IXDD609SIA [CLARE]

9-Ampere Low-Side Ultrafast MOSFET Drivers; 9安培低端超快MOSFET驱动器
IXDD609SIA
型号: IXDD609SIA
厂家: CLARE    CLARE
描述:

9-Ampere Low-Side Ultrafast MOSFET Drivers
9安培低端超快MOSFET驱动器

驱动器 接口集成电路 光电二极管 PC
文件: 总14页 (文件大小:1667K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
IXD_609  
9-Ampere Low-Side  
Ultrafast MOSFET Drivers  
Features  
Description  
9A Peak Source/Sink Drive Current  
Wide Operating Voltage Range: 4.5V to 35V  
-40°C to +125°C Extended Operating Temperature  
Range  
Logic Input Withstands Negative Swing of up to 5V  
Matched Rise and Fall Times  
The IXDD609/IXDI609/IXDN609 high-speed gate  
drivers are especially well suited for driving the latest  
IXYS MOSFETs and IGBTs. The IXD_609  
high-current output can source and sink 9A of peak  
current while producing voltage rise and fall times of  
less than 25ns. The input is CMOS compatible, and is  
virtually immune to latch up. Proprietary circuitry  
eliminates cross-conduction and current  
Low Propagation Delay Time  
Low, 10A Supply Current  
Low Output Impedance  
“shoot-through.Low propagation delay and fast,  
matched rise and fall times make the IXD_609 family  
ideal for high-frequency and high-power applications.  
Applications  
Efficient Power MOSFET and IGBT Switching  
Switch Mode Power Supplies  
Motor Controls  
DC to DC Converters  
Class-D Switching Amplifiers  
Pulse Transformer Driver  
The IXDD609 is configured as a non-inverting driver  
with an enable, the IXDN609 is configured as a  
non-inverting driver, and the IXDI609 is configured as  
an inverting driver.  
The IXD_609 family is available in a standard 8-pin  
DIP (PI); an 8-pin SOIC (SIA); an 8-pin Power SOIC  
with an exposed metal back (SI); an 8-pin DFN (D2); a  
5-pin TO-263 (YI); and a 5-pin TO-220 (CI).  
RoHS  
2002/95/EC  
Pb  
e3  
Ordering Information  
Logic  
Configuration  
Packing  
Method  
Part Number  
Package Type  
Quantity  
IXDD609D2TR  
IXDD609SI  
IXDD609SITR  
IXDD609SIA  
IXDD609SIATR  
IXDD609PI  
IXDD609CI  
IXDD609YI  
IXDI609SI  
IXDI609SITR  
IXDI609SIA  
IXDI609SIATR  
IXDI609PI  
8-Pin DFN  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
2000  
100  
2000  
100  
2000  
50  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
IN  
EN  
OUT  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
Tube  
Tube  
Tube  
50  
50  
5-Pin TO-263  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
100  
2000  
100  
2000  
50  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
8-Pin SOIC  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
IN  
OUT  
IXDI609CI  
Tube  
50  
IXDI609YI  
5-Pin TO-263  
Tube  
50  
IXDN609SI  
IXDN609SITR  
IXDN609SIA  
IXDN609SIATR  
IXDN609PI  
IXDN609CI  
IXDN609YI  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin Power SOIC with Exposed Metal Back  
8-Pin SOIC  
Tube  
Tape & Reel  
Tube  
Tape & Reel  
Tube  
100  
2000  
100  
2000  
50  
IN  
OUT  
8-Pin SOIC  
8-Pin DIP  
5-Pin TO-220  
5-Pin TO-263  
Tube  
Tube  
50  
50  
DS-IXD_609-R02  
www.clare.com  
1
IXD_609  
1. Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.1 Pin Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.2 Pin Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.3 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.4 Recommended Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3  
1.5 Electrical Characteristics: T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
A
1.6 Electrical Characteristics: T = - 40°C to +125°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
A
1.7 Thermal Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2. IXD_609 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.1 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
2.2 Characteristics Test Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5  
