C1210C823G3JAC7800 [KEMET]
Capacitor, Ceramic, Chip, General Purpose, 0.082uF, 25V, ±2%, U2J, 1210 (3225 mm), Sn/NiBar, -55º ~ +125ºC, 7" Reel/Unmarked;
| 型号： | C1210C823G3JAC7800 |
| 厂家： | 
KEMET CORPORATION |
| 描述： | Capacitor, Ceramic, Chip, General Purpose, 0.082uF, 25V, ±2%, U2J, 1210 (3225 mm), Sn/NiBar, -55º ~ +125ºC, 7" Reel/Unmarked |
| 文件： | 总20页 (文件大小：1424K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
SurfaceꢀMountꢀMultilayerꢀCeramicꢀChipꢀCapacitorsꢀ(SMDꢀMLCCs)
U2J Dielectric, 10 – 50 VDC
(Commercial & Automotive Grade)
Overview
KEMETꢀU2Jꢀdielectricꢀfeaturesꢀaꢀmaximumꢀoperatingꢀ
temperatureꢀofꢀ125°Cꢀandꢀisꢀconsideredꢀstable.ꢀTheꢀ
ElectronicsꢀIndustriesꢀAllianceꢀ(EIA)ꢀcharacterizesꢀU2Jꢀ
dielectricꢀasꢀaꢀClassꢀIꢀmaterial.ꢀComponentsꢀofꢀthisꢀ
classificationꢀareꢀtemperatureꢀcompensatingꢀandꢀareꢀ
suitedꢀforꢀresonantꢀcircuitꢀapplicationsꢀorꢀthoseꢀwhereꢀQꢀ
andꢀstabilityꢀofꢀcapacitanceꢀcharacteristicsꢀareꢀrequired.ꢀ
U2JꢀisꢀnotꢀsensitiveꢀtoꢀDCꢀBiasꢀasꢀcomparedꢀtoꢀClassꢀ
IIꢀdielectricꢀmaterialsꢀandꢀretainsꢀoverꢀ99%ꢀofꢀnominalꢀ
capacitanceꢀatꢀfullꢀratedꢀvoltage.ꢀKEMETꢀautomotiveꢀgradeꢀ
capacitorsꢀmeetꢀtheꢀdemandingꢀAutomotiveꢀElectronicsꢀ
Council'sꢀAEC–Q200ꢀqualificationꢀrequirements.
Capacitanceꢀchangeꢀisꢀlimitedꢀtoꢀ−750ꢀ±120ꢀppm/°Cꢀfromꢀ
−55°Cꢀtoꢀ+125°C.ꢀTheseꢀdevicesꢀareꢀleadꢀ(Pb)-free,ꢀRoHSꢀ
U2Jꢀisꢀanꢀextremelyꢀstableꢀdielectricꢀmaterialꢀthatꢀexhibitsꢀ andꢀREACHꢀcompliantꢀwithoutꢀexceptionꢀandꢀareꢀcapableꢀ
a negligible shift in capacitance with respect to voltage
ofꢀwithstandingꢀmultipleꢀpassesꢀthroughꢀaꢀleadꢀ(Pb)-freeꢀ
andꢀboastsꢀaꢀpredictableꢀandꢀlinearꢀchangeꢀinꢀcapacitanceꢀ solderꢀreflowꢀprofile.
with reference to ambient temperature with no aging
effect.ꢀInꢀaddition,ꢀU2Jꢀdielectricꢀextendsꢀtheꢀavailableꢀ
capacitanceꢀrangeꢀofꢀClassꢀIꢀMLCCsꢀtoꢀachieveꢀvaluesꢀ
previouslyꢀonlyꢀavailableꢀusingꢀClassꢀIIꢀdielectricꢀmaterialsꢀ
likeꢀX7R,ꢀX5R,ꢀY5VꢀandꢀZ5U.
Benefits
•ꢀ AEC–Q200ꢀautomotiveꢀqualified
• Up to 10x increase in capacitance versus C0G
• Extremely low effective series resistance (ESR)
•ꢀ Extremelyꢀlowꢀeffectiveꢀseriesꢀinductanceꢀ(ESL)
• High ripple current capability
•ꢀ LowꢀnoiseꢀsolutionꢀsimilarꢀtoꢀC0G
•ꢀ Retainsꢀoverꢀ99%ꢀofꢀnominalꢀcapacitanceꢀatꢀfullꢀratedꢀvoltage
•ꢀ Smallꢀpredictableꢀandꢀlinearꢀcapacitanceꢀchangeꢀwithꢀrespect
to temperature
•ꢀ Operatingꢀtemperatureꢀrangeꢀofꢀ−55°Cꢀtoꢀ+125°C
• Capacitance up to 470 nF
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• DC voltage ratings up to 50 V
Applications
• High ripple current
• Critical timing
• Decoupling
• Transient voltage suppression
• Wireless charging
•ꢀ ResonantꢀLLCꢀconverters
• Power conversion
• Pulse circuits
One world. One KEMET
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
1
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Ordering Information
C
1206
C
104
J
3
J
A
C
TU
CaseꢀSizeꢀ Specification/ Capacitance
Capacitance RatedꢀVoltageꢀ
Failure Rate/
Design
Packaging/
Gradeꢀ(C-Spec)
Ceramic
Dielectric
J = U2J
Termination Finish3
(L"ꢀxꢀW")
Series1
Codeꢀ(pF)
Tolerance2
(VDC)
0402
0603
0805
1206
1210
1812
C =
Standard
Twoꢀsignificantꢀ
digitsꢀ+
number of
zeros.
