only difference between the µPD784031(A), µPD784035(A), and µPD784036(A) is their capacity of internal
memory.
The µPD78P4038(A) is produced by replacing the masked ROM in the µPD784031(A), µPD784035(A), or
µPD784036(A) with 128K-byte one-time PROM or EPROM. Table 1-1 shows the differences between these products.
Table 1-1. Differences between the µPD784038 Sub-Series Special Products
Product
µPD784035(A)
µPD784036(A)
µPD78P4038(A)
µPD784031(A)
Item
(under develoment)
Internal ROM
48K bytes
(masked ROM)
64K bytes
(masked ROM)
128K bytes
(one-time PROM or
EPROM)
None
Internal RAM
4 352 bytes
2 048 bytes
2. DIFFERENCES BETWEEN STANDARD AND SPECIAL PRODUCTS
Table 2-1 shows the differences between standard and special products.
Table 2-1. Differences between Standard and Special Products
Product
µPD784035(A), µPD784036(A)
µPD784035, µPD784036, µPD784037, µPD784038
Item
Standard
Quality grade
Package
Special
80-pin plastic QFP (14 × 14 × 2.7 mm)
80-pin plastic QFP (14 × 14 × 2.7 mm)
80-pin plastic QFP (14 × 14 × 1.4 mm)
80-pin plastic TQFP (fine pitch, 12 × 12 mm)
7
µPD784035(A), 784036(A)
3. PIN CONFIGURATION (TOP VIEW)
•
80-pin plastic QFP (14 × 14 mm)
µPD784031GC(A)-×××-3B9, µPD784036GC(A)-×××-3B9
80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 64 63 62 61
P32/SCK0/SCL
P33/SO0/SDA
P34/TO0
P74/ANI4
P73/ANI3
P72/ANI2
P71/ANI1
P70/ANI0
1
2
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
3
P35/TO1
4
P36/TO2
5
P37/TO3
V
DD0
6
RESET
P17
7
V
DD1
X2
X1
P16
8
P15
9
P14/T
XD2/SO2
10
11
12
13
14
15
16
17
18
19
20
VSS1
P13/R
XD2/SI2
P00
P12/ASCK2/SCK2
P11/PWM1
P01
P02
P10/PWM0
TESTNote
P03
P04
V
SS0
P05
ASTB/CLKOUT
P40/AD0
P06
P07
P41/AD1
P67/REFRQ/HLDAK
P42/AD2
21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Note Connect the TEST pin to VSS0 directly.
8
µPD784035(A), 784036(A)
A8-A19
: Address bus
: Address/data bus
: Analog input
: Analog output
: Asynchronous serial clock
: Address strobe
: Analog power supply
: Reference voltage
: Analog ground
: Clock input
P60-P67
P70-P77
: Port 6
: Port 7
AD0-AD7
ANI0-ANI7
ANO0, ANO1
ASCK, ASCK2
ASTB
PWM0, PWM1 : Pulse width modulation output
RD
: Read strobe
: Refresh request
: Reset
REFRQ
RESET
RxD, RxD2
SCK0-SCK2
SCL
AVDD
: Receive data
: Serial clock
: Serial clock
: Serial data
: Serial input
: Serial output
: Test
AVREF1-AVREF3
AVSS
CI
SDA
CLKOUT
HLDAK
: Clock output
: Hold acknowledge
: Hold request
: Interrupt from peripherals
: Non-maskable interrupt
: Port 0
SI0-SI2
SO0-SO2
TEST
HLDRQ
INTP0-INTP5
NMI
TO0-TO3
TxD, TxD2
VDD0, VDD1
VSS0, VSS1
WAIT
: Timer output
: Transmit data
: Power supply
: Ground
P00-P07
P10-P17
P20-P27
P30-P37
P40-P47
P50-P57
: Port 1
: Port 2
: Wait
: Port 3
WR
: Write strobe
: Crystal
: Port 4
X1, X2
: Port 5
9
µPD784035(A), 784036(A)
4. BLOCK DIAGRAM
RxD/SI1
TxD/SO1
UART/IOE2
NMI
Baud-rate
ASCK/SCK1
generator
Programmable
interrupt controller
INTP0-INTP5
RxD2/SI2
TxD2/SO2
UART/IOE1
INTP3
TO0
Baud-rate
generator
Timer/counter 0
(16 bits)
ASCK2/SCK2
TO1
SCK0/SCL
Clocked serial
interface
SO0/SDA
Timer/counter 1
(16 bits)
INTP0
SI0
ASTB/CLKOUT
Clock output
78K/IV
CPU core
INTP1
INTP2/CI
TO2
ROM
AD0-AD7
Timer/counter 2
(16 bits)
A8-A15
A16-A19
TO3
Bus interface
RD
WR
Timer 3
(16 bits)
WAIT/HLDRQ
REFRQ/HLDAK
P00-P03
P04-P07
P00-P07
P10-P17
Port 0
Port 1
Real-time output
port
RAM
PWM0
PWM1
PWM
P20-P27
P30-P37
P40-P47
P50-P57
P60-P67
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
ANO0
ANO1
AVREF2
AVREF3
D/A converter
ANI0-ANI7
AVDD
AVREF1
AVSS
A/D converter
P70-P77
RESET
INTP5
Watchdog timer
TEST
System control
X1
X2
V
, V
VSDSD00, VSDSD11
Remark The internal ROM capacity differs for each product.
10
µPD784035(A), 784036(A)
5. LIST OF PIN FUNCTIONS
5.1 Port Pins (1/2)
Pin
Dual-function
-
I/O
I/O
Function
P00-P07
Port 0 (P0):
• 8-bit I/O port.
• Functions as a real-time output port (4 bits × 2).
• Inputs and outputs can be specified bit by bit.
• The use of the pull-up resistors can be specified by software for the pins
in input mode together.
• Can drive a transistor.
Port 1 (P1):
P10
PWM0
I/O
P11
PWM1
• 8-bit I/O port.
P12
ASCK2/SCK2
RxD2/SI2
TxD2/SO2
-
• Inputs and outputs can be specified bit by bit.
• The use of the pull-up resistors can be specified by software for the pins
P13
in input mode together.
P14
• Can drive LED.
P15-P17
P20
Port 2 (P2):
NMI
Input
• 8-bit input-only port.
P21
INTP0
• P20 does not function as a general-purpose port (nonmaskable
interrupt). However, the input level can be checked by an interrupt
service routine.
P22
INTP1
P23
INTP2/CI
INTP3
P24
• The use of the pull-up resistors can be specified by software for pins
P25
INTP4/ASCK/SCK1
INTP5
P22 to P27 (in units of 6 bits).
P26
• The P25/INTP4/ASCK/SCK1 pin functions as the SCK1 output pin by
CSIM1.
P27
SI0
Port 3 (P3):
P30
RxD/SI1
TxD/SO1
SCK0/SCL
SO0/SDA
TO0-TO3
AD0-AD7
I/O
• 8-bit I/O port.
P31
• Inputs and outputs can be specified bit by bit.
P32
• The use of the pull-up resistors can be specified by software for the pins
P33
in input mode together.
P34-P37
P40-P47
Port 4 (P4):
I/O
• 8-bit I/O port.
• Inputs and outputs can be specified bit by bit.
• The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
• Can drive LED.
P50-P57
A8-A15
Port 5 (P5):
I/O
• 8-bit I/O port.
• Inputs and outputs can be specified bit by bit.
• The use of the pull-up resistors can be specified by software for the pins
in the input mode together.
• Can drive LED.
11
µPD784035(A), 784036(A)
5.1 Port Pins (2/2)
Function
Pin
P60-P63
P64
Dual-function
A16-A19
I/O
I/O
Port 6 (P6):
• 8-bit I/O port.
RD
• Inputs and outputs can be specified bit by bit.
P65
WR
• The use of the pull-up resistors can be specified by software for the pins
P66
WAIT/HLDRQ
REFRQ/HLDAK
ANI0-ANI7
in the input mode together.
P67
Port 7 (P7):
P70-P77
I/O
• 8-bit I/O port.
• Inputs and outputs can be specified bit by bit.
12
µPD784035(A), 784036(A)
5.2 Non-Port Pins (1/2)
Pin
TO0-TO3
CI
I/O
Dual-function
P34-P37
Function
Output
Input
Input
Timer output
P23/INTP2
P30/SI1
Input of a count clock for timer/counter 2
Serial data input (UART0)
RXD
RXD2
TXD
P13/SI2
Serial data input (UART2)
Output
Input
P31/SO1
P14/SO2
P25/INTP4/SCK1
P12/SCK2
P33/SO0
P27
Serial data output (UART0)
TXD2
ASCK
ASCK2
SDA
Serial data output (UART2)
Baud rate clock input (UART0)
Baud rate clock input (UART2)
Serial data I/O (2-wire serial I/O)
Serial data input (3-wire serial I/O0)
Serial data input (3-wire serial I/O1)
Serial data input (3-wire serial I/O2)
Serial data output (3-wire serial I/O0)
Serial data output (3-wire serial I/O1)
Serial data output (3-wire serial I/O2)
Serial clock I/O (3-wire serial I/O0)
Serial clock I/O (3-wire serial I/O1)
Serial clock I/O (3-wire serial I/O2)
Serial clock I/O (2-wire serial I/O)
I/O
SI0
Input
SI1
P30/RXD
P13/RXD2
P33/SDA
P31/TXD
SI2
SO0
Output
I/O
SO1
SO2
P14/TXD2
P32/SCL
P25/INTP4/ASCK
P12/ASCK2
P32/SCK0
P20
SCK0
SCK1
SCK2
SCL
NMI
Input
External interrupt
reguest
-
INTP0
P21
•
•
Input of a count clock for timer/counter 1
Capture/trigger signal for CR11 or CR12
INTP1
INTP2
INTP3
P22
•
•
Input of a count clock for timer/counter 2
Capture/trigger signal for CR22
P23/CI
P24
•
•
Input of a count clock for timer/counter 2
Capture/trigger signal for CR21
•
•
Input of a count clock for timer/counter 0
Capture/trigger signal for CR02
INTP4
INTP5
AD0-AD7
A8-A15
A16-A19
RD
P25/ASCK/SCK1
P26
-
Input of a conversion start trigger for A/D converter
Time multiplexing address/data bus (for connecting external memory)
High-order address bus (for connecting external memory)
High-order address bus during address expansion (for connecting external memory)
Strobe signal output for reading the contents of external memory
Strobe signal output for writing on external memory
Wait signal insertion
I/O
P40-P47
P50-P57
P60-P63
P64
Output
Output
Output
Output
Input
WR
P65
WAIT
P66/HLDRQ
P67/HLDAK
P66/WAIT
P67/REFRQ
CLKOUT
REFRQ
HLDRQ
HLDAK
ASTB
Output
Input
Refresh pulse output to external pseudo static memory
Input of bus hold request
Output
Output
Output of bus hold response
Latch timing output of time multiplexing address (A0-A7) (for
connecting external memory)
CLKOUT
Output
ASTB
Clock output
13
µPD784035(A), 784036(A)
5.2 Non-Port Pins (2/2)
Pin
RESET
I/O
Input
Input
-
Dual-function
Function
-
-
Chip reset
X1
Crystal input for system clock oscillation (A clock pulse can also be input
to the X1 pin.)
X2
Analog voltage inputs for the A/D converter
Analog voltage outputs for the D/A converter
Application of A/D converter reference voltage
Application of D/A converter reference voltage
Positive power supply for the A/D converter
Ground for the A/D converter
ANI0-ANI7
ANO0, ANO1
AVREF1
Input
Output
-
P70-P77
-
-
AVREF2, AVREF3
AVDD
AVSS
VDD0Note 1
Positive power supply of the port part
Positive power supply except for the port part
Ground of the port part
VDD1Note 1
VSS0Note 2
VSS1Note 2
Ground except for the port part
Directly connect to VSS0. (The TEST pin is for the IC test.)
TEST
Notes 1. The potential of the VDD0 pin must be equal to that of the VDD1 pin.
2. The potential of the VSS0 pin must be equal to that of the VSS1 pin.
14
µPD784035(A), 784036(A)
5.3 I/O Circuits for Pins and Handling of Unused Pins
Table 5-1 describes the types of I/O circuits for pins and the handling of unused pins.
See Figure 5-1 for the configuration of these various types of I/O circuits.
Table 5-1. Types of I/O Circuits for Pins and Handling of Unused Pins (1/2)
Pin
I/O circuit type
5-H
I/O
I/O
Recommended connection method for unused pins
Input state : Connect these pins to VDD0.
Output state: Leave open.
P00-P07
P10/PWM0
P11/PWM1
P12/ASCK2/SCK2
P13/RxD2/SI2
P14/TxD2/SO2
P15-P17
8-C
5-H
P20/NMI
2
Input
Connect these pins to VDD0 or VSS0.
Connect these pins to VDD0.
P21/INTP0
P22/INTP1
2-C
P23/INTP2/CI
P24/INTP3
P25/INTP4/ASCK/SCK1 8-C
I/O
Input
I/O
Input state : Connect these pins to VDD0.
Output state: Leave open.
P26/INTP5
2-C
5-H
10-B
5-H
Connect these pins to VDD0.
P27/SI0
P30/RxD/SI1
Input state : Connect these pins to VDD0.
Output state: Leave open.
P31/TxD/SO1
P32/SCK0/SCL
P33/SO0/SDA
P34/TO0-P37/TO3
P40/AD0-P47/AD7
P50/A8-P57/A15
P60/A16-P63/A19
P64/RD
P65/WR
P66/WAIT/HLDRQ
P67/REFRQ/HLDAK
P70/ANI0-P77/ANI7
20-A
I/O
Input state : Connect these pins to VDD0 or VSS0.
Output state: Leave open.
ANO0, ANO1
12
Output
Leave open.
