TC1174_13 [MICROCHIP]
300mA CMOS LDO with Shutdown and VREF Bypass; 300毫安CMOS LDO具有关断功能和VREF绕道
| 型号： | TC1174_13 |
| 厂家： | 
MICROCHIP |
| 描述： | 300mA CMOS LDO with Shutdown and VREF Bypass |
| 文件： | 总14页 (文件大小：211K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TC1174
300mA CMOS LDO with Shutdown and VREF Bypass
Features
General Description
• Extremely Low Supply Current (50A, Typ.)
• Very Low Dropout Voltage
The TC1174 is an adjustable output CMOS low dropout
regulator. Total supply current is typically 50A at full
load (20 to 60 times lower than in bipolar regulators).
• 300mA Output Current
TC1174 key features include ultra low noise operation
(plus optional Bypass input); very low dropout voltage
(typically 270mV at full load) and internal feed-forward
compensation for fast response to step changes in
load. Supply current is reduced to 0.05A (typical) and
VOUT falls to zero when the shutdown input is low.
• Adjustable Output Voltages
• Power Saving Shutdown Mode
• Bypass Input for Ultra Quiet Operation
• Over Current and Over Temperature Protection
• Space-Saving MSOP Package Option
The TC1174 incorporates both over temperature and
over current protection. The TC1174 is stable with an
output capacitor of only 1F and has a maximum
output current of 300mA.
Applications
• Battery Operated Systems
• Portable Computers
• Medical Instruments
• Instrumentation
Typical Application
8
7
6
1
• Cellular/GSM/PHS Phones
• Linear Post-Regulators for SMPS
• Pagers
V
V
V
V
IN
OUT
OUT
IN
+
C1
1μF
2
R1
GND
NC
SHDN
NC
470K
Device Selection Table
Shutdown
Control
(from Power
Control Logic)
3
4
NC
Output
Junction
Temp. Range
5
Part Number Voltage
(V)
Package
R2
ADJ
Bypass
C
470pF
BYPASS
470K
TC1174VOA Adjustable 8-Pin SOIC -40°C to +125°C
TC1174VUA Adjustable 8-Pin MSOP -40°C to +125°C
(Optional)
R1
R2
V
= V
x
— + 1
OUT
REF
[
]
Package Type
8-Pin MSOP
V
V
IN
1
8
OUT
2
3
7
6
GND
NC
NC
SHDN
TC1174VUA
4
5
ADJ
Bypass
8-Pin SOIC
TC1174VOA
VOUT
VIN
1
2
3
8
GND
NC
7 NC
6 SHDN
ADJ
4
5 Bypass
2002-2012 Microchip Technology Inc.
DS21363C-page 1
TC1174
*Stresses above those listed under "Absolute Maximum
Ratings" may cause permanent damage to the device. These
are stress ratings only and functional operation of the device
at these or any other conditions above those indicated in the
operation sections of the specifications is not implied.
Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability.
1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings*
Input Voltage .........................................................6.5V
Output Voltage..................(VSS – 0.3V) to (VIN + 0.3V)
Power Dissipation................Internally Limited (Note 5)
Maximum Voltage on Any Pin ........VIN +0.3V to -0.3V
Operating Temperature Range......-40°C < TJ < 125°C
Storage Temperature..........................-65°C to +150°C
TC1174 ELECTRICAL SPECIFICATIONS
Electrical Characteristics: V = V
+ 1V, I = 0.1A, C = 3.3F, SHDN > V , T = 25°C, unless otherwise noted. Boldface
L L IH A
IN
OUT
type specifications apply for junction temperatures of -40°C to +125°C.