Fꢀ=ꢀ±1%
8 = 10
4 = 16
3 = 25
5 = 50
A = N/A
C = 100% Matte Sn
See
"Packagingꢀ
C-Spec
Orderingꢀ
OptionsꢀTable"ꢀ
below
Gꢀ=ꢀ±2%
Jꢀ=ꢀ±5%
Kꢀ=ꢀ±10%
Mꢀ=ꢀ±20%
1 Flexible termination option is available. Please see FT-CAP product bulletin C1087_U2J_FT-CAP_SMD.
2 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Packaging C-Spec Ordering Options Table
Packaging/Grade
Packaging Type1
Ordering Code (C-Spec)
CommercialꢀGrade1
BulkꢀBag/Unmarked
7"ꢀReel/Unmarked
Notꢀrequiredꢀ(blank)
TU
7411ꢀ(EIAꢀ0603ꢀandꢀsmallerꢀcaseꢀsizes)
7210ꢀ(EIAꢀ0805ꢀandꢀlargerꢀcaseꢀsizes)
13"ꢀReel/Unmarked
7"ꢀReel/Unmarked/2ꢀmmꢀpitch2
13"ꢀReel/Unmarked/2ꢀmmꢀpitch2
7081
7082
AutomotiveꢀGrade3
7"ꢀReel
AUTO
AUTO7411ꢀ(EIAꢀ0603ꢀandꢀsmallerꢀcaseꢀsizes)
AUTO7210ꢀ(EIAꢀ0805ꢀandꢀlargerꢀcaseꢀsizes)
3190
13"ꢀReel/Unmarked
7"ꢀReel/Unmarked/2ꢀmmꢀpitch2
13"ꢀReel/Unmarked/2ꢀmmꢀpitch2
3191
1 Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.
1 The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors
that have not been laser marked. The option to laser mark is not available on these devices. For more information see "Capacitor Marking."
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information."
3 Reeling tape options (paper or plastic) are dependent on capacitor case size (l" x w") and thickness dimensions. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information."
3 For additional information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information."
3 All automotive packaging C-Specs listed exclude the option to laser mark components. The option to laser mark is not available on these devices.
For more information see "Capacitor Marking."
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Qualification/Certification
Commercialꢀgradeꢀproductsꢀareꢀsubjectꢀtoꢀinternalꢀqualification.ꢀDetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀ
referencedꢀinꢀTableꢀ4,ꢀPerformanceꢀ&ꢀReliability.
AutomotiveꢀgradeꢀproductsꢀmeetꢀorꢀexceedꢀtheꢀrequirementsꢀoutlinedꢀbyꢀtheꢀAutomotiveꢀElectronicsꢀCouncil.ꢀDetailsꢀ
regardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀtheꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQualificationꢀforꢀPassiveꢀ
Components.ꢀForꢀadditionalꢀinformationꢀregardingꢀtheꢀAutomotiveꢀElectronicsꢀCouncilꢀandꢀAEC–Q200,ꢀpleaseꢀvisitꢀtheirꢀ
website at www.aecouncil.com.
Environmental Compliance
Leadꢀ(Pb)-free,ꢀRoHS,ꢀandꢀREACHꢀcompliantꢀwithoutꢀexemptions.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Automotive C-Spec Information
KEMETꢀautomotiveꢀgradeꢀproductsꢀmeetꢀorꢀexceedꢀtheꢀrequirementsꢀoutlinedꢀbyꢀtheꢀAutomotiveꢀElectronicsꢀCouncil.ꢀ
DetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀdocumentꢀAEC–Q200,ꢀStressꢀTestꢀQuali ꢀcationꢀforꢀPassiveꢀ
Components.ꢀTheseꢀproductsꢀareꢀsupportedꢀbyꢀaꢀProductꢀChangeꢀNoti ꢀcationꢀ(PCN)ꢀandꢀProductionꢀPartꢀApprovalꢀProcessꢀ
warrant (PPAP).
AutomotiveꢀproductsꢀofferedꢀthroughꢀourꢀdistributionꢀchannelꢀhaveꢀbeenꢀassignedꢀanꢀinclusiveꢀorderingꢀcodeꢀC-Spec,ꢀ“AUTO.”ꢀ
ThisꢀC-Specꢀwasꢀdevelopedꢀinꢀorderꢀtoꢀbetterꢀserveꢀsmallꢀandꢀmedium-sizedꢀcompaniesꢀthatꢀpreferꢀanꢀautomotiveꢀgradeꢀ
componentꢀwithoutꢀtheꢀrequirementꢀtoꢀsubmitꢀaꢀcustomerꢀSourceꢀControlledꢀDrawingꢀ(SCD)ꢀorꢀspeci ꢀcationꢀforꢀreviewꢀbyꢀaꢀ
KEMETꢀengineeringꢀspecialist.ꢀThisꢀC-SpecꢀisꢀthereforeꢀnotꢀintendedꢀforꢀuseꢀbyꢀKEMETꢀOEMꢀautomotiveꢀcustomersꢀandꢀareꢀ
notꢀgrantedꢀtheꢀsameꢀ“privileges”ꢀasꢀotherꢀautomotiveꢀC-Specs.ꢀCustomerꢀPCNꢀapprovalꢀandꢀPPAPꢀrequestꢀlevelsꢀareꢀlimitedꢀ
(seeꢀdetailsꢀbelow.)
Product Change Notification (PCN)
TheꢀKEMETꢀProductꢀChangeꢀNoti ꢀcationꢀsystemꢀisꢀusedꢀtoꢀcommunicateꢀprimarilyꢀtheꢀfollowingꢀtypesꢀofꢀchanges:
ꢀ •ꢀProduct/processꢀchangesꢀthatꢀaffectꢀproductꢀform,ꢀ ꢀt,ꢀfunction,ꢀand/orꢀreliability
• Changes in manufacturing site
ꢀ •ꢀProductꢀobsolescence
Customer Notification Due To:
KEMET Automotive
C-Spec
Days Prior To
Implementation
Process/Productꢀchange
Obsolescence*
KEMETꢀassigned1
Yesꢀ(withꢀapprovalꢀandꢀsignꢀoff)
Yes
Yes
180ꢀdaysꢀminimum
90ꢀdaysꢀminimum
AUTO
Yes (without approval)
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
TheꢀpurposeꢀofꢀtheꢀProductionꢀPartꢀApprovalꢀProcessꢀis:
ꢀ •ꢀToꢀensureꢀthatꢀsupplierꢀcanꢀmeetꢀtheꢀmanufacturabilityꢀandꢀqualityꢀrequirementsꢀforꢀtheꢀpurchasedꢀparts.