ASTB/CLKOUT
4-B
15
µPD784035(A), 784036(A)
Table 5-1. Types of I/O Circuits for Pins and Handling of Unused Pins (2/2)
Pin
I/O circuit type
I/O
Recommended connection method for unused pins
RESET
TEST
2
Input
-
1-A
Connect this pin to VSS0 directly.
AVREF1-AVREF3
AVSS
-
Connect these pins to VSS0.
AVDD
Connect this pin to VDD0.
Caution When I/O mode of an I/O dual-function pin is unpredictable, connect the pin to VDD0 through a
resistor of 10 to 100 kilohms (particularly when the voltage of the reset input pin becomes higher
than that of the low level input at power-on or when I/O is switched by software).
Remark Since type numbers are consistent in the 78K series, those numbers are not always serial in each product.
(Some circuits are not included.)
16
µPD784035(A), 784036(A)
Figure 5-1. I/O Circuits for Pins
Type 1-A
Type 2-C
V
DD0
VDD0
P
IN
Pull-up
enable
P
N
VSS0
IN
Type 2
Schmitt trigger input with hysteresis characteristics
Type 5-H
IN
VDD0
Schmitt trigger input with hysteresis characteristics
V
DD0
Type 4-B
Pull-up
enable
P
VDD0
P
Data
P
Data
OUT
IN/OUT
Output
disable
Output
disable
N
N
VSS0
V
SS0
Input
enable
Push-pull output which can output high impedance
(both the positive and negative channels are off.)
Type 8-C
Type 12
V
DD0
Pull-up
enable
P
V
DD0
Data
P
P
N
Analog output
voltage
OUT
IN/OUT
Output
disable
N
VSS0
Type 10-B
Type 20-A
V
DD0
VDD0
Data
P
Pull-up
enable
IN/OUT
P
Output
disable
V
DD0
N
Data
P
N
V
SS0
Comparator
IN/OUT
Open
drain
Output
disable
P
N
+
–
V
SS0
AVSS
AVREF
(Threshold voltage)
Input
enable
17
µPD784035(A), 784036(A)
6. CPU ARCHITECTURE
6.1 Memory Space
A 1M-byte memory space can be accessed. By using a LOCATION instruction, mode for mapping internal data
areas (special function registers and internal RAM) can be selected. A LOCATION instruction must always be
executed after a reset, and can be used only once.
(1) When the LOCATION 0 instruction is executed
• Internal memory
The table below indicates the internal data areas and internal ROM areas of each product.
Product name
µPD784035(A)
µPD784036(A)
Internal data area
0F700H-0FFFFH
Internal ROM area
00000H-0BFFFH
00000H-0F6FFH
Caution The following internal ROM areas, existing at the same addresses as the internal data areas,
cannot be used when the LOCATION 0 instruction is executed:
Product name
µPD784035(A)
µPD784036(A)
Unusable area
-
0F700H-0FFFFH (2 304 bytes)
• External memory
External memory is accessed in external memory expansion mode.
(2) When the LOCATION 0FH instruction is executed
• Internal memory
The table below lists the internal data areas and internal ROM areas for each product.
Product name
µPD784035(A)
µPD784036(A)
Internal data area
FF700H-FFFFFH
Internal ROM area
00000H-0BFFFH
00000H-0FFFFH
• External memory
External memory is accessed in external memory expansion mode.
18
Figure 6-1. µPD784035(A) Memory Map
When the LOCATION 0
instruction is executed
When the LOCATION
0FH instruction is executed
F
FFFFH
F F F F F H
F F F D F H
F F F D 0 H
F F F 0 0 H
Special function registers (SFRs)
Note 1
(256 bytes)
0
FFEFFH
FFEFFH
FEFFH
Internal RAM
(2 048 bytes)
General-purpose
registers (128 bytes)
External memory
(960K bytes)Note 1
0
0
FFE80H
FFE7FH
FF7 00H
FF6 FFH
FE80H
FE7FH
1
0
0
0
0
0
0 0 00H
FFFFH
FFDFH
FFD0H
FF 00H
FEFFH
0
0
FFE2FH
FFE06H
FE2FH
FE06H
Macro service control
word area (42 bytes)
Special function registers (SFRs)
Note 1
(256 bytes)
Data area (512 bytes)
0
0
FD00H
FCFFH
FFD00H
FFCFFH
Internal RAM
(2 048 bytes)
Program/data area
(1 536 bytes)
External memory
(997 120 bytes)Note 1
0
0
FF7 00H
F7 00H
BFFFH
0
0
F7 00H
F6 FFH
Program/data area
(48K bytes)
External memory
µ
Note 2
(14 080 bytes)Note 1
0
0
10 00H
0FFFH
100 00H
0FFFFH
CALLF entry area
(2K bytes)
Note 2
0
0
C0 00H
BFFFH
0C0 00H
0BFFFH
0
0
08 00H
07 FFH
0
0
00 80H
00 7FH
Internal ROM
(48K bytes)
CALLT table area
(64 bytes)
Internal ROM
(48K bytes)
0
0
00 40H
00 3FH
Vector table area
(64 bytes)
0
000 00H
00 00H
0
0 0 00H
Notes 1. Accessed in external memory expansion mode.
2. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
Figure 6-2. µPD784036(A) Memory Map
When the LOCATION 0
instruction is executed
When the LOCATION 0FH
instruction is executed
F FFFFH
F F F F F H
F F F D F H
F F F D 0 H
F F F 0 0 H
Special function registers (SFRs)
Note 1
(256 bytes)
0 FEFFH
F FEFFH
F FEFFH
Internal RAM
(2 048 bytes)
General-purpose
registers (128 bytes)
External memory
(960K bytes)Note 1
0 FE80H
0 FE7FH
F FE80H
F FE7FH
F F700H
F F6FFH
1 0000H
0 FFFFH
0 FFDFH
0 FFD0H
0 FF00H
0 FEFFH
0 FE2FH
0 FE06H
F FE2FH
F FE06H
Macro service control
word area (42 bytes)
Special function registers (SFRs)
Note 1
(256 bytes)
Data area (512 bytes)
0 FD00H
0 FCFFH
F FD00H
F FCFFH
Internal RAM
(2 048 bytes)
Program/data area
(1 536 bytes)
External memory
(980 736 bytes)Note 1
0 F700H
F F700H
0 FFFFH
0 F700H
0 F6FFH
Note 2
0 F6FFH
Program/data areaNote 3
0 1000H
0 0FFFH
CALLF entry
Internal ROM
area (2K bytes)
(63 232 bytes)
Note 4
1 0000H
0 FFFFH
0 0800H
0 07FFH
µ
0 0080H
0 007FH
CALLT table area
(64 bytes)
Internal ROM
(64K bytes)
Note 4
0 0040H
0 003FH
Vector table area
(64 bytes)
0 0000H
0 0000H
0 0000H
Notes 1. Accessed in external memory expansion mode.
2. This 2304-byte area can be used as an internal ROM area only when the LOCATION 0FH instruction is executed.
3. When the LOCATION 0 instruction is executed : 63 232 bytes
When the LOCATION 0FH instruction is executed: 65 536 bytes
4. Base area, or entry area based on a reset or interrupt. Internal RAM is excluded in the case of a reset.
µPD784035(A), 784036(A)
6.2 CPU Registers
6.2.1 General-purpose registers
A set of general-purpose registers consists of sixteen general-purpose 8-bit registers. Two 8-bit general-purpose
registers can be combined to form a 16-bit general-purpose register. Moreover, four 16-bit general-purpose registers,
when combined with an 8-bit register for address extension, can be used as 24-bit address specification registers.
Eight banks of this register set are provided. The user can switch between banks by software or the context
switching function.
General-purpose registers other than the V, U, T, and W registers used for address extension are mapped onto
internal RAM.
Figure 6-3. General-Purpose Register Format
A (R1)
B (R3)
R5
X (R0)
C (R2)
R4
AX (RP0)
BC (RP1)
RP2
R7
R6
RP3
V
U
R9
R8
VVP (RG4)
R11
UUP (RG5)
D (R13)
TDE (RG6)
H (R15)
WHL (RG7)
VP (RP4)
UP (RP5)
DE (RP6)
HL (RP7)
R10
T
E (R12)
L (R14)
W
8 banks
The character strings enclosed in
parentheses represent absolute names.
Caution By setting the RSS bit of PSW to 1, R4, R5, R6, R7, RP2, and RP3 can be used as the X, A, C, B,
AX, and BC registers, respectively. However, this function must be used only when using
programs for the 78K/III series.
21
µPD784035(A), 784036(A)
6.2.2 Control registers
(1) Program counter (PC)
This register is a 20-bit program counter. The program counter is automatically updated by program execution.
Figure 6-4. Format of Program Counter (PC)
19
0
PC
(2) Program status word (PSW)
This register holds the CPU state. The program status word is automatically updated by program execution.
Figure 6-5. Format of Program Status Word (PSW)
15
14
13
12
11
10
9
8
UF
RBS2
RBS1
RBS0
PSWH
PSWL
PSW
7
6
Z
5
4
3
2
1
0
0
S
RSSNote
AC
IE
P/V
CY
Note This flag is used to maintain compatibility with the 78K/III series. This flag must be set to 0 when programs
for the 78K/III series are being used.
(3) Stack pointer (SP)
This register is a 24-bit pointer for holding the start address of the stack. The high-order 4 bits must be set
to 0.
Figure 6-6. Format of Stack Pointer (SP)
23
20
0
SP
0
0
0
0
22
µPD784035(A), 784036(A)
6.2.3 Special function registers (SFRs)
The special function registers are registers with special functions such as mode registers and control registers
for built-in peripheral hardware. The special function registers are mapped onto the 256-byte space between 0FF00H
and 0FFFFHNote
.
Note Applicable when the LOCATION 0 instruction is executed. FFF00H-FFFFFH when the LOCATION 0FH
instruction is executed.
Caution Never attempt to access addresses in this area where no SFR is allocated. Otherwise, the
µPD784036(A) may be placed in the deadlock state. The deadlock state can be cleared only by
a reset.
Table 6-1 lists the special function registers (SFRs). The titles of the table columns are explained below.
• Abbreviation ................... Symbol used to represent a built-in SFR. The abbreviations listed in the table are
reserved words for the NEC assembler (RA78K4). The C compiler (CC78K4) allows
the abbreviations to be used as sfr variables with the #pragma sfr command.
• R/W ................................. Indicates whether each SFR allows read and/or write operations.
R/W : Allows both read and write operations.
R
: Allows read operations only.
: Allows write operations only.
W
• Manipulatable bits .......... Indicates the maximum number of bits that can be manipulated whenever an SFR is
manipulated. An SFR that supports 16-bit manipulation can be described in the sfrp
operand. For address specification, an even-numbered address must be speci-
fied.
An SFR that supports 1-bit manipulation can be described in a bit manipulation
instruction.
• When reset ..................... Indicates the state of each register when RESET is applied.
23
µPD784035(A), 784036(A)
Table 6-1. Special Function Registers (SFRs) (1/4)
Manipulatable bits
Note
Address
Special function register (SFR) name
Abbreviation R/W
When reset
Undefined
1 bit 8 bits 16 bits
0FF00H
0FF01H
0FF02H
0FF03H
0FF04H
0FF05H
0FF06H
0FF07H
0FF0EH
0FF0FH
0FF10H
0FF12H
0FF14H
0FF15H
0FF16H
0FF17H
0FF18H
0FF19H
0FF1AH
0FF1BH
0FF1CH
0FF1DH
0FF20H
0FF21H
0FF23H
0FF24H
0FF25H
0FF26H
0FF27H
0FF2EH
0FF30H
0FF31H
0FF32H
0FF33H
Port 0
P0
R/W
-
-
-
-
-
-
-
-
-
-
Port 1
Port 2
Port 3
Port 4
Port 5
Port 6
Port 7
P1
P2
R
P3
R/W
P4
P5
P6
00H
P7
Port 0 buffer register L P0L
P0H
Undefined
Port 0 buffer register H
Compare register (timer/counter 0)
Capture/compare register (timer/counter 0)
Compare register L (timer/counter 1)
Compare register H (timer/counter 1)
Capture/compare register L (timer/counter 1)
Capture/compare register H (timer/counter 1)
Compare register L (timer/counter 2)
Compare register H (timer/counter 2)
Capture/compare register L (timer/counter 2)
Capture/compare register H (timer/counter 2)
Compare register L (timer 3)
CR00
-
-
-
-
-
-
-
-
-
-
-
-
-
-
CR01
CR10 CR10W
-
-
-
-
-
-
CR11 CR11W
-
CR20 CR20W
-
CR21 CR21W
-
CR30 CR30W
-
Compare register H (timer 3)
Port 0 mode register
PM0
-
-
-
-
-
-
-
-
-
-
-
-
FFH
Port 1 mode register
PM1
Port 3 mode register
PM3
Port 4 mode register
PM4
Port 5 mode register
PM5
Port 6 mode register
PM6
Port 7 mode register
PM7
Real-time output port control register
Capture/compare control register 0
Timer output control register
RTPC
CRC0
TOC
00H
10H
00H
-
Capture/compare control register 1
Capture/compare control register 2
CRC1
CRC2
-
-
10H
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
24
µPD784035(A), 784036(A)
Table 6-1. Special Function Registers (SFRs) (2/4)
Manipulatable bits
Note 1
Address
Special function register (SFR) name
Abbreviation R/W
When reset
0000H
1 bit 8 bits 16 bits
0FF36H
0FF38H
0FF39H
0FF3AH
0FF3BH
0FF41H
0FF43H
0FF4EH
0FF50H
0FF51H
0FF52H
0FF53H
0FF54H
0FF55H
0FF56H
0FF57H
0FF5CH
0FF5DH
0FF5EH
0FF5FH
0FF60H
0FF61H
0FF62H
0FF68H
0FF6AH
0FF70H
0FF71H
0FF72H
0FF74H
0FF7DH
0FF80H
0FF81H
0FF82H
Capture register (timer/counter 0)
Capture register L (timer/counter 1)
Capture register H (timer/counter 1)
Capture register L (timer/counter 2)
Capture register H (timer/counter 2)
Port 1 mode control register
CR02
R
-
-
-
-
-
-
-
-
CR12 CR12W
-
CR22 CR22W
-
PMC1
PMC3
PUO
TM0
R/W
-
-
-
00H
Port 3 mode control register
Register for optional pull-up resistor
Timer register 0
Note 2
R
-
-
-
-
-
-
-
-
-
-
-
0000H
Timer register 1
Timer register 2
Timer register 3
TM1 TM1W
-
-
-
-
TM2 TM2W
-
TM3 TM3W
-
Prescaler mode register 0
Timer control register 0
PRM0
TMC0
PRM1
TMC1
DACS0
DACS1
DAM
R/W
-
-
-
-
-
-
-
-
-
-
-
11H
00H
11H
00H
Prescaler mode register 1
Timer control register 1
-
D/A conversion value setting register 0
D/A conversion value setting register 1
D/A converter mode register
A/D converter mode register
A/D conversion result register
PWM control register
-
-
03H
ADM
00H
ADCR
PWMC
PWPR
PWM0
PWM1
OSPC
IICC
R
-
Undefined
05H
R/W
PWM prescaler register
-
-
-
00H
PWM modulo register 0
-
-
Undefined
PWM modulo register 1
One-shot pulse output control register
-
-
-
-
00H
2
I C bus control register
Prescaler mode register for serial clock
Synchronous serial interface mode register
SPRM
CSIM
-
04H
00H
Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
2. Some registers cannot read. Refer to the µPD78038, µPD784038Y Sub-Series User’s Manual,
Hardware for details.