Symbol
Parameter
Min
Typ
Max
Units
Test Conditions
V
Input Operating Voltage
Maximum Output Current
Reference Voltage
2.7
300
1.165
—
—
—
6.0
—
V
mA
V
Note 6
IN
I
OUTMAX
V
1.20
40
1.235
—
REF
V
V
V
/T
/V
/V
V
Temperature Coefficient
ppm/°C Note 1
OUT
OUT
Line Regulation
Load Regulation
Dropout Voltage
—
0.05
1.1
0.35
2.0
%
%
(V + 1V) V 6V
R IN
OUT
IN
—
I = 0.1mA to IOUTMAX (Note 2)
L
OUT OUT
V
-V
—
—
—
20
80
270
30
160
480
mV
I = 0.1mA
L
IN OUT
I = 100mA
L
I = 300mA (Note 3)
L
I
Supply Current
—
—
—
—
—
—
50
0.05
60
90
0.5
—
A
A
SHDN = V
SS1
SS2
IH
I
Shutdown Supply Current
Power Supply Rejection Ratio
Output Short Circuit Current
Thermal Regulation
SHDN = 0V
PSRR
dB
F
–1kHz
RE
I
550
0.04
260
650
—
mA
V/W
V
= 0V
OUTSC
OUT
V
/P
Note 4
OUT
D
eN
Output Noise
—
nV/Hz F = 10kHz, I = I
L OUTMAX
470pF from Bypass to GND
SHDN Input
V
V
SHDN Input High Threshold
SHDN Input Low Threshold
45
—
—
—
%V
%V
IH
IL
IN
—
15
IN
ADJ Input
I
Adjustable Input Leakage Current
—
50
—
pA
ADJ
TC VOUT = (VOUTMAX – VOUTMIN) x 106
1:
VOUT x T
2: Regulation is measured at a constant junction temperature using low duty cycle pulse testing. Load regulation is tested over a load range
from 0.1mA to the maximum specified output current. Changes in output voltage due to heating effects are covered by the thermal
regulation specification.
3: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at a
1V differential.
4: Thermal Regulation is defined as the change in output voltage at a time T after a change in power dissipation is applied, excluding load or
line regulation effects. Specifications are for a current pulse equal to ILMAX at VIN = 6V for T = 10 msec.
5: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable junction temperature and the
thermal resistance from junction-to-air (i.e., TA, TJ, JA). Exceeding the maximum allowable power dissipation causes the device to initiate
thermal shutdown. Please see Section 4.0 Thermal Considerations for more details.
6: The minimum VIN has to justify the conditions: VIN VR + VDROPOUT and VIN 2.7V for IL = 0.1mA to IOUTMAX
.
DS21363C-page 2
2002-2012 Microchip Technology Inc.
TC1174
2.0
PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 2-1.
TABLE 2-1:
PIN FUNCTION TABLE
Pin No.
(8-Pin SOIC)
(8-Pin MSOP)
Symbol
Description
1
2
3
4
V
Regulated voltage output.
Ground terminal.
No connect.
OUT
GND
NC
ADJ
Output voltage adjust terminal. Output voltage setting is programmed with a resistor divider from
to this input. A capacitor may also be added to this input to reduce output noise.
V
OUT
5
6
Bypass
SHDN
Reference bypass input. Connecting a 470pF to this input further reduces output noise.
Shutdown control input. The regulator is fully enabled when a logic high is applied to this input.
The regulator enters shutdown when a logic low is applied to this input. During shutdown, output
voltage falls to zero and supply current is reduced to 0.05A (typical).
7
8
NC
No connect.
V
Unregulated supply input.
IN
2002-2012 Microchip Technology Inc.
DS21363C-page 3
TC1174
3.1
Bypass Input
3.0
DETAILED DESCRIPTION
A 470pF capacitor connected from the Bypass input to
ground reduces noise present on the internal
reference, which in turn significantly reduces output
noise. If output noise is not a concern, this input may be
left unconnected. Larger capacitor values may be
used, but results in a longer time period to rated output
voltage when power is initially applied.
The TC1174 is an adjustable low drop-out regulator.
Unlike bipolar regulators, the TC1174’s supply current
does not increase with load current. In addition, VOUT
remains stable and within regulation over the entire
0mA to IOUTMAX operating load current range, (an
important consideration in RTC and CMOS RAM
battery back-up applications).
