MAX1488EESD-T [MAXIM]
Line Driver, 4 Func, 1 Driver, CMOS, PDSO14, 0.150 INCH, MS-012B, SOIC-14;
| 型号： | MAX1488EESD-T |
| 厂家： | 
MAXIM INTEGRATED PRODUCTS |
| 描述： | Line Driver, 4 Func, 1 Driver, CMOS, PDSO14, 0.150 INCH, MS-012B, SOIC-14 驱动 输入元件 光电二极管 接口集成电路 驱动器 |
| 文件： | 总8页 (文件大小：102K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
19-2403; Rev 0; 8/95
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
MAX148E
_______________Ge n e ra l De s c rip t io n
____________________________Fe a t u re s
The MAX1488E quad, low-power line driver is designed
for EIA/TIA-232, EIA/TIA-562, and CCITT V.28 commu-
nications in harsh environments. Each transmitter out-
put is protected against ±15kV electrostatic discharge
(ESD) shocks. The inputs are TTL and CMOS compati-
ble with minimal loading. The outputs feature internally
controlled slew-rate limiting and current limiting. This
device has a guaranteed 120kbps data rate. Power-
s up p ly c urre nt is le s s tha n 180µA ove r a ± 4.5V to
±13.2V supply voltage range.
♦ ESD Protection:
±15kV—Human Body Model
±6kV—IEC801-2, Contact Discharge
±15kV—IEC801-2, Air-Gap Discharge
♦ Latchup Free, Even During an ESD Event
♦ Low 85µA Supply Current from I or I
EE
CC
♦ Guaranteed 120kbps Data Rate
♦ No External Capacitors Required for Slew-Rate
The MAX1488E is pin compatible with the MC1488,
MC14C88, SN75188, SN75C188, DS1488, a nd
DS14C88. It is available in 14-pin plastic DIP and SO
packages.
Limiting
♦ Pin Compatible with MC1488, MC14C88, SN75188,
SN75C188, DS1488, and DS14C88
______________Ord e rin g In fo rm a t io n
________________________Ap p lic a t io n s
PART
TEMP. RANGE
0°C to +70°C
0°C to +70°C
0°C to +70°C
-40°C to +85°C
-40°C to +85°C
PIN-PACKAGE
14 Plastic DIP
14 SO
PC Motherboards
Modems
MAX1488ECPD
MAX1488ECSD
MAX1488EC/D
MAX1488EEPD
MAX1488EESD
Interface Data Terminal Equipment (DTE) with
Data Circuit-Terminating Equipment (DCE)
Dice*
14 Plastic DIP
14 SO
Equipment Meeting IEC1000-4-2
(formerly IEC801-2) or ±15kV ESD Protection
* Dice are specified at T = +25°C.
A
__________Typ ic a l Op e ra t in g Circ u it
__________________P in Co n fig u ra t io n
1
1
⁄ MAX1488E
TOP VIEW
4
⁄ MAX1489E
4
V
V
EE
1
2
3
4
5
6
7
CC
14
13
12
11
10
9
MAX1488E
TTL/CMOS
LOGIC
TTL/CMOS
LOGIC
INTERCONNECTING
CABLE
INPUT A
OUTPUT A
INPUT B1
INPUT B2
OUTPUT B
GND
INPUT D1
INPUT D2
OUTPUT D
INPUT C1
INPUT C2
OUTPUT C
1
1
⁄ MAX1488E
⁄ MAX1489E
4
4
SIGNAL GROUND
8
PC
MODEM
(DCE)
MOTHERBOARD
(DTE)
DIP/SO
________________________________________________________________ Maxim Integrated Products
1
Ca ll t o ll fre e 1 -8 0 0 -9 9 8 -8 8 0 0 fo r fre e s a m p le s o r lit e ra t u re .