3. Block Diagrams & Truth Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.1 IXDD609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.2 IXDI609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
3.3 IXDN609 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
4. Typical Performance Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7  
5. Manufacturing Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.1 Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.2 ESD Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.3 Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
5.4 Mechanical Dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11  
2
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R02  
IXD_609  
1 Specifications  
1.1 Pin Configurations  
1.2 Pin Definitions  
IXDD609 D2 / PI / SI / SIA  
IXDD609 CI / YI  
Pin Name  
Description  
Logic Input  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
IN  
OUT  
OUT  
GND  
Output Enable - Drive pin low to disable output,  
and force output to a high impedance state  
EN  
EN  
GND  
EN  
Output - Sources or sinks current to turn-on or  
turn-off a discrete MOSFET or IGBT  
OUT  
OUT  
IXDI609 PI / SI / SIA  
IXDI609 CI / YI  
Inverted Output - Sources or sinks current to  
turn-on or turn-off a discrete MOSFET or IGBT  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
OUT  
OUT  
GND  
V
Supply Voltage - Provides power to the device  
CC  
NC  
Ground - Common ground reference for the  
device  
GND  
NC  
GND  
NC  
Not connected  
IXDN609 PI / SI / SIA  
IXDN609 CI / YI  
VCC  
OUT  
GND  
IN  
1
2
3
4
5
VCC  
IN  
VCC  
1
2
3
4
8
7
6
5
OUT  
OUT  
GND  
NC  
GND  
NC  
1.3 Absolute Maximum Ratings  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Supply Voltage  
Input Voltage  
-0.3  
-5  
40  
V
V
CC  
V , V  
V
CC+0.3  
IN EN  
I
Output Current  
Junction Temperature  
Storage Temperature  
-
9
A
°C  
OUT  
T
-55  
-65  
+150  
+150  
J
T
°C  
STG  
Unless stated otherwise, absolute maximum electrical ratings are at 25°C  
Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device.  
Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not  
implied.  
1.4 Recommended Operating Conditions  
Parameter  
Symbol  
Minimum  
Maximum  
Units  
V
Supply Voltage  
4.5  
-40  
35  
V
CC  
T
Operating Temperature Range  
+125  
°C  
A
R02  
www.clare.com  
3
IXD_609  
1.5 Electrical Characteristics: T = 25°C  
A
Test Conditions: 4.5V < V < 35V (unless otherwise noted).  
CC  
Parameter  
Conditions  
4.5V < VCC < 18V  
4.5V < VCC < 18V  
0V < V < V  
Symbol  
Minimum  
Typical  
Maximum  
Units  
Input Voltage, High  
Input Voltage, Low  
V
3.0  
-
-
0.8  
10  
-
IH  
V
V
-
-
-
IL  
Input Current  
I
IN  
CC  
-
A  
IN  
EN Input Voltage, High  
EN Input Voltage, Low  
Output Voltage, High  
Output Voltage, Low  
Output Resistance, High State  
Output Resistance, Low State  
IXDD609 only  
V
2/3V  
-
-
ENH  
CC  
V
IXDD609 only  
V
1/3V  
-
ENL  
CC  
-
-
V
V
-0.025  
CC  
-
-
0.025  
1
OH  
V
A
V
-
-
-
-
OL  
V
=18V, I =-100mA  
OUT  
R
CC  
0.6  
0.4  
OH  
V
=18V, I =100mA  
OUT  
R
CC  
0.8  
OL  
Limited by package power  
dissipation  
Output Current, Continuous  
I
-
-
2
DC  
V
V
V
V
=18V, C  
=18V, C  
=18V, C  
=18V, C  
=10nF  
=10nF  
=10nF  
=10nF  
Rise Time  
t
CC  
CC  
CC  
CC  
LOAD  
LOAD  
LOAD  
LOAD  
-
-
-
-
22  
15  
40  
42  
35  
25  
60  
60  
r
Fall Time  
t
f
On-Time Propagation Delay  
Off-Time Propagation Delay  
t
ondly  
t
ns  
offdly  
Enable to Output-High Delay Time  
(IXDD609 Only)  
Disable to High Impedance State Delay Time  
(IXDD609 Only)  
V
=18V  
CC  
t
-
-
25  
35  
60  
60  
ENOH  
V
=18V  
-
CC  
t
DOLD  
Enable Pull-Up Resistor  
R
-
-
-
-
200  
1
<1  
<1  
-
2
10  
10  
k  
mA  
EN  
V
=18V, V =3.5V  
IN  
CC  
V
=18V, V =0V  
IN  
Power Supply Current  
I
CC  
CC  
A  
V
=18V, V =V  
CC  
IN CC  
1.6 Electrical Characteristics: T = - 40°C to +125°C  
A
Test Conditions: 4.5V < V < 35V unless otherwise noted.  
