MC13156DWR2_技术文档

WIDEBAND FM IF

SYSTEM FOR DIGITAL AND

ANALOG APPLICATIONS

The MC13156 is a wideband FM IF subsystem targeted at high

performance data and analog applications. Excellent high frequency

performance is achieved at low cost using Motorola’s MOSAIC 1.5 bipolar

process. The MC13156 has an onboard grounded collector VCO transistor

that may be used with a fundamental or overtone crystal in single channel

operation or with a PLL in multichannel operation. The mixer is useful to

500 MHz and may be used in a balanced–differential, or single–ended

configuration. The IF amplifier is split to accommodate two low cost

cascaded filters. RSSI output is derived by summing the output of both IF

sections. A precision data shaper has a hold function to preset the shaper for

fast recovery of new data.

SEMICONDUCTOR

TECHNICAL DATA

DW SUFFIX

PLASTIC PACKAGE

Applications for the MC13156 include CT–2, wideband data links and

other radio systems utilizing GMSK, FSK or FM modulation.

24

CASE 751E

(SO–24L)

1

• 2.0 to 6.0 Vdc Operation

• Typical Sensitivity at 200 MHz of 2.0 µV for 12 dB SINAD

• RSSI Dynamic Range Typically 80 dB

• High Performance Data Shaper for Enhanced CT–2 Operation

• Internal 330 Ω and 1.4 kΩ Terminations for 10.7 MHz and 455 kHz Filters

• Split IF for Improved Filtering and Extended RSSI Range

• 3rd Order Intercept (Input) of –25 dBm (Input Matched)

FB SUFFIX

PLASTIC QFP PACKAGE

32

1

CASE 873

PIN CONNECTIONS

Function

SO–24L

QFP

RF Input 1

1

2

31

RF Input 2

32

Mixer Output

3

1

V

4

2

CC1

IF Amp Input

5

3

IF Amp Decoupling 1

IF Amp Decoupling 2

6

4

7

5

V

Connect (N/C Internal)

–

6

CC

Simplified Block Diagram

IF Amp Output

8

7

V

9

8

CC2

LO

In

LO

Emit

CAR

Det

DS

Hold Out

Data

DS

Gnd

DS

In

Quad

Coil

Limiter IF Input

10

11

12

–

9

V

RSSI

20

V

Demod

14

EE1

22

EE2

Limiter Decoupling 1

Limiter Decoupling 2

10

24

23

21

19

18 17

16

15

13

11

V

Connect (N/C Internal)

12, 13, 14

CC

Quad Coil

13

14

15

–

15

16

Demodulator Output

Data Slicer Input

17

V

Connect (N/C Internal)

18

CC

Mixer

Data

Slicer

Data Slicer Ground

Data Slicer Output

Data Slicer Hold

16

17

18

19

20

21

22

23

24

–

19

5.0

pF

20

21

Bias

V

22

EE2

RSSI Output/Carrier Detect In

23

LIM Amp

Carrier Detect Output

24

IF Amp

V

and Substrate

25

EE1

LO Emitter

26

LO Base

27

V

Connect (N/C Internal)

28, 29, 30

CC

1

2

3

4

5

6

7

8

9

10

11

12

LIM

ORDERING INFORMATION

Operating

RF

In 1

RF

In 2

Mix

Out

V

IF

In

IF

V

LIM

In

LIM

DEC 1 DEC 2

CC1

CC2

DEC 1 DEC 2 Out

Temperature Range

Device

Package

NOTE: Pin Numbers shown for SOIC package only. Refer to Pin Assignments Table.

MC13156DW

MC13156FB

SO–24L

QFP

T

A

= –40 to +85°C

This device contains 197 active transistors.

8–290

MOTOROLA ANALOG IC DEVICE DATA

MC13156

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Vdc

°C

Power Supply Voltage

Junction Temperature

Storage Temperature Range

16, 19, 22

V

–6.5

150

EE(max)

–

T

J(max)

T

stg

–65 to +150

°C

NOTES: 1. Devices should not be operated at or outside these values. The “Recommended Operating

Conditions” table provides for actual device operation.

2. ESD data available upon request.

RECOMMENDED OPERATING CONDITIONS

Rating

Symbol

Value

Unit

Power Supply Voltage @ T = 25°C

4, 9

16, 19, 22

V

EE

0 (Ground)

–2.0 to –6.0

Vdc

A

CC

–40°C ≤ T ≤ +85°C

A

Input Frequency

1, 2

–

f

500

–40 to +85

200

MHz

°C

in

Ambient Temperature Range

Input Signal Level

T

A

1, 2

V

mVrms

in

DC ELECTRICAL CHARACTERISTICS (T = 25°C, V

= V

= 0, no input signal.)

A

CC1

CC2

19, 22

Characteristic

Symbol

Min

Typ

Max

Unit

Total Drain Current (See Figure 2)

I

mA

Total

V

EE

V

EE

V

EE

V

EE

= –2.0 Vdc

= –3.0 Vdc

= –5.0 Vdc

= –6.0 Vdc

–

3.0

–

4.8

5.0

5.2

5.4

–

8.0

–

Drain Current, I (See Figure 3)

22

I

mA

22

19

V

EE

V

EE

V

EE

V

EE

= –2.0 Vdc

= –3.0 Vdc

= –5.0 Vdc

= –6.0 Vdc

–

3.0

3.1

3.3

3.4

–

Drain Current, I (See Figure 3)

19

I

V

EE

V

EE

V

EE

V

EE

= –2.0 Vdc

= –3.0 Vdc

= –5.0 Vdc

= –6.0 Vdc

–

1.8

1.9

2.0

–

DATA SLICER (Input Voltage Referenced to V

= –3.0 Vdc, no input signal; See Figure 15.)

EE

Input Threshold Voltage (High V )

in

15

17

V

1.0

–

1.1

1.7

1.2

–

Vdc

mA

15

Output Current (Low V )

in

I

17

Data Slicer Enabled (No Hold)

V

15

V

18

> 1.1 Vdc

= 0 Vdc

AC ELECTRICAL CHARACTERISTICS (T = 25°C, V

circuit, unless otherwise specified.)

= –3.0 Vdc, f

= 130 MHz, f

= 140.7 MHz, Figure 1 test

A

EE

RF

LO

Characteristic

Symbol

Min

Typ

Max

Unit

12 dB SINAD Sensitivity (See Figures 17, 25)

1, 14

–

–100

–

dBm

f

in

= 144.45 MHz; f

= 1.0 kHz; f = ±75 kHz

dev

mod

MIXER

Conversion Gain

1, 3

1, 2

3

–

22

–

dB

P

in

= –37 dBm (Figure 4)

Mixer Input Impedance

Single–Ended (Table 1)

R

C

–

1.0

4.0

–

kΩ

pF

p

Mixer Output Impedance

–

330

–

Ω

IF AMPLIFIER SECTION

IF RSSI Slope (Figure 6)

IF Gain (Figure 5)

20

5, 8

5

–

0.2

–

0.4

39

0.6

–

µA/dB

dB

Input Impedance

–

1.4

290

–

kΩ

Output Impedance

8

–

Ω

8–291

MOTOROLA ANALOG IC DEVICE DATA

MC13156

AC ELECTRICAL CHARACTERISTICS (continued) (T = 25°C, V

circuit, unless otherwise specified.)

= –3.0 Vdc, f

= 130 MHz, f

= 140.7 MHz, Figure 1 test

LO

A

EE

RF

Characteristic

LIMITING AMPLIFIER SECTION

Symbol

Min

Typ

Max

Unit

Limiter RSSI Slope (Figure 7)

Limiter Gain

20

–

0.2

–

0.4

55

0.6

–

µA/dB

dB

Input Impedance

10

–

1.4

–

kΩ

CARRIER DETECT

Output Current – Carrier Detect (High V )

in

21

20

–

0

–

µA

mA

Vdc

Output Current – Carrier Detect (Low V )

in

3.0

1.2

Input Threshold Voltage – Carrier Detect

0.9

1.4

Input Voltage Referenced to V

= –3.0 Vdc

EE

Figure 1. Test Circuit

Local

Oscillator

Input

140.7MHz

200m Vrms

MC13156

50

1:4

TR 1

(1)

Mixer

RF Input

130MHz

24

1

200

23

22

21

20

19

18

17

16

15

2

A

1.0 n

Carrier

Detect

3

4

5

V

1.0 µ

Mixer

Output

EE

+

100 n 1.0 n

330

50

V

CC

Bias

RSSI

Output

V

IF Input

A

EE

IF Amp

6

1.0 n

1.0 µ

+

V

100 n 1.0 n

EE

1.0 n

Data Slicer

Hold

7

Data

Slicer

Data Output

A

V

IF Output

Bias

8

9

1.0 n

330

50

1.0 n

V

CC

V

EE

LIM Amp

Limiter

Input

100 n

1.0 n

10

SMA

100 k

14

13

11

1.0 n

100 k

12

5.0 p

(3)

1.0 µH

150 p

NOTES: 1. TR 1 Coilcraft 1:4 impedance transformer.

2. V is DC Ground.

CC

3. 1.5 µH variable shielded inductor:

Toko Part # 292SNS–T1373 or Equivalent.

8–292

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 2. Total Drain Current versus Supply

Voltage and Temperature

Figure 3. Drain Currents versus Supply Voltage

6.5

6.0

5.5

5.0

4.5

4.0

3.5

4.0

3.6

3.2

2.8

2.4

2.0

1.6

T = 25°C

A

T = 85°C

A

I

22

55°C

25°C

–10°C

–40°C

I

19

1.0

2.0

3.0

4.0

5.0

6.0

7.0

1.0

2.0

3.0

V , SUPPLY VOLTAGE (–Vdc)

EE

4.0

5.0

6.0

7.0

V

, SUPPLY VOLTAGE (–Vdc)

EE

Figure 5. IF Amplifier Gain versus Input

Signal Level and Ambient Temperature

Figure 4. Mixer Gain versus Input Signal Level

25.0

22.5

20.0

17.5

15.0

12.5

10.0

40

38

36

34

32

30

28

26

T = 25°C

A

85°C

55°C

25°C

–10°C

–40°C

V

= –5.0 Vdc

EE

f = 10.7 MHz

–90

–80

–70

–60

–50

–40

–30

–20

–10

–65

–60

–55

–50

–45

–40

–35

–30

P , RF INPUT SIGNAL LEVEL (dBm)

in

P , IF INPUT SIGNAL LEVEL (dBm)

in

Figure 6. IF Amplifier RSSI Output Current versus

Input Signal Level and Ambient Temperature

Figure 7. Limiter Amplifier RSSI Output Current

versus Input Signal Level and Temperature

20.0

30

25

20

15

10

5.0

0

T = 25° to 85°C

A

V

= –5.0 Vdc

V

= – 5.0 Vdc

EE

f = 10.7 MHz

EE

f = 10.7 MHz

17.5

15.0

12.5

10.0

7.5

–10°C

–40°C

–10°C

–40°C

5.0

2.5

0

–50

–40

–30

–20

–10

0

10

–70

–60

–50

–40

–30

–20

–10

0

10

P , IF INPUT SIGNAL LEVEL (dBm)

in

P , INPUT SIGNAL LEVEL (dBm)

in

8–293

MOTOROLA ANALOG IC DEVICE DATA

MC13156

CIRCUIT DESCRIPTION

General

The MC13156 is a low power single conversion wideband

amplitude. The RSSI current output is derived by summing

the currents from the IF and limiting amplifier stages. An

external resistor at Pin 20 sets the voltage range or swing of

the RSSI output voltage. Linearity of the RSSI is optimized by

using external ceramic or crystal bandpass filters which have

an insertion loss of 8.0 dB. The RSSI circuit is designed to

provide 70+ dB of dynamic range with temperature

compensation (see Figures 6 and 7 which show RSSI

responses of the IF and Limiter amplifiers). Variation in the

RSSI output current with supply voltage is small (see

Figure 11).

FM receiver incorporating a split IF. This device is designated

for use as the backend in digital FM systems such as CT–2

and wideband data links with data rates up to 500 kbaud. It

contains a mixer, oscillator, signal strength meter drive, IF

amplifier, limiting IF, quadrature detector and a data slicer

with a hold function (refer to Figure 8, Simplified Internal

Circuit Schematic).

Current Regulation

Temperature compensating voltage independent current

regulators are used throughout.

Carrier Detect

When the meter current flowing through the meter load

resistance reaches 1.2 Vdc above ground, the comparator

flips, causing the carrier detect output to go high. Hysteresis

can be accomplished by adding a very large resistor for

positive feedback between the output and the input of the

comparator.

Mixer

The mixer is a double–balanced four quadrant multiplier

and is designed to work up to 500 MHz. It can be used in

differential or in single–ended mode by connecting the other

input to the positive supply rail.

Figure 4 shows the mixer gain and saturated output

response as a function of input signal drive. The circuit used

to measure this is shown in Figure 1. The linear gain of the

mixer is approximately 22 dB. Figure 9 shows the mixer gain

versus the IF output frequency with the local oscillator of

150 MHz at 100 mVrms LO drive level. The RF frequency is

swept. The sensitivity of the IF output of the mixer is shown in

Figure 10 for an RF input drive of 10 mVrms at 140 MHz and

IF at 10 MHz.

IF Amplifier

The first IF amplifier section is composed of three

differential stages with the second and third stages

contributing to the RSSI. This section has internal dc

feedback and external input decoupling for improved

symmetry and stability. The total gain of the IF amplifier block

is approximately 39 dB at 10.7 MHz. Figure 5 shows the gain

and saturated output response of the IF amplifier over

temperature, while Figure 12 shows the IF amplifier gain as a

function of the IF frequency.

The fixed internal input impedance is 1.4 kΩ. It is designed

for applications where a 455 kHz ceramic filter is used and no

external output matching is necessary since the filter requires

a 1.4 kΩ source and load impedance.

The single–ended parallel equivalent input impedance of

the mixer is Rp ~ 1.0 kΩ and Cp ~ 4.0 pF (see Table 1 for

details). The buffered output of the mixer is internally loaded

resulting in an output impedance of 330 Ω.

Local Oscillator

The on–chip transistor operates with crystal and LC

resonant elements up to 220 MHz. Series resonant, overtone

crystals are used to achieve excellent local oscillator stability.

3rd overtone crystals are used through about 65 to 70 MHz.

Operation from 70 MHz up to 180 MHz is feasible using the

on–chip transistor with a 5th or 7th overtone crystal. To

enhance operation using an overtone crystal, the internal

transistor’s bias is increased by adding an external resistor

For 10.7 MHz ceramic filter applications, an external

430 Ω resistor must be added in parallel to provide the

equivalent load impedance of 330 Ω that is required by the

filter; however, no external matching is necessary at the input

since the mixer output matches the 330 Ω source impedance

of the filter. For 455 kHz applications, an external 1.1 kΩ

resistor must be added in series with the mixer output to

obtain the required matching impedance of 1.4 kΩ of the filter

input resistance. Overall RSSI linearity is dependent on

having total midband attenuation of 12 dB (6.0 dB insertion

loss plus 6.0 dB impedance matching loss) for the filter. The

output of the IF amplifier is buffered and the impedance is

290 Ω.

from Pin 23 to V . –10 dBm of local oscillator drive is

EE

needed to adequately drive the mixer (Figure 10).

