UPC1909CX [NEC]
SWITCHING REGULATOR CONTROL IC; 开关稳压器控制IC
| 型号： | UPC1909CX |
| 厂家： | 
NEC |
| 描述： | SWITCHING REGULATOR CONTROL IC |
| 文件： | 总16页 (文件大小：85K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
Bipolar Analog Integrated Circuit
µPC1909
SWITCHING REGULATOR CONTROL IC
The µPC1909 is a switching regulator control IC ideal for primary side control of active-clamp typeNote DC/DC
converters. This IC has 2 outputs employing a totem-pole circuit with peak output current 1.2 A, and is capable of
directly driving a power MOS-FET. As a result, it has been possible to realize primary side control of an active-clamp
type converter on a single chip.
Note It is necessary to obtain license from Vicor Corporation before using the µPC1909 in an active-clamp type
circuit.
FEATURES
•
•
•
•
•
•
2 on-chip outputs; for Q and Q
Capable of directly driving a power MOS-FET
Drive supply voltage range: 7 V to 24 V
On-chip remote control circuit
On-chip pulse-by-pulse overcurrent protection circuit
On-chip overvoltage latch circuit
ORDERING INFORMATION
Part Number
µPC1909CX
µPC1909GS
Package
16-pin plastic DIP (300 mils)
16-pin plastic SOP (300 mils)
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. G14309EJ1V0DS00 (1st edition)
Date Published July 1999 N CP(K)
Printed in Japan
©
1999
µPC1909
BLOCK DIAGRAM
C
T
R
T
V
REF
DTC
1
FB
12
OUT
1
EMI
10
1
V
CC
16
15
14
13
11
9
PWM
comparator 1
Reference
power
supply
Oscillator
–
+
+
OLS
ON/OFF
control
+
–
–
PWM
comparator 2
Over-
Over-
voltage
current
protection
protection
1
2
3
4
5
6
7
8
OV
C
T2
GND
OC
DTC
2
OUT
2
ON/OFF EMI
2
2
Data Sheet G14309EJ1V0DS00
µPC1909
PIN CONFIGURATION (TOP VIEW)
16-pin plastic DIP (300 mils)
µPC1909CX
16-pin plastic SOP (300 mils)
µPC1909GS
OV
CT2
1
2
3
16
15
14
CT
RT
GND
OC
VREF
DTC1
4
5
6
7
8
13
12
11
10
9
DTC2
OUT2
FB
OUT1
EMI1
VCC
ON/OFF
EMI2
PIN FUNCTION LIST
Pin Number
Pin Name
OV
Function
Overvoltage protection
OLS shift setting
Ground
Pin Number
Pin Name
VCC
Function
Power supply
1
2
3
4
5
6
7
8
9
CT2
10
11
12
13
14
15
16
EMI1
OUT1
FB
OUT1 emitter
OUT1 output
Feedback input
GND
OC
Overcurrent protection
OUT2 dead-time setting
OUT2 output
DTC2
OUT2
ON/OFF
EMI2
DTC1
VREF
RT
OUT1 dead-time setting
Reference voltage output
Timing resistance
ON/OFF control
OUT2 emitter
CT
Timing capacitance
3
Data Sheet G14309EJ1V0DS00
µPC1909
ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings (Unless otherwise specified, TA = 25°C)
Parameter
Symbol
VCC
µPC1909CX
µPC1909GS
Unit
V
Supply Voltage
26
100
1.2
Output Current (DC, per output)
Output Current (peak, per output)
Total Power Dissipation
IC (DC)
IC (peak)
PT
mA
A
1000
694
mW
°C
°C
°C
Operating Ambient Temperature
Operating Junction Temperature
Storage Temperature
TA
−20 to +85
−20 to +150
−55 to +150
TJ
Tstg
Caution Product quality may suffer if the absolute maximum rating is exceeded even momentarily for any
parameter. That is, the absolute maximum ratings are rated values at which the product is on
the verge of suffering physical damage, and therefore the product must be used under
conditions that ensure that the absolute maximum ratings are not exceeded.
Recommended Operating Conditions
Parameter
Symbol
VCC
fOSC
CL
MIN.
7
TYP.
