AT73C246-B [MICROCHIP]
Power Supply Support Circuit, Fixed, 6 Channel, 7.50 X 7.50 MM, 0.90 MM HEIGHT, GREEN, MO-220, QFN-64;型号: | AT73C246-B |
厂家: | MICROCHIP |
描述: | Power Supply Support Circuit, Fixed, 6 Channel, 7.50 X 7.50 MM, 0.90 MM HEIGHT, GREEN, MO-220, QFN-64 |
文件: | 总159页 (文件大小:11597K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Features
• AUDIO CODEC
– 100dB Dynamic Range Stereo Audio DAC - 8 to 96 kHz sampling frequency
– 96dB Dynamic Range Stereo Audio ADC - 8 to 96 kHz sampling frequency
– 16 / 32 Ohms headset amplifier with capless operation
• SNR: 97 dB A-Weighted
• THD: -60 dB (16Ohms / 20mW / 3.3V supply)
• Maximum output power: 55mW (16Ohms / 3.3V supply)
– Stereo line inputs, stereo auxiliary inputs
– Stereo microphone inputs with bias generator for electret device
– Low power Analog Bypass mode (Line / Aux in to Headset Out)
– Low power Analog sidetone mode (Microphone in to Headset Out)
– Automatic Audio path control with smooth fade in / fade out operation
– I2S port
Power
Management
and Analog
Companions
(PMAAC)
• Master / Slave Operation
• I2S / Left / Right justified modes
• 16 / 18 / 20 / 24 bit operation
• 6x SUPPLY CHANNEL VOLTAGE REGULATORS
– DCDC0:
• 1.85V - 600mA. 0.8 to 3.6V / 50mV step.
AT73C246
6 Supply
• 2 MHz switching buck regulator
• Fast load transient response - PWM / PFM modes.
• Efficiency up to 92%
– DCDC1:
Channel PMU
With Audio
Codec
• 1.2V - 600mA. 0.8 to 3.6V / 50mV step.
• 2 MHz switching buck regulator
• Fast load transient response - PWM / PFM modes.
• Efficiency up to 90%
– LDO2: 1V - 300mA. 0.8 to 1.35V / 50mV step - Fast transient response
– LDO3: 3.3V - 200mA. 2.7 to 3.6V / 50mV step - Fast transient response
– LDO4: 3.3V - 200mA. 2.7 to 3.6V / 50mV step - Audio codec supply
– LDO5: 2.5V - 10mA - Backup battery charger and RTC supply
• LOW CONSUMPTION POWER MANAGER
– 2.5V - 5.5V VIN Operation
– 20uA typical consumption OFF mode
– VIN monitor, CPU supplies monitor
– Die temperatue and over-current protections
– Reset and Interrupt generation
– Automatic Voltage Ramping on supply channels for DVS applications
– Standby mode with selectable supplies OFF
• RTC
– Ultra Low power crystal oscillator (<1uA typ.)
– Wake up function with programmable alarm or selectable inputs
• 10-b / 300kS/s ADC with 4 external / 6 int\ernal selectable inputs
• Two-Wire Interface for PMU and Audio controls
• Available in 7.5 x 7.5 x 0.9 mm 64-pin QFN Package
• Applications: Multimedia, Audio + Supply solution for MPU+DDR2 designs.
11050A–PMAAC–07-Apr-10
1. Description
The AT73C246 is an integrated high performance Power Management and Audio IC. It is specif-
ically designed for advanced technology application processors with complex and low voltage
supplies targeting audio applications from low to high end. This System-on-Chip allows signifi-
cant savings in both cost and board area over previous discrete solutions.
Directly operated from a 2.9V to 5.5V input voltage, the PMU generates a set of 4 regulated
power supplies and an associated delayed reset signal. These 4 voltages are built up with 2 high
efficiency DCDC buck converters and 2 low noise LDOs. Featuring ultra fast transient responses
and integrating automatic voltage scaling function, these supplies perfectly fit with modern low
voltage MCU cores and memory supplies (DDR, Flash, ...). An additional 200mA LDO under
software control is provided for auxiliary application functions. The high performances of this
LDO (high PSRR, low noise, fast transient response) makes it ideal for analog front-ends (Audio,
RF...) as well digital peripherals.
Aside from the PMU, the AT73C246 integrates a complete state-of-the art low power audio
codec with headphone amplifier. On the input side, a stereo microphone preamplifier with differ-
ential or single ended connection (MICDIFF / MIC) and 2 selectable stereo inputs (LINE / AUX)
are directed to a 96dB Dynamic Range stereo audio ADC through an input mixer. On the output
side a 100dB dynamic range stereo audio DAC drives, through an output mixer, a 60 mW stereo
headphone amplifier which comes along with a VCM buffer. This VCM buffer allows to save two
large on-board coupling capacitors for area constrained applications. Additionally two fully ana-
log paths called bypass and sidetone from line / aux and microphone inputs to headphone
outputs allow to reduce the audio power consumption to minimum when needed.
The PMU is complemented with a low power RTC system including a recharging LDO, a crystal
oscillator and a programmable alarm that is fully integrated in the PMU digital core. Thus, the
RTC function is able to wake up the PMU, i.e the regulated power supplies, at a programmed
instant.
Also, a 10-bit ADC equipped with a 10:1 analog multiplexer is provided to the application to per-
form voltage measurements.
Finally, to reduce power consumption to minimum, the PMU features a flexible STANDBY mode
where the MCU is placed in reset state with selectable supplies ON, OFF or in low-power mode.
Power consumption in OFF mode is typically 20uA.
2
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
2. Block Diagram
Figure 2-1. AT73C246 functional block diagram
VIN4
LDO4
3.3V
Max: 200mA
(CODEC)
37
36
VIN0
SW0
BUCK0
1.8V
57
VDD4
58
56
59
53
VFB0
Max: 600mA
(CORE + MEM)
LINL
LINR
28
GND0
VIN1
SW1
27
30
29
34
BUCK1
1.2V
AUXL
AUXR
MICL
54
VFB1
Max: 600mA
(CORE)
52
55
AUDIO IN
GND1
+ ADC
MICLN
MICR
31
33
VIN2
LDO2
1V
Max: 300mA
(CORE)
51
VDD2
VIN3
MICRN
32
50
38
LDO3
3.3V
Max: 200mA
(I/O)
AVDD
18
35
MICBIAS
AUDIO
BIAS
VDD3
39
1
VMID
12
17
VBACKUP
AGND
LDO5
2.5V
Max: 10mA
(BACKUP)
AUDIO
CODEC
VINSYS
VDDC
HPDET
HPR
7
8
13
14
DIGITAL
CORE
LDO6
1.8V / 10mA
(Internal
AUDIO OUT
+DAC
HPL
16
15
functions)
HPVCM
REXT
VBG
10
9
PMU
BIAS
MCLK
LRFS
44
43
GNDSYS
11
AUDIO
PORT
BCLK
DAI
42
41
40
RSTB
ITB
20
19
DAO
WAKEUP1
WAKEUP2
23
24
XIN
63
PMU STATE
MACHINES
WAKEUP3
VPAD
XOUT
25
45
64
49
CLK32K
WAKEUP0
VBACKUP
RTC +
OSC
DGND
LED
62
60
65
2
HRST
PWREN
61
DIE TEMP
SENSOR
Internal voltages
DCDC
4MHz RC
OSCILLATOR
ANA0
ANA1
ANA2
ANA3
3
4
5
ANALOG
MUX
10b SAR
ADC
SYSTEM
32KHz RC
OSCILLATOR
TWI
NC
46
6
NC
NC
NC
TWCK
TWD
22
21
26
47
48
3
11050A–PMAAC–07-Apr-10
3. Package and Pinout
Figure 3-1. AT73C246 QFN64 package pinout - Top view
64
49
48
VBACKUP
LED
1
NC
NC
ANA0
NC
ANA1
VPAD
MCLK
LRFS
BCLK
ANA2
ANA3
VINSYS
VDDC
VBG
DAI
DAO
REXT
VDD3
VIN3
GNDSYS
VMID
VIN4
HPDET
HPR
VDD4
MICBIAS
MICL
MICR
HPVCM
HPL
16
17
33
32
4
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
4. Pin Description
Table 4-1.
Pin Name
VBACKUP
Pin Description
I/O
Pin Number
Type
Function
Output
1
Analog
RTC supply
Output for blinking led. Leave not
connected if a LED is not wired.
LED
Output
2
Digital
ANA0
ANA1
ANA2
ANA3
VINSYS
Input
Input
Input
Input
Input
3
4
5
6
7
Analog
Analog
Analog
Analog
Power
Measurement input 0
Measurement Input 1
Measurement Input 2
Measurement Input 3
PMU core supply
PMU / Audio digital supply. Internal use
only. No resistive load.
VDDC
VBG
Output
Output
Output
8
9
Analog
Analog
Analog
PMU Voltage reference
Resistor connection for PMU bias
current
REXT
10
GNDSYS
VMID
GND
Output
Input
11
12
13
14
15
16
17
18
Analog
Analog
Analog
Analog
Analog
Analog
Analog
Power
PMU ground
Audio Codec Mid-Supply reference
Headset detector
HPDET
HPR
Output
Output
Output
GND
Headset output right
HPVCM
HPL
Headset virtual ground output
Headset output left
AGND
AVDD
Audio Codec ground
Audio Codec supply input
Input
Interrupt request - Active low - Open-
drain
ITB
Output
19
Digital
RSTB
TWD
Output
Input/Output
Input
20
21
22
Digital
Digital
Digital
CPU reset - Active low - Open drain
Two Wire Interface - Data
TWCK
Two Wire Interface - Clock
Wake up 1 Input - VPAD level - 100k
Pull down
WAKEUP1
WAKEUP2
WAKEUP3
Input
Input
Input
23
24
25
Digital
Digital
Digital
Wake up 2 Input - VPAD level - 100k
Pull down
Wake up 3 input - VPAD level - 100k
Pull down
NC
-
26
27
28
29
30
-
Connect to DGND
LINR
LINL
AUXR
AUXL
Input
Input
Input
Input
Analog
Analog
Analog
Analog
Audio Line input right
Audio Line input left
Audio auxiliary input right
Audio auxiliary input left
5
11050A–PMAAC–07-Apr-10
Table 4-1.
Pin Name
MICLN
MICRN
MICR
MICL
Pin Description
I/O
Pin Number
31
Type
Analog
Analog
Analog
Analog
Analog
Power
Analog
Power
Analog
Digital
Digital
Digital
Digital
Digital
Power
-
Function
Input
Audio negative microphone input left
Audio negative microphone input right
Audio positive microphone input right
Audio positive microphone input left
Voltage bias for electret microphone
LDO4 output - 3.3V typ
LDO4 input
Input
32
Input
33
Input
34
MICBIAS
VDD4
VIN4
Output
Output
Input
35
36
37
VIN3
Input
38
LDO3 input
VDD3
DAO
Output
Output
Input
39
LDO3 output - 3.3V typ
Digital audio port data output
Digital audio port data input
Digital audio port bit clock
Digital audio port left/right clock
Audio codec master clock input
PMU I/O ring supply
40
DAI
41
BCLK
LRFS
MCLK
VPAD
NC
Input/Output
Input/Output
Input
42
43
44
Input
45
-
46
Leave open
NC
-
47
-
Connect to DGND
NC
-
48
-
Connect to DGND
MCLK32
VDD2
VIN2
Output
Output
Input
49
Digital
Analog
Power
Analog
Power
Analog
Analog
Analog
Analog
Analog
Analog
RTC clock output - VPAD level
LDO2 output
50
51
LDO2 input
VFB1
VIN1
Input
52
DCDC1 Voltage feedback input
DCDC1 power stage supply
DCDC1 power stage output
DCDC1 power stage ground
DCDC0 Voltage feedback input
DCDC0 power stage supply
DCDC0 power stage output
DCDC0 power stage ground
Input
53
SW1
Output
Ground
Input
54
GND1
VFB0
VIN0
55
56
Input
57
SW0
Output
Ground
58
GND0
59
Hard reset - VBACKUP level - 100k Pull
down
HRST
Input
Input
Input
60
61
62
Digital
Digital
Digital
Power on/off - VBACKUP level - 100k
Pull down
PWREN
WAKEUP0
Wake up 0 input - VBACKUP level -
100k Pull down
6
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Table 4-1.
Pin Name
XIN
Pin Description
I/O
Pin Number
Type
Function
Input
63
64
65
Analog
Analog
Analog
RTC crystal oscillator input
RTC crystal oscillator output
PMU digital ground + Thermal pad.
XOUT
Output
DGND
Ground
7
11050A–PMAAC–07-Apr-10
5. Application Block Diagram
Figure 5-1. AT73C246 Application Block Diagram
37
VIN4
LDO4
3.3V
Max: 200mA
(CODEC)
VIN
C42
10µF
36
VDD4
C41
10µF
57
58
56
59
VIN0
SW0
VIN
BUCK0
1.8V
LINEJACK
AUXJACK
100
R30
C1
28
3.3µF
C39
LINL
L1
10µF
R29
100K
C40
1nF
VDD0
2.2µH
C2
VFB0
R28
Max: 600mA
(CORE + MEM)
22µF
C38
1nF
J1
J2
100K
LINR
27
30
3.3µF
C37
GND0
R31
R27
100
100
AUXL
3.3µF
C35
R25
100K
R26
C36
1nF
53
54
52
55
VIN1
SW1
VIN
BUCK1
1.2V
R24
C34
1nF
C3
10µF
100K
L2
29
34
AUDIO IN
3.3µF
C33
AUXR
MICL
VDD1
2.2µH
100
+ ADC
C4
22µF
1µF
C31
MIC_L
VFB1
Max: 600mA
(CORE)
C32
1nF
J3
R22
2K
GND1
1µF
C29
31
33
32
MICLN
MICR
R23
C30
1nF
51
50
VIN2
2K
LDO2
1V
Max: 300mA
(CORE)
VDD0
C5
2.2µF
1µF
C27
MIC_R
J4
C28
1nF
R18
2K
VDD2
C6
10µF
1µF
C25
MICRN
R19
2K
C26
1nF
38
39
VIN3
VIN
LDO3
3.3V
Max: 200mA
(I/O)
C7
VDD4
10µF
18
35
12
17
AVDD
MICBIAS
VDD3
AUDIO
BIAS
C8
10µF
VMID
C23
1µF
R1
2K
AGND
1
VBACKUP
LDO5
2.5V
Max: 10mA
(BACKUP)
C9
2.2µF
AUDIO
CODEC
Backup
Battery
BAT1
DIGITAL
CORE
HEADSET 32ohms
HPDET
HPR
VINSYS
13
14
7
8
VINSYS
C10
2.2µF
LDO6
1.8V / 10mA
AUDIO OUT
+DAC
HPL
16
15
J5
(Internal
HPVCM
VDDC
functions)
C11
2.2µF
LINEOUT
C22
3.3µF
C21
3.3µF
R14
100
10
9
REXT
R2
PMU
BIAS
560k
VBG
1%
J6
R13
100K
R12
100
R15
C12
22nF
100K
11
GNDSYS
44
43
42
MCLK
LRFS
VDD0/VDD3
R3
4.7K
AUDIO
PORT
I²S
to MCU
BCLK
DAI
20
RSTB
41
40
C13
10nF
VDD0/VDD3
R4
DAO
4.7K
19
ITB
C19
C14
10nF
12p
23
WAKEUP1
XIN
63
64
49
X1
S3
100K
XOUT
WAKEUP2
WAKEUP3
C20
12p
24
100K
25
100K
45
VBACKUP
PMU STATE
MACHINES
From MCU
CLK32K
WAKEUP0
62
VBACKUP
PUSHBUTTON
S2
100K
RTC +
OSC
VIN
R5
470
HRST
60
VDD0/VDD3
VBACKUP
VBACKUP
PUSHBUTTON
S1
VPAD
100K
D1
2
65
LED
PWREN
61
PUSHBUTTON
DGND
100K
DIE TEMP
SENSOR
R8
100
ANA0
ANA1
ANA2
ANA3
3
ANA_0
C15
R9
100
22nF
DCDC
4MHz RC
OSCILLATOR
4
5
ANA_1
C16
22nF
ANALOG
INPUTS
10b SAR
ADC
R10
100
ANA_2
ANA_3
SYSTEM
32KHz RC
OSCILLATOR
C17
22nF
R11
100
6
NC
46
TWI
C18
22nF
26 47 48
22
21
TWCK
TWD
VDD0/VDD3
R6
4.7K
TWD
VDD0/VDD3
R7
4.7K
To MCU TWI
TWCK
8
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Table 5-1.
Typical Application Components Design
Schematic Reference
Value
2kΩ
Description
5% / 0.063W
1% / 0.063W
5% / 0.063W
5% / 0.063W
R1, R18, R19, R22, R23
R2
560kΩ
4.7kΩ
470Ω
R3, R4, R6,R7
R5
R8, R9, R10, R11, R14, R15,
R26, R27, R30, R31
100Ω
5% / 0.063W
5% / 0.063W
R12, R13, R24, R25, R28,
R29
100kΩ
X5R / 6.3V
C1, C3, C6, C7, C8, C10,
C41, C42
10µF
22µF
TDK: C1608X5R0J106MT
MURATA: GRM188R60J106ME47
X5R / 6.3V
C2, C4
TDK: C2012X5R0J226M
MURATA: GRM21BR60J226ME39
C5, C9, C11
2.2µF
1µF
X5R / 6.3V
C23, C25, C27, C29, C31
C13, C14
X5R / 6.3V
10nF
22nF
12pF
X5R / 6.3V
C15, C16, C17, C18, C12
C19, C20
X5R / 6.3V
C0G / 25V
C21, C22, C33, C35, C37,
C39
3.3µF
X5R / 6.3V
C26, C28, C30, C32, C34,
C36, C38, C40
1nF
X5R
L1, L2
2.2µH
COILCRAFT: LPS3314-222
9
11050A–PMAAC–07-Apr-10
10
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
6. Absolute Maximum Ratings
Table 6-1.
Absolute Maximum Ratings
Operating Temperature (Industrial).................-40 C to + 85⋅C(1)
*NOTICE:
Stresses beyond those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
This is a stress rating only and functional operation of
the device at these or other conditions beyond those
indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reli-
ability.
Storage Temperature......................................-55°C to + 150°C
Power Supply Input on VINSYS, VIN{0,1,3,4}, VPAD .. -0.3V to + 5.5V
Power Supply Input on VIN2, AVDD ...................... -0.3V to + 3.6V
Digital I/O Input Voltage...................................... -0.3V to + 5.5V
All Other Pins.......................................................-0.3V to + 5.5V
ESD (all pins).........................................2 KV HBM / 100V MM(2)
Notes: 1. Refer to Power Dissipation Rating section
2. According to specifications MIL-883-Method 3015.7 (HBM - Human Body Model) / JESD22 A115 (MM - Machine Model)
7. Recommended Operating Conditions
Table 7-1.
Parameter
Recommended Operating Conditions
Condition
Min
-40
Max
85
Units
°C
V
Operating Ambiant Temperature(1)
Power Supply Input
VINSYS
VIN{0,1,3,4}
VIN2
2.5
5.5
5.5
3.6
3.6
5.5
Power Supply Input
2.9
V
Power Supply Input
1.65
2.7
V
Power Supply Input
AVDD
V
Power Supply Input
VPAD
1.75
V
Note:
1. Refer to Power Dissipation Rating section
8. Power Dissipation Ratings
Table 8-1.
Parameter
Recommended Operating Conditions
Condition
Min
-40
Typ
Max
Units
Junction Temperature (Tj)
125
°C
Package thermal junction to ambient
resistance
(1)
RTHjA
30
35
°C / W
Ambient temperature = 70°C
Ambient temperature = 85°C
1.8
1.3
1.6
1.1
W
W
Maximum On-chip Power Dissipation
Note:
1. According to specification JESD51-5
11
11050A–PMAAC–07-Apr-10
9. PMU Electrical Characteristics
9.1
Current Consumption Versus Modes
Table 9-1.
Symbol
VIN
Current Consumption Versus Modes
Parameter
Comments
Min
Typ
Max
Units
Operating Supply Voltage
VINSYS, VIN{0,1,3,4} present.
2.9
3.6
5.5
V
All LDOs and DCDC converters
OFF. Audio OFF. RTC running.
POWERDOWN Mode.
RUN Mode.
-
-
20
7
40
15
µA
All LDOs and DCDC converters
running in PWM. Audio OFF. RTC
running.
mA
IDD_VIN
Default setup: DCDC0 ON in low-
power mode. LDO3 ON. All other
functions OFF.
STANDBY Mode.
All Modes.
-
310
1
500
5
µA
µA
RTC running. Total current
entering pin VBACKUP
IDD_RTC
9.2
Supply Monitor Thresholds
The following table applies to functional state diagrams of Figure 11-1 “AT73C246 Power Man-
ager Functional State Diagram” on page 25 and Figure 11-2 “AT73C246 Start-up and Shutdown
State Diagram” on page 26.
Table 9-2.
Symbol
Supply Monitor Thresholds
Parameter
Comments
Min
3.070
2.870
2.70
2.60
1.80
1.70
Typ
3.1
Max
3.130
2.930
2.85
2.70
1.90
Units
VIN > 3.1V
PMU Input 3.1V Rising Threshold
PMU Input 2.9V Falling Threshold
PMU Input 2.7V Rising Threshold
PMU Input 2.7V Falling Threshold
V
V
V
V
V
V
VIN < 2.9V
2.9
VIN > 2.7V
VIN < 2.7V
2.75
2.65
1.85
1.75
VBKP > 1.8V VBACKUP Input Rising Threshold
VBKP < 1.8V VBACKUP Input Falling Threshold
1.80
12
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
9.3
Digital I/Os DC Characteristics
Table 9-3.
Symbol
VPAD
VPAD Referred Digital I/Os
Parameter
Comments
Min
Typ
Max
Units
Operating Supply Voltage
1.75
3.6
5.5
V
0.3 x
VPAD
VIL
Input Low-Level Voltage
Input High-Level Voltage
Output High-Level Voltage
Output Low-Level Voltage
-0.3
-
-
-
-
V
V
V
V
0.7 x
VPAD
VPAD
0.3
+
VIH
VOH
VOL
0.75 x
VPAD
IO max.
IO max
-
0.25 x
VPAD
-
IO
Output Current
-
-
8
mA
RP
Pull-Up or Pull-Down Resistance
When applicable.
70
100
145
kΩ
Notes: 1. VPAD referred pins ITB, RSTB: open drain outputs. Only VOL and IO parameters are applicable.
2. VPAD referred pins WAKEUP1, WAKEUP2, WAKEUP3, MCLK, DAI, TWCK: CMOS inputs. Only VIH and VIL parameters are
applicable.
3. VPAD referred pins MCLK32K, DAO: CMOS outputs. Only VOL, VOH and IO parameters are applicable.
4. VPAD referred pin TWD: CMOS input and open drain output. Only VIL, VIH, VOL, IO parameters are applicable.
5. VPAD referred pins LRFS, BCLK: CMOS BiDir. All parameters applicable
Table 9-4.
VBACKUP Referred Digital I/Os
Parameter
Symbol
Comments
Min
Typ
Max
Units
VBACKUP
Operating Supply Voltage
1.75
2.5
2.65
V
0.3 x
VBACKUP
VIL
Input Low-Level Voltage
Input High-Level Voltage
Output High-Level Voltage
Output Low-Level Voltage
-0.3
-
-
-
-
V
V
V
V
0.7 x
VBACKUP
VBACKUP
+ 0.3
VIH
VOH
VOL
0.75 x
VBACKUP
IO max.
IO max
-
0.25 x
VBACKUP
-
IO
Output Current
-
-
8
mA
RP
Pull-Up or Pull-Down resistance
When applicable.
70
100
145
kΩ
Note:
VBACKUP referred pins PWREN, HRST, WAKEUP0: CMOS inputs. Only VIL and VIH parameters are applicable.
13
11050A–PMAAC–07-Apr-10
9.4
DCDC0 and DCDC1
Unless otherwise specified: External components L=2.2μH, COUT=22μF and CIN=10μF. VIN{0,1} > VDD{0,1} + 500mV.
TJ = [-40°C ; +125°C].
Table 9-5.
Symbol
VIN
DCDC0 and DCDC1 Electrical Characteristics
Parameter
Comments
VIN0, VIN1 and VINSYS
OFF
Min
2.9
-
Typ
3.6
-
Max
5.5
1
Units
V
Operating Supply Voltage
µA
PFM operation.
40
3
80
µA
-
-
IDD
Supply Current(1)
VDD0 = 1.85V, VDD1 = 1.2V
PWM operation.
6.5
mA
VDD0 = 1.85V, VDD1 = 1.2V
PFM operation.
PWM operation.
PWM operation.
VDD0
-
-
-
-
50
600
2.2
-
mA
mA
MHz
V
IO
Output Current
fSW
Switching Frequency
Default Output Voltage(2)
1.8
-
2
VDD0
VDD1
1.85
1.2
VDD1
-
-
V
Programmable Output Voltage
Range
VDD_RANGE
VDD_STEP
NSTEP
TSTEP
PFM or PWM operation.
PFM or PWM operation.
0.8
3.6
V
Output Voltage Steps
Number of Output Steps
Step time
50
mV
In case of direct output voltage
programming. Automatic ramping
not active.
step /
100µs
4
With automatic ramping.