The oscillator configurations specified above, and two

others using an external transistor, are described in the

application section:

1) A 133 MHz oscillator multiplier using a 3rd overtone

1) crystal, and

Limiter

The limiter section is similar to the IF amplifier section

except that four stages are used with the last three

contributing to the RSSI. The fixed internal input impedance

is 1.4 kΩ. The total gain of the limiting amplifier section is

approximately 55 dB. This IF limiting amplifier section

internally drives the quadrature detector section.

2) A 307.8 to 309.3 MHz manually tuned, varactor controlled

2) local oscillator.

RSSI

The Received Signal Strength Indicator (RSSI) output is a

current proportional to the log of the received signal

8–295

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 10. Mixer IF Output Level versus

Local Oscillator Input Level

Figure 9. Mixer Gain versus IF Frequency

20

15

–5.0

–10

–15

–20

–25

–30

–35

–40

–45

V

= –3.0 Vdc

EE

T = 25°C

A

V

= –3.0 Vdc

EE

V = 1.0 mVrms (–47 dBm)

in

10

R

= 330 Ω

= 50 Ω

O

R

in

BW(3.0 dB) = 21.7 MHz

= f – f

5.0

0

f

IF LO RF

f

= 150 MHz

= 100 mVrms

LO

f

= 140 MHz; f = 150 MHz

LO

RF

V

LO

RF Input Level = –27 dBm

(10 mVrms)

R

in

= 50 Ω; R = 330 Ω

O

–5.0

0.1

1.0

10

100

–50

–40

–30

–20

–10

0

10

f , IF FREQUENCY (MHz)

IF

LO DRIVE (dBm)

Figure 11. RSSI Output Current versus

Supply Voltage and RF Input Signal Level

Figure 12. IF Amplifier Gain versus IF Frequency

40

35

30

25

20

15

10

5.0

0

60

50

40

30

20

10

0

V =

in

T = 25°C

A

–20 dBm

–40 dBm

–60 dBm

V = 100 µV

in

R

= 50 Ω

= 330 Ω

–80 dBm

in

R

O

BW(3.0 dB) = 26.8 MHz

–100 dBm

T = 25°C

A

1.0

2.0

3.0

4.0

5.0

6.0

7.0

0.1

1.0

10

100

V , SUPPLY VOLTAGE (–Vdc)

EE

f, FREQUENCY (MHz)

Figure 13. Recovered Audio Output Voltage

versus Supply Voltage

400

300

200

100

0

f

= 1.0 kHz

= ±75 kHz

= 140 MHz

mod

f

dev

f

RF

RF Input Level = 1.0 mVrms

T = 25°C

A

1.0

2.0

3.0

4.0

5.0

6.0

7.0

V , SUPPLY VOLTAGE (–Vdc)

EE

8–296

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Quadrature Detector

pulled up, Q1 turns off; Q2 turns on, thereby clamping the

input at 2.0 V . On the other hand, when Pin 15 is pulled

down, Q1 turns on; Q2 turns off, thereby clamping the input at

The quadrature detector is a doubly balanced four

quadrant multiplier with an internal 5.0 pF quadrature

capacitor to couple the IF signal to the external parallel RLC

resonant circuit that provides the 90 degree phase shift and

drives the quadrature detector. A single pin (Pin 13) provides

for the external LC parallel resonant network and the internal

connection to the quadrature detector.

The bandwidth of the detector allows for recovery of

relatively high data rate modulation. The recovered signal is

converted from differential to single ended through a

push–pull NPN/PNP output stage. Variation in recovered

audio output voltage with supply voltage is very small (see

Figure 13). The output drive capability is approximately

±9.0 µA for a frequency deviation of ±75 kHz and 1.0 kHz

modulating frequency (see Application Circuit).

be

1.0 V .

be

The recovered data signal from the quadrature detector is

ac coupled to the data slicer via an input coupling capacitor.

The size of this capacitor and the nature of the data signal

determine how faithfully the data slicer shapes up the

recovered signal. The time constant is short for large peak to

peak voltage swings or when there is a change in dc level at

the detector output. For small signal or for continuous bits of

the same polarity which drift close to the threshold voltage,

the time constant is longer. When centered there is no input

current allowed, which is to say, that the input looks high in

impedance.

Another unique feature of the data slicer is that it responds

to various logic levels applied to the Data Slicer Hold Control

pin (Pin 18). Figure 15 illustrates how the input and output

currents under “no hold” condition relate to the input voltage.

Figure 16 shows how the input current and input voltage

relate for both the “no hold” and “hold” condition.

Data Slicer

The data slicer input (Pin 15) is self centering around 1.1 V

with clamping occurring at 1.1 ± 0.5 V Vdc. It is designed to

be

square up the data signal. Figure 14 shows a detailed

schematic of the data slicer.

The hold control (Pin18) does three separate tasks:

The Voltage Regulator sets up 1.1 Vdc on the base of

Q12, the Differential Input Amplifier. There is a potential of

1) With Pin 18 at 1.0 V or greater, the output is shut off

be

(sets high). Q19 turns on which shunts the base drive

from Q20, thereby turning the output off.

1.0 V

on the base–collector of transistor diode Q11 and

be

2.0 V on the base–collector of Q10. This sets up a 1.5 V

be be

2) With Pin 18 at 2.0 V or greater, internal clamping diodes

be

(~ 1.1 Vdc) on the node between the 36 kΩ resistors which is

connected to the base of Q12. The differential output of the

data slicer Q12 and Q13 is converted to a single–ended

output by the Driver Circuit. Additional circuitry, not shown in

Figure 14, tends to keep the data slicer input centered at

1.1 Vdc as input signal levels vary.

are open circuited and the comparator input is shut off and

effectively open circuited. This is accomplished by turning

off the current source to emitters of the input differential

amplifier, thus, the input differential amplifier is shut off.

3) When the input is shut off, it allows the input capacitor to

hold its charge during transmit to improve recovery at the

beginning of the next receive period. When it is turned on,

it allows for very fast charging of the input capacitor for

quick recovery of new tuning or data average. The above

features are very desirable in a TDD digital FM system.

The Input Diode Clamp Circuit provides the clamping at

1.0 V (0.75 Vdc) and 2.0 V (1.45 Vdc). Transistor diodes

be

Q7 and Q8 are on, thus, providing a 2.0 V potential at the

be

base of Q1. Also, the voltage regulator circuit provides a

potential of 2.0 Vbe on the base of Q3 and 1.0 V on the

be

emitter of Q3 and Q2. When the data slicer input (Pin 15) is

8–297

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 14. Data Slicer Circuit

9

15

V

CC

DS In

8.0 k

Data Out

17

Q15

Q14

Q10

Q3

36 k

Q20

Q1

Q2

Q12 Q13

Q7

Q5

Q8

16

DS Gnd

32 k

Q6

Q18

Q11

Q4

Q19

Q9

Q16

Q17

64 k

16 k

64 k

V

EE

64 k

19

Input Diode

Clamp Circuit

(Q1 to Q9)

Voltage

Regulator

(Q10, Q11)

Differential

Input Amplifier

(Q12, Q13)

Driver and

Output Circuit

(Q14, Q20)

18

DS Hold

Figure 15. Data Slicer Input/Output Currents

versus Input Voltage

Figure 16. Data Slicer Input Current

versus Input Voltage

2.5

0.5

0.3

150

100

50

Hold

≥ 1

V

EE

= –3.0 Vdc

V

No Hold

= 0 Vdc

18

1.5

V

18

Output Current

(I

)

17

0.5

0.1

–0.5

–1.5

–2.5

–0.1

–0.3

–0.5

0

Input Current

(I

V

= –3.0 Vdc

V = 0 Vdc

18

EE

–50

)

15

No Hold

1.0

Hold

–0.5

(No Hold)

1.6

–100

–1.0

0.6

0.8

1.0

1.2

1.4

1.8

0

0.5

1.5

2.0

2.5

3.0

V , INPUT VOLTAGE (Vdc)

15

V , INPUT VOLTAGE (Vdc)

15

8–298

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 17. MC13156DW Application Circuit

+

1.0 µ

(6)

0.146 µ

15 k

MMBR5179

68 p

100 p

(5) 0.82 µ

MC13156

7.5 p

50 p

144.455 MHz

RF Input

Mixer

5.6 k

24

1

2

3

4

5

470

43 p

(1)

0.1 µ

(4) 3rd O.T.

XTAL

SMA

133.755 MHz

Osc/Tripler

23

1.0 k

10 n

22

V

EE

Carrier

Detect

(2) 10.7 MHz

Ceramic

Filter

21

20

19

18

17

16

V

CC

Bias

100 k

RSSI

Output

10 n

47 k

IF Amp

10 n

430

6

7

V

EE

Data Slicer

Hold

10 n

Data

Slicer

10 k

Bias

8

Data

Output

(2) 10.7 MHz

Ceramic

Filter

V

CC

V

CC

9

V

EE

100 n

LIM Amp

15

10

11

12

180 p

10 n

430

100 k

14

13

10 n

5.0 p

(3)

1.5 µ

V

CC

150 p

10 k

+

1.0 µ

NOTES: 1. 0.1 µH Variable Shielded Inductor: Coilcraft part # M1283–A or equivalent.

2. 10.7 MHz Ceramic Filter: Toko part # SK107M5–A0–10X or Murata Erie part # SFE10.7MHY–A.

3. 1.5 µH Variable Shielded Inductor: Toko part # 292SNS–T1373.

4. 3rd Overtone, Series Resonant, 25 PPM Crystal at 44.585 MHz.

5. 0.814 µH Variable Shielded Inductor: Coilcraft part # 143–18J12S.

6. 0.146 µH Variable Inductor: Coilcraft part # 146–04J08.

8–299

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 18. MC13156DW Circuit Side Component Placement

+1 µ

Local OSC

10n

E

LO

In

IF

In

C

100p

10n

5.6k

B

10n

100n

100k

430

10n

+1 µ

V

CC

Figure 19. MC13156DW Ground Side Component Placement

8–300

MOTOROLA ANALOG IC DEVICE DATA

MC13156

APPLICATIONS INFORMATION

Component Selection

device to have good linearity of beta over several decades of

collector current. In other words, if the low current beta is

suppressed, it will not offer good 1/f noise performance. A

third overtone series resonant crystal having at least 25 ppm

tolerance over the operating temperature is recommended.

The local oscillator is an impedance inversion third overtone

Colpitts network and harmonic generator. In this circuit a 560

to 1.0 kΩ resistor shunts the crystal to ensure that it operates

in its overtone mode; thus, a blocking capacitor is needed to

eliminate the dc path to ground. The resulting parallel LC

network should “free–run” near the crystal frequency if a

short to ground is placed across the crystal. To provide

sufficient output loading at the collector, a high Q variable

inductor is used that is tuned to self resonate at the 3rd

harmonic of the overtone crystal frequency.

The on–chip grounded collector transistor may be used for

HF and VHF local oscillator with higher order overtone

crystals. Figure 20 shows a 5th overtone oscillator at

93.3 MHz and Figure 21 shows a 7th overtone oscillator at

148.3 MHz. Both circuits use a Butler overtone oscillator

configuration. The amplifier is an emitter follower. The crystal

is driven from the emitter and is coupled to the high

impedance base through a capacitive tap network. Operation

at the desired overtone frequency is ensured by the parallel

resonant circuit formed by the variable inductor and the tap

capacitors and parasitic capacitances of the on–chip

transistor and PC board. The variable inductor specified in

the schematic could be replaced with a high tolerance, high Q

ceramic or air wound surface mount component if the other

components have good tolerances. A variable inductor

provides an adjustment for gain and frequency of the

resonant tank ensuring lock up and startup of the crystal

oscillator. The overtone crystal is chosen with ESR of

typically 80 Ω and 120 Ω maximum; if the resistive loss in the

crystal is too high, the performance of the oscillator may be

impacted by lower gain margins.

The evaluation PC board is designed to accommodate

specific components, while also being versatile enough to

use components from various manufacturers and coil types.

Figures 18 and 19 show the placement for the components

specified in the application circuit (Figure 17). The

applications circuit schematic specifies particular

components that were used to achieve the results shown in

the typical curves and tables but equivalent components

should give similar results.

Input Matching Networks/Components

The input matching circuit shown in the application circuit

schematic is passive high pass network which offers effective

image rejection when the local oscillator is below the RF input

frequency. Silver mica capacitors are used for their high Q

and tight tolerance. The PC board is not dedicated to any

particular input matching network topology; space is provided

for the designer to breadboard as desired.

Alternate matching networks using 4:1 surface mount

transformers or BALUNS provide satisfactory performance.

The 12 dB SINAD sensitivity using the above matching

networks is typically –100 dBm for f

= 1.0 kHz and

mod

= ±75 kHz at f = 144.45 MHz and f = 133.75 MHz

OSC

f

dev

(see Figure 25).

IN

It is desirable to use a SAW filter before the mixer to

provide additional selectivity and adjacent channel rejection

and improved sensitivity. The SAW filter should be designed

to interface with the mixer input impedance of approximately

1.0 kΩ. Table 1 displays the series equivalent single–ended

mixer input impedance.

Local Oscillators

VHF Applications – The local oscillator circuit shown in the

application schematic utilizes a third overtone crystal and an

RF transistor. Selecting a transistor having good phase noise

performance is important; a mandatory criteria is for the

Table 1. Mixer Input Impedance Data

(Single–ended configuration, V = 3.0 Vdc, local oscillator drive = 100 mVrms)

CC

Series Equivalent

Complex Impedance

(R + jX)

Parallel

Resistance

Rp

Parallel

Capacitance

Cp

Frequency

(MHz)

(Ω)

(pF)

90

190 – j380

160 – j360

130 – j340

110 – j320

97 – j300

82 – j280

71 – j270

59 – j260

52 – j240

44 – j230

38 – j220

950

970

4.7

4.4

4.2

4.0

3.9

3.8

100

110

120

130

140

150

160

170

180

190

1020

1040

1030

1040

1100

1200

1160

1250

1300

8–301

MOTOROLA ANALOG IC DEVICE DATA

MC13156

A series LC network to ground (which is V ) is comprised

of the inductance of the base lead of the on–chip transistor

voltage varactor suitable for UHF applications; it is a dual

back–to–back varactor in a SOT–23 package. The input

matching network uses a 1:4 impedance matching

transformer (Recommended sources are Mini–Circuits and

Coilcraft).

CC

and PC board traces and tap capacitors. Parasitic

oscillations often occur in the 200 to 800 MHz range. A small

resistor is placed in series with the base (Pin 24) to cancel the

negative resistance associated with this undesired mode of

oscillation. Since the base input impedance is so large a

small resistor in the range of 27 to 68 Ω has very little effect

on the desired Butler mode of oscillation.

Using the same IF ceramic filters and quadrature detector

circuit as specified in the applications circuit in Figure 17, the

12 dB SINAD performance is –95 dBm for a f

= 1.0 kHz

mod

sinusoidal waveform and f

dev

±40 kHz.

