MCMA35PD1600TB [LITTELFUSE]

Silicon Controlled Rectifier, 35000mA I(T), 1600V V(RRM),;
MCMA35PD1600TB
型号: MCMA35PD1600TB
厂家: LITTELFUSE    LITTELFUSE
描述:

Silicon Controlled Rectifier, 35000mA I(T), 1600V V(RRM),

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MCMA35PD1600TB  
=
VRRM  
ITAV  
VT  
2x1600V  
35A  
Thyristor \ Diode Module  
=
=
1.22V  
Phase leg  
Part number  
MCMA35PD1600TB  
Backside: isolated  
3
1
2
5
4
TO-240AA  
Features / Advantages:  
Applications:  
Package:  
Thyristor for line frequency  
Planar passivated chip  
Long-term stability  
Line rectifying 50/60 Hz  
Softstart AC motor control  
DC Motor control  
Isolation Voltage:  
Industry standard outline  
RoHS compliant  
V~  
4800  
Direct Copper Bonded Al2O3-ceramic  
Power converter  
AC power control  
Lighting and temperature control  
Soldering pins for PCB mounting  
Base plate: DCB ceramic  
Reduced weight  
Advanced power cycling  
Disclaimer Notice  
Information furnished is believed to be accurate and reliable. However, users should independently  
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,  
www.littelfuse.com/disclaimer-electronics.  
and may not be used in, all applications. Read complete Disclaimer Notice at  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191205d  
© 2019 IXYS all rights reserved  
MCMA35PD1600TB  
Ratings  
Rectifier  
Symbol  
VRSM/DSM  
Definition  
Conditions  
min. typ. max. Unit  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 25°C  
TVJ = 140°C  
TVJ = 25°C  
1700  
1600  
100  
6
V
V
max. non-repetitive reverse/forward blocking voltage  
max. repetitive reverse/forward blocking voltage  
VRRM/DRM  
IR/D  
VR/D =1600 V  
VR/D =1600 V  
IT = 35 A  
IT = 70 A  
IT = 35 A  
IT = 70 A  
TC = 85°C  
180° sine  
µA  
mA  
V
reverse current, drain current  
forward voltage drop  
1.23  
1.50  
1.22  
1.56  
35  
VT  
V
TVJ  
=
°C  
V
125  
V
average forward current  
RMS forward current  
TVJ = 140°C  
TVJ = 140°C  
A
ITAV  
IT(RMS)  
VT0  
55  
A
0.87  
V
threshold voltage  
for power loss calculation only  
slope resistance  
9.8 mΩ  
0.9 K/W  
K/W  
rT  
RthJC  
RthCH  
Ptot  
thermal resistance junction to case  
thermal resistance case to heatsink  
0.2  
TC = 25°C  
TVJ = 45°C  
VR = 0 V  
120  
520  
560  
440  
475  
W
A
A
A
A
total power dissipation  
max. forward surge current  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
t = 10 ms; (50 Hz), sine  
t = 8,3 ms; (60 Hz), sine  
VR = 400V f = 1 MHz  
tP = 30 µs  
ITSM  
TVJ = 140°C  
VR = 0 V  
value for fusing  
TVJ = 45°C  
VR = 0 V  
I²t  
1.35 kA²s  
1.31 kA²s  
970 A²s  
940 A²s  
pF  
TVJ = 140°C  
VR = 0 V  
junction capacitance  
TVJ = 25°C  
TC = 140°C  
22  
CJ  
10  
5
W
W
W
PGM  
max. gate power dissipation  
tP = 300 µs  
0.5  
PGAV  
average gate power dissipation  
critical rate of rise of current  
TVJ = 140°C; f = 50 Hz  
repetitive, IT = 105 A  
150 A/µs  
(di/dt)cr  
0.45  
tP = 200 µs;diG /dt =  
A/µs;  
IG = 0.45A; V = VDRM  
V = VDRM  
non-repet., IT = 35 A  
TVJ = 140°C  
500 A/µs  
critical rate of rise of voltage  
gate trigger voltage  
1000 V/µs  
(dv/dt)cr  
VGT  
RGK = ∞; method 1 (linear voltage rise)  
VD = 6 V  
TVJ = 25°C  
TVJ = -40°C  
TVJ = 25°C  
TVJ = -40°C  
TVJ = 140°C  
1.5  
1.6  
V
V
gate trigger current  
VD = 6 V  
78 mA  
IGT  
200 mA  
gate non-trigger voltage  
gate non-trigger current  
latching current  
VD = VDRM  
0.2  
5
V
VGD  
IGD  
IL  
mA  
tp = 10 µs  
TVJ = 25°C  
450 mA  
IG = 0.45A; diG/dt = 0.45 A/µs  
VD = 6 V RGK = ∞  
holding current  
TVJ = 25°C  