260
-1.5
-2
280
300
2.5
3
µs
%
PFM; TJ = 25°C ; IO = 0 mA
PFM; TJ = [-40;125°C] ; IO = 0 mA
PWM; TJ = 25°C ; IO = 0 mA
PWM; TJ = [-40;125°C] ; IO = 0 mA
PWM operation.
VDD_ACC
DC Output Voltage Accuracy
-1.5
-2
1.5
2
VDD_RIPPLE
Ripple Voltage
2
2
mV
mV
PWM operation. IO ranging from 0
to IOMAX
Static Load Regulation
5
5
ΔVDD_IL
PWM. IO: 0 to IOMAX ; 1μs rise time
PWM. IO: IOMAX to 0 ; 1μs fall time
-40
40
Dynamic Load Regulation
Static Line Regulation
mV
VIN0 and VINSYS from 2.9 to 5.5V
ΔVDD_VIN
mV
%
VDD0 = 1.85V, VDD1 = 1.2V
PWM. IOMAX load. VDD0= 1.85V.
Relative to VIN0 input supply.
85
78
Eff
Efficiency
PWM. IOMAX load. VDD1= 1.2V.
Relative to VIN1 input supply.
%
Current from VIN(0,1) and VINSYS
from 0 to 100% VDD{0,1}
IINRUSH
Inrush Current(1)
30
200
mA
VDD0 = 1.85V, VDD1 = 1.2V
14
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Table 9-5.
Symbol
OCP
DCDC0 and DCDC1 Electrical Characteristics
Parameter
Comments
Min
Typ
Max
Units
Over-Current Protection
Output current.
1
1.4
1.8
A
From OFF to PWM operation.
VDD(0,1) rising to 95% of final value.
TSTART
TPWM
Start-up Time
5
ms
µs
PFM to PWM Settling Time
No output load.
10
-
Power Fail Detector Threshold
Accuracy
Overload of the programmed
PWRFDET
-1
8
+1
36
%.VDD
µF
threshold by 10mV / 5us min(3)
.
COUT
Total Capacitive Load
At VFB{0,1} pins.
Notes: 1. Current consumption without load. One DCDC converter ON, the other one OFF.
2. Default output voltage are set during manufacturing. Please contact Atmel for other default settings.
3. Threshold levels are programmed in register PMU_RST_LVL (0x04)
15
11050A–PMAAC–07-Apr-10
9.5
LDO2
Unless otherwise specified: External components COUT=10µF, CIN=10μF, TJ = [-40°C ; +125°C].
Table 9-6.
Symbol
VIN
LDO2 Electrical Characteristics
Parameter
Comments
Min
Typ
Max
3.6
1
Units
V
Operating Supply Voltage
VIN2
1.65
1.8
OFF
-
-
-
-
-
-
µA
µA
mA
V
IDD
Supply Current(1)
ON
250
300
-
IO
Output Current
VIN2 > VDD2 + 500mV.
-
VDD2
Default Output Voltage(2)
1
Programmable Output Voltage
Range
VDD_RANGE
0.8
1.35
V
VDD_STEP
TSTEP
Output Voltage Steps
Step time
50
mV
µs
With automatic ramping.
570
-1
600
630
1
VIN2 > VDD2 + 500mV
TJ = 25°C ; IO = 0 mA
VDD_ACC
DC Output Voltage Accuracy
Static Load Regulation
%
%.VDD2
mV
VIN2 > VDD2 + 500mV
-1.5
1.5
1
TJ = [-40°C ; 125°C] ; IO = 0 mA
VIN2 > VDD2 + 500mV
0.05
-50
50
IO ranging from 0 to IOMAX
VIN2 > VDD2 + 500mV
ΔVDD_IL
IO: 0 to IOMAX ; 1μs rise time
Dynamic Load Regulation
VIN2 > VDD2 + 500mV
IO: IOMAX to 0 ; 1μs fall time
IO = 0 mA
ΔVDD_VIN
Static Line Regulation
Drop Out Voltage(4)
5
mV
VIN2 from 1.65 to 3.6V
IO = 200mA
IO = 300mA
300
450
mV
mV
VDROPOUT
Current from VIN2 from 0 to 95% of
final value.
IINRUSH
Inrush Current
Start-up Time
200
500
1
mA
ms
VDD2 OFF and rising to 95% of
TSTART
final value. IO = 0 mA
Power Fail Detector Threshold
Accuracy
Overload of the programmed
threshold by 10mV / 5us min(3)
PWRFDET
-1
-
+1
%.VDD2
.
Notes: 1. Current consumption in VIN2 without load.
2. Default output voltage are set during manufacturing. Please contact Atmel for other default settings.
3. Threshold level is programmed in register PMU_RST_LVL (0x04)
4. VDROPOUT= VIN2 - VDD2 when VDD2 = 98% of VDD2 obtained with VIN2 > VDD2 + 500mV
16
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
9.6
LDO3
Unless otherwise specified: External components COUT=10µF, CIN=10μF, TJ = [-40°C ; +125°C].
Table 9-7.
Symbol
VIN
LDO3 Electrical Characteristics
Parameter
Comments
Min
Typ
3.6
-
Max
5.5
1
Units
V
Operating Supply Voltage
VIN3
2.9
OFF
-
-
-
-
µA
µA
mA
V
IDD
Supply Current(1)
ON
-
350
200
-
IO
Output Current
VIN3 > VDD3 + 300mV.
-
VDD3
Default Output Voltage(2)
3.3
Programmable Output Voltage
Range
VDD_RANGE
2.7
3.6
V
VDD_STEP
TSTEP
Output Voltage Steps
Step time
50
mV
µs
With automatic ramping.
570
-1
600
630
1
VIN3 > VDD3 + 300mV
TJ = 25°C ; IO = 0 mA
VDD_ACC
DC Output Voltage Accuracy
Static Load Regulation
%
%.VDD3
mV
VIN3 > VDD3 + 300mV
-1.5
1.5
0.5
TJ = [-40°C ; 125°C] ; IO = 0 mA
VIN3 > VDD3 + 300mV
0.05
-40
40
IO ranging from 0 to IOMAX
VIN3 > VDD3 + 300mV
ΔVDD_IL
IO: 0 to IOMAX ; 1μs rise time
Dynamic Load Regulation
VIN3 > VDD3 + 300mV
IO: IOMAX to 0 ; 1μs fall time
V
IN3 > VDD3 + 300mV. IO = 0 mA
ΔVDD_VIN
Static Line Regulation
Drop Out Voltage(4)
5
mV
VIN3 from 2.9 to 5.5V
IO = 10mA
50
mV
mV
VDROPOUT
IO = 200mA
250
V
IN3 > VDD3 + 300mV
60
50
IO = 1mA. DC to 3kHz.
PSRR
Power Supply Rejection Ratio
dB
VIN3 > VDD3 + 300mV
IO = 10mA. DC to 3kHz.
Current from VIN3 from 0 to 95%
of final value.
IINRUSH
Inrush Current
Start-up Time
200
500
1
mA
ms
VDD3 OFF and rising to 95% of
TSTART
final value. IO = 0 mA
Power Fail Detector Threshold
Accuracy
Overload of the programmed
threshold by 10mV / 5us min(3)
PWRFDET
-1
-
+1
%.VDD3
.
Notes: 1. Current consumption in VIN3 without load.
2. Default output voltage are set during manufacturing. Please contact Atmel for other default settings.
3. Threshold level is programmed in register PMU_RST_LVL (0x04)
4. VDROPOUT= VIN3 - VDD3 when VDD3 = 98% of VDD3 obtained with VIN3 > VDD3 + 300mV
17
11050A–PMAAC–07-Apr-10
9.7
LDO4
Unless otherwise specified: External components COUT=10µF, CIN=10μF, TJ = [-40°C ; +125°C].
Table 9-8.
Symbol
VIN
LDO4 Electrical Characteristics
Parameter
Comments
Min
Typ
3.6
-
Max
5.5
1
Units
V
Operating Supply Voltage
VIN4
2.9
OFF
-
-
-
-
µA
µA
mA
V
IDD
Supply Current(1)
ON
-
350
200
-
IO
Output Current
VIN4 > VDD4 + 300mV.
-
VDD4
Default Output Voltage(2)
3.3
Programmable Output Voltage
Range
VDD_RANGE
2.7
3.6
V
VDD_STEP
TSTEP
Output Voltage Steps
Step time
50
mV
µs
With automatic ramping.
570
-1
600
630
1
VIN4 > VDD4 + 300mV
TJ = 25°C ; IO = 0 mA
VDD_ACC
DC Output Voltage Accuracy
Static Load Regulation
%
%.VDD4
mV
VIN4 > VDD4 + 300mV
-1.5
1.5
0.5
TJ = [-40°C ; 125°C] ; IO = 0 mA
VIN4 > VDD4 + 300mV
0.05
-40
40
IO ranging from 0 to IOMAX
VIN4 > VDD4 + 300mV
ΔVDD_IL
IO: 0 to IOMAX ; 1μs rise time
Dynamic Load Regulation
VIN4 > VDD4 + 300mV
IO: IOMAX to 0 ; 1μs fall time
V
IN4 > VDD4 + 300mV. IO = 0 mA
ΔVDD_VIN
Static Line Regulation
Drop Out Voltage(3)
5
mV
VIN4 from 2.9 to 5.5V
IO = 10mA
50
mV
mV
VDROPOUT
IO = 200mA
250
V
IN4 > VDD4 + 300mV
60
50
IO = 1mA. DC to 3kHz.
PSRR
Power Supply Rejection Ratio
dB
VIN4 > VDD4 + 300mV
IO = 10mA. DC to 3kHz.
Current from VIN4 from 0 to 95%
of final value.
IINRUSH
TSTART
Inrush Current
Start-up Time
200
500
1
mA
ms
VDD4 OFF and rising to 95% of
final value. IO = 0 mA
Notes: 1. Current consumption in VIN4 without load.
2. Default output voltage are set during manufacturing. Please contact Atmel for other default settings.
3. VDROPOUT= VIN4 - VDD4 when VDD4 = 98% of VDD4 obtained with VIN4 > VDD4 + 300mV
18
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
9.8
LDO5
Unless otherwise specified: External components COUT=2.2µF, CIN=10μF, TJ = [-40°C ; +125°C].
Table 9-9.
Symbol
VIN
LDO5 Electrical Characteristics
Parameter
Comments
VINSYS
OFF
Min
Typ
3.6
-
Max
5.5
1
Units
V
Operating Supply Voltage
2.7
-
µA
µA
mA
V
IDD
Supply Current(1)
ON
-
-
-
7
IO
Output Current
-
10
2.58
10
15
VBACKUP
ΔVDD_VIN
ΔVDD_VIN
Output Voltage Accuracy
Static Line Regulation
Static Line Regulation
2.42
2.5
3
VINSYS from 2.7 to 5.5V
mV
mV
VINSYS =3.6V, IO from 0 to IOMAX
10
Current from VINSYS from 0 to
TSTART(MAX). VBACKUP = 2.5V
IINRUSH
TSTART
Note:
Inrush Current
Start-up Time
180
350
1
mA
ms
VBACKUP OFF and rising to 95% of
final value.
1. Current consumption in VINSYS without plugged backup battery
19
11050A–PMAAC–07-Apr-10
9.9
Measurement Bridge and 10-bit ADC
Table 9-10. Measurement Bridge and 10-bit ADC Electrical Characteristics
Symbol
Parameter
Comments
VINSYS
OFF
Min
Typ
Max
5.5
1
Units
V
VIN
Operating Supply Voltage(1)
2.9
3.6
-
-
-
-
µA
IDD
Supply Current
ON
2
mA
Internally connected to
VDDC pin.
VREF
Reference Voltage
1.75
1.8
1.85
V
INL
Integral Non Linearity
Differential Non Linearity
Offset Error
End Point Method
End Point Method
-2
-1
-2
-2
-
-
+2
+1
+2
+2
LSB
LSB
LSB
LSB
kS/s
ns
DNL
Offset
GAIN
FS
Gain Error
Sampling Rate
300
TACQ
Track and Hold Acquisition Time
500
0.4
External inputs ANA{0,1,2,3}
VDD{0,1,2,3,4} inputs
VINSYS
4
V
VMEAS
Measured Input Voltage Range
0.4
V
VINSYS input
0.4
5.5
V
External inputs ANA{0,1,2,3}
-1%
-1%
-1%
96
0.25
0.4
+1%
+1%
+1%
144
V/V
V/V
V/V
kΩ
ATTMEAS
Measured Input Scaling Factor
ANA{0,1,2,3} Input resistance
V
DD{0,1,2,3,4,5} inputs
INSYS input
V
0.25
120
RIN_NOM
Tj = 25C
TJ [-40 ; +25]. Relative to
RIN_NOM
+ 20
RIN_TEMP
RIN deviation with temperature
%
TJ [25 ; 125]. Relative to
RIN_NOM
-16
CIN
ANA{0,1,2,3} Input capacitance
15
pF
Notes: 1. The 10-bit ADC is supplied from the regulated VDDC voltage (1.8V) which is generated from VINSYS
.
2. Please refer to Atmel Data Converter Terminology literature
20
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
9.10 RTC Crystal Oscillator
Table 9-11. RTC Crystal Oscillator Electrical Characteristics
Symbol
VIN
Parameter
Comments
VBACKUP
Min
Typ
2.5
32.768
50
Max
Units
V
Operating Supply Voltage
Frequency
1.75
2.65
-
Freq
with crystal
-
40
-
kHz
%
Duty
Duty Cycle
60
OFF
-
5
nA
IDD
Supply Current(1)
ON
-
-
1.5
1500
300
µA
TON
Startup Time
CL= 12pF
-
1000
250
300
10
ms
VXIN
VXOUT
RF
Level Sinus Wave on XIN
Vpp On XOUT
mVpp
mVpp
MΩ
mn/month
kΩ
Internal Resistor
between xin and xout
@25°C, +/- 20ppm
Drift
Esr
Accuracy
1.5
100
3
Equivalent Series Resistance Rs
Motional Capacitance
Shunt Capacitance
Load Capacitance
Crystal @ 32.768kHz
Crystal @ 32.768kHz
Crystal @ 32.768kHz
Crystal @ 32.768kHz
50
CM
0.6
0.6
6
fF
CSHUNT
CLOAD
Note:
2
pF
12.5
pF
1. Current consumption in VBACKUP with crystal. In case of crystal not present on-board, back-up batteries or supercapacitors,
must be avoided.
9.11 Die Temperature Sensor
Table 9-12. Die Temperature Sensor Electrical Characteristics
Symbol
Parameter
Comments
Min
135
105
Typ
145
115
Max
155
125
Units
°C
TSHUTDOWN
TRESTART
130°C Shutdown Threshold
110°C Restart Threshold
°C
21
11050A–PMAAC–07-Apr-10
10. Audio Codec Electrical Characteristics
Unless otherwise specified: AVDD = 3.3V, TA = 25C, MCLK = 12.288MHz, FS = 48kHz. Master mode and 24-bit operation
on I2S port. All gains set to 0dB, audio effects are off. Noise measurements are made in the [20Hz-20kHz] band using the
A-Weighting filter. Distortion measurements are made from the 2nd to the 5th harmonic products of a 997Hz input sinewave.
Input sources have an internal impedance of 50 Ohms. Audio Path without mixing capability.
Table 10-1. Audio Codec Bias
Symbol
Parameter
Comments
Min
Typ
Max
3.6
20
Units
V
AVDD
Operating Supply Voltage
2.7
3.3
OFF
µA
IDD
Supply Current
STANDBY
1
mA
AVDD /
2
VMID
Mid-Supply Reference Voltage
-1%
+1%
V
TMID_ON
Time to charge VMID capacitor
Time to discharge VMID capacitor
From 0 to 95% of final value
From 0 to 95% of final value
350
700
ms/μF
ms/μF
TMID_OFF
Microphone Bias Reference
Voltage
VMICBIAS
RMICBIAS
No load.
AVDD
1.9
V
Microphone Bias Reference
Voltage Internal Resistance
1.5
2.3
kΩ
Table 10-2. Line Record Path: Line or Auxiliary Input to ADC Output
Symbol
Parameter
Comments
Min
Typ
Max
Units
Corresponds to 0dBFs digital
output signal.
AVDD /
3.3
VFS
Full Scale Input Voltage(1)
VRMS
AVDD = 3.3V
85
82
85
82
-
96
93
96
93
-80
90
0
-
-
dB
dB
dB
dB
dB
dB
dB
dB
dB
kΩ
pF
SNR
DR
Signal-to-Noise Ratio(2)
Dynamic Range(3)
AVDD = 2.7V
AVDD = 3.3V
-
AVDD = 2.7V
-
THD
Total Harmonic Distortion
Left / Right Channel separation(5)
Programmable Gain Range
Gain Step Size
-1dBFS digital output
-74
-
XTALK
80
-34
-
12
-
GLINE
1
Mute Attenuation(6)
80
5.9
-
-
-
RIN
CIN
Input Resistance
7
8.1
10
Input Capacitance
-
Table 10-3. Microphone Record Path: Microphone Input to ADC Output
Symbol
Parameter
Comments
Min
Typ
Max
Units
Corresponds to 0dBFs digital
output signal.
AVDD /
3.3
VFS
Full Scale Input Voltage(1)
VRMS
AVDD = 3.3V
AVDD = 2.7V
85
82
96
93
-
-
dB
dB
SNR
Signal-to-Noise Ratio(2)
22
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Table 10-3. Microphone Record Path: Microphone Input to ADC Output
Symbol
Parameter
Comments
Min
85
82
-
Typ
96
93
-84
90
-
Max
Units
dB
AVDD = 3.3V
-
-
DR
Dynamic Range(3)
AVDD = 2.7V
dB
THD
Total Harmonic Distortion
Left / Right Channel separation(5)
Programmable Gain Range
Gain Step Size
-1dBFS digital output
-74
-
dB
XTALK
80
0
dB
46
-
dB
GLINE
-
1
dB
Mute Attenuation(6)
80
8.4
-
-
-
dB
RIN
CIN
Input Resistance
0dB gain
12
-
15.6
10
kΩ
pF
Input Capacitance
Table 10-4. Playback Path: DAC Input to Headphone Output
Symbol
Parameter
Comments
Min
Typ
Max
Units
AVDD /
3.3
VFS
Full Scale Output Voltage(1)
0dBFs digital input signal.
VRMS
AVDD = 3.3V
92
89
92
89
-
97
94
97
94
-88
-65
-60
30
50
90
60
-
-
-
dB
dB
dB
dB
dB
dB
dB
mW
mW
dB
dB
dB
dB
dB
SNR
DR
Signal-to-Noise Ratio(2)
Dynamic Range(3)
AVDD = 2.7V
AVDD = 3.3V
-
AVDD = 2.7V
-
0dBFs input - 10kΩ load
20mW output - 32Ω load
20mW output - 16Ω load
32Ω load - THD < -40dB or 1%
16Ω load - THD < -40dB or 1%
10kΩ AC coupled load
16Ω DC coupled load
-80
-60
-55
THD
Total Harmonic Distortion
-
-
PO
Output Power
XTALK
Left / Right Channel Separation(5)
Programmable Gain Range
Gain Step Size
-77
-
+6
-
GHS
1
Mute Attenuation(6)
80
-
-
Table 10-5. Analog Bypass Path: Line / Auxiliary Input to Headphone Output
Symbol
Parameter
Comments
Min
Typ
Max
Units
AVDD /
3.3
VFS
Full Scale Output Voltage(1)
VRMS
AVDD = 3.3V
AVDD = 2.7V
AVDD = 3.3V
AVDD = 2.7V
92
89
92
89
97
94
97
94
-
-
-
-
dB
dB
dB
dB
SNR
DR
Signal-to-Noise Ratio(2)
Dynamic Range(3)
23
11050A–PMAAC–07-Apr-10
Table 10-5. Analog Bypass Path: Line / Auxiliary Input to Headphone Output
Symbol
Parameter
Comments
Min
Typ
-88
-65
-60
30
50
90
60
0
Max
-80
-60
-55
Units
dB
0dBFs input - 10kΩ load
20mW output - 32Ω load
20mW output - 16Ω load
32Ω load - THD < -40dB or 1%
16Ω load - THD < -40dB or 1%
10kΩ AC coupled load
16Ω DC coupled load
-
-
-
THD
Total Harmonic Distortion
dB
dB
mW
mW
dB
PO
Output Power
XTALK
GBYP
Left / Right Channel Separation(5)
dB
Bypass Gain
-1
+1
-
dB
Mute Attenuation(6)
80
-
dB
Table 10-6. Analog Sidetone Path: Microphone Input to Headphone Output
Symbol
Parameter
Comments
Min
Typ
Max
Units
AVDD /
3.3
VFS
Full Scale Output Voltage(1)
VRMS
AVDD = 3.3V
92
89
92
89
-
97
94
97
94
-88
-65
-60
30
50
90
60
-
-
-
dB
dB
dB
dB
dB
dB
dB
mW
mW
dB
dB
dB
dB
dB
SNR
DR
Signal-to-Noise Ratio(2)
Dynamic Range(3)
AVDD = 2.7V
AVDD = 3.3V
-
AVDD = 2.7V
-
0dBFs input - 10kΩ load
20mW output - 32Ω load
20mW output - 16Ω load
32Ω load - THD < -40dB or 1%
16Ω load - THD < -40dB or 1%
10kΩ AC coupled load
16Ω DC coupled load
-80
-60
-55
THD
Total Harmonic Distortion
-
-
PO
Output Power
XTALK
Left / Right Channel Separation(5)
Programmable Gain Range
Gain Steps
-30
2.5
80
0
3.5
-
GSIDETONE
3
Mute Attenuation(6)
-
Notes: 1. Full Scale: A linear extrapolation to 0dBFS of the measured level at -10dBFS.
2. Signal-to-Noise Ratio: The ratio of the RMS value of a 997Hz full scale sine wave to the RMS value of output noise with no
signal applied. Device is not muted.
3. Dynamic Range: According to AES17-1991 (Audio Engineering Society) and EIAJ CP-307 (Electronic Industries Associa-
tion of Japan), an extrapolation to 0dBFS input signal of the THD+N ratio measurement at -60dBFS. As an example, if
THD+N @ -60dBFS = -36dB, then DR = 96dB.
4. Total Harmonic Distortion + Noise Ratio: The ratio of the RMS sum of the noise and the distortion components to the RMS
value of the signal.
5. XTALK: Attenuation measurement from one channel to the other one. Measurement is performed by stimulated one channel
with a 997Hz / -10dBFS sinewave and leaving the other channel unstimulated.
6. Mute Attenuation: Attenuation measurement of a -10dBFS / 997Hz input signal when concerned gain is set to mute.
24
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11. PMU Functional Description
11.1 Power Manager State Diagram
Figure 11-1. AT73C246 Power Manager Functional State Diagram
POWERDOWN
(all supplies OFF)
RSTB = 0
POWER-OFF or POWER-FAIL
EVENT
STANDBY-OUT or POWER-FAIL
EVENT
HRST_POWERDOWN
EVENT
POWER-ON EVENT &
Vin > 3.1V
STANDBY
EVENT
RUN
(all supplies ON)
RSTB = 1
STANDBY
(selected supplies ON)
RSTB = 0
WAKEUP
EVENT
HRST
EVENT
HRST
EVENT
HRST
EVENT
HRST_RUN
EVENT
HRST
(all supplies OFF)
RSTB = 0
TWI Reset
AT73C246 is placed in POWERDOWN state at VINSYS rising following the PMU startup state
diagram described in Figure 11-2 on page 26. From this POWERDOWN state, normal CPU sup-
plies startup is achieved through validation of one of the POWER-ON events. From this state,
the PMU may be placed in STANDBY state (e.g.: during CPU sleep periods) upon software
request (STANDBY event). PMU wake-up is achieved if one of the WAKEUP events is detected.
The PMU returns to the POWERDOWN state as soon as a POWER-OFF event is detected. A
special HRST (Hard-Reset) state is provided to ensure complete stop and restart of the CPU
supplies in case of a software crash. Moreover, die temperature and VDD{0,1,2,3} supplies are
supervised and may generate a POWER-FAIL event in case of out-of-specification detection.
25
11050A–PMAAC–07-Apr-10
11.2 PMU Startup and Shutdown State Diagram
Figure 11-2. AT73C246 Start-up and Shutdown State Diagram
Vin > 2V
VINSYS < 2.7V
or
VDDC_KO
Start : VINSYS Monitor &
VDDC = 1.8V.
PMU_RSTN = 0
AUDIO_RSTN = 0
VINSYS > 2.7V &
VDDC_OK
PMU_RSTN = 1
AUDIO_RSTN = 1
1
1
READ
CONFIG
VBACKUP < 1.8V
VBACKUP > 1.8V
RTC_RSTN = 0
OFF
LDO5
(BACKUP)
START
LDO5
(BACKUP)
1
START
LDO5
(BACKUP)
VBACKUP > 1.8V
VBACKUP > 1.8V
RTC_RSTN = 1
VINSYS < 2.7V
POWER
DOWN
The start-up of the AT73C246 follows the flow diagram of Figure 11-2 and aims at placing the
power manager in the POWERDOWN state.