The crystal parallel capacitance, C , provides a feedback

This circuit is breadboarded using the evaluation PC board

shown in Figures 32 and 33. The RF ground is V and path

o

path that is low enough in reactance at frequencies of 5th

CC

overtone or higher to cause trouble. C has little effect near

lengths are minimized. High quality surface mount

components were used except where specified. The

absolute values of the components used will vary with layout

placement and component parasitics.

o

resonance because of the low impedance of the crystal

motional arm (R –L –C ). As the tunable inductor which

m

forms the resonant tank with the tap capacitors is tuned off

the crystal resonant frequency, it may be difficult to tell if the

oscillation is under crystal control. Frequency jumps may

occur as the inductor is tuned. In order to eliminate this

RSSI Response

Figure 26 shows the full RSSI response in the application

circuit. The 10.7 MHz, 110 kHz wide bandpass ceramic filters

(recommended sources are TOKO part # SK107M5–AO–10X

or Murata Erie SFE10.7MHY–A) provide the correct

bandpass insertion loss to linearize the curve between the

limiter and IF portions of RSSI. Figure 25 shows that limiting

occurs at an input of –100 dBm. As shown in Figure 26, the

RSSI output linear from –100 dBm to –30 dBm.

behavior an inductor (L ) is placed in parallel with the crystal.

o

L is chosen to resonant with the crystal parallel capacitance

o

(C ) at the desired operation frequency. The inductor

o

provides a feedback path at frequencies well below

resonance; however, the parallel tank network of the tap

capacitors and tunable inductor prevent oscillation at these

frequencies.

The RSSI rise and fall times for various RF input signal

levels and R20 values are measured at Pin 20 without 10 nF

filter capacitor. A 10 kHz square wave pulses the RF input

signal on and off. Figure 27 shows that the rise and fall times

are short enough to recover greater than 10 kHz ASK data;

with a wider IF bandpass filters data rates up to 50 kHz may

be achieved. The circuit used is the application circuit in

Figure 17 with no RSSI output filter capacitor.

UHF Application

Figure 22 shows a 318.5 to 320 MHz receiver which drives

the mixer with an external varactor controlled (307.8 to

309.3 MHz) LC oscillator using an MPS901 (RF low power

transistor in a TO–92 plastic package; also MMBR901 is

available in a SOT–23 surface mount package). With the

50 kΩ 10 turn potentiometer this oscillator is tunable over a

range of approximately 1.5 MHz. The MMBV909L is a low

Figure 20. MC13156DW Application Circuit

f

= 104 MHz; f

= 93.30 MHz

RF

LO

5th Overtone Crystal Oscillator

(4)

0.135 µH

33

+

1.0 µ

(2)

10 p

104 MHz

RF Input

Mixer

27 p

120 p

24

1

2

3

1.0 µH

(1)

0.1 µ

SMA

(3)

30 p

10 n

3.0 p

23

10 n

5th OT

XTAL

4.7 k

22

V

EE

V

CC

To Filter

NOTES: 1. 0.1 µH Variable Shielded Inductor: Coilcraft part # M1283–A or equivalent.

2. Capacitors are Silver Mica.

3. 5th Overtone, Series Resonant, 25 PPM Crystal at 93.300 MHz.

4. 0.135 µH Variable Shielded Inductor: Coilcraft part # 146–05J08S or equivalent.

8–302

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 21. MC13156DW Application Circuit

f

= 159 MHz; f

= 148.30 MHz

RF

LO

7th Overtone Crystal Oscillator

(4)

76 nH

+

33

1.0 µ

(2)

5.0 p

27 p

Mixer

50 p

159 MHz

RF Input

24

1

2

3

0.22 µH

(1)

0.08 µH

SMA

47 p

23

(3)

7th OT

XTAL

10 n

4.7 k

22

470

V

EE

10 n

V

CC

To IF Filter

NOTES: 1. 0.08 µH Variable Shielded Inductor: Toko part # 292SNS–T1365Z or equivalent.

2. Capacitors are Silver Mica.

3. 7th Overtone, Series Resonant, 25 PPM Crystal at 148.300 MHz.

4. 76 nH Variable Shielded Inductor: Coilcraft part # 150–03J08S or equivalent.

Figure 22. MC13156DW Varactor Controlled LC Oscillator

(2)

47 k

50 k

V

VCO

+

1.0 µ

(6)

4.7 k

0.1 µ

1.0 M

MPS901

6.8 p

(1)

Mixer

318.5 to

320 MHz

1:4 Transformer

24 p

24

1

2

3

20 p

24 p

RF Input

(4)

MMBV909L

SMA

23

22

12 k

(3)

18.5 nH

1.8 k

V

EE

1.0 n

307.8–309.3 MHz

LC Varactor

Controlled Oscillator

V

CC

= 3.3 Vdc (Reg)

NOTES: 1. 1:4 Impedance Transformer: Mini–Circuits.

2. 50 k Potentiometer, 10 turns.

3. Spring Coil; Coilcraft A05T.

4. Dual Varactor in SOT–23 Package.

5. All other components are surface mount components.

6. Ferrite beads through loop of 24 AWG wire.

8–303

MOTOROLA ANALOG IC DEVICE DATA

MC13156

45 MHz Narrowband Receiver

The 12 dB SINAD performance is –109 dBm for a f

=

mod

= ±4.0 kHz. The RSSI dynamic range is

1.0 kHz and a f

The above application examples utilize a 10.7 MHz IF. In

this section a narrowband receiver with a 455 kHz IF will be

described. Figure 23 shows a full schematic of a 45 MHz

receiver that uses a 3rd overtone crystal with the on–chip

oscillator transistor. The oscillator configuration is similar to

the one used in Figure 17; it is called an impedance inversion

Colpitts. A 44.545 MHz 3rd overtone, series resonant crystal

is used to achieve an IF frequency at 455 kHz. The ceramic

IF filters selected are Murata Erie part # SFG455A3. 1.2 kΩ

chip resistors are used in series with the filters to achieve the

terminating resistance of 1.4 kΩ to the filter. The IF

decoupling is very important; 0.1 µF chip capacitors are used

at Pins 6, 7, 11 and 12. The quadrature detector tank circuit

uses a 455 kHz quadrature tank from Toko.

dev

approximately 80 dB of linear range (see Figure 24).

Receiver Design Considerations

The curves of signal levels at various portions of the

application receiver with respect to RF input level are shown

in Figure 28. This information helps determine the network

topology and gain blocks required ahead of the MC13156 to

achieve the desired sensitivity and dynamic range of the

receiver system. In the application circuit the input third order

intercept (IP3) performance of the system is approximately

–25 dBm (see Figure 29).

Figure 23. MC13156DW Application Circuit at 45 MHz

1.8 µH

+

1.0 µ

(6)

(1)

0.33 µH

10 n

33 p

45 Hz

RF Input

Mixer

24

1

2

3

4

5

(4) 3rd OT

XTAL

44.545

MHz

56 p

39 p

SMA

(5) 0.416 µH

180 p

470 k

23

22

21

20

19

18

17

16

15

10 k

1.2 k

10 n

V

EE

10 n

Carrier

Detect

(2) 455 kHz

Ceramic

Filter

V

CC

Bias

100 k

RSSI

Output

10 n

47 k

IF Amp

0.1 µ

6

7

V

EE

10 n

0.1 µ

Data Slicer

Hold

Data

Slicer

10 k

1.2 k

Bias

8

Data

Output

(2) 455 kHz

Ceramic

Filter

V

CC

V

CC

9

V

EE

100 n

10

11

12

Audio To

C–Message

Filter and

Amp.

LIM Amp

0.1 µ

100 k

14

13

1.0 n

0.1 µ

5.0 p

(3)

V

CC

= 2.0 to 5.0 Vdc

680 µH

180 p

27 k

+

NOTES: 1. 0.33 µH Variable Shielded Inductor: Coilcraft part # 7M3–331 or equivalent.

2. 455 kHz Ceramic Filter: Murata Erie part # SFG455A3.

3. 455 kHz Quadrature Tank: Toko part # 7MC8128Z.

1.0 µ

4. 3rd Overtone, Series Resonant, 25 PPM Crystal at 44.540 MHz.

5. 0.416 µH Variable Shielded Inductor: Coilcraft part # 143–10J12S.

6. 1.8 µH Molded Inductor.

8–304

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 24. RSSI Output Voltage

versus Input Signal Level

Figure 25. S + N/N versus RF Input Signal Level

10

0

1.8

1.6

1.4

1.2

S +N

V

= 5.0 Vdc

= ±75 kHz

= 1.0 kHz

CC

–10

–20

–30

f

V

= 45.00 MHz

= 2.0 Vdc

f

RF

CC

dev

f

mod

12 dB SINAD @ –109 dBm

(0.8 µVrms)

(See Figure 23)

f

= 144.45 MHz

in

(See Figure 17)

1.0

0.8

0.6

–40

–50

N

0.4

–120

–100

–80

–60

–40

20

–110 –100 –90 –80 –70 –60 –50 –40 –30 –20

–20

0

SIGNAL INPUT LEVEL (dBm)

RF INPUT SIGNAL (dBm)

Figure 27. RSSI Output Rise and Fall Times

versus RF Input Signal Level

Figure 26. RSSI Output Voltage

versus Input Signal Level

1.4

1.2

1.0

0.8

0.6

0.4

35

t @ 22 k

r

f

30

25

20

t

@ 22 k

t @ 47 k

r

t

@ 47 k

f

t @ 100 k

r

t @ 100 k

f

15

10

5.0

0

V

= 5.0 Vdc

CC

f = 144.455 MHz

c

f

= 133.755 MHz

LO

Low Loss 10.7 MHz

Ceramic Filter

(See Figure 17)

0.2

–120

–100

–80

–60

–40

–20

0

–20

–40

–60

–80

SIGNAL INPUT LEVEL (dBm)

RF INPUT SIGNAL LEVEL (dBm)

Figure 28. Signal Levels versus

RF Input Signal Level

Figure 29. 1.0 dB Compression Pt. and Input

Third Order Intercept Pt. versus Input Power

0

–10

–20

–30

–40

–50

–60

10

0

LO Level = –2.0 dBm

(See Figure 17)

V

= 5.0 Vdc

= 144.4 MHz

= 144.5 MHz

= 133.75 MHz

= –2.0 dBm

IF Output

Limiter Input

CC

1.0 dB Comp. Pt.

= –37 dBm

f

RF1

IP3 = –25 dBm

f

RF2

–10

–20

–30

–40

–50

–60

–70

LO

P

LO

(See Figure 17)

–70

–100

–90

–80

–70

–60

–50

–40

–30

–100

–80

–60

–40

–20

0

RF INPUT SIGNAL LEVEL (dBm)

RF INPUT POWER (dBm)

8–305

MOTOROLA ANALOG IC DEVICE DATA

MC13156

BER TESTING AND PERFORMANCE

Description

Figure 31. Bit Error Rate versus RF

Input Signal Level and IF Bandpass Filter

The test setup shown in Figure 30 is configured so that the

function generator supplies a 100 kHz clock source to the bit

error rate tester. This device generates and receives a

repeating data pattern and drives a 5 pole baseband data

filter. The filter effectively reduces harmonic content of the

baseband data which is used to modulate the RF generator

which is running at 144.45 MHz. Following processing of the

signal by the receiver (MC13156), the recovered baseband

sinewave (data) is AC coupled to the data slicer. The data

slicer is essentially an auto–threshold comparator which

tracks the zero crossing of the incoming sinewave and

provides logic level data at its ouput. Data errors associated

with the recovered data are collected by the bit error rate

receiver and displayed.

–1

–3

–5

–7

10

V

= 4.0 Vdc

CC

Data Pattern = 2E09 Prbs NRZ

Baseband Filter f = 50 kHz

c

f

= ±32 kHz

dev

IF Filter BW

110 kHz

IF Filter BW

230 kHz

–90

–85

–80

–75

–70

Bit error rate versus RF signal input level and IF filter

bandwidth are shown in Figure 31. The bit error rate data was

taken under the following test conditions:

RF INPUT SIGNAL LEVEL (dBm)

Evaluation PC Board

• Data rate = 100 kbps

The evaluation PCB is very versatile and is intended to be

used across the entire useful frequency range of this device.

The center section of the board provides an area for

attaching all SMT components to the circuit side and radial

leaded components to the component ground side (see

Figures 32 and 33). Additionally, the peripheral area

surrounding the RF core provides pads to add supporting

and interface circuitry as a particular application dictates.

• Filter cutoff frequency set to 39% of the data rate or 39 kHz.

• Filter type is a 5 pole equal–ripple with 0.5° phase error.

• V

= 4.0 Vdc

CC

• Frequency deviation = ±32 kHz.

Figure 30. Bit Error Rate Test Setup

Function Generator

Bit Error Rate Tester

RF Generator

Wavetek Model No. 164

HP3780A or Equivalent

HP8640B

Gen

Clock

Input

Rcr

Clock

Input

Rcr

Data

Input

Clock

Out

Generator

Input

Modulation

Input

RF

Output

5 Pole

Bandpass

Filter

Data Slicer

Output

Mixer

Input

MC13156

UUT

8–306

MOTOROLA ANALOG IC DEVICE DATA

MC13156

Figure 32. Circuit Side View

MC13156DW

4.0″

Figure 33. Ground Side View

MC13156DW

Quadrature

Detector

IF

Filter

4.0″

IF

Filter

Local

Oscillator

IF Input

8–307

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Options

In Brief . . .

Motorola offers the convenience of Tape and Reel

packaging for our growing family of standard integrated circuit

products. Reels are available to support the requirements of

both first and second generation pick–and–place equipment.

The packaging fully conforms to the latest EIA–481A

specification. The antistatic embossed tape provides a

secure cavity, sealed with a peel–back cover tape.

Page

Tape and Reel Configurations . . . . . . . . . . . . . . . . . . . . . 12–2

Tape and Reel Information Table . . . . . . . . . . . . . . . . . . . 12–4

Analog MPQ Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12–5

12–1

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Configurations

Mechanical Polarization

SOIC and Micro–8

DEVICES

PLCC DEVICES

Typical

PIN 1

User Direction of Feed

2

DPAK and D PAK

DEVICES

Typical

User Direction of Feed

SOT–23 (5 Pin)

DEVICES

Typical

SOT–89 (3 Pin)

DEVICES

Typical

SOT–89 (5 Pin)

DEVICES

Typical

User Direction of Feed

12–2

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Configurations (continued)

TO–92 Reel Styles

STYLE A

(Preferred)

STYLE E

Carrier Strip

Rounded

Side

Flat Side

Adhesive Tape

Feed

Rounded side of transistor and adhesive tape visible.

Flat side of transistor and adhesive tape visible.

TO–92 Ammo Pack Styles

STYLE P

(Preferred)

STYLE M

Adhesive Tape On

Top Side

Adhesive Tape On

Top Side

Feed

Rounded Side

Flat Side

Carrier

Strip

Carrier

Strip

Flat side of transistor and

adhesive tape visible.

Rounded side of transistor and

adhesive tape visible.

Label

Style P ammo pack is equivalent to Styles A and B of reel pack

dependent on feed orientation from box.

Style M ammo pack is equivalent to Style E of reel

pack dependent on feed orientation from box.

TO–92 EIA Radial Tape in Fan Fold Box or On Reel

H2A

H2B

H

W2

H4

H5

T1

L1

H1

W1

W

L

T

T2

F1

F2

D

P2

P1

P2

P

12–3

MOTOROLA ANALOG IC DEVICE DATA

Tape and Reel Information Table

(1)

Devices

per Reel

Tape Width

(mm)

Reel Size

(inch)

Device

Suffix

Package

SO–8, SOP–8

SO–14

SO–16

12

16

2,500

13

R2

SO–16L, SO–8+8L WIDE

SO–20L WIDE

SO–24L WIDE

SO–28L WIDE

16

24

32

1,000

13

R2

R3

Micro–8

12

2,500

13

R2

PLCC–20

PLCC–28

PLCC–44

16

24

32

1,000

500

13

R2

PLCC–52

PLCC–68

PLCC–84

32

44

500

250

13

R2

(2)

TO–226AA (TO–92)

18

2,000

13

RA, RE, RP, or RM

(Ammo Pack) only

DPAK

16

24

8

2,500

800

13

7

RK

R4

TR

T1

2

D PAK

SOT–23 (5 Pin)

3,000

1,000

SOT–89 (3/5 Pin)

(1)

12

7

Minimum order quantity is 1 reel. Distributors/OEM customers may break lots or reels at their option, however broken reels may not be returned.

