C1210C823KARACTU_技术文档

SurfaceꢀMountꢀMultilayerꢀCeramicꢀChipꢀCapacitorsꢀ(SMDꢀMLCCs)

Telecom “Tip and Ring,” X7R Dielectric, 250 VDC

(Commercial Grade)

Overview

KEMET’sꢀ250VꢀDCꢀTipꢀandꢀRingꢀMLCCsꢀinꢀX7Rꢀdielectricꢀareꢀ

designedꢀandꢀratedꢀforꢀtelecommunicationꢀringerꢀcircuitsꢀ

whereꢀtheꢀcapacitorꢀisꢀusedꢀtoꢀblockꢀ-48Vꢀtoꢀ-52VꢀDCꢀofꢀlineꢀ

voltageꢀandꢀpassꢀaꢀ16-25ꢀHzꢀACꢀsignalꢀpulseꢀofꢀ70ꢀVrmsꢀ

toꢀ90ꢀVrms.ꢀServingꢀasꢀanꢀexcellentꢀreplacementꢀforꢀhighꢀ

voltageꢀleadedꢀﬁlmꢀdevices,ꢀtheseꢀsmallerꢀsurfaceꢀmountꢀ

technologyꢀfootprintsꢀsaveꢀvaluableꢀboardꢀspaceꢀwhichꢀisꢀ

criticalꢀwhenꢀcreatingꢀnewꢀdesigns.ꢀ

Componentsꢀofꢀthisꢀclassiﬁcationꢀareꢀﬁxed,ꢀceramicꢀdielectricꢀ

capacitorsꢀsuitedꢀforꢀbypassꢀandꢀdecouplingꢀapplicationsꢀorꢀ

forꢀfrequencyꢀdiscriminatingꢀcircuitsꢀwhereꢀQꢀandꢀstabilityꢀofꢀ

capacitanceꢀcharacteristicsꢀareꢀnotꢀcritical.ꢀX7Rꢀdielectricꢀ

exhibitsꢀaꢀpredictableꢀchangeꢀinꢀcapacitanceꢀwithꢀrespectꢀtoꢀ

timeꢀandꢀvoltageꢀandꢀboastsꢀaꢀminimalꢀchangeꢀinꢀcapacitanceꢀ

withꢀreferenceꢀtoꢀambientꢀtemperature.ꢀCapacitanceꢀchangeꢀisꢀ

limitedꢀtoꢀ±15%ꢀfromꢀ−55°Cꢀtoꢀ+125°C.ꢀ

KEMETꢀTipꢀandꢀRingꢀcapacitorsꢀfeatureꢀaꢀ125°Cꢀ

Theseꢀdevicesꢀareꢀableꢀtoꢀwithstandꢀtoday’sꢀhigherꢀlead-

freeꢀreﬂowꢀprocessingꢀtemperaturesꢀandꢀofferꢀsuperiorꢀhighꢀ

frequencyꢀﬁlteringꢀcharacteristicsꢀandꢀlowꢀESR.

maximumꢀoperatingꢀtemperatureꢀandꢀareꢀconsideredꢀ

“temperatureꢀstable.”ꢀTheꢀElectronicsꢀIndustriesꢀAllianceꢀ

(EIA)ꢀcharacterizesꢀX7RꢀdielectricꢀasꢀaꢀClassꢀIIꢀmaterial.ꢀ

Beneﬁts

•ꢀ −55°Cꢀtoꢀ+125°Cꢀoperatingꢀtemperatureꢀrange

• Lead (Pb)-free, RoHS and REACH compliant

• EIA 0805, 1206, 1210, 1812, 1825, 2220,and

2225 case sizes

•ꢀ DCꢀvoltageꢀratingꢀofꢀ250ꢀV

•ꢀ Capacitanceꢀofferingsꢀrangingꢀfromꢀ1,000ꢀpFꢀtoꢀ6.8ꢀμF

• Available capacitance tolerances of ±10% and ±20%

•ꢀ Non-polarꢀdevice,ꢀminimizingꢀinstallationꢀconcerns

•ꢀ 100%ꢀpureꢀmatteꢀtin-platedꢀterminationꢀﬁnishꢀthatꢀallowsꢀ

for excellent solderability

•ꢀ SnPbꢀterminationꢀﬁnishꢀoptionꢀavailableꢀuponꢀrequestꢀ

(5%ꢀPbꢀminimum)