25
µPD784035(A), 784036(A)
Table 6-1. Special Function Registers (SFRs) (3/4)
Manipulatable bits
Note 1
Address
Special function register (SFR) name
Abbreviation R/W
When reset
00H
1 bit 8 bits 16 bits
0FF84H
0FF85H
0FF86H
0FF88H
0FF89H
0FF8AH
0FF8BH
0FF8CH
Synchronous serial interface mode register 1
Synchronous serial interface mode register 2
Serial shift register
CSIM1
CSIM2
SIO
R/W
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Asynchronous serial interface mode register
ASIM
Asynchronous serial interface mode register 2 ASIM2
Asynchronous serial interface status register
ASIS
R
Asynchronous serial interface status register 2 ASIS2
Serial receive buffer: UART0
Serial transmission shift register: UART0
Serial shift register: IOE1
RXB
-
-
-
-
-
-
-
-
Undefined
TXS
W
SIO1
R/W
R
0FF8DH
Serial receive buffer: UART2
Serial transmission shift register: UART2
Serial shift register: IOE2
RXB2
TXS2
SIO2
W
R/W
0FF90H
0FF91H
0FFA0H
0FFA1H
0FFA4H
0FFA8H
0FFAAH
0FFACH
0FFADH
0FFAEH
0FFC0H
0FFC2H
0FFC4H
0FFC5H
0FFC6H
0FFC7H
0FFC8H
Baud rate generator control register
Baud rate generator control register 2
External interrupt mode register 0
External interrupt mode register 1
Sampling clock selection register
In-service priority register
BRGC
BRGC2
INTM0
INTM1
SCS0
ISPR
00H
-
R
Interrupt mode control register
Interrupt mask register 0L
IMC
R/W
80H
MK0L MK0
MK0H
MK1L
STBC
WDM
MM
FFFFH
Interrupt mask register 0H
Interrupt mask register 1L
-
-
-
-
-
-
-
FFH
30H
00H
20H
00H
Note 2
Note 2
Standby control register
-
-
Watchdog timer mode register
Memory expansion mode register
Hold mode register
HLDM
CLOM
PWC1
PWC2
Clock output mode register
Programmable wait control register 1
Programmable wait control register 2
-
-
AAH
-
AAAAH
Notes 1. Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
2. A write operation can be performed only with special instructions MOV STBC, #byte and MOV
WDM,#byte. Other instructions cannot perform a write operation.
26
µPD784035(A), 784036(A)
Table 6-1. Special Function Registers (SFRs) (4/4)
Manipulatable bits
Note
Address
Special function register (SFR) name
Abbreviation R/W
When reset
00H
1 bit 8 bits 16 bits
0FFCCH
0FFCDH
0FFCFH
0FFD0H-
0FFDFH
0FFE0H
0FFE1H
0FFE2H
0FFE3H
0FFE4H
0FFE5H
0FFE6H
0FFE7H
0FFE8H
0FFE9H
0FFEAH
0FFEBH
0FFECH
0FFEDH
0FFEEH
0FFEFH
Refresh mode register
RFM
RFA
R/W
-
-
Refresh area specification register
Oscillation settling time specification register
External SFR area
OSTS
-
-
-
-
-
Interrupt control register (INTP0)
Interrupt control register (INTP1)
Interrupt control register (INTP2)
Interrupt control register (INTP3)
Interrupt control register (INTC00)
Interrupt control register (INTC01)
Interrupt control register (INTC10)
Interrupt control register (INTC11)
Interrupt control register (INTC20)
Interrupt control register (INTC21)
Interrupt control register (INTC30)
Interrupt control register (INTP4)
Interrupt control register (INTP5)
Interrupt control register (INTAD)
Interrupt control register (INTSER)
Interrupt control register (INTSR)
Interrupt control register (INTCSI1)
Interrupt control register (INTST)
Interrupt control register (INTCSI)
Interrupt control register (INTSER2)
Interrupt control register (INTSR2)
Interrupt control register (INTCSI2)
Interrupt control register (INTST2)
PIC0
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
43H
PIC1
PIC2
PIC3
CIC00
CIC01
CIC10
CIC11
CIC20
CIC21
CIC30
PIC4
PIC5
ADIC
SERIC
SRIC
CSIIC1
STIC
0FFF0H
0FFF1H
0FFF2H
0FFF3H
CSIIC
SERIC2
SRIC2
CSIIC2
STIC2
0FFF4H
Note Applicable when the LOCATION 0 instruction is executed. When the LOCATION 0FH instruction is
executed, F0000H is added to each address.
27
µPD784035(A), 784036(A)
7. PERIPHERAL HARDWARE FUNCTIONS
7.1 Ports
The ports shown in Figure 7-1 are provided to enable the application of wide-ranging control. Table 7-1 lists the
functions of the ports. For the inputs to port 0 to port 6, a built-in pull-up resistor can be specified by software.
Figure 7-1. Port Configuration
P00
Port 0
P07
P10
Port 1
P17
P20-P27
P30
Port 2
8
Port 3
P37
P40
Port 4
P47
P50
Port 5
Port 6
Port 7
P57
P60
P67
P70
P77
28
µPD784035(A), 784036(A)
Table 7-1. Port Functions
Port name
Port 0
Pin
Function
Pull-up specification by software
P00-P07
• Bit-by-bit input/output setting supported
• Operable as 4-bit real-time outputs
(P00-P03, P04-P07)
Specified as a batch for all pins placed in
input mode.
• Capable of driving transistors
Port 1
P10-P17
• Bit-by-bit input/output setting supported
• Capable of driving LEDs
Specified as a batch for all pins placed in
input mode.
Port 2
Port 3
P20-P27
P30-P37
• Input port
Specified for the 6 bits (P22-P27) as a batch.
• Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
input mode.
Port 4
Port 5
Port 6
Port 7
P40-P47
P50-P57
P60-P67
P70-P77
• Bit-by-bit input/output setting supported
• Capable of driving LEDs
Specified as a batch for all pins placed in
input mode.
• Bit-by-bit input/output setting supported
• Capable of driving LEDs
Specified as a batch for all pins placed in
input mode.
• Bit-by-bit input/output setting supported
Specified as a batch for all pins placed in
input mode.
• Bit-by-bit input/output setting supported
-
7.2 Clock Generator
A circuit for generating the clock signal required for operation is provided. The clock generator includes a frequency
divider; low current consumption can be achieved by operating at a lower internal frequency when high-speed
operation is not necessary.
Figure 7-2. Block Diagram of Clock Generator
X1
f
XX
Oscillator
1/2
1/2
1/2
1/2
X2
f
CLK
CPU
Peripheral circuits
fXX/2
UART/IOE
INTP0 noise eliminator
Oscillation settling timer
Remark fXX : Oscillator frequency or external clock input
fCLK: Internal operating frequency
29
µPD784035(A), 784036(A)
Figure 7-3. Examples of Using Oscillator
(1) Crystal/ceramic oscillation
PD784036(A)
µ
V
SS1
X1
X2
(2) External clock
• When EXTC bit of OSTS = 1
• When EXTC bit of OSTS = 0
µ
PD784036(A)
PD784036(A)
µ
X1
X1
X2
X2
Open
PD74HC04, etc.
µ
Caution When using the clock generator, to avoid problems caused by influences such as stray
capacitance, run all wiring within the area indicated by the dotted lines according to the following
rules:
• Minimize the wiring length.
• Wires must never cross other signal lines.
• Wires must never run near a line carrying a large varying current.
• The grounding point of the capacitor of the oscillator must always be at the same potential as
VSS1. Never connect the capacitor to a ground pattern carrying a large current.
• Never extract a signal from the oscillator.
30
µPD784035(A), 784036(A)
7.3 Real-Time Output Port
The real-time output port outputs data stored in the buffer, synchronized with a timer/counter 1 match interrupt
or external interrupt. Thus, pulse output that is free of jitter can be obtained.
Therefore, the real-time output port is best suited to applications (such as open-loop control over stepping motors)
where an arbitrary pattern is output at arbitrary intervals.
As shown in Figure 7-4, the real-time output port is built around port 0 and the port 0 buffer register (P0H, P0L).
Figure 7-4. Block Diagram of Real-Time Output Port
Internal bus
4
4
8
Real-time output port
control register
(RTPC)
Buffer register
8
P0H
4
P0L
4
INTP0 (externally)
INTC10 (from timer/counter 1)
INTC11 (from timer/counter 1)
Output trigger
control circuit
Output latch (P0)
P00
P07
31
µPD784035(A), 784036(A)
7.4 Timers/Counters
Three timer/counter units and one timer unit are incorporated.
Moreover, seven interrupt requests are supported, allowing these units to function as seven timer/counter units.
Table 7-2. Timer/Counter Operation
Name
Timer/counter 0 Timer/counter 1 Timer/counter 2
-
Timer 3
Item
Count pulse width 8 bits
16 bits
Operating mode
Interval timer
2ch
2ch
2ch
2ch
1ch
External event counter
One-shot timer
-
-
-
-
-
-
-
-
Function
Timer output
2ch
-
Toggle output
-
PWM/PPG output
One-shot pulse output
Real-time output
-
Note
-
-
-
1 input
2
-
2 inputs
2
-
Pulse width measurement
1 input
2
-
Number of interrupt requests
1
Note The one-shot pulse output function makes the level of a pulse output active by software, and makes the
level of a pulse output inactive by hardware (interrupt request signal).
Note that this function differs from the one-shot timer function of timer/counter 2.
32
µPD784035(A), 784036(A)
Figure 7-5. Timer/Counter Block Diagram
Timer/counter 0
Clear information
Software trigger
OVF
Timer register 0
(TM0)
f
xx/8
Prescaler
Match
Match
Compare register
(CR00)
TO0
TO1
Compare register
(CR01)
Capture register
(CR02)
Edge
detection
INTP3
INTC00
INTC01
INTP3
Timer/counter 1
Clear information
Timer register 1
(TM1/TM1W)
f
xx/8
Prescaler
OVF
Match
Match
Event input
Compare register
(CR10/CR10W)
INTC10
To real-time
output port
INTC11
Edge
detection
Capture/compare register
(CR11/CR11W)
INTP0
INTP0
Capture register
(CR12/CR12W)
Timer/counter 2
Clear information
Timer register 2
(TM2/TM2W)
f
xx/8
Prescaler
OVF
Match
Match
Compare register
(CR20/CR20W)
TO2
TO3
Edge
detection
INTP2/CI
INTP2
Capture/compare register
(CR21/CR21W)
Capture register
(CR22/CR22W)
Edge
detection
INTP1
INTC20
INTC21
INTP1
Timer 3
Clear
Timer register 3
(TM3/TM3W)
f
xx/8
Prescaler
CSI
Match
Compare register
(CR30/CR30W)
INTC30
Remark OVF: Overflow flag
33
µPD784035(A), 784036(A)
7.5 PWM Output (PWM0, PWM1)
Two channels of PWM (pulse width modulation) output circuitry with a resolution of 12 bits and a repetition
frequency of 62.5 kHz (fCLK = 16 MHz) are incorporated. Low or high active level can be selected for the PWM output
channels, independently of each other. This output is best suited to DC motor speed control.
Figure 7-6. Block Diagram of PWM Output Unit
Internal bus
16
8
PWM modulo register
PWM control register
8
7
4 3
15
0
PWMn
(PWMC)
8
4
Reload
control
Pulse control
circuit
8-bit
down-counter
Output
control
Prescaler
f
CLK
PWMn (output pin)
4-bit counter
1/256
Remark n = 0, 1
34
µPD784035(A), 784036(A)
7.6 A/D Converter
An analog/digital (A/D) converter having 8 multiplexed analog inputs (ANI0-ANI7) is incorporated.
The successive approximation system is used for conversion. The result of conversion is held in the 8-bit A/D
conversion result register (ADCR). Thus, speedy high-precision conversion can be achieved. (The conversion time
is about 7.5 µs at fCLK = 16 MHz.)
A/D conversion can be started in any of the following modes:
• Hardware start: Conversion is started by means of trigger input (INTP5).
• Software start : Conversion is started by means of bit setting the A/D converter mode register (ADM).
After conversion has started, one of the following modes can be selected:
• Scan mode : Multiple analog inputs are selected sequentially to obtain conversion data from all pins.
• Select mode: A single analog input is selected at all times to enable conversion data to be obtained
continuously.
ADM is used to specify the above modes, as well as the termination of conversion.
