IXDD609SIA [CLARE]
9-Ampere Low-Side Ultrafast MOSFET Drivers; 9安培低端超快MOSFET驱动器
| 型号： | IXDD609SIA |
| 厂家： | 
CLARE |
| 描述： | 9-Ampere Low-Side Ultrafast MOSFET Drivers |
| 文件： | 总14页 (文件大小：1667K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IXD_609
9-Ampere Low-Side
Ultrafast MOSFET Drivers
Features
Description
• 9A Peak Source/Sink Drive Current
• Wide Operating Voltage Range: 4.5V to 35V
• -40°C to +125°C Extended Operating Temperature
Range
• Logic Input Withstands Negative Swing of up to 5V
• Matched Rise and Fall Times
The IXDD609/IXDI609/IXDN609 high-speed gate
drivers are especially well suited for driving the latest
IXYS MOSFETs and IGBTs. The IXD_609
high-current output can source and sink 9A of peak
current while producing voltage rise and fall times of
less than 25ns. The input is CMOS compatible, and is
virtually immune to latch up. Proprietary circuitry
eliminates cross-conduction and current
• Low Propagation Delay Time
• Low, 10A Supply Current
• Low Output Impedance
“shoot-through.” Low propagation delay and fast,
matched rise and fall times make the IXD_609 family
ideal for high-frequency and high-power applications.
Applications
• Efficient Power MOSFET and IGBT Switching
• Switch Mode Power Supplies
• Motor Controls
• DC to DC Converters
• Class-D Switching Amplifiers
• Pulse Transformer Driver
The IXDD609 is configured as a non-inverting driver
with an enable, the IXDN609 is configured as a
non-inverting driver, and the IXDI609 is configured as
an inverting driver.
The IXD_609 family is available in a standard 8-pin
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC
with an exposed metal back (SI); an 8-pin DFN (D2); a
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).
RoHS
2002/95/EC
Pb
e3
Ordering Information
Logic
Configuration
Packing
Method
Part Number
Package Type
Quantity
IXDD609D2TR
IXDD609SI
IXDD609SITR
IXDD609SIA
IXDD609SIATR
IXDD609PI
IXDD609CI
IXDD609YI
IXDI609SI
IXDI609SITR
IXDI609SIA
IXDI609SIATR
IXDI609PI
8-Pin DFN
Tape & Reel
Tube
Tape & Reel
Tube
Tape & Reel
Tube
2000
100
2000
100
2000
50
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
IN
EN
OUT
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
5-Pin TO-220
Tube
Tube
Tube
50
50
5-Pin TO-263
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
100
2000
100
2000
50
Tape & Reel
Tube
Tape & Reel
Tube
8-Pin SOIC
8-Pin SOIC
8-Pin DIP
5-Pin TO-220
IN
OUT
IXDI609CI
Tube
50
IXDI609YI
5-Pin TO-263
Tube
50
IXDN609SI
IXDN609SITR
IXDN609SIA
IXDN609SIATR
IXDN609PI
IXDN609CI
IXDN609YI
8-Pin Power SOIC with Exposed Metal Back
8-Pin Power SOIC with Exposed Metal Back
8-Pin SOIC
Tube
Tape & Reel
Tube
Tape & Reel
Tube
100
2000
100
2000
50
IN
OUT
8-Pin SOIC
8-Pin DIP
5-Pin TO-220
5-Pin TO-263
Tube
Tube
50
50
DS-IXD_609-R02
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1
IXD_609
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
2
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R02
IXD_609
1 Specifications
1.1 Pin Configurations
1.2 Pin Definitions
IXDD609 D2 / PI / SI / SIA
IXDD609 CI / YI
Pin Name
Description
Logic Input
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
2
3
4
8
7
6
5
IN
OUT
OUT
GND
Output Enable - Drive pin low to disable output,
and force output to a high impedance state
EN
EN
GND
EN
Output - Sources or sinks current to turn-on or
turn-off a discrete MOSFET or IGBT
OUT
OUT
IXDI609 PI / SI / SIA
IXDI609 CI / YI
Inverted Output - Sources or sinks current to
turn-on or turn-off a discrete MOSFET or IGBT
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
2
3
4
8
7
6
5
OUT
OUT
GND
V
Supply Voltage - Provides power to the device
CC
NC
Ground - Common ground reference for the
device
GND
NC
GND
NC
Not connected
IXDN609 PI / SI / SIA
IXDN609 CI / YI
VCC
OUT
GND
IN
1
2
3
4
5
VCC
IN
VCC
1
2
3
4
8
7
6
5
OUT
OUT
GND
NC
GND
NC
1.3 Absolute Maximum Ratings
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
Input Voltage
-0.3
-5
40
V
V
CC
V , V
V
CC+0.3
IN EN
I
Output Current
Junction Temperature
Storage Temperature
-
9
A
°C
OUT
T
-55
-65
+150
+150
J
T
°C
STG
Unless stated otherwise, absolute maximum electrical ratings are at 25°C
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not
implied.