ꢀ •ꢀToꢀprovideꢀtheꢀevidenceꢀthatꢀallꢀcustomerꢀengineeringꢀdesignꢀrecordsꢀandꢀspeci ꢀcationꢀrequirementsꢀareꢀproperlyꢀ
understoodꢀandꢀful ꢀlledꢀbyꢀtheꢀmanufacturingꢀorganization.
ꢀ •ꢀToꢀdemonstrateꢀthatꢀtheꢀestablishedꢀmanufacturingꢀprocessꢀhasꢀtheꢀpotentialꢀtoꢀproduceꢀtheꢀpart.
PPAP (Product Part Approval Process) Level
KEMET Automotive
C-Spec
1
●
○
2
3
●
○
4
5
KEMETꢀassigned1
●
●
●
AUTO
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer specification for review. For additional information contact KEMET.
●ꢀPartꢀnumberꢀspeci ꢀcꢀPPAPꢀavailable
○ꢀProductꢀfamilyꢀPPAPꢀonly
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Dimensions – Millimeters (Inches)
L
W
T
B
S
EIA Metric
Size Size
Code Code
S
L
W
Width
T
B
Mounting
Technique
Separation
Minimum
Length
Thickness
Bandwidth
Solderꢀreflowꢀ
0402
0603
0805
1206
1210
1812
1005
1608
2012
3216
3225
4532
1.00ꢀ(0.040)ꢀ±0.05ꢀ(0.002) 0.50ꢀ(0.020)ꢀ±0.05ꢀ(0.002)
1.60ꢀ(0.063)ꢀ±0.15ꢀ(0.006) 0.80ꢀ(0.032)ꢀ±0.15ꢀ(0.006)
2.00ꢀ(0.079)ꢀ±0.20ꢀ(0.008) 1.25ꢀ(0.049)ꢀ±0.20ꢀ(0.008)
3.20ꢀ(0.126)ꢀ±0.20ꢀ(0.008) 1.60ꢀ(0.063)ꢀ±0.20ꢀ(0.008)
3.20ꢀ(0.126)ꢀ±0.20ꢀ(0.008) 2.50ꢀ(0.098)ꢀ±0.20ꢀ(0.008)
4.50ꢀ(0.177)ꢀ±0.30ꢀ(0.012) 3.20ꢀ(0.126)ꢀ±0.30ꢀ(0.012)
0.30ꢀ(0.012)ꢀ±0.10ꢀ(0.004) 0.30 (0.012)
0.35ꢀ(0.014)ꢀ±0.15ꢀ(0.006) 0.70 (0.028)
only
Solderꢀwave
or
Solderꢀreflow
0.50ꢀ(0.02)ꢀ±0.25ꢀ(0.010)
0.50ꢀ(0.02)ꢀ±0.25ꢀ(0.010)
0.50ꢀ(0.02)ꢀ±0.25ꢀ(0.010)
0.60ꢀ(0.024)ꢀ±0.35ꢀ(0.014)
0.75 (0.030)
N/A
See Table 2
for thickness
Solderꢀreflowꢀ
only
Electrical Parameters/Characteristics
Item
Parameters/Characteristics
Operating Temperature Range
−55°Cꢀtoꢀ+125°Cꢀꢀ
−750ꢀ±120ꢀppm/°C
0.1%
CapacitanceꢀChangeꢀwithꢀReferenceꢀtoꢀ+25°Cꢀandꢀ0ꢀVDCꢀAppliedꢀ
(TCC)
AgingꢀRateꢀ(Maximumꢀ%ꢀCapacitanceꢀLoss/DecadeꢀHour)
DielectricꢀWithstandingꢀVoltageꢀ(DWV)
250%ꢀofꢀratedꢀvoltage
(5ꢀ±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50ꢀmA)
0.1%
DissipationꢀFactorꢀ(DF)ꢀMaximumꢀLimitꢀatꢀ25°C
1,000ꢀMΩꢀµFꢀorꢀ100ꢀGΩ
(Ratedꢀvoltageꢀappliedꢀforꢀ120ꢀ±5ꢀsecondsꢀatꢀ25°C)
InsulationꢀResistanceꢀ(IR)ꢀLimitꢀatꢀ25°C
To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Electrical Characteristics (Typical)
Capacitance vs. Temperature (TCC)
15
10
5
0
−5
−10
−15
−60
−40
−20
0
20
40
60
80
100
120
140
Tꢇꢍꢂꢇꢎꢁꢅꢏꢎꢇ ꢊꢐꢀꢌ
DCꢀ&ꢀACꢀBiasꢀEffectiveꢀCapacitance
0.0
0.00
−0.02
−0.04
−0.06
−0.08
−0.10
−0.1
−0.2
−0.3
−0.4
−0.5
0
5
10
15
20
25
0
5
10
15
20
25
ꢐꢁ Bꢂꢃꢄ ꢅꢆꢑꢒꢓ
ꢇ
ꢀꢁ Bꢂꢃꢄ ꢅꢆꢇ
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
RatedꢀDC
Capacitance Dissipation Factor
Capacitance
Shift
Insulation
Dielectric
U2J
Voltage
Value
(Maximum %)
Resistance
10% of Initial
limit
All
All
0.5
0.3%ꢀorꢀ±0.25ꢀpFꢀꢀ
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes)
Case Size/
Series
C0402C
C0603C
C0805C
C1206C
C1210C
C1812C
Cap
Code
Voltage Code
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
Capacitance
Rated Voltage (VDC)
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
100 pF
110 pF
120 pF
130 pF
150 pF
160 pF
180 pF
200 pF
220 pF
240 pF
270 pF
300 pF
330 pF
360 pF
390 pF
430 pF
470 pF
510 pF
560 pF
620 pF
680 pF
750 pF
820 pF
910 pF
1,000 pF
1,100 pF
1,200 pF
1,300 pF
1,500 pF
1,600 pF
1,800 pF
2,000 pF
2,200 pF
2,400 pF
2,700 pF
3,000 pF
3,300 pF
3,600 pF
3,900 pF
4,300 pF
4,700 pF
5,100 pF
5,600 pF
6,200 pF
6,800 pF
7,500 pF
8,200 pF
9,100 pF
10,000 pF
12,000 pF
101
111
121
131
151
161
181
201
221
241
271
301
331
361
391
431
471
511
561
621
681
751
821
911
102
112
122
132
152
162
182
202
222
242
272
302
332
362
392
432
472
512
562
622
682
752
822
912
103
123
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB BB CF CF CF CF
BB BB BB
BB BB BB
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN
CF CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB
CF CF CF DN DN DN DN EB EB EB EB FB FB FB FB
Rated Voltage (VDC)