When the result of conversion is transferred to ADCR, an interrupt request (INTAD) is generated. Using this feature,
the results of conversion can be continuously transferred to memory by the macro service.
Figure 7-7. Block Diagram of A/D Converter
ANI0
Series resistor string
Sample-and-hold circuit
ANI1
ANI2
ANI3
ANI4
ANI5
ANI6
ANI7
AVREF1
R/2
R
Voltage comparator
Successive conver-
sion register (SAR)
Conversion
trigger
Edge
detector
INTAD
INTP5
Control
circuit
R/2
AVSS
Trigger enable
8
A/D converter mode
register (ADM)
A/D conversion
result register (ADCR)
8
8
Internal bus
35
µPD784035(A), 784036(A)
7.7 D/A Converter
Two digital/analog (D/A) converter channels of voltage output type, having a resolution of 8 bits, are incorporated.
An R-2R resistor ladder system is used for conversion. By writing the value to be subject to D/A conversion in
the 8-bit D/A conversion value setting register (DACSn: n = 0, 1), the resulting analog value is output on ANOn
(n = 0, 1). The range of the output voltages is determined by the voltages applied to the AVREF2 and AVREF3 pins.
Because of its high output impedance, no current can be obtained from an output pin. When the load impedance
is low, insert a buffer amplifier between the load and the converter.
The impedance of the ANOn pin goes high while the RESET signal is low. DACSn is set to 0 after a reset
is released.
Figure 7-8. Block Diagram of D/A Converter
ANOn
2R
AVREF2
R
2R
Selector
R
2R
AVREF3
R
2R
DACEn
DACSn
Internal bus
Remark
n = 0, 1
36
µPD784035(A), 784036(A)
7.8 Serial Interface
Three independent serial interface channels are incorporated.
• Asynchronous serial interface (UART)/three-wire serial I/O (IOE) × 2
• Synchronous serial interface (CSI) × 1
• Three-wire serial I/O (IOE)
• Two-wire serial I/O (IOE)
So, communication with points external to the system and local communication within the system can be performed
at the same time. (See Figure 7-9.)
Figure 7-9. Example Serial Interfaces
UART + Three-wire serial I/O + Two-wire serial I/O
µ
PD784036(A)
Master
Slave
[Three-wire serial I/O]
SO1
SI
[UART]
SI1
SCK1
INTPm
Port
SO
SCK
Port
RxD
TxD
Note
RS-232-C
driver/receiver
Port
INT
V
DD
V
DD
Slave
SDA
SCL
SB0
SCK0
Port
Note
INTPn
Port
INT
[Two-wire serial I/O]
Note Handshake line
37
µPD784035(A), 784036(A)
7.8.1 Asynchronous serial interface/three-wire serial I/O (UART/IOE)
Two serial interface channels are available; for each channel, asynchronous serial interface mode or three-wire
serial I/O mode can be selected.
(1) Asynchronous serial interface mode
In this mode, 1-byte data is transferred after a start bit.
A baud rate generator is incorporated to enable communication at a wide range of baud rates.
Moreover, the frequency of a clock signal applied to the ASCK pin can be divided to define a baud rate.
With the baud rate generator, the baud rate conforming to the MIDI standard (31.25 kbps) can be obtained.
Figure 7-10. Block Diagram of Asynchronous Serial Interface Mode
Internal bus
RXB, RXB2
Receive buffer
Transmission
shift register
Receive
shift register
RxD, RxD2
TxD, TxD2
TXS, TXS2
INTSR,
Transmission
control parity
bit addition
Reception
control parity
check
INTSR2
INTSER,
INTSER2
INTST, INTST2
Baud rate generator
1/2m
1/2m
f
XX/2
1/2n+1
ASCK, ASCK2
Remark fXX: Oscillator frequency or external clock input
n = 0 to 11
m = 16 to 30
38
µPD784035(A), 784036(A)
(2) Three-wire serial I/O mode
In this mode, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK) and the two serial data lines (SI
and SO).
In general, a handshake line is required to check the state of communication.
Figure 7-11. Block Diagram of Three-Wire Serial I/O Mode
Internal bus
Direction control
circuit
SIO1, SIO2
Shift register
Output latch
SI1, SI2
SO1, SO2
Interrupt signal
generator
INTCSI1,
INTCSI2
SCK1, SCK2
Serial clock counter
1/2n+1
f
XX/2
1/m
Serial clock
control circuit
Remark fXX: Oscillator frequency or external clock input
n = 0 to 11
m = 1, 16 to 30
39
µPD784035(A), 784036(A)
7.8.2 Synchronous serial interface (CSI)
With this interface, the master device makes the serial clock active to start transmission, then transfers 1-byte data
in phase with the clock.
Figure 7-12. Block Diagram of Synchronous Serial Interface
Internal bus
Direction
control circuit
Reset
Output latch
Set
SI0
Shift register
SO0/SDA
N-ch open-drain
output enabled
(when two-wire
mode is used)
Interrupt signal
generator
Serial clock
counter
SCK0/SCL
INTCSI
Timer 3 output
Serial clock
control circuit
N-ch open-drain
output enabled
(when two-wire
mode is used)
f
XX/16
CLS0
CLS1
fXX/2
Remark fXX: Oscillator frequency or external clock input
40
µPD784035(A), 784036(A)
(1) Three-wire serial I/O mode
This mode is designed for communication with a device incorporating a conventional synchronous serial interface.
Basically, three lines are used for communication: the serial clock line (SCK0) and serial data lines (SI0 and SO0).
In general, a handshake line is required to check the state of communication.
(2) Two-wire serial I/O mode
In this mode, 8-bit data is transferred using two lines: the serial clock line (SCL) and serial data bus (SDA).
In general, a handshake line is required to check the communication state.
7.9 Clock Output Function
The frequency of the CPU clock signal can be divided for output to a point external to the system. Moreover, the
port can be used as a 1-bit port.
The ASTB pin is also used for the CLKOUT pin, so that when this function is used, the local bus interface cannot
be used.
Figure 7-13. Block Diagram of Clock Output Function
f
f
f
CLK
CLK/2
CLK/4
Output control
CLKOUT
f
f
CLK/8
CLK/16
Enable output
Output level
41
µPD784035(A), 784036(A)
7.10 Edge Detection Function
The interrupt input pins (NMI, INTP0-INTP5) are used to apply not only interrupt requests but also trigger signals
for the built-in circuits. As these pins are triggered by an edge (rising or falling) of an input signal, a function for edge
detection is incorporated. Moreover, a noise suppression function is provided to prevent erroneous edge detection
caused by noise.
Table 7-3. Noise Suppression Method for Interrupt Input Pins
Pin
Detectable edge
Noise suppression method
Analog delay
NMI
Rising edge or falling edge
Note
INTP0-INTP3
INTP4, INTP5
Rising edge or falling edge, or both edges
Clock sampling
Analog delay
Note INTP0 is used for sampling clock selection.
7.11 Watchdog Timer
A watchdog timer is incorporated for CPU runaway detection. The watchdog timer, if not cleared by software within
a specified interval, generates a nonmaskable interrupt. Furthermore, once watchdog timer operation is enabled, it
cannot be disabled by software. The user can specify whether priority is placed on an interrupt based on the watchdog
timer or on an interrupt based on the NMI pin.
Figure 7-14. Block Diagram of Watchdog Timer
f
CLK
Timer
f
CLK/221
f
CLK/220
INTWDT
f
f
CLK/219
CLK/217
Clear signal
42
µPD784035(A), 784036(A)
8. INTERRUPT FUNCTION
Table 8-1 lists the interrupt request handling modes. These modes are selected by software.
Table 8-1. Interrupt Request Handling Modes
Handling mode
Handled by
Handling
PC and PSW contents
Vectored interrupt Software
Branches to a handling routine for execution
(arbitrary handling).
The PC and PSW contents are pushed
to and popped from the stack.
Context switching
Automatically selects a register bank, and
branches to a handling routine for execution
(arbitrary handling).
The PC and PSW contents are saved to
and read from a fixed area in the
register bank.
Macro service
Firmware
Performs operations such as memory-to-I/O- Maintained
device data transfer (fixed handling).
8.1 Interrupt Source
An interrupt can be issued from any one of the interrupt sources listed in Table 8-2: execution of BRK and BRKCS
instructions, an operand error, or any of the 23 other interrupt sources.
Four levels of interrupt handling priority can be set. Priority levels can be set to nest control during interrupt handling
or to concurrently generate interrupt requests. Nested macro services, however, are performed without suspension.
When interrupt requests having the same priority level are generated, they are handled according to the default
priority (fixed). (See Table 8-2.)
43
µPD784035(A), 784036(A)
Table 8-2. Interrupt Sources
Source
Trigger
Default
priority
Internal/
external
Macro
Type
service
Name
Software
-
BRK instruction
BRKCS instruction
Operand error
Instruction execution
-
-
When the MOV STBC,#byte, MOV WDM,#byte, or LOCATION
instruction is executed, exclusive OR of the byte operand and
byte does not produce FFH.
Nonmaskable
Maskable
-
NMI
Detection of edge input on the pin
Watchdog timer overflow
External
Internal
External
-
WDT
0 (highest) INTP0
Detection of edge input on the pin (TM1/TM1W capture trigger,
TM1/TM1W event counter input)
Enabled
1
2
3
INTP1
INTP2
INTP3
Detection of edge input on the pin (TM2/TM2W capture trigger,
TM2/TM2W event counter input)
Detection of edge input on the pin (TM2/TM2W capture trigger,
TM2/TM2W event counter input)
Internal
Enabled
Detection of edge input on the pin (TM0 capture trigger, TM0
event counter input)
4
5
6
INTC00
INTC01
INTC10
TM0-CR00 match signal issued
TM0-CR01 match signal issued
TM1-CR10 match signal issued (in 8-bit operation mode)
TM1W-CR10W match signal issued (in 16-bit operation mode)
7
INTC11
INTC20
INTC21
INTC30
TM1-CR11 match signal issued (in 8-bit operation mode)
TM1W-CR11W match signal issued (in 16-bit operation mode)
8
TM2-CR20 match signal issued (in 8-bit operation mode)
TM2W-CR20W match signal issued (in 16-bit operation mode)
9
TM2-CR21 match signal issued (in 8-bit operation mode)
TM2W-CR21W match signal issued (in 16-bit operation mode)
10
TM3-CR30 match signal issued (in 8-bit operation mode)
TM3W-CR30W match signal issued (in 16-bit operation mode)
11
12
13
14
15
INTP4
Detection of edge input on the pin
External
Internal
Enabled
INTP5
Detection of edge input on the pin
INTAD
A/D converter processing completed (ADCR transfer)
ASI0 reception error
Enabled
-
INTSER
INTSR
ASI0 reception completed or CSI1 transfer completed
Enabled
INTCSI1
INTST
16
17
18
19
ASI0 transmission completed
CSI0 transfer completed
INTCSI
INTSER2
INTSR2
INTCSI2
ASI2 reception error
-
ASI2 reception completed or CSI2 transfer completed
Enabled
20 (lowest) INTST2
ASI2 transmission completed
Remark ASI: Asynchronous serial interface
CSI: Synchronous serial interface
44
µPD784035(A), 784036(A)
8.2 Vectored Interrupt
When a branch to an interrupt handling routine occurs, the vector table address corresponding to the interrupt
source is used as the branch address.
Interrupt handling by the CPU consists of the following operations:
• When a branch occurs : Push the CPU status (PC and PSW contents) to the stack.
• When control is returned: Pop the CPU status (PC and PSW contents) from the stack.
To return control from the handling routine to the main routine, use the RETI instruction. The branch destination
addresses must be within the range of 0 to FFFFH.
Table 8-3. Vector Table Address
Interrupt source
BRK instruction
Vector table address
003EH
Operand error
NMI
003CH
0002H
0004H
0006H
0008H
000AH
000CH
000EH
0010H
0012H
0014H
0016H
0018H
001AH
001CH
001EH
0020H
0022H
0024H
WDT
INTP0
INTP1
INTP2
INTP3
INTC00
INTC01
INTC10
INTC11
INTC20
INTC21
INTC30
INTP4
INTP5
INTAD
INTSER
INTSR
INTCSI1
INTST
0026H
0028H
002AH
002CH
INTCSI
INTSER2
INTSR2
INTCSI2
INTST2
002EH
45
µPD784035(A), 784036(A)
8.3 Context Switching
When an interrupt request is generated, or when the BRKCS instruction is executed, an appropriate register bank
is selected by the hardware. Then, a branch to a vector address stored in that register bank occurs. At the same
time, the contents of the current program counter (PC) and program status word (PSW) are stacked in the register
bank.
The branch address must be within the range of 0 to FFFFH.
Figure 8-1. Context Switching Caused by an Interrupt Request
0000B
Register bank (0-7)
<7> Transfer
Register bank n (n = 0-7)
PC19-16
PC15-0
A
B
X
C
<6> Exchange
<5> Save
R5
R7
R4
R6
<2> Save
(Bits 8 to 11 of
temporary register)
VP
UP
V
U
T
Switching between register banks
(RBS0-RBS2 ← n)
RSS ← 0
<3>
<4>
Temporary register
D
H
E
L
IE ← 0
W
<1> Save
PSW
8.4 Macro Service
The macro service function enables data transfer between memory and special function registers (SFRs) without
requiring the intervention of the CPU. The macro service controller accesses both memory and SFRs within the same
transfer cycle to directly transfer data without having to perform data fetch.
Since the CPU status is neither saved nor restored, nor is data fetch performed, high-speed data transfer is
possible.
Figure 8-2. Macro Service
Write
Read
Read
Write
Macro service
controller
CPU
Memory
SFR
Internal bus
46
µPD784035(A), 784036(A)
8.5 Examples of Macro Service Applications
(1) Serial interface transmission
Transmission data storage buffer (memory)
Data n
Data n - 1
Data 2
Data 1
Internal bus
Transmission
shift register
TXS (SFR)
TxD
Transmission control
INTST
Each time a macro service request (INTST) is generated, the next transmission data is transferred from memory
to TXS. When data n (last byte) has been transferred to TXS (that is, once the transmission data storage buffer
becomes empty), a vectored interrupt request (INTST) is generated.