•ꢀ Flexibleꢀterminationꢀoptionꢀavailableꢀuponꢀrequest

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Ordering Information

C

1825

C

105

K

A

R

A

C

TU

Rated

Voltageꢀ Dielectric

(VDC)

Failure

Rate/

Design

Case Size Speciﬁcation/ Capacitance Capacitance

Packaging/

Grade (C-Spec)

Ceramic

TerminationꢀFinish¹

(L" x W")

Series

Codeꢀ(pF)

Tolerance

0805

1206

1210

1812

1825

2220

2225

C = Standard

Xꢀ=ꢀFlexibleꢀ

Termination

Two

J = ±5%

K = ±10%

M = ±20%

A = 250

R = X7R

A = N/A C = 100% Matte Sn

Lꢀ=ꢀSnPbꢀ(5%ꢀPbꢀminimum)

See

"Packagingꢀ

C-Spec

Orderingꢀ

Options Table"

below

signiﬁcantꢀ

digitsꢀ+ꢀ

numberꢀofꢀ

zeros

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

One world. One KEMET

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Packaging C-Spec Ordering Options Table

Packaging/Grade

Packaging Type¹

Ordering Code (C-Spec)

BulkꢀBag/Unmarked

7"ꢀReel/Unmarked

Notꢀrequiredꢀ(Blank)

TU

7411 (EIA 0603 and smaller case sizes)

13"ꢀReel/Unmarked

7" Reel/Marked

7210ꢀ(EIAꢀ0805ꢀandꢀlargerꢀcaseꢀsizes)

TM

7040 (EIA 0603 and smaller case sizes)

13" Reel/Marked

7215ꢀ(EIAꢀ0805ꢀandꢀlargerꢀcaseꢀsizes)

7"ꢀReel/Unmarked/2mmꢀpitch²

13"ꢀReel/Unmarked/2mmꢀpitch²

7081

7082

¹Default packaging is "Bulk Bag". An ordering code C-Spec is not required for "Bulk Bag" packaging.

¹The terms "Marked" and "Unmarked" pertain to laser marking option of capacitors. All packaging options labeled as "Unmarked" will contain capacitors

that have not been laser marked. Please contact KEMET if you require a laser marked option. For more information see "Capacitor Marking".

²The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case

size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".

Applications

Typicalꢀapplicationsꢀincludeꢀtelecommunicationꢀringingꢀcircuits,ꢀswitchꢀmodeꢀpowerꢀsupplyꢀsnubberꢀcircuits,ꢀhighꢀvoltageꢀ

DCꢀblockingꢀandꢀhighꢀvoltageꢀcoupling.ꢀMarketsꢀincludeꢀtelephoneꢀlines,ꢀanalogꢀandꢀdigitalꢀmodems,ꢀfacsimileꢀmachines,ꢀ

wirelessꢀbaseꢀstations,ꢀcableꢀandꢀdigitalꢀvideoꢀrecordingꢀset-topꢀboxes,ꢀsatelliteꢀdishes,ꢀhighꢀvoltageꢀpowerꢀsupply,ꢀDC/DCꢀ

converters,ꢀandꢀEthernet,ꢀPOSꢀandꢀATMꢀhardware.

Qualiﬁcation/Certiﬁcation

CommercialꢀGradeꢀproductsꢀareꢀsubjectꢀtoꢀinternalꢀqualiﬁcation.ꢀDetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀ

referenced in Table 4, Performance & Reliability.

Environmental Compliance

Leadꢀ(Pb)-free,ꢀRoHS,ꢀandꢀREACHꢀcompliantꢀwithoutꢀexemptionsꢀ(excludingꢀSnPbꢀterminationꢀﬁnishꢀoption).

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Dimensions – Millimeters (Inches) – Standard Termination

L

W

T

B

S

EIA Size

Code

Metric Size

Code

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

2.00 (0.079)

±0.20 (0.008)

3.20 (0.126)

±0.20 (0.008)

3.20 (0.126)

±0.20 (0.008)

4.50 (0.177)

±0.30 (0.012)

4.50 (0.177)

±0.30 (0.012)

5.70 (0.224)

±0.40 (0.016)

5.60 (0.220)

±0.40 (0.016)

1.25 (0.049)

±0.20 (0.008)

1.60 (0.063)

±0.20 (0.008)

2.50 (0.098)

±0.20 (0.008)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

6.40 (0.248)

±0.40 (0.016)

0.50 (0.02)

±0.25 (0.010)

0.50 (0.02)

±0.25 (0.010)

0.50 (0.02)

±0.25 (0.010)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0.60 (0.024)

±0.35 (0.014)