When VINSYS rises above 2V:
• An internal VINSYS monitor starts and holds the internal PMU_RSTN and AUDIO_RSTN
signals to 0, thus forcing a complete reset of AT73C246. The PMU digital core supply voltage
26
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
(VDDC = 1.8V) is started. During this PMU reset, the ‘LED’ pin is driven to VINSYS (LED is
OFF).
• When VDDC is ready and VINSYS > 2.7V, the internal reset signals previously mentioned are
released, thus enabling the PMU digital core functions.
• Before starting the LDO5 (RTC supply), VBACKUP voltage is monitored and if it is lower than
1.8V, the RTC function is resetted. In case of VBACKUP > 1.8V, no reset is issued on the RTC
function.
• At this step, the power manager is placed in POWERDOWN state.
11.3 Power Manager Conditional Transitions
11.3.1
POWER-ON EVENTS
POWER-ON EVENTS are validated if all these listed conditions are true:
• VINSYS > 3.1V
• AT73C246 internal junction temperature Tj < 110°C
• PWREN pin is high for more than 100ms (see Table 11-1 on page 28).
Note:
PWREN pin, with internal 100k pull-down resistor, is active high (VBACKUP level). It is possible to
hard wire the PWREN pin to VBACKUP to always activate RUN state when VINSYS > 3.1V. Conse-
quently, using the software POWER-OFF EVENT (described in Section 11.3.2) will lead to going
back to the RUN state just after the POWERDOWN STATE.
11.3.2
POWER-OFF EVENTS
POWER-OFF EVENTS are validated if one of these listed conditions is true:
• VINSYS < 2.9V.
• PWREN pin goes from low to high state and high state is held for more than 5s (see Table
11-1 on page 28).
• Software request: bit 0 (OFF) of register 0x00 (PMU_MODES) is written to 1.
11.3.3
POWER-FAIL EVENTS
POWER-FAIL EVENTS are validated if one of these listed conditions is true:
• AT73C246 internal junction temperature Tj > 130°C
• Any internal power fail detection signal coming from any CPU power supply (VDD0, VDD1
,
V
DD2, VDD3) goes from low to high level.
Note:
In case of PWREN pin hard wired high (VBACKUP level), the POWER-FAIL EVENTS will lead to the
POWERDOWN state without possibility to go to the RUN state. The power manager will be able to
reach the RUN state only after an HRST event. This prevents the power manager from oscillating
between RUN and POWERDOWN states in case of permanent failure on CPU supplies.
11.3.4
11.3.5
STANDBY EVENT
STANDBY EVENT is validated if the following condition is true:
• Software request: bit 1 (STANDBY) of register 0x00 (PMU_MODES) is written to 1.
STANDBY-OUT EVENT
STANDBY-OUT EVENT is validated if the following condition is true:
• VINSYS < 2.9V.
27
11050A–PMAAC–07-Apr-10
11.3.6
WAKEUP EVENTS
WAKEUP EVENTS are validated if one of the listed condition is true:
• WAKEUP0 pin goes from low to high state and WAKEUP0 bit is set to ‘1’ (see Table 11-1) in
register 0x01 (PMU_WAKEUP_EVENTS).
• WAKEUP1 pin goes from low to high state and WAKEUP1 bit is set to ‘1’ (see Table 11-1) in
register 0x01 (PMU_WAKEUP_EVENTS).
• WAKEUP2 pin goes from low to high state and WAKEUP2 bit is set to ‘1’ (see Table 11-1) in
register 0x01 (PMU_WAKEUP_EVENTS).
• WAKEUP3 pin goes from low to high state and WAKEUP3 bit is set to ‘1’ (see Table 11-1) in
register 0x01 (PMU_WAKEUP_EVENTS).
• PWREN pin goes from low to high state and high state is held for more than 10ms (see Table
11-1) and PWREN bit is set to ‘1’ in register 0x01 (PMU_WAKEUP_EVENTS).
• An RTC alarm occurs and RTC bit is set to ‘1’ in register 0x01 (PMU_WAKEUP_EVENTS).
Notes: 1. WAKEUP0 and PWREN pins must be driven with VBACKUP level, WAKEUP{1,2,3} pins must be
driven with VPAD level.
2. If any WAKEUP EVENT is triggered while AT73C246 is going from RUN to STANDBY state,
STANDBY state is then first reached before WAKEUP EVENT is taken into account.
11.3.7
11.3.8
HRST EVENT
HRST EVENT is validated if the following condition is true:
• HRST pin goes from low to high state and high state is held for more than 1s (see Table 11-
1).
HRST RUN EVENTS
HRST RUN EVENTS are validated if all these listed conditions are true:
• HRST pin is at low level for more than 10ms (see Table 11-1).
• VINSYS > 3.1V
• AT73C246 internal junction temperature Tj < 110°C
Note:
In case of 110°C < Tj < 130°C, HRST state is maintained. The self cooling down of the die will lead
to Tj < 110°C, thus exit of HRST state.
11.3.9
HRST POWERDOWN EVENTS
HRST POWERDOWN EVENTS are validated if all of these listed conditions are true:
• HRST pin is at low level for more than 10ms.
• VINSYS < 3.1V or AT73C246 internal junction temperature Tj >130°C
Table 11-1. EVENTS Timing Table
Pin
Parameter
Comments
Min
95
Typ
100
5
Max
105
Units
ms
PWREN
PWREN
PWREN
HRST
Pin at VBACKUP Level. Debouncing Time.
Pin at VBACKUP Level. Debouncing Time.
Pin at VBACKUP Level. Debouncing Time.
Pin at VBACKUP Level. Debouncing Time.
Pin used as POWER-ON event
Pin used as POWER-OFF event
Pin used as WAKEUP event
Pin used as HRST event
4.75
9.5
5.25
10.5
1.05
sec
ms
10
1
0.95
sec
Pin used as HRST RUN event
Pin used as HRST POWERDOWN event
HRST
Pin at GND Level. Debouncing Time.
9.5
10
10.5
ms
28
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Table 11-1. EVENTS Timing Table
Pin Parameter
Comments
Min
5
Typ
Max
Units
ns
WAKEUP0 Pin pulsed to VBACKUP Level. Pulse Width.
WAKEUP1 Pin pulsed to VPAD Level. Pulse Width.
WAKEUP2 Pin pulsed to VPAD Level. Pulse Width.
WAKEUP3 Pin pulsed to VPAD Level. Pulse Width.
Pin used as WAKEUP event
Pin used as WAKEUP event
Pin used as WAKEUP event
Pin used as WAKEUP event
-
-
-
-
-
-
-
-
5
ns
5
ns
5
ns
11.4 Power Manager State Description
AT73C246 ICs are available with 2 factory programmed power sequences. The following timing
diagrams refer to “SEQUENCE A” and “SEQUENCE B” programmed ICs as defined in section
17. “Ordering Information” on page 154. See also the structure of register “VERSION (0x7F)”.
11.4.1
POWERDOWN STATE
When AT73C246 is in POWERDOWN state:
• Only VBACKUP supply is active. VDD{0,1,2,3,4} power supplies are OFF.
• Audio function is OFF.
• ADC function is OFF.
• RSTB pin is held low.
• Led pin is set as input with internal 120k pull-up resistor to VINSYS.
• TWI registers are reset to default value.
When the POWERDOWN state is reached from the RUN state, the CPU power supplies are
switched off sequentially as described in Figure 11-3 on page 30.
29
11050A–PMAAC–07-Apr-10
Figure 11-3. AT73C246 - RUN to POWERDOWN state Supplies Shutdown timing diagram.
SEQUENCE A
SEQUENCE B
RUN
STATE
POWERDOWN
STATE
RUN
STATE
POWERDOWN
STATE
SUPPLIES SHUTDOWN
SUPPLIES SHUTDOWN
TPWRDOWN
TPWRDOWN
POWEROFF
EVENT
POWEROFF
EVENT
TOFF_AUDIO
3.3V
TOFF_AUDIO
RSTB
RSTB
1V
TOFF_VDD3
TOFF_VDD2
VDD3 (3.3V)
VDD1 (1.2V)
VDD2 (1V)
TOFF_VDD1
TOFF_VDD1
1.2V
1.2V
VDD1 (1.2V)
1.85V
1.85V
TOFF_VDD0
TOFF_VDD0
V
DD0 (1.85V)
VDD0 (1.85V)
TOFF_VDD2
TOFF_VDD3
1V
3.3V
VDD2 (1V)
VDD3 (3.3V)
TOFF_VDD4
TOFF_VDD4
VDD4 (CODEC)
VDD4 (CODEC)
Table 11-2. RUN to POWERDOWN state timing table
Symbol
Parameter
Comments
Min
Typ
Max
Units
POWERDOWN Event detection
time
TPWRDOWN
58
62
66
66
µs
µs
Audio CODEC is OFF or Power Fail
Occurs
58
62
TOFF_AUDIO
Audio CODEC Shutdown Time
VDDx SHUTDOWN Time
Audio CODEC is ON
486
58
512
62
538
66
ms
µs
VDDx is OFF in RUN state(1)
VDDx is ON in RUN state(1)
TOFF_VDDx
4.8
5.2
5.4
ms
Note:
1. VDDx activity during RUN state is set by Bit7 of register VDDx_CTRL.
30
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
When the POWERDOWN state is reached from the STANDBY state, the CPU power supplies
are switched off sequentially as described in Figure 11-4.
Figure 11-4. AT73C246 - STANDBY to POWERDOWN state Supplies Shutdown timing diagram.
SEQUENCE A
SEQUENCE B
STANDBY
STATE
STANDBY
STATE
POWERDOWN
STATE
POWERDOWN
STATE
SUPPLIES SHUTDOWN
SUPPLIES SHUTDOWN
TSTBY_OUT
TSTBY_OUT
STANDBY_OUT
EVENT
STANDBY_OUT
EVENT
RSTB
RSTB
3.3V
1V
TOFF_VDD3
TOFF_VDD2
VDD3 (3.3V)
VDD1 (1.2V)
VDD0 (1.85V)
VDD2 (1V)
VDD1 (1.2V)
VDD0 (1.85V)
TOFF_VDD1
TOFF_VDD1
1.2V
1.2V
TOFF_VDD0
TOFF_VDD0
1.85V
1.85V
1V
3.3V
TOFF_VDD2
TOFF_VDD3
VDD2 (1V)
VDD3 (3.3V)
TOFF_VDD4
TOFF_VDD4
VDD4 (CODEC)
VDD4 (CODEC)
Table 11-3. STANDBY to POWERDOWN state timing table
Symbol
Parameter
Comments
Min
Typ
Max Units
STANDBY OUT Event
detection time
TSTBY_OUT
95
100
105
µs
VDDx is OFF during STANDBY state(1)
VDDx is ON during STANDBY state(1)
VDD4 is OFF in RUN state(2)
58
4.8
58
62
5.2
62
66
5.4
66
µs
ms
µs
TOFF_VDDx
VDDx SHUTDOWN Time
VDD4 SHUTDOWN Time
TOFF_VDD4
VDD4 is ON in RUN state(2)
4.8
5.2
5.4
ms
Notes: 1. VDDx activity during STANDBY state is set by register PMU_STANDBY_SUPPLIES.
2. VDD4 activity during RUN state is set by Bit7 of register VDD4_CTRL.
11.4.2
RUN STATE
When AT73C246 is in RUN state:
• VDD{0,1,2,3,5} power supplies are ON.
• RSTB pin is released.
• PMU functions are under software control (LDO4, AUDIO CODEC, ADC Controller)
• Led pin is driven according to register PMU_LED (0x0B).
31
11050A–PMAAC–07-Apr-10
When RUN state is reached from the POWERDOWN state, the power supplies are sequentially
started-up according to the Figure 11-5
Figure 11-5. AT73C246 - POWERDOWN to RUN state Supplies Start-Up timing diagram..
SEQUENCE A
SEQUENCE B
POWERDOWN
STATE
POWERDOWN
STATE
SUPPLIES START UP
SUPPLIES START UP
RUN STATE
RUN STATE
PWREN
EVENT
PWREN
EVENT
1V
3.3V
TON_SYS
TON_SYS
VDD2 (1V)
VDD3 (3.3V)
VDD0 (1.85V)
VDD1 (1.2V)
VDD2 (1V)
1.85V
1.85V
TON_VDD2
TON_VDD3
VDD0 (1.85V)
VDD1 (1.2V)
VDD3 (3.3V)
1.2V
1.2V
TON_VDD0
TON_VDD0
3.3V
1V
TON_VDD1
TON_VDD1
VPAD LEVEL
VPAD LEVEL
TON_VDD3
TON_VDD2
RSTB
RSTB
TRESET
TRESET
Table 11-4. POWERDOWN to RUN state timing table
Symbol
TON_SYS
TON_VDD0
TON_VDD1
TON_VDD2
TON_VDD3
TRESET
Parameter
Comments
Min
1.7
5
Typ
1.8
5.3
5.3
5.5
5.5
32
Max
Units
ms
POWER-ON Event Detection Time
VDD0 Start-up Time
1.9
5.6
ms
VDD1 Start-up Time
5
5.6
ms
VDD2 Start-up Time
5.2
5.2
30.4
5.8
ms
VDD3 Start-up Time
5.8
ms
All Regulators ON To RSTB High
33.6
ms
32
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
When RUN state is reached from the STANDBY state, the power supplies are sequentially
started-up according to the Figure 11-6.
Figure 11-6. AT73C246 - STANDBY to RUN state Supplies Start-Up timing diagram.
SEQUENCE A
SEQUENCE B
STANDBY
STATE
STANDBY
STATE
SUPPLIES START UP
SUPPLIES START UP
RUN STATE
RUN STATE
WAKEUP
EVENT
WAKEUP
EVENT
TON_SYS
TON_SYS
1V
3.3V
VDD3 ON
or OFF
VDD2 (1V)
VDD3 (3.3V)
TON_VDD2
1.85V
TON_VDD3
1.85V
VDD0
PWM
VDD0
PWM
VDD0 (1.85V)
PFM
VDD0 (1.85V)
PFM
1.2V
1.2V
TON_VDD0
TON_VDD0
VDD1 (1.2V)
PFM
VDD1 (1.2V)
PFM
VDD1
PWM
VDD1
PWM
TPFM
TPFM
TON_VDD1
TON_VDD1
3.3V
1V
VDD3 ON
or OFF
VDD3 (3.3V)
RSTB
VDD2 (1V)
RSTB
VPAD LEVEL
VPAD LEVEL
TON_VDD3
TON_VDD2
TRESET
TRESET
Table 11-5. STANDBY to RUN state timing table
Symbol
Parameter
Comments
Min
Typ
Max
Units
Time from validated WAKEUP event (end of debounce
time when applicable) to VDD2 or VDD3 power on.
TON_SYS
Start-up Time
810
420
900
990
520
µs
µs
Time from validated WAKEUP event (end of debounce
time when applicable) to PFM/PWM switching if
applicable.
PFM/PWM Switching
time
TPFM
470
VDDx is OFF during STANDBY state(1)
VDDx is ON during STANDBY state(1)
5.2
58
5.4
62
5.7
66
ms
µs
TON_VDDx VDDx Start-up Time
All Regulators ON To
RSTB High
TRESET
30.4
32
33.6
ms
Note:
1. VDDx activity during STANDBY state is set by register PMU_STANDBY_SUPPLIES.
11.4.3
STANDBY STATE
When AT73C246 is in STANDBY state:
• VBACKUP is ON.
• VDD{0,1,2,3} are ON or OFF according to the status in register 0x03
(PMU_STANDBY_SUPPLIES)
• VDD4 is ON or OFF according to the status in register 0x0A (VDD4_CTRL)
• Audio function is OFF
• ADC function is ON or OFF according to the status in register 0x30 (ADC_CTRL)
• RSTB pin is forced to ground.
• TWI pins are ignored to prevent TWI registers from corruption
• Led pin is driven according to register PMU_LED (0x0B)
To reach the STANDBY state, the appropriate power supplies are shut down as described in the
Figure 11-7 on page 34.
33
11050A–PMAAC–07-Apr-10
Figure 11-7. AT73C246 - RUN to STANDBY state Supplies Shutdown timing diagram.
SEQUENCE A
SEQUENCE B
RUN
STATE
RUN
STATE
STANDBY
STATE
STANDBY
STATE
SUPPLIES SHUTDOWN
SUPPLIES SHUTDOWN
TSTANDBY
TSTANDBY
STANDBY
EVENT
STANDBY
EVENT
TWAIT +
TOFF_AUDIO
3.3V
TWAIT +
TOFF_AUDIO
1V
RSTB
RSTB
TOFF_VDD3
TOFF_VDD2
(VDD3 ON
or OFF)
(VDD3 ON
or OFF)
VDD3 (3.3V)
VDD2 (1V)
TOFF_VDD1
TOFF_VDD1
1.2V
1.2V
VDD1
PFM
VDD1
PFM
VDD1 (1.2V)
PWM
VDD1 (1.2V)
PWM
TOFF_VDD0
TOFF_VDD0
1.85V
1.85V
1.85V
1.85V
VDD0 (1.85V)
PWM
VDD0
PFM
VDD0 (1.85V)
PWM
VDD0
PFM
TPWM
TPWM
TOFF_VDD2
TOFF_VDD3
1V
3.3V
VDD2 (1V)
VDD3 (3.3V)
Table 11-6. RUN to STANDBY state timing table
Symbol
Parameter
Comments
Min
Typ
Max
Units
STANDBY Event
Detection Time
TSTANDBY
150
460
160
500
170
540
µs
µs
Time from validated WAKEUP event (end of debounce
time when applicable) to PFM/PWM switching if
applicable.
PFM/PWM Switching
time
TPWM
If a WAKEUP event occurs in this window the PMU
automatically restart at the end of the STANDBY
process.
WAKEUP Event
Detection Window
TWAIT
150
160
170
µs
Audio CODEC is ON
486
58
512
62
538
66
ms
µs
µs
Audio CODEC
Shutdown Time
TOFF_AUDIO
Audio CODEC is OFF
VDDx is OFF during both STANBY(1) and RUN(2) states.
VDDx is OFF during STANBY state(1)
VDDx is ON during RUN state(2)
VDDx is ON during STANBY state(1)
VDDx is OFF during RUN state(2)
VDDx is ON during both STANBY(1) and RUN(2) states.
58
62
66
VDDx SHUTDOWN
Time
TOFF_VDDx
.
4.8
5.2
5.4
ms
.
.
4.8
58
5.2
62
5.4
66
ms
µs
.
TON_VDDx
VDDx STARTUP Time
Note:
1. VDDx activity during STANDBY state is set by register PMU_STANDBY_SUPPLIES.
2. VDDx activity during RUN state is set by Bit7 of register VDDx_CTRL.
11.4.4
HRST STATE
HRST state is a transition state used to restart the CPU:
• VDD{0,1,2,3,4} are switched off according to figure Figure 11-8 on page 35 depending on the
previous state
• VDD5 is ON
• RSTB pin is forced to ground
34
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Figure 11-8. AT73C246 - HRST state Supplies Shutdown timing diagram.
SEQUENCE A
SEQUENCE B
RUN / STANDBY /
POWERDOWN
STATE
RUN / STANDBY /
POWERDOWN
STATE
HRST
STATE
HRST
STATE
SUPPLIES SHUTDOWN
SUPPLIES SHUTDOWN
THRST
THRST
HRST_EVENT
EVENT
HRST_EVENT
EVENT
TOFF_AUDIO
TOFF_AUDIO
RSTB
RSTB
3.3V
1V
TOFF_VDD3
TOFF_VDD2
VDD3 (3.3V)
VDD1 (1.2V)
VDD0 (1.85V)
VDD2 (1V)
VDD2 (1V)
VDD1 (1.2V)
VDD0 (1.85V)
VDD3 (3.3V)
TOFF_VDD1
TOFF_VDD1
1.2V
1.2V
1.85V
1.85V
TOFF_VDD0
TOFF_VDD0
TOFF_VDD2
TOFF_VDD3
1V
3.3V
TOFF_PMU
TOFF_PMU
PMU FUNCTIONS
PMU FUNCTIONS
(LDO4, ADC, LED,...)
(LDO4, ADC, LED,...)
Table 11-7. HRST state timing table from RUN STATE
Symbol
Parameter
Comments
Min
58
Typ
62
Max
66
Units
µs
THRST
HRST Event Detection Time
Audio CODEC is ON
486
58
512
62
538
66
ms
µs
TOFF_AUDIO
Audio CODEC Shutdown Time
Audio CODEC is OFF
VDDx is OFF in RUN state(1)
VDDx is ON in RUN state(1)
58
62
66
µs
TOFF_VDDx
TOFF_PMU
Note:
Table 11-8. HRST state timing table from STANDBY STATE
VDDx SHUTDOWN Time
4.8
1.4
5.2
1.5
5.4
1.6
ms
ms
PMU Functions Shutdown Time
1. VDDx activity during RUN state is set by Bit7 of register VDDx_CTRL
Symbol
Parameter
Comments
Min
Typ
Max
Units
HRST Event Detection
Time
THRST
58
62
66
µs
Audio CODEC is ON
486
58
512
62
538
66
ms
µs
Audio CODEC Shutdown
Time
TOFF_AUDIO
Audio CODEC is OFF
VDDx is OFF during STANDBY state(1)
VDDx is ON during STANDBY state(1)
VDD4 is OFF in RUN state(2)
VDD4 is ON in RUN state(2)
58
62
66
µs
TOFF_VDDx
VDDx SHUTDOWN Time
VDD4 SHUTDOWN Time
4.8
58
5.2
62
5.4
66
ms
µs
TOFF_VDD4
4.8
5.2
5.4
ms
PMU Functions Shutdown
Time
TOFF_PMU
1.4
1.5
1.6
ms
Notes: 1. VDDx activity during STANDBY state is set by register PMU_STANDBY_SUPPLIES.
2. VDD4 activity during RUN state is set by Bit7 of register VDD4_CTRL.
35
11050A–PMAAC–07-Apr-10
11.5 DCDC0 and DCDC1 Functional Description
DCDC0 and DCDC1 are 2 identical high performance synchronous step-down (buck) convert-
ers. They feature:
• 2 control modes: PFM and PWM,
• A soft start circuit,
• A software programmable output voltage between 0.8 and 3.6V with automatic ramping for
DVS application,
• An Over-Current-Protection circuit,
• A 180 degree out of phase operating mode.
11.5.1
PFM and PWM Control Modes
Pulse Frequency Modulation control is an hysteretic control of the output voltage. It is specially
intended for light loads (< 50mA typ). In this mode, the DCDC converter exhibits a very low qui-
escent current (< 50µA) thus achieving very high efficiency at light loads. The frequency of
operation in this mode is not fixed but proportional to the load current.
Pulse Width Modulation control is a fixed frequency, variable duty cycle control of the DCDC
converter. It has a fast and precise feedback loop specially intended to handle hard loads and
low output ripple voltage.
At start-up, DCDC0 and DCDC1 operate in PWM mode. This way, high load at CPU boot are
properly handled. Through software control in registers VDD0_CTRL (0x06) and VDD1_CTRL
(0x07), the user may enter the low-power mode (PFM) when the application consumption is
reduced.
11.5.2
11.5.3
Soft-start Circuit
DCDC0 and DCDC1 feature a soft start circuit to prevent high input current while charging the
output capacitor from 0V to the default output voltage. Typically, the in-rush current at start-up
(with no load) is limited to 30 mA.
Output Voltage Programming
DCDC0 and DCDC1 output voltages can be managed through software control in registers
VDD0_CTRL (0x06) and VDD1_CTRL (0x07). 50mV steps are provided from 0.8V to 3.6V. It is
recommended to use the automatic ramping function in register PMU_SUPPLY_CTRL (0x04) to
achieve smooth operation. When the DVS_VDD{0,1} bit is active (default mode), output voltages
are ramped from the current value to the final value in 50mV / 280us steps. For users who intend
to disable the DVS_VDD{0,1} bit, a maximum of 4 steps (= 200mV) per 100us is allowed.
At power up, DCDC0 and DCDC1 default output voltages are respectively 1.85V and 1.20V. For
different default output voltages, please contact Atmel.
11.5.4
180° Out-of-phase Operation
DCDC0 and DCDC1 can be operated in-phase or at 180° out-of-phase according to the selec-
tion bit in register PMU_SUPPLY_CTRL (0x04). When operated in phase both converters will
start charging their inductor at the same time. When operated at 180° out-of-phase, the inductor
charge start time will be shifted by half a 2MHz clock delay (= 250ns) from one converter to the
other. This latter scheme tends to average the input current of both DCDC converters.
36
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.6 LDO2 Functional Description
LDO2 is a linear voltage regulator intended to supply CPU core voltages in the range 0.8V to
1.35V. Its maximum input voltage is 3.6V. Thus, it must not be wired to the VIN plane with VIN-
SYS, VIN0, VIN1, VIN3 and VIN4 if VIN is above 3.6V. Considering its low-output voltage and
for the sake of efficiency and power dissipation, the user may connect it at the output of DCDC0.
This LDO features:
• A soft start circuit,
• A software programmable output voltage between 0.8 and 1.35V with automatic ramping for
DVS application.
11.6.1
11.6.2
Soft-start Circuit
LDO2 features a soft start circuit to prevent high input current while charging the output capaci-
tor from 0V to the default output voltage. This soft start circuit limits the input current during 5ms
(+/-5%) at startup to 200mA in typical conditions. After this delay, LDO2 recovers full current
capability.