Voltage Code
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
Capacitance Cap Code
Case Size/Series
C0402C
C0603C
C0805C
C1206C
C1210C
C1812C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 1A – Capacitance Range/Selection Waterfall (0402 – 1812 Case Sizes) cont'd
Case Size/
Series
C0402C
C0603C
C0805C
C1206C
C1210C
C1812C
Cap
Code
Voltage Code
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
Capacitance
Rated Voltage (VDC)
Capacitance
Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
15,000 pF
18,000 pF
22,000 pF
27,000 pF
33,000 pF
47,000 pF
47,000 pF
56,000 pF
68,000 pF
82,000 pF
100,000 pF
120,000 pF
150,000 pF
180,000 pF
220,000 pF
270,000 pF
330,000 pF
390,000 pF
470,000 pF
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
274
334
394
474
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
F
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
G
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
J
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
K M
CF CF CF
DN DN DN DN EB EB EB EB FB FB FB FB
DN DN DN DN EB EB EB EB FB FB FB FB
DN DN DN DP EB EB EB EB FB FB FB FB
DP DP DP DP EB EB EB EB FB FB FB FB
DP DP DP DG EB EB EB EB FB FB FB FB GB GB GB
DG DG DG DG EB EB EB EB FB FB FB FB GB GB GB
DG DG DG DG EB EB EB EB FB FB FB FB GB GB GB
DG DG DG
EB EB EB EC FB FB FB FB GB GB GB
EC EC EC EC FB FB FB FB GB GB GB
EC EC EC EE FB FB FB FB GB GB GB
EC EC EC EF FB FB FB FC GB GB GB
EF EF EF EH FC FC FC FE GB GB GB
EF EF EF EH FE FE FE FG GB GB GB
EH EH EH
EH EH EH
FG FG FG FG GB GB GB
FG FG FG FH GB GB GB
FH FH FH FM GB GB GB
FM FM FM
GC GC GC
GH GH GH
GK GK GK
Rated Voltage (VDC)
Voltage Code
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
5
8
4
3
Capacitance Cap Code
Case Size/Series
C0402C
C0603C
C0805C
C1206C
C1210C
C1812C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 2A – Chip Thickness/Tape & Reel Packaging Quantities
Paper Quantity1
Plastic Quantity
Thickness Case Thickness ±
Code
Size1 Range (mm)
7" Reel
13" Reel
7" Reel
13" Reel
BB
CF
DN
DP
DG
EB
EC
EE
EF
EH
FB
FC
FE
FG
FH
FM
FT
FI
0402
0603
0805
0805
0805
1206
1206
1206
1206
1206
1210
1210
1210
1210
1210
1210
1210
1210
1812
1812
1812
1812
0.50ꢀ±0.05
0.80ꢀ±0.07*
0.78ꢀ±0.10*
0.90ꢀ±0.10*
1.25ꢀ±0.15
0.78ꢀ±0.10
0.90ꢀ±0.10
1.10ꢀ±0.10
1.20ꢀ±0.15
1.60ꢀ±0.20
0.78ꢀ±0.10
0.90ꢀ±0.10
1.00ꢀ±0.10
1.25ꢀ±0.15
1.55ꢀ±0.15
1.70ꢀ±0.20
1.90ꢀ±0.20
2.10ꢀ±0.20*
1.00ꢀ±0.10
1.10ꢀ±0.10
1.40ꢀ±0.15
1.60ꢀ±0.20
10,000
4,000
4,000
4,000
50,000
15,000
15,000
15,000
0
0
0
0
0
0
0
0
0
0
2,500
4,000
4,000
2,500
2,500
2,000
4,000
4,000
2,500
2,500
2,000
2,000
2,000
1,500
1,000
1,000
1,000
1,000
10,000
10,000
10,000
10,000
10,000
8,000
10,000
10,000
10,000
10,000
8,000
8,000
8,000
7,000
4,000
4,000
4,000
4,000
4,000
10,000
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
GB
GC
GH
GK
7" Reel
13" Reel
7" Reel
13" Reel
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1
Plastic Quantity
Package quantity based on finished chip thickness specifications.
1 If ordering using the 2 mm tape and reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA 0603
(1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
Table 2B – Bulk Packaging Quantities
Loose Packaging
Packaging Type
BulkꢀBagꢀ(default)
Packaging C-Spec1
N/A2
Case Size
Packaging Quantities (pieces/unit packaging)
EIA (in)
Metric (mm)
Minimum
Maximum
0402
0603
0805
1206
1210
1812
1005
1608
2012
3216
3225
4532
50,000
20,000
1
1 The "Packaging C-Spec" is a 4 to 8 digit code which identifies the packaging type and/or product grade. When ordering, the proper code must be included
in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details. Commercial grade
product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk bag packaging option for
automotive grade products.
