IXDD614CI [CLARE]
14-Ampere Low-Side Ultrafast MOSFET Drivers; 14安培低端超快MOSFET驱动器
| 型号： | IXDD614CI |
| 厂家： | 
CLARE |
| 描述： | 14-Ampere Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总14页 (文件大小：1660K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IXD_614
14-Ampere Low-Side
Ultrafast MOSFET Drivers
Features
Description
• 14A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Low Propagation Delay Time
The IXDD614 / IXDI614 / IXDN614 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. Each output can source
and sink 14A of peak current while producing voltage
rise and fall times of less than 30ns. Internal circuitry
eliminates cross-conduction and current
• Low, 10A Supply Current
• Low Output Impedance
"shoot-through," making the driver virtually immune to
latch up. Low propagation delay with fast rise and fall
times make the IXD_614 family ideal for
Applications
high-frequency and high-power applications.
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
The IXDD614 is configured as a non-inverting driver
with an enable. The IXDN614 is configured as a
non-inverting driver, and the IXDI614 is configured as
an inverting driver.
The IXD_614 family is available in an 8-pin DIP (PI),
an 8-pin Power SOIC with an exposed metal back (SI),
a 5-pin TO-220 (CI), and a 5-pin TO-263 (YI) package.
RoHS
2002/95/EC
Pb
e3
Ordering Information
Logic
Configuration
Packing
Method
Part Number
Package Type
Quantity
IXDD614PI
IXDD614SI
IXDD614SITR
IXDD614CI
IXDD614YI
IXDI614PI
8-Pin DIP
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
Tube
Tube
50
100
2000
50
IN
OUT
Tape & Reel
Tube
EN
5-Pin TO-263
Tube
50
8-Pin DIP
Tube
50
IXDI614SI
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
Tube
100
2000
50
IN
OUT
IXDI614SITR
IXDI614CI
Tape & Reel
Tube
IXDI614YI
5-Pin TO-263
Tube
50
IXDN614PI
IXDN614SI
IXDN614SITR
IXDN614CI
IXDN614YI
8-Pin DIP
Tube
50
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
5-Pin TO-220
Tube
100
2000
50
IN
OUT
Tape & Reel
Tube
5-Pin TO-263
Tube
50
DS-IXD_614-R02
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1
IXD_614
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. Performance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.1 IXDD614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2 IXDI614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.3 IXDN614 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.2 SI Package Tape & Reel Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4.3 YI (5-Pin TO-263) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.4.4 CI (5-Pin TO-220) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.4.5 PI (8-Pin DIP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
2
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R02
IXD_614
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD614 PI / SI
IXDD614 CI / YI
Pin Name
Description
Logic Input
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
2
3
4
8
7
6
5
IN
OUT
OUT
GND
Output Enable - Drive pin low to disable output,
and force output to a high impedance state
EN
EN
GND
EN
Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT
OUT
IXDI614 PI / SI
IXDI614 CI / YI
Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
2
3
4
8
7
6
5
OUT
OUT
GND
V
Supply Voltage - Provides power to the device
CC
NC
Ground - Common ground reference for the
device
GND
NC
GND
NC
Not connected
IXDN614 PI / SI
IXDN614 CI / YI
Note: Clare recommends that the exposed metal pad
on the back of the “SI” and the “D2” packages be
connected to GND. The pad is not suitable for carrying
current.
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
8
7
6
5
OUT
OUT
GND
2
3
4
NC
GND
NC
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
Input Voltage
-0.3
-5
40
V
V
CC
V
, V
IN EN
VCC+0.3
I
Output Current
Junction Temperature
Storage Temperature
-
14
+150
+150
A
OUT
T
°C
-55
-65
J
T
°C
STG
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
V
V
Supply Voltage
4.5
-40
35
CC
T
Operating Temperature Range
+125
°C
A
R02
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3
IXD_614
1.5 Electrical Characteristics: T = 25°C
A
Test Conditions: 4.5V < V < 35V (unless otherwise noted).
