SPM0404HE5H-PB_13 [KNOWLES]

SiSonicTM Microphone With Enhanced RF Protection; SiSonicTM麦克风具有增强RF保护
SPM0404HE5H-PB_13
型号: SPM0404HE5H-PB_13
厂家: KNOWLES ELECTRONICS    KNOWLES ELECTRONICS
描述:

SiSonicTM Microphone With Enhanced RF Protection
SiSonicTM麦克风具有增强RF保护

文件: 总11页 (文件大小:742K)
中文:  中文翻译
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SPM0404HE5H-P
SiSonicTM Microphone  
With Enhanced RF Protection  
The SPM0404HE5H-PB is a miniature, high-  
Features:  
performance, low power, top port silicon  
microphone. Using Knowles’ proven high  
performance SiSonicTM MEMS technology,  
the SPM0404HE5H-PB consists of an  
Enhanced RF protection  
Ultra-Stable Performance  
Standard SMD Reflow  
Omnidirectional  
acoustic sensor, a low noise input buffer,  
and an output amplifier. These devices are  
suitable for applications such as cellphones,  
smart phones, laptop computers, sensors,  
digital still cameras, portable music  
recorders, and other portable electronic  
devices where excellent wideband audio  
performance and RF immunity are required.  
Revision: D  
2/28/2013  
Sheet 1 of 11  
©2012 Knowles Electronics  
SPM0404HE5H-P
1. ABSOLUTE MAXIMUM RATINGS  
Parameter  
VDD to Ground  
Absolute Maximum Rating Units  
-0.5, +5.0  
-0.3, VDD + 0.3  
±5  
V
V
OUT to Ground  
Input Current to Any Pin  
Temperature Range  
mA  
°C  
-40 to +100  
Stresses exceeding these Absolute Maximum Ratingsmay cause permanent damage to the device. These are  
stress ratings only. Functional operation at these or any other conditions beyond those indicated under “Acoustic  
& Electrical Specifications” is not implied. Exposure beyond those indicated under “Acoustic & Electrical  
Specifications” for extended periods may affect device reliability.  
2. ACOUSTIC & ELECTRICAL SPECIFICATIONS  
TEST CONDITIONS: 23 ±2°C, 55±20% R.H., VDD(min) < VDD < VDD(max), no load, unless otherwise indicated  
Parameter  
Supply Voltage1  
Supply Current1,2  
Sensitivity1  
Symbol  
VDD  
Conditions  
Min  
1.5  
-
Typ  
-
Max  
3.6  
190  
-39  
-
Units  
V
IDD  
145  
-42  
59  
µA  
S
94 dB SPL @ 1 kHz  
-45  
-
dBV/Pa  
dB(A)  
Signal to Noise Ratio  
SNR  
94 dB SPL @ 1 kHz, A-weighted  
94 dB SPL @ 1 kHz,  
S = Typ, Rload > 2 k  
10% THD @ 1 kHz,  
S = Typ, VDD = 3.6V, Rload > 2 k  
Total Harmonic  
Distortion  
THD  
AOP  
-
-
-
1
-
%
Acoustic Overload  
Point  
115  
dB SPL  
DC Output  
Output Impedance  
Directivity  
VDD = 1.5V  
@ 1 kHz  
-
-
0.84  
-
-
V
ZOUT  
200  
  
