IXDD609D2TR [LITTELFUSE]

Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, ROHS COMPLIANT, DFN-8;
IXDD609D2TR
型号: IXDD609D2TR
厂家: LITTELFUSE    LITTELFUSE
描述:

Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, ROHS COMPLIANT, DFN-8

驱动 光电二极管 接口集成电路 驱动器
文件: 总14页 (文件大小:288K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IXD_609  
9-Ampere Low-Side  
Ultrafast MOSFET Drivers  
INTEGRATED  
C
IRCUITS  
D
IVISION  
Features  
Description  
9A Peak Source/Sink Drive Current  
Wide Operating Voltage Range: 4.5V to 35V  
-40°C to +125°C Extended Operating Temperature  
Range  
Logic Input Withstands Negative Swing of up to 5V  
Matched Rise and Fall Times  
The IXDD609/IXDI609/IXDN609 high-speed gate  
drivers are especially well suited for driving the latest  
IXYS MOSFETs and IGBTs. The IXD_609  
high-current output can source and sink 9A of peak  
current while producing voltage rise and fall times of  
less than 25ns. The input is CMOS compatible, and is  
virtually immune to latch up. Proprietary circuitry  
eliminates cross-conduction and current  
Low Propagation Delay Time  
Low, 10A Supply Current  
Low Output Impedance  
“shoot-through.Low propagation delay and fast,  
matched rise and fall times make the IXD_609 family  
ideal for high-frequency and high-power applications.  
Applications  
Efficient Power MOSFET and IGBT Switching  
Switch Mode Power Supplies  
Motor Controls  
DC to DC Converters  
Class-D Switching Amplifiers  
Pulse Transformer Driver  
The IXDD609 is configured as a non-inverting driver  
with an enable, the IXDN609 is configured as a  
non-inverting driver, and the IXDI609 is configured as  
an inverting driver.  
The IXD_609 family is available in a standard 8-pin  
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC  
with an exposed metal back (SI); an 8-pin DFN (D2); a  
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).  
Ordering Information  
Logic  
Part Number  
Packing  
Method  
Package Type  
8-Pin DFN  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
Quantity  
Configuration  
IXDD609D2TR  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
2000  
100  
2000  
100  
2000  
50  
IXDD609SI  
IXDD609SITR  
IXDD609SIA  
IXDD609SIATR  
IXDD609PI  
IXDD609CI  
IXDD609YI  
IXDI609SI  
IN  
OUT  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
EN  
Tube  
Tube  
Tube  
50  
50  
5-Pin TO-263  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
100  
2000  
100  
2000  
50  
IXDI609SITR  
IXDI609SIA  
IXDI609SIATR  
IXDI609PI  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
IN  
OUT  
IXDI609CI  
Tube  
50  
IXDI609YI  
5-Pin TO-263  
Tube  
50  
IXDN609SI  
IXDN609SITR  
IXDN609SIA  
IXDN609SIATR  
IXDN609PI  
IXDN609CI  
IXDN609YI  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin SOIC  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
100  
2000  
100  
2000  
50  
IN  
OUT  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
5-Pin TO-263  
Tube  
Tube  
50  
50  
DS-IXD_609-R09  
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1
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.3 Soldering Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.4 Board Wash . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.5 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2
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R09  
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1 Specifications  
1.1 Pin Configurations  
1.2 Pin Definitions  
IXDD609 D2 / PI / SI / SIA  
IXDD609 CI / YI  
Pin Name  
Description  
Logic Input  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
IN  
OUT  
OUT  
GND  
EN  
Output Enable - Drive pin low to disable output,  
and force output to a high impedance state  
EN  
GND  
EN  
Output - Sources or sinks current to turn-on or  
turn-off a discrete MOSFET or IGBT  
OUT  
OUT  
IXDI609 PI / SI / SIA  
IXDI609 CI / YI  
Inverted Output - Sources or sinks current to  
turn-on or turn-off a discrete MOSFET or IGBT  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
OUT  
OUT  
GND  
V
Supply Voltage - Provides power to the device  
CC  
NC  
Ground - Common ground reference for the  
device  
GND  
NC  
GND  
NC  
Not connected  
IXDN609 PI / SI / SIA  
IXDN609 CI / YI  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
OUT  
OUT  
GND  
NC  
GND  
NC  
1.3 Absolute Maximum Ratings  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Supply Voltage  
Input Voltage  
-0.3  
-5  
40  
V
V
CC  
V , V  
VCC+0.3  
IN EN  
I
Output Current  
Junction Temperature  
Storage Temperature  
-
±9  
A
OUT  
T
°C  
-55  
-65  
+150  
+150  
J
T
°C  
STG  
Unless stated otherwise, absolute maximum electrical ratings are at 25°C  
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.  
