TC1174 [MICROCHIP]
300mA CMOS LDO with Shutdown and VREF Bypass; 300毫安CMOS LDO具有关断功能和VREF绕道
| 型号： | TC1174 |
| 厂家： | 
MICROCHIP |
| 描述： | 300mA CMOS LDO with Shutdown and VREF Bypass |
| 文件： | 总12页 (文件大小：445K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1174
300mA CMOS LDO with Shutdown and V
Bypass
REF
Features
General Description
• Extremely Low Supply Current (50µA, Typ.)
• Very Low Dropout Voltage
The TC1174 is an adjustable output CMOS low dropout
regulator. Total supply current is typically 50µA at full
load (20 to 60 times lower than in bipolar regulators).
• 300mA Output Current
TC1174 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 270mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. Supply current is reduced to 0.05µA (typical) and
• Adjustable Output Voltages
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package Option
V
falls to zero when the shutdown input is low.
OUT
The TC1174 incorporates both over temperature and
over current protection. The TC1174 is stable with an
output capacitor of only 1µF and has a maximum
output current of 300mA.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
8
7
6
1
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
V
V
V
V
IN
OUT
OUT
IN
+
C1
1µF
2
R1
GND
NC
SHDN
NC
470K
Device Selection Table
Shutdown
Control
(from Power
Control Logic)
3
4
NC
Output
Junction
Temp. Range
5
Part Number Voltage
(V)
Package
R2
ADJ
Bypass
C
470pF
BYPASS
470K
TC1174VOA Adjustable 8-Pin SOIC -40°C to +125°C
TC1174VUA Adjustable 8-Pin MSOP -40°C to +125°C
(Optional)
R1
R2
V
= V
x
— + 1
OUT
REF
[
]
Package Type
8-Pin MSOP
V
V
IN
1
8
OUT
2
3
7
6
GND
NC
NC
SHDN
TC1174VUA
4
5
ADJ
Bypass
8-Pin SOIC
TC1174VOA
VOUT
VIN
1
2
3
8
GND
NC
7 NC
6 SHDN
ADJ
4
5 Bypass
2002 Microchip Technology Inc.
DS21363B-page 1
TC1174
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage.................. (V – 0.3V) to (V + 0.3V)
SS
IN
Power Dissipation................Internally Limited (Note 5)
Maximum Voltage on Any Pin ........V +0.3V to -0.3V
IN
Operating Temperature Range...... -40°C < T < 125°C
J
Storage Temperature..........................-65°C to +150°C
TC1174 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: VIN = VOUT + 1V, IL = 0.1µA, CL = 3.3µF, SHDN > VIH, TA = 25°C, unless otherwise noted. Boldface
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
VIN
Input Operating Voltage
Maximum Output Current
Reference Voltage
2.7
300
1.165
—
—
—
6.0
—
V
mA
V
Note 6
IOUTMAX
VREF
1.20
40
1.235
—
∆VOUT/∆T
∆VOUT/∆VIN
∆VOUT/VOUT
VIN-VOUT
VOUT Temperature Coefficient
Line Regulation
ppm/°C Note 1
—
0.05
1.1
0.35
2.0
%
%
(VR + 1V) ≤ VIN ≤ 6V
Load Regulation
—
IL = 0.1mA to IOUTMAX (Note 2)
Dropout Voltage
—
—
—
20
80
270
30
160
480
mV
I
I
I
L = 0.1mA
L = 100mA
L = 300mA (Note 3)
ISS1
Supply Current
—
—
—
—
—
—
50
0.05
60
90
0.5
—
µA
µA
SHDN = VIH
SHDN = 0V
FRE – 1kHz
VOUT = 0V
Note 4
ISS2
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
PSRR
IOUTSC
∆VOUT/∆PD
eN
dB
550
0.04
260
650
—
mA
V/W
Output Noise
—
nV/√Hz F = 10kHz, IL = IOUTMAX
470pF from Bypass to GND
SHDN Input
VIH
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
VIL
—
15
ADJ Input
IADJ
Adjustable Input Leakage Current
—
50
—
pA
TC VOUT = (VOUTMAX – VOUTMIN) x 106
1:
VOUT x ∆T
2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
6: The minimum VIN has to justify the conditions: VIN ≥ VR + VDROPOUT and VIN ≥ 2.7V for IL = 0.1mA to IOUTMAX
.
DS21363B-page 2
2002 Microchip Technology Inc.
TC1174
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
Symbol
Description
1
2
3
4
VOUT
GND
NC
Regulated voltage output.
Ground terminal.
No connect.
ADJ
Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider from
VOUT to this input. A capacitor may also be added to this input to reduce output noise.
5
6
Bypass
SHDN
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05µA (typical).
7
8
NC
VIN
No connect.