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

0.75 (0.030)

Solder Wave or

SolderꢀReﬂow

See Table 2 for

Thickness

N/A

SolderꢀReﬂowꢀ

Only

Dimensions – Millimeters (Inches) – Flexible Termination

S

EIA Size

Code

Metric Size

Code

T

Mounting

Technique

L Length

W Width

B Bandwidth Separation

Minimum

Thickness

2.00 (0.079)

±0.30 (0.012)

3.30 (0.130)

±0.40 (0.016)

3.30 (0.130)

±0.40 (0.016)

4.50 (0.178)

±0.40 (0.016)

4.60 (0.181)

±0.40 (0.016)

5.90 (0.232)

±0.75 (0.030)

5.90 (0.232)

±0.75 (0.030)

1.25 (0.049)

±0.30 (0.012)

1.60 (0.063)

±0.35(0.013)

2.60(0.102)

±0.30(0.012)

3.20 (0.126)

±0.30 (0.012)

6.40 (0.252)

±0.40 (0.016)

5.00 (0.197)

±0.40 (0.016)

6.40 (0.248)

±0.40 (0.016)

0.50 (0.02)

0.75 (0.030)

±0.25 (0.010)

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

Solder Wave or

SolderꢀReﬂow

0.60 (0.024)

±0.25 (0.010)

0.60 (0.024)

±0.25 (0.010)

0.70 (0.028)

See Table 2 for

Thickness

±0.35 (0.014)

0.70 (0.028)

N/A

SolderꢀReﬂowꢀ

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

0.70 (0.028)

±0.35 (0.014)

Only

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

OperatingꢀTemperatureꢀRange

−55°Cꢀtoꢀ+125°Cꢀꢀ

CapacitanceꢀChangeꢀwithꢀReferenceꢀto

+25°Cꢀandꢀ0ꢀVdcꢀAppliedꢀ(TCC)

±15%

¹AgingꢀRateꢀ(Maximumꢀ%ꢀCapacitanceꢀLoss/DecadeꢀHour)

²DielectricꢀWithstandingꢀVoltageꢀ(DWV)ꢀ

3.0%

250%ꢀofꢀratedꢀvoltage

(5±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50mA)

³DissipationꢀFactorꢀ(DF)ꢀMaximumꢀLimitꢀatꢀ25°C

5%(6.3Vꢀ&ꢀ10V),ꢀ3.5%(16Vꢀ&ꢀ25V)ꢀandꢀ2.5%(50Vꢀtoꢀ250V)

SeeꢀInsulationꢀResistanceꢀLimitꢀTable

(Ratedꢀvoltageꢀappliedꢀforꢀ120±5ꢀsecondsꢀatꢀ25°C)

⁴InsulationꢀResistanceꢀ(IR)ꢀMinimumꢀLimitꢀatꢀ25°C

¹Regarding Aging Rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

²DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the

capacitor.

³Capacitance and dissipation factor (DF) measured under the following conditions:

1kHz ± 50Hz and 1.0 ± 0.2 Vrms if capacitance ≤10µF

120Hz ± 10Hz and 0.5 ± 0.1 Vrms if capacitance >10µF

⁴To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON".

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Capacitance DissipationꢀFactorꢀ Capacitance

Insulationꢀ

Dielectric

X7R

Voltage

Value

(Maximumꢀ%)ꢀ

Shiftꢀ

Resistance

> 25

16/25

< 16

3.0

5.0

7.5

10% of Initial

Limit

All

±20%

Insulation Resistance Limit Table

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

<ꢀ0.012ꢀµF

<ꢀ0.047ꢀµF

<ꢀꢀ0.15ꢀµFꢀ

<ꢀ0.47ꢀµF

<ꢀ0.39ꢀµF

ALL

≥ꢀ0.012ꢀµF

≥ꢀ0.047ꢀµF

≥ꢀ0.15ꢀµF

≥ꢀ0.47ꢀµF

≥ꢀ0.39ꢀµF

N/A

<ꢀ2.2ꢀµF

ALL

≥ꢀ2.2ꢀµF

N/A

<ꢀ10ꢀµF

ALL

≥ꢀ10ꢀµF

N/A

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes)

Case Size/

C0805C C1206C C1210C C1812C C1825C C2220C C2225C

Series

Capacitance

Voltage Code

A

Capacitance

Code

Rated Voltage (VDC)