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not  
implied.  
1.4 Recommended Operating Conditions  
Parameter  
Symbol  
Range  
Units  
V
Supply Voltage  
4.5 to 35  
V
CC  
T
Operating Temperature Range  
-40 to +125  
°C  
A
R09  
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3
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.5 Electrical Characteristics: T = 25°C  
A
Test Conditions: 4.5V < V < 35V (unless otherwise noted).  
CC  
Parameter  
Conditions  
4.5V < VCC < 18V  
4.5V < VCC < 18V  
0V < V < V  
Symbol  
Minimum  
Typical  
Maximum  
Units  
Input Voltage, High  
Input Voltage, Low  
V
3.0  
-
-
0.8  
±10  
-
IH  
V
V
-
-
-
IL  
Input Current  
I
IN  
CC  
-
A  
IN  
EN Input Voltage, High  
EN Input Voltage, Low  
Output Voltage, High  
Output Voltage, Low  
Output Resistance, High State  
Output Resistance, Low State  
IXDD609 only  
V
2/3V  
-
-
ENH  
CC  
V
IXDD609 only  
V
1/3V  
-
ENL  
CC  
-
-
V
V
-0.025  
CC  
-
-
0.025  
1
OH  
V
A
V
-
-
-
-
OL  
V
=18V, I =-100mA  
OUT  
R
CC  
0.6  
0.4  
OH  
V
=18V, I =100mA  
OUT  
R
CC  
0.8  
OL  
Limited by package power  
dissipation  
Output Current, Continuous  
I
-
-
±2  
DC  
V
V
V
V
=18V, C  
=18V, C  
=18V, C  
=18V, C  
=10nF  
=10nF  
=10nF  
=10nF  
Rise Time  
t
CC  
CC  
CC  
CC  
LOAD  
LOAD  
LOAD  
LOAD  
-
-
-
-
22  
15  
40  
42  
35  
25  
60  
60  
r
Fall Time  
t
f
On-Time Propagation Delay  
Off-Time Propagation Delay  
t
ondly  
t
ns  
offdly  
Enable to Output-High Delay Time  
(IXDD609 Only)  
Disable to High Impedance State Delay Time  
(IXDD609 Only)  
V
=18V  
CC  
t
-
-
25  
35  
60  
60  
ENOH  
V
=18V  
-
CC  
t
DOLD  
Enable Pull-Up Resistor  
R
-
-
-
-
200  
1
<1  
<1  
-
2
10  
10  
k  
mA  
EN  
V
=18V, V =3.5V  
IN  
CC  
V
=18V, V =0V  
IN  
Power Supply Current  
I
CC  
CC  
A  
V
=18V, V =V  
CC  
IN CC  
1.6 Electrical Characteristics: T = - 40°C to +125°C  
A
Test Conditions: 4.5V < V < 35V unless otherwise noted.  