2 A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-static bulk bag and automotive grade products). The 15th
through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our standard "Bulk
Bag" packaging.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
EIA
Size
Code
Metric
Size
Code
C
Y
X
V1
V2
C
Y
X
V1
V2
C
Y
X
V1
V2
0402
0603
0805
1206
1210
12101
1812
1005
1608
2012
3216
3225
3225
4532
0.50
0.72
0.72
2.20
1.20
0.45
0.62
0.62
1.90
1.00
0.40
0.52
0.52
1.60
0.80
0.90
1.00
1.60
1.60
1.50
2.15
1.15
1.35
1.35
1.35
1.60
1.60
1.10
1.55
1.90
2.80
2.90
3.60
4.00
4.40
5.60
5.65
5.60
6.90
2.10
2.60
2.90
3.80
3.90
4.60
0.80
0.90
1.50
1.50
1.40
2.05
0.95
1.15
1.15
1.15
1.40
1.40
1.00
1.45
1.80
2.70
2.80
3.50
3.10
3.50
4.70
4.70
4.70
6.00
1.50
2.00
2.30
3.20
3.30
4.00
0.60
0.75
1.40
1.40
1.30
1.95
0.75
0.95
0.95
0.95
1.20
1.20
0.90
1.35
1.70
2.60
2.70
3.40
2.40
2.80
4.00
4.00
4.00
5.30
1.20
1.70
2.00
2.90
3.00
3.70
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations, the user should perform
qualification testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
V1
Y
Y
V2
X
X
C
C
Grid Placement Courtyard
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Soldering Process
Recommended Soldering Technique:
ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreflowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206
ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreflowꢀonly
Recommended Reflow Soldering Profile:
TheꢀKEMETꢀfamiliesꢀofꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀ(SMDꢀMLCCs)ꢀareꢀcompatibleꢀwithꢀwaveꢀ(singleꢀorꢀdual),ꢀ
convection,ꢀIRꢀorꢀvaporꢀphaseꢀreflowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀrecommendedꢀtoꢀavoidꢀextremeꢀthermalꢀ
stress.ꢀKEMET’sꢀrecommendedꢀprofileꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀreflowꢀreflectꢀtheꢀprofileꢀconditionsꢀofꢀtheꢀIPC/J-
STD-020ꢀstandardꢀforꢀmoistureꢀsensitivityꢀtesting.ꢀTheseꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreflowꢀpassesꢀatꢀ
theseꢀconditions.
Termination Finish
ꢀꢂ
ꢀL
tꢂ
Profile Feature
Maꢁimum ꢃamp Up ꢃate ꢄ ꢅꢆCꢇsecond
Maꢁimum ꢃamp Doꢈn ꢃate ꢄ ꢉꢆCꢇsecond
SnPb
100% Matte Sn
tL
Preheat/Soak
Temperature Minimum (TSmin
)
100°C
150°C
150°C
200°C
ꢀsmaꢁ
ꢀsmin
Temperature Maximum (TSmax
Time (tS) from TSmin to TSmax
)
ts
60ꢀ–ꢀ120ꢀseconds
60ꢀ–ꢀ120ꢀseconds
3°C/secondꢀ
maximum
3°C/secondꢀ
maximum
Ramp-Up Rate (TL to TP)
25
25ꢆC to ꢂeaꢊ
LiquidousꢀTemperatureꢀ(TL)
TimeꢀAboveꢀLiquidousꢀ(tL)
Peak Temperature (TP)
183°C
60ꢀ–ꢀ150ꢀseconds
235°C
217°C
60ꢀ–ꢀ150ꢀseconds
260°C
Tꢀꢁꢂ
TimeꢀWithinꢀ5°CꢀofꢀMaximumꢀ
20ꢀsecondsꢀ
maximum
30ꢀsecondsꢀ
maximum
Peak Temperature (tP)
6°C/secondꢀ
maximum
6°C/secondꢀ
maximum
Ramp-Down Rate (TP to TL)
Timeꢀ25°CꢀtoꢀPeakꢀ
6 minutes maximum 8 minutes maximum
Temperature
Note: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reflow.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Table 4 – Performance & Reliability: Test Methods and Conditions
Stress
Reference
Test or Inspection Method
Package Size (L" x W")
Force
Duration
Terminal Strength
JIS-C-6429
Appendixꢀ1,ꢀNote:
0402
0603
5 N (0.51 kg)
10 N (1.02 kg) 60ꢀseconds
≥ꢀ0805
18 N (1.83 kg)
BoardꢀFlex
JIS-C-6429
J-STD-002
Appendixꢀ2,ꢀNote:ꢀ3.0ꢀmmꢀ(minimum).
Magnificationꢀ50ꢀXꢀConditions:
a)ꢀMethodꢀB,ꢀ4ꢀhoursꢀatꢀ155°C,ꢀdryꢀheatꢀatꢀ235°C
b)ꢀMethodꢀBꢀatꢀ215°C,ꢀcategoryꢀ3
Solderability
c)ꢀMethodꢀDꢀatꢀ260°C,ꢀcategoryꢀ3
Temperature Cycling
JESD22ꢀMethodꢀJA-104
MIL-STD-202ꢀMethodꢀ103
1,000ꢀcyclesꢀ(−55°Cꢀtoꢀ+125°C).ꢀMeasurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.
Loadꢀhumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀratedꢀvoltage.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ
Measurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.
Lowꢀvoltꢀhumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀ1.5ꢀV.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ
Measurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀtestꢀconclusion.
tꢀ=ꢀ24ꢀhours/cycle.ꢀStepsꢀ7aꢀandꢀ7bꢀnotꢀrequired.ꢀMeasurementꢀatꢀ24ꢀhoursꢀ±4ꢀhoursꢀafterꢀ
test conclusion.
BiasedꢀHumidity
Moisture Resistance MIL-STD-202ꢀMethodꢀ106
−55°C/+125°C.ꢀNote:ꢀNumberꢀofꢀcyclesꢀrequiredꢀ–ꢀ300.ꢀMaximumꢀtransferꢀtimeꢀ–ꢀ20ꢀ
Thermal Shock
HighꢀTemperatureꢀLife
StorageꢀLife
MIL-STD-202ꢀMethodꢀ107
seconds.ꢀDwellꢀtimeꢀ–ꢀ15ꢀminutes.ꢀAirꢀ–ꢀair.
MIL-STD-202
Methodꢀ108/EIAꢀ-198
1,000ꢀhoursꢀatꢀ125°Cꢀwithꢀ2ꢀXꢀratedꢀvoltageꢀapplied.
MIL-STD-202ꢀMethodꢀ108 125°C,ꢀ0ꢀVDCꢀforꢀ1,000ꢀhours.
5ꢀG'sꢀforꢀ20ꢀminutes,ꢀ12ꢀcyclesꢀeachꢀofꢀ3ꢀorientations.ꢀNote:ꢀUseꢀ8"ꢀXꢀ5"ꢀPCBꢀ0.031"ꢀthickꢀ
MIL-STD-202ꢀMethodꢀ204 7ꢀsecureꢀpointsꢀonꢀoneꢀlongꢀsideꢀandꢀ2ꢀsecureꢀpointsꢀatꢀcornersꢀofꢀoppositeꢀsides.ꢀPartsꢀ
mountedꢀwithinꢀ2"ꢀfromꢀanyꢀsecureꢀpoint.ꢀTestꢀfromꢀ10ꢀ–ꢀ2,000ꢀHz.
