2SK4081(1)-S27-AY [RENESAS]

2A, 600V, 0.005ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA, LEAD FREE, MP-3B, TO-251, 3 PIN;
2SK4081(1)-S27-AY
型号: 2SK4081(1)-S27-AY
厂家: RENESAS TECHNOLOGY CORP    RENESAS TECHNOLOGY CORP
描述:

2A, 600V, 0.005ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA, LEAD FREE, MP-3B, TO-251, 3 PIN

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DATA SHEET  
MOS FIELD EFFECT TRANSISTOR  
2SK4081  
SWITCHING  
N-CHANNEL POWER MOS FET  
DESCRIPTION  
The 2SK4081 is N-channel MOS FET device that features a low gate charge and excellent switching characteristics, and  
designed for high voltage applications such as switching power supply, AC adapter.  
FEATURES  
Low on-state resistance  
RDS(on) = 5 Ω MAX. (VGS = 10 V, ID = 1.0 A)  
Low gate charge  
QG = 7.2 nC TYP. (VDD = 450 V, VGS = 10 V, ID = 2.0 A)  
Gate voltage rating: ±30 V  
Avalanche capability ratings  
<R>  
ORDERING INFORMATION  
PART NUMBER  
2SK4081-S15-AY Note  
2SK4081(1)-S27-AY Note  
2SK4081-ZK-E1-AY Note  
2SK4081-ZK-E2-AY Note  
LEAD PLATING  
P
GE  
P-3-a) typ. 0.39 g  
1 (MP-3-b) typ. 0.34 g  
Pure Sn (Tin)  
TO-252 (MP-3ZK) typ. 0.27 g  
Note Pb-free (This product doeectrode.)  
ABSOLUTE MAXIMUM
(TO-251)  
Drain to Source Voltag
Gate to Source Voltage
Drain Current (DC) (TC = 25
Drain Current (pulse) Note1  
D(DC)  
ID(pulse)  
PT1  
600  
V
V
±30  
±2.0  
A
±8.0  
A
Total Power Dissipation (TC = 25°C)  
Total Power Dissipation (TA = 25°C) Note2  
30  
W
W
°C  
°C  
A
PT2  
1.0  
Channel Temperature  
Tch  
150  
(TO-252)  
Storage Temperature  
Tstg  
55 to +150  
1.4  
Single Avalanche Current Note3  
Single Avalanche Energy Note3  
IAS  
EAS  
117  
mJ  
Notes 1. PW 10 μs, Duty Cycle 1%  
2. Mounted on glass epoxy board of 40 mm x 40 mm x 1.6 mm  
3. Starting Tch = 25°C, VDD = 150 V, RG = 25 Ω, VGS = 20 0 V  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
2007  
Document No. D18785EJ2V0DS00 (2nd edition)  
Date Published June 2007 NS  
Printed in Japan  
The mark <R> shows major revised points.  
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.  
2SK4081  
ELECTRICAL CHARACTERISTICS (TA = 25°C)  
CHARACTERISTICS  
SYMBOL  
IDSS  
TEST CONDITIONS  
VDS = 600 V, VGS = 0 V  
MIN. TYP. MAX. UNIT  
Zero Gate Voltage Drain Current  
Gate Leakage Current  
Gate to Source Cut-off Voltage  
Forward Transfer Admittance Note  
Drain to Source On-state Resistance Note  
Input Capacitance  
10  
±100  
3.5  
μA  
nA  
V
IGSS  
VGS(off)  
| yfs |  
RDS(on)  
Ciss  
VGS = ±30 V, VDS = 0 V  
VDS = 10 V, ID = 1 mA  
VDS = 10 V, ID = 1.0 A  
VGS = 10 V, ID = 1.0 A  
VDS = 10 V,  
2.5  
3.0  
0.35  
S
4.2  
230  
95  
5
Ω
pF  
pF  
pF  
ns  
ns  
ns  
ns  
nC  
nC  
nC  
V
Output Capacitance  
Coss  
Crss  
VGS = 0 V,  
Reverse Transfer Capacitance  
Turn-on Delay Time  
f = 1 MHz  
11  
td(on)  
tr  
VDD = 150 V, ID = 1.0 A,  
VGS = 10 V,  
11  
Rise Time  
7
Turn-off Delay Time  
td(off)  
tf  
RG = 10 Ω  
13  
Fall Time  
13.5  
7.2  
2.9  
3.0  
0.87  
175  
550  
Total Gate Charge  
QG  
VDD = 450 V,  
VGS = 10 V,  
ID = 2.0 A  
Gate to Source Charge  
QGS  
QGD  
VF(S-D)  
trr  
Gate to Drain Charge  
Body Diode Forward Voltage Note  
Reverse Recovery Time  
Reverse Recovery Charge  
Note Pulsed  
IF =
1.5  
ns  
nC  
Qrr  
TEST CIRCUIT 1 AVALANCHE CAP
CUIT 2 SWITCHING TIME  
D.U.T.  