10
MAX.
24
Unit
V
Supply Voltage
Oscillation Frequency
50
200
2200
500
kHz
pF
Output Load Capacitance
Output Load Resistance
Operating Junction Temperature
3000
RL
10
kΩ
°C
TJ
−20
+100
4
Data Sheet G14309EJ1V0DS00
µPC1909
Electrical Characteristics (Unless otherwise specified, TA = 25°C, VCC = 10 V, RT = 10 kΩ, fosc = 200 kHz)
Block
Total
Parameter
Standby Current
Symbol
ICC (SB)
ICC
Conditions
MIN.
TYP.
0.1
12
9
MAX.
Unit
mA
mA
V
VCC = 7 V
Without load
Circuit Current
6
8
3
18
10
5
Under-
Voltage
Lockout
Circuit
Start-Up Threshold Voltage
VCC (L to H)
VH
Operating Voltage Hysteresis
Width
4
V
Reference
Voltage
Output Voltage
Line Regulation
VREF
IREF = 0 A
4.7
4.9
1
5.1
10
V
REGIN
8 V ≤ VCC ≤ 15 V,
mV
IREF = 0 A
Load Regulation
REGL
1 mA ≤ IREF ≤ 4 mA
6
12
mV
Output Voltage Temperature
Coefficient
∆VREF/∆T
−10°C ≤ TA ≤ +85°C,
400
(700)
µV/°C
IREF = 0 A
Short Circuit Current
IO short
fOSC
IREF = 0 A
15
200
1
mA
kHz
%
Oscillation
Oscillation Frequency
Frequency Line Regulation
180
220
(5)
∆f/∆V
∆f/∆T
8 V ≤ VCC ≤ 15 V
Frequency Temperature
Coefficient
−10°C ≤ TA ≤ +85°C
2
%
PWM
Input Bias Current
IB (COMP1)
IB (COMP2)
VTH (L)
VCOMP1 = VREF
VCOMP2 = VREF
10
10
µA
µA
V
Comparator
Low-level Threshold Voltage
High-level Threshold Voltage
1.5
3.5
3
VTH (H)
V
Dead-time Temperature
Coeficient
∆DT/∆T
−10°C ≤ TA ≤ +85°C,
%
VD = 0.46 VREF
Output
Low-level Output Voltage
High-level Output Voltage
Rise Time
VOL
VOH
ISINK = 3 mA
0.5
V
V
V
CC
−
1.6
ISOURCE = 30 mA
tr
RL = 15 Ω, CL = 2200 pF
RL = 15 Ω, CL = 2200 pF
60
40
ns
ns
V
Fall Time
tf
Remote
Control
Input Voltage at Output ON
Input Voltage at Output OFF
Hysteresis Width
VIN (ON)
VIN (OFF)
VH
2.4
2.2
0.1
190
2.6
2.4
0.2
210
200
150
2.4
2.8
2.6
0.3
230
V
V
Overcurrent
Latch
Overcurrent Threshold Voltage
Input Bias Current
VTH (OC)
IB (OC)
td (OC)
VTH (OV)
IB (OV)
VR (OV)
td (OV)
mV
µA
ns
V
VCC = 0 V
Delay to Output
Overvoltage
Latch
Overvoltage Threshold Voltage
Input Bias Current
2
2.8
4
VOV = VREF
µA
V
OVL Reset Voltage
Delay to Output
2
750
ns
Remark Values in parentheses ( ) represent reference values.