CC
Parameter
Input Voltage, High
Conditions
Symbol
VIH
Minimum
Typical Maximum Units
4.5V < V < 18V
CC
3.0
-
-
-
V
4.5V < V < 18V
CC
Input Voltage, Low
VIL
-
0.8
10
0V < V < V
IN
Input Current
IIN
CC
-
-
A
EN Input Voltage, High
EN Input Voltage, Low
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
IXDD614 only
VENH
VENL
VOH
VOL
2/3VCC
-
-
-
V
IXDD614 only
1/3VCC
-
-
-
VCC-0.025
-
-
V
-
-
-
-
0.025
0.8
V
=18V, I =-100mA
OUT
ROH
ROL
CC
0.4
0.3
V
=18V, I =100mA
OUT
CC
0.6
Limited by package power
dissipation
Output Current, Continuous
IDC
-
-
4
A
C
C
C
C
=15nF, V =18V
CC
Rise Time
tR
tF
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
-
-
-
-
25
18
50
50
31
44
200
1
35
25
70
70
60
70
-
=15nF, V =18V
CC
Fall Time
=15nF, V =18V
CC
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
Enable Pull-Up Resistor
tONDELAY
tOFFDELAY
tENOH
tDOLD
REN
ns
=15nF, V =18V
CC
IXDD614 only
IXDD614 only
IXDD614 only
=18V, V =3.5V
k
V
2
mA
CC
IN
V
=18V, V =0V
IN
Power Supply Current
ICC
<1
<1
10
10
CC
A
V
=18V, V =V
IN CC
CC
4
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R02
IXD_614
1.6 Electrical Characteristics: T = - 40°C to +125°C
A
Test Conditions: 4.5V < V < 35V.
CC
Parameter
Input Voltage, High
Conditions
Symbol
VIH
Minimum
Maximum
Units
4.5V < V < 18V
CC
3.3
-
-
0.65
10
V
4.5V < V < 18V
CC
Input Voltage, Low
VIL
0V < V < V
IN
Input Current
IIN
CC
-
A
Output Voltage, High
Output Voltage, Low
-
VOH
VOL
ROH
ROL
VCC-0.025
-
V
-
-
-
-
0.025
1.5
1.2
V
=18V, I =-100mA
OUT
Output Resistance, High State
Output Resistance, Low State
CC
V
=18V, I =100mA
OUT
CC
Limited by package power
dissipation
Output Current, Continuous
IDC
-
1
A
C
C
C
C
=15nF, V =18V
CC
Rise Time
tR
tF
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
-
-
-
-
50
40
90
90
75
85
3
=15nF, V =18V
CC
Fall Time
=15nF, V =18V
CC
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
tONDELAY
tOFFDELAY
tENOH
tDOLD
ns
=15nF, V =18V
CC
IXDD614 only
IXDD614 only
=18V, V =3.5V
V
mA
CC
IN
V
=18V, V =0V
IN
Power Supply Current
ICC
150
150
CC
A
V
=18V, V =V
IN CC
CC
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
CI (5-Pin TO-220)
PI (8-Pin DIP)
36
125
85
46
3
Thermal Resistance, Junction-to-Ambient
Thermal Resistance, Junction-to-Case
°C/W
JA
SI (8-Pin Power SOIC)
YI (5-Pin TO-263)
CI (5-Pin TO-220)
SI (8-Pin Power SOIC)
YI (5-Pin TO-263)
10
2
°C/W
JC
R02
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5
IXD_614
2 Performance
2.1 Timing Diagrams
VIH
VIH
VIL
IN
IN
VIL
t
t
t
t
ONDELAY
ONDELAY
OFFDELAY
OFFDELAY
90%
90%
10%
OUT
10%
OUT
t
t
t
t
R
R
F
F
2.2 Characteristics Test Diagram
+
VCC
IN
OUT
VCC
0.1μF 10μF
VCC
-
Tektronix
Current Probe
6302
EN
GND
VIN
CLOAD
6
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R02
IXD_614
3 Block Diagrams & Truth Tables
3.1 IXDD614
3.3 IXDN614
VCC
VCC
IN
OUT
OUT
IN
GND
EN
GND
IN
EN
OUT
IN
OUT
0
1
x
1 or open
1 or open
0
0
1
0
1
Z
0
1
3.2 IXDI614
VCC
OUT
IN
GND
IN
OUT
0
1
1
0
R02
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7
IXD_614
4 Typical Performance Characteristics
Rise Time vs. Supply Voltage
(VIN=0-5V, f=10kHz,TA=25ºC)
Fall Time vs. Supply Voltage
(VIN=0V-5V, f=10kHz,TA=25ºC)
Rise & Fall Time vs.Temperature
(VIN=0-5V, f=10kHz, CL=3.6nF, VCC=18V)
80
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
15
14
13
12
11
10
9
CL=15nF
CL=7.5nF
CL=3.6nF
tR
CL=15nF
CL=7.5nF
CL=3.6nF
tF
8
7
6
5
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Supply Voltage (V)
Supply Voltage (V)
Rise Time vs. Load Capacitance
Fall Time vs. Load Capacitance
50
50
VCC=4.5V
VCC=4.5V
45
40
35
30
25
20
15
10
5
45
40
35
30
25
20
15
10
5
VCC=8V
VCC=12V
VCC=18V
VCC=25V
V
CC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
VCC=30V
VCC=35V
2
4
6
8
10
12
14
16
2
4
6
8
10
12
14
16
Load Capacitance (nF)
Load Capacitance (nF)
Propogation Delay
vs. Junction Temperature
Propagation Delay vs. Supply Voltage
Propagation Delay vs. Input Voltage
(VIN=0-5V, f=1kHz, CL=15nF, VCC=18V)
(VIN=0-5V, f=1kHz, CL=15nF)
(VIN=0-5V, f=1kHz, CL=15nF, VCC=12V)
70
65
60
55
50
45
40
250
200
150
100
50
160
140
120
100
80
tOFFDLY
tOFFDLY