Integrated circuits in TO–226AA packages are available in Styes A and E only, with optional “Ammo Pack” (Suffix RP or RM). The RA and RP configurations

are preferred. For ordering information please contact your local Motorola Semiconductor Sales Office.

(2)

12–4

MOTOROLA ANALOG IC DEVICE DATA

Analog MPQ Table

Tape/Reel and Ammo Pack

Package Type

Package Code

MPQ

PLCC

Case 775

Case 776

Case 777

0802

0804

0801

1000/reel

500/reel

SOIC

Case 751

Case 751A

Case 751B

Case 751G

Case 751D

Case 751E

Case 751F

0095

0096

0097

2003

2005

2008

2009

2500/reel

1000/reel

Micro–8

Case 846A

–

2500/reel

TO–92

Case 29

0031

2000/reel

2000/Ammo Pack

DPAK

Case 369A

–

2500/reel

800/reel

2

D PAK

Case 936

SOT–23 (5 Pin)

Case 1212

3000/reel

1000/reel

SOT–89 (3 Pin)

Case 1213

SOT–89 (5 Pin)

Case 1214

12–5

MOTOROLA ANALOG IC DEVICE DATA

12–6

MOTOROLA ANALOG IC DEVICE DATA

Packaging Information

In Brief . . .

The packaging availability for each device type is indicated

on the individual data sheets and the Selector Guide. All of the

outline dimensions for the packages are given in this section.

The maximum power consumption an integrated circuit

can tolerate at a given operating ambient temperature can be

found from the equation:

T

– T

A

J(max)

P

=

D(TA)

R

θJA(Typ)

where:

P

= Power Dissipation allowable at a given

operating ambient temperature. This must

be greater than the sum of the products of

the supply voltages and supply currents at

the worst case operating condition.

D(TA)

T

= Maximum operating Junction Temperature

as listed in the Maximum Ratings Section.

J(max)

See individual data sheets for T

information.

J(max)

T

A

= Maximum desired operating Ambient

Temperature

R

= Typical Thermal Resistance Junction-to-

Ambient

θJA(Typ)

13–1

MOTOROLA ANALOG IC DEVICE DATA

Case Outline Dimensions

LP, P, Z SUFFIX

CASE 29-04

NOTES:

Plastic Package

(TO-226AA/TO-92)

ISSUE AD

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. CONTOUR OF PACKAGE BEYOND DIMENSION R

IS UNCONTROLLED.

4. DIMENSION F APPLIES BETWEEN P AND L.

DIMENSION D AND J APPLY BETWEEN L AND K

MINIMUM. LEAD DIMENSION IS UNCONTROLLED

IN P AND BEYOND DIMENSION K MINIMUM.

A

B

R

P

INCHES

DIM MIN MAX

MILLIMETERS

L

MIN

4.45

4.32

3.18

0.41

1.15

2.42

0.39

MAX

5.20

5.33

4.19

0.55

0.48

1.39

2.66

0.50

–––

F

SEATING

PLANE

A

B

C

D

F

G

H

J

0.175 0.205

0.170 0.210

0.125 0.165

0.016 0.022

0.016 0.019

0.045 0.055

0.095 0.105

0.015 0.020

K

1

2

3

D

X X

G

K

L

N

P

0.500

0.250

0.080 0.105

––– 0.100

––– 12.70

–––

J

H

V

6.35

2.04

–––

2.93

3.43

–––

2.66

2.54

–––

C

SECTION X–X

R

V

0.115

0.135

–––

1

–––

N

KC, T SUFFIX

CASE 221A-06

Plastic Package

ISSUE Y

SEATING

PLANE

–T–

C

NOTES:

T

F

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–B–

S

2. CONTROLLING DIMENSION: INCH.

INCHES

DIM MIN MAX

0.560 0.625 14.23 15.87

MILLIMETERS

MIN MAX

4

Q

A

B

C

D

F

U

0.380 0.420

0.140 0.190

0.020 0.045

0.139 0.155

0.100 BSC

9.66 10.66

1

2

3

3.56

0.51

3.53

4.82

1.14

3.93

H

L

–Y–

G

H

J

2.54 BSC

K

––– 0.280

0.012 0.045

–––

0.31

7.11

1.14

1

2

3

K

L

N

Q

R

S

0.500 0.580 12.70 14.73

R

0.045 0.070

0.200 BSC

1.15

5.08 BSC

1.77

J

0.100 0.135

2.54

2.04

0.51

5.97

0.00

3.42

2.92

1.39

6.47

1.27

G

0.080

0.115

D 3 PL

0.020 0.055

0.235 0.255

0.000 0.050

T

U

M

0.25 (0.010)

B

Y

N

13–2

MOTOROLA ANALOG IC DEVICE DATA

TH SUFFIX

CASE 314A-03

Plastic Package

ISSUE D

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

–T–

Y14.5M, 1982.

B

–P–

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 0.043 (1.092) MAXIMUM.

C

E

Q

OPTIONAL

CHAMFER

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

A

U

F

A

B

C

D

E

F

0.572 0.613 14.529 15.570

0.390 0.415 9.906 10.541

0.170 0.180 4.318 4.572

0.025 0.038 0.635 0.965

0.048 0.055 1.219 1.397

0.570 0.585 14.478 14.859

L

K

1

5

G

J

K

L

Q

S

0.067 BSC

1.702 BSC

G

0.015 0.025 0.381 0.635

0.730 0.745 18.542 18.923

0.320 0.365 8.128 9.271

0.140 0.153 3.556 3.886

0.210 0.260 5.334 6.604

0.468 0.505 11.888 12.827

5X J

S

5X D

M

0.014 (0.356)

T P

U

NOTES:

T, TV SUFFIX

CASE 314B-05

Plastic Package

ISSUE J

C

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

B

–P–

OPTIONAL

CHAMFER

Q

F

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 0.043 (1.092) MAXIMUM.

E

A

INCHES

DIM MIN MAX

A

B

C

D

E

MILLIMETERS

MIN MAX

0.613 14.529 15.570

0.415 9.906 10.541

U

L

S

V

0.572

0.390

0.170

0.025

0.048

0.850

0.067 BSC

0.166 BSC

0.015

0.900

0.320

0.320 BSC

0.140

–––

0.468

–––

0.090

W

K

0.180 4.318

0.038 0.635

0.055 1.219

4.572

0.965

1.397

F

0.935 21.590 23.749

1

G

H

J

K

L

N

Q

S

1.702 BSC

4.216 BSC

5

0.025 0.381

1.100 22.860 27.940

0.635

5X J

0.365 8.128

9.271

G

M

0.24 (0.610)

T

H

N

8.128 BSC

5X D

0.153 3.556

0.620

0.505 11.888 12.827

0.735 ––– 18.669

0.110 2.286 2.794

3.886

––– 15.748

M

0.10 (0.254)

T P

U

V

W

SEATING

PLANE

–T–

B

–Q–

SEATING

PLANE

T SUFFIX

–T–

CASE 314C–01

Plastic Package

ISSUE A

C

E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

A

K

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 10.92 (0.043) MAXIMUM.

1

2 3 4 5

INCHES

DIM MIN MAX

0.625 15.59

MILLIMETERS

L

MIN

MAX

15.88

10.67

4.83

1

A

B

C

D

E

G

J

0.610

0.380

0.160

0.020

0.035

5

0.420

0.190

0.040

0.055

9.65

4.06

0.51

0.89

1.02

1.40

0.067 BSC

1.702 BSC

0.015

0.500

0.355

0.139

0.025

––– 12.70

0.370

0.147

0.38

0.64

–––

9.40

3.73

K

L

Q

9.02

3.53

G

D 5 PL

M

0.356 (0.014)

T Q

J

13–3

MOTOROLA ANALOG IC DEVICE DATA

T, T1 SUFFIX

CASE 314D-03

Plastic Package

ISSUE D

SEATING

PLANE

–T–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

C

–Q–

B

Y14.5M, 1982.

E

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION D DOES NOT INCLUDE

INTERCONNECT BAR (DAMBAR) PROTRUSION.

DIMENSION D INCLUDING PROTRUSION SHALL

NOT EXCEED 10.92 (0.043) MAXIMUM.

U

A

S

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

L

A

B

C

D

E

G

H

J

0.572

0.390

0.170

0.025

0.048

0.613 14.529 15.570

0.415 9.906 10.541

0.180 4.318

0.038 0.635

0.055 1.219

1

2

3

4 5

K

4.572

0.965

1.397

0.067 BSC

1.702 BSC

0.087

0.015

1.020

0.320

0.140

0.105

0.543

0.112 2.210

0.025 0.381

2.845

0.635

1

2

3

4

K

L

Q

U

S

1.065 25.908 27.051

5

0.365 8.128

0.153 3.556

0.117 2.667

9.271

3.886

2.972

J

G

H

0.582 13.792 14.783

D 5 PL

M

0.356 (0.014)

T Q

DT-1 SUFFIX

CASE 369-07

Plastic Package

(DPAK)

C

B

R

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

V

ISSUE K

E

INCHES

DIM MIN MAX

MILLIMETERS

4

MIN

5.97

6.35

2.19

0.69

0.84

0.94

MAX

6.35

6.73

2.38

0.88

1.01

1.19

4

A

B

C

D

E

F

G

H

J

0.235 0.250

0.250 0.265

0.086 0.094

0.027 0.035

0.033 0.040

0.037 0.047

0.090 BSC

0.034 0.040

0.018 0.023

0.350 0.380

0.175 0.215

0.050 0.090

0.030 0.050

A

1

2

3

S

–T–

SEATING

PLANE

2.29 BSC

1

2

3

K

0.87

0.46

8.89

4.45

1.27

0.77

1.01

0.58

9.65

5.46

2.28

1.27

K

R

S

J

F

V

H

D 3 PL

G

M

0.13 (0.005)

T

DT SUFFIX

CASE 369A-13

Plastic Package

(DPAK)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

SEATING

PLANE

–T–

C

B

ISSUE Y

INCHES

DIM MIN MAX

MILLIMETERS

E

V

R

MIN

5.97

6.35

2.19

0.69

0.84

0.94

MAX

6.35

6.73

2.38

0.88

1.01

1.19

A

B

C

D

E

F

G

H

J

K

L

R

S

U

V

Z

0.235 0.250

0.250 0.265

0.086 0.094

0.027 0.035

0.033 0.040

0.037 0.047

0.180 BSC

4

Z

1

A

K

S

1

2

3

4.58 BSC

U

0.034 0.040

0.018 0.023

0.87

0.46

2.60

1.01

0.58

2.89

0.102

0.114

0.090 BSC

0.175 0.215

0.020 0.050

2.29 BSC

F

J

4.45

0.51

0.77

3.51

5.46

1.27

–––

1.27

–––

L

H

0.020

0.030 0.050

0.138 –––

–––

D 2 PL

M

G

0.13 (0.005)

T

13–4

MOTOROLA ANALOG IC DEVICE DATA

DP1, N, P, P1 SUFFIX

CASE 626-05

Plastic Package

ISSUE K

8

5

NOTES:

1. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

2. PACKAGE CONTOUR OPTIONAL (ROUND OR

SQUARE CORNERS).

–B–

1

4

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

MILLIMETERS

DIM MIN MAX

9.40 10.16 0.370 0.400

INCHES

MIN MAX

F

A

B

C

D

F

–A–

NOTE 2

6.10

3.94

0.38

1.02

6.60 0.240 0.260

4.45 0.155 0.175

0.51 0.015 0.020

1.78 0.040 0.070

L

G

H

J

K

L

2.54 BSC

0.100 BSC

1.27 0.030 0.050

0.30 0.008 0.012

8

C

0.76

0.20

2.92

1

J

3.43

0.115

0.135

–T–

SEATING

PLANE

7.62 BSC

0.300 BSC

N

M

N

–––

10

–––

10

0.76

1.01 0.030 0.040

M

D

K

G

H

M

0.13 (0.005)

T A

B

N, P, N-14, P2 SUFFIX

CASE 646-06

Plastic Package

ISSUE L

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

4. ROUNDED CORNERS OPTIONAL.

14

1

8

B

7

INCHES

DIM MIN MAX

0.770 18.16

MILLIMETERS

A

F

MIN

MAX

19.56

6.60

4.69

0.53

1.78

A

B

C

D

F

0.715

0.240

0.145

0.015

0.040

0.260

0.185

0.021

0.070

6.10

3.69

0.38

1.02

L

14

1

C

G

H

J

K

L

0.100 BSC

2.54 BSC

0.052

0.008

0.115

0.095

0.015

0.135

1.32

0.20

2.92

2.41

0.38

3.43

J

N

0.300 BSC

7.62 BSC

SEATING

PLANE

K

M

N

0

10

0.039

0

0.39

10

1.01

0.015

H

G

D

M

DP2, N, P, PC SUFFIX

CASE 648-08

Plastic Package

ISSUE R

NOTES:

–A–

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. ROUNDED CORNERS OPTIONAL.

16

1

9

8

B

S

INCHES

DIM MIN MAX

0.770 18.80

MILLIMETERS

MIN

MAX

19.55

6.85

4.44

0.53

1.77

F

A

B

C

D

F

0.740

0.250

0.145

0.015

0.040

C

L

0.270

0.175

0.021

0.70

6.35

3.69

0.39

1.02

16

1

SEATING

PLANE

–T–

G

H

J

K

L

M

S

0.100 BSC

0.050 BSC

2.54 BSC

1.27 BSC

K

M

0.008

0.015

0.130

0.305

10

0.21

0.38

3.30

7.74

10

H

J

0.110

0.295

0

2.80

7.50

0

G

D 16 PL

0.020

0.040

0.51

1.01

M

0.25 (0.010)

T A

13–5

MOTOROLA ANALOG IC DEVICE DATA

B, P, P2, V SUFFIX

CASE 648C-03

Plastic Package

(DIP–16)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

5. INTERNAL LEAD CONNECTION BETWEEN 4 AND

5, 12 AND 13.

–A–

ISSUE C

16

1

9

8

–B–

INCHES

DIM MIN MAX

0.840 18.80

MILLIMETERS

L

MIN

MAX

21.34

6.60

4.69

0.53

A

B

C

D

E

F

0.740

0.240

0.145

0.015

0.050 BSC

0.040

0.100 BSC

0.008

0.115

0.300 BSC

0

0.260

0.185

0.021

6.10

3.69

0.38

NOTE 5

16

1

1.27 BSC

C

0.70

1.02

1.78

G

J

K

L

M

N

2.54 BSC

0.015

0.135

0.20

2.92

0.38

3.43

–T–

SEATING

PLANE

M

N

7.62 BSC

K

10

0.040

0

10

E

0.015

0.39

1.01

J 16 PL

F

G

D 16 PL

M

S

0.13 (0.005)

T B

M

S

0.13 (0.005)

T A

–A–

P SUFFIX

NOTES:

CASE 648E–01

Plastic Package

(DIP–16)

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

4. DIMENSION A AND B DOES NOT INCLUDE MOLD

PROTRUSION.

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.25 (0.010).