250

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

180ꢀpF

220ꢀpF

270ꢀpF

330ꢀpF

390ꢀpF

470ꢀpF

560ꢀpF

680ꢀpF

820ꢀpF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

DR

1,000ꢀpF

1,200ꢀpF

1,500ꢀpF

1,800ꢀpF

2,200ꢀpF

2,700ꢀpF

3,300ꢀpF

3,900ꢀpF

4,700ꢀpF

5,600ꢀpF

6,800ꢀpF

8,200ꢀpF

10,000ꢀpF

12,000ꢀpF

15,000ꢀpF

18,000ꢀpF

22,000ꢀpF

27,000ꢀpF

33,000ꢀpF

39,000ꢀpF

47,000ꢀpF

56,000ꢀpF

68,000ꢀpF

82,000ꢀpF

0.10ꢀµF

0.12ꢀµF

0.15ꢀµF

0.18ꢀµF

0.22ꢀµF

0.27ꢀµF

0.33ꢀµF

0.39ꢀµF

0.47ꢀµF

0.56ꢀµF

0.68ꢀµF

0.82ꢀµF

1.0ꢀµF

EQ

ES

EM

FN

FQ

FA

FZ

FU

FM

FK

GB

GE

GG

GJ

HB

HD

HF

KC

KD

KE

JC

JD

JF

1.2ꢀµF

Rated Voltage (VDC)

Voltage Code

250

A

250

A

250

A

250

A

250

A

250

A

250

A

Capacitance

Capacitance Code

Case Size/Series

C0805C

C1206C

C1210C

C1812C

C1825C

C2220C

C2225C

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 2A – Chip Thickness/Tape & Reel Packaging Quantities

Paper Quantity

7" Reel 13" Reel

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

DR

EQ

ES

EM

FN

FQ

FA

FZ

FU

FM

FK

GB

GE

GG

GJ

HB

HD

HF

JC

JD

JF

0805

1206

1210

1812

1825

2220

2225

0.78 ± 0.20

1.00 ± 0.20

1.25 ± 0.15

0.78 ± 0.20

0.90 ± 0.20

1.10 ± 0.15

1.25 ± 0.20

1.55 ± 0.20

1.70 ± 0.20

2.10 ± 0.20

1.00 ± 0.10

1.30 ± 0.10

1.55 ± 0.10

1.70 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

0

4,000

10,000

4,000

0

10,000

4,000

2,500

4,000

2,500

2,000

1,000

10,000

8,000

4,000

0

KC

KD

KE

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 2B – Bulk Packaging Quantities

Loose Packaging

Packaging Type

BulkꢀBagꢀ(default)

PackagingꢀC-Spec¹

N/A²

Case Size

Packaging Quantities (pieces/unit packaging)

EIA (in)

Metric (mm)

Minimum

Maximum

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

1005

1608

2012

3216

3225

4520

4532

4564

5650

5664

50,000

1

20,000

¹The "Packaging C-Spec" is a 4 to 8 digit code which identiﬁes the packaging type and/or product grade. When ordering, the proper code must be

included in the 15th through 22nd character positions of the ordering code. See "Ordering Information" section of this document for further details.

Commercial Grade product ordered without a packaging C-Spec will default to our standard "Bulk Bag" packaging. Contact KEMET if you require a bulk

bag packaging option for Automotive Grade products.

²A packaging C-Spec (see note 1 above) is not required for "Bulk Bag" packaging (excluding Anti-Static Bulk Bag and Automotive Grade products). The

15th through 22nd character positions of the ordering code should be left blank. All product ordered without a packaging C-Spec will default to our

standard "Bulk Bag" packaging.

C1011_X7R_TIP_RING_SMD • 11/29/2017

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1210¹

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

1.50

2.15

2.75

2.70

1.35

1.60

1.70

1.90

2.80

2.90

3.60

6.90

5.50

6.90

5.60

5.65

5.60

6.90

8.20

8.10

2.90

3.80

3.90

4.60

7.90

6.50

7.90

1.50

1.40

2.05

2.65

2.60

1.15

1.40

1.50

1.80

2.70

2.80

3.50

6.80

5.40

6.80

4.70

6.00

7.30

7.20

2.30

3.20

3.30

4.00

7.30

5.90

7.30

1.40

1.30

1.95

2.55

2.50

0.95

1.20

1.30

1.70

2.60

2.70

3.40

6.70

5.30

6.70

4.00

5.30

6.60

6.50

2.00

2.90

3.00

3.70

7.00

5.60

7.00

¹Only for capacitance values ≥ 22 µF

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1011_X7R_TIP_RING_SMD • 11/29/2017