D.U.T.  
RG  
= 25 Ω  
V
V
GS  
0
R
L
PG.  
GS = 20 0 V  
90%  
V
GS  
Wave Form  
V
GS  
50
10%  
90%  
RG  
V
PG.  
V
DD  
DS  
90%  
BVDS
IAS  
V
DS  
V
0
GS  
V
10% 10%  
VDS  
0
ID  
Wave Form  
V
DD  
τ
td(on)  
tr  
td(off)  
tf  
τ = 1 s  
μ
Duty Cycle 1%  
ton  
toff  
Starting Tch  
TEST CIRCUIT 3 GATE CHARGE  
D.U.T.  
IG  
= 2 mA  
RL  
PG.  
V
DD  
50 Ω  
2
Data Sheet D18785EJ2V0DS  
2SK4081  
TYPICAL CHARACTERISTICS (TA = 25°C)  
DERATING FACTOR OF FORWARD BIAS  
SAFE OPERATING AREA  
TOTAL POWER DISSIPATION vs.  
CASE TEMPERATURE  
120  
100  
80  
60  
40  
20  
0
35  
30  
25  
20  
15  
10  
5
0
0
25  
50  
75  
100  
125  
150  
0
0  
75  
100  
125  
150  
Tch - Channel Temperature - °C  
emperature - °C  
FORWARD BIAS SAFE OPERATING AREA  
SE TEMPERATURE  
100  
10  
I
I
D(pulse)  
D(DC)  
1
1
0.1  
0.01  
0.001  
0.5  
0
T
C
= 25°C  
Single Pulse  
0.1  
1
0
25  
50  
75  
100  
125  
150  
VDS - D
TC - Case Temperature - °C  
SIENT THERMAL RESISTANCE vs. PULSE WIDTH  
1000  
100  
10  
Rth(ch-A) = 125°C/Wi  
Rth(ch-C) = 4.167°C/Wi  
1
0.1  
0.01  
Single Pulse  
100 μ  
1 m  
10 m  
100 m  
1
10  
100  
1000  
PW - Pulse Width - s  
3
Data Sheet D18785EJ2V0DS  
2SK4081  
DRAIN CURRENT vs.  
FORWARD TRANSFER CHARACTERISTICS  
DRAIN TO SOURCE VOLTAGE  
6
5
4
3
2
1
0
10  
1
V
DS = 10 V  
Pulsed  
V
GS = 20 V  
10 V  
T
ch = 55°C  
40°C  
25°C  
25°C  
75°C  
125°C  
150°C  
0.1  
0.01  
Pulsed  
30  
0
5
10  
15  
20  
25  
35  
0
4
8
12  
16  
20  
VDS - Drain to Source Voltage - V  
ate to Source Voltage - V  
GATE TO SOURCE CUT-OFF VOLTAGE vs.  
CHANNEL TEMPERATURE  
ER ADMITTANCE vs.  
6
5
4
3
2
1
0
T
ch = 55°C  
25°C  
75°C  
125°C  
40°C  
25°C  
150°C  
0.1  
V
DS = 10 V  
= 1 mA  
I
D
0.01  
-75  
-25  
2
0.01  
0.1  
1
10  
ID - Drain Current - A  
Tch - C
DRAIN TO SOURCE OTANCE vs.  
GATE TO SOURCE VOLT
DRAIN TO SOURCE ON-STATE  
RESISTANCE vs. DRAIN CURRENT  
12  
12  
10  
8
10  
8
6
6
I
D
= 2.0 A  
1.0 A  
VGS = 10 V  
4
4
20 V  
2
2
Pulsed  
Pulsed  
0
0
0
5
10  
15  
20  
0.01  
0.1  
1
10  
VGS - Gate to Source Voltage - V  
ID - Drain Current - A  
4
Data Sheet D18785EJ2V0DS  
2SK4081  
DRAIN TO SOURCE ON-STATE RESISTANCE vs.  
CHANNEL TEMPERATURE  
CAPACITANCE vs.  
DRAIN TO SOURCE VOLTAGE  
12  
10  
8
10000  
1000  
100  
10  
V
GS = 10 V  
Pulsed  
I
D
= 2.0 A  
1.0 A  
C
iss  
C
oss  
6
4
C
rss  
1
2
V
GS = 0 V  
f = 1 MHz  
0.1  
0
0.1  
1
10  
100  
1000  
-75  
-25  
25  
75  
125  
175  
rain to Source Voltage - V  
Tch - Channel Temperature - °C  
SWITCHING CHARACTERISTICS  
T CHARACTERISTICS  
1000  
100  
10  
00  
100  
0
12  
10  
8
V
V
DD = 150 V  
GS = 10 V  
= 450 V  
300 V  
150 V  
R = 10 Ω  
G
t
f
t
d(off)  
V
GS  
6
t
d(on)  
4
t
r
V
DS  
2
I
D
= 2.0 A  
7
1
0
0.1  
0
1
2
3
4
5
6
8
ID -
QG - Gate Charge - nC  
SOURCE T
FORWARD V
REVERSE RECOVERY TIME vs.  
