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70567-0043 [MOLEX]

Board Connector, 22 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle;

70567-0043


元器件型号：	70567-0043
生产厂家：	Molex Electronics Ltd.
描述和应用：	Board Connector, 22 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle PC 连接器
PDF文件：	总2页 (文件大小：340K)
下载文档：	下载PDF数据表文档文件
型号参数：70567-0043参数

70567-0105

Board Connector, 10 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle,

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0 MOLEX

70567-0110

Board Connector, 20 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle,

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0 MOLEX

70567-0120

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating

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10 MOLEX

70567-0122

Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle

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0 MOLEX

70567-0125

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

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4 MOLEX

70567-0131

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

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6 MOLEX

70567-0137

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0138

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0139

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

70567-0140

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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2 MOLEX

70567-0141

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0142

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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2 MOLEX

70567-0143

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

70567-0144

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0145

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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5 MOLEX

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