Vibration
Mechanical Shock
MIL-STD-202ꢀMethodꢀ213 Figureꢀ1ꢀofꢀMethodꢀ213,ꢀConditionꢀF.
Resistance to Solvents MIL-STD-202ꢀMethodꢀ215 Addꢀaqueousꢀwashꢀchemical,ꢀOKEMꢀcleanꢀorꢀequivalent.ꢀꢀ
Storage and Handling
Ceramicꢀchipꢀcapacitorsꢀshouldꢀbeꢀstoredꢀinꢀnormalꢀworkingꢀenvironments.ꢀWhileꢀtheꢀchipsꢀthemselvesꢀareꢀquiteꢀrobustꢀinꢀ
otherꢀenvironments,ꢀsolderabilityꢀwillꢀbeꢀdegradedꢀbyꢀexposureꢀtoꢀhighꢀtemperatures,ꢀhighꢀhumidity,ꢀcorrosiveꢀatmospheres,ꢀ
andꢀlongꢀtermꢀstorage.ꢀInꢀaddition,ꢀpackagingꢀmaterialsꢀwillꢀbeꢀdegradedꢀbyꢀhighꢀtemperatureꢀ–ꢀreelsꢀmayꢀsoftenꢀorꢀwarpꢀ
andꢀtapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40°Cꢀandꢀmaximumꢀ
storageꢀhumidityꢀnotꢀexceedꢀ70%ꢀrelativeꢀhumidity.ꢀTemperatureꢀfluctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀ
theꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀchlorineꢀandꢀsulfurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀ
shouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀ1.5ꢀyearsꢀofꢀreceipt.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Construction
Detailed Cross Section
Dielectric Material
(CaZrO3)
Barrier Layer
(Ni)
Dielectric
Material (CaZrO3)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
End Termination/
External Electrode
(Cu)
Barrier Layer
(Ni)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Capacitor Marking (Optional):
Laserꢀmarkingꢀoptionꢀisꢀnotꢀavailableꢀon:
•ꢀ C0G,ꢀU2J,ꢀUltraꢀStableꢀX8R,ꢀandꢀY5Vꢀdielectricꢀdevices
•ꢀ EIAꢀ0402ꢀcaseꢀsizeꢀdevices
•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀflexibleꢀterminationꢀoption
•ꢀ KPSꢀcommercialꢀandꢀautomotiveꢀgradeꢀstackedꢀdevices
Theseꢀcapacitorsꢀareꢀsuppliedꢀunmarkedꢀonly.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Tape & Reel Packaging Information
KEMETꢀoffersꢀmultilayerꢀceramicꢀchipꢀcapacitorsꢀpackagedꢀinꢀ8,ꢀ12ꢀandꢀ16ꢀmmꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀ
EIAꢀStandardꢀ481.ꢀThisꢀpackagingꢀsystemꢀisꢀcompatibleꢀwithꢀallꢀtape-fedꢀautomaticꢀpickꢀandꢀplaceꢀsystems.ꢀSeeꢀTableꢀ2ꢀforꢀ
detailsꢀonꢀreelingꢀquantitiesꢀforꢀcommercialꢀchips.
ꢑar code laꢈel
Antiꢆstatic reel
®
ꢇmꢈossed plasticꢉ or
punched paper carrierꢃ
Chip and ꢍꢎS orientation in pocꢌet
(eꢋcept 1ꢀ25 commercial, and 1ꢀ25 and 2225 Military)
KEMET
Sprocꢌet holes
ꢇmꢈossment or punched cavity
ꢀ mm, 12 mm
or 1ꢁ mm carrier tape
Antiꢆstatic cover tape
(0ꢃ10 mm (0ꢃ00ꢊꢄ) maꢋimum thicꢌness)
1ꢂꢀ mm (ꢂꢃ00ꢄ)
or
ꢅꢅ0 mm (1ꢅꢃ00ꢄ)
ꢉꢇꢏA 01005, 0201, 0ꢊ02 and 0ꢁ0ꢅ case siꢐes availaꢈle on punched paper carrier onlyꢃ
Table 5 – Carrier Tape Configuration, Embossed Plastic & Punched Paper (mm)
New 2 mm Pitch Reel Options*
Embossed Plastic Punched Paper
Tape
Packaging
Ordering Code
(C-Spec)
C-3190
7"ꢀReel 13"ꢀReel 7"ꢀReel 13"ꢀReel
EIA Case Size Size
(W)*
Packaging Type/Options
Pitch (P1)* Pitch (P1)*
01005 – 0402
0603
8
8
2
2
2/4
4
Automotiveꢀgradeꢀ7"ꢀreelꢀunmarked
Automotiveꢀgradeꢀ13"ꢀreelꢀunmarked
Commercialꢀgradeꢀ7"ꢀreelꢀunmarked
Commercialꢀgradeꢀ13"ꢀreelꢀunmarked
C-3191
2/4
4
C-7081
0805
8
4
4
4
C-7082
1206 – 1210
1805 – 1808
≥ꢀ1812
8
4
4
4
4
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
12
12
12
16
8
4
8
8
Benefits of Changing from 4 mm to 2 mm Pitching Spacing
•ꢀ Lowerꢀplacementꢀcosts.
• Double the parts on each reel results in fewer reel
changesꢀandꢀincreasedꢀe ꢀꢀciency.
•ꢀ Fewerꢀreelsꢀresultꢀinꢀlowerꢀpackaging,ꢀshippingꢀandꢀ
storageꢀcosts,ꢀreducingꢀwaste.
