2SK4080-ZK-E1-AY [NEC]

Small Signal Field-Effect Transistor, 48A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, LEAD FREE, TO-252, MP-3ZK, 3 PIN;
2SK4080-ZK-E1-AY
型号: 2SK4080-ZK-E1-AY
厂家: NEC    NEC
描述:

Small Signal Field-Effect Transistor, 48A I(D), 30V, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-252AA, LEAD FREE, TO-252, MP-3ZK, 3 PIN

文件: 总8页 (文件大小:190K)
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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SK4080  
SWITCHING  
N-CHANNEL POWER MOS FET  
DESCRIPTION  
The 2SK4080 is N-channel MOS FET device that features a low on-state resistance and excellent switching  
characteristics, and designed for low voltage high current applications such as DC/DC converter with synchronous  
rectifier.  
FEATURES  
Low on-state resistance  
RDS(on)1 = 9.0 mΩ MAX. (VGS = 10 V, ID = 24 A)  
Low QGD: QGD = 6.3 nC TYP.  
4.5 V drive available  
(TO-251)  
ORDERING INFORMATION  
PART NUMBER  
PACKAGE  
2SK4080(1)-S27-AY Note  
2SK4080-ZK-E1-AY Note  
2SK4080-ZK-E2-AY Note  
<R>  
TO-251 (MP-3-b)  
TO-252 (MP-3ZK)  
TO-252 (MP-3ZK)  
Note Pb-free (This product does not contain Pb in external electrode.)  
(TO-252)  
ABSOLUTE MAXIMUM RATINGS (TA = 25°C)  
Drain to Source Voltage (VGS = 0 V)  
Gate to Source Voltage (VDS = 0 V)  
Drain Current (DC) (TC = 25°C)  
Drain Current (pulse) Note1  
VDSS  
VGSS  
ID(DC)  
ID(pulse)  
PT1  
30  
±20  
±48  
±144  
29  
V
V
A
A
Total Power Dissipation (TC = 25°C)  
Total Power Dissipation  
W
W
°C  
PT2  
1.0  
Channel Temperature  
Tch  
150  
Storage Temperature  
Tstg  
IAS  
–55 to +150  
°C  
A
Single Avalanche Current Note2  
Single Avalanche Energy Note2  
21  
EAS  
44.1  
mJ  
Notes 1. PW 10 μs, Duty Cycle 1%  
2. Starting Tch = 25°C, VDD = 15 V, RG = 25 Ω, VGS = 20 0 V, L = 100 μH  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. D18214EJ2V0DS00 (2nd edition)  
Date Published March 2007 NS CP(K)  
Printed in Japan  
2006  
The mark <R> shows major revised points.  
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.  
2SK4080  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 30 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
10  
±100  
2.5  
μA  
nA  
V
IGSS  
VGS = ±20 V, VDS = 0 V  
VDS = 10 V, ID = 1 mA  
VDS = 10 V, ID = 12 A  
VGS = 10 V, ID = 24 A  
VGS = 4.5 V, ID = 24 A  
VDS = 10 V  
Gate Cut-off Voltage  
VGS(off)  
| yfs |  
RDS(on)1  
RDS(on)2  
Ciss  
1.5  
7
2.0  
14  
Forward Transfer Admittance Note  
Drain to Source On-state Resistance Note  
S
7.0  
10.2  
1670  
290  
150  
10  
9.0  
15  
mΩ  
mΩ  
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
nC  
Ω
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Turn-on Delay Time  
Rise Time  
Coss  
Crss  
VGS = 0 V  
f = 1 MHz  
td(on)  
tr  
VDD = 15 V  
ID = 30 A  
5.3  
42  
Turn-off Delay Time  
Fall Time  
td(off)  
tf  
VGS = 12 V  
RG = 3 Ω  
6.1  
32  
Total Gate Charge  
QG1  
VDD = 15 V, VGS = 12 V, ID = 30 A  
VDD = 15 V, VGS = 4.5 V, ID = 30 A  
VDD = 15 V  
QG2  
13  
Gate to Source Charge  
Gate to Drain Charge  
Gate Resistance  
QGS  
QGD  
RG  
4.6  
6.3  
2.4  
0.94  
29  
ID = 30 A  
Body Diode Forward Voltage Note  
Reverse Recovery Time  
Reverse Recovery Charge  
Note Pulsed  
VF(S-D)  
trr  
IF = 30 A, VGS = 0 V  
IF = 30 A, VGS = 0 V  
di/dt = 100 A/μs  
1.5  
V
ns  
nC  
Qrr  
23  
TEST CIRCUIT 1 AVALANCHE CAPABILITY  
TEST CIRCUIT 2 SWITCHING TIME  
D.U.T.  