tONDLY
tONDLY
tOFFDLY
60
tONDLY
0
40
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
40
2
4
6
8
10
12
14
Temperature (ºC)
Supply Voltage (V)
Input Voltage (V)
Input Threshold
vs.Temperature
(CL=3.6nF, VCC=18V)
Enable Threshold
vs. Supply Voltage
Input Threshold
vs. Supply Voltage
25
20
15
10
5
3.5
3.0
2.5
2.0
1.5
3.5
3.0
2.5
2.0
1.5
Min VENH
Min VIH
Min VIH
Max VIL
Max VENL
Max VIL
0
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
40
Supply Voltage (V)
Temperature (ºC)
Supply Voltage (V)
8
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R02
IXD_614
Supply Current vs. Load Capacitance
(VCC=12V)
Supply Current vs. Load Capacitance
(VCC=35V)
Supply Current vs. Load Capacitance
(VCC=18V)
1000
100
10
1000
100
10
1000
100
10
f=2MHz
f=1MHz
f=500kHz
f=2MHz
f=1MHz
f=500kHz
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=100kHz
f=50kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=10kHz
f=1kHz
f=10kHz
f=1kHz
1
1
0.1
1
0.1
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
2
4
6
8
10
12
14
16
18
Load Capacitance (nF)
Load Capacitance (pF)
Load Capacitance (nF)
Supply Current vs. Frequency
(VCC=18V)
Supply Current vs. Frequency
(VCC=35V)
Supply Current vs. Load Capacitance
(VCC=8V)
1000
100
10
1000
100
10
1000
100
10
CL=15nF
CL=7.5nF
CL=3.6nF
CL=15nF
CL=7.5nF
CL=3.6nF
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
1
1
1
0.1
0.01
0.1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
2
4
6
8
10
12
14
16
18
Frequency (kHz)
Frequency (kHz)
Load Capacitance (nF)
Quiescent Supply Current
vs.Temperature
Supply Current vs. Frequency
(VCC=8V)
Supply Current vs. Frequency
(VCC=12V)
2.0
1.5
1.0
0.5
0.0
-0.5
1000
100
10
1000
100
10
3.5V
5V
CL=15nF
CL=7.5nF
CL=3.6nF
CL=15nF
CL=7.5nF
CL=3.6nF
10V
0V & 18V
1
1
0.1
0.01
0.1
-40 -20
0
20 40 60 80 100 120 140
1
10
100
1000
10000
1
10
100
1000
10000
Temperature (ºC)
Frequency (kHz)
Frequency (kHz)
Output Sink Current
vs. Supply Voltage
(CL=330nF)
Output Source Current
vs. Supply Voltage
(CL=330nF)
Dynamic Supply Current
vs.Temperature
(VIN=0-5V, f=1kHz, CL=5.4nF, VCC=18V)
45
40
35
30
25
20
15
10
5
0
-5
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-10
-15
-20
-25
-30
-35
0
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
-40 -20
0
20 40 60 80 100 120 140
Supply Voltage (V)
Supply Voltage (V)
Temperature (ºC)
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IXD_614
Output Source Current
vs.Temperature
Output Sink Current
vs.Temperature
(CL=330nF, VCC=18V)
(CL=330nF, VCC=18V)
-10
-12
-14
-16
-18
-20
-22
24
23
22
21
20
19
18
17
16
-40 -20
0
20 40 60 80 100 120 140
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Temperature (ºC)
Low-State Output Resistance @ +10mA
High-State Output Resistance @ -10mA
vs. Supply Voltage
vs. Supply Voltage
0.7
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.6
0.5
0.4
0.3
0.2
0.1
0
5
10
15
20
25
30
35
40
0
5
10
15
20
25
30
35
40
Supply Voltage (V)
Supply Voltage (V)
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IXD_614
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_614SI / IXD_614PI /IXD_614CI / IXD_614YI
MSL 1
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
IXD_614CI / IXD_614YI
IXD_614PI
245°C for 30 seconds
250°C for 30 seconds
260°C for 30 seconds
IXD_614SI
RoHS
2002/95/EC
Pb
e3
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IXD_614
5.4 Mechanical Dimensions
5.4.1 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.10 / 0.25
(0.004 / 0.010)
1.55
(0.061)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.209) (0.108)
2.75
5.80 / 6.20
(0.228 / 0.244)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
(0.024)
1.27
(0.050)
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
0º / 8º
4.80 / 5.00
(0.190 / 0.197)
Recommended PCB Land Pattern
0.03 / 0.10
(0.001 / 0.004)
1.30 / 1.75
(0.051 / 0.069)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
2.29 / 2.79
(0.090 / 0.110)
NOTES:
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
2. The exposed metal pad on the back of the SI package should
be connected to GND. It is not suitable for carrying
current.
