MAX1287EKA [MAXIM]

PLASTIC ENCAPSULATED DEVICES; 塑封器件


型号：	MAX1287EKA
厂家：	MAXIM INTEGRATED PRODUCTS
描述：	PLASTIC ENCAPSULATED DEVICES 塑封器件转换器模数转换器
文件：	总8页 (文件大小：95K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MAX1287EKA

Rev. A

RELIABILITY REPORT

FOR

MAX1287EKA

PLASTIC ENCAPSULATED DEVICES

February 1, 2004

MAXIM INTEGRATED PRODUCTS

120 SAN GABRIEL DR.

SUNNYVALE, CA 94086

Written by

Reviewed by

Jim Pedicord

Quality Assurance

Reliability Lab Manager

Bryan J. Preeshl

Quality Assurance

Executive Director

Conclusion

The MAX1287 successfully meets the quality and reliability standards required of all Maxim products. In addition,

Maxim’s continuous reliability monitoring program ensures that all outgoing product will continue to meet Maxim’s quality

and reliability standards.

Table of Contents

I. ........Device Description

II. ........Manufacturing Information

III. .......Packaging Information

V. ........Quality Assurance Information

VI. .......Reliability Evaluation

IV. .......Die Information

.....Attachments

I. Device Description

A. General

The MAX1287 is a low-cost, micropower, serial output 12-bit analog-to-digital converter (ADC) available in a tiny 8-pin

SOT23. The MAX1287 operates with a single +3V supply. The devices feature a successive-approximation ADC,

automatic shutdown, fast wakeup (1.4µs), and a high-speed 3-wire interface. Power consumption is only 0.5mW

(V_DD= +2.7V) at the maximum sampling rate of 150ksps. AutoShutdown™ (0.2µA) between conversions results in

reduced power consumption at slower throughput rates. The MAX1287 provides 2-channel, single-ended operations

and accept input signals from 0 to V_REF. Data is accessed using an external clock through the 3-wire

SPI™/QSPI™/MICROWIRE™-compatible serial interface. Excellent dynamic performance, low power, ease of use,

and small package size make these converters ideal for portable battery-powered data-acquisition applications, and

for other applications that demand low power consumption and minimal space.

B. Absolute Maximum Ratings

Item

Rating

VDD to GND

-0.3V to +6V

CNVST, SCLK, DOUT to GND

REF, AIN1 (AIN+), AIN2 (AIN-) to GND

Maximum Current into Any Pin

-0.3V to (VDD + 0.3V)

50mA

Operating Temperature Range

Storage Temperature Range

Lead Temperature (soldering, 10s)

Continuous Power Dissipation (TA = +70°C)

8-Pin SOT

-40°C to +85°C

-60°C to +150°C

+300°C

696mW

Derates above +70°C

8-Pin SOT

9.7mW/°C

II. Manufacturing Information

A. Description/Function: 150ksps, 12-Bit, 2-Channel Single-Ended ADCs in SOT23

B. Process:

S6 (Standard 0.6 micron silicon gate CMOS)

C. Number of Device Transistors:

D. Fabrication Location:

6922

California, USA

E. Assembly Location:

Malaysia

F. Date of Initial Production:

October, 2001

III. Packaging Information

A. Package Type:

B. Lead Frame:

8-Pin SOT

Copper

C. Lead Finish:

Solder Plate

N/A

D. Die Attach:

E. Bondwire:

6 mil dia. ball

Epoxy with silica filler

#05-2101-0032

Class UL94-V0

F. Mold Material:

G. Assembly Diagram:

H. Flammability Rating:

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-112:

Level 1

IV. Die Information

A. Dimensions:

90 x 45 mils

B. Passivation:

Si₃N₄/SiO₂(Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Si (Si = 1%)

None

D. Backside Metallization:

E. Minimum Metal Width:

F. Minimum Metal Spacing:

G. Bondpad Dimensions:

H. Isolation Dielectric:

I. Die Separation Method:

0.6 microns (as drawn)

5 mil. Sq.

SiO₂

Wafer Saw

V. Quality Assurance Information

A. Quality Assurance Contacts:

Jim Pedicord (Manager, Reliability Operations)

Bryan Preeshl (Executive Director)

Kenneth Huening (Vice President)

B. Outgoing Inspection Level:

0.1% for all electrical parameters guaranteed by the Datasheet.

0.1% For all Visual Defects.