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
ABSOLUTE MAXIMUM RATINGS
Positive Supply Voltage (V ) .............................................+14V
Operating Temperature Ranges
CC
Negative Supply Voltage (V ).............................................-14V
MAX1488EC_D ...................................................0°C to +70°C
MAX1488EE_D ................................................-40°C to +85°C
Storage Temperature Range .............................-65°C to +160°C
Lead Temperature (soldering, 10sec) .............................+300°C
EE
Input Voltage (V ) .................................................-0.3V to +15V
IN
Driver Output Voltage ..........................................................±15V
Continuous Power Dissipation (T = +70°C)
A
Plastic DIP (derate 10.00mW/°C above +70°C) ..........800mW
SO (derate 8.7mW/°C above +70°C)...........................695mW
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
MAX148E
ELECTRICAL CHARACTERISTICS
(V = 4.5V to 13.2V, V = -4.5V to -13.2V, T = T
to T , unless otherwise noted. Typical values are at T = +25°C.)
MAX A
CC
EE
A
MIN
PARAMETER
SYMBOL
CONDITIONS
= -V = 5.0V, R = 3kΩ
MIN
TYP
MAX
UNITS
DC CHARACTERISTICS
V
3.7
5
4.0
5.4
CC
EE
L
V
CC
= -V = 6.5V, R = 3kΩ
EE L
Output Voltage High
V
OH
V
V
CC
= -V = 12.0V, R = 3kΩ
10
10.5
EE
L
V
= -V = 13.2V, R = open
13.2
-3.7
-5
CC
EE
L
V
CC
= -V = 5.0V, R = 3kΩ
-4.5
-5.8
EE
L
V
CC
= -V = 6.5V, R = 3kΩ
EE L
Output Voltage Low
V
V
V
OL
V
= -V = 12.0V, R = 3kΩ
-10.8
-10
CC
EE
L
V
CC
= -V = 13.2V, R = open
-13.2
4.5
EE
L
V
CC
13.2
-4.5
180
Operating Voltage Range
V
EE
-13.2
Positive Supply Current
Negative Supply Current
Output Short-Circuit Current
Input High Voltage
I
CC
No load
No load
85
-85
±20
µA
µA
mA
V
I
EE
-180
±4
I
OS
Output shorted to ground (Note 1)
±45
V
2.0
IH
Input Low Voltage
V
0.8
±2
V
IL
Input Current
I
IN1
0
µA
Ω
Output Resistance
R
O
300
V
CC
= V = 0V V ≤ 2.0V
EE O
I
I
TIMING CHARACTERISTICS (see Figure 1)
V
= 4.5V, V = -4.5V, C = 50pF
2.4
2.8
3.5
3.9
4.2
4.5
5.1
5.4
CC
EE
L
Output Propagation Delay,
Low to High
t
t
V
CC
= 9.0V, V = -9.0V, C = 50pF
µs
µs
µs
PLH
PHL
EE
L
V
CC
= 12.0V, V = -12.0V, C = 50pF
3.1
EE
L
V
CC
= 4.5V, V = -4.5V, C = 50pF
2.1
EE
L
Output Propagation Delay,
High to Low
V
CC
= 9.0V, V = -9.0V, C = 50pF
2.4
EE
L
V
CC
= 12.0V, V = -12.0V, C = 50pF
2.6
EE
L
V
= 4.5V, V = -4.5V, C = 50pF
0.25
0.42
0.42
CC
EE
L
Propagation Delay Skew,
t
V
= 9.0V, V = -9.0V, C = 50pF
SK
CC EE L
t
- t
PLH PHL
I
I
V
CC
= 12.0V, V = -12.0V, C = 50pF
EE L
ESD CHARACTERISTICS
Human Body Model
±15
±6
ESD Protection
IEC-1000-4-2 (Contact Discharge)
IEC-1000-4-2 (Air-Gap Discharge)
kV
±15
2
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
MAX148E
ELECTRICAL CHARACTERISTICS (continued)
(V = 4.5V to 13.2V, V = -4.5V to -13.2V, T = T
to T , unless otherwise noted. Typical values are at T = +25°C.)