Figure 3-1 shows a typical application circuit. The
regulator is enabled any time the shutdown input
(SHDN) is at or above VIH, and shutdown (disabled)
when SHDN is at or below VIL. SHDN may be
controlled by a CMOS logic gate, or I/O port of a
microcontroller. If the SHDN input is not required, it
should be connected directly to the input supply. While
in shutdown, supply current decreases to 0.05A
(typical), VOUT falls to zero.
3.2
Output Capacitor
A 1F (min) capacitor from VOUT to ground is required.
The output capacitor should have an effective series
resistance greater than 0.1 and less than 5.0. A 1F
capacitor should be connected from VIN to GND if there
is more than 10 inches of wire between the regulator
and the AC filter capacitor, or if a battery is used as the
power source. Aluminum electrolytic or tantalum
capacitor types can be used. (Since many aluminum
electrolytic capacitors freeze at approximately -30°C,
solid tantalums are recommended for applications
operating below -25°C.) When operating from sources
other than batteries, supply-noise rejection and
transient response can be improved by increasing the
value of the input and output capacitors and employing
passive filtering techniques.
FIGURE 3-1:
TYPICAL APPLICATION
CIRCUIT
8
1
V
V
V
IN
OUT
OUT
+
+
C1
C2
1μF
1μF
7
6
2
3
R1
GND
NC
NC
+
–
Battery
470K
Shutdown
Control
SHDN
3.3
Adjust Input
(from Power
Control Logic)
The output voltage setting is determined by the values
of R1 and R2 (Figure 3-1). The ohmic values of these
resistors should be between 470K and 3M to minimize
bleeder current.
4
5
R2
Bypass
ADJ
C
470pF
BYPASS
470K
(Optional)
The output voltage setting is calculated using the
following equation.
EQUATION 3-1:
R1
R2
VOUT = VREF
x
[
+ 1
]
The voltage adjustment range of the TC1174 is from
VREF to (VIN – 0.05V).
DS21363C-page 4
2002-2012 Microchip Technology Inc.
TC1174
EQUATION 4-2:
PDMAX = (TJMAX – TAMAX
4.0
4.1
THERMAL CONSIDERATIONS
Thermal Shutdown
)
JA
Integrated thermal protection circuitry shuts the
regulator off when die temperature exceeds 150°C.
The regulator remains off until the die temperature
drops to approximately 140°C.
Where all terms are previously defined.
Equation 4-1 can be used in conjunction with Equation
4-2 to ensure regulator thermal operation is within
limits. For example:
4.2
Power Dissipation
Given:
The amount of power the regulator dissipates is
primarily a function of input and output voltage, and
output current. The following equation is used to
calculate worst case actual power dissipation:
VINMAX
= 3.0V + 10%
VOUTMIN = 2.7V – 0.5%
ILOADMAX = 250mA
TJMAX
TAMAX
= 125°C
= 55°C
EQUATION 4-1:
8-Pin MSOP Package
PD (VINMAX – VOUTMIN)ILOADMAX
Find: 1. Actual power dissipation
2. Maximum allowable dissipation
Where:
PD = Worst case actual power dissipation
VINMAX
Actual power dissipation:
= Maximum voltage on VIN
VOUTMIN = Minimum regulator output voltage
ILOADMAX = Maximum output (load) current
PD (VINMAX – VOUTMIN)ILOADMAX
= [(3.0 x 1.1) – (2.7 x .995)]250 x 10–3
= 155mW
The maximum allowable power dissipation (Equation
4-2) is a function of the maximum ambient temperature
(TAMAX), the maximum allowable die temperature
(TJMAX) and the thermal resistance from junction-to-air
(JA). The 8-Pin SOIC package has a JA of approxi-
mately 160°C/Watt, while the 8-Pin MSOP package
has a JA of approximately 200°C/Watt.
