SG1731J/DESC [MICROSEMI]

Brush DC Motor Controller;
SG1731J/DESC
型号: SG1731J/DESC
厂家: Microsemi    Microsemi
描述:

Brush DC Motor Controller

电动机控制 驱动 CD
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SG1731/SG2731/SG3731  
DC MOTOR PULSE WIDTH MODULATOR  
Description  
Features  
The SG1731 is a pulse width modulator circuit designed  
specifically for DC motor control. It provides a bi-directional pulse  
train output in response to the magnitude and polarity of an  
analog error signal input. The device is useful as the control  
element in motor-driven servo systems for precision positioning  
and speed control, as well as in audio modulators and amplifiers  
using carrier frequencies to 350 kHz.  
. ±3.5 V to ±15 V Control Supply  
. ±2.5 V to ±22 V Driver Supply  
.
Dual 100 mA Source/Sink Output Drivers  
. 5 kHz to 350 kHz Oscillator Range  
. High Slew Rate Error Amplifier  
. Adjustable Deadband Operation  
.
Digital SHUTDOWN Input  
The circuit contains a triangle waveform oscillator, a wideband  
operational amplifier for error voltage generation, a summing/  
scaling network for level-shifting the triangle waveform, externally  
programmable PWM comparators and dual ±100 mA, ±22 V  
totem pole drivers with commutation diodes for full bridge output.  
A SHUTDOWN terminal forces the drivers into a floating high-  
impedance state when driven LOW. Supply voltage to the control  
circuitry and to the output drivers may be from either dual positive  
and negative supplies, or single-ended.  
High Reliability Features  
. Available to MIL-STD-883  
. Available to DSCC  
– Standard Microcircuit Drawing (SMD)  
. MSC-AMS level “S” Processing Available  
Block Diagram  
500  
Figure 1 · Block Diagram  
www.microsemi.com  
May 2015 Rev. 1.4  
1
© 2015 Microsemi Corporation  
Absolute Maximum Ratings (Note 1)  
Supply Voltage (±VS) ........................................................ ±18 V  
Output Driver Diode Current (continuous) .................... 200 mA  
Analog Inputs ......................................................................... ±VS Output Driver Diode Current (peak, 500 ns) ................. 400 mA  
Digital Inputs (SHUTDOWN) ................... -VS-0.3 V to -VS+18 V  
Output Driver Supply Voltage (±VO) ................................. ±25 V  
Source/Sink Output Current (continuous) .................... 200 mA  
Source/Sink Output Current (peak, 500 ns) ................. 400 mA  
Operating Junction Temperature  
Hermetic (J - Package) ................................................. 150°C  
Plastic (N - Package) .................................................... 150°C  
Storage Temperature Range.............................. -65°C to 150°C  
Lead Temperature (Soldering, 10 Seconds) .................... 300°C  
RoHS Peak Package Solder Reflow Temp.(40 sec. max. exp.)...... 260°C (+0, -5)  
Values beyond which damage may occur. Extended operation  
at the maximum levels may degrade performance and affect  
reliability.  
Note 1.  
Thermal Data  
J Package:  
Note A. Junction Temperature Calculation: TJ = TA + (PD x θJA).  
Note B. The above numbers for θJC are maximums for the limiting  
thermal resistance of the package in a standard mounting  
configuration. The θJA numbers are meant to be guidelines for  
the thermal performance of the device/pc-board system. All of  
the above assume no ambient airflow.  
Thermal Resistance-Junction to Case, θJC .............. 30°C/W  
Thermal Resistance-Junction to Ambient, θJA .......... 80°C/W  
N Package:  
Thermal Resistance-Junction to Case, θJC .............. 40°C/W  
Thermal Resistance-Junction to Ambient, θJA ......... 65°C/W  
L Package:  
Thermal Resistance-Junction to Case, θJC ................. 35°C/W  
Thermal Resistance-Junction to Ambient, θJA .......... 120°C/W  
Recommended Operating Conditions (Note 2)  
Supply Voltage Range (±VS)................................ ±3.5 V to ±15 V Oscillator Frequency Range .......................... 10 Hz to 350 kHz  
Error Amp Common-Mode Range ................ -VS + 3 V to VS - 3 V Oscillator Voltage (Peak-to-Peak) ............................1 V to 10 V  
Output Driver Supply Voltage Range................... ±2.5 V to ±22 V Oscillator Timing Capacitor (CT) ...................... 200 pF to 2.5 µF  
Source/Sink Output Current (continuous) ...................... 100 mA Operating Ambient Temperature Range  
Source/Sink Output Current (peak, 500 ns) ................... 200 mA  
Output Driver Diode Current (continuous) ...................... 100 mA  
Output Driver Diode Current (peak, 500 ns) ................... 200 mA  
SG1731 ......................................................... -55°C to 125°C  
SG2731 ........................................................... -25°C to 85°C  
SG3731 .............................................................. 0°C to 70°C  
Note 2. Range over which the device is functional and parameter limits are guaranteed.  