Output Voltage Programming
LDO2 output voltage can be managed through software control in register VDD2_CTRL (0x08).
50mV steps are provided from 0.8V to 1.35V. It is recommended to use the automatic ramping
function in register PMU_SUPPLY_CTRL (0x04) to achieve smooth operation. When the
DVS_VDD2 bit is active (default mode), output voltages are ramped from the current value to
the final value in 50mV / 600us steps.
At power up, LDO2 default output voltage is 1V. For different default output voltage, please con-
tact Atmel.
11.7 LDO3 and LDO4 Functional Description
LDO3 and LDO4 are low dropout linear voltage regulators intended to supply CPU peripherals
(I/Os, analog functions) in the range 2.7V to 3.6V. They can be operated directly from a 5.5V
maximum input voltage. They feature:
• A soft start circuit,
• A software programmable output between 2.7V and 3.6V voltage with automatic ramping for
DVS application,
11.7.1
11.7.2
Soft-start Circuit
LDO3 and LDO4 feature a soft start circuit to prevent high input current while charging the out-
put capacitor from 0V to the default output voltage. This soft start circuit limits the input current
during 5ms (+/-5%) at startup to 200mA in typical conditions. After this delay, LDO3(4) recovers
full current capability.
Output Voltage Programming
LDO3 and LDO4 output voltages can be managed through software control in registers
VDD3_CTRL (0x09) and VDD4_CTRL (0x0A). 50mV steps are provided from 2.7V to 3.6V. It is
recommended to use the automatic ramping function in register PMU_SUPPLY_CTRL (0x04) to
achieve smooth operation. When the DVS_VDD{3,4} bit is active (default mode), output voltages
are ramped from the current value to the final value in 50mV / 600us steps.
37
11050A–PMAAC–07-Apr-10
At power up, LDO3 an LDO4 default output voltages are both 3.3V. For different default output
voltages, please contact Atmel.
11.8 Power Fail Detectors
AT73C246 features a Power Fail detector on each CPU supplies (VDD0, VDD1, VDD2, VDD3). This
function is made of a comparator that toggles each time one the listed power supplies goes
below a defined threshold. The comparator toggling is considered by the PMU digital state
machine as a POWER-FAIL event.
The threshold value of the power fail detector is proportional to the output voltage of the regula-
tor. It is not a fixed voltage, it is adapted to the programmed output voltage. The default
threshold value is set according to register PMU_RST_LVL (0x05) and can be programmed to
another value through TWI access. For other default threshold values at startup, please contact
Atmel.
11.9 Measurement Bridge and 10-bit ADC
AT73C246 features a 10-channel measurement chain including:
• A multiplexer + attenuator followed by a unity gain buffer
• A 300kS/s 10-bit SAR ADC.
ADC function is enabled through the register ADC_CTRL (0x30). ADC_MUX_1 (0x31) and
ADC_MUX_2 (0x32) allow the selection of inputs to be measured. 1 to 10 inputs can be
selected. The ADC will then perform serial conversion on these inputs and write the correspond-
ing result in registers 0x33 to 0x49.
2 sampling modes are provided to perform periodic conversions:
• Max speed
• Low speed.
To enter these modes, refer to the sampling period bits (TS) in the register ADC_CTRL (0x30).
When MAX_SPEED mode is selected, the ADC runs at 300kS/s and loop without any dead time
over the selected inputs. When a LOW_SPEED sampling period is selected, the ADC performs
a set of input conversions (1 to 10) at 300kS/s and then wait for one sampling period (defined by
TS bits) to start another set of conversions.
38
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Figure 11-9. Measurement Bridge and 10-bit ADC Block Diagram.
ADC_MUX_1 0x31
ADC_MUX_2 0x32
VINSYS
VDD0
VDD1
VDD2
VDD3
VDD4
VDDC
TWI Registers
ADC_ANA0_MSB
ADC_ANA0_LSB
VREFP
MUX
10
1
BUFFER
ADC
ADCOUT <9:0>
VREFN
ANA0
ANA1
ANA2
ANA3
ADC_ANA_LSB
GNDSYS
ADC_CTRL 0x30
39
11050A–PMAAC–07-Apr-10
11.10 Real Time Clock (RTC) User Interface
Figure 11-10. RTC Block Diagram
RTC DATA 3
RTC DATA 2
RTC DATA 1
RTC DATA 0
CONTROL REGISTER
MODE REGISTER
TIME REGISTER
RTC_SEL
CALENDAR REGISTER
TIME ALARM REGISTER
CALENDAR ALARM REGISTER
STATUS REGISTER
RTC_EN
RTC
CTRL
RTC
STATUS CLEAR COMMAND REGISTER
INTERRUPT ENABLE REGISTER
INTERRUPT DISABLE REGISTER
INTERRUPT MASK REGISTER
VALID ENTRY REGISTER
RTC_WRITE
VERSION REGISTER
RESERVED REGISTER
RTC ADDR
Table 11-9.
Offset
0x00
Register Mapping
Register
Name
RTC_CR
Access
Read-write
Read-write
Read-write
Read-write
Read-write
Read-write
Read-only
Write-only
Write-only
Write-only
Read-only
Read-only
Read-only
---
Reset
Control Register
0x0
0x04
Mode Register
RTC_MR
0x0
0x08
Time Register
RTC_TIMR
RTC_CALR
RTC_TIMALR
RTC_CALALR
RTC_SR
0x0
0x0C
0x10
Calendar Register
Time Alarm Register
Calendar Alarm Register
Status Register
0x01819819
0x0
0x14
0x01010000
0x18
0x0
---
0x1C
0x20
Status Clear Command Register
Interrupt Enable Register
Interrupt Disable Register
Interrupt Mask Register
Valid Entry Register
Version Register(1)
Reserved Register
RTC_SCCR
RTC_IER
---
0x24
RTC_IDR
RTC_IMR
RTC_VER
RTC_VERSION
---
---
0x28
0x0
0x0
---
0x2C
0xFC
0xFC
---
Note:
1. Values in the Version Register vary with the version of the IP block implementation.
40
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.1 RTC Register Read/Write Operation
Figure 11-11. RTC Read Operation
WRITE
RTC_ADDR
WRITE 02
@RTC_CTRL
WRITE 03
@RTC_CTRL
WRITE 02
@RTC_CTRL
READ
RTC_DATA3
READ
RTC_DATA2
READ
RTC_DATA1
READ
RTC_DATA0
WRITE 00
@RTC_CTRL
TWI ACCESS
RTC_EN = 0
RTC_EN = 1
RTC_EN = 0
RTC_EN = 0
RTC_SEL = 1
RTC_WRITE = 0
RTC_SEL = 1
RTC_WRITE = 0
RTC_SEL = 1
RTC_WRITE = 0
RTC_SEL = 0
RTC_WRITE = 0
RTC_ADDR
RTC_DATA
RTC_EN
RTC_SEL
RTC_WRITE
Figure 11-12. RTC Write Operation
WRITE
RTC_ADDR
WRITE
RTC_DATA3
WRITE
RTC_DATA2
WRITE
RTC_DATA1
WRITE
RTC_DATA0
WRITE 06
@RTC_CTRL
WRITE 07
@RTC_CTRL
WRITE 06
@RTC_CTRL
WRITE 00
@RTC_CTRL
TWI ACCESS
RTC_EN = 0
RTC_EN = 1
RTC_EN = 0
RTC_EN = 0
RTC_SEL = 1
RTC_WRITE = 1
RTC_SEL = 1
RTC_WRITE = 1
RTC_SEL = 1
RTC_WRITE = 1
RTC_SEL = 0
RTC_WRITE = 0
RTC_ADDR
RTC_DATA
RTC_EN
RTC_SEL
RTC_WRITE
41
11050A–PMAAC–07-Apr-10
11.10.2 RTC Control Register
Name:
RTC_CR
Read-write
0x00
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
16
CALEVSEL
TIMEVSEL
15
–
14
–
13
–
12
–
11
–
10
–
9
8
7
6
5
4
3
2
1
0
–
–
–
–
–
–
UPDCAL
UPDTIM
• UPDTIM: Update Request Time Register
0 = No effect.
1 = Stops the RTC time counting.
Time counting consists of second, minute and hour counters. Time counters can be programmed once this bit is set and
acknowledged by the bit ACKUPD of the Status Register.
• UPDCAL: Update Request Calendar Register
0 = No effect.
1 = Stops the RTC calendar counting.
Calendar counting consists of day, date, month, year and century counters. Calendar counters can be programmed once
this bit is set.
• TIMEVSEL: Time Event Selection
The event that generates the flag TIMEV in RTC_SR (Status Register) depends on the value of TIMEVSEL.
0 = Minute change.
1 = Hour change.
2 = Every day at midnight.
3 = Every day at noon.
• CALEVSEL: Calendar Event Selection
The event that generates the flag CALEV in RTC_SR depends on the value of CALEVSEL.
0 = Week change (every Monday at time 00:00:00).
1 = Month change (every 01 of each month at time 00:00:00).
2, 3 = Year change (every January 1 at time 00:00:00)
42
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.3 RTC Mode Register
Name:
RTC_MR
Read-write
0x04
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
–
–
–
–
HRMOD
• HRMOD: 12-/24-hour Mode
0 = 24-hour mode is selected.
1 = 12-hour mode is selected.
All non-significant bits read zero.
43
11050A–PMAAC–07-Apr-10
11.10.4 RTC Time Register
Name:
RTC_TIMR
Read-write
0x08
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
21
13
5
20
12
4
19
18
10
2
17
16
AMPM
HOUR
15
–
14
6
11
9
8
MIN
7
3
1
0
–
SEC
• SEC: Current Second
The range that can be set is 0 - 59 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
• MIN: Current Minute
The range that can be set is 0 - 59 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
• HOUR: Current Hour
The range that can be set is 1 - 12 (BCD) in 12-hour mode or 0 - 23 (BCD) in 24-hour mode.
• AMPM: Ante Meridiem Post Meridiem Indicator
This bit is the AM/PM indicator in 12-hour mode.
0 = AM.
1 = PM.
All non-significant bits read zero.
44
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.5 RTC Calendar Register
Name:
RTC_CALR
Read-write
0x0C
Access:
Address:
31
–
30
–
29
21
13
5
28
20
12
4
27
19
11
26
25
17
9
24
16
8
DATE
23
22
18
DAY
MONTH
15
14
6
10
2
YEAR
7
3
1
0
–
CENT
• CENT: Current Century
The range that can be set is 19 - 20 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
• YEAR: Current Year
The range that can be set is 00 - 99 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
• MONTH: Current Month
The range that can be set is 01 - 12 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
• DAY: Current Day
The range that can be set is 1 - 7 (BCD).
The coding of the number (which number represents which day) is user-defined as it has no effect on the date counter.
• DATE: Current Date
The range that can be set is 01 - 31 (BCD).
The lowest four bits encode the units. The higher bits encode the tens.
All non-significant bits read zero.
45
11050A–PMAAC–07-Apr-10
11.10.6 RTC Time Alarm Register
Name:
RTC_TIMALR
Read-write
0x10
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
22
21
13
5
20
12
4
19
18
10
2
17
16
HOUREN
AMPM
HOUR
15
14
6
11
9
8
MINEN
MIN
7
3
1
0
SECEN
SEC
• SEC: Second Alarm
This field is the alarm field corresponding to the BCD-coded second counter.
• SECEN: Second Alarm Enable
0 = The second-matching alarm is disabled.
1 = The second-matching alarm is enabled.
• MIN: Minute Alarm
This field is the alarm field corresponding to the BCD-coded minute counter.
• MINEN: Minute Alarm Enable
0 = The minute-matching alarm is disabled.
1 = The minute-matching alarm is enabled.
• HOUR: Hour Alarm
This field is the alarm field corresponding to the BCD-coded hour counter.
• AMPM: AM/PM Indicator
This field is the alarm field corresponding to the BCD-coded hour counter.
• HOUREN: Hour Alarm Enable
0 = The hour-matching alarm is disabled.
1 = The hour-matching alarm is enabled.
46
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.7 RTC Calendar Alarm Register
Name:
RTC_CALALR
Read-write
0x14
Access:
Address:
31
30
–
29
28
20
27
19
26
25
17
24
16
DATEEN
DATE
23
22
–
21
–
18
MTHEN
MONTH
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
–
–
–
–
–
• MONTH: Month Alarm
This field is the alarm field corresponding to the BCD-coded month counter.
• MTHEN: Month Alarm Enable
0 = The month-matching alarm is disabled.
1 = The month-matching alarm is enabled.
• DATE: Date Alarm
This field is the alarm field corresponding to the BCD-coded date counter.
• DATEEN: Date Alarm Enable
0 = The date-matching alarm is disabled.
1 = The date-matching alarm is enabled.
47
11050A–PMAAC–07-Apr-10
11.10.8 RTC Status Register
Name:
RTC_SR
Read-only
0x18
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
CALEV
TIMEV
SEC
ALARM
ACKUPD
• ACKUPD: Acknowledge for Update
0 = Time and calendar registers cannot be updated.
1 = Time and calendar registers can be updated.
• ALARM: Alarm Flag
0 = No alarm matching condition occurred.
1 = An alarm matching condition has occurred.
• SEC: Second Event
0 = No second event has occurred since the last clear.
1 = At least one second event has occurred since the last clear.
• TIMEV: Time Event
0 = No time event has occurred since the last clear.
1 = At least one time event has occurred since the last clear.
The time event is selected in the TIMEVSEL field in RTC_CTRL (Control Register) and can be any one of the following
events: minute change, hour change, noon, midnight (day change).
• CALEV: Calendar Event
0 = No calendar event has occurred since the last clear.
1 = At least one calendar event has occurred since the last clear.
The calendar event is selected in the CALEVSEL field in RTC_CR and can be any one of the following events: week
change, month change and year change.
48
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.9 RTC Status Clear Command Register
Name:
RTC_SCCR
Write-only
0x1C
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
CALCLR
TIMCLR
SECCLR
ALRCLR
ACKCLR
• ACKCLR: Acknowledge Clear
0 = No effect.
1 = Clears corresponding status flag in the Status Register (RTC_SR).
• ALRCLR: Alarm Clear
0 = No effect.
1 = Clears corresponding status flag in the Status Register (RTC_SR).
• SECCLR: Second Clear
0 = No effect.
1 = Clears corresponding status flag in the Status Register (RTC_SR).
• TIMCLR: Time Clear
0 = No effect.
1 = Clears corresponding status flag in the Status Register (RTC_SR).
• CALCLR: Calendar Clear
0 = No effect.
1 = Clears corresponding status flag in the Status Register (RTC_SR).
49
11050A–PMAAC–07-Apr-10
11.10.10 RTC Interrupt Enable Register
Name:
RTC_IER
Write-only
0x20
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
CALEN
TIMEN
SECEN
ALREN
ACKEN
• ACKEN: Acknowledge Update Interrupt Enable
0 = No effect.
1 = The acknowledge for update interrupt is enabled.
• ALREN: Alarm Interrupt Enable
0 = No effect.
1 = The alarm interrupt is enabled.
• SECEN: Second Event Interrupt Enable
0 = No effect.
1 = The second periodic interrupt is enabled.
• TIMEN: Time Event Interrupt Enable
0 = No effect.
1 = The selected time event interrupt is enabled.
• CALEN: Calendar Event Interrupt Enable
0 = No effect.
• 1 = The selected calendar event interrupt is enabled.
50
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
11.10.11 RTC Interrupt Disable Register
Name:
RTC_IDR
Write-only
0x24
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
CALDIS
TIMDIS
SECDIS
ALRDIS
ACKDIS
• ACKDIS: Acknowledge Update Interrupt Disable
0 = No effect.
1 = The acknowledge for update interrupt is disabled.
• ALRDIS: Alarm Interrupt Disable
0 = No effect.
1 = The alarm interrupt is disabled.
• SECDIS: Second Event Interrupt Disable
0 = No effect.
1 = The second periodic interrupt is disabled.
• TIMDIS: Time Event Interrupt Disable
0 = No effect.
1 = The selected time event interrupt is disabled.
• CALDIS: Calendar Event Interrupt Disable
0 = No effect.
1 = The selected calendar event interrupt is disabled.
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11050A–PMAAC–07-Apr-10
11.10.12 RTC Interrupt Mask Register
Name:
RTC_IMR
Read-only
0x28
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
CAL
TIM
SEC
ALR
ACK
• ACK: Acknowledge Update Interrupt Mask
0 = The acknowledge for update interrupt is disabled.
1 = The acknowledge for update interrupt is enabled.
• ALR: Alarm Interrupt Mask
0 = The alarm interrupt is disabled.
1 = The alarm interrupt is enabled.
• SEC: Second Event Interrupt Mask
0 = The second periodic interrupt is disabled.
1 = The second periodic interrupt is enabled.
• TIM: Time Event Interrupt Mask
0 = The selected time event interrupt is disabled.
1 = The selected time event interrupt is enabled.
• CAL: Calendar Event Interrupt Mask
0 = The selected calendar event interrupt is disabled.
1 = The selected calendar event interrupt is enabled.
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11050A–PMAAC–07-Apr-10
AT73C246
11.10.13 RTC Valid Entry Register
Name:
RTC_VER
Read-only
0x2C
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
–
17
–
16
–
15
–
14
–
13
–
12
–
11
–
10
–
9
8
–
–
7
6
5
4
3
2
1
0
–
–
–
–
NVCALALR
NVTIMALR
NVCAL
NVTIM
• NVTIM: Non-valid Time
0 = No invalid data has been detected in RTC_TIMR (Time Register).
1 = RTC_TIMR has contained invalid data since it was last programmed.
• NVCAL: Non-valid Calendar
0 = No invalid data has been detected in RTC_CALR (Calendar Register).
1 = RTC_CALR has contained invalid data since it was last programmed.
• NVTIMALR: Non-valid Time Alarm
0 = No invalid data has been detected in RTC_TIMALR (Time Alarm Register).
1 = RTC_TIMALR has contained invalid data since it was last programmed.
• NVCALALR: Non-valid Calendar Alarm
0 = No invalid data has been detected in RTC_CALALR (Calendar Alarm Register).
1 = RTC_CALALR has contained invalid data since it was last programmed.
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11050A–PMAAC–07-Apr-10
11.10.14 RTC Version register
Name:
RTC_VERSION
Read-only
0xFC
Access:
Address:
31
–
30
–
29
–
28
–
27
–
26
–
25
–
24
–
23
–
22
–
21
–
20
–
19
–
18
10
2
17
16
MFN
15
–
14
–
13
–
12
–
11
9
1
8
VERSION
7
6
5
4
3
0
VERSION
• VERSION
Reserved. Value subject to change. No funcionality associated. This is the Atmel internal version of the macrocell.
• MFN
Reserved. Value subject to change. No funcionality associated.
11.11 Die Temperature Sensor
The AT73C246 features a die temperature sensor for protection reasons. If the junction temper-
ature rises above the shutdown threshold for a minimum time of 1ms (+/- 5%), the power
manager event TJ > 130°C is asserted. In a similar fashion, if the temperature falls through the
restart threshold for more than 1ms, the power manager event TJ <110°C is asserted.
The two internal thresholds shutdown and restart are defined in Section 9.11 “Die Temperature
Sensor” on page 21.
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12. Audio Codec Functional Description
12.1 Description
AT73C246 features a high quality, low power stereo audio codec with integrated headphone
amplifier.
The playback channel accommodates 16 to 24-bit stereo programmable format entering the dig-
ital audio interface (I2S) and delivers an internal analog audio output through a 100dB SNR
Sigma Delta Stereo DAC. An output mixer allows to mix this DAC output with a line / aux or
microphone input.
A 16-32 Ohms Stereo headphone amplifier with virtual ground output provides a 97dB SNR out-
put for line / headphone loads. The virtual ground output allows to remove 2 space demanding
coupling capacitors on board.
On the record side, a multiplexer can select between a main stereo line input and a stereo auxil-
iary input such as an FM radio. A stereo microphone input with up to 46dB gain is provided. A
stereo input mixer allows mixing between line (or aux) and microphone channels before entering
a 96dB SNR Stereo Sigma Delta ADC. The digital audio signal is then digitally filtered and trans-
ferred to the I2S audio interface.
12.2 Audio Codec Block Diagram
Figure 12-1. Audio Codec Block Diagram
BYPASS
0 -> -30dB
1dB Step
-34 -> +12dB
1dB Step
MUX
LINL
-77/+6dB
1dB Step
AUXL
ADC
DAC
HPL
0 -> +46dB
1dB Step
MICL
DSP
+
Audio
Controller
MICLN
VMID
HPVCM
0 -> +46dB
1dB Step
MICR
-77/+6dB
1dB Step
MICRN
ADC
DAC
HPR
-34 -> +12dB
1dB Step
MUX
LINR
AUXR
HPDET
0 -> -30dB
1dB Step
BYPASS
Codec Bias
200K
I²S
2K
200K
MICBIAS AVDD
VMID AGND
PAO
DAI
LRFS BCLK MCLK
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11050A–PMAAC–07-Apr-10
12.3 Audio Codec Controls
Figure 12-2. Audio Codec Controls
RHSBOTH
LHSBOTH
ENASR
ASRTIME
STDBY
ENAC
LINBOTH
RINBOTH
PATHSEL
BCLKINV
MASTER
MCLKSEL
SSCMODE
WL
DAIMODE
SELFS
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AT73C246
12.4 Audio Controller
The audio controller sequences the power-up and power-down of the audio codec sub-functions
(Mic.amp / ADC / DAC / …). During these transitioning phases, the controller also manages the
gain steps to fade them in and out, thus providing smooth operation.
Depending on the application, two modes are provided:
1. Automatic path control
Dedicated to the major audio path scenarios (those described in Table 13-25 on page 95), this
mode enables the whole audio path setup only via "PATHSEL" bits in register AUTOSTART
(0x10).
2. Custom path control
Dedicated to audio path scenarios not described in the previously mentioned table, this mode
brings the flexibility to start manually the audio sub-functions.
The following figure shows the global context of the audio codec control.
Figure 12-3. Audio Codec Typical Control Sequence
Apply Supply
& MCLK
1
Registers to set
AUDIO_CONTROL (0x11)
(Set DCBlock bit here)
:
Configure
Analog & Digital
Interfaces
-
Registers to set
See dedicated sections.
Automatic path
control
Custom path
control
6
2
-
-
-
-
MIC_CONTROL (0x12)
DAI_CONTROL (0x13)
FRAME_CONTROL (0x14)
Register to set
MUTE (0x15)
:
Register to set
:
Shutdown
Audio Codec
-
Unmute Codec
3
4
7
-
AUTOSTART (0x10)
Start Audio
Codec in
Standby
8
Register to set
:
At least 1s.
See “Power-off Time”
-
AUTOSTART (0x10)
-
Software
Wait
section.
5
Typically 350ms.
See VMID section.
Register to set
:
Unset
DCBLOCK bit
-
9
-
-
AUDIO_CONTROL (0x11)
See “AC/DC coupled load
Software
Wait
management” section.
Remove MCLK
& supply
10
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11050A–PMAAC–07-Apr-10
12.4.1
Audio Codec General Recommendations
12.4.1.1
VMID
• VMID is the common mode voltage of the audio codec analog core. It is recommended to
decouple this voltage with a 1uF capacitor to ensure low noise operation as well as slow
(thus silent) transients at codec power up and power down.
• The VMID capacitor is charged and discharged whenever the ENAC bit is set or cleared.
Particularly, placing the audio codec in STANDBY mode does not discharge the VMID
capacitor. The software WAIT operations in the previous diagram (step #5 and step #8 in
“Audio Codec Typical Control Sequence” on page 57) should accommodate VMID's settling
time constant. See “Audio Codec Bias” on page 22..
12.4.1.2
AC / DC Coupled Load Management
• By default the audio codec is in DC-coupled load configuration: DCBLOCK = 0 in register
AUDIO_CONTROL(0x11). In this case, a virtual ground voltage is provided on pin HPVCM (a
buffered version of VMID). It allows to directly connect headphones or line loads between
HPVCM and HPL(or R) without any coupling capacitors. To prevent any audio pop at start-up
or shutdown in this DC coupling mode, the audio codec fastly starts HPL, HPR and HPVCM
outputs shorted all together. No software management is required to achieve pop-less
operation.
• If output loads are AC coupled to the headphone amplifier, the audio codec DCBLOCK bit
must be set and unset as described in “Audio Codec Typical Control Sequence” on page 57.
This bit partially controls the two switches S1 and S2 described in the following figure. When
DCBLOCK = 1 and the headphone amplifier is OFF, the output coupling capacitors are
charged and discharged by the amplifier “VMID_BUFFER”. In order to achieve silent startup
and shutdown, the following rules must be respected:
– DCBLOCK = 0 at supply power-on and power-off. This ensures that the LDO4
power-on and power-off transients are not transmitted to the audio loads.
– DCBLOCK = 1 when ENAC = 1. Particularly, DCBLOCK must be set before
ENAC=1 and unset after ENAC=0. This ensures that the full VMID waveform is
properly buffered to the output loads.
– DCBLOCK = 1 after ENAC = 0 and until VMID capacitor is fully discharged. At codec
shutdown (ENAC=0), VMID will discharge slowly. The VMID_BUFFER ensures slow
and silent discharge of the output coupling capacitors, and needs S1 and S2 to be
closed.