1.4 Recommended Operating Conditions
Parameter
Symbol
Minimum
Maximum
Units
V
Supply Voltage
4.5
-40
35
V
CC
T
Operating Temperature Range
+125
°C
A
R02
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3
IXD_609
1.5 Electrical Characteristics: T = 25°C
A
Test Conditions: 4.5V < V < 35V (unless otherwise noted).
CC
Parameter
Conditions
4.5V < VCC < 18V
4.5V < VCC < 18V
0V < V < V
Symbol
Minimum
Typical
Maximum
Units
Input Voltage, High
Input Voltage, Low
V
3.0
-
-
0.8
10
-
IH
V
V
-
-
-
IL
Input Current
I
IN
CC
-
A
IN
EN Input Voltage, High
EN Input Voltage, Low
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
IXDD609 only
V
2/3V
-
-
ENH
CC
V
IXDD609 only
V
1/3V
-
ENL
CC
-
-
V
V
-0.025
CC
-
-
0.025
1
OH
V
A
V
-
-
-
-
OL
V
=18V, I =-100mA
OUT
R
CC
0.6
0.4
OH
V
=18V, I =100mA
OUT
R
CC
0.8
OL
Limited by package power
dissipation
Output Current, Continuous
I
-
-
2
DC
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=10nF
=10nF
=10nF
=10nF
Rise Time
t
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
22
15
40
42
35
25
60
60
r
Fall Time
t
f
On-Time Propagation Delay
Off-Time Propagation Delay
t
ondly
t
ns
offdly
Enable to Output-High Delay Time
(IXDD609 Only)
Disable to High Impedance State Delay Time
(IXDD609 Only)
V
=18V
CC
t
-
-
25
35
60
60
ENOH
V
=18V
-
CC
t
DOLD
Enable Pull-Up Resistor
R
-
-
-
-
200
1
<1
<1
-
2
10
10
k
mA
EN
V
=18V, V =3.5V
IN
CC
V
=18V, V =0V
IN
Power Supply Current
I
CC
CC
A
V
=18V, V =V
CC
IN CC
1.6 Electrical Characteristics: T = - 40°C to +125°C
A
Test Conditions: 4.5V < V < 35V unless otherwise noted.