CC  
Parameter  
Conditions  
4.5V < VCC < 18V  
4.5V < VCC < 18V  
0V < V < V  
Symbol  
Minimum  
Maximum  
Units  
Input Voltage, High  
Input Voltage, Low  
V
3.3  
-
0.65  
±10  
-
IH  
V
V
-
-
IL  
Input Current  
I
IN  
CC  
A  
IN  
Output Voltage, High  
Output Voltage, Low  
Output Resistance, High State  
Output Resistance, Low State  
-
V
V
-0.025  
CC  
OH  
V
-
V
-
-
-
0.025  
2
OL  
V
=18V, I =-100mA  
OUT  
R
CC  
OH  
V
=18V, I =100mA  
OUT  
R
CC  
1.5  
OL  
Limited by package power  
dissipation  
Output Current, Continuous  
I
-
±1  
A
DC  
V
V
V
V
=18V, C  
=18V, C  
=18V, C  
=18V, C  
=10nF  
=10nF  
=10nF  
=10nF  
Rise Time  
t
CC  
CC  
CC  
CC  
LOAD  
LOAD  
LOAD  
LOAD  
-
-
-
-
-
40  
30  
75  
75  
75  
r
Fall Time  
t
f
On-Time Propagation Delay  
Off-Time Propagation Delay  
Enable to Output-High Delay Time  
Disable to High Impedance State Delay Time  
t
ondly  
ns  
t
offdly  
IXDD609 only, V =18V  
CC  
t
ENOH  
IXDD609 only, V =18V  
CC  
t
-
-
-
-
75  
2.5  
150  
150  
DOLD  
V
=18V, V =3.5V  
IN  
mA  
CC  
V
=18V, V =0V  
IN  
Power Supply Current  
I
CC  
CC  
A  
V
=18V, V =V  
CC  
IN CC  
4
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R09  
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
1.7 Thermal Characteristics  
Package  
Parameter  
Symbol  
Rating  
Units  
D2 (8-Pin DFN)  
35  
36  
125  
85  
120  
46  
3
CI (5-Pin TO-220)  
PI (8-Pin DIP)  
Thermal Impedance, Junction-to-Ambient  
°C/W  
°C/W  
JA  
SI (8-Pin Power SOIC)  
SIA (8-Pin SOIC)  
YI (5-Pin TO-263)  
CI (5-Pin TO-220)  
SI (8-Pin Power SOIC)  
YI (5-Pin TO-263)  
Thermal Impedance, Junction-to-Case  
10  
2
JC  
2 IXD_609 Performance  
2.1 Timing Diagrams  
VIH  
VIH  
IN  
IN  
VIL  
VIL  
t
t
t
t
ondly  
offdly  
offdly  
ondly  
90%  
90%  
10%  
OUT  
10%  
OUT  
t
t
t
t
r
r
f
f
2.2 Characteristics Test Diagram  
+
VCC  
IN  
OUT  
VCC  
0.1μF 10μF  
VCC  
-
Tektronix  
Current Probe  
EN  
GND  
VIN  
CLOAD  
6302  
R09  
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5
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
3 Block Diagrams & Truth Tables  
3.1 IXDD609  
3.3 IXDN609  
VCC  
VCC  
IN  
OUT  
IN  
OUT  
GND  
EN  
GND  
IN  
OUT  
IN  
EN  
OUT  
0
1
0
1
x
1 or open  
1 or open  
0
0
1
0
1
Z
3.2 IXDI609  
VCC  
OUT  
IN  
GND  
IN  
OUT  
0
1
1
0
6
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R09  
IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
4 Typical Performance Characteristics  
Fall Time vs. Supply Voltage  
Rise Time vs. Supply Voltage  
Rise and Fall Times vs.Temperature  
(Input=0-5V, f=10kHz,TA=25ºC)  
(Input=0-5V, f=10kHz,TA=25ºC)  
(VIN=0-5V, VCC=18V, f=10kHz, CL=2.5nF)  
70  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
11  
10  
9
CL=10nF  
CL=5.4nF  
CL=1.5nF  
t
r
CL=10nF  
CL=5.4nF  
CL=1.5nF  
8
t
f
7
6
5
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
-40 -20  
0
20 40 60 80 100 120 140  
Supply Voltage (V)  
Supply Voltage (V)  
Temperature (ºC)  
Rise Time vs. Load Capacitance  
Fall Time vs. Load Capacitance  
70  
60  
60  
50  
40  
30  
20  
10  
0
VCC=4.5V  
VCC=8V  
VCC=4.5V  
VCC=8V  
V
CC=12V  
VCC=18V  
CC=25V  
VCC=12V  
VCC=18V  
50  
40  
30  
20  
10  
0
V
V
CC=25V  
VCC=30V  
CC=35V  
VCC=30V  
VCC=35V  
V
0
2000  
4000  
6000  
8000  
10000  
0
2000  
4000  
6000  
8000  
10000  
Load Capacitance (pF)  
Load Capacitance (pF)  
Propagation Delay  
Propagation Delay vs. Supply Voltage  
Propagation Delay vs. Input Voltage  
vs.Temperature  
(VIN=0-5V, f=1kHz, CL=5.4nF)  
(VIN=5V, VCC=12V, f=1kHz, CL=5.4nF)  
(VCC=18V, f=1kHz, CL=5.4nF)  
200  
150  
100  