Electrical Characteristics  
(Unless otherwise specified, these specfiications apply over the operating ambient temperatures for SG1731 with -55°C TA 125°C, SG2731  
with -25°C TA 85°C, SG3731 with 0°C TA 70°C, VS = ±15 V, and VO = ±22 V. Low duty cycle pulse testing techniques are used which  
maintains junction and case temperatures equal to the ambient temperature.)  
SG1731/2731/3731  
Min. Typ. Max.  
Parameter  
Test Conditions  
Units  
Oscillator Section  
TA = 25°C  
TA = TMIN to TMAX  
VCM = ±5 V  
CT = 1000 pF, 2V∆± = ±5 V,TA = 25°C  
CT = 1000 pF, 2V∆± = ±5 V  
CT Charging Current  
450 500 550  
µA  
µA  
µA  
kHz  
%
400  
600  
-20  
2V∆± Input Bias Current  
Initial Oscillator Frequency  
Temperature Stability (Note 3)  
22.5 25.0 27.5  
10  
Error Amplifier Section (Note 5)  
Input Offset Voltage  
Input Bias Current  
10  
3
mV  
µA  
Input Offset Current  
600  
nA  
Open Loop Voltage Gain  
Output Voltage Swing  
Common-Mode Rejection Ratio  
Slew Rate (Notes 3 and 4)  
Unity Gain Bandwidth (Notes 3 and 4)  
70  
±10  
70  
5
0.7  
dB  
V
dB  
V/µs  
MHz  
RL = 2 kΩ  
RL = 2 kΩ  
TA = 25°C  
TA = 25°C  
10  
1
PWM Comparators  
Input Bias Current  
±VT= ±3 V  
6
µA  
2
Electrical Characteristics (Continued)  
SG1731/2731/3731  
Min. Typ. Max.  
Units  
Parameter  
Test Conditions  
SHUTDOWN Section  
Logic Threshold  
-VS = -3.5 V to -15 V  
VSHUTDOWN = -VS+2.4 V  
VSHUTDOWN = -VS  
VS+0.8  
VS+2.0  
400  
-1.0  
V
µA  
mA  
SHUTDOWN HIGH Current  
SHUTDOWN LOW Current  
Output Drivers (Each Output)  
HIGH Output Voltage  
ISOURCE = 20 mA  
ISOURCE = 100 mA  
ISINK = 20 mA  
ISINK = 100 mA  
19.2  
19.0  
V
V
V
V
ns  
ns  
LOW Output Voltage  
-19.2  
-19.0  
300  
Driver Risetime  
Driver Falltime  
CL  
CL  
= 1000 pF  
= 1000 pF  
300  
Total Supply Current  
VS Supply Current  
VO Supply Current  
VSHUTDOWN = -VS + 0.8 V  
VSHUTDOWN = -VS + 0.8 V  
14  
6
mA  
mA  
Note 5. VCM = ±12 V.  
Note 3. These parameters, although guaranteed, are not tested in production.  
Note 4. Unity Gain Inverting 10 kFeedback Resistance.  
Application Information  
SUPPLY VOLTAGE  
As  
a design aid, the solutions to Equation 1 over  
TheSG1731requiresasupplyvoltageforthecontrolcircuitry(VS)  
and for the power output drivers (VO). Each supply may be either  
balanced positive and negative with respect to ground, or  
single-ended. The only restrictions are:  
the recommended range of TOSC and VOSC are given in graphic  
form in Figure 1. The lower limit on TOSC is 1.85 µs,  
corresponding to a maximum frequency of 350 kHz. The  
maximum value of VOSC, (2V+) - (2V-), is 10 V peak-to-peak  
for linear waveforms.  
The voltage between +V and -V must be at least 7.0 V; but  
1.  
2.  
3.  
S
S
no more than 44 V.  
The voltage between +V and -V must be at least 5.0 V; but  
O
O
no more than 44 V.  
+V must be at least 5 V more positive than -VS. This  
O
eliminates the combination of a single-ended positive control  
supply with a single-ended negative driver supply.  
SUBSTRATE CONNECTION  
The substrate connection (Pin 10) must always be connected to  
either -VS or -VO, whichever is more negative. The substrate must  
also be well bypassed to ground with a high quality capacitor.  