TVJ = 25°C  
200 mA  
IH  
gate controlled delay time  
VD = ½ V  
2
µs  
µs  
tgd  
DRM  
IG = 0.45A; diG/dt = 0.45 A/µs  
turn-off time  
VR = 100 V; IT  
=
35A; V = VDRM TVJ =125 °C  
µs  
185  
tq  
di/dt = 10 A/µs dv/dt = 20 V/µs  
tp = 200  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191205d  
© 2019 IXYS all rights reserved  
MCMA35PD1600TB  
Ratings  
Package TO-240AA  
Symbol  
IRMS  
Definition  
Conditions  
min. typ. max. Unit  
per terminal  
80  
140  
125  
125  
A
°C  
°C  
°C  
g
RMS current  
-40  
-40  
-40  
TVJ  
virtual junction temperature  
Top  
operation temperature  
storage temperature  
Tstg  
81  
Weight  
2.5  
2.5  
9.7  
4
4
Nm  
Nm  
mm  
mm  
V
MD  
mounting torque  
terminal torque  
M
T
terminal to terminal  
terminal to backside  
13.0  
dSpp/App  
dSpb/Apb  
creepage distance on surface | striking distance through air  
16.0 16.0  
4800  
t = 1 second  
V
isolation voltage  
ISOL  
50/60 Hz, RMS; IISOL 1 mA  
t = 1 minute  
4000  
V
Part description  
M = Module  
C = Thyristor (SCR)  
M = Thyristor  
A = (up to 1800V)  
35 = Current Rating [A]  
PD = Phase leg  
1600 = Reverse Voltage [V]  
TB = TO-240AA-1B  
Ordering  
Ordering Number  
Marking on Product  
MCMA35PD1600TB  
Delivery Mode  
Quantity Code No.  
36 515933  
Standard  
MCMA35PD1600TB  
Box  
TVJ =140°C  
Equivalent Circuits for Simulation  
* on die level  
Thyristor  
V0  
I
R0  
threshold voltage  
slope resistance *  
0.87  
8.6  
V
V0 max  
R0 max  
mΩ  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191205d  
© 2019 IXYS all rights reserved  
MCMA35PD1600TB  
Outlines TO-240AA  
3
1
2
5
4
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191205d  
© 2019 IXYS all rights reserved  
MCMA35PD1600TB  
Thyristor  
100  
500  
400  
104  
VR = 0 V  
50 Hz, 80% VRRM  
80  
60  
I2t  
ITSM  
300  
[A]  
TVJ = 45°C  
TVJ = 45°C  
103  
IT  
TVJ = 125°C  
[A2s]  
40  
20  
0
140°C  
[A]  
TVJ = 140°C  
TVJ = 140°C  
200  
TVJ = 25°C  
100  
102  
0.5  
1.0  
1.5  
2.0  
0.01  
0.1  
1
1
2
3
4
5 6 7 8 10  
VT [V]  
t [s]  
t [ms]  
Fig. 3 I2t versus time (1-10 s)  
Fig. 2 Surge overload current  
ITSM: crest value, t: duration  
Fig. 1 Forward characteristics  
10  
100.0  
10.0  
100  
1: I  
, T = 140°C  
GD VJ  
2: I , T  
GT VJ  
= 25°C  
3: I , T = -40°C  
GT VJ  
dc =  
1
0.5  
0.4  
6
80  
60  
40  
20  
0
5
TVJ = 25°C  
4
3
0.33  
0.17  
0.08  
2
VG  
[V]  
tgd  
ITAVM  
[A]  
1
1
lim.  
typ.  
[μs]  
1.0  
0.1  
4: P  
= 0.5 W  
GAV  
GM  
GM  
5: P  
6: P  
=
5 W  
= 10 W  
0.1  
1
10  
100  
1000 10000  
0.01  
0.10  
1.00  
IG [A]  
10.00  
0
40  
80  
120  
160  
IG [mA]  
Tcase [°C]  
Fig. 6 Max. forward current at  
case temperature  
Fig. 5 Gate controlled delay time tgd  
Fig. 4 Gate voltage & gate current  
1.00  
60  
40  
20  
0
dc =  
1
0.5  
0.4  
0.33  
0.17  
0.08  
RthHA  
0.80  
0.4  
0.6  
0.8  
1.0  
2.0  
4.0  
Ptot  
[W]  
ZthJC  
0.60  
[K/W]  
i
Rthi (K/W)  
ti (s)  
0.40  
1
2
3
4
5
0.0200  
0.0900  
0.1900  
0.3700  
0.2300  
0.0004  
0.0090  
0.0140  
0.0600  
0.3900  
0.20  
0.00  
1
10  
100  
1000  
10000  
0
10  
20  
30  
40  
0
40  
80  
Tamb [°C]  
120  
160  
t [ms]  
IT(AV) [A]  
Fig. 8 Transient thermal impedance junction to case  
Fig. 7a Power dissipation versus direct output current  
Fig. 7b and ambient temperature  
IXYS reserves the right to change limits, conditions and dimensions.  
Data according to IEC 60747and per semiconductor unless otherwise specified  
20191205d  
© 2019 IXYS all rights reserved  

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