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AT73C246
Figure 12-4. AC / DC Coupled Load Management Schematic View
VIN4
AT73C246
CL
LDO4
HPL
LEFT
VDD4
S1
RL
10uF
ENAC
DCBLOCK.ONHP
AVDD
VMID
VMID
BUFFER
RR
CR
S2
200k
RIGHT
HPR
200k
1uF
AGND
Figure 12-5. Audio Codec Typical Startup and Shutdown Waveforms With AC Coupled Loads.
VDD4
VMID
HP(L/R)
DCBLOCK
ENAC
STANDBY
S1 & S2
S1 AND S2 OPENED
BY AUDIO CODEC
12.4.1.3
12.4.1.4
12.4.1.5
MUTE Register
By default, the audio codec starts muted. To enable the audio processing, the MUTE register
(0x15) must be cleared. Unmute operation can be performed before or after releasing the
STANDBY mode. During operation, this register provides a convenient way of muting the audio
signal without changing the various gain registers.
Master Clock Input (MCLK)
The Audio Controller is clocked by MCLK pin. Therefore a clock must be present at this pin
before each codec control change. Particularly, the master clock must be present at power-on,
power-off, gain change, path change. The master clock must also be available when fully analog
path are used.
Power-off Conditions
Three audio codec power-off conditions can occur:
• Sofware request (ENAC = 0 in AUTOSTART register). In this case, the codec is smoothly
powered off by the audio controller.
• PMU Power-off event or Standby event (as defined in Section 11.3 “Power Manager
Conditional Transitions” on page 27). In this case, the codec is smoothly powered off with a
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11050A–PMAAC–07-Apr-10
500ms timeout. Contrary to the first point, which has no timeout, the audio power-off time
limit is here fixed to 500ms. Beyond this limit, the codec is hardly reseted as in the following
point.
• PMU Power-fail event. In this case, the PMU finite state machine makes an immediate hard
reset of the audio codec to ensure fast shutdown. This case may generate an audible click /
pop noise.
12.4.1.6
Power-off Time
At power-off, the audio controller needs to perform several controls on audio codec sub-func-
tions and to discharge the output coupling capacitors. Therefore, the codec’s power-off time is
divided into:
• a digital power-off time and,
• an analogue one.
During this power-off phase, the codec‘s master clock and supply must be present. See “Audio
Codec Power-off Waveforms” on page 60.
Figure 12-6. Audio Codec Power-off Waveforms
VDD4
MCLK
ENAC
VMID
analog
power-off
time
AUDIO
SIGNAL
digital
power-off
time
The digital power-off time depends on the number of controls (power-off, gain steps ramping, ...)
to perform and for this reason strongly varies according to:
• the master clock frequency,
• the current path,
• the current gains and
• the current Automatic Soft Ramping time (ASR_TIME in AUDIO_CONTROL(0x11)).
In worst case conditions (slowest clock, maximum ASR_TIME, maximum complexity audio path,
maximum gains everywhere), the power-off time reaches 3 seconds. During this period, the
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AT73C246
master clock must be running to properly shutdown the codec. This time linearly varies with
ASR_TIME value. See Table 12-1
Table 12-1. Audio Codec Maximum Power-off Time
ASR_TIME
Power-off time (ms)
00
01
10
11
375
750
1500
3000
The analog power-off time corresponds to the VMID’s discharge time specified in “Audio Codec
Bias” on page 22: TMID_OFF
.
Finally, the wait step #8 in “Audio Codec Typical Control Sequence” on page 57 needs to acco-
modate the digital power-off time + the analog power-off time.
12.4.2
Automatic Path Configuration
In this automatic path mode, the audio path control is fully managed by the AUTOSTART(0x10)
register and more precisely by the following bits:
• ENAC (Enable Audio codec),
• STANDBY(1) (Audio standby) and
• PATHSEL (Audio path selection).
When the audio controller detects a change in these bits, it generates sequential controls to the
audio codec sub-functions (power-up, gain ramping, unmute,…) with the right timing and order.
Notes: 1. Audio STANDBY does not refer to the PMU STANDBY state as defined in “AT73C246 Power
Manager Functional State Diagram” on page 25. The audio STANDBY mode activated by reg-
ister AUTOSTART (0x10) only refers to the audio codec controller.
12.4.2.1
STANDBY Release
Once the CODEC is started and in standby mode (ENAC=1 and STANDBY=1, step #5 in “Audio
Codec Typical Control Sequence” on page 57), the audio path is simply selected by PATHSEL
bits.
At STANDBY release (STANDBY=0), the audio controller will:
• Power-up the requested audio sub-functions. To do so, the audio controller makes WRITE
accesses to the registers
– INPUT_CONTROL (0x1E),
– OUTPUT_CONTROL (0x1F) and
– INPUT_MIXER (0x20).
• Ramp-up the concerned path gains from mute to their current register value.
Notes: 1. Changing PATHSEL value with STANDBY=1 does not changes the codec state. It remains in
STANDBY mode.
2. The audio controller always ensures minimum power consumption by powering only needed
sub-functions.
3. Audio parameters (volume, mute, effects…) can be modified before or after releasing the
standby mode.
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11050A–PMAAC–07-Apr-10
12.4.2.2
Pause Management With STANDBY Bit
To pause the audio codec activity and reduce power consumption to few hundreds of micro-
amps, the STANDBY bit can be activated in register AUTOSTART (0x10). The Audio codec will
then:
• Softly ramp down all the path concerned gains down-to mute and
• Power off all the audio sub-functions. The registers INPUT_CONTROL (0x1E),
OUTPUT_CONTROL (0x1F), and INPUT_MIXER (0x20) are modified by the audio
controller.
Notes: 1. Placing the codec in standby mode maintains the common mode voltage at VMID pin and thus
allows to re-start fastly,
2. Standby release is simply achieved by clearing the STANDBY bit (STANDBY = 0). The proce-
dure described in “STANDBY Release” on page 61 applies.
12.4.2.3
On-the-fly Path Change
The audio controller is able to softly switch from one audio path configuration to another without
shutting down the codec nor entering the STANDBY mode. As soon as it detects a change in the
PATHSEL value, the following mechanism occurs:
• Power up and/or power down of the audio sub-functions according to the final state to reach.
This operation generates automatic changes in the registers INPUT_CONTROL (0x1E),
OUTPUT_CONTROL (0x1F), and INPUT_MIXER (0x20).
• Ramp up and/or ramp down of the concerned path gain.
Notes: 1. A channel may be temporarily and smoothly switched off and on to reach the new path.
2. Any software write operation in the registers INPUT_CONTROL (0x1E), OUTPUT_CONTROL
(0x1F), and INPUT_MIXER (0x20) will generate a series of control on the audio codec sub-
functions. In automatic path control, the order of the write operations in those registers is of
prime importance. Please note that changing those registers updates the used audio path
without updating the PATHSEL value. Therefore, these write operations are not recommended
and must be limited to simple ones (for example changing LINESEL bit in register
INPUT_CONTROL (0x1E) ).
12.4.2.4
Audio Codec Shutdown
The Audio controller will start to shutdown the codec if ENAC = 0. The shutdown sequence is
made of the following steps:
• Softly ramp down all the path concerned gains down-to mute,
• Power off all the audio sub-functions and,
• Power off the common voltage VMID.
Notes: 1. In this mode, the power consumption is reduced to few hundreds of nA.
2. The common mode voltage power-off follows VMID time constant and thus may take a few
hundreds of milliseconds depending on VMID capacitor. See “Audio Codec Bias” on page
22.
A software example of audio codec control using automatic path control is provided in the sec-
tion “Basic Audio Codec Setting Using Automatic Path Control” on page 134.
12.4.3
Custom Path Configuration
In this custom path mode, the audio path control is managed by the following registers:
• AUTOSTART (0x10) (ENAC and STANDBY bits only)
• AUDIO_CONTROL (0x11) (ENCONF and CUSTCONF bits only)
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11050A–PMAAC–07-Apr-10
AT73C246
• INPUT_CONTROL (0x1E)
• OUTPUT_CONTROL (0x1F)
• INPUT_MIXER (0x20)
Like in the automatic path configuration, the audio controller will sequence audio codec sub-
functions ON/OFF as well as gain stepping. However, the audio path is no more selected via the
"PATHSEL" value in register AUTOSTART.
To specify a custom audio path:
• The bit CUSTCONF in register AUDIO_CONTROL (0x11) must be set to '1' to specify the
'custom' path configuration mode.
• The registers INPUT_CONTROL (0x1E), OUTPUT_CONTROL (0x1F), and INPUT_MIXER
(0x20) are set to define the audio path,
• The bit ENCONF in register AUDIO_CONTROL (0x11) is pulsed to '1' to enable the audio
controller sequencing.
Notes: 1. “Pulsed to ‘1’ ”means written to ‘1’ and then written to ’0’.
2. In this mode, the STANDBY bit behaves like in the automatic mode. It is possible to place the
CODEC in standby mode to reduce power consumption during audio pause by simply setting
the STANDBY bit to 1. STANDBY release is achieved by clearing this bit.
3. On-the-fly path change is achieved by modifying the registers INPUT_CONTROL (0x1E),
OUTPUT_CONTROL (0x1F) , and INPUT_MIXER (0x20) to define the new audio path config-
uration and then pulsing to '1' the ENCONF bit. In this case, a channel may be temporarily
(and smoothly) switched off and on to reach the new configuration.
4. Changing the three registers INPUT_CONTROL (0x1E), OUTPUT_CONTROL (0x1F) , and
INPUT_MIXER (0x20) with the ENCONF bit set to ‘1’ makes the changes to take effect imme-
diately. Therefore, the order of write operations is of prime importance. It is then recommended
to write these registers with ENCONF set to 0 and then pulse ENCONF to ‘1’ once the new
audio path is fully specified. Knowing the final state to reach, the audio controller is able to
sequence the controls with the right order and timings to ensure noise-free operation.
5. In this custom mode, the Audio Controller may forbid any configuration that does not make
sense. For example, it will prevent the headphone amplifier from being switched on if it has no
input source (DAC, Microphone, or Line).
6. It is possible and sometimes convenient to switch from an automatically set path to a custom
one. In this case, the audio controller softly performs the required path change. However, acti-
vating an automatic path configuration from a current custom path configuration is not allowed.
The audio codec must be switched off first (ENAC=0).
A software example of audio codec control using custom path control is provided in the section
“Basic Audio Codec Setting Using Custom Path Control” on page 135.
12.5 Audio Codec Power Consumption Versus Programmed Audio Path
Unless otherwise specified:
• AVDD = 3.3V
• MCLK = 12.288MHz , FS = 48KHz
• All Gains set to 0dB
• No audio signal
• TA = 25°C.
• Headphone amplifier set in AC coupling mode.
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11050A–PMAAC–07-Apr-10
• Current consumptions don’t account for load consumption and are measured in AVDD pin and
INSYS pin.
V
Table 12-2. Audio PATH Power Consumption
Consumption
PATH_SEL
AUDIO PATH
Description
Units
VINSYS
AVDD
0.61
5.2
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
No Path
0.10
1.80
0.10
0.10
0.10
2.00
2.00
2.00
2.00
2.00
2.00
2.00
2.00
1.80
1.80
1.80
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
mA
DAC Playback
Mic Sidetone
Digital IN - Headphone OUT
Microphone IN - Headphone OUT
Aux IN - Headphone OUT
2.65
2.65
2.65
3.40
3.40
3.40
5.05
5.05
5.05
3.70
3.70
5.60
5.60
5.60
Aux Bypass
Line Bypass
Line IN - Headphone OUT
Mic IN - Digital OUT
Mic Record
Aux Record
Aux IN - Digital OUT
Line Record
Line IN - DIGITAL OUT
Mic Sidetone + Record
Aux Bypass + Record
Line Bypass + Record
Mic + Aux Record
Mic + Line Record
Mic IN - Headphone and Digital OUT
Aux IN - Headphone and Digital OUT
Line IN - Headphone and Digital OUT
Mic + Aux IN - Digital OUT
Mic + Line IN - Digital OUT
DAC Playback + Mic Sidetone Digital + Mic IN - Headphone OUT
DAC Playback + Aux Bypass
DAC Playback + Line Bypass
Digital + Aux IN - Headphone OUT
Digital + Line IN - Headphone OUT
DAC Playback + Mic Sidetone
+ Aux Bypass
10000
10001
10010
10011
10100
10101
10110
Digital + Mic + Aux IN - Headphone OUT
Digital + Mic + Line IN - Headphone OUT
1.80
1.80
3.80
3.80
3.80
3.80
3.80
5.85
5.85
8.00
8.00
8.00
8.00
8.00
mA
mA
mA
mA
mA
mA
mA
DAC Playback + Mic Sidetone
+ Line Bypass
DAC Playback and
MIC Record
Digital IN - Headphone OUT
Mic IN - Digital OUT
DAC Playback and
Aux Record
Digital IN - Headphone OUT
Aux IN - Digital OUT
DAC Playback and
Line Record
Digital IN - Headphone OUT
Line IN - Digital OUT
DAC Playback + Mic Sidetone Digital + Mic IN - Headphone OUT
and Mic Record
Mic IN - Digital OUT
DAC Playback + Aux Bypass
and Aux Record
Digital + Aux IN - Headphone OUT
Aux IN - Digital OUT
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11050A–PMAAC–07-Apr-10
AT73C246
Table 12-2. Audio PATH Power Consumption
Consumption
PATH_SEL
AUDIO PATH
Description
Units
VINSYS
AVDD
DAC Playback + Line Bypass
and Line Record
Digital + Line IN - Headphone OUT
Line IN - Digital OUT
10111
3.80
8.00
mA
DAC Playback + Mic Sidetone
+ Aux Bypass and
Mic + Aux Record
Digital + Mic + Aux IN - Headphone OUT
Mic + Aux IN - Digital OUT
11000
11001
3.80
3.80
8.25
8.25
mA
mA
DAC Playback + Mic Sidetone
+ Line Bypass and
Mic + Line Record
Digital + Mic + Line IN - Headphone OUT
Mic + Line IN - Digital OUT
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11050A–PMAAC–07-Apr-10
12.6 Digital Audio Interface
12.6.1
General Description
AT73C246 features a 16 to 24-bit multi-mode master / slave I2S port. The following modes are
provided:
• I2S,
• Left Justified,
• Right Justified, and
• SSC
The I2S port is configured through register I2S_CONTROL (0x13) and FRAME_CONTROL
(0x14). For each of the listed modes, the data transfer is described in the following sections.
The following table provides authorized MCLK / FS ratios and associated filter types:
Table 12-3. Authorized MCLK / FS Ratios & Filter Types
12 MHz(1)
12.288 MHz
18.432 MHz
11.2896 MHz
16.9344 MHz
8 KHz
0
0
0
3
4
1
1
3
2
2
2
2
NA
NA
NA
NA
NA
1
NA
NA
NA
NA
NA
1
16 KHz
32 KHz
48 KHz
96 KHz
22.05 KHz
44.1 KHz
88.2 KHz
2
2
1
1
3
3
NA
NA
NA
NA
NA
NA
1
1
3
3
Note:
1. 12.0000 MHz case is not provided if DAI is configured in Right-Justified and Master mode in
DAI_CONTROL (0x13) and FRAME_CONTROL registers (0x14).
12.6.2
Data Transfer: I²S MODE
Figure 12-7. N-bit I²S Mode (FS = 44.1KHz - MCLK = 256 x FS)
MCLK
LRFS
BCLK
SDOUT
SDIN
Ln
Ln-1
L0
Rn
Rn-1
R3
R2
R1
R0
n bits Left Channel
n bits Right Channel
66
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11050A–PMAAC–07-Apr-10
AT73C246
12.6.3
Data Transfer: Left Justified Mode
Figure 12-8. N-bit Left Justified Mode (FS = 44.1KHz - MCLK = 256 x FS)
MCLK
LRFS
BCLK
SDOUT
SDIN
Ln
Ln-1
Ln-2
L0
Rn
Rn-1
Rn-2
R3
R2
R1
R0
n bits Left Channel
n bits Right Channel
12.6.4
Data Transfer: Right Justified Mode
Figure 12-9. N-bit Right Justified Mode (FS = 44.1KHz - MCLK = 256 x FS)
MCLK
LRFS
BCLK
SDOUT
SDIN
Ln
Ln-1
Ln-2
L0
Rn
Rn-1
Rn-2
R3
R2
R1
R0
n bits Right Channel
n bits Left Channel
67
11050A–PMAAC–07-Apr-10
12.6.5
Timing Specifications
Figure 12-10. Timing Diagram of data interface (I²S Mode)
T
LRCLK
TLRCLK
V
IH
LRFS
BCLK
V
IL
T
BCLK
VIH
V
IL
T
HSDX
T
LSDX
V
XH
DAI
MSB
LSB
LSB
MSB
LSB
DAO
V
XL
Word N
Left Channel
Word N-1
Right Channel
Word N
Right Channel
Table 12-4. Digital Audio InterfaceTiming Specifications
Parameter
Symbols
TLRCLK
Min
Typ
1 / (2 x FS)
Max
Unit
Left/Right Word Cycle Time
Bit Clock Period
s
s
TBCLK
TMCLK / 2
5
BCLK Posedge to {DAI, DAO and LRFS} Change
Hold Time
THSDX
TLSDX
ns
ns
{DAI, DAO and LRFS} Change to BCLK
Posedge Setup Time
5
12.7 Digital Filters Transfer Function
12.7.1
DAC Frequency Response
The following diagrams are referred to FS = 1 (Sampling Frequency).
Figure 12-11. DAC Type 0 Frequency Response
Overall
Ripple
68
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11050A–PMAAC–07-Apr-10
AT73C246
Figure 12-12. DAC Type 1 Frequency Response
Overall
Ripple
Ripple
Ripple
Figure 12-13. DAC Type 2 Frequency Response
Overall
Figure 12-14. DAC Type 3 Frequency Response
Overall
69
11050A–PMAAC–07-Apr-10
Figure 12-15. DAC Type 4 Frequency Response
Overall
Ripple
12.7.2
ADC Frequency Response
The following diagrams are referred to FS = 1 (Sampling Frequency).
Figure 12-16. ADC Type 0 Frequency Response
Overall
Ripple
Figure 12-17. ADC Type 1 Frequency Response
Overall
Ripple
70
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11050A–PMAAC–07-Apr-10
AT73C246
Figure 12-18. ADC Type 2 Frequency Response
Overall
Ripple
Figure 12-19. ADC Type 3 Frequency Response
Overall
Ripple
Figure 12-20. ADC Type 4 Frequency Response
Overall
Ripple
71
11050A–PMAAC–07-Apr-10
12.7.3
De-Emphasis Filter Frequency Response
12.7.3.1
De-Emphasis Filter: Frequency Response & Error (FS = 32kHz)
Figure 12-21. De-Emphasis Filter: Frequency Response & Error (FS = 32kHz)
Response
Error
Fequency (Hz)
Fequency (Hz)
12.7.3.2
De-Emphasis Filter: Frequency Response & Error (FS = 44.1kHz)
Figure 12-22. De-Emphasis Filter: Frequency Response & Error (FS = 44.1kHz)
Response
Error
Fequency (Hz)
Fequency (Hz)
12.7.3.3
De-Emphasis Filter: Frequency Response & Error (FS = 48kHz)
Figure 12-23. De-Emphasis Filter: Frequency Response & Error (FS = 48kHz)
Response
Error
Fequency (Hz)
Fequency (Hz)
72
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12.7.4
Equalizer Frequency Response
The following figures show the frequency response of the equalizer function implemented in the
D/A channels.
Figure 12-24. Bass Filters Response
dB
Fs
Figure 12-25. Medium Filters Response
dB
Fs
73
11050A–PMAAC–07-Apr-10
Figure 12-26. Treble Filters Response
dB
Fs
12.8 Analog Audio Interfaces
12.8.1
Microphone Inputs
The following figures show recommended application circuits for microphone inputs
configurations:
• Mono - single-ended and differential microphone
• Stereo - single ended and differential microphone
• Long-wires microphone
Recommended resistor / capacitor / inductor value may be tuned to the final application,
depending on:
• the microphone specified load resistance,
• the high pass filter desired corner frequency,
• the level and frequency of unwanted signals to be rejected.
Depending also on desired high frequency filtering: common-mode or differential, the differential
suggested application diagrams may be modified.
74
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11050A–PMAAC–07-Apr-10
AT73C246
Figure 12-27. Mono - Single Ended and Differential Microphone Applications
VIN4
VIN4
LDO4
LDO4
VDD4
AVDD
VDD4
AVDD
10uF
10uF
2k
2k
MICBIAS
MICBIAS
2k
1k
1k
AT73C246
AT73C246
10uF
10uF
1uF
1uF
1uF
MICL
MICLN
MICR
MICL
MICLN
MICR
2.2nF
M
NC
M
2.2nF
NC
NC
NC
MICRN
MICRN
NC
Figure 12-28. Stereo - Single Ended and Differential Microphone Applications
VIN4
VIN4
LDO4
LDO4
VDD4
AVDD
VDD4
AVDD
470
470
470
470
10uF
10uF
2k
2k
10uF
10uF
10uF
10uF
NC
NC
MICBIAS
MICBIAS
2k
1k
1k
AT73C246
AT73C246
1uF
1uF
MICL
MICL
2.2nF
2.2nF
M
M
1uF
MICLN
NC
MICLN
1k
2k
1uF
1uF
1uF
MICR
MICR
2.2nF
2.2nF
M
M
1k
MICRN
NC
MICRN
Figure 12-29. Long Wires Microphone Applications
VIN4
LDO4
VDD4
VIN4
LDO4
VDD4
AVDD
10uF
10uF
470
470
AVDD
2k
2k
10uF
1k
10uF
NC
MICBIAS
MICBIAS
2k
AT73C246
AT73C246
10uF
10uH
1uF
1uF
MICL
MICL
10uH
2.2nF
1nF
M
long wires
1uF
MICLN
NC
MICLN
10uH
M
2.2nF
1nF
1k
long wires
1k
10uH
1uF
1uF
MICR
NC
NC
MICR
1nF
10uH
M
2.2nF
long wires
MICRN
MICRN
1k
75
11050A–PMAAC–07-Apr-10
12.8.2
Aux / Line Inputs
Figure 12-30. Aux and Line Input Application Circuits
3.3uF
100
AUXL
10nF
10nF
ON-BOARD
AUDIO IC
SOURCE
(FM receiver, ...)
AUXR
100
3.3uF
3.3uF
AT73C246
100
LINL
LINR
10nF
10nF
jack
100
3.3uF
12.8.3
Line / Headphone Outputs
Figure 12-31. AC Coupled Output Application Circuits
3.3uF
330uF
100
HPR
HPR
HPVCM
HPL
jack
jack
HPVCM
NC
NC
AT73C246
AT73C246
line-output
headphone
output
16 / 32 Ohms
3.3uF
330uF
100
HPL
Figure 12-32. DC Coupled (CAPLESS) Application Circuits
HPR
HPR
DIFF. IN /
DIFF. OUT
POWER AMP.
jack
HPVCM
HPVCM
AT73C246
AT73C246
headphone
output
16 / 32 Ohms
DIFF. IN /
DIFF. OUT
POWER AMP.
HPL
HPL
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13. Two Wire Interface and Control Registers
13.1 Two-wire Interface (TWI) Protocol
The two-wire interface interconnects components on a unique two-wire bus, made up of one
clock line and one data line with speeds up to 400 Kbits per second, based one a byte oriented
transfer format. The TWI is slave only and single byte access.
The interface adds flexibility to the power supply solution, enabling LDO regulators to be con-
trolled depending on the instantaneous application requirements.
The AT73C246 has the following 7-bit address:1001001.
Attempting to read data from register addresses not listed in this section results in 0xFF being
read out.
• TWCK is an input pin for the clock
• TWD is an open-drain pin that drives or receives the serial data
The data put on the TWD line must be 8 bits long. Data is transferred MSB first. Each byte must
be followed by an acknowledgement.
Each transfer begins with a START condition and terminates with a STOP condition.
• A high-to-low transition on TWD while TWCK is high defines a START condition.
• A low-to-high transition on TWD while TWCK is high defines a STOP condition.
Figure 13-1. TWI Start/Stop Cycle
TWD
TWCK
Start
Stop
Figure 13-2. TWI Data Cycle
TWD
TWCK
Start
Address
R/W
Ack
Data
Ack
Data
Ack
Stop
After the host initiates a Start condition, it sends the 7-bit slave address defined above to notify
the slave device. A Read/Write bit follows (Read = 1, Write = 0).
The device acknowledges each received byte.
The first byte sent after device address and R/W bit is the address of the device register the host
wants to read or write.
For a write operation the data follows the internal address
77
11050A–PMAAC–07-Apr-10
For a read operation a repeated Start condition needs to be generated followed by a read on the
device.