Omnidirectional  
Decreasing output voltage  
Polarity  
Increasing sound pressure  
1 100% tested.  
2 Maximum specifications are measured at maximum VDD. Typical specifications are measured at VDD = 1.8V.  
Revision: D  
Sheet 2 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
3. FREQUENCY RESPONSE CURVE  
Typical Free Field Response  
Normalized to 1 kHz  
20  
18  
16  
14  
12  
10  
8
6
4
2
0
-2  
-4  
-6  
-8  
-10  
-12  
-14  
-16  
-18  
-20  
100  
1,000  
10,000  
Frequency (Hz)  
Revision: D  
Sheet 3 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
4. INTERFACE CIRCUIT  
VDD  
.1f  
RF  
VDD  
OUTPUT  
RS  
VREF  
External Gain = -RF/RS  
(Set By User)  
GROUND  
Dotted Section  
Represents  
SiSonicTM  
Microphone  
Note: All Ground pins must be connected to ground.  
Capacitors near the microphone should not contain Class 2 dielectrics.  
Detailed information on acoustic, mechanical, and system integration can be found in  
the latest SiSonicTM Design Guide application note.  
Revision: D  
Sheet 4 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
5. MECHANICAL SPECIFICATIONS  
Item  
Length (L)  
Dimension  
4.72  
Tolerance  
±0.10  
Width (W)  
3.76  
±0.10  
Height (H)  
1.25  
±0.10  
Acoustic Port (AP)  
Ø0.84  
±0.08  
Pin #  
Pin Name  
OUTPUT  
GROUND  
GROUND  
VDD  
Type  
Signal  
Power  
Power  
Power  
Description  
Output Signal  
Ground  
1
2
3
4
Ground  
Power Supply  
Notes: Pick Area only extends to 0.25 mm of any edge or hole unless otherwise specified.  
Dimensions are in millimeters unless otherwise specified.  
Tolerance is ±0.15mm unless otherwise specified  
Revision: D  
Sheet 5 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
6. EXAMPLE LAND PATTERN  
7. EXAMPLE SOLDER STENCIL PATTERN  
Notes: Dimensions are in millimeters unless otherwise specified.  
Further optimizations based on application should be performed.  
Revision: D  
2/28/2013  
Sheet 6 of 11  
©2012 Knowles Electronics  
SPM0404HE5H-P
8. PACKAGING & MARKING DETAIL  
Model Number  
SPM0404HE5H-PB  
Suffix Reel Diameter Quantity Per Reel  
-6 134,800  
Pin 1  
Alpha Character A:  
S”: Knowles SiSonicTM Production  
E”: Knowles Engineering Samples  
“P”: Knowles Prototype Samples  
“JIN NUMBER”:  
Unique Job Identification Number  
for product traceability  
Notes: Dimensions are in millimeters unless otherwise specified.  
Vacuum pickup only in the pick area indicated in Mechanical Specifications.  
Tape & reel per EIA-481.  
Labels applied directly to reel and external package.  
Shelf life: Twelve (12) months when devices are to be stored in factory supplied,  
unopened ESD moisture sensitive bag under maximum environmental conditions of  
30°C, 70% R.H.  
Revision: D  
Sheet 7 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
9. RECOMMENDED REFLOW PROFILE  
tP  
TP  
Ramp-up  
TL  
tL  
TSMAX  
tS Preheat  
Ramp-down  
TSMIN  
25°C  
Time  
Time 25°C to Peak  
Profile Feature  
Pb-Free  
Average Ramp-up rate (TSMAX to TP)  
Preheat  
3°C/second max.  
Temperature Min (TSMIN)  
150°C  
200°C  
60-180 seconds  
Temperature Max (TSMAX  
)
Time (TSMIN to TSMAX) (tS)  
Time maintained above:  
Temperature (TL)  
Time (tL)  
217°C  
60-150 seconds  
Peak Temperature (TP)  
Time within 5°C of actual Peak Temperature (tP)  
Ramp-down rate (TP to TSMAX  
Time 25°C to Peak Temperature  
260°C  
20-40 seconds  
6°C/second max  
8 minutes max  
)
Notes: Based on IPC/JDEC J-STD-020 Revision C.  
All temperatures refer to topside of the package, measured on the package body  
surface.  
Revision: D  
Sheet 8 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
10. ADDITIONAL NOTES  
(A) MSL (moisture sensitivity level) Class 1.  
(B) Maximum of 3 reflow cycles is recommended.  
(C) In order to minimize device damage:  
Do not board wash or clean after the reflow process.  
Do not brush board with or without solvents after the reflow process.  
Do not directly expose to ultrasonic processing, welding, or cleaning.  
Do not insert any object in port hole of device at any time.  
Do not apply over 30 psi of air pressure into the port hole.  
Do not pull a vacuum over port hole of the microphone.  
Do not apply a vacuum when repacking into sealed bags at a rate faster than 0.5 atm/sec.  
11. MATERIALS STATEMENT  
Meets the requirements of the European RoHS directive 2011/65/EC as amended.  
Meets the requirements of the industry standard IEC 61249-2-21:2003 for halogenated  
substances and Knowles Green Materials Standards Policy section on Halogen-Free.  
Ozone depleting substances are not used in the product or the processes used to make the  
product, including compounds listed in Annex A, B, and C of the “Montreal Protocol on  
Substances That Deplete the Ozone Layer.”  
Revision: D  
Sheet 9 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
12. RELIABILITY SPECIFICATIONS  
Test  
Description  
100 cycles air-to-air thermal shock from -40oC to +125oC with 15  
minute soaks. (IEC 68-2-4)  
Thermal Shock  
High Temperature Storage  
Low Temperature Storage  
High Temperature Bias  
Low Temperature Bias  
1,000 hours at +105oC environment (IEC 68-2-2 Test Ba)  
1,000 hours at -40oC environment (IEC 68-2-2 Test Aa)  
1,000 hours at +105oC under bias (IEC 68-2-2 Test Ba)  
1,000 hours at -40oC under bias (IEC 68-2-2 Test Aa)  
Temperature / Humidity Bias 1,000 hours at +85oC/85% R.H. under bias. (JESD22-A101A-B)  
4 cycles of 20 to 2,000 Hz sinusoidal sweep with 20 G peak  
acceleration lasting 12 minutes in X, Y, and Z directions.  
(Mil-Std-883E, method 2007.2 A)  
Vibration  
ESD-HBM  
3 discharges of ±2 kV direct contact to I/O pins. (ESD STM5.2)  
3 discharges of ±8 kV direct contact to lid while unit is grounded.  
(IEC 61000-4-2)  
ESD-LID/GND  
3 discharges of ±2 kV direct contact to I/O pins.  
(MIL 883E, Method 3015.7)  
ESD-MM  
Reflow  
5 reflow cycles with peak temperature of +260oC  
Mechanical Shock  
3 pulses of 10,000 G in the X, Y, and Z direction (IEC 68-2-27, Test Ea)  
Note: After reliability tests are performed, the sensitivity of the microphones shall not deviate  
more than 3 dB from its initial value.  
Revision: D  
Sheet 10 of 11  
2/28/2013  
©2012 Knowles Electronics  
SPM0404HE5H-P
13. SPECIFICATION REVISIONS  
Revision  
Specification Changes  
Date  
C
Format Update  
8/14/09  
New RoHS statement (C10114438); updated humidity conditions and ESD  
descriptions (C10114466); released in new format (C10114628)  
D
2/28/13  
Information contained herein is subject to change without notice. It may be used by a party at their own discretion  
and risk. We do not guarantee any results or assume any liability in connection with its use. This publication is not  
to be taken as a license to operate under any existing patents.  
Revision: D  
Sheet 11 of 11  
2/28/2013  
©2012 Knowles Electronics  

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