CC
Parameter
Conditions
4.5V < VCC < 18V
4.5V < VCC < 18V
0V < V < V
Symbol
Minimum
Maximum
Units
Input Voltage, High
Input Voltage, Low
V
3.3
-
0.65
10
IH
V
V
-
-
IL
Input Current
I
IN
CC
A
IN
Output Voltage, High
Output Voltage, Low
Output Resistance, High State
Output Resistance, Low State
-
V
V
-0.025
CC
-
OH
V
-
V
-
-
-
0.025
2
OL
V
=18V, I =-100mA
OUT
R
CC
OH
V
=18V, I =100mA
OUT
R
CC
1.5
OL
Limited by package power
dissipation
Output Current, Continuous
I
-
1
A
DC
V
V
V
V
=18V, C
=18V, C
=18V, C
=18V, C
=10nF
=10nF
=10nF
=10nF
Rise Time
t
CC
CC
CC
CC
LOAD
LOAD
LOAD
LOAD
-
-
-
-
-
40
30
75
75
75
r
Fall Time
t
f
On-Time Propagation Delay
Off-Time Propagation Delay
Enable to Output-High Delay Time
Disable to High Impedance State Delay Time
t
ondly
ns
t
offdly
IXDD609 only, V =18V
CC
t
ENOH
IXDD609 only, V =18V
CC
t
-
-
-
-
75
2.5
150
150
DOLD
V
=18V, V =3.5V
IN
mA
CC
V
=18V, V =0V
IN
Power Supply Current
I
CC
CC
A
V
=18V, V =V
CC
IN CC
4
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R02
IXD_609
1.7 Thermal Characteristics
Package
Parameter
Symbol
Rating
Units
D2 (8-Pin DFN)
35
36
125
85
120
46
3
CI (5-Pin TO-220)
PI (8-Pin DIP)
Thermal Resistance, Junction-to-Ambient
°C/W
°C/W
JA
SI (8-Pin Power SOIC)
SIA (8-Pin SOIC)
YI (5-Pin TO-263)
CI (5-Pin TO-220)
SI (8-Pin Power SOIC)
YI (5-Pin TO-263)
Thermal Resistance, Junction-to-Case
10
2
JC
2 IXD_609 Performance
2.1 Timing Diagrams
VIH
VIH
IN
IN
VIL
VIL
t
t
t
t
ondly
offdly
offdly
ondly
90%
90%
10%
OUT
10%
OUT
t
t
t
t
r
r
f
f
2.2 Characteristics Test Diagram
+
VCC
IN
OUT
VCC
0.1μF 10μF
VCC
-
Tektronix
Current Probe
EN
GND
VIN
CLOAD
6302
R02
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5
IXD_609
3 Block Diagrams & Truth Tables
3.1 IXDD609
3.3 IXDN609
VCC
VCC
IN
OUT
IN
OUT
GND
EN
GND
IN
OUT
IN
EN
OUT
0
1
0
1
x
1 or open
1 or open
0
0
1
0
1
Z
3.2 IXDI609
VCC
OUT
IN
GND
IN
OUT
0
1
1
0
6
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R02
IXD_609
4 Typical Performance Characteristics
Rise Time vs. Supply Voltage
(Input=0-5V, f=10kHz,TA=25ºC)
Fall Time vs. Supply Voltage
(Input=0-5V, f=10kHz,TA=25ºC)
Rise and Fall Times vs.Temperature
(VIN=0-5V, VCC=18V, f=10kHz, CL=2.5nF)
70
60
50
40
30
20
10
0
60
50
40
30
20
10
0
11
10
9
CL=10nF
CL=5.4nF
CL=1.5nF
t
r
CL=10nF
CL=5.4nF
CL=1.5nF
8
t
f
7
6
5
0
5
10
15
20
25
30
35
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
Supply Voltage (V)
Temperature (ºC)
Supply Voltage (V)
Fall Time vs. Load Capacitance
Rise Time vs. Load Capacitance
60
50
40
30
20
10
0
70
60
50
40
30
20
10
VCC=4.5V
VCC=8V
VCC=4.5V
VCC=8V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
VCC=12V
VCC=18V
VCC=25V
VCC=30V
VCC=35V
0
0
0
2000
4000
6000
8000
10000
2000
4000
6000
8000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Propagation Delay
vs.Temperature
(VCC=18V, f=1kHz, CL=5.4nF)
Propagation Delay vs. Input Voltage
(VIN=5V, VCC=12V, f=1kHz, CL=5.4nF)
Propagation Delay vs. Supply Voltage
(VIN=0-5V, f=1kHz, CL=5.4nF)
55
50
45
40
35
30
200
150
100
50
180
160
140
120
100
80
t
ondly
t
offdly
t
offdly
t
offdly
60
t
ondly
t
ondly
40
20
0
0
-40 -20
0
20 40 60 80 100 120 140
2
4
6
8
10
12
0
5
10
15
20
25
30
35
Temperature (ºC)
Input Voltage (V)