CC  
Parameter  
Conditions  
4.5V < VCC < 18V  
4.5V < VCC < 18V  
0V < V < V  
Symbol  
Minimum  
Maximum  
Units  
Input Voltage, High  
Input Voltage, Low  
V
3.3  
-
0.65  
10  
IH  
V
V
-
-
IL  
Input Current  
I
IN  
CC  
A  
IN  
Output Voltage, High  
Output Voltage, Low  
Output Resistance, High State  
Output Resistance, Low State  
-
V
V
-0.025  
CC  
-
OH  
V
-
V
-
-
-
0.025  
2
OL  
V
=18V, I =-100mA  
OUT  
R
CC  
OH  
V
=18V, I =100mA  
OUT  
R
CC  
1.5  
OL  
Limited by package power  
dissipation  
Output Current, Continuous  
I
-
1
A
DC  
V
V
V
V
=18V, C  
=18V, C  
=18V, C  
=18V, C  
=10nF  
=10nF  
=10nF  
=10nF  
Rise Time  
t
CC  
CC  
CC  
CC  
LOAD  
LOAD  
LOAD  
LOAD  
-
-
-
-
-
40  
30  
75  
75  
75  
r
Fall Time  
t
f
On-Time Propagation Delay  
Off-Time Propagation Delay  
Enable to Output-High Delay Time  
Disable to High Impedance State Delay Time  
t
ondly  
ns  
t
offdly  
IXDD609 only, V =18V  
CC  
t
ENOH  
IXDD609 only, V =18V  
CC  
t
-
-
-
-
75  
2.5  
150  
150  
DOLD  
V
=18V, V =3.5V  
IN  
mA  
CC  
V
=18V, V =0V  
IN  
Power Supply Current  
I
CC  
CC  
A  
V
=18V, V =V  
CC  
IN CC  
4
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R02  
IXD_609  
1.7 Thermal Characteristics  
Package  
Parameter  
Symbol  
Rating  
Units  
D2 (8-Pin DFN)  
35  
36  
125  
85  
120  
46  
3
CI (5-Pin TO-220)  
PI (8-Pin DIP)  
Thermal Resistance, Junction-to-Ambient  
°C/W  
°C/W  
JA  
SI (8-Pin Power SOIC)  
SIA (8-Pin SOIC)  
YI (5-Pin TO-263)  
CI (5-Pin TO-220)  
SI (8-Pin Power SOIC)  
YI (5-Pin TO-263)  
Thermal Resistance, Junction-to-Case  
10  
2
JC  
2 IXD_609 Performance  
2.1 Timing Diagrams  
VIH  
VIH  
IN  
IN  
VIL  
VIL  
t
t
t
t
ondly  
offdly  
offdly  
ondly  
90%  
90%  
10%  
OUT  
10%  
OUT  
t
t
t
t
r
r
f
f
2.2 Characteristics Test Diagram  
+
VCC  
IN  
OUT  
VCC  
0.1μF 10μF  
VCC  
-
Tektronix  
Current Probe  
EN  
GND  
VIN  
CLOAD  
6302  
R02  
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5
IXD_609  
3 Block Diagrams & Truth Tables  
3.1 IXDD609  
3.3 IXDN609  
VCC  
VCC  
IN  
OUT  
IN  
OUT  
GND  
EN  
GND  
IN  
OUT  
IN  
EN  
OUT  
0
1
0
1
x
1 or open  
1 or open  
0
0
1
0
1
Z
3.2 IXDI609  
VCC  
OUT  
IN  
GND  
IN  
OUT  
0
1
1
0
6
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R02  
IXD_609  
4 Typical Performance Characteristics  
Rise Time vs. Supply Voltage  
(Input=0-5V, f=10kHz,TA=25ºC)  
Fall Time vs. Supply Voltage  
(Input=0-5V, f=10kHz,TA=25ºC)  
Rise and Fall Times vs.Temperature  
(VIN=0-5V, VCC=18V, f=10kHz, CL=2.5nF)  
70  
60  
50  
40  
30  
20  
10  
0
60  
50  
40  
30  
20  
10  
0
11  
10  
9
CL=10nF  
CL=5.4nF  
CL=1.5nF  
t
r
CL=10nF  
CL=5.4nF  
CL=1.5nF  
8
t
f
7
6
5
0
5
10  
15  
20  
25  
30  
35  
-40 -20  
0
20 40 60 80 100 120 140  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Temperature (ºC)  
Supply Voltage (V)  
Fall Time vs. Load Capacitance  
Rise Time vs. Load Capacitance  
60  
50  
40  
30  
20  
10  
0
70  
60  
50  
40  
30  
20  
10  
VCC=4.5V  
VCC=8V  
VCC=4.5V  
VCC=8V  
VCC=12V  
VCC=18V  
VCC=25V  
VCC=30V  
VCC=35V  
VCC=12V  
VCC=18V  
VCC=25V  
VCC=30V  
VCC=35V  
0
0
0
2000  
4000  
6000  
8000  
10000  
2000  
4000  
6000  