Maximum allowable power dissipation:
PDMAX = (TJMAX – TAMAX
)
JA
= (125 – 55)
200
= 350mW
In this example, the TC1174 dissipates a maximum of
155mW; below the allowable limit of 350mW. In a
similar manner, Equation 4-1 and Equation 4-2 can be
used to calculate maximum current and/or input
voltage limits. For example, the maximum allowable
VIN is found by substituting the maximum allowable
power dissipation of 350mW into Equation 4-1, from
which VINMAX = 4.1V.
4.3
Layout Considerations
The primary path of heat conduction out of the package
is via the package leads. Therefore, layouts having a
ground plane, wide traces at the pads, and wide power
supply bus lines combine to lower JA and therefore
increase the maximum allowable power dissipation
limit.
2002-2012 Microchip Technology Inc.
DS21363C-page 5
TC1174
5.0
TYPICAL CHARACTERISTICS
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein are
not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
Load Regulation
Line Regulation
Output Noise
2.00
1.80
0.012
0.010
10.0
1.0
R
C
= 50Ω
= 1μF
LOAD
OUT
1.60
1.40
1.20
1 to 300mA
0.008
0.006
1.00
0.80
0.60
0.40
0.004
0.002
0.000
0.1
0.0
1 to 100mA
1 to 50mA
-0.002
0.20
0.00
-0.004
0.01
10
-40° -20° 0° 20° 40° 60° 80° 100° 120°
-40° -20°
0.01
1
100
1000
0° 20° 40° 60° 80° 100° 120°
FREQUENCY (kHz)
TEMPERATURE ( C)
°
TEMPERATURE (°C)
Supply Current
V
vs. Temperature
OUT
100.0
90.0
80.0
0.40
0.35
3.075
3.025
125C
85C
V
= 4V
LOAD
LOAD
IN
I
= 100μA
= 3.3μF
C
0.30
0.25
0.20
0.15
0.10
0.05
0.00
70C
25C
70.0
60.0
50.0
40.0
0C
2.975
-40C
2.925
-40° -20°
0
-40° -20°
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
50
0° 20° 40° 60° 80° 100° 120°
TEMPERATURE (°C)
100
150 200 250 300
LOAD CURRENT (mA)
DS21363C-page 6
2002-2012 Microchip Technology Inc.
TC1174
6.0
6.1
PACKAGING INFORMATION
Package Marking Information
Package marking data not available at this time.
6.2
Taping Form
Component Taping Orientation for 8-Pin MSOP Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin MSOP
12 mm
8 mm
2500
13 in
Component Taping Orientation for 8-Pin SOIC (Narrow) Devices
User Direction of Feed
PIN 1
W
P
Standard Reel Component Orientation
for TR Suffix Device
Carrier Tape, Number of Components Per Reel and Reel Size
Package
Carrier Width (W)
Pitch (P)
Part Per Full Reel
Reel Size
8-Pin SOIC (N)
12 mm
8 mm
2500
13 in
2002-2012 Microchip Technology Inc.
DS21363C-page 7
TC1174
6.3
Package Dimensions
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin MSOP
PIN 1
.197 (5.00)
.189 (4.80)
.122 (3.10)
.114 (2.90)
.026 (0.65) TYP.
.122 (3.10)
.114 (2.90)
.043 (1.10)
MAX.
.008 (0.20)
.005 (0.13)
6° MAX.
.016 (0.40)
.010 (0.25)
.006 (0.15)
.002 (0.05)
.028 (0.70)
.016 (0.40)
Dimensions: inches (mm)
DS21363C-page 8
2002-2012 Microchip Technology Inc.
TC1174
Note: For the most current package drawings, please see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
8-Pin SOIC
PIN 1
.157 (3.99)
.150 (3.81)
.244 (6.20)
.228 (5.79)
.050 (1.27) TYP.
.197 (5.00)
.189 (4.80)
.069 (1.75)
.053 (1.35)
.010 (0.25)
.007 (0.18)
8
.020 (0.51)
.013 (0.33)
.010 (0.25)
.004 (0.10)
.050 (1.27)
.016 (0.40)
Dimensions: inches (mm)
2002-2012 Microchip Technology Inc.