(2) Serial interface reception
Reception data storage buffer (memory)
Data n
Data n - 1
Data 2
Data 1
Internal bus
Reception buffer
RXB (SFR)
Reception
shift register
RxD
Reception control
INTSR
Each time a macro service request (INTSR) is generated, reception data is transferred from RXB to memory.
When data n (last byte) has been transferred to memory (that is, once the reception data storage buffer becomes
full), a vectored interrupt request (INTSR) is generated.
47
µPD784035(A), 784036(A)
(3) Real-time output port
INTC10 and INTC11 function as the output triggers for the real-time output ports. For these triggers, the macro
service can simultaneously set the next output pattern and interval. Therefore, INTC10 and INTC11 can be used
to independently control two stepping motors. They can also be applied to PWM and DC motor control.
Output pattern profile (memory)
Output timing profile (memory)
Pn
T
n
P
n–1
T
n–1
P
2
1
T
2
1
P
T
Internal bus
Internal bus
Match
(SFR)
P0L
CR10
TM1
(SFR)
INTC10
Output latch
P00-P03
Each time a macro service request (INTC10) is generated, a pattern and timing data are transferred to the buffer
register (P0L) and compare register (CR10), respectively. When the contents of timer register 1 (TM1) and CR10
match, another INTC10 is generated, and the P0L contents are transferred to the output latch. When Tn (last
byte) is transferred to CR10, a vectored interrupt request (INTC10) is generated.
For INTC11, the same operation as that performed for INTC10 is performed.
48
µPD784035(A), 784036(A)
9. LOCAL BUS INTERFACE
The local bus interface enables the connection of external memory and I/O devices (memory-mapped I/O). It
supports a 1M-byte memory space. (See Figure 9-1.)
Figure 9-1. Example of Local Bus Interface
PD784036(A)
µ
A16-A19
RD
WR
Kanji character
generator
PROM
PD27C1001A
Pseudo SRAM
µ
µ
PD24C1000
REFRQ
Data bus
AD0-AD7
ASTB
Latch
Address bus
A8-A15
Gate array for I/O
expansion including
Centronics interface
circuit, etc.
9.1 Memory Expansion
By adding external memory, program memory or data memory can be expanded to one of seven sizes between
256 bytes and approximately 1M byte.
49
µPD784035(A), 784036(A)
9.2 Memory Space
The 1M-byte memory space is divided into eight spaces, each having a logical address. Each of these spaces
can be controlled using the programmable wait and pseudo-static RAM refresh functions.
Figure 9-2. Memory Space
FFFFFH
512K bytes
80000H
7FFFFH
256K bytes
40000H
3FFFFH
128K bytes
20000H
1FFFFH
64K bytes
10000H
0FFFFH
16K bytes
0C000H
0BFFFH
16K bytes
08000H
07FFFH
16K bytes
04000H
03FFFH
16K bytes
00000H
50
µPD784035(A), 784036(A)
9.3 Programmable Wait
When the memory space is divided into eight spaces, a wait state can be separately inserted for each memory
space while the RD or WR signal is active. This prevents the overall system efficiency from being degraded even
when memory devices having different access times are connected.
In addition, an address wait function that extends the ASTB signal active period is provided to assure a longer
address decode time. (This function is set for the entire space.)
9.4 Pseudo-Static RAM Refresh Function
Refresh is performed as follows:
• Pulse refresh
A bus cycle is inserted where a refresh pulse is output on the REFRQ pin at regularintervals. When the memory
space is divided into eight, and a specified area is being accessed, refresh pulses can also be output on
the REFRQ pin as the memory is being accessed. This can prevent the refresh cycle from suspending normal
memory access.
• Power-down self-refresh
In standby mode, a low-level signal is output on the REFRQ pin to maintain the contents of pseudo-static RAM.
9.5 Bus Hold Function
A bus hold function is provided to facilitate connection to devices such as a DMA controller. Suppose that a bus
hold request signal (HLDRQ) is received from an external bus master. In this case, upon the completion of the bus
cycle being performed at the reception, the address bus, address/data bus, ASTB, RD, and WR pins are placed in
the high-impedance state, and the bus hold acknowledge signal (HLDAK) is made active to release the bus for the
external bus master.
While the bus hold function is being used, the external wait and pseudo-static RAM refresh functions are disabled.
51
µPD784035(A), 784036(A)
10. STANDBY FUNCTION
The standby function allows the power consumption of the chip to be reduced. The following standby modes are
supported:
• HALT mode : The CPU operation clock is stopped. By occasionally inserting the HALT mode during normal
operation, the overall average power consumption can be reduced.
• IDLE mode : The entire system is stopped, with the exception of the oscillator. This mode consumes only
very little more power than STOP mode, but normal program operation can be restored in almost
as little time as that required to restore normal program operation from HALT mode.
• STOP mode : The oscillator is stopped. All operations in the chip stop, such that only leakage current flows.
These modes can be selected by software.
A macro service can be initiated in HALT mode.
Figure 10-1. Standby Mode Status Transition
Macro service request
End of one operation
End of macro service
Program
operation
Macro
service
Wait for
oscillation
settling
HALT
(standby)
IDLE
(standby)
STOP
(standby)
Request for masked interrupt
Notes 1. INTP4 and INTP5 are applied when not masked.
2. Only when the interrupt request is not masked
Remark NMI is enabled only by external input. The watchdog timer cannot be used to release one of the standby
modes (STOP, HALT, or IDLE mode).
52
µPD784035(A), 784036(A)
11. RESET FUNCTION
Applying a low-level signal to the RESET pin initializes the internal hardware (reset status).
When the RESET input makes a low-to-high transition, the following data is loaded into the program counter (PC):
• Eight low-order bits of the PC
: Contents of location at address 0000H
• Intermediate eight bits of the PC : Contents of location at address 0001H
• Four high-order bits of the PC : 0
The PC contents are used as a branch destination address. Program execution starts from that address. Therefore,
a reset start can be performed from an arbitrary address.
The contents of each register can be set by software, as required.
The RESET input circuit contains a noise eliminator to prevent malfunctions caused by noise. This noise eliminator
is an analog delay sampling circuit.
Figure 11-1. Accepting a Reset
Execute instruction
at reset start address
Delay
Initialize PC
Delay
Delay
RESET
(input)
Internal reset signal
Start reset
End reset
For power-on reset, the RESET signal must be held active until the oscillation settling time (approximately 40 ms)
has elapsed.
Figure 11-2. Power-On Reset
Execute instruction at
reset start address
Oscillation settling time
Delay
Initialize PC
VDD
RESET
(input)
Internal reset signal
End reset
53
µPD784035(A), 784036(A)
12. INSTRUCTION SET
(1) 8-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where A is described as r.)
MOV, XCH, ADD, ADDC, SUB, SUBC, AND, OR, XOR, CMP, MULU, DIVUW, INC, DEC, ROR, ROL, RORC,
ROLC, SHR, SHL, ROR4, ROL4, DBNZ, PUSH, POP, MOVM, XCHM, CMPME, CMPMNE, CMPMNC, CMPMC,
MOVBK, XCHBK, CMPBKE, CMPBKNE, CMPBKNC, CMPBKC, CHKL, CHKLA
Table 12-1. Instructions Implemented by 8-Bit Addressing
Note 2
2nd operand
#byte
A
r
saddr
saddr'
sfr
!addr16
mem
r3
[WHL+]
[WHL-]
n
None
r'
!!addr24 [saddrp]
[%saddrg]
PSWL
PSWH
1st operand
Note 6
A
(MOV)
(MOV)
(XCH)
MOV
(MOV)
MOV
(XCH)
(MOV)
(XCH)
MOV
XCH
MOV
(MOV)
(XCH)
Note 1
Note 6
ADD
XCH
(ADD)
(XCH)
Note 1
Note 1
1,
6
Note 1
Note 1
Note 1
(ADD)
(ADD)Notes
(ADD)
ADDNote 1 ADD
(ADD)
Note 3
r
MOV
(MOV)
(XCH)
MOV
XCH
MOV
XCH
MOV
MOV
XCH
ROR
MULU
DIVUW
INC
Note 1
ADD
XCH
Note 1
Note 1
Note 1
(ADD)
ADD
ADD
ADDNote 1
DEC
Note 6
saddr
sfr
MOV
(MOV)
MOV
MOV
XCH
INC
Note 1
Note 1
ADDNote 1 (ADD)
ADD
DEC
DBNZ
Note 1
ADD
MOV
MOV
MOV
PUSH
POP
Note 1
Note 1
ADDNote 1 (ADD)
ADD
CHKL
CHKLA
!addr16
!!addr24
MOV
(MOV)
MOV
Note 1
ADD
mem
MOV
Note 1
[saddrp]
[%saddrg]
ADD
mem3
ROR4
ROL4
r3
MOV
MOV
MOV
PSWL
PSWH
B, C
DBNZ
STBC, WDM
[TDE+]
[TDE–]
(MOV)
MOVBKNote 5
Note 1
(ADD)
Note 4
MOVM
Notes 1. ADDC, SUB, SUBC, AND, OR, XOR, and CMP are the same as ADD.
2. There is no second operand, or the second operand is not an operand address.
3. ROL, RORC, ROLC, SHR, and SHL are the same as ROR.
4. XCHM, CMPME, CMPMNE, CMPMNC, and CMPMC are the same as MOVM.
5. XCHBK, CMPBKE, CMPBKNE, CMPBKNC, and CMPBKC are the same as MOVBK.
6. When saddr is saddr2 with this combination, an instruction with a short code exists.
54
µPD784035(A), 784036(A)
(2) 16-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where AX is described as rp.)
MOVW, XCHW, ADDW, SUBW, CMPW, MULUW, MULW, DIVUX, INCW, DECW, SHRW, SHLW, PUSH, POP,
ADDWG, SUBWG, PUSHU, POPU, MOVTBLW, MACW, MACSW, SACW
Table 12-2. Instructions Implemented by 16-Bit Addressing
Note 2
None
2nd operand
#word
AX
rp
saddrp
saddrp'
strp
!addr16
mem
[WHL+]
byte
n
rp'
!!addr24 [saddrp]
[%saddrg]
1st operand
Note
3
AX
(MOVW) (MOVW) (MOVW)
(MOVW)
MOVW
(MOVW)
MOVW
XCHW
(MOVW)
(XCHW)
Note 1
ADDW
(XCHW) (XCHW)
(XCHW)Note 3 (XCHW) XCHW
Note 1
Notes 1,3
(ADD)
(ADDW)Note 1 (ADDW)
(ADDW)Note 1
Note 4
rp
MOVW
(MOVW) MOVW
(XCHW) XCHW
MOVW
XCHW
MOVW
XCHW
MOVW
SHRW
SHLW
MULW
Note 1
ADDW
INCW
Note 1
Note 1
Note 1
(ADDW)Note 1 ADDW
ADDW
ADDW
DECW
saddrp
sfrp
MOVW
(MOVW)Note 3 MOVW
MOVW
XCHW
INCW
Note 1
Note 1
ADDW
(ADDW)Note 1 ADDW
DECW
Note 1
ADDW
MOVW
MOVW
MOVW
PUSH
POP
Note 1
Note 1
ADDW
(ADDW)Note 1 ADDW
!addr16
!!addr24
MOVW
(MOVW) MOVW
MOVW
MOVTBLW
mem
[saddrp]
[%saddrg]
PSW
PUSH
POP
SP
ADDWG
SUBWG
post
PUSH
POP
PUSHU
POPU
[TDE+]
byte
(MOVW)
SACW
MACW
MACSW
Notes 1. SUBW and CMPW are the same as ADDW.
2. There is no second operand, or the second operand is not an operand address.
3. When saddrp is saddrp2 with this combination, an instruction with a short code exists.
4. MULUW and DIVUX are the same as MULW.
55
µPD784035(A), 784036(A)
(3) 24-bit instructions (The instructions enclosed in parentheses are implemented by a combination of
operands, where WHL is described as rg.)
MOVG, ADDG, SUBG, INCG, DECG, PUSH, POP
Table 12-3. Instructions Implemented by 24-Bit Addressing
2nd operand #imm24
WHL
rg
saddrg
!!addr24
mem1 [%saddrg]
SP
NoneNote
1st operand
WHL
rg'
(MOVG) (MOVG) (MOVG) (MOVG) (MOVG) MOVG
MOVG
MOVG
(ADDG)
(SUBG)
(ADDG)
(SUBG)
(ADDG)
(SUBG)
ADDG
SUBG
rg
MOVG
ADDG
SUBG
(MOVG) MOVG
MOVG
MOVG
INCG
DECG
PUSH
POP
(ADDG)
(SUBG)
ADDG
SUBG
saddrg
!!addr24
mem1
(MOVG) MOVG
(MOVG) MOVG
MOVG
[%saddrg]
SP
MOVG
MOVG
MOVG
INCG
DECG
Note There is no second operand, or the second operand is not an operand address.
56
µPD784035(A), 784036(A)
(4) Bit manipulation instructions
MOV1, AND1, OR1, XOR1, SET1, CLR1, NOT1, BT, BF, BTCLR, BFSET
Table 12-4. Bit Manipulation Instructions Implemented by Addressing
2nd operand
CY
saddr.bit sfr.bit
A.bit X.bit
/saddr.bit /sfr.bit
/A.bit /X.bit
NoneNote
PSWL.bit PSWH.bit
mem2.bit
/PSWL.bit /PSWH.bit
/mem2.bit
1st operand
!addr16.bit !!addr24.bit
/!addr16.bit /!!addr24.bit
CY
MOV1
AND1
OR1
AND1
OR1
NOT1
SET1
CLR1
XOR1
saddr.bit
sfr.bit
MOV1
NOT1
SET1
CLR1
BF
A.bit
X.bit
PSWL.bit
PSWH.bit
mem2.bit
!addr16.bit
!!addr24.bit
BT
BTCLR
BFSET
Note There is no second operand, or the second operand is not an operand address.