8000  
10000  
Load Capacitance (pF)  
Load Capacitance (pF)  
Propagation Delay  
vs.Temperature  
(VCC=18V, f=1kHz, CL=5.4nF)  
Propagation Delay vs. Input Voltage  
(VIN=5V, VCC=12V, f=1kHz, CL=5.4nF)  
Propagation Delay vs. Supply Voltage  
(VIN=0-5V, f=1kHz, CL=5.4nF)  
55  
50  
45  
40  
35  
30  
200  
150  
100  
50  
180  
160  
140  
120  
100  
80  
t
ondly  
t
offdly  
t
offdly  
t
offdly  
60  
t
ondly  
t
ondly  
40  
20  
0
0
-40 -20  
0
20 40 60 80 100 120 140  
2
4
6
8
10  
12  
0
5
10  
15  
20  
25  
30  
35  
Temperature (ºC)  
Input Voltage (V)  
Supply Voltage (V)  
Input Threshold Voltage  
vs.Temperature  
(VCC=18V, CL=2.5nF)  
Input Threshold vs. Supply Voltage  
Enable Threshold vs. Supply Voltage  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
25  
20  
15  
10  
5
2.8  
2.7  
2.6  
2.5  
2.4  
2.3  
2.2  
2.1  
2.0  
1.9  
Min VIH  
Min VENH  
Min VIH  
Max VIL  
Max VENL  
Max VIL  
0
0
5
10  
15  
20  
25  
30  
35  
-40 -20  
0
20 40 60 80 100 120 140  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Temperature (ºC)  
Supply Voltage (V)  
R02  
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7
IXD_609  
Supply Current vs. Load Capacitance  
(VCC=12V)  
Supply Current vs. Load Capacitance  
(VCC=18V)  
Supply Current vs. Load Capacitance  
(VCC=8V)  
300  
250  
200  
150  
100  
50  
500  
400  
300  
200  
100  
0
200  
150  
100  
50  
f=2MHz  
f=1MHz  
f=2MHz  
f=1MHz  
f=2MHz  
f=1MHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
f=500kHz  
f=100kHz  
f=50kHz  
f=10kHz  
f=1kHz  
0
0
1000  
10000  
1000  
10000  
1000  
10000  
Load Capacitance (pF)  
Load Capacitance (pF)  
Load Capacitance (pF)  
Supply Current vs. Frequency  
(VCC=12V)  
Supply Current vs. Frequency  
(VCC=8V)  
Supply Current vs. Frequency  
(VCC=18V)  
1000  
1000  
100  
10  
1000  
CL=10nF  
CL=5.4nF  
100 CL=1.5nF  
CL=10nF  
CL=5.4nF  
CL=1.5nF  
CL=10nF  
CL=5.4nF  
100 CL=1.5nF  
10  
1
10  
1
1
0.1  
0.01  
0.1  
1
0.1  
1
10  
100  
1000  
10000  
1
10  
100  
1000  
10000  
10  
100  
1000  
10000  
Frequency (kHz)  
Frequency (kHz)  
Frequency (kHz)  
Dynamic Supply Current  
vs.Temperature  
(VIN=5V, VCC=18V, f=1kHz, CL=1.5nF)  
Quiescent Supply Current  
vs.Temperature  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0.0  
0.65  
0.60  
0.55  
0.50  
0.45  
0.40  
0.35  
VIN=3.5V  
VIN=5V  
VIN=10V  
VIN=0V & 18V  
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (ºC)  
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (ºC)  
Output Sink Current  
vs. Supply Voltage  
(f=422Hz, CL=66nF)  
Output Source Current  
vs. Supply Voltage  
(f=422Hz, CL=66nF)  
30  
25  
20  
15  
10  
5
-30  
-25  
-20  
-15  
-10  
-5  
0
0
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Supply Voltage (V)  
8
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R02  
IXD_609  
Output Source Current  
vs.Temperature  
(VCC=18V, f=422Hz, CL=66nF)  
Output Sink Current  
vs.Temperature  
(VCC=18V, f=422Hz, CL=66nF)  
-12.0  
-11.5  
-11.0  
-10.5  
-10.0  
-9.5  
14.0  
13.5  
13.0  
12.5  
12.0  
11.5  
11.0  
10.5  
10.0  
-9.0  
-40 -20  
0
20 40 60 80 100 120 140  
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (ºC)  
Temperature (ºC)  