R

16

1

9

8

ISSUE O

–B–

6. ROUNDED CORNER OPTIONAL.

M

P

L

INCHES

DIM MIN MAX

0.760 18.80

MILLIMETERS

F

MIN

MAX

19.30

6.60

4.44

0.53

1.77

A

B

C

D

F

0.740

0.245

0.145

0.015

0.050

0.260

0.175

0.021

0.070

6.23

3.69

0.39

1.27

16

J

1

C

G

H

J

K

L

M

P

0.100 BSC

0.050 BSC

2.54 BSC

1.27 BSC

0.21

3.05

7.50

0

5.08 BSC

7.62 BSC

0.39 0.88

–T–

SEATING

PLANE

0.008

0.015

0.140

0.305

10

0.38

3.55

7.74

10

S

0.120

0.295

0

K

H

G

0.200 BSC

0.300 BSC

0.015 0.035

R

S

D 13 PL

M

S

0.25 (0.010)

T B

A

P SUFFIX

CASE 649-03

Plastic Package

ISSUE D

P

A

NOTES:

1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE

POSITION AT SEATING PLANE AT MAXIMUM

MATERIAL CONDITION.

13

24

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

L

Q

B

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

1.265

0.540

0.205

0.020

0.060

1

A

B

C

D

F

31.50

13.21

4.70

0.38

1.02

32.13 1.240

13.72 0.520

5.21 0.185

0.51 0.015

1.52 0.040

12

M

J

H

F

C

G

H

J

K

L

M

N

P

2.54 BSC

0.100 BSC

1.65

0.20

2.92

14.99

–––

2.16 0.065

0.30 0.008

3.43

15.49 0.590

10 –––

0.085

0.012

0.135

0.610

10

24

N

0.115

1

K

0.51

0.13

0.51

1.02 0.020

0.38 0.005

0.76 0.020

0.040

0.015

0.030

D

G

SEATING

PLANE

Q

13–6

MOTOROLA ANALOG IC DEVICE DATA

A, B, N, P SUFFIX

CASE 707-02

Plastic Package

ISSUE C

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D),

SHALL BE WITHIN 0.25 (0.010) AT MAXIMUM

MATERIAL CONDITION, IN RELATION TO

SEATING PLANE AND EACH OTHER.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

18

10

9

B

1

3. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

A

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.915

0.260

0.180

0.022

0.070

L

A

B

C

D

F

22.22

6.10

3.56

0.36

1.27

23.24 0.875

6.60 0.240

4.57 0.140

0.56 0.014

1.78 0.050

C

18

1

G

H

J

K

L

2.54 BSC

0.100 BSC

K

N

1.02

0.20

2.92

1.52 0.040

0.30 0.008

3.43

0.060

0.012

0.135

J

M

F

D

SEATING

PLANE

0.115

H

G

7.62 BSC

0.300 BSC

M

N

0

0.51

15

0

15

0.040

1.02 0.020

P SUFFIX

CASE 710-02

Plastic Package

ISSUE B

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL

CONDITION, IN RELATION TO SEATING PLANE

AND EACH OTHER.

28

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

1

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

28

1

15

A

B

C

D

F

36.45 37.21 1.435 1.465

13.72 14.22 0.540 0.560

B

3.94

0.36

1.02

5.08 0.155 0.200

0.56 0.014 0.022

1.52 0.040 0.060

14

G

H

J

K

L

2.54 BSC

0.100 BSC

2.16 0.065 0.085

0.38 0.008 0.015

1.65

0.20

2.92

L

C

A

3.43

0.115

0.135

15.24 BSC

0.600 BSC

N

M

N

0

0.51

15

0

15

1.02 0.020 0.040

J

M

G

H

F

K

SEATING

PLANE

D

P SUFFIX

CASE 711-03

Plastic Package

ISSUE C

NOTES:

1. POSITIONAL TOLERANCE OF LEADS (D), SHALL

BE WITHIN 0.25 (0.010) AT MAXIMUM MATERIAL

CONDITION, IN RELATION TO SEATING PLANE

AND EACH OTHER.

40

1

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSION B DOES NOT INCLUDE MOLD FLASH.

40

21

20

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

B

A

B

C

D

F

51.69 52.45 2.035 2.065

13.72 14.22 0.540 0.560

3.94

0.36

1.02

5.08 0.155 0.200

0.56 0.014 0.022

1.52 0.040 0.060

1

G

H

J

K

L

2.54 BSC

0.100 BSC

2.16 0.065 0.085

0.38 0.008 0.015

L

A

1.65

0.20

2.92

C

3.43

0.115

0.135

N

15.24 BSC

0.600 BSC

M

N

0

0.51

15

0

15

J

1.02 0.020 0.040

K

SEATING

PLANE

M

H

G

F

D

13–7

MOTOROLA ANALOG IC DEVICE DATA

F, P, P-3 SUFFIX

CASE 724-03

Plastic Package

(NDIP–24)

NOTES:

1. CHAMFERED CONTOUR OPTIONAL.

2. DIMENSION L TO CENTER OF LEADS WHEN

FORMED PARALLEL.

3. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

24

ISSUE D

1

4. CONTROLLING DIMENSION: INCH.

–A–

INCHES

DIM MIN MAX

1.265 31.25

MILLIMETERS

MIN

MAX

32.13

6.85

4.44

0.51

24

1

13

12

A

B

C

D

E

F

1.230

0.250

0.145

0.015

0.050 BSC

0.040

–B–

0.270

0.175

0.020

6.35

3.69

0.38

1.27 BSC

1.02

L

C

0.060

1.52

G

J

K

L

M

N

0.100 BSC

2.54 BSC

0.007

0.110

0.012

0.140

0.18

2.80

0.30

3.55

NOTE 1

–T–

SEATING

PLANE

K

0.300 BSC

7.62 BSC

N

M

0

15

0

15

E

0.020

0.040

0.51

1.01

G

J 24 PL

F

M

0.25 (0.010)

T B

D 24 PL

M

0.25 (0.010)

T A

H, P, DP SUFFIX

CASE 738-03

Plastic Package

ISSUE E

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

–A–

4. DIMENSION B DOES NOT INCLUDE MOLD

FLASH.

20

1

11

B

INCHES

DIM MIN MAX

1.010 1.070 25.66

MILLIMETERS

10

MIN

MAX

27.17

6.60

A

B

C

D

E

F

0.240 0.260

0.150 0.180

0.015 0.022

0.050 BSC

6.10

3.81

0.39

L

4.57

0.55

C

1.27 BSC

0.050 0.070

0.100 BSC

1.27

1.77

20

G

2.54 BSC

1

J

0.008 0.015

0.21

2.80

7.62 BSC

0

0.51

0.38

3.55

K

L

M

N

0.110

0.140

–T–

SEATING

PLANE

K

M

0.300 BSC

0

15

1.01

0.020 0.040

N

E

J 20 PL

G

F

M

0.25 (0.010)

T B

D 20 PL

M

0.25 (0.010)

T A

D, D1, D2 SUFFIX

CASE 751-05

Plastic Package

(SO-8, SOP-8)

ISSUE R

NOTES:

D

A

E

1. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M, 1994.

2. DIMENSIONS ARE IN MILLIMETERS.

3. DIMENSION D AND E DO NOT INCLUDE MOLD

PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

5. DIMENSION B DOES NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 TOTAL IN EXCESS

OF THE B DIMENSION AT MAXIMUM MATERIAL

CONDITION.

C

8

1

5

4

M

0.25

B

H

MILLIMETERS

8

h X 45

B

C

DIM MIN

MAX

1.75

0.25

0.49

0.25

5.00

4.00

e

1

A

A1

B

C

D

E

1.35

0.10

0.35

0.18

4.80

3.80

A

SEATING

PLANE

e

H

h

1.27 BSC

0.10

L

5.80

0.25

0.40

0

6.20

0.50

1.25

7

A1

B

L

M

S

0.25

C B

A

13–8

MOTOROLA ANALOG IC DEVICE DATA

D SUFFIX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

CASE 751A-03

Plastic Package

(SO-14)

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

–A–

ISSUE F

14

1

8

7

–B–

P 7 PL

M

0.25 (0.010)

B

MILLIMETERS

DIM MIN MAX

INCHES

14

1

MIN

MAX

0.344

0.157

0.068

0.019

0.049

F

A

B

C

D

F

8.55

3.80

1.35

0.35

0.40

8.75 0.337

4.00 0.150

1.75 0.054

0.49 0.014

1.25 0.016

R X 45

G

C

G

J

K

M

P

1.27 BSC

0.050 BSC

–T–

SEATING

PLANE

J

M

0.19

0.10

0

0.25 0.008

0.25 0.004

0.009

7

K

D 14 PL

7

0

M

S

0.25 (0.010)

T B

A

5.80

0.25

6.20 0.228

0.50 0.010

0.244

0.019

R

–A–

D SUFFIX

NOTES:

CASE 751B-05

Plastic Package

(SO-16)

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

16

9

ISSUE J

–B–

P 8 PL

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

M

S

0.25 (0.010)

B

1

8

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL

IN EXCESS OF THE D DIMENSION AT

MAXIMUM MATERIAL CONDITION.

G

MILLIMETERS

DIM MIN MAX

9.80 10.00 0.386 0.393

INCHES

MIN MAX

16

1

A

B

C

D

F

K

3.80

1.35

0.35

0.40

4.00 0.150 0.157

1.75 0.054 0.068

0.49 0.014 0.019

1.25 0.016 0.049

R X 45

C

G

J

K

M

P

1.27 BSC

0.050 BSC

0.25 0.008 0.009

0.25 0.004 0.009

–T–

SEATING

PLANE

0.19

0.10

0

J

M

D

16 PL

7

0

7

5.80

0.25

6.20 0.229 0.244

0.50 0.010 0.019

M

S

0.25 (0.010)

T B

A

R

DW, FP SUFFIX

–A–

NOTES:

CASE 751D-04

Plastic Package

(SO-20L, SO–20)

ISSUE E

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

20

11

4. MAXIMUM MOLD PROTRUSION 0.150

(0.006) PER SIDE.

10X P

–B–

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

M

0.010 (0.25)

B

1

10

J

F

20X D

MILLIMETERS

DIM MIN MAX

12.65 12.95 0.499 0.510

INCHES

MIN MAX

M

S

0.010 (0.25) T A

B

A

B

C

D

F

20

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

1

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

C

0.25

0.10

0

SEATING

PLANE

7

0

7

–T–

10.05 10.55 0.395 0.415

18X G

R

0.25

0.75 0.010 0.029

K

M

13–9

MOTOROLA ANALOG IC DEVICE DATA

DW SUFFIX

CASE 751E-04

Plastic Package

(SO-24L,

SOP (16+4+4)L)

ISSUE E

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

24

13

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

–B– 12X P

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

M

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

12

24X D

24

J

MILLIMETERS

DIM MIN MAX

INCHES

M

S

0.010 (0.25)

T A

B

1

MIN

MAX

0.612

0.299

0.104

0.019

0.035

A

B

C

D

F

15.25

7.40

2.35

0.35

0.41

15.54 0.601

7.60 0.292

2.65 0.093

0.49 0.014

0.90 0.016

F

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.23

0.13

0

0.32 0.009

0.29 0.005

0.013

0.011

8

C

K

–T–

SEATING

8

0

M

10.05

0.25

10.55 0.395

0.75 0.010

0.415

0.029

PLANE

R

22X G

DW SUFFIX

CASE 751F-04

NOTES:

Plastic Package

(SO-28L, SOIC–28)

ISSUE E

28

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE

1

–A–

15

28

14X P

DAMBAR PROTRUSION SHALL BE 0.13

(0.005) TOTAL IN EXCESS OF D DIMENSION

AT MAXIMUM MATERIAL CONDITION.

M

0.010 (0.25)

B

–B–

1

MILLIMETERS

DIM MIN MAX

INCHES

14

MIN

MAX

0.711

0.299

0.104

0.019

0.035

M

A

B

C

D

F

17.80

7.40

2.35

0.35

0.41

18.05 0.701

7.60 0.292

2.65 0.093

0.49 0.014

0.90 0.016

28X D

R

X 45

M

S

0.010 (0.25)

T A

B

G

J

K

M

P

1.27 BSC

0.050 BSC

0.23

0.13

0

0.32 0.009

0.29 0.005

0.013

0.011

8

C

8

0

–T–

SEATING

PLANE

10.01

0.25

10.55 0.395

0.75 0.010

0.415

0.029

26X G

F

R

K

J

DW SUFFIX

CASE 751G-02

Plastic Package

(SO-16L, SOP–16L,

SOP-8+8L)

ISSUE A

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

16

9

–B–

8X P

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

M

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

8

J

16X D

16

MILLIMETERS

DIM MIN MAX

10.15 10.45 0.400

INCHES

M

S

0.010 (0.25)

T A

B

MIN

MAX

1

A

B

C

D

F

0.411

F

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

R X 45

G

J

K

M

P

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

0.25

0.10

0

C

7

0

7

–T–

M

10.05 10.55 0.395 0.415

0.25 0.75 0.010 0.029

SEATING

14X G

K

PLANE

R

13–10

MOTOROLA ANALOG IC DEVICE DATA

D SUFFIX

16

CASE 751K–01

Plastic Package

(SO–16)

NOTES:

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

–A–

ISSUE O

4

5

MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

16

9

DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

M

–B–

P

MILLIMETERS

DIM MIN MAX

INCHES

F

MIN

MAX

0.393

0.157

0.068

0.019

0.049

A

B

C

D

F

9.80

3.80

1.35

0.35

0.40

10.00 0.368

4.00 0.150

1.75 0.054

0.49 0.014

1.25 0.016

1

8

G

R ^{X 45}

G

J

K

M

P

1.27 BSC

0.050 BSC

0.19

0.10

0

0.25 0.008

0.25 0.004

7

0.009

7

C

SEATING

PLANE

–T–

0

5.80

0.25

6.20 0.229

0.50 0.010

0.244

0.019

14 X D

J

K

R

M

S

0.25 (0.010)

T A

B

–A–

DW SUFFIX

CASE 751N–01

Plastic Package

(SOP–16L)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

T

16

9

ISSUE O

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER

SIDE.

M

–B–

P

0.010 (0.25)

B

5. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN

EXCESS OF D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

1

8

16

J

F

MILLIMETERS

DIM MIN MAX

10.15 10.45 0.400

INCHES

13X D

1

MIN

MAX

A

B

C

D

F

0.411

M

S

0.010 (0.25)

T A

B

7.40

2.35

0.35

0.50

7.60 0.292 0.299

2.65 0.093 0.104

0.49 0.014 0.019

0.90 0.020 0.035

G

J

K

M

P

R

S

T

1.27 BSC

0.050 BSC

0.32 0.010 0.012

0.25 0.004 0.009

R X 45

0.25

0.10

0

7

0

7

C

10.05 10.55 0.395 0.415

0.25 0.75 0.010 0.029

2.54 BSC

3.81 BSC

–T–

SEATING

PLANE

M

S

0.100 BSC

0.150 BSC

K

9X G

13–11

MOTOROLA ANALOG IC DEVICE DATA

CASE 762-01

Plastic Medium Power Package

(SIP-9)

ISSUE C

9

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

Q

1

M

0.25 (0.010)

T A

–A–

MILLIMETERS

DIM MIN MAX

22.40 23.00 0.873 0.897

INCHES

MIN MAX

–C–

U

V

A

B

C

D

E

M

X

6.40

3.45

0.40

9.35

1.40

6.60 0.252 0.260

3.65 0.135 1.143

0.55 0.015 0.021

9.60 0.368 0.377

1.60 0.055 0.062

S

W

E

F

Y

G

H

J

2.54 BSC

0.100 BSC

1.51

1.71 0.059 0.067

0.360 0.400 0.014 0.015

R

B

N

K

M

N

Q

R

S

U

V

W

X

Y

3.95

30 BSC

2.50

3.15

13.60 13.90 0.535 0.547

1.65 1.95 0.064 0.076

22.00 22.20 0.866 0.874

0.55

2.89 BSC

4.20 0.155 0.165

30 BSC

2.70 0.099 0.106

3.45 0.124 0.135

9

1

SEATING

PLANE

–T–

K

M

0.25 (0.010)

T C

J

H

G

F

0.75 0.021 0.029

0.113 BSC

0.75 0.025 0.029

D 9 PL

0.65

2.70

M

0.25 (0.010)

T A

2.80 0.106

0.110

FN SUFFIX

CASE 775-02

Plastic Package

(PLCC-20)

NOTES:

1. DATUMS –L–, –M–, AND –N– DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS PLASTIC

BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD

FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250)

PER SIDE.