L
D.U.T.  
V
V
GS  
0
R
G
= 25 Ω  
50 Ω  
R
L
90%  
V
GS  
Wave Form  
V
GS  
10%  
90%  
R
G
PG.  
V
DD  
PG.  
GS = 20 0 V  
V
DD  
V
DS  
90%  
V
DS  
V
0
GS  
BVDSS  
10% 10%  
V
DS  
Wave Form  
0
I
AS  
V
DS  
I
D
τ
t
d(on)  
t
r
t
d(off)  
t
f
V
DD  
t
on  
t
off  
τ = 1  
μs  
Duty Cycle 1%  
Starting Tch  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
= 2 mA  
I
G
R
L
50 Ω  
PG.  
V
DD  
2
Data Sheet D18214EJ2V0DS  
2SK4080  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
35  
30  
25  
20  
15  
10  
5
0
0
25  
50  
75 100 125 150 175  
0
25  
50  
75 100 125 150 175  
TC - Case Temperature - °C  
TC - Case Temperature - °C  
FORWARD BIAS SAFE OPERATING AREA  
DRAIN CURRENT vs. CASE TEMPERATURE  
60  
1000  
100  
10  
I
D(DC)  
I
D(pulse)  
50  
40  
30  
20  
10  
0
100 μs  
RDS(ON) Limited  
(at VGS = 10 V)  
1 ms  
Power Dissipation Limited  
= 25°C  
Single pulse  
1
T
C
10 ms  
0.1  
0.1  
1
10  
100  
0
25  
50  
75  
100 125 150  
VDS - Drain to Source Voltage - V  
TC - Case Temperature - °C  
TRANSIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
R
th(ch-a) = 125°C/W  
Rth(ch-c) = 4.3°C/W  
1
Single Pulse  
100 1000  
0.1  
100 μ  
1 m  
10 m  
100 m  
1
10  
PW - Pulse Width - s  
3
Data Sheet D18214EJ2V0DS  
2SK4080  
DRAIN CURRENT vs.  
FORWARD TRANSFER CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
200  
150  
100  
50  
100  
10  
T
ch = 55°C  
25°C  
25°C  
V
GS = 10 V  
75°C  
125°C  
150°C  
1
4.5 V  
1.5  
0.1  
0.01  
VDS = 10 V  
Pulsed  
2.5  
Pulsed  
0
0
0.5  
1
2
3
0
1
2
3
4
5
VDS - Drain to Source Voltage - V  
VGS - Gate to Source Voltage - V  
GATE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
FORWARD TRANSFER ADMITTANCE vs.  
DRAIN CURRENT  
3
2.5  
2
100  
Tch = 150°C  
125°C  
V
DS = 10 V  
= 1 mA  
I
D
75°C  
10  
25°C  
25°C  
55°C  
1.5  
1
1
V
DS = 10 V  
0.5  
0
Pulsed  
0.1  
0.1  
1
10  
100  
-75  
-25  
25  
75  
125  
175  
ID - Drain Current - A  
Tch - Channel Temperature - °C  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
DRAIN CURRENT  
DRAIN TO SOURCE ON-STATERESISTANCE vs.  