Supply Voltage (V)
Input Threshold Voltage
vs.Temperature
(VCC=18V, CL=2.5nF)
Input Threshold vs. Supply Voltage
Enable Threshold vs. Supply Voltage
3.5
3.0
2.5
2.0
1.5
1.0
25
20
15
10
5
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
2.0
1.9
Min VIH
Min VENH
Min VIH
Max VIL
Max VENL
Max VIL
0
0
5
10
15
20
25
30
35
-40 -20
0
20 40 60 80 100 120 140
0
5
10
15
20
25
30
35
Supply Voltage (V)
Temperature (ºC)
Supply Voltage (V)
R02
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7
IXD_609
Supply Current vs. Load Capacitance
(VCC=12V)
Supply Current vs. Load Capacitance
(VCC=18V)
Supply Current vs. Load Capacitance
(VCC=8V)
300
250
200
150
100
50
500
400
300
200
100
0
200
150
100
50
f=2MHz
f=1MHz
f=2MHz
f=1MHz
f=2MHz
f=1MHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
f=500kHz
f=100kHz
f=50kHz
f=10kHz
f=1kHz
0
0
1000
10000
1000
10000
1000
10000
Load Capacitance (pF)
Load Capacitance (pF)
Load Capacitance (pF)
Supply Current vs. Frequency
(VCC=12V)
Supply Current vs. Frequency
(VCC=8V)
Supply Current vs. Frequency
(VCC=18V)
1000
1000
100
10
1000
CL=10nF
CL=5.4nF
100 CL=1.5nF
CL=10nF
CL=5.4nF
CL=1.5nF
CL=10nF
CL=5.4nF
100 CL=1.5nF
10
1
10
1
1
0.1
0.01
0.1
1
0.1
1
10
100
1000
10000
1
10
100
1000
10000
10
100
1000
10000
Frequency (kHz)
Frequency (kHz)
Frequency (kHz)
Dynamic Supply Current
vs.Temperature
(VIN=5V, VCC=18V, f=1kHz, CL=1.5nF)
Quiescent Supply Current
vs.Temperature
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.65
0.60
0.55
0.50
0.45
0.40
0.35
VIN=3.5V
VIN=5V
VIN=10V
VIN=0V & 18V
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Output Sink Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
Output Source Current
vs. Supply Voltage
(f=422Hz, CL=66nF)
30
25
20
15
10
5
-30
-25
-20
-15
-10
-5
0
0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Supply Voltage (V)
Supply Voltage (V)
8
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R02
IXD_609
Output Source Current
vs.Temperature
(VCC=18V, f=422Hz, CL=66nF)
Output Sink Current
vs.Temperature
(VCC=18V, f=422Hz, CL=66nF)
-12.0
-11.5
-11.0
-10.5
-10.0
-9.5
14.0
13.5
13.0
12.5
12.0
11.5
11.0
10.5
10.0
-9.0
-40 -20
0
20 40 60 80 100 120 140
-40 -20
0
20 40 60 80 100 120 140
Temperature (ºC)
Temperature (ºC)
High State Output Resistance
vs. Supply Voltage
Low State Output Resistance
vs. Supply Voltage
(IOUT= -10mA)
(IOUT= +10mA )
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
1.5
1.0
0.5
0.0
0
5
10
15
20
25
30
35
0
5
10
15
20
25
30
35
Supply Voltage (V)
Supply Voltage (V)
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9
IXD_609
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our
products to the maximum conditions set forth in the standard, and guarantee proper operation of our
devices when handled according to the limitations and information in that standard as well as to any limitations set
forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device
Moisture Sensitivity Level (MSL) Rating
IXD_609SI / IXD_609SIA / IXD_609PI /IXD_609CI / IXD_609YI
IXD_609D2
MSL 1
MSL 3
5.2 ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard
JESD-625.
5.3 Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020 must be observed.