50  
180  
160  
140  
120  
100  
80  
55  
50  
45  
40  
35  
30  
t
ondly  
t
offdly  
t
offdly  
t
offdly  
t
60  
ondly  
t
ondly  
40  
20  
0
0
2
3
4
5
6
7
8
9
10 11 12  
0
5
10  
15  
20  
25  
30  
35  
-40 -20  
0
20 40 60 80 100 120 140  
Input Voltage (V)  
Temperature (ºC)  
Supply Voltage (V)  
Input Threshold Voltage  
vs.Temperature  
(VCC=18V, CL=2.5nF)  
Input Threshold vs. Supply Voltage  
Enable Threshold vs. Supply Voltage  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
25  
20  
15  
10  
5
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
Min VIH  
Min VENH  
Min VIH  
Max VIL  
Max VENL  
Max VIL  
0
-40 -20  
0
20 40 60 80 100 120 140  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Temperature (ºC)  
Supply Voltage (V)  
Supply Voltage (V)  
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IXD_609  
INTEGRATED  
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IRCUITS  
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IVISION  
Supply Current vs. Load Capacitance  
(VCC=18V)  
Supply Current vs. Load Capacitance  
(VCC=12V)  
Supply Current vs. Load Capacitance  
(VCC=8V)  
500  
400  
300  
200  
100  
0
300  
250  
200  
150  
100  
50  
200  
150  
100  
50  
f=2MHz  
f=1MHz  
f=2MHz  
f=1MHz  
f=2MHz  
f=1MHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
0
0
1000  
1000  
5000  
Load Capacitance (pF)  
10000  
1000  
5000  
Load Capacitance (pF)  
10000  
5000  
Load Capacitance (pF)  
10000  
Supply Current vs. Frequency  
(VCC=18V)  
Supply Current vs. Frequency  
(VCC=12V)  
Supply Current vs. Frequency  
(VCC=8V)  
1000  
1000  
1000  
100  
10  
CL=10nF  
CL=5.4nF  
100 CL=1.5nF  
CL=10nF  
CL=5.4nF  
100 CL=1.5nF  
CL=10nF  
CL=5.4nF  
CL=1.5nF  
10  
1
10  
1
1
0.1  
0.01  
0.1  
1
0.1  
1
10  
100  
Frequency (kHz)  
1000  
10000  
1
10  
100  
Frequency (kHz)  
1000  
10000  
10  
100  
Frequency (kHz)  
1000  
10000  
Dynamic Supply Current  
vs.Temperature  
(VIN=5V, VCC=18V, f=1kHz, CL=1.5nF)  
Quiescent Supply Current  
vs.Temperature  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.65  
0.60  
0.55  
0.50  
0.45  
0.40  
VIN=3.5V  
VIN=5V  
VIN=10V  
VIN=0V & 18V  
-40 -20  
0
20 40 60 80 100 120 140  
0.35  
Temperature (ºC)  
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (ºC)  
Output Source Current  
vs. Supply Voltage  
(f=422Hz, CL=66nF)  
Output Sink Current  
vs. Supply Voltage  
(f=422Hz, CL=66nF)  
-30  
30  
25  
20  
15  
10  
5
-25  
-20  
-15  
-10  
-5  
0
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Supply Voltage (V)  
8
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IRCUITS  
D
IVISION  
Output Source Current  
Output Sink Current  
vs.Temperature  
vs.Temperature  
(VCC=18V, f=422Hz, CL=66nF)  
(VCC=18V, f=422Hz, CL=66nF)  
-12.0  
14.0  
13.5  
13.0  
12.5  
12.0  
11.5  
11.0  
10.5  
10.0  
-11.5  
-11.0  
-10.5  
-10.0  
-9.5  
-9.0  
-40 -20  
0
20 40 60 80 100 120 140  
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (ºC)  
Temperature (ºC)  
High State Output Resistance  
vs. Supply Voltage  
Low State Output Resistance  
vs. Supply Voltage  
(IOUT= -10mA)  
(IOUT= +10mA )  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.5  
1.0  
0.5  
0.0  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Supply Voltage (V)  
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IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
5 Manufacturing Information  
5.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated  
Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest  
version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation.  
