70567-0145 [MOLEX]

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating; 2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 22电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC端脚镀层
70567-0145
型号: 70567-0145
厂家: Molex Electronics Ltd.    Molex Electronics Ltd.
描述:

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54毫米( .100 )间距C- Grid®头,通孔无钉,双排,垂直,罩,高温, 22电路, 0.76μm ( 30μ ),金(Au )选择性电镀,锡(Sn ) PC端脚镀层

PC
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70567-0146

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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5 MOLEX

70567-0147

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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11 MOLEX

70567-0148

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 28 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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1 MOLEX

70567-0149

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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3 MOLEX

70567-0151

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

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2 MOLEX

70567-0152

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

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2 MOLEX

70567-0153

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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2 MOLEX

70567-0154

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

70567-0155

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 42 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0156

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76μm (30μ") Gold (Au) Selective Plating

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3 MOLEX

70567-0159

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 50 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX

70567-0160

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 52 Circuits

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2 MOLEX

70567-0161

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 54 Circuits

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2 MOLEX

70567-0162

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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4 MOLEX

70567-0163

2.54mm (.100) Pitch C-Grid® Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 58 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

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2 MOLEX