High State Output Resistance  
vs. Supply Voltage  
Low State Output Resistance  
vs. Supply Voltage  
(IOUT= -10mA)  
(IOUT= +10mA )  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
1.5  
1.0  
0.5  
0.0  
0
5
10  
15  
20  
25  
30  
35  
0
5
10  
15  
20  
25  
30  
35  
Supply Voltage (V)  
Supply Voltage (V)  
R02  
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9
IXD_609  
5 Manufacturing Information  
5.1 Moisture Sensitivity  
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. Clare classified  
all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint  
industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our  
products to the maximum conditions set forth in the standard, and guarantee proper operation of our  
devices when handled according to the limitations and information in that standard as well as to any limitations set  
forth in the information or standards referenced below.  
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced  
product performance, reduction of operable life, and/or reduction of overall reliability.  
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according to  
the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.  
Device  
Moisture Sensitivity Level (MSL) Rating  
IXD_609SI / IXD_609SIA / IXD_609PI /IXD_609CI / IXD_609YI  
IXD_609D2  
MSL 1  
MSL 3  
5.2 ESD Sensitivity  
This product is ESD Sensitive, and should be handled according to the industry standard  
JESD-625.  
5.3 Reflow Profile  
This product has a maximum body temperature and time rating as shown below. All other guidelines of  
J-STD-020 must be observed.  
Device  
Maximum Temperature x Time  
IXD_609CI / IXD_609YI  
IXD_609PI  
245°C for 30 seconds  
250°C for 30 seconds  
260°C for 30 seconds  
IXD_609SI / IXD_609SIA / IXD_609D2  
RoHS  
2002/95/EC  
Pb  
e3  
10  
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R02  
IXD_609  
5.4 Mechanical Dimensions  
5.4.1 SIA (8-Pin SOIC)  
0.10 / 0.25  
(0.004 / 0.010)  
1.27  
(0.050)  
0.40 / 1.27  
(0.016 / 0.050)  
3.80 / 4.00  
(0.150 / 0.157)  
5.40  
(0.213)  
5.80 / 6.20  
(0.228 / 0.244)  
1.55  
(0.061)  
PIN 1  
0.25 / 0.50 x45º  
(0.010 / 0.020 x45º)  
0.60  
0.31 / 0.51  
(0.012 / 0.020)  
1.27 BSC  
(0.05 BSC)  
(0.024)  
0º / 8º  
Recommended PCB Land Pattern  
4.80 / 5.00  
(0.190 / 0.197)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
0.10 / 0.25  
(0.004 / 0.010)  
1.30 / 1.75  
(0.051 / 0.069)  
NOTE: Molded package conforms to JEDEC standard configuration  
MS-012 variation AA.  
5.4.2 SI (8-Pin Power SOIC with Exposed Metal Back)  
3.80  
(0.150)  
0.10 / 0.25  
(0.004 / 0.010)  
1.55  
(0.061)  
0.40 / 1.27  
(0.016 / 0.050)  
3.80 / 4.00  
(0.150 / 0.157)  
5.40  
(0.209) (0.108)  
2.75  
5.80 / 6.20  
(0.228 / 0.244)  
PIN 1  
0.25 / 0.50 x45º  
(0.010 / 0.020 x45º)  
0.60  
(0.024)  
1.27  
(0.050)  
0.31 / 0.51  
(0.012 / 0.020)  
1.27 BSC  
(0.05 BSC)  
0º / 8º  
4.80 / 5.00  
(0.190 / 0.197)  
Recommended PCB Land Pattern  
0.03 / 0.10  
(0.001 / 0.004)  
1.30 / 1.75  
(0.051 / 0.069)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
NOTES:  
2.29 / 2.79  
1. Molded package conforms to JEDEC standard configuration  
MS-012 variation BA.  