Device
Maximum Temperature x Time
IXD_609CI / IXD_609YI
IXD_609PI
245°C for 30 seconds
250°C for 30 seconds
260°C for 30 seconds
IXD_609SI / IXD_609SIA / IXD_609D2
RoHS
2002/95/EC
Pb
e3
10
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R02
IXD_609
5.4 Mechanical Dimensions
5.4.1 SIA (8-Pin SOIC)
0.10 / 0.25
(0.004 / 0.010)
1.27
(0.050)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.213)
5.80 / 6.20
(0.228 / 0.244)
1.55
(0.061)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
(0.024)
0º / 8º
Recommended PCB Land Pattern
4.80 / 5.00
(0.190 / 0.197)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.10 / 0.25
(0.004 / 0.010)
1.30 / 1.75
(0.051 / 0.069)
NOTE: Molded package conforms to JEDEC standard configuration
MS-012 variation AA.
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)
3.80
(0.150)
0.10 / 0.25
(0.004 / 0.010)
1.55
(0.061)
0.40 / 1.27
(0.016 / 0.050)
3.80 / 4.00
(0.150 / 0.157)
5.40
(0.209) (0.108)
2.75
5.80 / 6.20
(0.228 / 0.244)
PIN 1
0.25 / 0.50 x45º
(0.010 / 0.020 x45º)
0.60
(0.024)
1.27
(0.050)
0.31 / 0.51
(0.012 / 0.020)
1.27 BSC
(0.05 BSC)
0º / 8º
4.80 / 5.00
(0.190 / 0.197)
Recommended PCB Land Pattern
0.03 / 0.10
(0.001 / 0.004)
1.30 / 1.75
(0.051 / 0.069)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
NOTES:
2.29 / 2.79
1. Molded package conforms to JEDEC standard configuration
MS-012 variation BA.
(0.090 / 0.110)
2. The exposed metal pad on the back of the SI package should
be connected to GND. It is not suitable for carrying
current.
3.30 / 3.81
(0.130 / 0.150)
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11
IXD_609
5.4.3 Tape & Reel Information for SI and SIA Packages
∅1.55 0.05
330.2 DIA.
4.00 0.10 See Note #2
(13.00 DIA.)
0.30 0.05
R0.50 TYP
1.75 0.10
2.00 0.10
B
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
5.50 0.10
(3.40)
B0=5.20 0.10
12.00 0.30
A
A
Embossed Carrier
1.80 0.10
K0=2.30 0.10
∅1.50 (MIN)
B
8.00 0.10
SECTION B-B
A0=6.40 0.10
(1.20)
Embossment
(4.70)
(70º)
NOTES:
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
SECTION A-A
4. Unless otherwise specified, all dimensions in millimeters.
5.4.4 YI (5-Pin TO-263)
1.20 / 1.40
(0.047 / 0.055)
1.00 / 1.40
(0.039 / 0.055)
Recommended PCB Pattern
4.20 / 4.80
(0.165 / 0.189)
9.65 / 10.30
(0.380 / 0.406)
10.40
(0.409)
9.15
(0.360)
8.80 / 9.50
(0.346 / 0.374)
3.65
(0.144)
14.80 / 15.80
(0.583 / 0.622)
1
2 3 4 5
6.35
(0.250)
3.85
(0.152)
0.40 / 0.70
(0.016 / 0.028)
1.70 BSC
(0.067 BSC)
1.70
(0.067)
1.05
(0.041)
0.60 / 0.99
(0.024 / 0.039)
2.24 / 2.84
(0.088 / 0.112)
7.50 / 8.20
(0.295 / 0.323)
Optional
0º - 3º
6.60 / 7.20
(0.260 / 0.283)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
2.10 / 2.70
(0.083 / 0.106)
6
NOTES:
1. All metal surfaces are solder-plated except trimmed area.
2. Short lead of No. 3 is optional to IXYS.
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.
1.20 / 1.70
(0.047 / 0.067)
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IXD_609
5.4.5 PI (8-Pin DIP)
8-0.900 DIA.
(8-0.035 DIA.)