KPS 1210
8
8
KPS 1812
andꢀ2220
12
4
12
4
Array 0612
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance specifications.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
ꢁ
ꢁ2
ꢀ2
ꢎ10 pitches cumulative
tolerance on tape ꢏ0ꢈ2 mmꢐ
ꢊ1
ꢀ0
ꢉD0
A0
ꢂ
ꢅ0
ꢃ
ꢊ2
ꢄ1
ꢄ0
S1
ꢀ1
ꢁ1
Cover ꢁape
ꢊmꢇossment
ꢂor cavity siꢋe,
see ꢌote 1 ꢁaꢇle ꢍ
Center Lines of Cavity
ꢉD1
ꢄ1 is for tape feeder reference only,
includinꢆ draft concentric aꢇout ꢄ0ꢈ
Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
D1 Minimum
Note 1
1.0
(0.039)
R Reference S1 Minimum
T
T1
TapeꢀSize
8 mm
D0
E1
P0
P2
Note 2
Note 3
Maximum Maximum
25.0
(0.984)
1.5ꢀ+0.10/−0.0ꢀ
(0.059ꢀ+0.004/−0.0)
1.75ꢀ±0.10ꢀ
4.0ꢀ±0.10ꢀ
2.0ꢀ±0.05
0.600
(0.024)
0.600
(0.024)
0.100
(0.004)
12 mm
16 mm
(0.069ꢀ±0.004) (0.157ꢀ±0.004) (0.079ꢀ±0.002)
1.5
(0.059)
30
(1.181)
Variable Dimensions — Millimeters (Inches)
B1 Maximum
Note 4
E2
T2
W
TapeꢀSize
8 mm
Pitch
F
P1
A0,B0ꢀ&ꢀK0
Minimum
6.25
(0.246)
Maximum Maximum
2.5
(0.098)
4.35
(0.171)
3.5ꢀ±0.05ꢀ
(0.138ꢀ±0.002) (0.157ꢀ±0.004)
4.0ꢀ±0.10
8.3
(0.327)
Single (4 mm)
Single (4 mm)
8.2
10.25
5.5ꢀ±0.05ꢀ
8.0ꢀ±0.10
4.6
12.3
12 mm
16 mm
Note 5
andꢀDoubleꢀ(8ꢀmm)
(0.323)
(0.404)
(0.217ꢀ±0.002) (0.315ꢀ±0.004)
(0.181)
(0.484)
12.1
(0.476)
14.25
(0.561)
7.5ꢀ±0.05 12.0ꢀ±0.10
(0.138ꢀ±0.002)ꢀ (0.157ꢀ±0.004)ꢀ
4.6
(0.181)
16.3
(0.642)
Triple (12 mm)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
ꢀ
ꢋ10 pitches cumulative
tolerance on tape ꢌ0ꢍ2 mmꢎ
ꢃ1
ꢁo
ꢂDo
A0
ꢄ
ꢅ
ꢃ2
ꢆ0
ꢁ1
ꢆottom Cover ꢀape
G
Cavity Siꢇe,
See
ꢀ1
ꢀ1
Center Lines of Cavity
ꢀop Cover ꢀape
ꢈote 1, ꢀaꢉle ꢊ
ꢆottom Cover ꢀape
Uꢀꢁꢂ ꢃꢄꢂꢁꢅꢆꢄꢇꢈ ꢇꢉ Uꢈꢂꢁꢁꢊꢄꢈꢋ
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
R Reference
Note 2
TapeꢀSize
D0
E1
P0
P2
T1 Maximum
G Minimum
0.10
1.5ꢀ+0.10ꢀ-0.0ꢀ
(0.059ꢀ+0.004ꢀ-0.0)
1.75ꢀ±0.10ꢀ
(0.069ꢀ±0.004)
4.0ꢀ±0.10ꢀ
(0.157ꢀ±0.004)
2.0ꢀ±0.05ꢀ
(0.079ꢀ±0.002)
0.75
(0.030)
25
(0.984)
8 mm
(0.004)
maximum
Variable Dimensions — Millimeters (Inches)
TapeꢀSize
8 mm
Pitch
E2 Minimum
F
P1
T Maximum
W Maximum
A0 B0
2.0ꢀ±0.05ꢀ
(0.079ꢀ±0.002)
ꢀ4.0ꢀ±0.10ꢀ
(0.157ꢀ±0.004)
8.3
(0.327)
8.3
(0.327)
Half (2 mm)
Single (4 mm)
6.25
(0.246)
3.5ꢀ±0.05ꢀ
(0.138ꢀ±0.002)
1.1
(0.098)
Note 1
8 mm
1. The cavity defined by A0, B0 and T shall surround the component with sufficient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force: 1.0 kg minimum.
2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ
Tape Width
8 mm
Peel Strength
0.1 to 1.0 Newton (10 to 100 gf)
0.1 to 1.3 Newton (10 to 130 gf)
12ꢀandꢀ16ꢀmm
Theꢀdirectionꢀofꢀtheꢀpullꢀshallꢀbeꢀoppositeꢀtheꢀdirectionꢀofꢀtheꢀcarrierꢀtapeꢀtravel.ꢀTheꢀpullꢀangleꢀofꢀtheꢀcarrierꢀtapeꢀshallꢀbeꢀ
165°ꢀtoꢀ180°ꢀfromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ
300ꢀ±10ꢀmm/minute.