Figure 13-3. TWD Write Operation
S
ADDR
W
DATA
A
A
IADDR
A
P
TWD
Figure 13-4. TWD Read Operation
TWD
S
ADDR
W
A
IADDR
A
S
ADDR
R
A
DATA
N
P
• S = Start
• P = Stop
• W = Write
• R = Read
• A = Acknowledge
• N = Not Acknowledge
• ADDR = Device address
• IADDR = Internal address
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13.2 PMU Register Tables
13.2.1
Register Mapping
Table 13-1. Register Mapping
Addr
0x00
0x01
0x02
0x03
0x04
0x05
0x06
0x07
0x08
0x09
0x0A
0x0B
0x0C
0x0D
0x0E
0x10
0x11
0x12
0x13
0x14
0x15
0x16
0x17
0x18
0x19
0x1A
0x1B
0x1C
0x1D
0x1E
0x1F
0x20
0x21
0x22
0x30
0x31
0x32
0x33
Name
7
-
6
-
5
-
4
3
2
1
0
PMU_MODES
PMU_WAKEUP_EVENTS
PMU_WAKEUP_TRIG
PMU_STANDBY_SUPPLIES
PMU_SUPPLY_CTRL
PMU_RST_LEVEL
VDD0_CTRL
-
-
STANDBY
WAKEUP2
WAKEUP2
VDD2
PWRDOWN
WAKEUP1
WAKEUP1
VDD1
RUN
-
-
RTC
PWREN
PWREN
LP_VDD0
DVS_VDD4
WAKEUP3
WAKEUP3
VDD3
WAKEUP0
WAKEUP0
VDD0
-
-
RTCR
LP_VDD1
IN_PHASE
-
-
-
-
DVS_VDD3
DVS_VDD2
DVS_VDD1
DVS_VDD0
RST_VDD3
RST_VDD2
RST_VDD1
RST_VDD0
ON_VDD0
ON_VDD1
ON_VDD2
ON_VDD3
ON_VDD4
LPMODE
VDD0_SEL
VDD1_SEL
VDD1_CTRL
LPMODE
VDD2_CTRL
-
-
-
-
VDD2_SEL
VDD3_CTRL
-
VDD3_SEL
VDD4_SEL
VDD4_CTRL
-
PMU_LED
TON_LED
PERIOD_LED
BLINK
ON_LED
RTC_IT
PMU_MASK
-
-
-
-
-
-
-
-
RTC_ALARM
RTC_ALARM
VDD2_WUP
PMU_IT
-
-
-
-
-
RTC_IT
PMU_WAKEUP_SUPPLIES
AUTOSTART
-
-
-
VDD0_WUP
VDD1_WUP
PATH_SEL
ENASR
VDD3_WUP
-
ENAC
STANDBY
DCBLOCK
MICLDIFF
AUDIO_CONTROL
MIC_CONTROL
DAI_CONTROL
FRAME_CONTROL
MUTE
-
BCLKINV
ENCONF
CUSTCONF
ASR_TIME
-
-
-
MICRDIFF
MICDET
ONMICBIAS
MCLKSEL
SELFS
MICDET_ST
MUTEHPR
-
MASTER
SSCMODE
MUTEDACL
-
WL
DAIMODE
MUTEDACR
MUTEINL
MUTEINR
MUTEMICL
MUTEMICR
MUTEHPL
MICLVOL
-
-
MICLVOL
MICRVOL
INLVOL
INRVOL
HPLVOL
HPRVOL
MICRVOL
-
INLVOL
INLBOTH
INRBOTH
INRVOL
HPLVOL
HPRVOL
HP_CONTROL
AUDIO_EFFECTS
INPUT_CONTROL
OUTPUT_CONTROL
INPUT_MIXER
SIDETONE_VOL
EQUALIZER
HPDET_ST
LHPBOTH
RHPBOTH
ONDEEMP
ONLINR
3DFX_DEPTH
ON3DFX
SWAP_DAC
SWAP_ADC
ONADCL
ONHPL
MONO_DAC MONO_ADC
-
LINESEL
ONMICL
ONMICR
ONBYPASS
MIXMICR
ONADCR
ONHPR
ONLINL
ONDACL
ONMIXL
ONSIDETONE
ONPLAYBACK
-
ONDACR
ONMIXR
-
-
MIXMICL
MIXLINEL
MIXLINER
-
-
-
-
SIDETONE_VOL
-
-
ON_BUF
VIN
-
EQ_SEL
ADC_CTRL
ON_ADC
TS
ADC_MUX_1
-
-
-
-
VDD4
-
VDD3
ANA3
VDD2
ANA2
VDD1
ANA1
VDD0
ANA0
ADC_MUX_2
-
ADC_ANA0_MSB
ADC<9:2>
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11050A–PMAAC–07-Apr-10
Table 13-1. Register Mapping
Addr
0x34
0x35
0x36
0x37
0x38
0x39
0x3A
0x3B
0x3C
0x3D
0x3E
0x3F
0x40
0x41
0x42
0x43
0x44
0x47
0x48
0x49
0x50
0X51
0x52
0x53
0x54
0x55
0x56
0x7F
Name
7
6
5
4
3
2
1
0
ADC_ANA0_LSB
ADC_ANA1_MSB
ADC_ANA1_LSB
ADC_ANA2_MSB
ADC_ANA2_LSB
ADC_ANA3_MSB
ADC_ANA3_LSB
ADC_VDD0_MSB
ADC_VDD0_LSB
ADC_VDD1_MSB
ADC_VDD1_LSB
ADC_VDD2_MSB
ADC_VDD2_LSB
ADC_VDD3_MSB
ADC_VDD3_LSB
ADC_VDD4_MSB
ADC_VDD4_LSB
ADC_VIN_MSB
ADC_VIN_LSB
ADC_ANA_LSB
RTC_CTRL
-
-
-
-
-
-
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<1:0>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
ADC<9:2>
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
ADC_ANA3<1:0>
- -
ADC_ANA2<1:0>
- -
ADC_ANA1<1:0>
RTC_WRITE
ADC_ANA0<1:0>
-
RTC_SEL
RTC_EN
RTC_ADDR
RTC_ADDR
RTC_DATA0
RTC_DATA1
RTC_DATA2
RTC_DATA3
RTC_DATA0
RTC_DATA1
RTC_DATA2
RTC_DATA3
BACKUP_CTRL
VERSION
-
-
-
-
OSC_UPDT
OSC_EN
OSC_STAT
RST_BKUP
SOFTWARE_TAG
VERSION
80
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AT73C246
13.2.2
PMU Control
Name:
PMU_MODES
Read / Write
0x00
Access:
Address:
7
-
6
-
5
-
4
-
3
-
2
1
0
STANDBY
PWRDOWN
RUN
Table 13-2. PMU_MODES (0x00) Structure
Bit
Name
Description
Reset value
7:3
-
unused
00000
STANDBY request
0: Default value.
1: STANDBY request. Reset to 0 at STANDBY
exit.
2
STANDBY
0
POWERDOWN request
0: Default value.
1: POWERDOWN request. Reset to 0 when
POWERDOWN state reached.
1
0
PWRDOWN
RUN
0
0
RUN mode
Notes: 1. Please refer to Section 11. “PMU Functional Description” on page 25
2. ‘RUN’ bit is read-only. Only ‘STANDBY’ and ‘PWRDOWN’ bits can be written
81
11050A–PMAAC–07-Apr-10
Name:
PMU_WAKEUP_EVENTS
Read / Write
Access:
Address:
0x01
7
-
6
-
5
4
3
2
1
0
RTC
PWREN
WAKEUP3
WAKEUP2
WAKEUP1
WAKEUP0
Table 13-3. PMU_WAKEUP_EVENTS (0x01) Structure
Bit
Name
Description
Reset value
7:6
-
unused
00
Wake up by RTC alarm input
0: disabled
1: enabled
5
4
3
2
1
RTC
0
0
0
0
0
1
Wake up by PWREN input
0: disabled
1: enabled
PWREN
Wake up by WAKEUP3 input
0: disabled
1: enabled
WAKEUP3
WAKEUP2
WAKEUP1
WAKEUP0
Wake up by WAKEUP2 input
0: disabled
1: enabled
Wake up by WAKEUP1 input
0: disabled
1: enabled
Wake up by WAKEUP0 input
0: disabled
0
1: enabled
Note:
Please refer to Section 11. “PMU Functional Description” on page 25
82
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
PMU_WAKEUP_TRIG
Read Only
Access:
Address:
0x02
7
-
6
-
5
4
3
2
1
0
RTCR
PWREN
WAKEUP3
WAKEUP2
WAKEUP1
WAKEUP0
Table 13-4. PMU_WAKEUP_TRIG (0x02) Structure
Bit
7:6
5
Name
Description
Reset value
-
unused
00
0
RTCR
WAKEUP_EVENT trigged on RTC alarm
WAKEUP_EVENT trigged on PWREN
WAKEUP_EVENT trigged on WAKEUP3
WAKEUP_EVENT trigged on WAKEUP2
WAKEUP_EVENT trigged on WAKEUP1
WAKEUP_EVENT trigged on WAKEUP0
4
PWREN
WAKEUP3
WAKEUP2
WAKEUP1
WAKEUP0
0
3
0
2
0
1
0
0
0
Note:
Please refer to Section 11. “PMU Functional Description” on page 25
83
11050A–PMAAC–07-Apr-10
Name:
PMU_STANDBY_SUPPLIES
Access:
Address:
Read / Write
0x03
7
-
6
-
5
4
3
2
1
0
LP_VDD1
LP_VDD0
VDD3
VDD2
VDD1
VDD0
Table 13-5. PMU_STANDBY_SUPPLIES (0x03) Structure
Bit
Name
Description
Reset value
7:6
-
unused
00
VDD1 Low power mode in STANDBY
0: Full power (PWM)
1: Low power (PFM)
5
4
3
2
1
0
LP_VDD1
LP_VDD0
VDD3
1
1
1
0
0
1
VDD0 Low power mode in STANDBY
0: Full power (PWM)
1: Low power (PFM)
VDD3 in STANDY state
0: OFF
1: ON
VDD2 in STANDY state
0: OFF
1: ON
VDD2
VDD1 in STANDY state
0: OFF
1: ON
VDD1
VDD0 in STANDY state
0: OFF
1: ON
VDD0
84
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11050A–PMAAC–07-Apr-10
AT73C246
Name:
PMU_SUPPLY_CTRL
Read / Write
0x04
Access:
Address:
7
-
6
-
5
4
3
2
1
0
IN_PHASE
DVS_VDD4 DVS_VDD3 DVS_VDD2 DVS_VDD1 DVS_VDD0
Table 13-6. PMU_SUPPLY_CTRL (0x04) Structure
Bit
Name
Description
Reset value
7:6
-
unused
00
DCDC0 and DCDC1 phase operation
0: out-of phase
1: in-phase
5
4
3
2
1
0
IN_PHASE
DVS_VDD4
DVS_VDD3
DVS_VDD2
DVS_VDD1
DVS_VDD0
0
1
1
1
1
1
DVS function on VDD4
0: OFF
1: ON
DVS function on VDD3
0: OFF
1: ON
DVS function on VDD2
0: OFF
1: ON
DVS function on VDD1
0: OFF
1: ON
DVS function on VDD0
0: OFF
1: ON
85
11050A–PMAAC–07-Apr-10
Name:
PMU_RST_LVL
Read / Write
0x05
Access:
Address:
7
6
5
4
3
2
1
0
RST_VDD3
RST_VDD2
RST_VDD1
RST_VDD0
Table 13-7. PMU_RST_LVL (0x05) Structure
Bit
7:6
5:4
3:2
1:0
Name
Description
Reset value
RST_VDD3
RST_VDD2
RST_VDD1
RST_VDD0
RST level on VDD3
RST level on VDD2
RST level on VDD1
RST level on VDD0
01
10
10
11
Table 13-8. VDDx Reset Level Selection Table
RST_VDDx
RST LEVEL
0.85 x VDDx
0.90 x VDDx
0.92 x VDDx
0.95 x VDDx
00
01
10
11
86
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
VDD0_CTRL
Read / Write
0x06
Access:
Address:
7
6
5
4
3
2
1
0
ON_VDD0
LPMODE
VDD0_SEL
Table 13-9. VDD0_CTRL (0x06) Structure
Bit
Name
Description
Reset value
VDD0 ON/OFF
0: OFF
7
ON_VDD0
0
1: ON
VDD0 Low power mode
0: Full power (PWM)
1: Low power (PFM)
6
LPMODE
0
5:0
VDD0_SEL
VDD0 voltage selection
010101
Table 13-10. VDD0 Voltage Selection Table
VDD0_SEL
000000
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001101
001110
001111
010000
010001
010010
VDD0 (V)
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
VDD0_SEL
010011
010100
010101
010110
010111
011000
011001
011010
011011
011100
011101
011110
011111
VDD0 (V)
VDD0_SEL
100110
100111
101000
101001
101010
101011
101100
101101
101110
101111
110000
110001
110010
110011
110100
110101
110110
110111
111000
VDD0 (V)
2.70
2.75
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
100000
100001
100010
100011
100100
100101
87
11050A–PMAAC–07-Apr-10
Name:
VDD1_CTRL
Read / Write
0x07
Access:
Address:
7
6
5
4
3
2
1
0
ON_VDD1
LPMODE
VDD1_SEL
Table 13-11. VDD1_CTRL (0x07) Structure
Bit
Name
Description
Reset value
VDD1 ON / OFF
0: OFF
7
ON_VDD1
0
1: ON
VDD1 Low power mode
0: Full power (PWM)
1: Low power (PFM)
6
LPMODE
0
5:0
VDD1_SEL
VDD1 voltage selection
001000
Table 13-12. VDD1 Voltage Selection Table
VDD1_SEL
000000
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001101
001110
001111
010000
010001
010010
VDD1 (V)
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
1.40
1.45
1.50
1.55
1.60
1.65
1.70
VDD1_SEL
010011
010100
010101
010110
010111
011000
011001
011010
011011
011100
011101
011110
011111
VDD1 (V)
VDD1_SEL
100110
100111
101000
101001
101010
101011
101100
101101
101110
101111
110000
110001
110010
110011
110100
110101
110110
110111
111000
VDD1 (V)
2.70
2.75
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
1.75
1.80
1.85
1.90
1.95
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
2.45
2.50
2.55
2.60
2.65
100000
100001
100010
100011
100100
100101
88
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
VDD2_CTRL
Read / Write
0x08
Access:
Address:
7
6
-
5
-
4
3
2
1
0
ON_VDD2
VDD2_SEL
Table 13-13. VDD2_CTRL (0x08) Structure
Bit
Name
Description
Reset value
VDD2 ON / OFF
0: OFF
7
ON_VDD2
0
1: ON
6:5
4:0
-
unused
00
VDD2_SEL
VDD2 voltage selection
00100
Table 13-14. VDD2 Voltage Selection Table
VDD2_SEL
00000
00001
00010
00011
00100
00101
00110
00111
VDD2 (V)
0.80
0.85
0.90
0.95
1.00
1.05
1.10
1.15
1.20
1.25
1.30
1.35
01000
01001
01010
01011
89
11050A–PMAAC–07-Apr-10
Name:
VDD3_CTRL
Read / Write
0x09
Access:
Address:
7
6
-
5
-
4
3
2
1
0
ON_VDD3
VDD3_SEL
Table 13-15. VDD3_CTRL (0x09) Structure
Bit
Name
Description
Reset value
VDD3 ON / OFF
0: OFF
7
ON_VDD3
0
1: ON
6:5
4:0
-
unused
00
VDD3_SEL
VDD3 voltage selection
01100
Table 13-16. VDD3 Voltage Selection Table
VDD3_SEL
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
VDD3 (V)
2.70
2.75
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
10000
10001
10010
90
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
VDD4_CTRL
Read / Write
0x0A
Access:
Address:
7
6
-
5
-
4
3
2
1
0
ON_VDD4
VDD4_SEL
Table 13-17. VDD4_CTRL (0x0A) Structure
Bit
Name
Description
Reset value
VDD4 ON / OFF
0: OFF
7
ON_VDD4
0
1: ON
6:5
4:0
-
unused
00
VDD4_SEL
VDD4 voltage selection
01100
Table 13-18. VDD4 Voltage Selection Table
VDD4_SEL
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
VDD4 (V)
2.70
2.75
2.80
2.85
2.90
2.95
3.00
3.05
3.10
3.15
3.20
3.25
3.30
3.35
3.40
3.45
3.50
3.55
3.60
10000
10001
10010
91
11050A–PMAAC–07-Apr-10
Name:
PMU_LED
Read / Write
0x0B
Access:
Address:
7
6
5
4
3
2
1
0
TON_LED
PERIOD_LED
BLINK
ON_LED
Table 13-19. PMU_LED (0x0B) Structure
Bit
7:5
4:2
Name
Description
Reset value
000
TON_LED
PERIOD_LED
LED ‘ON’ time
LED blinking period
010
Blinking function ON / OFF
1
0
BLINK
0: OFF
1: ON
0
0
Led ON / OFF
0: OFF
ON_LED
1: ON
Table 13-20. LED Blinking Function Parameters Selection Table
TON_LED
000
LED ‘ON’ Time (ms)
PERIOD_LED
BLINKING PERIOD (s)
25
000
001
010
011
100
101
110
111
0.5
1
001
50
010
75
2
011
100
125
150
175
200
3
100
4
101
5
110
6
111
8
Note:
In case of TON_LED = 175ms, PERIOD_LED=5s and BLINK=1 selection, the LED pin is driven
according to the following diagram. During 9 clock periods (internal RC 32kHz oscillator) the pin is
driven to 0, and during 1 clock period the pin is configured as ‘input’ with an internal pull up resis-
tor to VINSYS.
Figure 13-5. LED Pin Timing Diagram for TON_LED = 175ms and PERIOD_LED=5s
Internal
RC 32kHz
Pin forced to ‘0’
LED Pin
9 x 32kHz clock periods
92
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
PMU_MASK
Read / Write
0x0C
Access:
Address:
7
-
6
-
5
-
4
-
3
-
2
-
1
0
RTC_ALA
RM
RTC_IT
Table 13-21. PMU_MASK (0x0C) Structure
Bit
Name
Description
Reset value
7:2
-
unused
111111
Mask RTC alarm
0: not masked
1: masked
1
0
RTC_ALARM
RTC_IT
1
1
Mask RTC interrupt
0: not masked
1: masked
Name:
PMU_IT
Access:
Address:
Read Only
0x0D
7
-
6
-
5
-
4
-
3
-
2
-
1
0
RTC_ALA
RM
RTC_IT
Table 13-22. PMU_IT (0x0D) Structure
Bit
Name
Description
Reset value
7:2
-
unused
000000
RTC alarm interrupt
0: default value
1: RTC alarm has occurred. Reset to 0 at read.
1
0
RTC_ALARM
RTC_IT
0
0
RTC interrupt
0: default value
1: RTC interrupt has occurred. Reset to 0 at read.
93
11050A–PMAAC–07-Apr-10
Name:
PMU_WAKEUP_SUPPLIES
Read / Write
Access:
Address:
0x0E
7
-
6
-
5
-
4
-
3
2
1
0
VDD0_WUP VDD1_WUP VDD2_WUP VDD3_WUP
Table 13-23. PMU_WAKEUP_SUPPLIES (0x0E) Structure
Bit
Name
Description
Reset value
7:4
-
unused
0000
VDD0 Value at WAKEUP
0: Programmed value
1: Default value
3
2
1
0
VDD0_WUP
VDD1_WUP
VDD2_WUP
VDD3_WUP
1
1
1
1
VDD1Value at WAKEUP
0: Programmed value
1: Default value
VDD2 Value at WAKEUP
0: Programmed value
1: Default value
VDD3 Value at WAKEUP
0: Programmed value
1: Default value
94
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
AUTOSTART
Read / Write
0x10
Access:
Address:
7
-
6
5
4
3
2
1
0
ENAC
STANDBY
PATH_SEL
Table 13-24. AUTOSTART (0x10) Structure
Bit
Name
Description
Reset value
7
-
unused
0
Audio Codec ON / OFF
6
ENAC
0: OFF
1: ON
0
Audio STANDBY mode ON / OFF
0: Audio codec active
1: Audio codec in standby
5
STANDBY
PATH_SEL
1
4:0
Audio PATH selection
00000
Table 13-25. Audio Path Selection Table
PATH_SEL
00000
00001
00010
00011
00100
00101
00110
00111
01000
01001
01010
01011
01100
01101
01110
01111
AUDIO PATH
No Path
DAC Playback
Mic Sidetone
Digital IN - Headphone OUT
Microphone IN - Headphone OUT
Aux IN - Headphone OUT
Line IN - Headphone OUT
Mic IN - Digital OUT
Aux Bypass
Line Bypass
Mic Record
Aux Record
Aux IN - Digital OUT
Line Record
Line IN - DIGITAL OUT
Mic Sidetone + Record
Aux Bypass + Record
Line Bypass + Record
Mic + Aux Record
Mic + Line Record
Mic IN - Headphone and Digital OUT
Aux IN - Headphone and Digital OUT
Line IN - Headphone and Digital OUT
Mic + Aux IN - Digital OUT
Mic + Line IN - Digital OUT
DAC Playback + Mic Sidetone Digital + Mic IN - Headphone OUT
DAC Playback + Aux Bypass
DAC Playback + Line Bypass
Digital + Aux IN - Headphone OUT
Digital + Line IN - Headphone OUT
DAC Playback + Mic Sidetone
+ Aux Bypass
10000
10001
10010
Digital + Mic + Aux IN - Headphone OUT
Digital + Mic + Line IN - Headphone OUT
DAC Playback + Mic Sidetone
+ Line Bypass
DAC Playback and
MIC Record
Digital IN - Headphone OUT
Mic IN - Digital OUT
95
11050A–PMAAC–07-Apr-10
Table 13-25. Audio Path Selection Table
PATH_SEL
AUDIO PATH
DAC Playback and
Aux Record
Digital IN - Headphone OUT
Aux IN - Digital OUT
10011
DAC Playback and
Line Record
Digital IN - Headphone OUT
Line IN - Digital OUT
10100
10101
10110
10111
DAC Playback + Mic Sidetone Digital + Mic IN - Headphone OUT
and Mic Record
Mic IN - Digital OUT
DAC Playback + Aux Bypass
and Aux Record
Digital + Aux IN - Headphone OUT
Aux IN - Digital OUT
DAC Playback + Line Bypass
and Line Record
Digital + Line IN - Headphone OUT
Line IN - Digital OUT
DAC Playback + Mic Sidetone
+ Aux Bypass and
Mic + Aux Record
Digital + Mic + Aux IN - Headphone OUT
Mic + Aux IN - Digital OUT
11000
11001
DAC Playback + Mic Sidetone
+ Line Bypass and
Mic + Line Record
Digital + Mic + Line IN - Headphone OUT
Mic + Line IN - Digital OUT
96
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
AUDIO_CONTROL
Read / Write
0x11
Access:
Address:
7
-
6
5
4
3
2
1
0
CUST_CO
NF
BCLKINV
DCBLOCK
ENCONF
ENASR
ASR_TIME
Table 13-26. AUDIO_CONTROL (0x11) Structure
Bit
Name
Description
Reset value
7
-
-
0
Bit clock inversion on I2S port
0: not inverted
6
5
BLCKINV
0
0
1: inverted
Headphone output coupling configuration
0: DC coupled (capless operation)
1: AC coupled
DCBLOCK
Custom configuration enable
0: Default value.
1: custom configuration is send to audio
controller.
4
3
ENCONF
0
0
Custom audio configuration
0: Audio path are set with PATH_SEL
1: Custom audio path set by software
CUST_CONF
Gain soft ramping ON / OFF
2
ENASR
0: OFF
1: ON
1
1:0
ASR_TIME
Gain soft ramping timing selection
11
Table 13-27. Gain Soft Ramping Timing Selection Table
ASR_TIME
Timing
00
01
10
11
MCLK / (32 x 512)
MCLK / (64 x 512)
MCLK / (128 x 512)
MCLK / (256 x 512)
97
11050A–PMAAC–07-Apr-10
Name:
MIC_CONTROL
Read / Write
0x12
Access:
Address:
7
-
6
-
5
4
3
2
1
0
MICLDIFF
MICRDIFF
MICDET
ONMICBIAS MICDET_ST
Table 13-28. MIC_CONTROL (0x12) Structure
Bit
Name
Description
Reset value
7:6
-
unused
00
Left microphone differential configuration
0: Single-ended
5
MICLDIFF
0
1: Differential
Right microphone differential configuration
0: Single-ended
1: Differential
4
MICRDIFF
MICDET
0
3:2
1
Microphone detector threshold
00
0
Microphone bias generator ON / OFF
0: OFF
1: ON
ONMICBIAS
MICBIAS pin microphone detector status bit
0: No microphone detected
0
MICDET_ST
0
1: Microphone detected
Table 13-29. Microphone Detector Threshold Selection Table
MICDET
MICBIAS PIN LEVEL (V)
AVDD - 0.1
00
01
10
11
AVDD - 0.2
AVDD - 0.3
AVDD - 0.4
98
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
DAI_CONTROL
Read / Write
0x13
Access:
Address:
7
-
6
-
5
-
4
-
3
2
1
0
MASTER
MCLKSEL
Table 13-30. DAI_CONTROL (0x13) Structure
Bit
Name
Description
Reset value
7:4
-
unused
0000
MASTER / SLAVE operation on DAI port
0: Slave
1: Master
3
MASTER(1)
MCLKSEL
0
2:0
Audio Master clock frequency selection
001
Note:
1. The MASTER mode is not provided for 12.0000 MHz clock case and Right-Justified mode on
DAI.