57
µPD784035(A), 784036(A)
(5) Call/return instructions and branch instructions
CALL, CALLF, CALLT, BRK, RET, RETI, RETB, RETCS, RETCSB, BRKCS, BR, BNZ, BNE, BZ, BE, BNC, BNL,
BC, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, BH, BF, BT, BTCLR, BFSET, DBNZ
Table 12-5. Call/Return and Branch Instructions Implemented by Addressing
Instruction
address
$addr20 $!addr20
!addr16 !!addr20
rp
rg
[rp]
[rg]
!addr11 [addr5]
RBn
None
operand
Basic
BCNote
CALL
BR
CALL
CALL
BR
CALL
BR
CALL
BR
CALL
BR
CALL
BR
CALLF
CALLF
BRKCS
BRK
instruction BR
BR
RET
RETCS
RETCSB
RETI
RETB
Composite BF
instruction BT
BTCLR
BFSET
DBNZ
Note BNZ, BNE, BZ, BE, BNC, BNL, BL, BNV, BPO, BV, BPE, BP, BN, BLT, BGE, BLE, BGT, BNH, and BH
are the same as BC.
(6) Other instructions
ADJBA, ADJBS, CVTBW, LOCATION, SEL, NOT EI, DI, SWRS
58
µPD784035(A), 784036(A)
13. ELECTRICAL CHARACTERISTICS
ABSOLUTE MAXIMUM RATINGS (TA = 25 °C)
Parameter
Supply voltage
Symbol
Conditions
Rating
-0.5 to +7.0
AVSS to VDD + 0.5
-0.5 to +0.5
-0.5 to VDD + 0.5
-0.5 to VDD + 0.5
15
Unit
V
VDD
AVDD
AVSS
VI
V
V
Input voltage
V
Output voltage
Output low current
VO
V
IOL
At one pin
mA
mA
mA
mA
V
Total of all output pins
At one pin
100
Output high current
IOH
-10
Total of all output pins
-100
A/D converter reference input
voltage
AVREF1
-0.5 to VDD + 0.3
D/A converter reference input
voltage
AVREF2
AVREF3
TA
-0.5 to VDD + 0.3
-0.5 to VDD + 0.3
-40 to +85
V
V
Operating ambient temperature
Storage temperature
°C
°C
Tstg
-65 to +150
Caution Absolute maximum ratings are rated values beyond which physical damage will be caused to the
product; if the rated value of any of the parameters in the above table is exceeded, even
momentarily, the quality of the product may deteriorate. Always use the product within its rated
values.
59
µPD784035(A), 784036(A)
OPERATING CONDITIONS
• Operating ambient temperature (TA)
: -40 to +85 °C
• Rise time and fall time (tr, tf) (at pins which are not specified) : 0 to 200 µs
• Power supply voltage and clock cycle time : See Figure 13-1.
Figure 13-1. Power Supply Voltage and Clock Cycle Time
10 000
4 000
1 000
Guaranteed
operating
range
125
100
62.5
10
0
1
2
3
4
5
6
7
Power supply voltage [V]
CAPACITANCE (TA = 25 °C, VDD = VSS = 0 V)
Parameter
Input capacitance
Output capacitance
I/O capacitance
Symbol
CI
Conditions
MIN.
TYP.
MAX.
10
Unit
pF
f = 1 MHz
0 V on pins other than measured pins
CO
10
pF
CIO
10
pF
60
µPD784035(A), 784036(A)
OSCILLATOR CHARACTERISTICS (TA = -40 to +85 °C, VDD = +4.5 to 5.5 V, VSS = 0 V)
Resonator
Recommended circuit
Parameter
MIN.
4
MAX.
32
Unit
Ceramic resonator
or crystal
Oscillator frequency (fXX)
MHz
VSS1 X1
X2
C1
C2
External clock
X1 input frequency (fX)
4
0
32
10
MHz
ns
X1 input rise and fall times
(tXR, tXF)
X1
X2
X1 input high-level and low-
level widths (tWXH, tWXL)
10
125
ns
HCMOS
inverter
Caution When using the system clock generator, run wires in the portion surrounded by broken lines
according to the following rules to avoid effects such as stray capacitance:
• Minimize the wiring.
• Never cause the wires to cross other signal lines.
• Never cause the wires to run near a line carrying a large varying current.
• Cause the grounding point of the capacitor of the oscillator to have the same potential as VSS1.
Never connect the capacitor to a ground pattern carrying a large current.
• Never extract a signal from the oscillator.
61
µPD784035(A), 784036(A)
OSCILLATOR CHARACTERISTICS (TA = -40 to +85 °C, VDD = +2.7 to 5.5 V, VSS = 0 V)
Resonator
Recommended circuit
Parameter
MIN.
4
MAX.
16
Unit
Ceramic resonator
or crystal
Oscillator frequency (fXX)
MHz
VSS1 X1
X2
C1
C2
External clock
X1 input frequency (fX)
4
0
16
10
MHz
ns
X1 input rise and fall times
(tXR, tXF)
X1
X2
X1 input high-level and low-
level widths (tWXH, tWXL)
10
125
ns
HCMOS
inverter
Caution When using the system clock generator, run wires in the portion surrounded by broken lines
according to the following rules to avoid effects such as stray capacitance:
•
•
•
•
Minimize the wiring.
Never cause the wires to cross other signal lines.
Never cause the wires to run near a line carrying a large varying current.
Cause the grounding point of the capacitor of the oscillator to have the same potential as VSS1.
Never connect the capacitor to a ground pattern carrying a large current.
Never extract a signal from the oscillator.
•
62
µPD784035(A), 784036(A)
DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V) (1/2)
Parameter
Symbol
VIL1
Conditions
MIN.
-0.3
TYP.
MAX.
Unit
V
Input low voltage
For pins other than those described in
Notes 1, 2, 3, and 4
0.3VDD
VIL2
VIL3
VIH1
For pins described in Notes 1, 2, 3, and
4
-0.3
-0.3
0.2VDD
+0.8
V
V
V
VDD = +5.0 V ± 10 %
For pins described in Notes 2, 3, and 4
Input high voltage
For pins other than those described in
Note 1
0.7VDD
VDD + 0.3
VIH2
VIH3
For pins described in Note 1
0.8VDD
2.2
VDD + 0.3
VDD + 0.3
V
V
VDD = +5.0 V ± 10 %
For pins described in Notes 2, 3, and 4
Output low voltage
Output high voltage
VOL1
VOL2
IOL = 2 mA
0.4
1.0
V
V
VDD = +5.0 V ± 10 %
IOL = 8 mA
For pins described in Notes 2 and 5
VOH1
VOH2
IOH = -2 mA
VDD - 1.0
VDD - 1.4
V
V
VDD = +5.0 V ± 10 %
IOH = -5 mA
For pins described in Note 4
X1 input low current
X1 input high current
IIL
EXTC = 0
-30
µA
µA
0 V ≤ VI ≤ VIL2
IIH
EXTC = 0
+30
VIH2 ≤ VI ≤ VDD
Notes 1. X1, X2, RESET, P12/ASCK2/SCK2, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3,
P25/INTP4/ASCK/SCK1, P26/INTP5, P27/SI0, P32/SCK0/SCL, P33/SO0/SDA, TEST
2. P40/AD0-P47/AD7, P50/A8-P57/A15
3. P60/A16-P63/A19, P64/RD, P65/WR, P66/WAIT/HLDRQ, P67/REFRQ/HLDAK
4. P00-P07
5. P10-P17
63
µPD784035(A), 784036(A)
DC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V) (2/2)
Parameter
Symbol
ILI
Conditions
MIN.
TYP.
MAX.
Unit
Input leakage current
0 V ≤ VI ≤ VDD
±10
µA
For pins other than X1 when EXTC = 0
Output leakage current
VDD supply current
ILO
0 V ≤ VO ≤ VDD
±10
µA
IDD1
Operation mode
fXX = 32 MHz
25
12
13
8
45
mA
VDD = +5.0 V ± 10 %
fXX = 16 MHz
25
26
12
12
8
mA
mA
mA
mA
mA
kΩ
VDD = +2.7 to 3.3 V
IDD2
IDD3
RL
HALT mode
fXX = 32 MHz
VDD = +5.0 V ± 10 %
fXX = 16 MHz
VDD = +2.7 to 3.3 V
IDLE mode
(EXTC = 0)
fXX = 32 MHz
VDD = +5.0 V ± 10 %
fXX = 16 MHz
VDD = +2.7 to 3.3 V
Pull-up resistor
VI = 0 V
15
80
64
µPD784035(A), 784036(A)
AC CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V)
(1) Read/write operation (1/2)
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Symbol
Conditions
VDD = +5.0 V ± 10 %
MIN.
MAX.
Address setup time
tSAST
(0.5 + a) T - 15
(0.5 + a) T - 31
(0.5 + a) T - 17
(0.5 + a) T - 40
0.5T - 24
ASTB high-level width
tWSTH
tHSTLA
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
Address hold time (to ASTB↓)
0.5T - 34
Address hold time (to RD↑)
Delay from address to RD↓
tHRA
tDAR
0.5T - 14
VDD = +5.0 V ± 10 %
(1 + a) T - 9
(1 + a) T - 15
Address float time (to RD↓)
tFRA
0
Delay from address to data input tDAID
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
(2.5 + a + n) T - 37
(2.5 + a + n) T - 52
(2 + n) T - 40
Delay from ASTB↓ to data input
Delay from RD↓ to data input
tDSTID
tDRID
(2 + n) T - 60
(1.5 + n) T - 50
(1.5 + n) T - 70
Delay from ASTB↓ to RD↓
Data hold time (to RD↑)
tDSTR
tHRID
tDRA
0.5T - 9
0
After program
Delay from RD↑ to address active
VDD = +5.0 V ± 10 %
0.5T - 8
is read
0.5T - 12
After data is
read
VDD = +5.0 V ± 10 %
1.5T - 8
1.5T - 12
Delay from RD↑ to ASTB↑
tDRST
tWRL
0.5T - 17
RD low-level width
VDD = +5.0 V ± 10 %
(1.5 + n) T - 30
(1.5 + n) T - 40
0.5T - 14
Address hold time (to WR↑)
Delay from address to WR↓
tHWA
tDAW
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
(1 + a) T - 5
(1 + a) T - 15
Delay from ASTB↓ to data output
tDSTOD
0.5T + 19
0.5T + 35
0.5T - 11
Delay from WR↓ to data output
Delay from ASTB↓ to WR↓
tDWOD
tDSTW
0.5T - 9
Remarks T: TCYK (system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n ≥ 0)
65
µPD784035(A), 784036(A)
(1) Read/write operation (2/2)
Unit
Parameter
Symbol
Conditions
VDD = +5.0 V ± 10 %
MIN.
MAX.
ns
ns
ns
ns
ns
ns
ns
Data setup time (to WR↑)
tSODW
(1.5 + n) T - 30
(1.5 + n) T - 40
0.5T - 5
Note
Data hold time (to WR↑)
tHWOD
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
0.5T - 25
Delay from WR↑ to ASTB↑
tDWST
tWWL
0.5T - 12
WR low-level width
(1.5 + n) T - 30
(1.5 + n) T - 40
Note The hold time includes the time during which VOH1 and VOL1 are held under the load conditions of
CL = 50 pF and RL = 4.7 kΩ.
Remarks T: TCYK (system clock cycle time)
n: Number of wait states (n ≥ 0)
(2) Bus hold timing
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Symbol
tFHQC
Conditions
MIN.
MAX.
(6 + a + n) T + 50
(7 + a + n) T + 30
(7 + a + n) T + 40
1T + 30
Delay from HLDRQ↑ to float
Delay from HLDRQ↑ to HLDAK↑
tDHQHHAH VDD = +5.0 V ± 10 %
Delay from float to HLDAK↑
tDCFHA
Delay from HLDRQ↓ to HLDAK↓ tDHQLHAL VDD = +5.0 V ± 10 %
2T + 40
2T + 60
Delay from HLDAK↓ to active
tDHAC
VDD = +5.0 V ± 10 %
1T - 20
1T - 30
Remarks T: TCYK (system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n ≥ 0)
66
µPD784035(A), 784036(A)
(3) External wait timing
Symbol
tDAWT
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Conditions
VDD = +5.0 V ± 10 %
MIN.
MAX.
Delay from address to WAIT↓ input
(2 + a) T - 40
(2 + a) T - 60
1.5T - 40
tDSTWT
tHSTWTH
tDSTWTH
tDRWTL
tHRWT
Delay from ASTB↓ to WAIT↓ input
Hold time from ASTB↓ to WAIT
Delay from ASTB↓ to WAIT↑
Delay from RD↓ to WAIT↓ input
Hold time from RD↓ to WAIT↓
Delay from RD↓ to WAIT↑
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
1.5T - 60
(0.5 + n) T + 5
(0.5 + n) T +10
(1.5 + n) T - 40
(1.5 + n) T - 60
T - 50
T - 70
nT + 5
nT + 10
tDRWTH
tDWTID
(1 + n) T - 40
(1 + n) T - 60
0.5T - 5
Delay from WAIT↑ to data input
0.5T - 10
tDWTW
tDWTR
tDWWTL
Delay from WAIT↑ to WR↑
Delay from WAIT↑ to RD↑
Delay from WR↓ to WAIT↓ input
0.5T
0.5T
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
T - 50
T - 75
tHWWT
Hold time from WR↓ to WAIT
Delay from WR↓ to WAIT↑
nT + 5
nT + 10
tDWWTH
(1 + n) T - 40
(1 + n) T - 70
Remarks T: TCYK (system clock cycle time)
a: 1 (during address wait), otherwise, 0
n: Number of wait states (n ≥ 0)
(4) Refresh timing
Symbol
tRC
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
Parameter
Conditions
MIN.