MAX A
CC
EE
A
MIN
PARAMETER
SYMBOL
CONDITIONS
= 1500pF, R = 5kΩ,
MIN
TYP
MAX
UNITS
C
V
L
L
t
t
850
R1
from -3.3V to 3.3V
OUTPUT_
Output Rise Time
ns
C
V
= 1500pF, R = 5kΩ,
L
L
740
860
765
R2
from -3.0V to 3.0V
OUTPUT_
C
V
= 1500pF, R = 5kΩ,
L
L
t
t
F1
F2
from -3.3V to 3.3V
OUTPUT_
Output Fall Time
Output Slew Rate
ns
C
V
= 1500pF, R = 5kΩ,
L
L
from -3.0V to 3.0V
OUTPUT_
C
V
= 15pF to 2500pF, R = 3kΩ to 7kΩ,
L
L
SR
= 12V, V = -12V, T = +25°C,
4
30
V/µs
CC
EE
A
V
from -3.0V to 3.0V
OUTPUT_
C
V
CC
= 15pF to 2500pF, R = 3kΩ to 7kΩ,
L
= 12V, V = -12V, T = +25°C
EE A
L
Guaranteed Data Rate
120
kbps
Note 1: The I value is for one output at a time. If more than one output is shorted simultaneously, damage may occur.
OS
__________________________________________Typ ic a l Op e ra t in g Ch a ra c t e ris t ic s
(V = 12V, V = -12V, T = +25°C, unless otherwise noted.)
CC
EE
A
OUTPUT VOLTAGE
vs. SUPPLY VOLTAGE
SLEW RATE vs.
LOAD CAPACITANCE
OUTPUT VOLTAGE
vs. TEMPERATURE
11
10
9
15
15
10
R = 3kΩ
L
R = 5kΩ
L
V
@ V = -V = 12V
CC EE
OH
10
R = 3kΩ
L
V
OH
V
@ V = -V = 4.5V
RISING EDGE
OH CC EE
5
0
5
0
8
7
FALLING EDGE
V
OL
@ V = -V = 4.5V
CC EE
6
5
4
3
-5
-5
V
OL
R = 3kΩ
L
V
OL
@ V = -V = 12V
CC EE
-10
-15
-10
-15
R = 5kΩ
L
R = 3kΩ
L
4
5
6
7
8
9
10 11 12 13 14
0
500 1000 1500 2000 2500 3000
LOAD CAPACITANCE (pF)
-40 -20
0
20
40
60 80
100
V
AND -V SUPPLIES (V)
EE
TEMPERATURE (°C)
CC
_______________________________________________________________________________________
3
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
_____________________P in De s c rip t io n
3.0V
DRIVER
INPUT
1.5V
PIN
NAME
FUNCTION
0V
T
PHL
T
PLH
1
V
EE
-4.5V to -13.2V Supply Voltage Input
V
OH
2, 4, 5, 9,
10, 12, 13
INPUT_
Driver Inputs
3.3V
3.0V
3, 6, 8, 11 OUTPUT_ Driver Outputs
V
OUT
0V
MAX148E
7
GND
Ground
-3.0V
-3.3V
14
V
CC
+4.5V to +13.2V Supply Voltage Input
t
F2
t
R2
_______________De t a ile d De s c rip t io n
V
OL
The MAX1488E provides ±15kV of ESD protection when
operating or when powered down. After an ESD event,
the MAX1488E will not latch up. Internal slew-rate-limit-
ing circuitry eliminates the need for external capacitors.
The MAX1488E has a guaranteed 120kbps data rate.
t
F1
t
R1
SIGNAL
GENERATOR
R
L
C
L
Ou t p u t s
Tables 1 and 2 describe the output states. The output
voltage level is affected by both the load current and
supply voltage, and is stable over temperature. Refer to
the Typical Operating Characteristics to see how the
output voltage varies with supply voltage, load capaci-
tance, and temperature.
Figure 1. Slew-Rate Test Circuit and Timing Diagram
operation. Maxim’s engineers developed state-of-the-
a rt struc ture s to p rote c t the se p ins a ga inst ESD of
± 15kV, without d a ma g e . Afte r a n ESD e ve nt, the
MAX1488E keeps working without latchup.