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

0.99

1.44

1.66

4.47

2.71

0.89

1.24

1.56

3.57

2.11

0.79

1.04

1.46

2.42

1.81

1.59

2.30

2.15

2.85

1.62

1.75

1.80

2.10

2.06

3.01

2.30

6.90

5.50

6.90

5.85

5.90

7.40

7.10

8.80

3.06

4.01

3.30

7.90

6.50

7.90

1.49

2.20

2.05

2.75

1.42

1.55

1.60

1.90

1.96

2.91

2.20

6.80

5.40

6.80

4.95

6.50

6.20

7.90

2.46

3.41

2.70

7.30

5.90

7.30

1.39

2.10

1.95

2.65

1.22

1.35

1.40

1.70

1.86

2.81

2.10

6.70

5.30

6.70

4.25

5.80

5.50

7.20

2.16

3.11

2.40

7.00

5.60

7.00

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow

solder processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform

qualiﬁcation testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1210 case size.

V1

Y

V2

X

C

Grid Placement Courtyard

C1011_X7R_TIP_RING_SMD • 11/29/2017

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Soldering Process

Recommended Soldering Technique:

ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreﬂowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206

ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreﬂowꢀonly

Recommended Reﬂow Soldering Proﬁle:

KEMET’sꢀfamiliesꢀofꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀ(SMDꢀMLCCs)ꢀareꢀcompatibleꢀwithꢀwaveꢀ(singleꢀorꢀdual),ꢀ

convection,ꢀIRꢀorꢀvaporꢀphaseꢀreﬂowꢀtechniques.ꢀPreheatingꢀofꢀtheseꢀcomponentsꢀisꢀrecommendedꢀtoꢀavoidꢀextremeꢀthermalꢀ

stress.ꢀKEMET’sꢀrecommendedꢀproﬁleꢀconditionsꢀforꢀconvectionꢀandꢀIRꢀreﬂowꢀreﬂectꢀtheꢀproﬁleꢀconditionsꢀofꢀtheꢀIPC/ꢀ

J-STD-020ꢀstandardꢀforꢀmoistureꢀsensitivityꢀtesting.ꢀTheseꢀdevicesꢀcanꢀsafelyꢀwithstandꢀaꢀmaximumꢀofꢀthreeꢀreﬂowꢀpassesꢀ

atꢀtheseꢀconditions.

Termination Finish

T_ꢁ

T_L

t_ꢁ

Proﬁle Feature

Maꢀimum Ramp ꢂp Rate ꢃ ꢄꢅCꢆsecond

Maꢀimum Ramp Doꢇn Rate ꢃ ꢈꢅCꢆsecond

SnPb

100% Matte Sn

t_L

Preheat/Soak

TemperatureꢀMinimumꢀ(T_Smin

)

100°C

150°C

200°C

T_smaꢀ

T_smin

TemperatureꢀMaximumꢀ(T_Smax

)

Time (t_S) from T_Sminto T_Smax

60 – 120 seconds

3°C/secondꢀ

maximum

60 – 120 seconds

3°C/secondꢀ

maximum

t_s

Ramp-UpꢀRateꢀ(T_Lto T_P)

25

LiquidousꢀTemperatureꢀ(T_L)

TimeꢀAboveꢀLiquidousꢀ(t_L)

PeakꢀTemperatureꢀ(T_P)

183°C

60 – 150 seconds

235°C

217°C

60 – 150 seconds

260°C

25ꢅC to ꢁeaꢉ

Tiꢀe

TimeꢀWithinꢀ5°CꢀofꢀMaximumꢀ

20 seconds

maximum

30 seconds

maximum

PeakꢀTemperatureꢀ(t_P)

6°C/secondꢀ

maximum

6°C/secondꢀ

maximum

Ramp-Down Rate (T_Pto T_L)

Timeꢀ25°CꢀtoꢀPeakꢀ

Temperature

6ꢀminutes

maximum

8ꢀminutes

maximum

Note 1: All temperatures refer to the center of the package, measured on the

capacitor body surface that is facing up during assembly reﬂow.

C1011_X7R_TIP_RING_SMD • 11/29/2017 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalꢀStrength

JIS–C–6429

Appendixꢀ1,ꢀNote:ꢀForceꢀofꢀ1.8ꢀkgꢀforꢀ60ꢀseconds.