MAX.
Random read/write cycle time
REFRQ low-level pulse width
3T
tWRFQL
VDD = +5.0 V ± 10 %
1.5T - 25
1.5T - 30
0.5T - 9
1.5T - 9
1.5T - 9
0.5T - 15
1.5T - 25
1.5T - 30
tDSTRFQ
tDRRFQ
tDWRFQ
tDRFQST
tWRFQH
Delay from ASTB↓ to REFRQ
Delay from RD↑ to REFRQ
Delay from WR↑ to REFRQ
Delay from REFRQ↑ to ASTB
REFRQ high-level pulse width
VDD = +5.0 V ± 10 %
Remark T: TCYK (system clock cycle time)
67
µPD784035(A), 784036(A)
SERIAL OPERATION (TA = -40 to +85 °C, VDD = +2.7 to 5.5 V, AVSS = VSS = 0 V)
(1) CSI
Unit
ns
Parameter
Symbol
Conditions
MIN.
MAX.
Serial clock cycle time (SCK0)
tCYSK0
Input External clock
10/fXX + 380
When SCK0 and SO0 are CMOS I/O
µs
Output
T
ns
Serial clock low-level width
(SCK0)
tWSKL0
tWSKH0
Input External clock
5/fXX + 150
When SCK0 and SO0 are CMOS I/O
µs
Output
0.5T - 40
ns
Serial clock high-level width
(SCK0)
Input External clock
5/fXX + 150
When SCK0 and SO0 are CMOS I/O
µs
ns
ns
ns
Output
0.5T - 40
SI0 setup time (to SCK0↑)
SI0 hold time (to SCK0↑)
tSSSK0
tHSSK0
tDSBSK1
40
5/fXX + 40
0
SO0 output delay time
CMOS push-pull output
(3-wire serial I/O mode)
5/fXX + 150
5/fXX + 400
(to SCK0↓)
ns
tDSBSK2
Open-drain output
0
(2-wire serial I/O mode), RL = 1 kΩ
Remarks 1. The values in this table are those when CL is 100 pF.
2. T Serial clock cycle set by software. The minimum value is 16/fXX.
3. fXX : Oscillator frequency
:
68
µPD784035(A), 784036(A)
(2) IOE1, IOE2
Unit
Parameter
Symbol
tCYSK1
Conditions
MIN.
250
MAX.
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Serial clock cycle time
(SCK1, SCK2)
Input
VDD = +5.0 V ± 10 %
500
Output
Input
Internal, divided by 16
T
Serial clock low-level width
(SCK1, SCK2)
tWSKL1
tWSKH1
VDD = +5.0 V ± 10 %
85
210
Output
Input
Internal, divided by 16
0.5T - 40
85
Serial clock high-level width
(SCK1, SCK2)
VDD = +5.0 V ± 10 %
210
Output
Internal, divided by 16
0.5T - 40
40
Setup time for SI1 and SI2
tSSSK1
tHSSK1
(to SCK1, SCK2↑)
ns
ns
ns
Hold time for SI1 and SI2
40
(to SCK1, SCK2↑)
Output delay time for SO1 and tDSOSK
0
50
SO2 (to SCK1, SCK2↓)
Output hold time for SO1 and
tHSOSK
When data is transferred
0.5tCYSK1 - 40
SO2 (to SCK1, SCK2↑)
Remarks 1. The values in this table are those when CL is 100 pF.
2. T: Serial clock cycle set by software. The minimum value is 16/fXX.
(3) UART, UART2
Unit
ns
Parameter
Symbol
tCYASK
Conditions
VDD = +5.0 V ± 10 %
MIN.
125
250
52.5
85
MAX.
ASCK clock input cycle time
ns
ns
ASCK clock low-level width
ASCK clock high-level width
tWASKL
tWASKH
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
ns
ns
52.5
85
ns
69
µPD784035(A), 784036(A)
CLOCK OUTPUT OPERATION
Symbol
Unit
Parameter
CLKOUT cycle time
CLKOUT low-level width
Conditions
MIN.
MAX.
tCYCL
ns
ns
ns
ns
ns
ns
ns
ns
ns
nT
tCLL
VDD = +5.0 V ± 10 %
0.5tCYCL - 10
0.5tCYCL - 20
0.5tCYCL - 10
0.5tCYCL - 20
tCLH
tCLR
tCLF
CLKOUT high-level width
CLKOUT rise time
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
VDD = +5.0 V ± 10 %
10
20
10
20
CLKOUT fall time
Remarks n: Divided frequency ratio set by software in the CPU (n = 1, 2, 4, 8, 16)
T: tCYK (system clock cycle time)
OTHER OPERATIONS
Unit
µs
Parameter
NMI low-level width
NMI high-level width
INTP0 low-level width
INTP0 high-level width
Symbol
tWNIL
Conditions
MIN.
10
MAX.
µs
tWNIH
10
ns
tWIT0L
tWIT0H
tWIT1L
4tCYSMP
4tCYSMP
4tCYCPU
ns
ns
Low-level width for INTP1-
INTP3 and CI
ns
µs
µs
High-level width for INTP1-
INTP3 and CI
tWIT1H
4tCYCPU
10
Low-level width for INTP4 and tWIT2L
INTP5
High-level width for INTP4 and tWIT2H
INTP5
10
µs
µs
RESET low-level width
RESET high-level width
tWRSL
tWRSH
10
10
Remarks tCYSMP: Sampling clock set by software
tCYCPU: CPU operation clock set by software in the CPU
70
µPD784035(A), 784036(A)
A/D CONVERTER CHARACTERISTICS
(TA = -40 to +85 °C, VDD = AVDD = AVREF1 = +2.7 to 5.5 V, VSS = AVSS = 0 V)
Parameter
Resolution
Symbol
Conditions
MIN.
8
TYP.
MAX.
Unit
bit
Note
Total error
1.0
0.8
%
Note
Linearity calibration
Quantization error
Conversion time
%
±1/2
LSB
tCYK
tCYK
tCYK
tCYK
V
tCONV
tSAMP
FR = 1
FR = 0
FR = 1
FR = 0
120
180
24
Sampling time
36
Analog input voltage
Analog input impedance
AVREF1 current
VIAN
-0.3
AVREF1 + 0.3
RAN
1 000
0.5
MΩ
mA
mA
µA
AIREF1
AIDD1
AIDD2
1.5
5.0
20
AVDD supply current
fXX = 32 MHz, CS = 1
STOP mode, CS = 0
2.0
1.0
Note Quantization error is not included. This parameter is indicated as the ratio to the full-scale value.
Remark tCYK: System clock cycle time
71
µPD784035(A), 784036(A)
D/A CONVERTER CHARACTERISTICS (TA = -40 to +85 °C, VDD = AVDD = +2.7 to 5.5 V, VSS = AVSS = 0 V)
Parameter
Resolution
Symbol
Conditions
MIN.
8
TYP.
MAX.
0.6
Unit
bit
Total error
Load conditions: VDD = AVDD = AVREF2
%
4 MΩ, 30 pF
= +2.7 to 5.5 V
AVREF3 = 0 V
V
DD = AVDD = +2.7 to 5.5 V
0.8
0.8
1.0
10
%
%
%
AVREF2 = 0.75VDD
AVREF3 = 0.25VDD
Load conditions: VDD = AVDD = AVREF2
2 MΩ, 30 pF
= +2.7 to 5.5 V
AVREF3 = 0 V
VDD = AVDD = +2.7 to 5.5 V
AVREF2 = 0.75VDD
AVREF3 = 0.25VDD
Settling time
Load conditions: 2 MΩ, 30 pF
µs
kΩ
V
Output resistance
Analog reference voltage
RO
DACS0, 1 = 55 H
10
8
AVREF2
AVREF3
RAIREF
0.75VDD
VDD
0
4
0.25VDD
V
Resistance of AVREF2 and
DACS0, 1 = 55 H
kΩ
AVREF3
Reference power supply
input current
AIREF2
AIREF3
0
5
0
mA
mA
-5
72
µPD784035(A), 784036(A)
DATA RETENTION CHARACTERISTICS (TA = -40 to +85 °C)
Parameter
Symbol
VDDDR
Conditions
MIN.
2.5
TYP.
MAX.
5.5
50
Unit
V
Data retention voltage
Data retention current
STOP mode
IDDDR
VDDDR = +2.7 to 5.5 V
VDDDR = +2.5 V
10
2
µA
µA
µs
10
VDD rise time
VDD fall time
tRVD
tFVD
tHVD
200
200
0
µs
VDD hold time
ms
(to STOP mode setting)
STOP clear signal input time tDREL
0
ms
ms
ms
V
Oscillation settling time
tWAIT
Crystal
30
Ceramic resonator
5
0
Note
Input low voltage
Input high voltage
VIL
VIH
Specific pins
0.1VDDDR
0.9VDDDR
VDDDR
V
Note RESET, P20/NMI, P21/INTP0, P22/INTP1, P23/INTP2/CI, P24/INTP3, P25/INTP4/ASCK/SCK1,
P26/INTP5, P27/SI0, P32/SCK0/SCL, and P33/SO0/SDA pins
AC TIMING TEST POINTS
V
DD - 1 V
0.8VDD or 2.2 V
0.8 V
0.8VDD or 2.2 V
0.8 V
Test points
0.45 V
73
µPD784035(A), 784036(A)
TIMING WAVEFORM
(1) Read operation
t
WSTH
ASTB
t
SAST
t
DRST
t
DSTID
t
HSTLA
A8-A19
t
DAID
t
HRA
AD0-AD7
t
DSTR
t
FRA
t
HRID
t
DAR
t
DRID
t
DRA
RD
t
WRL
(2) Write operation
t
WSTH
ASTB
t
SAST
t
DWST
t
DSTOD
t
HSTLA
A8-A19
t
HWA
AD0-AD7
t
DSTW
t
HWOD
t
DAW
t
DWOD
t
SODW
WR
t
WWL
74
µPD784035(A), 784036(A)
HOLD TIMING
ADTB, A8-A19,
AD0-AD7, RD, WR
t
FHQC
t
DCFHA
t
DHAC
HLDRQ
HLDAK
t
DHQLHAL
t
DHQHHAH
EXTERNAL WAIT SIGNAL INPUT TIMING
(1) Read operation
ASTB
t
DSTWTH
t
HSTWTH
t
DSTWT
A8-A19
AD0-AD7
RD
t
DAWT
t
DWTID
t
DRWTL
t
DWTR
WAIT
t
HRWT
DRWTH
t
(2) Write operation
ASTB
t
DSTWTH
t
HSTWTH
t
DSTWT
A8-A19
AD0-AD7
WR
t
DAWT
t
DWWTL
t
DWTW
WAIT
t
HWWT
DWWTH
t
75
µPD784035(A), 784036(A)
REFRESH TIMING WAVEFORM
(1) Random read/write cycle
t
RC
ASTB
WR
t
RC
t
RC
t
RC
t
RC
RD
(2) When refresh memory is accessed for a read and write at the same time
ASTB
RD, WR
t
DSTRFQ
t
DRFQST
t
WRFQH
REFRQ
t
WRFQL
(3) Refresh after a read
ASTB
t
DRFQST
RD
t
DRRFQ
REFRQ
t
WRFQL
(4) Refresh after a write
ASTB
t
DRFQST
WR
t
DWRFQ
REFRQ
t
WRFQL
76
µPD784035(A), 784036(A)
SERIAL OPERATION
(1) CSI
t
WSKL0
t
WSKH0
SCK
tSSSK0
t
HSSK0
t
CYSK0
SI
Input data
t
HSBSK1
t
DSBSK1
SO
Output data
(2) IOE1, IOE2
t
WSKL1
t
WSKH1
SCK
tSSSK1
t
HSSK1
t
CYSK1
SI
Input data
t
HSOSK
t
DSOSK
SO
Output data
(3) UART, UART2
tWASKH
tWASKL
ASCK,
ASCK2
tCYASK
77
µPD784035(A), 784036(A)
CLOCK OUTPUT TIMING
t
CLH
t
CLL
CLKOUT
t
CLR
t
CLF
t
CYCL
INTERRUPT REQUEST INPUT TIMING
tWNIH
tWNIL
tWIT0L
tWIT1L
tWIT2L
NMI
tWIT0H
INTP0
tWIT1H
CI,
INTP1-INTP3
tWIT2H
INTP4, INTP5
RESET INPUT TIMING
t
WRSH
t
WRSL
RESET
78
µPD784035(A), 784036(A)
EXTERNAL CLOCK TIMING
t
WXH
t
WXL
X1
t
XR
t
XF
t
CYX
DATA RETENTION CHARACTERISTICS
STOP mode setting
V
DD
V
DDDR
t
DREL
t
WAIT
t
HVD
t
FVD
t
RVD
RESET
NMI
(Clearing by falling edge)
NMI
(Clearing by rising edge)
79
µPD784035(A), 784036(A)
14. PACKAGE DRAWINGS
80 PIN PLASTIC QFP (14x14)
A
B
60
61
41
40
detail of lead end
S
C D
R
Q
21
20
80
1
F
P
J
G
M
H
I
K
M
N
L
NOTE
ITEM MILLIMETERS
INCHES
Each lead centerline is located within 0.13 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
A
B
17.2±0.4
14.0±0.2
0.677±0.016
+0.009
0.551
–0.008
+0.009
0.551
C
14.0±0.2
–0.008
D
F
17.2±0.4
0.825
0.677±0.016
0.032
G
0.825
0.032
+0.004
0.012
H
0.30±0.10
–0.005
I
0.13
0.005
J
K
0.65 (T.P.)
1.6±0.2
0.026 (T.P.)
0.063±0.008
+0.009
0.031
L
0.8±0.2
–0.008
+0.004
0.006
+0.10
0.15
M
–0.003
–0.05
N
P
0.10
0.004
+0.005
0.106
2.7±0.1
–0.004
Q
R
S
0.1±0.1
5°±5°
0.004±0.004
5°±5°
3.0 MAX.
0.119 MAX.
S80GC-65-3B9-5
Remark The shape and material of the ES version are the same as those of the corresponding mass-produced
product.