(0.090 / 0.110)  
2. The exposed metal pad on the back of the SI package should  
be connected to GND. It is not suitable for carrying  
current.  
3.30 / 3.81  
(0.130 / 0.150)  
R02  
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11  
IXD_609  
5.4.3 Tape & Reel Information for SI and SIA Packages  
1.55 0.05  
330.2 DIA.  
4.00 0.10 See Note #2  
(13.00 DIA.)  
0.30 0.05  
R0.50 TYP  
1.75 0.10  
2.00 0.10  
B
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
5.50 0.10  
(3.40)  
B0=5.20 0.10  
12.00 0.30  
A
A
Embossed Carrier  
1.80 0.10  
K0=2.30 0.10  
1.50 (MIN)  
B
8.00 0.10  
SECTION B-B  
A0=6.40 0.10  
(1.20)  
Embossment  
(4.70)  
(70º)  
NOTES:  
1. A0 & B0 measured at 0.3mm above base of pocket.  
2. 10 pitches cumulative tol. 0.2mm  
3. ( ) Reference dimensions only.  
SECTION A-A  
4. Unless otherwise specified, all dimensions in millimeters.  
5.4.4 YI (5-Pin TO-263)  
1.20 / 1.40  
(0.047 / 0.055)  
1.00 / 1.40  
(0.039 / 0.055)  
Recommended PCB Pattern  
4.20 / 4.80  
(0.165 / 0.189)  
9.65 / 10.30  
(0.380 / 0.406)  
10.40  
(0.409)  
9.15  
(0.360)  
8.80 / 9.50  
(0.346 / 0.374)  
3.65  
(0.144)  
14.80 / 15.80  
(0.583 / 0.622)  
1
2 3 4 5  
6.35  
(0.250)  
3.85  
(0.152)  
0.40 / 0.70  
(0.016 / 0.028)  
1.70 BSC  
(0.067 BSC)  
1.70  
(0.067)  
1.05  
(0.041)  
0.60 / 0.99  
(0.024 / 0.039)  
2.24 / 2.84  
(0.088 / 0.112)  
7.50 / 8.20  
(0.295 / 0.323)  
Optional  
0º - 3º  
6.60 / 7.20  
(0.260 / 0.283)  
DIMENSIONS  
mm MIN / mm MAX  
(inches MIN / inches / MAX)  
2.10 / 2.70  
(0.083 / 0.106)  
6
NOTES:  
1. All metal surfaces are solder-plated except trimmed area.  
2. Short lead of No. 3 is optional to IXYS.  
3. No. 3 lead is connected to No. 6 lead (bottom heat sink) internally.  
1.20 / 1.70  
(0.047 / 0.067)  
12  
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IXD_609  
5.4.5 PI (8-Pin DIP)  
8-0.900 DIA.  
(8-0.035 DIA.)  
2.540  
(0.100)  
9.02 / 10.16  
(0.355 / 0.400)  
0.20 / 0.38  
(0.008 / 0.015)  
7.50  
(0.295)  
1.40  
(0.055)  
6.10 / 6.86  
(0.240 / 0.270)  
7.62 BSC  
(0.300 BSC)  
2.540 BSC  
(0.100 BSC)  
7.37 / 8.26  
(0.290 / 0.325)  
7.62 / 10.92  
(0.300 / 0.430)  
PC Board Pattern  
3.05 / 3.81  
(0.120 / 0.150)  
3.43 / 4.70  
(0.135 / 0.185)  
0.38 / 1.02  
(0.015 / 0.040)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
1.14 / 1.65  
3.18 / 3.81  
(0.125 / 0.150)  
(0.045 / 0.065)  
0.38 / 0.58  
(0.015 / 0.023)  
NOTE: Molded package conforms to JEDEC standard configuration  
MS-001 variation BA.  