5
Data Sheet G14309EJ1V0DS00
µPC1909
TYPICAL CHARACTERISTICS CURVES (UNLESS OTHERWISE SPECIFIED, T
A
°
= 25 C, VCC = 10 V, REFERENCE VALUES)
P
T
vs. T
A
Under-Voltage Lockout Circuit
1.2
1.0
0.8
0.6
0.4
0.2
15
12.5
10
µ
µ
PC1909CX
125 °C/W
PC1909GS
7.5
5
180 °C/W
2.5
V
H
V
CC (H to L)
V
CC (L to H)
0
25
50
75
100
125
150
0
2.5
5
7.5
10
12.5
15
T
A
- Ambient Temperature - °C
VCC - Supply Voltage - V
I
CC vs. VCC
ICC vs. VCC (During OVL Operation)
18
16
14
12
10
18
16
14
12
10
V
H
V
H
0.8
0.4
0.8
0.4
f
OSC = 200 kHz
CC (SB)
I
f
OSC = 200 kHz
20 25
CC (SB)
I
Without load
0
5
10
15
20
25
0
5
10
15
VCC - Supply Voltage - V
VCC - Supply Voltage - V
I
CC(SB) vs. T
A
VOUT1 vs. VIN
250
200
150
100
50
20
15
10
5
µ
V
IN (OFF)
V
IN (ON)
0
−25
0
25
50
75
100
0
1
2
3
4
5
6
T
A
- Ambient Temperature - °C
VIN - Remote Control Voltage - V
6
Data Sheet G14309EJ1V0DS00
µPC1909
VREF vs. TA
∆
fosc vs. RT, CT
30
20
1000
500
10
CT = 220 pF
0
100
50
−10
−20
−30
CT = 1000 pF
CT = 470 pF
∆
−25
0
25
50
75
100
10
50
100
TA - Ambient Temperature - °C
RT - Timing Resistance - kΩ
fosc vs. TA
VOH, VOL vs. TA
VCC
225
220
215
210
205
200
195
190
185
180
175
− 1
VCC
− 1.5
VCC
− 2
1.53
1.49
1.45
−25
0
25
50
75
100
–25
0
25
50
75
100
TA - Ambient Temperature - °C
TA - Ambient Temperature - °C
tf, tr vs. TA (OUT1)
tf, tr vs. TA (OUT2)
100
80
60
40
20
0
100
80
60
40
20
0
fOSC = 555 kHz
fOSC = 555 kHz
tr
tf
tr
tf
−25
0
25
50
75
100
−25
0
25
50
75
100
TA - Ambient Temperature - °C
TA - Ambient Temperature - °C
7
Data Sheet G14309EJ1V0DS00
µPC1909
Duty vs. T
A
45
44
43
42
41
40
39
38
37
36
35
−25
0
25
50
75
100
TA
- Ambient Temperature - °C
8
Data Sheet G14309EJ1V0DS00
µPC1909
TIMING CHART
Oscillation
Oscillation
waveform C
T
waveform C ’
T
Feedback input
FB
V
d
t
qc
t
qd
OUT
1
output waveform
OUT
2
output waveform
(1) Oscillation waveform (CT)
This waveform is determined by the external capacitor connected to the CT pin (pin 16) and the external resistor
connected to the RT pin (pin 15). It is usually a 1.5-V to 3.5-V triangle waveform (the rise and fall times are the
same).
(2) Output waveform (OUT1)
Whichever is the lower of the DTC1 pin (pin 13) and FB pin (pin 12) voltages is compared with the triangle wave
of the CT pin (pin 16). The OUT1 pin (pin 11) is high level while the triangle wave is low.
(3) Output waveform (OUT2)
Whichever is the higher of the DTC2 pin (pin 5) and FB pin (pin 12) voltages is compared with the level-shifted
triangle wave (CT’). The OUT2 pin (pin 6) is high level while the level-shifted triangle wave is high.
(4) Triangle wave level shift
The triangle wave that controls OUT2 is the original triangle wave of the CT pin (pin 16) shifted to a lower
potential via the level shift circuit (OLS). The amount of shift (Vd) can be adjusted using the resistor (RCT2)
connected between the CT2 pin (pin 2) and the VREF pin.
The relationship between the shift amount (Vd) and the resistance value (kΩ) of the resistor RCT2 connected to
the CT2 pin (pin 2) is as follows.
4.3
CT2[kΩ] + 10
Vd
=
× 2 [V]
R
(5) Dead-time (tqc, tqd) adjustment
The dead time between the fall of OUT1 and the rise of OUT2 (tqc) and the dead time between the fall of OUT2
and the rise of OUT1 (tqd) is determined by the oscillation frequency and the amount of level shift of the triangle
wave. Although usually tqc = tqd, if setting these independently, connect a suitable resistor between the CT pin
and the VREF pin, as well as between the CT pin and GND, and adjust the dead time by making the oscillation
waveform asymmetrical.