3.30 / 3.81
(0.130 / 0.150)
5.4.2 SI Package Tape & Reel Information
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
1.75 0.10
2.00 0.10
0.30 0.05
B
R0.50 TYP
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
∅1.50 (MIN)
B
8.00 0.10
K0=2.30 0.10
SECTION B-B
A0=6.40 0.10
(1.20)
Embossment
(4.70)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
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IXD_614
5.4.3 YI (5-Pin TO-263)
1.20 / 1.40
(0.047 / 0.055)
1.00 / 1.40
(0.039 / 0.055)
Recommended PCB Pattern
4.20 / 4.80
(0.165 / 0.189)
9.65 / 10.30
(0.380 / 0.406)
10.40
(0.409)
9.15
(0.360)
8.80 / 9.50
(0.346 / 0.374)
3.65
(0.144)
14.80 / 15.80
(0.583 / 0.622)
1
2 3 4 5
6.35
(0.250)
3.85
(0.152)
0.40 / 0.70
(0.016 / 0.028)
1.70 BSC
(0.067 BSC)
1.70
(0.067)
1.05
(0.041)
0.60 / 0.99
(0.024 / 0.039)
2.24 / 2.84
(0.088 / 0.112)
7.50 / 8.20
(0.295 / 0.323)
Optional
0º - 3º
6.60 / 7.20
(0.260 / 0.283)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
2.10 / 2.70
(0.083 / 0.106)
6
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
1.20 / 1.70
(0.047 / 0.067)
5.4.4 CI (5-Pin TO-220)
1.14 / 1.40
(0.045 / 0.055)
9.91 / 10.54
(0.390 / 0.415)
4.32 / 4.83
(0.170 / 0.190)
7.823
(0.308)
12.387
(0.487)
14.73 / 15.75
(0.580 / 0.620)
11.94 / 12.95
(0.470 / 0.510)
6.299
(0.248)
8.64 / 9.40
(0.340 / 0.370)
3
1
2 3 4 5
6.502
(0.256)
7.620
(0.300)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
25.27 / 26.54
(0.995 / 1.045)
12.70 / 14.73
(0.50 / 0.58)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
1.70 BSC
(0.067 BSC)
0.64 / 1.02
(0.025 / 0.040)
Recommended Hole Pattern
(0.090 / 0.115)
Finished Hole Diameter = 1.45mm (0.057 in.)
NOTES:
1.This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3.The metal tab is connected to pin 3 (GND).
1.70mm (0.067 in.)
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IXD_614
5.4.5 PI (8-Pin DIP)
8-0.900 DIA.
(8-0.035 DIA.)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
0.20 / 0.38
(0.008 / 0.015)
7.50
(0.295)
1.40
(0.055)
6.10 / 6.86
(0.240 / 0.270)
7.62 BSC
(0.300 BSC)
2.540 BSC
(0.100 BSC)
7.37 / 8.26
(0.290 / 0.325)
7.62 / 10.92
(0.300 / 0.430)
PC Board Pattern
3.05 / 3.81
(0.120 / 0.150)
3.43 / 4.70
(0.135 / 0.185)
0.38 / 1.02
(0.015 / 0.040)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.14 / 1.65
3.18 / 3.81
(0.125 / 0.150)
(0.045 / 0.065)
0.38 / 0.58
(0.015 / 0.023)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_614-R02
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
8/16/2011
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