Table 1. Driver A Functions
INPUT A
OUTPUTA
ESD p rote c tion c a n b e te s te d in va rious wa ys ; the
transmitter outputs are characterized for protection to
the following:
H
L
L
H
1) ±15kV using the Human Body Model
Table 2. Driver B–D Functions
2) ±6kV using the Contact-Discharge Method specified
in IEC1000-4-2 (formerly IEC801-2)
INPUT_1
INPUT_2
OUTPUT_
H
L
X
H
X
L
L
H
H
3) ± 15kV us ing the Air-Ga p Me thod s p e c ifie d in
IEC1000-4-2 (formerly IEC801-2).
ESD Test Conditions
ESD performance depends on a number of conditions.
Contact Maxim for a reliability report that documents
test setup, methodology, and results.
In p u t s
The driver inputs determine the driver output states
(Tables 1 and 2). Driver inputs B, C, and D have two
inputs. Connect unused inputs to ground or V
.
CC
Human Body Model
Figure 2a shows the Human Body Model, and Figure
2b shows the current waveform it generates when dis-
charged into a low impedance. This model consists of
a 100pF capacitor charged to the ESD voltage of inter-
e s t, whic h is the n d is c ha rg e d into the te s t d e vic e
through a 1.5kΩ resistor.
±1 5 k V ES D P ro t e c t io n
As with all Maxim devices, ESD-protection structures
are incorporated on all pins to protect against electro-
static discharges encountered during handling and
assembly. The MAX1488E driver outputs have extra
protection against static electricity found in normal
4
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
MAX148E
R
C
1M
R
D
1500Ω
R
C
50M to 100M
R 330Ω
D
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
DISCHARGE
RESISTANCE
CHARGE-CURRENT
LIMIT RESISTOR
HIGH-
VOLTAGE
DC
HIGH-
VOLTAGE
DC
DEVICE
UNDER
TEST
DEVICE
UNDER
TEST
C
s
100pF
STORAGE
CAPACITOR
C
s
150pF
STORAGE
CAPACITOR
SOURCE
SOURCE
Figure 2a. Human Body ESD Test Model
Figure 3a. IEC1000-4-2 ESD Test Model
I
100%
90%
I 100%
P
90%
PEAK-TO-PEAK RINGING
(NOT DRAWN TO SCALE)
I
r
AMPERES
36.8%
10%
0
10%
TIME
0
t = 0.7ns to 1ns
r
t
RL
t
30ns
60ns
t
DL
CURRENT WAVEFORM
Figure 2b. Human Body Model Current Waveform
Figure 3b. IEC1000-4-2 ESD Generator Current Waveform
IEC1000-4-2
Machine Model
The IEC1000-4-2 standard covers ESD testing and per-
formance of finished equipment; it does not specifically
refer to integrated circuits. The MAX1488E helps you
design equipment that meets Level 4 (the highest level)
of IEC1000-4-2, without additional ESD-protection com-
ponents.
The Machine Model for ESD testing uses a 200pF stor-
age capacitor and zero-discharge resistance. Its objec-
tive is to mimic the s tre s s c a us e d b y c onta c t tha t
occurs with handling and assembly during manufactur-
ing. Of course, all pins (not just RS-232 inputs and out-
p uts) re q uire this p rote c tion during ma nufa c turing .
Therefore, the Machine Model is less relevant to the I/O
ports than the Human Body Model and IEC1000-4-2.
The major difference between tests done using the
Human Body Model and IEC1000-4-2 is higher peak
current in IEC1000-4-2. Because series resistance is
lower in the IEC1000-4-2 ESD test model (Figure 3a),
the ESD withstand voltage measured to this standard is
generally lower than that measured using the Human
Body Model. Figure 3b shows the current waveform for
the ±6kV IEC1000-4-2 Level 4 ESD Contact-Discharge
test.