3. Labeling:ꢀBarꢀcodeꢀlabelingꢀ(standardꢀorꢀcustom)ꢀshallꢀbeꢀonꢀtheꢀsideꢀofꢀtheꢀreelꢀoppositeꢀtheꢀsprocketꢀholes.ꢀRefer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
°
T
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Typical Pocket Centerline
Tape
Maximum
°
°
T
s
Width (mm) Rotation (
)
8,12
16 – 200
20
10
Bo
Tape
Maximum
°
S
Width (mm) Rotation (
)
8,12
16 – 56
72 – 200
20
10
5
Typical Component Centerline
Ao
Figure 4 – Maximum Lateral Movement
Figure 5 – Bending Radius
Embossed
Carrier
Punched
Carrier
8 mm & 12 mm Tape
16 mm Tape
0.5 mm maximum
0.5 mm maximum
1.0 mm maximum
1.0 mm maximum
R
Bending
Radius
R
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 6 – Reel Dimensions
ꢁull ꢂadius,
ꢌꢍ (ꢇncludes
flanꢎe distortion
at outer edꢎe)
Access ꢄole at
Slot Location
(ꢅ ꢆ0 mm minimum)
See ꢀote
ꢌ2 (Measured at huꢏ)
D
(See ꢀote)
A
ꢀ
C
(Arꢏor hole
ꢌ1 (Measured at huꢏ)
diameter)
ꢇf present,
tape slot in core
for tape startꢈ
2ꢉ5 mm minimum ꢊidth ꢋ
10ꢉ0 mm minimum depth
ꢃ
(see ꢀote)
ꢀoteꢈ Drive spoꢐes optionalꢑ if used, dimensions ꢃ and D shall applyꢉ
Table 8 – Reel Dimensions
Metric will govern
Constant Dimensions — Millimeters (Inches)
TapeꢀSize
8 mm
A
B Minimum
C
D Minimum
178ꢀ±0.20ꢀ
(7.008ꢀ±0.008)ꢀ
or
1.5
(0.059)
13.0ꢀ+0.5/−0.2ꢀ
(0.521ꢀ+0.02/−0.008)
20.2
(0.795)
12 mm
16 mm
330ꢀ±0.20
(13.000ꢀ±0.008)
Variable Dimensions — Millimeters (Inches)
TapeꢀSize
N Minimum
W1
W2 Maximum
W3
8.4ꢀ+1.5/−0.0
(0.331ꢀ+0.059/−0.0)
14.4
(0.567)
8 mm
50
(1.969)
12.4ꢀ+2.0/−0.0
18.4
Shallꢀaccommodateꢀtapeꢀ
widthꢀwithoutꢀinterference
12 mm
16 mm
(0.488ꢀ+0.078/−0.0)ꢀꢀ
(0.724)
16.4ꢀ+2.0/−0.0
(0.646ꢀ+0.078/−0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
ꢅmꢋossed Carrier
Carrier ꢀape
ꢉunched Carrier
ꢊ mm & 12 mm only
ꢂound Sprocꢃet ꢄoles
ꢃTꢄꢅT
ꢀꢁꢂ
ꢀop Cover ꢀape
ꢅlonꢆated Sprocꢃet ꢄoles
(ꢇ2 mm tape and ꢈider)
100 mm
minimum Leader
ꢌ00 mm minimum
ꢀrailer
Components
1ꢁ0 mm minimum
ꢀop Cover ꢀape
Figure 8 – Maximum Camber
ꢆlonꢅated Sprocꢂet ꢃoles
(ꢇ2 mm & ꢈider tapes)
Carrier ꢀape
ꢁound Sprocꢂet ꢃoles
1 mm maꢄimum, either direction
Straiꢅht ꢆdꢅe
250 mm
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
19
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
U2J Dielectric, 10 – 50 VDC (Commercial & Automotive Grade)
KEMET Electronics Corporation Sales Offices
Forꢀaꢀcompleteꢀlistꢀofꢀourꢀglobalꢀsalesꢀo ꢀꢀces,ꢀpleaseꢀvisitꢀwww.kemet.com/sales.
Disclaimer
Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀ
checkingꢀandꢀverifyingꢀtheꢀextentꢀtoꢀwhichꢀtheꢀInformationꢀcontainedꢀinꢀthisꢀpublicationꢀisꢀapplicableꢀtoꢀanꢀorderꢀatꢀtheꢀtimeꢀtheꢀorderꢀisꢀplaced.
AllꢀInformationꢀgivenꢀhereinꢀisꢀbelievedꢀtoꢀbeꢀaccurateꢀandꢀreliable,ꢀbutꢀitꢀisꢀpresentedꢀwithoutꢀguarantee,ꢀwarranty,ꢀorꢀresponsibilityꢀofꢀanyꢀkind,ꢀexpressedꢀorꢀimplied.
StatementsꢀofꢀsuitabilityꢀforꢀcertainꢀapplicationsꢀareꢀbasedꢀonꢀKEMETꢀElectronicsꢀCorporation’sꢀ(“KEMET”)ꢀknowledgeꢀofꢀtypicalꢀoperatingꢀconditionsꢀforꢀsuchꢀ
applications,ꢀbutꢀareꢀnotꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀ
TheꢀInformationꢀisꢀintendedꢀforꢀuseꢀonlyꢀbyꢀcustomersꢀwhoꢀhaveꢀtheꢀrequisiteꢀexperienceꢀandꢀcapabilityꢀtoꢀdetermineꢀtheꢀcorrectꢀproductsꢀforꢀtheirꢀapplication.ꢀAnyꢀ
technicalꢀadviceꢀinferredꢀfromꢀthisꢀInformationꢀorꢀotherwiseꢀprovidedꢀbyꢀKEMETꢀwithꢀreferenceꢀtoꢀtheꢀuseꢀofꢀKEMET’sꢀproductsꢀisꢀgivenꢀgratis,ꢀandꢀKEMETꢀassumesꢀnoꢀ
obligationꢀorꢀliabilityꢀforꢀtheꢀadviceꢀgivenꢀorꢀresultsꢀobtained.
AlthoughꢀKEMETꢀdesignsꢀandꢀmanufacturesꢀitsꢀproductsꢀtoꢀtheꢀmostꢀstringentꢀqualityꢀandꢀsafetyꢀstandards,ꢀgivenꢀtheꢀcurrentꢀstateꢀofꢀtheꢀart,ꢀisolatedꢀcomponentꢀ
failuresꢀmayꢀstillꢀoccur.ꢀAccordingly,ꢀcustomerꢀapplicationsꢀwhichꢀrequireꢀaꢀhighꢀdegreeꢀofꢀreliabilityꢀorꢀsafetyꢀshouldꢀemployꢀsuitableꢀdesignsꢀorꢀotherꢀsafeguardsꢀ
(suchꢀasꢀinstallationꢀofꢀprotectiveꢀcircuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀ
propertyꢀdamage.
Althoughꢀallꢀproduct–relatedꢀwarnings,ꢀcautionsꢀandꢀnotesꢀmustꢀbeꢀobserved,ꢀtheꢀcustomerꢀshouldꢀnotꢀassumeꢀthatꢀallꢀsafetyꢀmeasuresꢀareꢀindictedꢀorꢀthatꢀotherꢀ
measuresꢀmayꢀnotꢀbeꢀrequired.
KEMET is a registered trademark of KEMET Electronics Corporation.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com
C1086_U2J • 2/28/2018
20
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