1

ISSUE C

M

S

0.007 (0.180) T L–M

N

B

4. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

M

S

N

0.007 (0.180) T L–M

Y BRK

–N–

U

6. THE PACKAGE TOP MAY BE SMALLER THAN THE

PACKAGE BOTTOM BY UP TO 0.012 (0.300).

DIMENSIONS R AND U ARE DETERMINED AT THE

OUTERMOST EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,

GATE BURRS AND INTERLEAD FLASH, BUT

INCLUDING ANY MISMATCH BETWEEN THE TOP

AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037 (0.940).

THE DAMBAR INTRUSION(S) SHALL NOT CAUSE

THE H DIMENSION TO BE SMALLER THAN 0.025

(0.635).

D

–L–

Z

–M–

W

D

20

1

S

0.010 (0.250) T L–M

N

G1

X

V

VIEW D–D

INCHES

DIM MIN MAX

MILLIMETERS

MIN

9.78

4.20

2.29

0.33

MAX

10.03

4.57

2.79

0.48

M

S

A

R

0.007 (0.180) T L–M

N

A

B

C

E

0.385

0.165

0.090

0.013

0.395

0.180

0.110

0.019

Z

M

S

0.007 (0.180) T L–M

N

F

M

S

H

0.007 (0.180) T L–M

N

G

H

J

0.050 BSC

1.27 BSC

C

0.026

0.020

0.025

0.350

0.042

–––

0.032

–––

0.356

0.048

0.056

0.020

10

0.66

0.51

0.64

8.89

1.07

–––

2

0.81

–––

9.04

1.21

1.42

0.50

10

E

0.004 (0.100)

K1

K

R

U

V

W

X

Y

Z

G

–T– ^SEATING

J

PLANE

VIEW S

M

S

0.007 (0.180) T L–M

N

G1

F

S

0.010 (0.250) T L–M

N

VIEW S

2

G1 0.310

K1 0.040

0.330

–––

7.88

1.02

8.38

–––

13–12

MOTOROLA ANALOG IC DEVICE DATA

FN SUFFIX

CASE 776-02

Plastic Package

(PLCC–28)

ISSUE D

1

M

S

0.007 (0.180)

T L–M

N

B

Z

Y BRK

D

–N–

M

S

0.007 (0.180)

T L–M

N

U

–M–

–L–

W

D

S

0.010 (0.250)

T L–M

N

X

G1

V

28

1

VIEW D–D

M

S

A

0.007 (0.180)

T L–M

N

M

S

H

0.007 (0.180)

T L–M

N

Z

M

S

T L–M

N

R

K1

C

E

0.004 (0.100)

SEATING

PLANE

G

K

–T–

VIEW S

J

M

S

0.007 (0.180)

T L–M

N

F

G1

S

0.010 (0.250)

T L–M

N

VIEW S

NOTES:

INCHES

DIM MIN MAX

MILLIMETERS

1. DATUMS –L–, –M–, AND –N– DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS

PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE

MOLD FLASH. ALLOWABLE MOLD FLASH IS

0.010 (0.250) PER SIDE.

MIN

MAX

12.57

4.57

2.79

0.48

A

B

C

E

0.485

0.165

0.090

0.013

0.495 12.32

0.180

0.110

0.019

4.20

2.29

0.33

F

G

H

J

0.050 BSC

1.27 BSC

4. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

0.026

0.020

0.025

0.450

0.042

–––

0.032

–––

0.456

0.048

0.056

0.020

10

0.66

0.51

0.64

11.43

1.07

–––

0.81

–––

11.58

1.21

1.42

0.50

10

5. CONTROLLING DIMENSION: INCH.

6. THE PACKAGE TOP MAY BE SMALLER THAN

THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR

BURRS, GATE BURRS AND INTERLEAD

FLASH, BUT INCLUDING ANY MISMATCH

BETWEEN THE TOP AND BOTTOM OF THE

PLASTIC BODY.

K

R

U

V

W

X

Y

Z

2

G1 0.410

K1 0.040

0.430 10.42

––– 1.02

10.92

–––

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037

(0.940). THE DAMBAR INTRUSION(S) SHALL

NOT CAUSE THE H DIMENSION TO BE

SMALLER THAN 0.025 (0.635).

13–13

MOTOROLA ANALOG IC DEVICE DATA

FN SUFFIX

CASE 777-02

Plastic Package

(PLCC)

M

S

0.007(0.180)

T

L–M

N

B

M

S

0.007(0.180)

T

L–M

N

U

1

ISSUE C

D

–N–

Z

Y BRK

–M–

–L–

X

G1

S

0.010 (0.25)

T

L–M

N

VIEW D–D

H

V

W

D

M

S

0.007(0.180)

T

L–M

N

44

1

M

S

A

R

0.007(0.180)

T

L–M

N

K1

Z

K

J

C

F

E

M

S

0.007(0.180)

VIEW S

T

L–M

N

0.004 (0.10)

G

SEATING

PLANE

–T–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

G1

VIEW S

A

B

C

E

0.685 0.695 17.40 17.65

S

0.010 (0.25)

T

L–M

N

0.165 0.180

0.090 0.110

0.013 0.019

0.050 BSC

4.20

2.29

0.33

4.57

2.79

0.48

NOTES:

6. THE PACKAGE TOP MAY BE SMALLER THAN

THE PACKAGE BOTTOM BY UP TO 0.012

(0.300). DIMENSIONS R AND U ARE

DETERMINED AT THE OUTERMOST

EXTREMES OF THE PLASTIC BODY

EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS,

GATE BURRS AND INTERLEAD FLASH, BUT

INCLUDING ANY MISMATCH BETWEEN THE

TOP AND BOTTOM OF THE PLASTIC BODY.

7. DIMENSION H DOES NOT INCLUDE DAMBAR

PROTRUSION OR INTRUSION. THE DAMBAR

PROTRUSION(S) SHALL NOT CAUSE THE H

DIMENSION TO BE GREATER THAN 0.037

(0.940). THE DAMBAR INTRUSION(S) SHALL

NOT CAUSE THE H DIMENSION TO BE

SMALLER THAN 0.025 (0.635).

F

1. DATUMS –L–, –M–, AND –N– ARE DETERMINED

WHERE TOP OF LEAD SHOULDER EXITS

PLASTIC BODY AT MOLD PARTING LINE.

2. DIMENSION G1, TRUE POSITION TO BE

MEASURED AT DATUM –T–, SEATING PLANE.

3. DIMENSIONS R AND U DO NOT INCLUDE MOLD

FLASH. ALLOWABLE MOLD FLASH IS 0.010

(0.25) PER SIDE.

G

H

J

1.27 BSC

0.026 0.032

0.66

0.51

0.64

0.81

–––

0.020

0.025

–––

K

R

U

V

W

X

Y

Z

0.650 0.656 16.51 16.66

0.042 0.048

0.042 0.056

––– 0.020

1.07

–––

2

1.21

1.42

0.50

10

4. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5. CONTROLLING DIMENSION: INCH.

2

10

G1 0.610 0.630 15.50 16.00

K1 0.040 ––– 1.02 –––

NOTES:

M SUFFIX

CASE 803C

PRELIMINARY

Plastic Package

6

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–A–

7

8

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION.

–F–

9

MAXIMUM MOLD PROTRUSION 0.15 (0.008) PER

SIDE.

20

1

11

10

10 DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.13 (0.006) TOTAL IN

EXCESS OF THE D DIMENSION AT MAXIMUM

MATERIAL CONDITION.

K

–B–

1

J

20

G

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.504

0.215

0.081

0.020

0.032

S 10 PL

A

B

C

D

E

F

12.35

5.10

1.95

0.35

–––

12.80 0.486

5.45 0.201

2.05 0.077

0.50 0.014

M

0.13 (0.005)

B

N

0.81

12.40*

–––

0.488*

G

H

J

K

L

M

N

S

1.15

0.59

0.18

1.10

0.05

0

1.39 0.045

0.81 0.023

0.27 0.007

1.50 0.043

0.20 0.001

0.055

0.032

0.011

0.059

0.008

10

C

0.10 (0.004)

E

L

M

10

0

D 20 PL

–T–

SEATING

PLANE

0.50

7.40

0.85 0.020

8.20 0.291

0.033

0.323

M

S

0.13 (0.005)

T B

A

*APPROXIMATE

13–14

MOTOROLA ANALOG IC DEVICE DATA

TV SUFFIX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

CASE 821C-04

Plastic Package

(15-Pin ZIP)

ISSUE D

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

15

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

6. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL

BE 0.003 (0.076) TOTAL IN EXCESS OF THE D

DIMENSION. AT MAXIMUM MATERIAL CONDITION.

SEATING

PLANE

–T–

C

E

M

B

–Q–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

–P–

U

A

B

C

D

E

0.684 0.694 17.374 17.627

0.784 0.792 19.914 20.116

0.173 0.181 4.395 4.597

0.024 0.031 0.610 0.787

0.058 0.062 1.473 1.574

Y

K

V

A

R

G

H

J

K

L

0.050 BSC

0.169 BSC

0.018 0.024 0.458 0.609

0.700 0.710 17.780 18.034

1.270 BSC

4.293 BSC

S

0.200 BSC

5.080 BSC

PIN 15

M

R

S

U

V

Y

0.148 0.151 3.760 3.835

0.416 0.426 10.567 10.820

0.157 0.167 3.988 4.242

PIN 1

H

L

G

0.105

0.868 REF

0.625 0.639 15.875 16.231

0.115 2.667 2.921

15X D

15X J

22.047 REF

S

M

Q

0.010 (0.254)

T P

0.024 (0.610)

T

T SUFFIX

CASE 821D-03

Plastic Package

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

1

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

15

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

6. DELETED

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION SHALL

BE 0.003 (0.076) TOTAL IN EXCESS OF THE D

DIMENSION. AT MAXIMUM MATERIAL CONDITION.

SEATING

PLANE

Q

–L–

–T–

C

B

E

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

–P–

U

A

B

C

D

E

F

0.681 0.694 17.298 17.627

0.784 0.792 19.914 20.116

0.173 0.181 4.395 4.597

0.024 0.031 0.610 0.787

0.058 0.062 1.473 1.574

0.016 0.023 0.407 0.584

A

R

K

G

H

J

K

Q

R

U

Y

0.050 BSC

0.110 BSC

0.018 0.024 0.458 0.609

1.078 1.086 27.382 27.584

0.148 0.151 3.760 3.835

0.416 0.426 10.567 10.820

1.270 BSC

2.794 BSC

Y

PIN 1

PIN 15

H

G

0.110 BSC

0.503 REF

2.794 BSC

12.776 REF

7X F

15X D

15X J

S

M

L

0.010 (0.254)

T P

M

0.024 (0.610)

T

13–15

MOTOROLA ANALOG IC DEVICE DATA

FTB SUFFIX

CASE 824D–01

Plastic Package

(TQFP–44)

1

ISSUE O

L

–T–, –U–, –Z–

–Z–

44

34

33

1

AE

G

AE

DETAIL AA

–T–

L

–U–

F

PLATING

BASE METAL

DETAIL AA

J

11

23

N

12

22

D

M

S

0.20 (0.008)

AC T–U

Z

A

SECTION AE–AE

M

S

0.20 (0.008)

AB T–U

Z

0.05 (0.002) T–U

S

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

M

S

0.20 (0.008)

AC T–U

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED AT

DATUM PLANE –AB–.

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

M

DETAIL AD

–AB–

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –AB–.

E

C

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL NOT

CAUSE THE D DIMENSION TO EXCEED 0.530

(0.021).

0.10 (0.004)

–AC–

H

Y

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

A

B

C

D

E

9.950 10.050 0.392 0.396

1.400 1.600 0.055 0.063

0.300 0.450 0.012 0.018

1.350 1.450 0.053 0.057

0.300 0.400 0.012 0.016

R

F

G

H

J

K

L

M

N

Q

R

S

V

W

X

Y

0.800 BSC

0.031 BSC

K

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.450 0.550 0.018 0.022

8.000 BSC

12 REF

Q

W

X

0.315 BSC

12 REF

VIEW AD

0.090 0.160 0.004 0.006

1

5

1

5

0.100 0.200 0.004 0.008

11.900 12.100 0.469 0.476

0.200 REF

1.000 REF

12 REF

0.008 REF

0.039 REF

12 REF

13–16

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 824E–02

Plastic Package

(QFP)

44

1

ISSUE A

S

–L–, –M–, –N–

M

S

0.20 (0.008)

T L–M

H L–M

N

A

M

0.05 (0.002) L–M

PIN 1

IDENT

J1

G

44

34

33

1

VIEW Y

3 PL

F

PLATING

BASE METAL

–L–

–M–

J

B1

D

M

VIEW Y

S

0.20 (0.008)

T L–M

N

SECTION J1–J1

11

23

G 40X

44 PL

12

22

–N–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –L–, –M– AND –N– TO BE DETERMINED

AT DATUM PLANE –H–.

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –T–.

M

VIEW P

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.530 (0.021).

E

DATUM

C

–H–

PLANE

0.01 (0.004)

–T–

W

Y

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.398

0.087

A

B

C

D

E

9.90

2.00

0.30

2.00

0.30

10.10 0.390

2.21 0.079

0.45 0.0118 0.0177

2.10 0.079

0.40 0.012

1

0.083

0.016

F

R R1

R R2

G

J

K

M

S

V

W

Y

A1

0.80 BSC

0.031 BSC

0.13

0.65

5

0.23 0.005

0.95 0.026

10

0.009

0.037

10

DATUM

PLANE

–H–

5

12.95

0.000

5

13.45 0.510

0.210 0.000

0.530

0.008

10

K

10

5

2

A1

0.450 REF

0.170 0.005

1.600 REF

0.130

0.300

0.300 0.005

0.018 REF

0.007

0.063 REF

B1 0.130

C1

R1

R2 0.130

1

2

C1

VIEW P

0.005

0.012

10

5

0

10

7

5

0

7

13–17

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 840F–01

Plastic Package

ISSUE O

64

1

L

–Z–

64

49

1

48

–T–, –U–, –Z–

P

AE

L

B

V

G

–U–

–T–

DETAIL AA

16

33

32

17

BASE

METAL

A

N

M

S

0.20 (0.008)

AB T–U

Z

0.050 (0.002) T–U

S

D

F

M

0.20 (0.008)

AC T–U

M

J

C

E

SECTION AE–AE

–AB–

0.10 (0.004)

–AC–

Y

H

DETAIL AD

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.396

0.063

0.011

0.057

0.009

NOTES:

A

B

C

D

E

F

9.950 10.050 0.392

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

1.400

0.170

1.350

0.170

1.600 0.055

0.270 0.007

1.450 0.053

0.230 0.007

Q

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U– AND –Z– TO BE DETERMINED

AT DATUM PLANE –AC–.