__________Ap p lic a t io n s In fo rm a t io n
Use proper layout to ensure other devices on your
board are not damaged in an ESD strike. Currents as
high as 60A can instantaneously pass into the ground,
so it is important to minimize the ground-lead return
path to the power supply. A separate return path to the
power supply is recommended. Trace widths should be
The Air-Gap test involves approaching the device with
a charged probe. The Contact-Discharge method con-
nects the probe to the device before the probe is ener-
gized.
greater than 40 mils. V
and V must be bypassed
CC
EE
with 0.1µF capacitors as close to the part as possible to
ensure maximum ESD protection.
_______________________________________________________________________________________
5
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
___________________Ch ip To p o g ra p h y
V
SS
V
DD
INPUT D1
INPUT D2
INPUT A
MAX148E
0. 134"
(3. 40mm)
OUTPUT A
OUTPUT D
INPUT B1
INPUT B2
INPUT C1
INPUT C2
OUTPUT B
OUTPUT C
GND
0. 070"
(1. 78mm)
TRANSISTOR COUNT: 95
SUBSTRATE CONNECTED TO GND
6
_______________________________________________________________________________________
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
MAX148E
________________________________________________________P a c k a g e In fo rm a t io n
INCHES
MILLIMETERS
DIM
MIN
0.053
MAX
0.069
0.010
0.019
0.010
0.157
MIN
1.35
0.10
0.35
0.19
3.80
MAX
1.75
0.25
0.49
0.25
4.00
A
D
A1 0.004
B
C
E
e
0.014
0.007
0.150
0°-8°
A
0.101mm
0.004in.
0.050
1.27
e
H
L
0.228
0.016
0.244
0.050
5.80
0.40
6.20
1.27
A1
C
B
L
INCHES
MILLIMETERS
DIM PINS
Narrow SO
SMALL-OUTLINE
PACKAGE
MIN MAX
MIN
MAX
5.00
8.75
8
0.189 0.197 4.80
D
D
D
E
H
14 0.337 0.344 8.55
16 0.386 0.394 9.80 10.00
21-0041A
(0.150 in.)
_______________________________________________________________________________________
7
±1 5 k V ES D-P ro t e c t e d , Qu a d , Lo w -P o w e r
RS -2 3 2 Lin e Drive r
___________________________________________P a c k a g e In fo rm a t io n (c o n t in u e d )
INCHES
MILLIMETERS
DIM
E
MIN
MAX
0.200
–
MIN
–
MAX
5.08
–
A
–
E1
D
A1 0.015
A2 0.125
A3 0.055
0.38
3.18
1.40
0.41
1.14
0.20
0.13
7.62
6.10
2.54
7.62
–
0.175
0.080
0.022
0.065
0.012
0.080
0.325
0.310
–
4.45
2.03
0.56
1.65
0.30
2.03
8.26
7.87
–
A3
A2
A1
A
L
B
0.016
B1 0.045
0.008
D1 0.005
0.300
E1 0.240
0.100
eA 0.300
MAX148E
C
0° - 15°
E
C
e
e
B1
eA
eB
–
–
B
eB
L
–
0.400
0.150
10.16
3.81
0.115
2.92
D1
INCHES
MILLIMETERS
PKG. DIM
PINS
Plastic DIP
PLASTIC
DUAL-IN-LINE
PACKAGE
(0.300 in.)
MIN
MAX MIN
MAX
8
P
P
P
P
P
N
D
D
D
D
D
D
0.348 0.390 8.84
9.91
14
16
18
20
24
0.735 0.765 18.67 19.43
0.745 0.765 18.92 19.43
0.885 0.915 22.48 23.24
1.015 1.045 25.78 26.54
1.14 1.265 28.96 32.13
21-0043A
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are
implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
8
___________________Ma x im In t e g ra t e d P ro d u c t s , 1 2 0 S a n Ga b rie l Drive , S u n n yva le , CA 9 4 0 8 6 (4 0 8 ) 7 3 7 -7 6 0 0
© 1995 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.
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