We test all of our products to the maximum conditions set forth in the standard, and guarantee proper  
operation of our devices when handled according to the limitations and information in that standard as well as to any  
limitations set forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled  
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Classification  
IXD_609 All Versions except IXD_609YI  
IXD_609YI  
MSL 1  
MSL 3  
5.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.  
5.3 Soldering Profile  
Provided in the table below is the Classification Temperature (T ) of this product and the maximum dwell time the  
C
body temperature of this device may be (T - 5)ºC or greater. The classification temperature sets the Maximum Body  
C
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other  
processes, the guidelines of J-STD-020 must be observed.  
Classification Temperature (TC)  
Dwell Time (tp)  
Device  
Maximum Cycles  
IXD_609CI  
IXD_609YI  
245°C for 30 seconds  
245°C for 30 seconds  
250°C for 30 seconds  
260°C for 30 seconds  
30 seconds  
30 seconds  
30 seconds  
30 seconds  
1
3
3
3
IXD_609PI  
IXD_609SI / IXD_609SIA / IXD_609D2  
5.4 Board Wash  
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or  
remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to  
prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and  
providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing  
process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature  
and duration necessary to remove the moisture trapped within the package is the responsibility of the user  
(assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be  
used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based.  
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IRCUITS  
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IVISION  
5.5 Mechanical Dimensions  
5.5.1 SIA (8-Pin SOIC)  
0.31 / 0.51  
(0.012 / 0.020)  
8x  
PCB Land Pattern  
TOP VIEW  
1.55  
(0.061)  
5
5.80 / 6.20  
(0.228 / 0.244)  
3.75  
(0.148)  
3.80 / 4.00  
(0.150 / 0.157)  
0.10 / 0.25  
(0.004 / 0.010)  
A
0.25  
(0.010)  
PIN #1  
1.27  
0.05  
6x  
0.60  
(0.024)  
GAUGE PLANE  
SEATING PLANE  
1.25 MIN  
(0.049 MIN)  
A
0.40 / 1.27  
(0.016 / 0.050)  
4
8°- 0°  
1.75 MAX  
(0.069 MAX)  
4.80 / 5.00  
(0.189 / 0.197)  
Dimensions  
MIN / MAX  
0.10  
(0.004)  
0.10 / 0.25  
(0.004 / 0.010)  
Notes:  
1. Controlling dimension: millimeters.  
2. All dimensions are in mm (inches).  
3. This package conforms to JEDEC Standard MS-012, variation AA, Rev. F.  
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.  
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.  
6. Lead thickness includes plating.  
5.5.2 SI (8-Pin Power SOIC with Exposed Metal Back)  
PCB Land Pattern  
0.31 / 0.51  
(0.012 / 0.020)  
8x  
0.60  
(0.024)  
BOTTOM VIEW  
1.55  
(0.061)  
TOP VIEW  
5
5.80 / 6.20  
(0.228 / 0.244)  
3.85  
(0.152)  
2.05 / 2.41  
(0.081 / 0.095)  
2.23  
(0.088)  
3.80 / 4.00  
(0.150 / 0.157)  
PIN #1  
1.27  
0.05  
6x  
2.81 / 3.30  
(0.111 / 0.130)  
3.055  
(0.120)  
1.25 MIN  
(0.049 MIN)  
4
1.70 MAX  
(0.067 MAX)  
0.10 / 0.25  
(0.004 / 0.010)  
4.80 / 5.00  
(0.189 / 0.197)  
A
0.25  
(0.010)  
Dimensions  
MIN / MAX  
GAUGE PLANE  
SEATING PLANE  
A
0.10  
(0.004)  
0.40 / 1.27  
(0.016 / 0.050)  
0 / 0.15  
(0 / 0.006)  
8°- 0°  
Notes:  
1. Controlling dimension: millimeters.  
2. All dimensions are in mm (inches).  
3. This package conforms to JEDEC Standard MS-012, variation BA, Rev. F.  
4. Dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15mm per end.  
5. Dimension does not include interlead flash or protrusion. Interlead flash or protrusion shall not exceed 0.25mm per side.  