C. Observed Outgoing Defect Rate: < 50 ppm

D. Sampling Plan: Mil-Std-105D

VI. Reliability Evaluation

A. Accelerated Life Test

The results of the 135°C biased (static) life test are shown in Table 1. Using these results, the Failure

Rate (l ) is calculated as follows:

l =

1.83

(Chi square value for MTTF upper limit)

MTTF

192 x 4389 x 320 x 2

Temperature Acceleration factor assuming an activation energy of 0.8eV

l = 3.39 x 10^-9

l = 3.39 F.I.T. (60% confidence level @ 25°C)

This low failure rate represents data collected from Maxim’s reliability monitor program. In addition to

routine production Burn-In, Maxim pulls a sample from every fabrication process three times per week and subjects

it to an extended Burn-In prior to shipment to ensure its reliability. The reliability control level for each lot to be

shipped as standard product is 59 F.I.T. at a 60% confidence level, which equates to 3 failures in an 80 piece

sample. Maxim performs failure analysis on any lot that exceeds this reliability control level. Attached Burn-In

Schematic (Spec. # 06-5676) shows the static Burn-In circuit. Maxim also performs quarterly 1000 hour life test

monitors. This data is published in the Product Reliability Report (RR-1M).

B. Moisture Resistance Tests

Maxim pulls pressure pot samples from every assembly process three times per week. Each lot sample

must meet an LTPD = 20 or less before shipment as standard product. Additionally, the industry standard

85°C/85%RH testing is done per generic device/package family once a quarter.

C. E.S.D. and Latch-Up Testing

The AC13 die type has been found to have all pins able to withstand a transient pulse of ±1000V per Mil-

Std-883 Method 3015 (reference attached ESD Test Circuit). Latch-Up testing has shown that this device

withstands a current of ±200mA.

Table 1

Reliability Evaluation Test Results

MAX1287EKA

FAILURE

TEST ITEM

TEST CONDITION

SAMPLE

SIZE

NUMBER OF

FAILURES

IDENTIFICATION

PACKAGE

Static Life Test (Note 1)

Ta = 135°C

Biased

DC Parameters

& functionality

320

Time = 192 hrs.

Moisture Testing (Note 2)

Pressure Pot

Ta = 121°C

P = 15 psi.

RH= 100%

Time = 168hrs.

DC Parameters

& functionality

SOT

85/85

Ta = 85°C

RH = 85%

Biased

DC Parameters

& functionality

Time = 1000hrs.

Mechanical Stress (Note 2)

Temperature

Cycle

-65°C/150°C

1000 Cycles

Method 1010

DC Parameters

Note 1: Life Test Data may represent plastic DIP qualification lots.

Note 2: Generic Package/Process data

Attachment #1

TABLE II. Pin combination to be tested. 1/ 2/

Terminal A

Terminal B

(The common combination

of all like-named pins

(Each pin individually

connected to terminal A

with the other floating)

connected to terminal B)

All pins except V_PS13/

All input and output pins

All V_PS1pins

All other input-output pins

1/ Table II is restated in narrative form in 3.4 below.

2/ No connects are not to be tested.

3/ Repeat pin combination I for each named Power supply and for ground

(e.g., where V_PS1is V_DD, V_CC, V_SS, V_BB, GND, +V_S,-V_S, V_REF, etc).

3.4

Pin combinations to be tested.

Each pin individually connected to terminal A with respect to the device ground pin(s) connected

to terminal B. All pins except the one being tested and the ground pin(s) shall be open.

Each pin individually connected to terminal A with respect to each different set of a combination

of all named power supply pins (e.g., V_SS1, or V

or V

or V_CC1, or V_CC2) connected to

SS2

SS3

terminal B. All pins except the one being tested and the power supply pin or set of pins shall be

open.

Each input and each output individually connected to terminal A with respect to a combination of

all the other input and output pins connected to terminal B. All pins except the input or output pin

being tested and the combination of all the other input and output pins shall be open.

TERMINAL C

TERMINAL A

REGULATED

HIGH VOLTAGE

SUPPLY

DUT

SHORT

SOCKET

CURRENT

PROBE

(NOTE 6)

TERMINAL B

R = 1.5kW

C = 100pf

TERMINAL D

Mil Std 883D

Method 3015.7

Notice 8

ONCE PER SOCKET

ONCE PER BOARD

10 OHMS

10K

0.1uF

+5V

1mA

8-SOT

DEVICES : MAX 1086-89

MAX 1286-89

MAX. EXPECTED CURRENT

DRAWN BY: HAK TAN

NOTES:

= 1mA

DOCUMENT I.D. 06-5676

REVISION A

MAXIM TITLE: 883 BI Circuit (MAX 1086-89/1286-89)

PAGE 2 OF 3

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