Table 13-31. Audio Master Clock Selection Table
MCLKSEL
000
MCLK (MHz) MCLKSEL
MCLK (MHz)
12.000
12.288
11.2896
18.432
100
101
110
111
16.9344
001
-
-
-
010
011
99
11050A–PMAAC–07-Apr-10
Name:
FRAME_CONTROL
Read / Write
0x14
Access:
Address:
7
6
5
4
3
2
1
0
SSCMODE
WL
DAI_MODE
SELFS
Table 13-32. FRAME_CONTROL (0x14) Structure
Bit
Name
Description
Reset value
SSC mode for DAI
7
SSCMODE
0: DAI according to DAI_MODE bits
1: SSC mode
0
6:5
4:3
2:0
WL
Word length selection
11
DAI_MODE
SELFS
Digital Audio Interface mode control
Audio Frame frequency selection
00
011
Table 13-33. Digital Audio Interface Word Length Selection Table
WL
00
01
10
11
MODE
16
18
20
24
Table 13-34. Digital Audio Interface Mode Selection Table
DAIMODE
MODE
00
01
10
11
I2S
Left-Justified
Right-Justified(1)
N/A
Note:
1. The Right-Justified mode is not provided for 12.0000 MHz clock case and MASTER mode on
DAI.
Table 13-35. Audio Sampling Frequency Selection Table
SELFS
000
FS (kHz)
SELFS
100
FS (kHz)
96
8
001
16
32
48
101
22.050
44.100
88.200
010
110
011
111
100
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
MUTE
Access:
Address:
Read / Write
0x15
7
6
5
4
3
2
1
0
MUTEDAC
MUTEDACL
MUTEINL
MUTEINR
MUTEMICL MUTEMICR
MUTEHPL
MUTEHPR
R
Table 13-36. MUTE (0x15) Structure
Bit
Name
Description
Reset value
DAC Left mute
0: active
7
MUTEDACL
1
1: muted
DACR Right mute
0: active
1: muted
6
5
4
3
2
1
0
MUTEDACR
MUTEINL
1
1
1
1
1
1
1
AUX / LINE Left mute
0: active
1: muted
AUX / LINE Right mute
0: active
1: muted
MUTEINR
MUTEMICL
MUTEMICR
MUTEHPL
MUTEHPR
MIC Left mute
0: active
1: muted
MIC Right mute
0: active
1: muted
Headphone Left mute
0: active
1: muted
Headphone Right mute
0: active
1: muted
101
11050A–PMAAC–07-Apr-10
Name:
MICLVOL
Read / Write
0x16
Access:
Address:
7
-
6
-
5
4
3
2
1
0
MICLVOL
Table 13-37. MICLVOL (0x16) Structure
Bit
7:6
5:0
Name
Description
Reset value
00
-
unused
MICLVOL
Microphone Left volume selection
000000
Table 13-38. Microphone Left Volume Selection Table
MICLVOL
000000
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001101
001110
001111
GAIN(dB)
MICLVOL
010000
010001
010010
010011
010100
010101
010110
010111
011000
011001
011010
011011
011100
011101
011110
011111
GAIN(dB)
16
MICLVOL
100000
100001
100010
100011
100100
100101
100110
100111
101000
101001
101010
101011
101100
101101
101110
GAIN(dB)
32
0
1
17
33
2
18
34
3
19
35
4
20
36
5
21
37
6
22
38
7
23
39
8
24
40
9
25
41
10
11
12
13
14
15
26
42
27
43
28
44
29
45
30
46
31
Other values
46
102
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
MICRVOL
Read / Write
0x17
Access:
Address:
7
-
6
-
5
4
3
2
1
0
MICRVOL
Table 13-39. MICRVOL (0x17) Structure
Bit
7:6
5:0
Name
Description
Reset value
0
-
unused
MICRVOL
Microphone Right volume selection
000000
Table 13-40. Microphone Right Volume Selection Table
MICRVOL
000000
000001
000010
000011
000100
000101
000110
000111
001000
001001
001010
001011
001100
001101
001110
001111
GAIN(dB)
MICRVOL
010000
010001
010010
010011
010100
010101
010110
010111
011000
011001
011010
011011
011100
011101
011110
011111
GAIN(dB)
16
MICRVOL
100000
100001
100010
100011
100100
100101
100110
100111
GAIN(dB)
32
0
1
17
33
2
18
34
3
19
35
4
20
36
5
21
37
6
22
38
7
23
39
8
24
101000
101001
101010
101011
101100
101101
101110
40
9
25
41
10
11
12
13
14
15
26
42
27
43
28
44
29
45
30
46
31
Other values
46
103
11050A–PMAAC–07-Apr-10
Name:
INLVOL
Read / Write
0x18
Access:
Address:
7
6
5
4
3
2
1
0
INLBOTH
INLVOL
Table 13-41. INLVOL (0x18) Structure
Bit
Name
Description
Reset value
1
AUX / LINE Left volume controls Right channel
0: inactive
1: active. Prioritary bit over INRBOTH.
7
INLBOTH
INLVOL
6:0
AUX / LINE input Left volume selection
0000000
Table 13-42. AUX / LINE Left Volume Selection Table
INLVOL
≤1011100
1011101
1011110
1011111
1100000
1100001
1100010
1100011
1100100
1100101
1100110
1100111
1101000
1101001
1101010
1101011
1101100
GAIN(dB)
MUTE
-35
INLVOL
1101101
1101110
1101111
1110000
1110001
1110010
1110011
1110100
1110101
1110110
1110111
1111000
1111001
1111010
1111011
1111100
1111101
GAIN(dB)
-19
-18
-17
-16
-15
-14
-13
-12
-11
-10
-9
INLVOL
1111110
GAIN(dB)
-2
-1
0
1111111
-34
0000000
0000001
0000010
0000011
0000100
0000101
0000110
0000111
0001000
0001001
0001010
0001011
>=0101111
-33
1
-32
2
-31
3
-30
4
-29
5
-28
6
-27
7
-26
8
-25
-8
9
-24
-7
10
11
12
-23
-6
-22
-5
-21
-4
-20
-3
104
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
INRVOL
Read / Write
0x19
Access:
Address:
7
6
5
4
3
2
1
0
INRBOTH
INRVOL
Table 13-43. INRVOL (0x19) Structure
Bit
Name
Description
Reset value
0
AUX / LINE Right volume controls left channel
0: inactive
1: active.
7
INRBOTH
INRVOL
6:0
AUX / LINE input Right volume selection
0000000
Table 13-44. AUX / LINE Right Volume Selection Table
INLVOL
≤1011100
1011101
1011110
1011111
1100000
1100001
1100010
1100011
1100100
1100101
1100110
1100111
1101000
1101001
1101010
1101011
1101100
GAIN(dB)
MUTE
-35
INLVOL
1101101
1101110
1101111
1110000
1110001
1110010
1110011
1110100
1110101
1110110
1110111
1111000
1111001
1111010
1111011
1111100
1111101
GAIN(dB)
-19
-18
-17
-16
-15
-14
-13
-12
-11
-10
-9
INLVOL
1111110
GAIN(dB)
-2
-1
0
1111111
-34
0000000
0000001
0000010
0000011
0000100
0000101
0000110
0000111
0001000
0001001
0001010
0001011
>=0101111
-33
1
-32
2
-31
3
-30
4
-29
5
-28
6
-27
7
-26
8
-25
-8
9
-24
-7
10
11
12
-23
-6
-22
-5
-21
-4
-20
-3
105
11050A–PMAAC–07-Apr-10
Name:
HPLVOL
Read / Write
0x1A
Access:
Address:
7
6
5
4
3
2
1
0
HPLVOL
Table 13-45. HPLVOL (0x1A) Structure
Bit
Name
Description
Headphone Left volume selection
Reset value
7:0
HPLVOL
00000000
Table 13-46. Headphone Left Volume Selection Table
GAIN
(dB)
GAIN
(dB)
GAIN
(dB)
GAIN
(dB)
HPLVOL
HPLVOL
HPLVOL
HPLVOL
MUT
E
≤10110010
11001000
-56
11011110
-34
11110100
-12
10110011
10110100
10110101
10110110
10110111
10111000
10111001
10111010
10111011
10111100
10111101
10111110
10111111
11000000
11000001
11000010
11000011
11000100
11000101
11000110
11000111
-77
-76
-75
-74
-73
-72
-71
-70
-69
-68
-67
-66
-65
-64
-63
-62
-61
-60
-59
-58
-57
11001001
11001010
11001011
11001100
11001101
11001110
11001111
11010000
11010001
11010010
11010011
11010100
11010101
11010110
11010111
11011000
11011001
11011010
11011011
11011100
11011101
-55
-54
-53
-52
-51
-50
-49
-48
-47
-46
-45
-44
-43
-42
-41
-40
-39
-38
-37
-36
-35
11011111
11100000
11100001
11100010
11100011
11100100
11100101
11100110
11100111
11101000
11101001
11101010
11101011
11101100
11101101
11101110
11101111
11110000
11110001
11110010
11110011
-33
-32
-31
-30
-29
-28
-27
-26
-25
-24
-23
-22
-21
-20
-19
-18
-17
-16
-15
-14
-13
11110101
11110110
11110111
11111000
11111001
11111010
11111011
11111100
11111101
11111110
11111111
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
00000000
00000001
00000010
00000011
00000100
00000101
>=00000110
1
2
3
4
5
6
106
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
HPRVOL
Read / Write
0x1B
Access:
Address:
7
6
5
4
3
2
1
0
HPRVOL
Table 13-47. HPRVOL (0x1B) Structure
Bit
Name
Description
HEADSET Right volume selection
Reset value
7:0
HPRVOL
00000000
Table 13-48. Headphone Right Volume Selection Table
GAIN
(dB)
GAIN
(dB)
GAIN
(dB)
GAIN
(dB)
HPRVOL
HPRVOL
HPRVOL
HPRVOL
MUTE
-77
-76
-75
-74
-73
-72
-71
-70
-69
-68
-67
-66
-65
-64
-63
-62
-61
-60
-59
-58
-57
≤10110010
10110011
10110100
10110101
10110110
10110111
10111000
10111001
10111010
10111011
10111100
10111101
10111110
10111111
11000000
11000001
11000010
11000011
11000100
11000101
11000110
11000111
11001000
11001001
11001010
11001011
11001100
11001101
11001110
11001111
11010000
11010001
11010010
11010011
11010100
11010101
11010110
11010111
11011000
11011001
11011010
11011011
11011100
11011101
-56
-55
-54
-53
-52
-51
-50
-49
-48
-47
-46
-45
-44
-43
-42
-41
-40
-39
-38
-37
-36
-35
11011110
11011111
11100000
11100001
11100010
11100011
11100100
11100101
11100110
11100111
11101000
11101001
11101010
11101011
11101100
11101101
11101110
11101111
11110000
11110001
11110010
11110011
-34
-33
-32
-31
-30
-29
-28
-27
-26
-25
-24
-23
-22
-21
-20
-19
-18
-17
-16
-15
-14
-13
11110100
11110101
11110110
11110111
11111000
11111001
11111010
11111011
11111100
11111101
11111110
11111111
-12
-11
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
00000000
00000001
00000010
00000011
00000100
00000101
>=00000110
1
2
3
4
5
6
107
11050A–PMAAC–07-Apr-10
Name:
HP_CONTROL
Read / Write
0x1C
Access:
Address:
7
-
6
-
5
4
-
3
-
2
1
0
-
HPDET_ST
LHPBOTH
RHPBOTH
Table 13-49. HP_CONTROL (0x1C) Structure
Bit
Name
Description
Reset value
7:3
-
unused
00000
Headphone plug in-out detector
2
1
0
HPDET_ST
LHPBOTH
RHPBOTH
0: OFF
1: ON
0
1
0
Right Headphone volume follows left
0: inactive
1: active. Prioritary bit over RHPBOTH.
Left Headphone volume follows right
0: inactive
1: active
108
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
AUDIO_EFFECTS
Read / Write
0x1D
Access:
Address:
7
6
5
4
3
2
1
0
3DFX_DEPTH
ON3DFX
SWAP_DAC SWAP_ADC MONO_DAC MONO_ADC ONDEEMP
Table 13-50. AUDIO_EFFECTS (0x1D) Structure
Bit
Name
Description
Reset value
7:6
3DFX_DEPTH 3D effect depth control
00
3D effect
5
4
3
2
1
0
ON3DFX
0: OFF
1: ON
0
0
0
0
0
0
DAC Left / Right channel swap
0: Left / Right inputs on Left / Right outputs
1: Left / Right inputs on Right / Left outputs
SWAP_DAC
SWAP_ADC
MONO_DAC
MONO_ADC
ONDEEMP
ADC Left / Right channel swap
0: Left / Right inputs on Left / Right outputs
1: Left / Right inputs on Right / Left outputs
(Left + Right) / 2 on Left and Right channels
0: inactive
1: active
Left ADC output on both Left and Right channels
0: inactive
1: active
De-emphasis filter
0: OFF
1: ON
Table 13-51. 3-D Effect Depth Control Table
3DFX_DEPTH
Attenuation
0dB
00
01
10
11
-6dB
-12dB
-18dB
109
11050A–PMAAC–07-Apr-10
Name:
INPUT_CONTROL
Access:
Read / Write.
This register is modified by Audio Controller at audio path change.
0x1E
Address:
7
-
6
5
4
3
2
1
0
LINESEL
ONMICL
ONMICR
ONADCL
ONADCR
ONLINL
ONLINR
Table 13-52. INPUT_CONTROL (0x1E) Structure
Bit
Name
Description
Reset value
7
unused
0
LINE / AUX input selection
0: Aux input selected
1: Line input selected
LINESEL
ONMICL
ONMICR
ONADCL
ONADCR
ONLINL
6
5
4
3
2
1
0
1
0
0
0
0
0
0
Left microphone amplifier
0: OFF
1: ON
Right microphone amplifier
0: OFF
1: ON
Left ADC
0: OFF
1: ON
Right ADC
0: OFF
1: ON
Left line input amplifier
0: OFF
1: ON
Right line input amplifier
0: OFF
1: ON
ONLINR
110
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
OUTPUT_CONTROL
Read / Write
Access:
This register is modified by Audio Controller at audio path change.
0x1F
Address:
7
-
6
5
4
3
2
1
0
ONSIDETONE
ONPLAYBACK
ONBYPASS
ONHPL
ONHPR
ONDACL
ONDACR
Table 13-53. OUTPUT_CONTROL (0x1F) Structure
Bit
Name
Description
Reset value
7
unused
0
Sidetone switch
0: muted
1: enabled
ONSIDETONE
ONPLAYBACK
ONBYPASS
ONHPL
6
5
4
3
2
1
0
0
0
0
0
0
0
0
Playback switch
0: muted
1: enabled
Bypass switch
0: muted
1: enabled
Left headphone amplifier
0: OFF
1: ON
Right headphone amplifier
0: OFF
1: ON
ONHPR
Left DAC
0: OFF
1: ON
ONDACL
Right DAC
0: OFF
ONDACR
1: ON
111
11050A–PMAAC–07-Apr-10
Name:
INPUT_MIXER
Access:
Read / Write
This register is modified by Audio Controller at audio path change.
0x20
Address:
7
-
6
-
5
4
3
2
1
0
MIXMICL
MIXMICR
MIXLINEL
MIXLINER
ONMIXL
ONMIXR
Table 13-54. INPUT_MIXER (0x20) Structure
Bit
Name
Description
Reset value
7:6
-
unused
00
Left microphone input mixer switch
5
4
3
2
1
0
MIXMICL
MIXMICR
MIXLINEL
MIXLINER
ONMIXL
0: muted
1: enabled
0
0
0
0
0
0
Right microphone input mixer switch
0: muted
1: enabled
Left line / aux input mixer switch
0: muted
1: enabled
Right line / aux input mixer switch
0: muted
1: enabled
Left input mixer ON / OFF
0: muted
1: enabled
Right input mixer ON / OFF
0: muted
ONMIXR
1: enabled
112
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
SIDETONE_VOL
Read / Write
0x21
Access:
Address:
7
-
6
-
5
-
4
3
2
1
0
SIDETONE_VOL
Table 13-55. SIDETONE_VOL (0x21) Structure
Bit
7:5
4:0
Name
Description
Reset value
000
unused
SIDETONE_VOL
Left / Right sidetone path attenuation
01011
Table 13-56. Left / Right Sidetone Path Attenuation Selection Table
SIDETONE_VOL
00000
ATT(dB)
SIDETONE_VOL
00100
ATT(dB)
SIDETONE_VOL
01000
ATT(dB)
0
3
6
9
12
15
18
21
24
27
30
30
00001
00101
01001
00010
00110
01010
00011
00111
>=01011
113
11050A–PMAAC–07-Apr-10
Name:
EQUALIZER
Read / Write
0x22
Access:
Address:
7
-
6
-
5
-
4
-
3
2
1
0
EQ_SEL
Table 13-57. EQUALIZER (0x22) Structure
Bit
7:4
3:0
Name
Description
Reset value
0
EQ_SEL
Equalizer selection
0000
Table 13-58. Equalizer Selection Table(0x22) Structure
EQ_SEL
0000
Description
Flat Response
0001
Bass boost +12dB
Bass boost +6dB
Bass cut -12dB
Bass cut -6dB
0010
0011
0100
0101
Medium boost +3dB
Medium boost +8dB
Medium cut -3dB
Medium cut -8dB
Treble boost +12dB
Treble boost +6dB
Treble cut -12dB
Treble cut -6dB
Flat response.
0110
0111
1000
1001
1010
1011
1100
Other value
114
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
ADC_CTRL
Read / Write
0x30
Access:
Address:
7
6
5
-
4
-
3
-
2
1
0
ON_ADC
ON_BUF
TS
Table 13-59. ADC_CTRL (0x30) Structure
Bit
Name
Description
Reset value
ADC function
0: OFF
7
ON_ADC
0
1: ON
Analog buffer
0: OFF
6
ON_BUF
0
1: ON
5:3
2:0
unused
TS
-
000
000
Sampling period
Table 13-60. ADC Sampling Period Selection Table
SAMPLING
PERIOD (s)
TS
000
001
010
011
100
101
110
111
0.01
0.02
0.1
1
2
3
4
Max speed
115
11050A–PMAAC–07-Apr-10
Name:
ADC_MUX_1
Read / Write
0x31
Access:
Address:
7
-
6
5
-
4
3
2
1
0
VIN
VDD4
VDD3
VDD2
VDD1
VDD0
Table 13-61. ADC_MUX1 (0x31) Structure
Bit
Name
Description
Reset value
7
unused
-
0
VIN channel selection
0: Not selected
1: Selected
6
5
4
VIN
1
1
1
unused
VDD4
-
VDD4 channel selection
0: Not selected
1: Selected
VDD3 channel selection
0: Not selected
1: Selected
3
2
1
0
VDD3
VDD2
VDD1
VDD0
1
1
1
1
VDD2 channel selection
0: Not selected
1: Selected
VDD1 channel selection
0: Not selected
1: Selected
VDD0 channel selection
0: Not selected
1: Selected
116
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
ADC_MUX_2
Read / Write
0x32
Access:
Address:
7
-
6
-
5
-
4
-
3
2
1
0
ANA3
ANA2
ANA1
ANA0
Table 13-62. ADC_MUX2 (0x32) Structure
Bit
Name
Description
Reset value
7:4
unused
-
0000
ANA3 channel selection
0: Not selected
1: Selected
3
2
1
0
ANA3
ANA2
ANA1
ANA0
1
1
1
1
ANA2 channel selection
0: Not selected
1: Selected
ANA1 channel selection
0: Not selected
1: Selected
ANA0 channel selection
0: Not selected
1: Selected
117
11050A–PMAAC–07-Apr-10
Name:
ADC_ANA0_MSB
Read Only
0x33
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-63. ADC_ANA0_MSB (0x33) Structure
Bit
Name
Description
ADC_OUT<9:2> for ANA0 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_ANA0_LSB
Read Only
0x34
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-64. ADC_ANA0_LSB (0x34) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for ANA0 Channel
00
118
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
ADC_ANA1_MSB
Read Only
0x35
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-65. ADC_ANA1_MSB (0x35) Structure
Bit
Name
Description
ADC_OUT<9:2> for ANA1 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_ANA1_LSB
Read Only
0x36
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-66. ADC_ANA1_LSB (0x36) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for ANA1 Channel
00
119
11050A–PMAAC–07-Apr-10
Name:
ADC_ANA2_MSB
Read Only
0x37
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-67. ADC_ANA2_MSB (0x37) Structure
Bit
Name
Description
ADC_OUT<9:2> for ANA2 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_ANA2_LSB
Read Only
0x38
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-68. ADC_ANA2_LSB (0x38) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for ANA2 Channel
00
120
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
ADC_ANA3_MSB
Read Only
0x39
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-69. ADC_ANA3_MSB (0x39) Structure
Bit
Name
Description
ADC_OUT<9:2> for ANA3 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_ANA3_LSB
Read Only
0x3A
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-70. ADC_ANA3_LSB (0x3A) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for ANA3 Channel
00
121
11050A–PMAAC–07-Apr-10
Name:
ADC_VDD0_MSB
Read Only
0x3B
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-71. ADC_VDD0_MSB (0x3B) Structure
Bit
Name
Description
ADC_OUT<9:2> for VDD0 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_VDD0_LSB
Read Only
0x3C
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-72. ADC_VDD0_LSB (0x3C) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for VDD0 Channel
00
122
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
Name:
ADC_VDD1_MSB
Read Only
0x3D
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-73. ADC_VDD1_MSB (0x3D) Structure
Bit
Name
Description
ADC_OUT<9:2> for VDD1 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_VDD1_LSB
Read Only
0x3E
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-74. ADC_VDD1_LSB (0x3E) Structure
Bit
Name
Description
Reset value
7:2
1:0
-
unused
ADC<1:0>
ADC_OUT<1:0> for VDD1 Channel
00
123
11050A–PMAAC–07-Apr-10
Name:
ADC_VDD2_MSB
Read Only
0x3F
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-75. ADC_VDD2_MSB (0x3F) Structure
Bit
Name
Description
ADC_OUT<9:2> for VDD2 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_VDD2_LSB
Read Only
0x40
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-76. ADC_VDD2_LSB (0x40) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for VDD2 Channel
00
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Name:
ADC_VDD3_MSB
Read Only
0x41
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-77. ADC_VDD3_MSB (0x41) Structure
Bit
Name
Description
ADC_OUT<9:2> for VDD3 Channel
Reset value
7:2
ADC<9:2>
00000000
Name:
ADC_VDD3_LSB
Read Only
0x42
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-78. ADC_VDD3_LSB (0x42) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for VDD3 Channel
00
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Name:
ADC_VDD4_MSB
Read Only
0x43
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-79. ADC_VDD4_MSB (0x43) Structure
Bit
Name
Description
ADC_OUT<9:2> for VDD4 Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_VDD4_LSB
Read Only
0x44
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-80. ADC_VDD4_LSB (0x44) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for VDD4 Channel
00
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Name:
ADC_VIN_MSB
Read Only
0x47
Access:
Address:
7
6
5
4
3
2
1
0
ADC<9:2>
Table 13-81. ADC_VIN_MSB (0x47) Structure
Bit
Name
Description
ADC_OUT<9:2> for VIN Channel
Reset value
7:0
ADC<9:2>
00000000
Name:
ADC_VIN_LSB
Read Only
0x48
Access:
Address:
7
6
5
4
3
2
1
0
ADC<1:0>
Table 13-82. ADC_VIN_LSB (0x48) Structure
Bit
7:2
1:0
Name
Description
Reset value
-
unused
ADC<1:0>
ADC_OUT<1:0> for VIN Channel
00
127
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Name:
ADC_ANA_LSB
Read Only
0x49
Access:
Address:
7
6
5
4
3
2
1
0
ADC_ANA3<1:0>
ADC_ANA2<1:0>
ADC_ANA1<1:0>
ADC_ANA0<1:0>
Table 13-83. ADC_ANA_LSB (0x49) Structure
Bit
7:6
5:4
3:2
1:0
Name
Description
Reset value
ADC_ANA3<1:0>
ADC_ANA2<1:0>
ADC_ANA1<1:0>
ADC_ANA0<1:0>
ADC_OUT<1:0:> for ANA3 Channel
ADC_OUT<1:0:> for ANA2 Channel
ADC_OUT<1:0:> for ANA1 Channel
ADC_OUT<1:0:> for ANA0 Channel
00
00
00
00
Name:
RTC_CTRL
Access:
Address:
Read / Write
0x50
7
-
6
-
5
4
3
2
1
0
RTC_WRITE RTC_SEL
RTC_EN
Table 13-84. RTC_CTRL (0x50) Structure
Bit
Name
Description
unused
Reset value
7:3
-
RTC read/write:
2
1
0
RTC_WRITE
RTC_SEL
RTC_EN
RTC_WRITE = 0: Read mode
RTC_WRITE = 1: Write mode
0
0
0
RTC block select:
RTC_SEL = 0: Not Selected
RTC_SEL = 1: Selected
RTC block enable:
RTC_EN = 0: Disabled
RTC_EN = 1: Enabled
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Name:
RTC_ADDR
Read / Write
0x51
Access:
Address:
7
6
5
4
3
2
1
0
RTC_ADDR
Table 13-85. RTC_ADDR (0x51) Structure
Bit
Name
Description
Reset value
7:0
RTC_ADDR
RTC address
0000
Name:
RTC_DATA0
Read / Write
0x52
Access:
Address:
7
6
5
4
3
2
1
0
RTC_DATA0
Table 13-86. RTC_DATA0 (0x52) Structure
Bit
Name
Description
Reset value
7:0
RTC_DATA0
RTC DATA 0
0000000
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Name:
RTC_DATA1
Read / Write
0x53
Access:
Address:
7
6
5
4
3
3
3
2
2
2
1
1
1
0
RTC_DATA1
Table 13-87. RTC_DATA1 (0x53) Structure
Bit
Name
Description
Reset value
7:0
RTC_DATA1
RTC DATA 1
0000000
Name:
RTC_DATA2
Read / Write
0x54
Access:
Address:
7
6
5
4
0
RTC_DATA2
Table 13-88. RTC_DATA2 (0x54) Structure
Bit
Name
Description
Reset value
7:0
RTC_DATA2
RTC DATA 2
0000000
Name:
RTC_DATA3
Read / Write
0x55
Access:
Address:
7
6
5
4
0
RTC_DATA3
Table 13-89. RTC_DATA3 (0x55) Structure
Bit
Name
Description
Reset value
7:0
RTC_DATA3
RTC DATA 3
0000000
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Name:
BACKUP_CTRL
Read / Write
0x56
Access:
Address:
7
-
6
-
5
-
4
-
3
2
1
0
OSC_UPDT
OSC_EN
OSC_STAT RST_BKUP
Table 13-90. BACKUP_CTRL (0x56) Structure
Bit
Name
Description
Reset value
7:4
-
unused
0000
RTC Oscillator update
0: No action.