5.4.6 CI (5-Pin TO-220)  
1.14 / 1.40  
(0.045 / 0.055)  
9.91 / 10.54  
(0.390 / 0.415)  
4.32 / 4.83  
(0.170 / 0.190)  
7.823  
(0.308)  
12.387  
(0.487)  
14.73 / 15.75  
(0.580 / 0.620)  
11.94 / 12.95  
(0.470 / 0.510)  
6.299  
(0.248)  
8.64 / 9.40  
(0.340 / 0.370)  
3
1
2 3 4 5  
6.502  
(0.256)  
7.620  
(0.300)  
DIMENSIONS  
mm MIN / mm MAX  
(inches MIN / inches / MAX)  
25.27 / 26.54  
(0.995 / 1.045)  
12.70 / 14.73  
(0.50 / 0.58)  
0.38 / 0.64  
(0.015 / 0.025)  
2.29 / 2.92  
1.70 BSC  
(0.067 BSC)  
0.64 / 1.02  
(0.025 / 0.040)  
Recommended Hole Pattern  
(0.090 / 0.115)  
Finished Hole Diameter = 1.45mm (0.057 in.)  
NOTES:  
1.This drawing will meet all dimensions requirement of  
JEDEC outlines TS-001AA and 5-lead version TO-220AB.  
2. Mounting hole diameter: 3.53 / 3.96 (0.139 / 0.156)  
3.The metal tab is connected to pin 3 (GND).  
1.70mm (0.067 in.)  
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13  
IXD_609  
5.4.7 D2 (8-Pin DFN)  
5.00 BSC  
(0.197 BSC)  
0.35 x 45º  
(0.014 x 45º)  
0.80 / 1.00  
(0.031 / 0.039)  
0.20 REF  
(0.008 REF)  
0.95  
(0.037)  
4.50  
(0.177)  
Pin 1  
4.00 BSC  
(0.158 BSC)  
3.05  
(0.120)  
0.45  
(0.018)  
0.00 / 0.05  
(0.000 / 0.002)  
2.55  
(0.100)  
1.20  
(0.047)  
0.76 / 0.81  
(0.030 / 0.032)  
Recommended PCB Land Pattern  
3.04 / 3.09  
(0.120 / 0.122)  
Dimensions  
mm MIN / mm MAX  
(inches MIN / inches MAX)  
0.30 / 0.45  
(0.012 / 0.018)  
0.95 BSC  
(0.037 BSC)  
Pin 1  
Pin 8  
2.54 / 2.59  
(0.100 / 0.102)  
NOTE:  
0.35 / 0.45 x 45º  
(0.014 / 0.018 x 45º)  
The exposed metal pad on the back of the D2 package should  
be connected to GND. It is not suitable for carrying current.  
5.4.8 Tape & Reel Information for D2 Package  
1.55 0.05  
330.2 DIA.  
(13.00 DIA.)  
4.00 0.10 See Note #2  
1.75 0.10  
R0.75 TYP  
2.00 0.05  
Top Cover  
Tape Thickness  
0.102 MAX.  
(0.004 MAX.)  
(0.05)  
5º MAX  
5.50 0.05  
(0.05)  
B0=5.40 0.10  
12.00 0.30  
Embossed Carrier  
K0=1.90 0.10  
1.50 (MIN)  
8.00 0.10  
NOTES:  
5º MAX  
1. A0 & B0 measured at 0.3mm above base of pocket.  
2. 10 pitches cumulative tol. 0.2mm  
3. ( ) Reference dimensions only.  
A0=4.25 0.10  
Embossment  
4. Unless otherwise specified, all dimensions in millimeters.  
0.30 0.05  
For additional information please visit our website at: www.clare.com  
Clare, Inc. makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and  
product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in Clare’s Standard Terms and Conditions of Sale,  
Clare, Inc. assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for  
a particular purpose, or infringement of any intellectual property right.  
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other  
applications intended to support or sustain life, or where malfunction of Clare’s product may result in direct physical harm, injury, or death to a person or severe property or environmental  
damage. Clare, Inc. reserves the right to discontinue or make changes to its products at any time without notice.  
Specification: DS-IXD_609-R02  
©Copyright 2011, Clare, Inc.  
All rights reserved. Printed in USA.  
8/16/2011  
14  
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R02  

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