1 ms 2 ms  
5 ms 10 ms 20 ms  
OSCILLATOR  
Figure 2 · SG1731 Oscillator Period VS. VOSC and CT  
ERROR AMPLIFIER  
The triangle oscillator consists of two voltage comparators, a  
set/reset flip-flop, a bi-directional 500 µA current source, and  
an external timing capacitor CT. A positive reference voltage  
(2V+) applied to Pin 2 determines the positive peak value of  
the triangle, and a negative reference voltage (2V-) at Pin 7  
sets the negative peak value of the triangle waveform.  
Since the value of the internal current source is fixed at a  
nominal ±500 µA, the oscillator period is a function of the  
selected peak-to-peak voltage excursion and the value of CT.  
The theoretical expression for the oscillator period is:  
The error amplifier of the SG1731 is a conventional internally-  
compensated operational amplifier with low output impedance.  
All of the usual feedback and frequency compensation  
techniques may be use to control the closed-loop gain  
characteristics. The control supply voltage ±VS will determine the  
input common mode range and output voltage swing; both will  
extend to within 3 V of the VS supply.  
PULSE WIDTH MODULATION  
2CT dV  
TOSC  
=
(Eq.1)  
Pulse width modulation occurs by comparing the triangle  
waveform to a fixed upper (+VT) and lower (-VT) threshold  
voltage. A crossing above the upper threshold causes  
Output A to switch to the HIGH state, and a crossing below  
5 x 10-4  
where CT is the timing capacitor in Farads and dV is VOSC in Volts  
peak-to-peak.  
3
Application Information (Continued)  
the lower threshold causes Output B to switch to the HIGH state.  
If ±VS is less than ±8 V then ±VT can be obtained with resistors  
from ±VS. If ±VS is greater than ±8 V use zeners.  
Threshold crossings are generated by shifting the triangle  
waveform up and down with the error voltage (Pin 5). A positive  
error voltage will result in a pulse width modulated output at  
Driver A (Pin 13). Similarly, a negative error voltage produces a  
pulse train at Driver B (Pin 12). Figure 2 illustrates this process  
for the case where V+ is greater than VT.  
It is important to note that the triangle shifting circuit also  
attenuates the waveform seen at CT by a factor of 2. This results  
in a waveform at the PWM comparators with a positive peak of  
V+ and a negative peak of V-, and must be taken into account  
when selecting the values for +VT and -VT.  
Figure 3 - Pulse Width Modulation with No Deadband  
Application Circuits  
+15 V  
+22 V  
9 V  
15 V  
22 V  
+10 V  
10 V  
Figure 4  
Figure 5  
A high torque position servo is obtained by buffering the output  
drivers to obtain higher output current.  
In this simple battery-powered position servo, the control supply  
and driver supply are both single-ended positive with respect to  
ground.  
4
Application Circuits (Continued)  
+10 V  
+15 V  
200 pF  
+40 V  
+22 V  
10 V  
15 V  
22 V  
22 V  
Figure 6  
Figure 7  
Bi-directional speed control results when the feedback voltage  
transducer is a tachometer.  
The two-quadrant transfer function of the SG1731 is ideal for  
pulse width modulated audio power amplifiers.  
Connection Diagrams & Ordering Information (See Notes Below)  
Ambient  
Temperature Range  
Part No.  
Connection Diagram  
Package  
16-PIN CERAMIC DIP  
J - PACKAGE  
SG1731J- 883B  
SG1731J-DESC  
SG1731J  
-55°C to 125°C  
-55°C to 125°C  
-55°C to 125°C  
+VS  
+VT  
2V+  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
SHUTDOWN  
+VO  
N. I. INPUT  
INV. INPUT  
ERROR  
CT  
OUTPUT A  
OUTPUT B  
-VO  
SUBSTRATE  
-VS  
2V-  
-VT  
16-PIN PLASTIC DIP  
N - PACKAGE  
-25°C to 85°C  
0°C to 70°C  
SG2731N  
SG3731N  
N Package: RoHS Compliant / Pb-free Transition DC: 0503  
N Package: RoHS / Pb-free 100% Matte Tin Lead Finish  
20-PIN CERAMIC  
LEADLESS CHIP CARRIER  
L- PACKAGE  
SG1731L  
SG1731L- 883B  
-55°C to 125°C  
-55°C to 125°C  
NC  
-V  
NC  
+V  
11  
12  
1
3
2
1
20 19  
S
T
2
3
4
5
SUBSTRATE  
-V  
13  
14  
2V  
Δ+  
4
5
6
18  
O
N. I. INPUT  
INV. INPUT  
17  
16  
OUTPUT B  
NC  
OUTPUT A  
15  
16  
17  
NC  
ERROR  
6
7
7
8
15  
14  
+V  
O
18  
19  
C
T
8
9
SHUTDOWN  
+V  
2V  
Δ-  
S
20  
9
10 11 12 13  
-V  
T
10  
Note 1. All packages are viewed from the top.  