DS21363C-page 9
TC1174
REVISION HISTORY
Revision C (November 2012)
Added a note to each package outline drawing.
DS21363C-page 10
2002-2012 Microchip Technology Inc.
TC1174
SALES AND SUPPORT
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1. Your local Microchip sales office
2. The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
2002-2012 Microchip Technology Inc.
DS21363C-page11
TC1174
NOTES:
DS21363C-page12
2002-2012 Microchip Technology Inc.
Note the following details of the code protection feature on Microchip devices:
•
Microchip products meet the specification contained in their particular Microchip Data Sheet.
•
Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
•
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
•
•
Microchip is willing to work with the customer who is concerned about the integrity of their code.
Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights.
Trademarks
The Microchip name and logo, the Microchip logo, dsPIC,
FlashFlex, KEELOQ, KEELOQ logo, MPLAB, PIC, PICmicro,
PICSTART, PIC logo, rfPIC, SST, SST Logo, SuperFlash
and UNI/O are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
32
FilterLab, Hampshire, HI-TECH C, Linear Active Thermistor,
MTP, SEEVAL and The Embedded Control Solutions
Company are registered trademarks of Microchip Technology
Incorporated in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
Analog-for-the-Digital Age, Application Maestro, BodyCom,
chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, dsPICworks, dsSPEAK, ECAN,
ECONOMONITOR, FanSense, HI-TIDE, In-Circuit Serial
Programming, ICSP, Mindi, MiWi, MPASM, MPF, MPLAB
Certified logo, MPLIB, MPLINK, mTouch, Omniscient Code
Generation, PICC, PICC-18, PICDEM, PICDEM.net, PICkit,
PICtail, REAL ICE, rfLAB, Select Mode, SQI, Serial Quad I/O,
Total Endurance, TSHARC, UniWinDriver, WiperLock, ZENA
and Z-Scale are trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
GestIC and ULPP are registered trademarks of Microchip
Technology Germany II GmbH & Co. & KG, a subsidiary of
Microchip Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2002-2012, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
Printed on recycled paper.
ISBN: 9781620767344
QUALITY MANAGEMENT SYSTEM
CERTIFIED BY DNV
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
== ISO/TS 16949 ==
2002-2012 Microchip Technology Inc.
DS21363C-page 13
Worldwide Sales and Service
AMERICAS
ASIA/PACIFIC
ASIA/PACIFIC
EUROPE
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2401-1200
Fax: 852-2401-3431
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
India - Pune
Tel: 91-20-2566-1512
Fax: 91-20-2566-1513
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
Web Address:
www.microchip.com
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Japan - Osaka
Tel: 81-66-152-7160
Fax: 81-66-152-9310
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Japan - Yokohama
Tel: 81-45-471- 6166
Fax: 81-45-471-6122
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Korea - Seoul
China - Hangzhou
Tel: 86-571-2819-3187
Fax: 86-571-2819-3189
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
UK - Wokingham
Tel: 44-118-921-5869
Fax: 44-118-921-5820
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
China - Hong Kong SAR
Tel: 852-2401-1200
Fax: 852-2401-3431
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Detroit
Farmington Hills, MI
Tel: 248-538-2250
Fax: 248-538-2260
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Los Angeles
China - Shenzhen
Tel: 86-755-8203-2660
Fax: 86-755-8203-1760
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Fax: 886-7-330-9305
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Santa Clara
Santa Clara, CA
Tel: 408-961-6444
Fax: 408-961-6445
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
Toronto
Mississauga, Ontario,
Canada
China - Xiamen
Tel: 905-673-0699
Fax: 905-673-6509
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
10/26/12
DS21363C-page 14
2002-2012 Microchip Technology Inc.
相关型号：
TC1185-2.6VCT
2.6 V FIXED POSITIVE LDO REGULATOR, 0.4 V DROPOUT, PDSO5, SC-74A, SOT-23A, 5 PIN
MICROCHIP
©2020 ICPDF网 联系我们和版权申明