GATE TO SOURCE VOLTAGE  
20  
30  
Pulsed  
Pulsed  
25  
20  
15  
10  
5
15  
10  
5
I
D
= 48 A  
24 A  
V
GS = 4.5 V  
9.6 A  
10 V  
0
0
0
5
10  
15  
20  
1
10  
100  
1000  
VGS - Gate to Source Voltage - V  
ID - Drain Current - A  
4
Data Sheet D18214EJ2V0DS  
2SK4080  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
CAPACITANCE vs. DRAIN TO  
SOURCE VOLTAGE  
25  
10000  
1000  
100  
C
C
iss  
20  
15  
10  
5
V
GS = 4.5 V  
oss  
10 V  
C
rss  
V
GS = 0 V  
D
I = 24 A  
f = 1 MHz  
Pulsed  
0
10  
-75  
-25  
25  
75  
125  
175  
0.1  
1
10  
100  
Tch - Channel Temperature - °C  
VDS - Drain to Source Voltage - V  
SWITCHING CHARACTERISTICS  
DYNAMIC INPUT/OUTPUT CHARACTERISTICS  
100  
30  
25  
20  
15  
10  
5
12  
10  
8
V
DD = 24 V  
15 V  
t
d(off)  
6 V  
t
f
t
d(on)  
10  
6
V
GS  
4
t
r
V
V
R
DD = 15 V  
GS = 12 V  
V
DS  
2
ID = 30 A  
G
= 3 Ω  
1
0
0
0.1  
1
10  
100  
0
10  
20  
30  
40  
ID - Drain Current - A  
QG - Gate Chage - nC  
SOURCE TO DRAIN DIODE FORWARD VOLTAGE  
1000  
REVWESE RECOVERY TIME vs.  
DRAIN CURRENT  
1000  
100  
10  
V
GS = 10 V  
100  
10  
4.5 V  
0 V  
1
0.1  
0.01  
di/dt = 100 A/  
GS = 0 V  
μs  
Pulsed  
V
1
0
0.5  
1
1.5  
0.1  
1
10  
100  
ID - Drain Current - A  
VF(S-D) - Source to Drain Voltage - V  
5
Data Sheet D18214EJ2V0DS  
2SK4080  
SINGLE AVALANCHE CURRENT vs.  
INDUCTIVE LOAD  
SINGLE AVALANCHE ENERGY  
DERATING FACTOR  
120  
100  
80  
60  
40  
20  
0
100  
10  
1
V
R
V
DD = 15 V  
= 25 Ω  
GS = 20  
21 A  
G
0 V  
I
AS = 21 A  
I
AS  
E
AS = 44.1 mJ  
V
V
R
DD = 15 V  
GS = 20 0 V  
G
= 25 Ω  
Starting Tch = 25°C  
25  
50  
75  
100  
125  
150  
0.01  
0.1  
1
10  
Starting Tch - Starting Channel Temperature - °C  
L - Inductive Load - mH  
6
Data Sheet D18214EJ2V0DS  
2SK4080  
PACKAGE DRAWINGS (Unit: mm)  
1) TO-251 (MP-3-b)  
2) TO-252 (MP-3ZK)  
<R>  
2.3 0.1  
6.6 0.2  
2.3 0.1  
6.5 0.2  
5.1 TYP.  
4.3 MIN.  
5.3 TYP.  
0.5 0.1  
0.5 0.1  
4
No Plating  
4
1
2
3
1
2
3
1.14 MAX.  
No Plating  
0.76 0.12  
0.76 0.12  
2.3 TYP.  
0.5 0.1  
1.14 MAX.  
0 to 0.25  
0.5 0.1  
2.3 2.3  
2.3 TYP.  
1.0  
1. Gate  
1.Gate  
2.Drain  
3.Source  
4.Fin (Drain)  
2. Drain  
3. Source  
4. Fin (Drain)  
EQUIVALENT CIRCUIT  
Drain  
Body  
Diode  
Gate  
Source  
Remark The diode connected between the gate and source of the transistor serves as a protector against ESD.  
When this device actually used, an additional protection circuit is externally required if a voltage exceeding  
the rated voltage may be applied to this device.  
7
Data Sheet D18214EJ2V0DS  
2SK4080  
The information in this document is current as of March, 2007. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or  
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all  
products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual  
property rights of third parties by or arising from the use of NEC Electronics products listed in this document  
or any other liability arising from the use of such products. No license, express, implied or otherwise, is  
granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.  
Descriptions of circuits, software and other related information in this document are provided for illustrative  
purposes in semiconductor product operation and application examples. The incorporation of these  
circuits, software and information in the design of a customer's equipment shall be done under the full  
responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by  
customers or third parties arising from the use of these circuits, software and information.  
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redundancy, fire-containment and anti-failure features.  
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The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-  
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(Note)  
(1)  
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
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(2)  
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  

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