Unregulated supply input.
2002 Microchip Technology Inc.
DS21363B-page 3
TC1174
3.1
Bypass Input
3.0
DETAILED DESCRIPTION
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
The TC1174 is an adjustable low drop-out regulator.
Unlike bipolar regulators, the TC1174’s supply current
does not increase with load current. In addition, V
OUT
remains stable and within regulation over the entire
0mA to I operating load current range, (an
OUTMAX
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
3.2
Output Capacitor
(SHDN) is at or above V , and shutdown (disabled)
A 1µF (min) capacitor from V
to ground is required.
The output capacitor should have an effective series
IH
OUT
when SHDN is at or below V . SHDN may be
IL
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05µA
resistance greater than 0.1Ω and less than 5.0Ω. A 1µF
capacitor should be connected from V to GND if there
IN
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
(typical), V
falls to zero.
OUT
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
8
7
6
1
V
V
V
IN
OUT
OUT
+
+
C1
1µF
C2
1µF
2
3
R1
GND
NC
NC
+
Battery
470K
–
Shutdown
Control
SHDN
3.3
Adjust Input
(from Power
Control Logic)
The output voltage setting is determined by the values
of R1 and R2 (Figure 3-1). The ohmic values of these
resistors should be between 470K and 3M to minimize
bleeder current.
4
5
R2
Bypass
ADJ
C
470pF
BYPASS
470K
(Optional)
The output voltage setting is calculated using the
following equation.
EQUATION 3-1:
R1
R2
V
= V
x
[
+ 1
]
OUT
REF
The voltage adjustment range of the TC1174 is from
to (V – 0.05V).
V
REF
IN
DS21363B-page 4
2002 Microchip Technology Inc.
TC1174
EQUATION 4-2:
DMAX = (TJMAX – T
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
P
)
AMAX
θ
JA
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
Where all terms are previously defined.
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.2
Power Dissipation
Given:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
V
= 3.0V + 10%
= 2.7V – 0.5%
= 250mA
INMAX
V
OUTMIN
I
LOADMAX
T
= 125°C
JMAX
EQUATION 4-1:
T
= 55°C
AMAX
8-Pin MSOP Package
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
D
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Where:
P
= Worst case actual power dissipation
D
Actual power dissipation:
= Maximum voltage on V
V
IN
INMAX
V
= Minimum regulator output voltage
= Maximum output (load) current
P
≈ (VINMAX – VOUTMIN)I
LOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10
OUTMIN
D
I
–3
LOADMAX
= 155mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(θ ). The 8-Pin SOIC package has a θ of approxi-
Maximum allowable power dissipation:
DMAX = (TJMAX – T
P
)
AMAX
θ
JA
JA
JA
= (125 – 55)
200
mately 160°C/Watt, while the 8-Pin MSOP package
has a θ of approximately 200°C/Watt.
JA
= 350mW
In this example, the TC1174 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
V
is found by substituting the maximum allowable
IN
power dissipation of 350mW into Equation 4-1, from
which VINMAX = 4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower θ and therefore
JA
increase the maximum allowable power dissipation
limit.
2002 Microchip Technology Inc.
DS21363B-page 5
TC1174
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
FREQUENCY (kHz)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100µA
= 3.3µF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
DS21363B-page 6
2002 Microchip Technology Inc.
TC1174
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
2002 Microchip Technology Inc.
DS21363B-page 7
TC1174
6.3
Package Dimensions
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
DS21363B-page 8
2002 Microchip Technology Inc.
TC1174
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
3. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002 Microchip Technology Inc.
DS21363B-page 9
TC1174
NOTES:
DS21363B-page 10
2002 Microchip Technology Inc.
TC1174
Information contained in this publication regarding device
applications and the like is intended through suggestion only
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
No representation or warranty is given and no liability is
assumed by Microchip Technology Incorporated with respect
to the accuracy or use of such information, or infringement of
patents or other intellectual property rights arising from such
use or otherwise. Use of Microchip’s products as critical com-
ponents in life support systems is not authorized except with
express written approval by Microchip. No licenses are con-
veyed, implicitly or otherwise, under any intellectual property
rights.
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© 2002, Microchip Technology Incorporated, Printed in the
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2002 Microchip Technology Inc.
DS21363B-page 11
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1 Floor, Wing A (A3/A4)
No. 11, O’Shaugnessey Road
Bangalore, 560 025, India
Tel: 91-80-2290061 Fax: 91-80-2290062
05/01/02
DS21363B-page 12
2002 Microchip Technology Inc.
相关型号：
TC1174VUAMR
Adjustable Positive LDO Regulator, 1.2V Min, 5.95V Max, 0.48V Dropout, CMOS, PDSO8
MICROCHIP
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