70567-0120 [MOLEX]

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating; 2.54毫米( .100“ )间距C- Grid®头,通孔无钉,双排, VerticalShrouded ,高温, 40电路,锡(Sn )镀层
70567-0120
型号: 70567-0120
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 40 Circuits, Tin (Sn) Plating
2.54毫米( .100“ )间距C- Grid®头,通孔无钉,双排, VerticalShrouded ,高温, 40电路,锡(Sn )镀层

文件: 总7页 (文件大小:1215K)
下载:  下载PDF数据表文档文件

70567-0122

Board Connector, 44 Contact(s), 2 Row(s), Male, Straight, 0.1 inch Pitch, Solder Terminal, Guide Slot, Black Insulator, Receptacle

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0 MOLEX

70567-0125

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 50 Circuits, Tin (Sn) Plating

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4 MOLEX

70567-0131

2.54mm (.100") Pitch C-Grid® Header, Through Hole without Peg, Dual Row, VerticalShrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

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6 MOLEX

70567-0137

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0138

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0139

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

70567-0140

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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2 MOLEX

70567-0141

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0142

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating,

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2 MOLEX

70567-0143

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

70567-0144

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0145

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

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5 MOLEX

70567-0146

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0147

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

70567-0148

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX