TC1174VUART [MICROCHIP]
ADJUSTABLE POSITIVE LDO REGULATOR, 0.48 V DROPOUT, PDSO8, MSOP-8;型号: | TC1174VUART |
厂家: | MICROCHIP |
描述: | ADJUSTABLE POSITIVE LDO REGULATOR, 0.48 V DROPOUT, PDSO8, MSOP-8 光电二极管 输出元件 调节器 |
文件: | 总8页 (文件大小:63K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TC1174
300mA Adjustable CMOS LDO with Shutdown and VREF Bypass
GENERAL DESCRIPTION
FEATURES
The TC1174 is an adjustable output CMOS low dropout
regulator. Total supply current is typically 50µA at full load
(20 to 60 times lower than in bipolar regulators!).
■ Extremely Low Supply Current (50µA, Typ.)
■ Very Low Dropout Voltage
■ Guaranteed 300mA Output
TC1174 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage (typi-
cally 240mV at full load) and internal feed-forward compen-
sation for fast response to step changes in load. Supply
current is reduced to 0.05µA (typical) and VOUT falls to zero
when the shutdown input is low. The TC1174 incorporates
both over-temperature and over-current protection. The
TC1174 is stable with an output capacitor of only 1µF and
has a maximum output current of 300mA.
■ Adjustable Output Voltage
■ Power-Saving Shutdown Mode
■ Bypass Input for Ultra-Quiet Operation
■ Over-Current and Over-Temperature Protection
■ Space-Saving MSOP Package Option
APPLICATIONS
■ Battery-Operated Systems
■ Portable Computers
■ Medical Instruments
■ Instrumentation
■ Cellular / GSM / PHS Phones
■ Linear Post-Regulator for SMPS
■ Pagers
ORDERING INFORMATION
Output
Voltage
(V)
Junction
Temperature
Range
Part
Number
Package
TC1174VOA Adjustable 8-Pin SOIC – 40 to +125°C
TC1174VUA Adjustable 8-PIn MSOP – 40 to +125°C
TYPICAL APPLICATION
PIN CONFIGURATION
8-Pin MSOP
8
7
6
1
2
1
2
3
4
8
7
6
5
VOUT
GND
NC
VIN
NC
VOUT
V
IN
V
V
IN
OUT
C1
1µF
SHDN
Bypass
TC1174VUA
ADJ
R1
NC
GND
NC
TC1174
470K
8-Pin SOIC
Shutdown
Control
(from Power
Control Logic)
3 NC
SHDN
VOUT
GND
1
2
VIN
NC
8
7
6
5
5
R2
4
Bypass
ADJ
SHDN
3 TC1174VOA
4
NC
C
BYPASS
470pF
(Optional)
470K
Bypass
ADJ
R1
V
= V
x
— + 1
OUT
REF [R2 ]
© 2001 Microchip Technology Inc. DS21363A
TC1174-2 1/25/00
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
Storage Temperature ............................ – 65°C to +150°C
Maximum Voltage on Any Pin ............ VIN +0.3V to – 0.3V
Lead Temperature (Soldering, 10 Sec.)................ +300°C
ABSOLUTE MAXIMUM RATINGS*
Input Voltage ..............................................................6.5V
Output Voltage ........................... (VSS – 0.3) to (VIN + 0.3)
Power Dissipation ....................Internally Limited (Note 7)
Operating Temperature.................... – 40°C < TJ < 125°C
*Absolute Maximum Ratings indicate device operation limits beyond dam-
age may occur. Device operation beyond the limits listed in Electrical
Characteristics is not recommended.
ELECTRICALCHARACTERISTICS:VIN=VOUT +1V,IL =0.1µA,CL =3.3µF,SHDN>VIH,TA=25°C,unlessotherwisenoted.
BOLDFACE type specifications apply for junction temperatures of
– 40°C to +125°C
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
VIN
Input Operating Voltage
Maximum Output Current
Reference Voltage
—
300
1.165
—
—
—
6.0
—
V
mA
V
IOUT
MAX
VREF
1.20
40
1.235
—
∆VOUT/∆T
∆VOUT/∆VIN
∆VOUT/VOUT
VOUT Temperature Coefficient
Line Regulation
Note 1
ppm/°C
%
(VR + 1V) < VIN < 6V
IL = 0.1mA to IOUTMAX (Note 2)
—
0.05
1.1
0.35
2.0
Load Regulation
—
%
VIN – VOUT
Dropout Voltage (Note 4)
IL = 0.1mA
IL = 100mA
IL = 300mA
—
20
80
270
30
160
480
mV
IISS1
ISS2
Supply Current
SHDN = VIH
SHDN = 0V
—
—
—
—
—
—
50
0.05
60
90
µA
µA
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
0.5
PSRR
F
RE ≤ 1kHz
dB
IOUT
VOUT = 0V
550
0.04
260
650
—
mA
SC
∆VOUT/∆PD
Note 4
V/W
nV/√Hz
eN
Output Noise
F= 10kHz, IL = IOUT
—
MAX
470pF from Bypass to GND
SHDN Input
VIH
VIL
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%VIN
%VIN
—
15
ADJ Input
IADJ
Adjust Input Leakage Current
—
50
—
pA
NOTES: 1. TC VOUT = (VOUTMAX – VOUTMIN) x 10 6
VOUT x ∆T
2. Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3. Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
4. Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load
or line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10msec.
5. The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e. TA, TJ, θJA). Exceeding the maximum allowable power dissipation causes the device to initiate
© 2001 Microchip Technology Inc. DS21363A
TC1174-2 1/25/00
2
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
DETAILED DESCRIPTION
8
7
6
1
The TC1174 is an adjustable low dropout regulator.
Unlike bipolar regulators, the TC1174 supply current does
not increase with load current. In addition, VOUT remains
stable and within regulation at very low load currents (an
important consideration in RTC and CMOS RAM battery
back-up applications). TC1174 pin functions are detailed
below:
VOUT
VOUT
GND
NC
VIN
NC
C1
1µF
C2
1µF
2
3
R1
Battery
TC1174
470K
Shutdown
SHDN
Control
(from Power
Control Logic)
4
5
R2
ADJ
Bypass
PIN DESCRIPTIONS
CBYPASS
470pF
470K
(Optional)
Pin
No. Symbol Description
1
2
3
VOUT
GND
NC
Regulated voltage output
Ground terminal
No connect
Figure 1: Typical Application Circuit
Output Capacitor
A 1µF (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series resis-
tance of 5Ω or less. A 1µF capacitor should be connected
from VIN to GND if there is more than 10 inches of wire
between the regulator and the AC filter capacitor, or if a
battery is used as the power source. Aluminum electrolytic
or tantalum capacitor types can be used. (Since many
aluminum electrolytic capacitors freeze at approximately –
30°C, solid tantalums are recommended for applications
operating below – 25°C.) When operating from sources
other than batteries, supply-noise rejection and transient
response can be improved by increasing the value of the
input and output capacitors and employing passive filtering
techniques.
4
ADJ
Output voltage adjust terminal. Output
voltage setting is programmed with a
resistor divider from VOUT to this input. A
capacitor may also be added to this input to
reduce output noise (see text).
5
6
Bypass
SHDN
Reference bypass input. Connecting a
470pF to this input further reduces output
noise.
Shutdown control input. The regulator is
fully enabled when a logic high is applied to
this input. The regulator enters shutdown
when a logic low is applied to this input.
During shutdown, output voltage falls to
zero and supply current is reduced to
0.05µA (typical).
7
8
NC
VIN
No connect
Adjust Input
The output voltage setting is determined by the values
of R1 and R2 (Figure 1). The ohmic values of these resistors
should be between 470K and 3M to minimize bleeder
current. The output voltage setting is calculated using:
Unregulated supply input
Figure 1 shows a typical application circuit. The regula-
tor is enabled any time the shutdown input (SHDN) is at or
above VIH, and shutdown (disabled) when SHDN is at or
below VIL. SHDN may be controlled by a CMOS logic gate,
or I/O port of a microcontroller. If the SHDN input is not
required, it should be connected directly to the input supply.
While in shutdown, supply current decreases to 0.05µA
(typical) and VOUT falls to zero.
R1
VOUT = VREF
x
+ 1
[R2 ] ]
Equation 1.
The voltage adjustment range of the TC1174 is from VREF
to (VIN – 0.05V).
Bypass Input
Thermal Considerations
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal reference,
which in turn significantly reduces output noise. If output
noise is not a concern, this input may be left unconnected.
Larger capacitor values may be used, but results in a longer
time period to rated output voltage when power is initially
applied.
Thermal Shutdown
Integrated thermal protection circuitry shuts the regula-
tor off when die temperature exceeds 150°C. The regulator
remains off until the die temperature drops to approximately
140°C.
© 2001 Microchip Technology Inc. DS21363A
3
TC1174-2 1/25/00
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
Power Dissipation
= 155mW
The amount of power the regulator dissipates is prima-
rilyafunctionofinputandoutputvoltage,andoutputcurrent.
Thefollowingequationisusedtocalculateworstcaseactual
power dissipation:
Maximum allowable power dissipation:
PDMAX = (TJMAX – TA
)
MAX
JA
=
=
(125 – 55)
200
350mW
PD ≈ (VINMAX – VOUT )ILOAD
MIN
MAX
Where:
PD = worst case actual power dissipation
VINMAX = maximum voltage on VIN
In this example, the TC1174 dissipates a maximum of
only 155mW; far below the allowable limit of 350mW. In a
similar manner, Equation 2 and Equation 3 can be used to
calculate maximum current and/or input voltage limits. For
example, the maximum allowable VIN is found by substitut-
ing the maximum allowable power dissipation of 350mW
into Equation 2, from which VINMAX = 4.1V.
VOUTMIN = minimum regulator output voltage
ILOADMAX = maximum output (load) current
Equation 2.
The maximum allowablepower dissipation (Equation 3)
is a function of the maximum ambient temperature (TAMAX),
the maximum allowable die temperature (125°C), and the
thermal resistance from junction-to-air (JA). The 8-Pin
Layout Considerations
SOIC package has a of approximately 160°C/Watt,
JA
The primary path of heat conduction out of the package
isviathepackageleads. Therefore, layoutshavingaground
plane, wide traces at the pads, and wide power supply bus
while the 8-Pin MSOP package has a JA of approximately
200°C/Watt; both when mounted on a single layer FR4
dielectric copper clad PC board.
lines combine to lower and, therefore, increase the
JA
maximum allowable power dissipation limit.
PDMAX = (TJMAX – TA
)
MAX
JA
Where all terms are previously defined.
Equation 3.
Equation 2 can be used in conjunction with Equation 3
to ensure regulator thermal operation is within limits. For
example:
GIVEN:
VINMAX = 3.0V + 10%
= 2.7V - 0.5%
VOUT
MIN
ILOADMAX = 250mA
TJMAX = 125°C
TA
= 55°C
MAX
8-Pin MSOP Package
FIND: 1. Actual power dissipation
2. Maximum allowable dissipation.
Actual power dissipation:
PD ≈ (VINMAX – VOUTMIN)ILOAD
MAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10-3
© 2001 Microchip Technology Inc. DS21363A
TC1174-2 1/25/00
4
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
TYPICAL CHARACTERISTICS
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1µF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
1 to 100mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 50mA
–0.002
0.20
0.00
–0.004
0.01
10
–40 –20
0
20 40 60 80 100 120
–40 –20
0.01
1
100
1000
0
20 40 60 80 100 120
FREQUENCY (KHz)
TEMPERATURE (°C)
TEMPERATURE (°C)
Supply Current
Dropout Voltage vs. Load Current
V
vs. Temperature
OUT
100.0
90.0
80.0
3.075
3.025
0.40
0.35
125°C
85°C
V
= 4V
= 100µA
IN
I
LOAD
C
= 3.3µF
LOAD
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70°C
25°C
70.0
60.0
50.0
40.0
0°C
2.975
–40°C
2.925
–40 –20
0
–40 –20
0
20 40 60 80 100 120
50
0
20 40 60 80 100 120
TEMPERATURE (°C)
150 200 250 300
100
TEMPERATURE (°C)
LOAD CURRENT (mA)
Power Supply Rejection Ratio
= 5V
–30dB
–35dB
–40dB
V
R
V
OUT
= 50Ω
= 50mV p-p
LOAD
INAC
–45dB
–50dB
–55dB
–60dB
–65dB
–70dB
–75dB
C
= 1µF
OUT
–80dB
1K
100K
1M
10
100
10K
FREQUENCY (Hz)
© 2001 Microchip Technology Inc. DS21363A
5
TC1174-2 1/25/00
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
TAPE AND REEL
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
Standard Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
User Direction of Feed
PIN 1
W
PIN 1
P
Standard Reel Component Orientation
for TR Suffix Device
Reverse Reel Component Orientation
for RT Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
© 2001 Microchip Technology Inc. DS21363A
TC1174-2 1/25/00
6
300mA Adjustable CMOS LDO
with Shutdown and VREF Bypass
TC1174
PACKAGE DIMENSIONS
8-Pin SOIC (Narrow)
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8° MAX.
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
© 2001 Microchip Technology Inc. DS21363A
7
TC1174-2 1/25/00
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All rights reserved.
©
2001 Microchip Technology Incorporated. Printed in the USA. 1/01
Printed on recycled paper.
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© 2001 Microchip Technology Inc. DS21363A
TC1174-2 1/25/00
8
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