6. The exposed metal pad on the back of the package should be connected to GND. It is not suitable for carrying current.  
7. Lead thickness includes plating.  
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IXD_609  
INTEGRATED  
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IRCUITS  
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IVISION  
5.5.3 Tape & Reel Information for SI and SIA Packages  
330.2 DIA.  
(13.00 DIA.)  
Top Cover  
W=12.00  
(0.472)  
Tape Thickness  
B0=5.30  
(0.209)  
0.102 MAX.  
(0.004 MAX.)  
A0=6.50  
(0.256)  
P1=8.00  
(0.315)  
K0= 2.10  
(0.083)  
Dimensions  
mm  
(inches)  
User Direction of Feed  
Embossed Carrier  
Embossment  
NOTE: Tape dimensions not shown comply with JEDEC Standard EIA-481-2  
5.5.4 YI (5-Pin TO-263)  
E
(Note 2)  
MM  
INCH  
MIN  
SYMBOL  
MIN  
MAX  
4.826  
0.254  
0.991  
0.889  
0.737  
0.584  
1.651  
9.652  
7.700  
1.562  
MAX  
0.190  
0.010  
0.039  
0.035  
0.029  
0.023  
0.065  
0.380  
0.303  
0.062  
0.420  
0.315  
0.270  
E1  
E3  
Recommended PCB Pattern  
A
A1  
b
b1  
c
c1  
c2  
D
D1  
D2  
E
E1  
E3  
e
H
L
4.064  
0.000  
0.508  
0.508  
0.381  
0.381  
1.143  
8.382  
6.858  
1.358  
0.160  
0.000  
0.020  
0.020  
0.015  
0.015  
0.045  
0.330  
0.270  
0.053  
10.75  
(0.423)  
L1  
D2  
D1  
D
(Note 2)  
2.20  
(0.087)  
8.40  
(0.331)  
H
*
9.652 10.668 0.380  
8.000  
6.869  
1.702 BSC  
14.605 15.875 0.575  
8.05  
(0.317)  
Pin 1  
Indicator  
6.223  
5.092  
0.245  
0.200  
0.067 BSC  
10.50  
(0.413)  
C
C
3.80  
(0.150)  
0.625  
0.110  
0.066  
e ~4x  
b ~5x  
1.778  
1.000  
2.794  
1.676  
0.070  
0.039  
L1  
L3  
R
R1  
θ
*
Circular feature will be  
present on devices  
with the  
1.05  
(0.041)  
1.702  
(0.067)  
0.254 BSC  
0.460 TYP  
0.506 TYP  
0.010 BSC  
0.018 TYP  
0.02 TYP  
-
A
Optional Tip Lead Form.  
Dimensions  
mm  
(inches)  
c2  
-
8º  
8º  
SECTION: C-C  
PLATING  
(Note 3)  
b1  
JEDEC TO-263  
Optional Tip Lead Form  
c
BASE METAL c1  
A1  
A1  
b
NOTES:  
1. Reference JEDEC TO-263 Type “BA”.  
L
L
R1  
L3  
R1  
R
R
2. Dimension does not include mold flash; mold flash  
shall not exceed 0.127mm (0.005 inch) per side.  
3. Minimum plating: 1000 microinches.  
L3  
θ
θ
4. Controlling dimension: millimeters.  
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IXD_609  
INTEGRATED  
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IRCUITS  
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IVISION  
5.5.5 PI (8-Pin DIP)  
9.652 ± 0.381  
(0.380 ± 0.015)  
PCB Hole Pattern  
7.620 ± 0.254  
(0.300 ± 0.010)  
2.540 ± 0.127  
(0.100 ± 0.005)  
8-0.800 DIA.  
2.540 ± 0.127  
(8-0.031 DIA.)  