Note 2. Contact factory for leadless chip carrier availability.  
Note 3. Hermetic Packages J, L use Sn63/Pb37 hot solder lead finish, Contact factory for availability of RoHS versions.  
5
Package Outline Dimensions  
Controlling dimensions are in inches, metric equivalents are shown for general information.  
MILLIMETERS  
INCHES  
MAX  
DIM  
MIN  
-
MAX  
5.08  
0.51  
1.65  
0.38  
19.94  
7.11  
MIN  
-
A
b
0.200  
0.020  
0.065  
0.015  
0.785  
0.280  
0.38  
1.04  
0.20  
19.30  
5.59  
0.015  
0.045  
0.008  
0.760  
0.220  
D
b2  
c
9
8
16  
D
E
E
1
e
2.54 BSC  
0.100 BSC  
eA  
b2  
eA  
H
L
7.37  
0.63  
3.18  
-
7.87  
1.78  
5.08  
15°  
0.290  
0.025  
0.125  
-
0.310  
0.070  
0.200  
15°  
A
Seating Plane  
L
α
θ
H
b
Q
0.51  
1.02  
0.020  
0.040  
e
Note:  
Dimensions do not include protrusions; these shall  
not exceed 0.155mm (.006”) on any side. Lead  
dimension shall not include solder coverage.  
Figure 8 · J 16-Pin Ceramic Dual Inline Package Dimensions  
MILLIMETERS  
INCHES  
MAX  
DIM  
MIN  
-
MAX  
5.33  
-
MIN  
-
A
A1  
A2  
b
0.210  
-
D
0.38  
0.015  
3.30 Typ.  
0.130 Typ.  
E1  
0.36  
1.14  
0.56  
1.78  
0.014  
0.045  
0.008  
0.735  
0.022  
0.070  
0.014  
0.775  
1
b1  
c
b1  
0.20  
0.36  
E
D
18.67  
19.69  
e
2.54 BSC  
0.100 BSC  
A2  
A
E
7.62  
6.10  
2.92  
-
8.26  
7.11  
0.381  
15°  
0.300  
0.240  
0.115  
-
0.325  
0.280  
0.150  
15°  
c
A1  
E1  
L
L
e
S
EATING PLANE  
θ
θ
b
Note:  
Dimensions do not include protrusions; these shall  
not exceed 0.155mm (.006”) on any side. Lead  
dimension shall not include solder coverage.  
Figure 9 · N 16-Pin Plastic Dual Inline Package Dimensions  
6
Package Outline Dimensions (Continued)  
E3  
D
MILLIMETERS  
INCHES  
DIM  
MIN  
8.64  
-
MAX  
9.14  
MIN  
MAX  
0.360  
0.320  
D/E  
E3  
e
0.340  
-
8.128  
E
1.270 BSC  
0.635 TYP  
0.050 BSC  
0.025 TYP  
B1  
L
1.02  
1.52  
0.040  
0.060  
0.090  
A
1.626  
2.286  
0.064  
h
1.016 TYP  
0.040 TYP  
A
L2  
L
8
A1  
A1  
A2  
L2  
B3  
1.372  
-
1.68  
1.168  
2.41  
0.054  
-
0.066  
0.046  
0.95  
3
1
1.91  
0.075  
0.203R  
0.008R  
Note:  
All exposed metalized area shall be gold plated  
60 micro-inch minimum thickness over nickel  
plated unless otherwise specified in purchase  
order.  
13  
h
18  
A2  
B3  
e
B1  
Figure 10 · L 20-Pin Ceramic LCC Package Outline Dimensions  
7
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and system solutions for communications, defense & security, aerospace and industrial  
markets. Products include high-performance and radiation-hardened analog mixed-signal  
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synchronization devices and precise time solutions, setting the world’s standard for time; voice  
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capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has  
approximately 3,400 employees globally. Learn more at www.microsemi.com.  
Microsemi Corporate Headquarters  
One Enterprise, Aliso Viejo,  
CA 92656 USA  
Microsemi makes no warranty, representation, or guarantee regarding the information contained herein or  
the suitability of its products and services for any particular purpose, nor does Microsemi assume any  
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hereunder and any other products sold by Microsemi have been subject to limited testing and should not  
be used in conjunction with mission-critical equipment or applications. Any performance specifications are  
believed to be reliable but are not verified, and Buyer must conduct and complete all performance and  
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2015 Microsemi Corporation. All  
rights reserved. Microsemi and the  
Microsemi logo are trademarks of  
Microsemi Corporation. All other  
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property of their respective owners.  
SG1731-1.4/05.15  

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