80
µPD784035(A), 784036(A)
15. RECOMMENDED SOLDERING CONDITIONS
The conditions listed below shall be met when soldering the µPD784035(A) and µPD784036(A).
For details of the recommended soldering conditions, refer to our document Semiconductor Device Mounting
Technology Manual (C10535E).
Please consult with our sales offices in case any other soldering process is used, or in case soldering is done under
different conditions.
Table 15-1. Soldering Conditions for Surface-Mount Devices
µPD784035GC(A)-×××-3B9: 80-pin plastic QFP (14 × 14 mm)
µPD784036GC(A)-×××-3B9: 80-pin plastic QFP (14 × 14 mm)
Soldering process
Infrared ray reflow
Soldering conditions
Symbol
IR35-00-3
Peak package's surface temperature: 235 °C
Reflow time: 30 seconds or less (210 °C or more)
Maximum allowable number of reflow processes: 3
VPS
Peak package's surface temperature: 215 °C
Reflow time: 40 seconds or less (200 °C or more)
Maximum allowable number of reflow processes: 3
VP15-00-3
WS60-00-1
Wave soldering
Solder temperature: 260 °C or less
Flow time: 10 seconds or less
Number of flow processes: 1
Preheating temperature
: 120 °C max. (measured on the package surface)
Partial heating method
Terminal temperature: 300 °C or less
-
Heat time: 3 seconds or less (for one side of a device)
Caution Do not apply two or more different soldering methods to one chip (except for partial heating
method for terminal sections).
81
µPD784035(A), 784036(A)
APPENDIX A DEVELOPMENT TOOLS
The following development tools are available for system development using the µPD784036(A).
See also (5).
(1) Language processing software
RA78K4
Assembler package for all 78K/IV series models
C compiler package for all 78K/IV series models
Device file for µPD784038 sub-series models
C compiler library source file for all 78K/IV series models
CC78K4
DF784038
CC78K4-L
(2) PROM write tools
PG-1500
PROM programmer
PA-78P4026GC
PG-1500 controller
Programmer adaptor, connects to PG-1500
Control program for PG-1500
(3) Debugging tools
• When using the in-circuit emulator IE-78K4-NS
Note
IE-78K4-NS
In-circuit emulator for all 78K/IV series models
IE-70000-MC-PS-B
Power supply unit for IE-78K4-NS
Note
IE-70000-98-IF-C
Interface adapter when the PC-9800 series computer (other than a notebook)
is used as the host machine
Note
IE-70000-CD-IF
PC card and interface cable when a PC-9800 series notebook is used as the
host machine
Note
TM
IE-70000-PC-IF-C
Interface adapter when the IBM PC/AT or compatible is used as the host
machine
Note
IE-784038-NS-EM1
Emulation board for evaluating µPD784038 sub-series models
Emulation probe for 80-pin plastic QFP (GC-3B9 type)
NP-80GC
EV-9200GC-80
Socket for mounting on target system board made for 80-pin plastic QFP
(GC-3B9 type)
Note
ID78K4-NS
Integrated debugger for IE-78K4-NS
SM78K4-NS
DF784038
System simulator for all 78K/IV series models
Device file for µPD784038 sub-series models
Note Under development
82
µPD784035(A), 784036(A)
• When using the in-circuit emulator IE-784000-R
IE-784000-R
IE-70000-98-IF-B
In-circuit emulator for all 78K/IV series models
Interface adapter when the PC-9800 series computer (other than a notebook)
is used as the host machine
Note
IE-70000-98-IF-C
IE-70000-98N-IF-B
Interface adapter and cable when a PC-9800 series notebook is used as the
host machine
IE-70000-PC-IF-B
Interface adapter when the IBM PC/AT or compatible is used as the host
machine
Note
IE-70000-PC-IF-C
IE-78000-R-SV3
IE-784038-NS-EM1
Interface adapter and cable when the EWS is used as the host machine
Note
Note
Emulation board for evaluating µPD784038 sub-series models
IE-784038-R-EM1
IE-78400-R-EM
Emulation board for all 78K/IV series models
Note
IE-78K4-R-EX2
Conversion board for 80 pins to use the IE-784038-NS-EM1 on the
IE-784000-R. The board is not needed when the conventional product
IE-784038-R-EM1 is used.
EP-78230GC-R
EV-9200GC-80
Emulation probe for 80-pin plastic QFP (GC-3B9 type)
Socket for mounting on target system board made for 80-pin plastic QFP
(GC-3B9 type)
ID78K4
Integrated debugger for IE-784000-R
SM78K4
DF784038
System simulator for all 78K/IV series models
Device file for µPD784038 sub-series models
Note Under development
(4) Real-time OS
RX78K/IV
MX78K4
Real-time OS for 78K/IV series models
OS for 78K/IV series models
83
µPD784035(A), 784036(A)
(5) Notes when using development tools
• The ID78K-NS, ID78K4, and SM78K4 can be used in combination with the DF784038.
• The CC78K and RX78K/IV can be used in combination with the RA78K4 and DF784038.
• The NP-80GC is a product from Naito Densei Machida Seisakusho Co., Ltd. (044-822-3813). Consult the NEC
sales representative for purchasing.
• The host machines and operating systems corresponding to each software are shown below.
Host machine
[OS]
PC
EWS
TM
TM
TM
PC-9800 Series [Windows
]
HP9000 Series 700 [HP-UX
]
TM
TM
IBM PC/AT and compatibles [Windows] SPARCstation [SunOS
]
TM
TM
NEWS
(RISC) [NEWS-OS
]
Software
Note
Note
Note
RA78K4
CC78K4
PG-1500 controller
ID78K4-NS
ID78K4
-
-
SM78K4
-
Note
Note
RX78K/IV
MX78K4
Note Software under MS-DOS
84
µPD784035(A), 784036(A)
APPENDIX B RELATED DOCUMENTS
Documents Related to Devices
Document No.
Document name
Japanese
U13010J
U13009J
To be created
U11316J
U11090J
U10905J
U10594J
U10595J
U10095J
English
µPD784035(A), 784036(A) Data Sheet
µPD784031(A) Data Sheet
This manual
Under creation
µPD78P4038(A) Data Sheet
To be created
µPD784038, 784038Y Sub-Series User's Manual, Hardware
µPD784038 Sub-Series Special Function Registers
78K/IV Series User's Manual, Instruction
78K/IV Series Instruction Summary Sheet
78K/IV Series Instruction Set
U11316E
-
U10905E
-
-
-
78K/IV Series Application Note, Software Basic
Documents Related to Development Tools (User’s Manual)
Document No.
Document name
Japanese
U11334J
English
U11334E
U11162E
U11743E
U11572E
U11571E
U12322E
U11940E
EEU-1291
U10540E
To be created
EEU-1534
To be created
U11383E
EEU-1515
U10093E
U10092E
RA78K4 Assembler Package
Operation
Language
U11162J
RA78K Series Structured Assembler Preprocessor
CC78K4 C Compiler
U11743J
Operation
Language
U11572J
U11571J
CC78K Series Library Source File
PG-1500 PROM Programmer
U12322J
U11940J
TM
PG-1500 Controller PC-9800 Series (MS-DOS ) Base
EEU-704
EEU-5008
Under creation
U12903J
TM
PG-1500 Controller IBM PC Series (PC DOS ) Base
IE-78K4-NS
IE-784000-R
IE-784038-NS-EM1
IE-784038-R-EM1
To be created
U11383J
EP-78230
EEU-985
U10093J
SM78K4 System Simulator Windows Base
SM78K Series System Simulator
Reference
External Parts User Open
Interface Specifications
U10092J
ID78K4 Integrated Debugger
Reference
Reference
U12796J
U10440J
U12796E
U10440E
ID78K4 Integrated Debugger Windows Base
ID78K4 Integrated Debugger HP-UX, SunOS, NEW-OS Base Reference
U11960J
U11960E
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
85
µPD784035(A), 784036(A)
Documents Related to Software to Be Incorporated into the Product (User’s Manual)
Document No.
Document name
Japanese
English
78K/IV Series Real-Time OS
Basic
U10603J
U10604J
U10364J
U11779J
U10603E
Installation
Debugger
Basic
U10604E
-
-
OS for 78K/IV Series MX78K4
Other Documents
Document No.
Document name
Japanese
English
IC PACKAGE MANUAL
C10943X
Semiconductor Mount Technology Manual
C10535J
C11531J
C10983J
U11892J
C12769J
C11416J
C10535E
C11531E
C10983E
E11892E
-
Quality Grades on NEC Semiconductor Device
NEC Semiconductor Device Reliability/Quality Control System
Guide to Prevent Damage for Semiconductor Devices by Electrostatic Discharge (ESD)
Semiconductor Device Quality Control/Reliability Handbook
Guide for Products Related to Micro-Computer: Other Companies
-
Caution The above documents may be revised without notice. Use the latest versions when you design
application systems.
86
µPD784035(A), 784036(A)
NOTES FOR CMOS DEVICES
1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS
Note: Strong electric field, when exposed to a MOS device, can cause destruction
of the gate oxide and ultimately degrade the device operation. Steps must
be taken to stop generation of static electricity as much as possible, and
quickly dissipate it once, when it has occurred. Environmental control must
be adequate. When it is dry, humidifier should be used. It is recommended
to avoid using insulators that easily build static electricity. Semiconductor
devices must be stored and transported in an anti-static container, static
shielding bag or conductive material. All test and measurement tools
including work bench and floor should be grounded. The operator should
be grounded using wrist strap. Semiconductor devices must not be touched
with bare hands. Similar precautions need to be taken for PW boards with
semiconductor devices on it.
2 HANDLING OF UNUSED INPUT PINS FOR CMOS
Note: No connection for CMOS device inputs can be cause of malfunction. If no
connection is provided to the input pins, it is possible that an internal input
level may be generated due to noise, etc., hence causing malfunction. CMOS
device behave differently than Bipolar or NMOS devices. Input levels of
CMOS devices must be fixed high or low by using a pull-up or pull-down
circuitry. Each unused pin should be connected to VDD or GND with a
resistor, if it is considered to have a possibility of being an output pin. All
handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3 STATUS BEFORE INITIALIZATION OF MOS DEVICES
Note: Power-on does not necessarily define initial status of MOS device. Produc-
tion process of MOS does not define the initial operation status of the device.
Immediately after the power source is turned ON, the devices with reset
function have not yet been initialized. Hence, power-on does not guarantee
out-pin levels, I/O settings or contents of registers. Device is not initialized
until the reset signal is received. Reset operation must be executed imme-
diately after power-on for devices having reset function.
87
µPD784035(A), 784036(A)
IEBus is a trademark of NEC Corporation.
MS-DOS and Windows are registered trademarks or trademarks of Microsoft Corporation in the United States
and/or other countries.
PC/AT, and PC DOS are trademarks of IBM Corporation.
HP9000 series 700 and HP-UX are trademarks of Hewlett-Packard Company.
SPARCstation is a trademark of SPARC International, Inc.
SunOS is a trademark of Sun Microsystems, Inc.
NEWS and NEWS-OS are trademarks of SONY Corporation.
88
µPD784035(A), 784036(A)
Regional Information
Some information contained in this document may vary from country to country. Before using any NEC
product in your application, pIease contact the NEC office in your country to obtain a list of authorized
representatives and distributors. They will verify:
•
•
•
•
•
Device availability
Ordering information
Product release schedule
Availability of related technical literature
Development environment specifications (for example, specifications for third-party tools and
components, host computers, power plugs, AC supply voltages, and so forth)
•
Network requirements
In addition, trademarks, registered trademarks, export restrictions, and other legal issues may also vary
from country to country.
NEC Electronics Inc. (U.S.)
Santa Clara, California
Tel: 408-588-6000
800-366-9782
NEC Electronics (Germany) GmbH NEC Electronics Hong Kong Ltd.
Benelux Office
Hong Kong
Eindhoven, The Netherlands
Tel: 040-2445845
Tel: 2886-9318
Fax: 2886-9022/9044
Fax: 408-588-6130
800-729-9288
Fax: 040-2444580
NEC Electronics Hong Kong Ltd.
Seoul Branch
Seoul, Korea
Tel: 02-528-0303
Fax: 02-528-4411
NEC Electronics (France) S.A.
Velizy-Villacoublay, France
Tel: 01-30-67 58 00
NEC Electronics (Germany) GmbH
Duesseldorf, Germany
Tel: 0211-65 03 02
Fax: 01-30-67 58 99
Fax: 0211-65 03 490
NEC Electronics Singapore Pte. Ltd.
United Square, Singapore 1130
Tel: 253-8311
NEC Electronics (France) S.A.
Spain Office
Madrid, Spain
NEC Electronics (UK) Ltd.
Milton Keynes, UK
Tel: 01908-691-133
Fax: 250-3583
Tel: 01-504-2787
Fax: 01908-670-290
Fax: 01-504-2860
NEC Electronics Taiwan Ltd.
Taipei, Taiwan
Tel: 02-719-2377
NEC Electronics Italiana s.r.1.
Milano, Italy
Tel: 02-66 75 41
NEC Electronics (Germany) GmbH
Scandinavia Office
Taeby, Sweden
Fax: 02-719-5951
Fax: 02-66 75 42 99
Tel: 08-63 80 820
NEC do Brasil S.A.
Cumbica-Guarulhos-SP, Brasil
Tel: 011-6465-6810
Fax: 08-63 80 388
Fax: 011-6465-6829
J97. 8
89
µPD784035(A), 784036(A)
Some related documents may be preliminary versions. Note that, however, what documents are preliminary is not indicated
in this document.
The export of this product from Japan is regulated by the Japanese government. To export this product may be prohibited
without governmental license, the need for which must be judged by the customer. The export or re-export of this product
from a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96. 5
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