(0.100 ± 0.005)  
9.144 ± 0.508  
(0.360 ± 0.020)  
6.350 ± 0.127  
(0.250 ± 0.005)  
3.302 ± 0.051  
(0.130 ± 0.002)  
Pin 1  
0.457 ± 0.076  
(0.018 ± 0.003)  
7.620 ± 0.127  
(0.300 ± 0.005)  
7.239 TYP.  
(0.285)  
7.620 ± 0.127  
(0.300 ± 0.005)  
4.064 TYP  
(0.160)  
0.254 ± 0.0127  
(0.010 ± 0.0005)  
Dimensions  
0.813 ± 0.102  
mm  
(0.032 ± 0.004)  
(inches)  
5.5.6 CI (5-Pin TO-220)  
A
B
3.810 - 3.860  
(0.150 - 0.152)  
9.652 - 10.668  
(0.380 - 0.420)  
3.556 - 4.826  
(0.140 - 0.190)  
9.652 - 10.668  
(0.380 - 0.420)  
0.127 BSC  
(0.005 BSC)  
0.355 M B A M  
0.508 - 1.397  
(0.020 - 0.055)  
2.540 - 3.048  
(0.100 - 0.120)  
5.842 - 6.858  
(0.230 - 0.270)  
5.842 - 6.858  
(0.230 - 0.270)  
7.550 - 8.100  
(0.297 - 0.319)  
4.826 - 5.334  
(0.190 - 0.210)  
14.224 - 16.510  
(0.560 - 0.650)  
12.192 - 12.878  
(0.480 - 0.507)  
6.300 - 6.700  
(0.248 - 0.264)  
8.382 - 9.017  
(0.330 - 0.355)  
6.858 - 8.890  
(0.270 - 0.350)  
THERMAL PAD  
2.032 - 2.921  
(0.080 - 0.115)  
C
C
12.700 - 14.732  
(0.500 - 0.580)  
0.356 - 0.610  
(0.014 - 0.024)  
0.381 - 1.016 5x  
(0.015 - 0.040 5x)  
SECTION C-C  
1.702 4x BSC  
(0.067 4x BSC)  
BASE METAL  
0.381 - 1.016  
(0.015 - 0.040)  
PLATING  
0.381 M B A M  
Dimensions  
mm  
(inches)  
0.356 - 0.559  
(0.014 - 0.022)  
0.356 - 0.610  
(0.014 - 0.024)  
LEAD TIP  
0.381 - 0.965  
(0.015 - 0.038)  
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IXD_609  
INTEGRATED  
C
IRCUITS  
D
IVISION  
5.5.7 D2 (8-Pin DFN)  
5.00 BSC  
(0.197 BSC)  
0.35 x 45º  
(0.014 x 45º)  
0.80 / 1.00  
(0.031 / 0.039)  
0.20 REF  
(0.008 REF)  
0.95  
(0.037)  
4.50  
(0.177)  
Pin 1  
4.00 BSC  
(0.157 BSC)  
3.10  
(0.122)  
0.45  
(0.018)  
0.10  
(0.004)  
2.60  
(0.102)  
1.20  
(0.047)  
0.74 / 0.83  
(0.029 / 0.033)  
Recommended PCB Land Pattern  
3.03 / 3.10  
(0.119 / 0.122)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
0.30 / 0.45  
(0.012 / 0.018)  
0.95 BSC  
(0.037 BSC)  
Pin 1  
Pin 8  
2.53 / 2.60  
(0.100 / 0.102)  
NOTE:  
0.35 / 0.45 x 45º  
(0.014 / 0.018 x 45º)  
The exposed metal pad on the back of the D2 package should  
be connected to GND. Pad is not suitable for carrying current.  
5.5.8 Tape & Reel Information for D2 Package  
1.55 0.05  
330.2 DIA.  
(13.00 DIA.)  
4.00 0.10 See Note #2  
1.75 0.10  
R0.75 TYP  
2.00 0.05  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
(0.05)  
5º MAX  
5.50 0.05  
(0.05)  
B0=5.40 0.10  
12.00 0.30  
Embossed Carrier  
K0=1.90 0.10  
1.50 (MIN)  
P1=8.00 0.10  
NOTES:  
5º MAX  
1. A0 & B0 measured at 0.3mm above base of pocket.  
2. 10 pitches cumulative tol. 0.2mm  
3. ( ) Reference dimensions only.  
A0=4.25 0.10  
Embossment  
4. Unless otherwise specified, all dimensions in millimeters.  
0.30 0.05  
For additional information please visit our website at: www.ixysic.com  
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make  
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated  
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its  
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe  
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IXD_609-R09  
©Copyright 2017, IXYS Integrated Circuits Division  
All rights reserved. Printed in USA.  
10/25/2017  
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R09  

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