DIODE FORWARD CURRENT  
100  
10  
1000  
100  
10  
V
GS = 10 V  
1
0 V  
0.1  
0.01  
di/dt = 100 A/μs  
VGS = 0 V  
Pulsed  
1.5  
0
0.5  
1
0.1  
1
10  
VF(S-D) - Source to Drain Voltage - V  
IF - Diode Forward Current - A  
5
Data Sheet D18785EJ2V0DS  
2SK4081  
SINGLE AVALANCHE CURRENT vs.  
INDUCTIVE LOAD  
SINGLE AVALANCHE ENERGY  
DERATING FACTOR  
10  
120  
100  
80  
60  
40  
20  
0
V
R
V
I
DD = 150 V  
= 25 Ω  
GS = 20 0 V  
AS 1.4 A  
G
I
AS = 1.4 A  
1
EAS = 117 mJ  
V
R
V
DD = 150 V  
= 25 Ω  
GS = 20 0 V  
Starting Tch = 25°C  
G
0.1  
0.01  
0.1  
1
10  
100  
1000  
25  
75  
100  
125  
150  
L - Inductive Load - H  
Startting Channel Temperature - °C  
6
Data Sheet D18785EJ2V0DS  
2SK4081  
<R>  
PACKAGE DRAWINGS (Unit: mm)  
1) TO-251 (MP-3-a)  
2) TO-251 (MP-3-b)  
6.6 0.2  
5.3 TYP.  
Mold Area  
2.3 0.1  
0.5 0.1  
4.3 MIN.  
2.3 0.1  
6.6 0.2  
5.3 TYP.  
4
0.5 0.1  
4
1
2
3
1
2
3
No Plating  
1.14 MAX.  
1.14 MAX.  
0.76 0.12  
2.
0.5 0.1  
TYP.  
0.5 0.1  
0.76 0.1  
2.3 TYP.  
2.3 TYP.  
1.Gate  
2.Drain  
1. Gate  
3.Source  
2. Drain  
4.Fin (Drain)  
3. Source  
4. Fin (Drain)  
3) TO-252 (MP-3ZK)  
IVALENT CIRCUIT  
Drain  
6.5 0.2  
5.1 TYP.  
4.3 MIN.  
Body  
Diode  
4
Gate  
Source  
1
2
3
No lating  
0.76 0.12  
1.14 MAX.  
0 to 0.25  
0.5 0.1  
2.3 2.3  
1.0  
1. Gate  
2. Drain  
3. Source  
4. Fin (Drain)  
Remark Strong electric field, when exposed to this device, can cause destruction of the gate oxide and ultimately degrade  
the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly  
dissipate it once, when it has occurred.  
7
Data Sheet D18785EJ2V0DS  
2SK4081  
The information in this document is current as of June, 2007. The information is subject to change  
without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or  
data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all  
products and/or types are available in every country. Please check with an NEC Electronics sales  
representative for availability and additional information.  
No part of this document may be copied or reproduced in any form or by any means without the prior  
written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may  
appear in this document.  
NEC Electronics does not assume any liability for infringement of paterights or other intellectual  
property rights of third parties by or arising from the use of NEC Electlisted in this document  
or any other liability arising from the use of such products. No plied or otherwise, is  
granted under any patents, copyrights or other intellectual property or others.  
Descriptions of circuits, software and other related informatioded for illustrative  
purposes in semiconductor product operation and apporporation of these  
circuits, software and information in the design of a be done under the full  
responsibility of the customer. NEC Electronics asany losses incurred by  
customers or third parties arising from the use of tormation.  
While NEC Electronics endeavors to enhance tty of NEC Electronics products,  
customers agree and acknowledge that the pannot be eliminated entirely. To  
minimize risks of damage to property or persons arising from defects in NEC  
Electronics products, customers musty measures in their design, such as  
redundancy, fire-containment and an
NEC Electronics products are clee quality grades: "Standard", "Special" and  
"Specific".  
The "Specific" quality gradronics products developed based on a customer-  
designated "quality assurpplication. The recommended applications of an NEC  
Electronics product dedicated below. Customers must check the quality grade of  
each NEC Electroniparticular application.  
"Standard": Communications equipment, test and measurement equipment, audio  
and visectronic appliances, machine tools, personal electronic equipment  
and indus
"Special": Transportatint (automobiles, trains, ships, etc.), traffic control systems, anti-disaster  
systems, anti-cstems, safety equipment and medical equipment (not specifically designed  
for life support).  
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life  
support systems and medical equipment for life support, etc.  
The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC  
Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications  
not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to  
determine NEC Electronics' willingness to support a given application.  
(Note)  
(1)  
"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes its  
majority-owned subsidiaries.  
(2)  
"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (as  
defined above).  
M8E 02. 11-1  
8
Data Sheet D18785EJ2V0DS  

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