G

H

J

K

L

M

N

P

0.500 BSC

0.020 BSC

R

0.050

0.090

0.450

0.150 0.002

0.200 0.004

0.550 0.018

0.006

0.008

0.022

K

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

7.500 BSC

12° REF

0.090 0.160 0.004

0.250 BSC 0.010 BSC

0.295 BSC

12° REF

0.006

W

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25 (0.010 ) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

X

°

5

Q

R

S

V

W

X

Y

1°

0.100

5

1°

0.200 0.004

DETAIL AD

0.008

0.476

11.900 12.100 0.469

0.200 REF

1.000 REF

12 REF

0.008 REF

0.039 REF

°

12 REF

°

13–18

MOTOROLA ANALOG IC DEVICE DATA

DM SUFFIX

CASE 846A–02

Plastic Package

(Micro–8)

8

1

ISSUE C

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

–A–

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH,

PROTRUSIONS OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

–B–

K

MILLIMETERS

INCHES

PIN 1 ID

G

DIM MIN

MAX

3.10

1.10

MIN

0.114

MAX

0.122

D 8 PL

A

B

C

D

G

H

J

2.90

–––

M

S

0.08 (0.003)

T B

A

––– 0.043

0.25

0.40 0.010 0.016

0.65 BSC

0.026 BSC

0.15 0.002 0.006

0.23 0.005 0.009

5.05 0.187 0.199

0.70 0.016 0.028

0.05

0.13

4.75

0.40

SEATING

PLANE

–T–

K

L

0.038 (0.0015)

C

L

J

H

13–19

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 848B-04

Plastic Package

(TQFP–52)

1

52

ISSUE C

L

39

27

26

40

B

DETAIL A

–B–

–A–

L

–A–, –B–, –D–

DETAIL A

14

52

1

13

–D–

F

B

M

S

0.20 (0.008)

H A–B

D

0.05 (0.002) A–B

J

N

V

M

S

0.20 (0.008)

C A–B

BASE METAL

D

DETAIL C

M

C

M

S

0.02 (0.008)

C A–B

D

E

SECTION B–B

DATUM

PLANE

–H–

0.10 (0.004)

H

SEATING

PLANE

–C–

G

MILLIMETERS

DIM MIN MAX

INCHES

NOTES:

MIN

MAX

0.398

0.096

0.015

0.083

0.013

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT

DATUM PLANE –H–.

U

A

B

C

D

E

9.90

2.10

0.22

2.00

0.22

10.10 0.390

2.45 0.083

0.38 0.009

2.10 0.079

0.33 0.009

F

G

H

J

K

L

0.65 BSC

0.026 BSC

R

–––

0.13

0.65

0.25

0.23 0.005

0.95 0.026

–––

0.010

0.009

0.037

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –C–.

Q

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT.

7.80 REF

0.307 REF

M

N

Q

R

S

5

0.13

0

0.13

12.95

0.13

0

12.95

0.35

1.6 REF

10

5

10

0.007

7

0.17 0.005

7

0.30 0.005

13.45 0.510

––– 0.005

K

T

0

W

X

0.012

0.530

–––

T

U

V

W

X

–––

0

–––

DETAIL C

13.45 0.510

0.45 0.014

0.530

0.018

0.063 REF

13–20

MOTOROLA ANALOG IC DEVICE DATA

FB SUFFIX

CASE 848D–03

Plastic Package

ISSUE C

1

52

4X

4X TIPS

0.20 (0.008) H L–M N

0.20 (0.008) T L–M N

–X–

X=L, M, N

52

1

40

C

L

39

AB

G

3X VIEW Y

–L–

–M–

B1

VIEW Y

B

V

V1

BASE METAL

F

PLATING

13

14

27

26

J

U

–N–

A1

S1

D

M

S

0.13 (0.005)

T L–M

N

A

S

SECTION AB–AB

ROTATED 90 CLOCKWISE

4X θ2

4X θ3

C

0.10 (0.004) T

–H–

–T–

SEATING

PLANE

VIEW AA

MILLIMETERS

INCHES

MIN MAX

0.394 BSC

0.197 BSC

0.394 BSC

0.197 BSC

DIM MIN

MAX

10.00 BSC

5.00 BSC

A

A1

B

B1

C

C1

C2

D

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

S

0.05 (0.002)

10.00 BSC

5.00 BSC

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –L–, –M– AND –N– TO BE DETERMINED

AT DATUM PLANE –H–.

W

–––

0.05

1.30

0.20

0.45

0.22

1.70

––– 0.067

2 X R R1

0.20 0.002 0.008

1.50 0.051 0.059

0.40 0.008 0.016

0.75 0.018 0.030

0.35 0.009 0.014

θ1

E

F

0.25 (0.010)

C2

θ

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –T–.

G

0.65 BSC

0.026 BSC

GAGE PLANE

J

K

R1

S

S1

U

0.07

0.08

12.00 BSC

6.00 BSC

0.09

12.00 BSC

6.00 BSC

0.20 REF

1.00 REF

0.20 0.003 0.008

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.25 (0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE -H-.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46

(0.018). MINIMUM SPACE BETWEEN

0.50 REF

0.020 REF

0.20 0.003 0.008

K

E

0.472 BSC

0.236 BSC

0.16 0.004 0.006

C1

V

0.472 BSC

0.236 BSC

0.008 REF

0.039 REF

Z

V1

W

Z

VIEW AA

PROTRUSION AND ADJACENT LEAD OR

PROTRUSION 0.07 (0.003).

θ

0

12

5

7

0

7

–––

θ1

θ2

θ3

0

12

5

REF

13

REF

13

13–21

MOTOROLA ANALOG IC DEVICE DATA

B SUFFIX

CASE 858–01

Plastic Package

ISSUE O

42

1

NOTES:

–A–

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH. MAXIMUM MOLD FLASH 0.25 (0.010).

42

1

22

21

–B–

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

L

A

B

C

D

F

G

H

J

1.435 1.465 36.45 37.21

0.540 0.560 13.72 14.22

0.155 0.200

0.014 0.022

0.032 0.046

0.070 BSC

3.94

0.36

0.81

1.778 BSC

7.62 BSC

5.08

0.56

1.17

H

C

K

0.300 BSC

0.008 0.015

0.20

2.92

0.38

3.43

–T–

K

L

0.115

0.135

SEATING

PLANE

0.600 BSC

15.24 BSC

N

G

M

N

0

15

0

0.51

15

1.02

M

F

0.020 0.040

J 42 PL

D 42 PL

M

S

0.25 (0.010)

T B

M

S

0.25 (0.010)

T A

B SUFFIX

CASE 859–01

Plastic Package

(SDIP)

ISSUE O

56

1

–A–

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION L TO CENTER OF LEAD WHEN

FORMED PARALLEL.

56

29

28

4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH. MAXIMUM MOLD FLASH 0.25 (0.010)

–B–

INCHES

DIM MIN MAX

MILLIMETERS

1

MIN

MAX

52.45

14.22

5.08

A

B

C

D

E

2.035

0.540

0.155

0.014

2.065 51.69

0.560 13.72

0.200

0.022

L

3.94

0.36

0.56

H

C

0.035 BSC

0.89 BSC

F

0.032

0.046

0.81

1.17

G

H

J

K

L

0.070 BSC

0.300 BSC

1.778 BSC

7.62 BSC

–T–

K

0.008

0.115

0.015

0.135

0.20

2.92

0.38

3.43

SEATING

PLANE

0.600 BSC

15.24 BSC

N

G

M

F

M

N

0

15

0

0.51

15

1.02

0.020

0.040

E

J 56 PL

D 56 PL

M

S

0.25 (0.010)

T A

M

S

0.25 (0.010)

T B

13–22

MOTOROLA ANALOG IC DEVICE DATA

FB, FTB SUFFIX

CASE 873-01

Plastic Package

(TQFP–32)

1

ISSUE A

L

17

24

25

16

B

P

–B–

–A–

L

V

B

–A–, –B–, –D–

DETAIL A

32

9

1

8

F

BASE

METAL

–D–

A

M

S

0.20 (0.008)

C

A–B

D

0.05 (0.002) A–B

N

J

S

M

S

0.20 (0.008)

H A–B

D

M

S

0.20 (0.008)

C

A–B

D

DETAIL C

M

SECTION B–B

VIEW ROTATED 90 CLOCKWISE

E

C

DATUM

PLANE

–H–

–C–

SEATING

PLANE

0.01 (0.004)

M

H

G

U

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

A

B

C

D

E

F

G

H

J

K

L

M

N

P

Q

R

S

6.95

1.40

7.10 0.274 0.280

1.60 0.055 0.063

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD WHERE

THE LEAD EXITS THE PLASTIC BODY AT THE

BOTTOM OF THE PARTING LINE.

4. DATUMS –A–, –B– AND –D– TO BE DETERMINED AT

DATUM PLANE –H–.

T

0.273 0.373 0.010 0.015

1.30

0.273

0.80 BSC

–––

0.119

0.33

5.6 REF

6

0.119

0.40 BSC

5

0.15

8.85

0.15

5

8.85

1.00 REF

1.50 0.051 0.059

R

––– 0.010

–––

–H–

0.031 BSC

DATUM

PLANE

0.20

––– 0.008

0.197 0.005 0.008

0.57 0.013 0.022

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –C–.

0.220 REF

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS 0.25

(0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE DETERMINED

AT DATUM PLANE –H–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT.

K

8

6

8

Q

0.135 0.005 0.005

0.016 BSC

10

X

10

5

DETAIL C

0.25 0.006 0.010

9.15 0.348 0.360

0.25 0.006 0.010

T

U

V

X

11

9.15 0.348 0.360

0.039 REF

5

11

13–23

MOTOROLA ANALOG IC DEVICE DATA

T SUFFIX

CASE 894-03

Plastic Package

(23-Pin SZIP)

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION R DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

4. DIMENSION B DOES NOT INCLUDE MOLD FLASH

OR PROTRUSIONS.

5. MOLD FLASH OR PROTRUSIONS SHALL NOT

EXCEED 0.010 (0.250).

23

6. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.003 (0.076) TOTAL IN EXCESS OF

THE D DIMENSION AT MAXIMUM MATERIAL

CONDITION.

C

E

INCHES

DIM MIN MAX

MILLIMETERS

MIN MAX

B

L

K

Y

A

B

C

D

E

0.684

1.183

0.175

0.026

0.058

0.165

0.694 17.374 17.627

1.193 30.048 30.302

0.179

0.031

0.062

0.175

V

–N–

4.445

0.660

1.473

4.191

4.547

0.787

1.574

4.445

M

A

U

F

P

S

F

G

H

J

K

L

M

N

P

0.050 BSC

0.169 BSC

1.270 BSC

4.293 BSC

0.356 0.508

0.014

0.625

0.770

0.148

0.020

H

0.639 15.875 16.231

0.790 19.558 20.066

0.152

R

W

3.760

3.861

–T–

SEATING

PLANE

0.390 BSC

9.906 BSC

23X J

R

S

U

V

W

Y

0.416

0.157

0.105

0.868 REF

0.200 BSC

0.700

0.424 10.566 10.770

0.167

0.115

3.988

2.667

4.242

2.921

PIN 1

M

0.024 (0.610)

T

PIN 23

22.047 REF

5.080 BSC

G

0.710 17.780 18.034

23X D

M

S

0.010 (0.254)

T Q

N

13–24

MOTOROLA ANALOG IC DEVICE DATA

FTA SUFFIX

CASE 932–02

Plastic Package

(TQFP–48)

ISSUE D

1

48

P

4X

0.200 (0.008) AB T–U

Z

DETAIL Y

9

A

A1

48

37

AE

1

36

–T–

–U–

V1

B

V

B1

–T–, –U–, –Z–

12

25

DETAIL Y

13

24

–Z–

S1

M

TOP & BOTTOM

S

R

4X

GAUGE PLANE

0.200 (0.008) AC T–U

Z

0.250 (0.010)

E

C

H

0.080 (0.003) AC

G

–AB–

–AC–

W

Q

K

AD

DETAIL AD

X

BASE METAL

MILLIMETERS

DIM MIN MAX

7.000 BSC

INCHES

MIN

MAX

NOTES:

A

A1

B

0.276 BSC

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

3.500 BSC

7.000 BSC

3.500 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

0.138 BSC

0.276 BSC

0.138 BSC

N

J

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

B1

C

D

E

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

F

D

F

G

H

J

K

M

N

P

0.500 BASIC

0.020 BASIC

5. DIMENSIONS S AND V TO BE DETERMINED AT

SEATING PLANE –AC–.

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BASIC 0.010 BASIC

M

S

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B DO

INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

0.080 (0.003)

AC T–U

Z

12 REF

SECTION AE–AE

Q

R

1

5

1

5

0.150 0.250 0.006 0.010

S

9.000 BSC

4.500 BSC

9.000 BSC

4.500 BSC

0.200 REF

1.000 REF

0.354 BSC

0.177 BSC

0.354 BSC

0.177 BSC

0.008 REF

0.039 REF

S1

V

V1

W

X

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

13–25

MOTOROLA ANALOG IC DEVICE DATA

D2T SUFFIX

CASE 936–03

Plastic Package

ISSUE B

1

2

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

3

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS

A AND K.

TERMINAL 4

4. DIMENSIONS U AND V ESTABLISH A MINIMUM

MOUNTING SURFACE FOR TERMINAL 4.

5. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH OR GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.025 (0.635) MAXIMUM.

K

U

A

S

V

B

H

F

1

2

3

INCHES

DIM MIN MAX

0.403 9.804 10.236

MILLIMETERS

MIN MAX

A

B

C

D

E

F

0.386

0.356

0.170

0.026

0.045

J

D

0.368 9.042

0.180 4.318

0.036 0.660

0.055 1.143

9.347

4.572

0.914

1.397

G

M

0.010 (0.254)

T

0.051 REF

0.100 BSC

0.539 0.579 13.691 14.707

0.125 MAX

0.050 REF

1.295 REF

2.540 BSC

–T–

E

G

H

J

K

L

M

N

P

R

S

U

V

OPTIONAL

CHAMFER

3.175 MAX

1.270 REF

0.000

0.088

0.018

0.058

5

0.010 0.000

0.254

2.591

0.660

1.981

0.102 2.235

0.026 0.457

0.078 1.473

REF

5 REF

C

0.116 REF

0.200 MIN

0.250 MIN

2.946 REF

5.080 MIN

6.350 MIN

M

L

P

N

R

D2T SUFFIX

CASE 936A–02

Plastic Package

(D PAK)

1

NOTES:

2

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. TAB CONTOUR OPTIONAL WITHIN DIMENSIONS

A AND K.

5

ISSUE A

TERMINAL 6

4. DIMENSIONS U AND V ESTABLISH A MINIMUM

MOUNTING SURFACE FOR TERMINAL 6.

5. DIMENSIONS A AND B DO NOT INCLUDE MOLD

FLASH OR GATE PROTRUSIONS. MOLD FLASH

AND GATE PROTRUSIONS NOT TO EXCEED

0.025 (0.635) MAXIMUM.