1: Update RTC oscillator with OSC_EN
3
2
1
0
OSC_UPDT
OSC_EN
0
0
0
0
RTC Oscillator enable request
0: Oscillator off.
1: Oscillator on.
RTC Oscillator status (read only)
0: Oscillator off.
1: Oscillator on.
OSC_STAT
RST_BKUP
Reset of the Backup Area
0: Backup area active
1: Backup area in reset state
Name:
VERSION
Access:
Address:
Read
0x7F
7
6
5
4
3
2
1
0
SOFTWARE_TAG
VERSION
Table 13-91. VERSION (0x7F) Structure
Bit
Name
Description
Reset value
Software Tag to identify product specificities as
described in Section 17. “Ordering Information”
on page 154.
SOFTWARE_TAG
7:4
XXXX
‘0001’: Rev. C samples
‘0010’: Rev. D samples
3:0
VERSION
XXXX
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14. PMU and Audio Soft Control: Quick Start
14.1 RTC Examples
14.1.1
14.1.2
14.1.3
14.1.4
RTC Oscillator POWER-ON
// Set OSC_EN = 1 and OSC_UPDT = 1
TWI_WRITE 0x0C @BACKUP_CTRL
// Wait > 200us.
WAIT 200us
// Set OSC_UPDT = 0
TWI_WRITE 0x04 @BACKUP_CTRL
// Read BACKUP_CTRL to verify OSC_STAT bit. Result = 0x06.
TWI_READ @BACKUP_CTRL
RTC Oscillator POWER-OFF
// Set OSC_EN = 0 and OSC_UPDT = 1
TWI_WRITE 0x08 @BACKUP_CTRL
// Wait 200us
WAIT 200us
// Set OSC_UPDT = 0
TWI_WRITE 0x00 @BACKUP_CTRL
// Read BACKUP_CTRL to verify OSC_STAT bit. Result = 0x00.
TWI_READ @BACKUP_CTRL
RTC Domain RESET
// Set RST_BKUP = 1
TWI_WRITE 0x01 @BACKUP_CTRL
// Wait 200s
WAIT 200us
// Set RST_BKUP = 0
TWI_WRITE 0x00 @BACKUP_CTRL
Note:
RTC Write Operation
Reset of the RTC domain powers off the RTC oscillator.
The following example makes a generic 32-bit write operation into the RTC macro. The 32-bit
data is split into 4 bytes, that are successively sent over the TWI.
unsigned int RTC_DATA;
char DATA0 = (char) (RTC_DATA); // LSBs
char DATA1 = (char) (RTC_DATA >> 8);
char DATA2 = (char) (RTC_DATA >> 16);
char DATA3 = (char) (RTC_DATA >> 24); // MSBs
// Select RTC_ADDR = ADDR. ADDR is the RTC macro register to write,
TWI_WRITE ADDR @RTC_ADDR
// Set RTC_DATA0 to RTC_DATA4 registers.
TWI_WRITE DATA0 @RTC_DATA0
TWI_WRITE DATA1 @RTC_DATA1
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TWI_WRITE DATA2 @RTC_DATA2
TWI_WRITE DATA3 @RTC_DATA3
// Set RTC_WRITE = 1 (write) and RTC_SEL = 1
TWI_WRITE 0x06 @ RTC_CTRL
// Pulse RTC_EN
TWI_WRITE 0x07 @ RTC_CTRL
TWI_WRITE 0x06 @ RTC_CTRL
// Disable RTC access
TWI_WRITE 0x00 @ RTC_CTRL
14.1.5
RTC Read Operation
The following example makes a generic 32-bit read operation into the RTC macro. The 32-bit
RTC data is split into 4 bytes, that are successively read over the TWI.
// Select RTC_ADDR = ADDR. ADDR is the RTC macro register to read,
TWI_WRITE ADDR @RTC_ADDR
// Set RTC_WRITE = 0 (read) and RTC_SEL = 1
TWI_WRITE 0x02 @ RTC_CTRL
// Pulse RTC_EN
TWI_WRITE 0x03 @ RTC_CTRL
TWI_WRITE 0x02 @ RTC_CTRL
// Read RTC_DATA0 to RTC_DATA4 registers.
TWI_READ @RTC_DATA0 // LSBs
TWI_READ @RTC_DATA1
TWI_READ @RTC_DATA2
TWI_READ @RTC_DATA3 // MSBs
// Disable RTC access
TWI_WRITE 0x00 @ RTC_CTRL
14.1.6
RTC Date and Time Update
In the following example, the RTC date and time is set to “12 October 2004, 08h 49min 59s”.
The WRITE_RTC and READ_RTC functions operate as described in the previous sections.
// Disable RTC interrupt MASK
TWI_WRITE 0xFE @PMU_MASK
// Enable RTC ACKUPD IT @RTC_IER (RTC_ADDR 0x20).
WRITE_RTC 0x00000001 @RTC_IER
// Set UPDTIME and UPDCAL @RTC_CR (RTC_ADDR 0x00).
WRITE_RTC 0x00000003 @RTC_CR
// Wait ITB low. This ensures that the RTC is ready to be updated.
// Reset IT by read operation, result is 0x01.
TWI_READ @PMU_IT
// Read in RTC_SR that ACKUPD = 1 (RTC_ADDR = 0x18)
READ_RTC @RTC_SR
// Disable ACKUPD IT @RTC_IDR (RTC_ADDR = 0x24)
WRITE_RTC 0x00000001 @RTC_IDR
// Write Date @RTC_CALR (RTC_ADDR = 0x0C) (12 October 2004)
WRITE_RTC 0x12300420 @RTC_CALR
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// Write Time @RTC_TIMR (RTC_ADDR = 0x08) (08h 49min 59s)
WRITE_RTC 0x00084959 @RTC_TIMR
// Start RTC @RTC_CR (RTC_ADDR = 0x00)
WRITE_RTC 0x00000000 @RTC_CR
14.2 Audio Examples
14.2.1
Basic Audio Codec Setting Using Automatic Path Control
The following example demonstrates an automatic audio path setting. Assuming that the audio
codec is supplied by the LDO4, the sequence is the following:
• Make the codec interface configuration,
• Set the Digital-IN to Headphone-OUT path,
• Put the audio codec in standby mode,
• Release the standby mode to re-activate the selected path,
• Change the path on-the-fly,
• Shutdown the codec.
// Start LDO4 @3.3V
TWI_WRITE 0x8C @ VDD4_CTRL
// Digital Audio Interface configuration
// Master clock = 12.288MHz, Master / Slave = slave.
// DAI mode = I2S mode, Word length = 24 bits, FS = 48kHz
TWI_WRITE 0x01 @ DAI_CONTROL
TWI_WRITE 0x63 @ FRAME_CONTROL
// Analog interface configuration
// Mic. config: L & R single ended, Micbias = OFF, Mic. detection = OFF.
// Headphone config: AC coupled,
// Automatic Soft Ramping = ON, ASR timing = 11 (~10ms / step)
TWI_WRITE 0x00 @ MIC_CONTROL
TWI_WRITE 0x27 @ AUDIO_CONTROL
// Analog gain
// Headphone (L & R) gain: -20dB. (LHPBOTH set by default in HP_CONTROL)
// Mic L & R gain: +26 dB.
// Unmute all gains. No power-up is performed.
TWI_WRITE 0xEC @ HPLVOL
TWI_WRITE 0x1A @ MICLVOL
TWI_WRITE 0x1A @ MICRVOL
TWI_WRITE 0x00 @ MUTE
// Audio Start
// ENAC = 1, STANDBY = 1. PATH = 1 (DAC playback)
// At the first start, VMID capacitor is charged.
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// Wait (3.tau) = 300ms with 1uF before standby release. (VMID will be
// discharged only when ENAC = 0.)
// From this point Audio Data can be sent over the Digital audio interface.
TWI_WRITE 0x61 @ AUTOSTART.
WAIT 300ms
// Release standby. The audio codec starts silently, the gains are slowly
// ramped up from mute to the register gains. The codec is active.
TWI_WRITE 0x41 @ AUTOSTART
// Codec Pause by Standby
// All gains are softly ramped down to mute. The codec functions are
// shut down. Current consumption is reduced to a few hundreds of micro-
// amps. VMID remains charged
TWI_WRITE 0x61 @ AUTOSTART
// Pause out: Standby release. The codec softly re-starts.
TWI_WRITE 0x41 @ AUTOSTART
// On-the-fly path change
// PATH = 19: Digital IN to Headphone OUT + Mic IN to Digital OUT.
// The codec controller powers up automatically the new path. The DAC
// playback is not affected by starting the Mic. recording.
TWI_WRITE 0x52 @ AUTOSTART
// Codec Shutdown. ENAC = 0, STANDBY = 1. The codec turns off smoothly.
// In case of AC Coupling output configuration, HPR & HPL will slowly
// discharge following VMID time constant.
TWI_WRITE 0x20 @ AUTOSTART
WAIT 600ms
// Disable DCBLOCK bit.
TWI_WRITE 0x07 @ AUDIO_CONTROL
// LDO4 shutdown.
TWI_WRITE 0x0C @ VDD4_CONTROL
14.2.2
Basic Audio Codec Setting Using Custom Path Control
The following example demonstrates a custom audio path setting. Assuming that the audio
codec is supplied by the LDO4, the sequence is the following:
• Make the codec analog and digital interfaces configuration,
• Enter the custom path mode and configure a path with DAC input and Headphone Amplifier
output,
• Put the audio codec in standby mode,
• Release the standby mode to re-activate the selected path,
• Change the path on-the-fly to add the microphone inputs to the DAC signal,
• Shutdown the codec.
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// Start LDO4 @3.3V
TWI_WRITE 0x8C @ VDD4_CTRL
// Digital Audio Interface configuration
// Master clock = 12.288MHz, Master / Slave = slave.
// DAI mode = I2S mode, Word length = 24 bits, FS = 48kHz
TWI_WRITE 0x01 @ DAI_CONTROL
TWI_WRITE 0x63 @ FRAME_CONTROL
// Analog interface configuration
// Mic. config: L & R single ended, Micbias = OFF, Mic. detection = OFF.
// Headphone config: AC coupled,
// Automatic Soft Ramping = ON, ASR timing = 11 (~10ms / step)
TWI_WRITE 0x00 @ MIC_CONTROL
TWI_WRITE 0x27 @ AUDIO_CONTROL
// Analog gain
// Headphone (L & R) gain: -20dB. (LHPBOTH set by default in HP_CONTROL)
// Mic L & R gain: +26 dB.
// Unmute all gains. No power-up is performed.
TWI_WRITE 0xEC @ HPLVOL
TWI_WRITE 0x1A @ MICLVOL
TWI_WRITE 0x1A @ MICRVOL
TWI_WRITE 0x00 @ MUTE
// Enter the custom path configuration mode
TWI_WRITE 0x2F @ AUDIO_CONTROL
// Audio Start
// ENAC = 1, STANDBY = 1. PATH = 0 (Not read by the audio controller)
// At the first start, VMID capacitor is charged.
// Wait (3.tau) = 300ms with 1uF before standby release. (VMID will be
// discharged only when ENAC = 0.)
// From this point Audio Data can be sent over the Digital audio interface.
TWI_WRITE 0x60 @ AUTOSTART.
WAIT 300ms
// Audio path definition: DAC input to Headphone output. The software sets
// the bits: ONDACL, ONDACR, ONHPL, ONHPR and PLAYBACK by writing
// the registers INPUT_CONTROL, OUTPUT_CONTROL, and INPUT_MIXER.
// The changes are not taken immediately into account (ENCONF = 0).
TWI_WRITE 0x40 @ INPUT_CTRL
TWI_WRITE 0x2F @ OUTPUT_CTRL
TWI_WRITE 0x00 @ INPUT_MIXER
// ENCONF pulse: the audio controller takes the requested changes into
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// account.
TWI_WRITE 0x3F @ AUDIO_CONTROL
TWI_WRITE 0x2F @ AUDIO_CONTROL
// STANDBY release. The codec softly starts.
TWI_WRITE 0x40 @ AUTOSTART.
// Codec Pause by Standby
// All gains are softly ramped down to mute. The codec functions are
// shut down. Current consumption is reduced to a few hundreds of micro-
// amps. VMID remains charged
TWI_WRITE 0x60 @ AUTOSTART
// Pause out: Standby release. The codec softly re-starts.
TWI_WRITE 0x40 @ AUTOSTART
// On-the-fly path change: the stereo microphone inputs are added to the
// DAC playback. The software sets: ONMICL, ONMICR, and ONSIDETONE.
TWI_WRITE 0x70 @ INPUT_CTRL
TWI_WRITE 0x6F @ OUTPUT_CTRL
TWI_WRITE 0x00 @ INPUT_MIXER
// Sidetone gain
TWI_WRITE 0x00 @ SIDETONE_VOL
// ENCONF pulse: the audio controller takes the requested changes into
// account. The path modification is here immediate because STANDBY=0.
TWI_WRITE 0x3F @ AUDIO_CONTROL
TWI_WRITE 0x2F @ AUDIO_CONTROL
// Codec Shutdown. ENAC = 0, STANDBY = 1. The codec turns off smoothly.
// In case of AC Coupling output configuration, HPR & HPL will slowly
// discharge following VMID time constant.
TWI_WRITE 0x20 @ AUTOSTART
WAIT 600ms
// Disable DCBLOCK bit.
TWI_WRITE 0x07 @ AUDIO_CONTROL
// LDO4 shutdown.
TWI_WRITE 0x0C @ VDD4_CONTROL
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15. Typical Performance Characteristics
15.1 PMU: Power Supply Sequences
Figure 15-1. Powerdown State to Run State Supplies Start-Up
Powerdown to Run State
SEQUENCE A
Powerdown to Run State
SEQUENCE B
Figure 15-2. Run Sate to Powerdown State Supplies Shut-Down
Run to Powerdown State
SEQUENCE A
Run to Powerdown State
SEQUENCE B
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Figure 15-3. Detailed Supplies Start-Up
Detailed Supplies Start-Up
SEQUENCE A
Detailed Supplies Start-Up
SEQUENCE B
Figure 15-4. Detailed Supplies Shutdown
Detailed Supplies Shutdown
SEQUENCE A
Detailed Supplies shutdown
SEQUENCE B
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Figure 15-5. Run State to Standby State
Run To Standby State (default setting)
SEQUENCE A
Run To Standby State (default setting)
SEQUENCE B
Figure 15-6. Standby To Run State
Standby To Run State (default setting)
SEQUENCE A
Standby To Run State (default setting)
SEQUENCE B
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15.2 DCDC0 and DCDC1
Unless otherwise noted, the reported measurement were performed at room temperature. External components are those
described in Section 5. “Application Block Diagram” on page 8.
Figure 15-7. DCDC0 Transient Load Regulation Performance
DCDC0 - VIN = 3.3V - VOUT = 1.85V
Load Step 0 To 600mA / 1us
DCDC0 - VIN = 3.3V - VOUT = 1.85V
Load Step 600 To 0mA / 1us
DCDC0 - VIN = 5.5V - VOUT = 1.85V
Load Step 0 To 600mA / 1us
DCDC0 - VIN = 5.5V - VOUT = 1.85V
Load Step 600 To 0mA / 1us
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Figure 15-8. DCDC0 Ripple and Efficency Performance
DCDC0 - VOUT = 1.8V
Efficiency in PFM and PWM modes
DCDC0 - VIN = 5.5V - VOUT = 1.8V
Output Voltage Ripple
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Figure 15-9. DCDC1Transient Load Regulation Performance
DCDC0 - VIN = 3.3V - VOUT = 1.2V
Load Step 0 To 600mA / 1us
DCDC0 - VIN = 3.3V - VOUT = 1.2V
Load Step 600 To 0mA / 1us
DCDC0 - VIN = 5.5V - VOUT = 1.2V
DCDC0 - VIN = 5.5V - VOUT = 1.2V
Load Step 0 To 600mA / 1us
Load Step 600 To 0mA / 1us
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Figure 15-10. DCDC0 Ripple and Efficiency Performance
DCDC1 - VOUT = 1.2V
Efficiency in PFM and PWM modes
DCDC1 - VIN = 5.5V - VOUT = 1.2V
Output Voltage Ripple
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15.3 LDO2
Unless otherwise noted, the reported measurement were performed at room temperature. External components are those
described in Section 5. “Application Block Diagram” on page 8.
Figure 15-11. LDO2 Tansient and Static Load Regulation Performance
LDO2- VIN = 1.8V - VOUT = 1V
Load Step 0 To 300mA / 1us
LDO2 - VIN = 1.8V - VOUT = 1V
Load Step 300 To 0mA / 1us
LDO2 - VIN = 1.8V - VOUT = 1V
LDO2 - VIN = 1.7V - VOUT = 1.2V
Static Load Regulation - 0 To 300mA
Static Load Regulation - 0 To 300mA
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15.4 LDO3
Unless otherwise noted, the reported measurement were performed at room temperature. External components are those
described in Section 5. “Application Block Diagram” on page 8.
Figure 15-12. LDO3 Transient and Static Load Regulation Performance
LDO3- VIN = 5.5V - VDD3 = 3.3V
Load Step 0 To 200mA / 1us
LDO3 - VIN = 5.5V - VDD3 = 3.3V
Load Step 200 To 0mA / 1us
LDO3 - VIN = 3.6V - VDD3 = 3.3V
Static Load Regulation - 0 To 200mA
LDO3 - VDD3 = 3.3V - 200mA output load
Drop Out Characteristic.
(VDD3REG = VDD3 with VIN3 > VDD3 + 300mV)
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15.5 AUDIO
Unless otherwise noted, the reported measurement were performed at room temperature with AVDD = 3.3V supplied from
LDO4. Typical components as described in Section 5. “Application Block Diagram” on page 8 are used.
Figure 15-13. Microphone Recording Waveforms
Differential Microphone Recording ( Path 5)
-1dBV / 1kHz Input - Fs = 48kHz - 16kpts FFT
Differential Microphone Recording ( Path 5)
-60dBV / 1kHz Input - Fs = 48kHz - 16kpts FFT
Differential Microphone Recording ( Path 5)
THD+N Ratio Versus Input Level
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Figure 15-14. DAC Playback Waveforms
DAC playback ( Path 1) - Load 10k
0 dBFs / 1kHz Input - Fs = 48kHz - 32kpts FFT
DAC playback ( Path 1) - Load 10k
-60 dBFs / 1kHz Input - Fs = 48kHz - 32kpts FFT
DAC playback ( Path 1) - Load 10k
THD+N Ratio Versus Input Level
DAC playback ( Path 1) - Load 32 Ohms AC coupled
20mW Ouput Power - Fs = 48kHz - 32kpts FFT
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Figure 15-15. Line Record Waveforms
Line Record (path 7)
-1 dBV / 1kHz Input - Fs = 48kHz - 32kpts FFT
Line Record (path 7)
-60 dBV / 1kHz Input - Fs = 48kHz - 32kpts FFT
Line Record (path 7)
THD+N Ratio Versus Input Level
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Figure 15-16. Line Bypass Waveforms
Line Bypass (path 5)
0 dBV / 1kHz Input - 10k load - 16kpts FFT
Line Bypass (path 5)
-60 dBV / 1kHz Input - 10k load - 16kpts FFT
Line Record (path 5) - 10k load
THD+N Ratio Versus Input Level
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16. Package Information
Figure 16-1. Mechanical Package Drawing for 64-lead Quad Flat No Lead Package
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17. Ordering Information
Table 17-1. Ordering Information
Temperature
Ordering Code
Package
Power Sequence
Type(2)
Software
Tag(1)
Supplies Default Values
and Marking
Operating Range
VDD0 = 1.85V
VDD1 = 1.20V
VDD2 = 1.00V
VDD3 = 3.30V
VDD4 = 3.30V
QFN64 7.5 x7.5mm
AT73C246
Green
-40°C to +85°C
-40°C to +85°C
-40°C to +85°C
A
B
B
0000
0001
0010
VDD0 = 1.80V
VDD1 = 1.20V
VDD2 = 1.20V
VDD3 = 3.30V
VDD4 = 3.30V
QFN64 7.5 x7.5mm
AT73C246-A
Green
VDD0 = 1.80V
VDD1 = 1.00V
VDD2 = 1.00V
VDD3 = 3.30V
VDD4 = 3.30V
QFN64 7.5 x7.5mm
AT73C246-B
Green
Notes: 1. See “VERSION” (0x7F) register definition.
2. See “Power Manager State Description” on page 29 and “Typical Performance Characteristics” on page 139.
154
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
18. Revision History
Table 18-1. Revision History
Change
Request
Ref.
Doc. Rev
Date
Comments
11050A
07-Apr-10
First issue
155
11050A–PMAAC–07-Apr-10
156
AT73C246
11050A–PMAAC–07-Apr-10
AT73C246
1
2
3
4
5
6
7
8
9
Description ............................................................................................... 2
Block Diagram .......................................................................................... 3
Package and Pinout ................................................................................. 4
Pin Description ......................................................................................... 5
Application Block Diagram ..................................................................... 8
Absolute Maximum Ratings .................................................................. 11
Recommended Operating Conditions .................................................. 11
Power Dissipation Ratings .................................................................... 11
PMU Electrical Characteristics ............................................................. 12
9.1Current Consumption Versus Modes ......................................................................12
9.2Supply Monitor Thresholds ......................................................................................12
9.3Digital I/Os DC Characteristics ................................................................................13
9.4DCDC0 and DCDC1 ................................................................................................14
9.5LDO2 .......................................................................................................................16
9.6LDO3 .......................................................................................................................17
9.7LDO4 .......................................................................................................................18
9.8LDO5 .......................................................................................................................19
9.9Measurement Bridge and 10-bit ADC .....................................................................20
9.10RTC Crystal Oscillator ...........................................................................................21
9.11Die Temperature Sensor .......................................................................................21
10 Audio Codec Electrical Characteristics ............................................... 22
11 PMU Functional Description ................................................................. 25
11.1Power Manager State Diagram .............................................................................25
11.2PMU Startup and Shutdown State Diagram ..........................................................26
11.3Power Manager Conditional Transitions ................................................................27
11.4Power Manager State Description .........................................................................29
11.5DCDC0 and DCDC1 Functional Description .........................................................36
11.6LDO2 Functional Description .................................................................................37
11.7LDO3 and LDO4 Functional Description ...............................................................37
11.8Power Fail Detectors .............................................................................................38
11.9Measurement Bridge and 10-bit ADC ....................................................................38
11.10Real Time Clock (RTC) User Interface ................................................................40
11.11Die Temperature Sensor .....................................................................................54
i
11050A–PMAAC–07-Apr-10
12 Audio Codec Functional Description ................................................... 55
12.1Description .............................................................................................................55
12.2Audio Codec Block Diagram ..................................................................................55
12.3Audio Codec Controls ............................................................................................56
12.4Audio Controller .....................................................................................................57
12.5Audio Codec Power Consumption Versus Programmed Audio Path ....................63
12.6Digital Audio Interface ...........................................................................................66
12.7Digital Filters Transfer Function .............................................................................68
12.8Analog Audio Interfaces ........................................................................................74
13 Two Wire Interface and Control Registers ........................................... 77
13.1Two-wire Interface (TWI) Protocol .........................................................................77
13.2PMU Register Tables ............................................................................................79
14 PMU and Audio Soft Control: Quick Start ......................................... 132
14.1RTC Examples ....................................................................................................132
14.2Audio Examples ...................................................................................................134
15 Typical Performance Characteristics ................................................. 139
15.1PMU: Power Supply Sequences .........................................................................139
15.2DCDC0 and DCDC1 ............................................................................................142
15.3LDO2 ...................................................................................................................146
15.4LDO3 ...................................................................................................................147
15.5AUDIO .................................................................................................................148
16 Package Information ............................................................................ 153
17 Ordering Information ........................................................................... 154
18 Revision History ................................................................................... 155
ii
AT73C246
11050A–PMAAC–07-Apr-10
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11050A–PMAAC–07-Apr-10
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