2.540
(0.100)
9.02 / 10.16
(0.355 / 0.400)
0.20 / 0.38
(0.008 / 0.015)
7.50
(0.295)
1.40
(0.055)
6.10 / 6.86
(0.240 / 0.270)
7.62 BSC
(0.300 BSC)
2.540 BSC
(0.100 BSC)
7.37 / 8.26
(0.290 / 0.325)
7.62 / 10.92
(0.300 / 0.430)
PC Board Pattern
3.05 / 3.81
(0.120 / 0.150)
3.43 / 4.70
(0.135 / 0.185)
0.38 / 1.02
(0.015 / 0.040)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
1.14 / 1.65
3.18 / 3.81
(0.125 / 0.150)
(0.045 / 0.065)
0.38 / 0.58
(0.015 / 0.023)
NOTE: Molded package conforms to JEDEC standard configuration
MS-001 variation BA.
5.4.6 CI (5-Pin TO-220)
1.14 / 1.40
(0.045 / 0.055)
9.91 / 10.54
(0.390 / 0.415)
4.32 / 4.83
(0.170 / 0.190)
7.823
(0.308)
12.387
(0.487)
14.73 / 15.75
(0.580 / 0.620)
11.94 / 12.95
(0.470 / 0.510)
6.299
(0.248)
8.64 / 9.40
(0.340 / 0.370)
3
1
2 3 4 5
6.502
(0.256)
7.620
(0.300)
DIMENSIONS
mm MIN / mm MAX
(inches MIN / inches / MAX)
25.27 / 26.54
(0.995 / 1.045)
12.70 / 14.73
(0.50 / 0.58)
0.38 / 0.64
(0.015 / 0.025)
2.29 / 2.92
1.70 BSC
(0.067 BSC)
0.64 / 1.02
(0.025 / 0.040)
Recommended Hole Pattern
(0.090 / 0.115)
Finished Hole Diameter = 1.45mm (0.057 in.)
NOTES:
1.This drawing will meet all dimensions requirement of
JEDEC outlines TS-001AA and 5-lead version TO-220AB.
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)
3.The metal tab is connected to pin 3 (GND).
1.70mm (0.067 in.)
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13
IXD_609
5.4.7 D2 (8-Pin DFN)
5.00 BSC
(0.197 BSC)
0.35 x 45º
(0.014 x 45º)
0.80 / 1.00
(0.031 / 0.039)
0.20 REF
(0.008 REF)
0.95
(0.037)
4.50
(0.177)
Pin 1
4.00 BSC
(0.158 BSC)
3.05
(0.120)
0.45
(0.018)
0.00 / 0.05
(0.000 / 0.002)
2.55
(0.100)
1.20
(0.047)
0.76 / 0.81
(0.030 / 0.032)
Recommended PCB Land Pattern
3.04 / 3.09
(0.120 / 0.122)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.30 / 0.45
(0.012 / 0.018)
0.95 BSC
(0.037 BSC)
Pin 1
Pin 8
2.54 / 2.59
(0.100 / 0.102)
NOTE:
0.35 / 0.45 x 45º
(0.014 / 0.018 x 45º)
The exposed metal pad on the back of the D2 package should
be connected to GND. It is not suitable for carrying current.
5.4.8 Tape & Reel Information for D2 Package
∅1.55 0.05
330.2 DIA.
(13.00 DIA.)
4.00 0.10 See Note #2
1.75 0.10
R0.75 TYP
2.00 0.05
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
(0.05)
5º MAX
5.50 0.05
(0.05)
B0=5.40 0.10
12.00 0.30
Embossed Carrier
K0=1.90 0.10
∅1.50 (MIN)
8.00 0.10
NOTES:
5º MAX
1. A0 & B0 measured at 0.3mm above base of pocket.
2. 10 pitches cumulative tol. 0.2mm
3. ( ) Reference dimensions only.
A0=4.25 0.10
Embossment
4. Unless otherwise specified, all dimensions in millimeters.
0.30 0.05
For additional information please visit our website at: www.clare.com
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for
a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-IXD_609-R02
©Copyright 2011, Clare, Inc.
All rights reserved. Printed in USA.
8/16/2011
14
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R02
相关型号：
IXDD609SIATR
Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, ROHS COMPLIANT, MS-012AA, SOIC-8
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IXDD609SITR
Buffer/Inverter Based MOSFET Driver, 9A, CMOS, PDSO8, ROHS COMPLIANT, MS-012BA, SOIC-8
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