U

A

V

S

K

B

H

1

2

3

4

5

INCHES

DIM MIN MAX

0.403 9.804 10.236

MILLIMETERS

MIN MAX

A

B

C

D

E

G

H

K

L

M

N

P

R

S

0.386

0.356

0.170

0.026

0.045

0.067 BSC

0.539

0.050 REF

0.000

0.088

0.018

0.058

5

0.116 REF

0.200 MIN

0.250 MIN

0.368 9.042

0.180 4.318

0.036 0.660

0.055 1.143

1.702 BSC

0.579 13.691 14.707

1.270 REF

9.347

4.572

0.914

1.397

D

M

0.010 (0.254)

T

G

–T–

E

OPTIONAL

CHAMFER

0.010 0.000

0.254

2.591

0.660

1.981

0.102 2.235

0.026 0.457

0.078 1.473

REF

5 REF

2.946 REF

5.080 MIN

6.350 MIN

U

V

C

M

L

P

N

R

13–26

MOTOROLA ANALOG IC DEVICE DATA

20

DT, DTB SUFFIX

CASE 948E–02

Plastic Package

(TSSOP–20)

ISSUE A

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

1

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

20X K REF

K

M

S

0.10 (0.004)

T U

V

S

K1

0.15 (0.006) T U

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

J J1

20

11

^2XL/2

B

SECTION N–N

L

–U–

PIN 1

IDENT

0.25 (0.010)

N

10

1

MILLIMETERS

DIM MIN MAX

INCHES

MIN

MAX

0.260

0.177

0.047

0.006

0.030

M

A

B

C

6.40

4.30

–––

6.60 0.252

4.50 0.169

1.20

S

0.15 (0.006) T U

–––

A

D

F

0.05

0.50

0.15 0.002

0.75 0.020

N

–V–

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

F

0.27

0.09

0.19

0.37

0.011

0.015

0.008

0.006

0.012

0.010

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

DETAIL E

C

6.40 BSC

0.252 BSC

M

0

8

0

8

–W–

G

D

H

0.100 (0.004)

–T– ^SEATING

DETAIL E

PLANE

DTB SUFFIX

CASE 948F–01

16

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

Plastic Package

1

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

(TSSOP–16, TSSOP–16L)

ISSUE O

16X KREF

M

S

0.10 (0.004)

T U

V

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

S

0.15 (0.006) T U

K

K1

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

16

9

2X L/2

J1

SECTION N–N

B

–U–

L

J

PIN 1

IDENT.

8

1

N

MILLIMETERS

DIM MIN MAX

INCHES

0.25 (0.010)

MIN

MAX

0.200

0.177

0.047

0.006

0.030

A

B

C

4.90

4.30

–––

5.10 0.193

4.50 0.169

1.20

S

M

0.15 (0.006) T U

A

–––

D

F

0.05

0.50

0.15 0.002

0.75 0.020

–V–

N

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.18

0.09

0.19

0.28 0.007

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

0.011

0.008

0.006

0.012

0.010

F

DETAIL E

6.40 BSC

0.252 BSC

0

C

M

0

8

0.10 (0.004)

–W–

H

SEATING

PLANE

–T–

D

G

13–27

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948G–01

Plastic Package

(TSSOP–14)

ISSUE O

14

1

NOTES:

14X K REF

1

DIMENSIONING AND TOLERANCING PER ANSI

M

S

Y14.5M, 1982.

0.10 (0.004)

T U

V

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

S

0.15 (0.006) T U

N

0.25 (0.010)

14

4

5

8

2X L/2

M

B

L

N

–U–

PIN 1

IDENT.

F

7

1

6

7

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

DETAIL E

S

K

0.15 (0.006) T U

A

MILLIMETERS

DIM MIN MAX

INCHES

MIN MAX

K1

–V–

A

B

C

4.90

4.30

–––

5.10 0.193 0.200

4.50 0.169 0.177

1.20

J J1

––– 0.047

D

F

0.05

0.50

0.15 0.002 0.006

0.75 0.020 0.030

SECTION N–N

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.60 0.020 0.024

0.20 0.004 0.008

0.16 0.004 0.006

0.30 0.007 0.012

0.25 0.007 0.010

0.50

0.09

0.19

–W–

C

6.40 BSC

0.252 BSC

0.10 (0.004)

M

0

8

0

8

SEATING

PLANE

–T–

H

G

DETAIL E

D

13–28

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948H–01

Plastic Package

ISSUE O

24

1

24X KREF

M

S

0.10 (0.004)

T U

V

S

0.15 (0.006) T U

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

24

13

2X L/2

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD FLASH,

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED

0.25 (0.010) PER SIDE.

B

–U–

L

PIN 1

IDENT.

12

1

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

S

0.15 (0.006) T U

A

–V–

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

MILLIMETERS

DIM MIN MAX

7.90 0.303

INCHES

MIN

MAX

C

A

B

7.70

4.30

–––

0.311

4.50 0.169 0.177

1.20 ––– 0.047

C

0.10 (0.004)

D

F

G

H

J

J1

K

K1

L

0.05

0.50

0.65 BSC

0.27

0.09

0.19

0.15 0.002 0.006

0.75 0.020 0.030

SEATING

PLANE

–T–

G

H

D

0.026 BSC

0.011 0.015

0.37

0.20 0.004 0.008

0.16 0.004 0.006

0.30 0.007 0.012

0.25 0.007 0.010

6.40 BSC

0.252 BSC

M

0

8

0

8

–W–

DETAIL E

N

0.25 (0.010)

K

M

K1

N

J1

F

DETAIL E

SECTION N–N

J

13–29

MOTOROLA ANALOG IC DEVICE DATA

DTB SUFFIX

CASE 948J–01

Plastic Package

(TSSOP–8)

8

1

ISSUE O

NOTES:

8x KREF

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

M

S

0.10 (0.004)

T U

V

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSION A DOES NOT INCLUDE MOLD FLASH.

PROTRUSIONS OR GATE BURRS. MOLD FLASH

OR GATE BURRS SHALL NOT EXCEED 0.15

(0.006) PER SIDE.

S

0.15 (0.006) T U

K

K1

8

5

2X L/2

4

5

DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH OR

PROTRUSION SHALL NOT EXCEED 0.25 (0.010)

PER SIDE.

DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE –W–.

J J1

B

–U–

L

PIN 1

IDENT.

SECTION N–N

4

1

N

6

7

0.25 (0.010)

S

0.15 (0.006) T U

A

M

–V–

MILLIMETERS

INCHES

DIM MIN

MAX

3.10

4.50 0.169

1.20 –––

0.15 0.002

0.75 0.020

MIN

0.114

MAX

0.122

0.177

0.047

0.006

0.030

N

A

B

C

2.90

4.30

–––

F

D

F

0.05

0.50

DETAIL E

G

H

J

J1

K

K1

L

0.65 BSC

0.026 BSC

0.50

0.09

0.19

0.60 0.020

0.20 0.004

0.16 0.004

0.30 0.007

0.25 0.007

0.024

0.008

0.006

0.012

0.010

–W–

C

0.10 (0.004)

G

SEE DETAIL E

SEATING

PLANE

–T–

D

6.40 BSC

0.252 BSC

M

0

8

0

8

H

M SUFFIX

CASE 967–01

Plastic Package

(EIAJ–20)

20

1

ISSUE O

NOTES:

1

DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2

3

CONTROLLING DIMENSION: MILLIMETER.

DIMENSIONS D AND E DO NOT INCLUDE MOLD

FLASH OR PROTRUSIONS AND ARE MEASURED

AT THE PARTING LINE. MOLD FLASH OR

PROTRUSIONS SHALL NOT EXCEED 0.15 (0.006)

PER SIDE.

L

E

20

11

Q

1

4

5

TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

H

E

M

THE LEAD WIDTH DIMENSION (b) DOES NOT

INCLUDE DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08 (0.003)

TOTAL IN EXCESS OF THE LEAD WIDTH

DIMENSION AT MAXIMUM MATERIAL CONDITION.

DAMBAR CANNOT BE LOCATED ON THE LOWER

RADIUS OR THE FOOT. MINIMUM SPACE

BETWEEN PROTRUSIONS AND ADJACENT LEAD

TO BE 0.46 ( 0.018).

L

1

10

DETAIL P

Z

D

VIEW P

MILLIMETERS

INCHES

MIN MAX

––– 0.081

e

A

DIM MIN

MAX

c

A

–––

0.05

0.35

0.18

2.05

0.20 0.002 0.008

0.50 0.014 0.020

0.27 0.007

1

b

c

0.011

D

E

e

12.35 12.80 0.486 0.504

A

b

1

5.10

5.45 0.201 0.215

1.27 BSC

0.050 BSC

8.20 0.291 0.323

0.85 0.020 0.033

1.50 0.043 0.059

M

0.10 (0.004)

0.13 (0.005)

H

7.40

0.50

1.10

0

0.70

–––

E

L

E

M

Q

10

0.90 0.028 0.035

0.81 ––– 0.032

10

0

1

Z

13–30

MOTOROLA ANALOG IC DEVICE DATA

FTB SUFFIX

CASE 976–01

Plastic Package

(TQFP–20)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

20

1

ISSUE O

4X

9

0.200 (0.008) AB T–U Z

5. DIMENSIONS S AND V TO BE DETERMINED AT

DATUM PLANE –AC–.

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B

DO INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

A

A1

DETAIL Y

20

16

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

15

1

–T–

–U–

MILLIMETERS

DIM MIN MAX

4.000 BSC

INCHES

MIN MAX

0.157 BSC

0.079 BSC

0.157 BSC

0.079 BSC

V

B

A

A1

B

2.000 BSC

4.000 BSC

2.000 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

B1

C

D

E

11

5

V1

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

F

G

H

J

K

M

N

P

0.650 BSC

0.026 BSC

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BSC 0.010 BSC

6

10

12 REF

–Z–

S1

Q

R

S

S1

V

V1

W

X

1

5

1

5

S

0.150 0.250 0.006 0.010

6.000 BSC

3.000 BSC

6.000 BSC

3.000 BSC

0.200 REF

1.000 REF

0.236 BSC

0.118 BSC

0.236 BSC

0.118 BSC

0.008 REF

0.039 REF

4X

0.200 (0.008) AB T–U Z

DETAIL AD

J

N

–AB–

–AC–

F

D

0.080 (0.003) AC

S

0.080 (0.003)

AC T–U

Z

M

SECTION AE–AE

TOP & BOTTOM

R

–T–, –U–, –Z–

C

H

E

AE

G

AE

W

K

X

GAUGE

PLANE

Q

0.250 (0.010)

DETAIL AD

DETAIL Y

13–31

MOTOROLA ANALOG IC DEVICE DATA

FTA SUFFIX

CASE 977–01

Plastic Package

ISSUE O

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

24

1

2. CONTROLLING DIMENSION: MILLIMETER.

3. DATUM PLANE –AB– IS LOCATED AT BOTTOM OF

LEAD AND IS COINCIDENT WITH THE LEAD

WHERE THE LEAD EXITS THE PLASTIC BODY AT

THE BOTTOM OF THE PARTING LINE.

4. DATUMS –T–, –U–, AND –Z– TO BE DETERMINED

AT DATUM PLANE –AB–.

4X

5. DIMENSIONS S AND V TO BE DETERMINED AT

DATUM PLANE –AC–.

9

0.200 (0.008) AB T–U Z

6. DIMENSIONS A AND B DO NOT INCLUDE MOLD

PROTRUSION. ALLOWABLE PROTRUSION IS

0.250 (0.010) PER SIDE. DIMENSIONS A AND B

DO INCLUDE MOLD MISMATCH AND ARE

DETERMINED AT DATUM PLANE –AB–.

7. DIMENSION D DOES NOT INCLUDE DAMBAR

PROTRUSION. DAMBAR PROTRUSION SHALL

NOT CAUSE THE D DIMENSION TO EXCEED

0.350 (0.014).

A

A1

24

DETAIL Y

19

8. MINIMUM SOLDER PLATE THICKNESS SHALL BE

0.0076 (0.0003).

9. EXACT SHAPE OF EACH CORNER IS OPTIONAL.

1

18

–T–

–U–

MILLIMETERS

DIM MIN MAX

4.000 BSC

INCHES

MIN MAX

0.157 BSC

0.079 BSC

0.157 BSC

0.079 BSC

A

A1

B

2.000 BSC

4.000 BSC

2.000 BSC

1.400 1.600 0.055 0.063

0.170 0.270 0.007 0.011

V

B

B1

C

D

E

B1

13

6

1.350 1.450 0.053 0.057

0.170 0.230 0.007 0.009

V1

F

G

H

J

K

M

N

P

0.500 BSC

0.020 BSC

0.050 0.150 0.002 0.006

0.090 0.200 0.004 0.008

0.500 0.700 0.020 0.028

12 REF

0.090 0.160 0.004 0.006

0.250 BSC 0.010 BSC

12 REF

7

12

Q

R

S

S1

V

V1

W

X

1

5

1

5

–Z–

S1

0.150 0.250 0.006 0.010

6.000 BSC

3.000 BSC

6.000 BSC

3.000 BSC

0.200 REF

1.000 REF

0.236 BSC

0.118 BSC

0.236 BSC

0.118 BSC

0.008 REF

0.039 REF

S

4X

0.200 (0.008) AB T–U Z

DETAIL AD

–T–, –U–, –Z–

–AB–

–AC–

AE

0.080 (0.003) AC

M

TOP & BOTTOM

P

R

G

DETAIL Y

C

E

J

N

F

W

GAUGE

Q

D

PLANE

H

K

0.250 (0.010)

X

S

0.080 (0.003)

AC T–U

Z

DETAIL AD

SECTION AE–AE

13–32

MOTOROLA ANALOG IC DEVICE DATA

N SUFFIX

CASE 1212–01

Plastic Package

(SOT–23)

1

ISSUE O

NOTES:

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCES

PER ASME Y14.5M, 1994.

A2

B

A

E

D

S

0.05

3. DATUM C IS A SEATING PLANE.

A1

MILLIMETERS

5

1

4

3

DIM MIN

MAX

0.10

1.30

0.50

0.25

3.00

3.10

1.80

L

A1

A2

B

C

D

E

E1

e

e1

L

0.00

1.00

0.30

0.10

2.80

2.50

1.50

0.95 BSC

1.90 BSC

0.20

0.45

2

E1

C

L1

B

5X

C

M

S

0.10

C B

A

e

e1

–––

0.75

L1

H SUFFIX

1

CASE 1213–01

Plastic Package

(SOT–89)

ISSUE O

NOTES:

A

D

A2

1. DIMENSIONS ARE IN MILLIMETERS.

2. INTERPRET DIMENSIONS AND TOLERANCING

PER ASME Y14.5M, 1994.

C

B

D1

3. DATUM C IS A SEATING PLANE.

MILLIMETERS

DIM MIN

MAX

1.60

0.57

0.52

0.50

4.60

1.70

4.25

2.60

E1

E

A2

B

B1

C

D

D1

E

1.40

0.37

0.32

0.30

4.40

1.50

–––

L1

B

C

M

S

0.10

C B

A

E1

e

e1

L1

2.40

1.50 BSC

3.00 BSC

0.80 –––

B1 2X

e

M

S

0.10

C B

A

e1

13–33

MOTOROLA ANALOG IC DEVICE DATA


型号：	MC13156DWR2
厂家：	MOTOROLA
描述：	RF and Baseband Circuit, Bipolar, PDSO24, PLASTIC, SO-24 无绳技术电信光电二极管电信集成电路
文件：	总57页 (文件大小：1180K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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