9
Data Sheet G14309EJ1V0DS00
µPC1909
PACKAGE DRAWINGS
16 PIN PLASTIC DIP (300 mil)
16
9
1
8
A
K
L
P
F
R
M
C
B
M
N
D
NOTES
ITEM MILLIMETERS
INCHES
1) Each lead centerline is located within 0.25 mm (0.01 inch)
of its true position (T.P.) at maximum material condition.
A
B
C
20.32 MAX.
1.27 MAX.
2.54 (T.P.)
0.800 MAX.
0.050 MAX.
0.100 (T.P.)
+0.004
2) Item "K" to center of leads when formed parallel.
D
0.50±0.10
0.020
–0.005
F
G
H
I
1.1 MIN.
3.5±0.3
0.043 MIN.
0.138±0.012
0.020 MIN.
0.170 MAX.
0.200 MAX.
0.300 (T.P.)
0.256
0.51 MIN.
4.31 MAX.
5.08 MAX.
7.62 (T.P.)
6.5
J
K
L
+0.10
0.25
+0.004
0.010
M
–0.05
–0.003
N
P
R
0.25
0.01
1.1 MIN.
0 15°
0.043 MIN.
0 15°
P16C-100-300B-1
10
Data Sheet G14309EJ1V0DS00
µPC1909
16 PIN PLASTIC SOP (300 mil)
16
9
detail of lead end
P
1
8
A
H
I
F
G
J
S
B
L
N
S
K
C
D
M
M
E
NOTE
ITEM MILLIMETERS
Each lead centerline is located within 0.12 mm of
its true position (T.P.) at maximum material condition.
A
B
C
10.2±0.2
0.78 MAX.
1.27 (T.P.)
+0.08
0.42
D
−0.07
E
F
G
H
I
0.1±0.1
1.65±0.15
1.55
7.7±0.3
5.6±0.2
1.1±0.2
J
+0.08
0.22
K
−0.07
L
M
N
0.6±0.2
0.12
0.10
+7°
3°
P
−3°
P16GM-50-300B-5
11
Data Sheet G14309EJ1V0DS00
µPC1909
RECOMMENDED SOLDERING CONDITIONS
The µPC1909 should be soldered and mounted under the following recommended conditions. For the details of
the recommended soldering conditions, refer to the document Semiconductor Device Mounting Technology
Manual (C10535E). For soldering methods and conditions other than those recommended below, contact your NEC
sales representative.
Insertion Type
µPC1909CX: 16-pin plastic DIP (300 mils)
Soldering Method
Wave soldering (pins only)
Partial heating
Soldering Conditions
Solder bath temperature: 260°C Max., Time: 10 seconds max.
Pin temperature: 300°C max., Time: 3 seconds max. (per pin)
Caution Apply wave soldering only to the pins and be careful not to bring solder into direct contact with
the package.
Surface Mounting Type
µPC1909GS: 16-pin plastic SOP (300 mils)
Recommended
Soldering Method
Infrared reflow
Soldering Conditions
Condition symbol
Package peak temperature: 235°C, Time: 30 seconds max.
(at 210°C or higher), Count: Twice or less
IR35-00-2
VPS
Package peak temperature: 215°C, Time: 40 seconds max.
(at 200°C or higher), Count: Twice or less
VP15-00-2
WS60-00-1
Wave soldering
Soldering bath temperature: 260°C or less, Time: 10 seconds max.,
Count: Once, Preheating temperature: 120°C MAX.
(package surface temperature)
Caution Do not use different soldering methods together.
12
Data Sheet G14309EJ1V0DS00
µPC1909
[MEMO]
13
Data Sheet G14309EJ1V0DS00
µPC1909
[MEMO]
14
Data Sheet G14309EJ1V0DS00
µPC1909
[MEMO]
15
Data Sheet G14309EJ1V0DS00
µPC1909
• The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
• No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
• NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
• Descriptions of circuits, software, and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these circuits,
software, and information in the design of the customer's equipment shall be done under the full responsibility
of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third
parties arising from the use of these circuits, software, and information.
• While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
• NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
M7 98. 8
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