Appendixꢀ2,ꢀNote:ꢀStandardꢀterminationꢀsystemꢀ–ꢀ2.0ꢀmmꢀ(minimum)ꢀforꢀallꢀexceptꢀ3ꢀmmꢀ

forꢀC0G.ꢀFlexibleꢀterminationꢀsystemꢀ–ꢀ3.0ꢀmmꢀ(minimum).

BoardꢀFlex

JIS–C–6429

Magniﬁcationꢀ50ꢀX.ꢀConditions:

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀa)ꢀMethodꢀB,ꢀ4ꢀhoursꢀatꢀ155°C,ꢀdryꢀheatꢀatꢀ235°C

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb)ꢀMethodꢀBꢀatꢀ215°Cꢀcategoryꢀ3

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀc)ꢀMethodꢀD,ꢀcategoryꢀ3ꢀatꢀ260°C

Solderability

J–STD–002

1,000ꢀCyclesꢀ(−55°Cꢀtoꢀ+125°C).ꢀMeasurementꢀatꢀ24ꢀhoursꢀ+/−ꢀ4ꢀhoursꢀafterꢀtestꢀ

conclusion.

LoadꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀratedꢀvoltage.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ+/−ꢀ4ꢀhoursꢀafterꢀtestꢀconclusion.

LowꢀVoltꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀ1.5ꢀV.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ+/−ꢀ4ꢀhoursꢀafterꢀtestꢀconclusion.

TemperatureꢀCycling

BiasedꢀHumidity

JESD22ꢀMethodꢀJA–104

MIL–STD–202ꢀMethodꢀ

103

MIL–STD–202ꢀMethodꢀ

tꢀ=ꢀ24ꢀhours/cycle.ꢀStepsꢀ7aꢀandꢀ7bꢀnotꢀrequired.

MoistureꢀResistance

ThermalꢀShock

Measurementꢀatꢀ24ꢀhoursꢀ+/−ꢀ4ꢀhoursꢀafterꢀtestꢀconclusion.

106

MIL–STD–202ꢀMethodꢀ

−55°C/+125°C.ꢀNote:ꢀNumberꢀofꢀcyclesꢀrequiredꢀ–ꢀ300,ꢀmaximumꢀtransferꢀtimeꢀ–ꢀ20ꢀ

seconds,ꢀdwellꢀtimeꢀ–ꢀ15ꢀminutes.ꢀAirꢀ–ꢀAir.

107

MIL–STD–202ꢀMethodꢀ

108

HighꢀTemperatureꢀLife

1,000ꢀhoursꢀatꢀ125°Cꢀ(85°CꢀforꢀX5R,ꢀZ5UꢀandꢀY5V)ꢀwithꢀ2ꢀXꢀratedꢀvoltageꢀapplied.

/EIA–198

MIL–STD–202ꢀMethodꢀ

108

StorageꢀLife

Vibration

150°C,ꢀ0ꢀVDCꢀforꢀ1,000ꢀhours.

5ꢀg'sꢀforꢀ20ꢀmin.,ꢀ12ꢀcyclesꢀeachꢀofꢀ3ꢀorientations.ꢀNote:ꢀUseꢀ8"ꢀXꢀ5"ꢀPCBꢀ0.031"ꢀthickꢀ7ꢀ

secureꢀpointsꢀonꢀoneꢀlongꢀsideꢀandꢀ2ꢀsecureꢀpointsꢀatꢀcornersꢀofꢀoppositeꢀsides.ꢀPartsꢀ

mountedꢀwithinꢀ2"ꢀfromꢀanyꢀsecureꢀpoint.ꢀTestꢀfromꢀ10ꢀ–ꢀ2,000ꢀHz

MIL–STD–202ꢀMethodꢀ

204

MIL–STD–202ꢀMethodꢀ

MechanicalꢀShock

Figureꢀ1ꢀofꢀMethodꢀ213,ꢀConditionꢀF.

213

MIL–STD–202ꢀMethodꢀ

215

Resistance to Solvents

Addꢀaqueousꢀwashꢀchemical,ꢀOKEMꢀCleanꢀorꢀequivalent.

Storage and Handling

Ceramicꢀchipꢀcapacitorsꢀshouldꢀbeꢀstoredꢀinꢀnormalꢀworkingꢀenvironments.ꢀWhileꢀtheꢀchipsꢀthemselvesꢀareꢀquiteꢀrobustꢀinꢀ

otherꢀenvironments,ꢀsolderabilityꢀwillꢀbeꢀdegradedꢀbyꢀexposureꢀtoꢀhighꢀtemperatures,ꢀhighꢀhumidity,ꢀcorrosiveꢀatmospheres,ꢀ

andꢀlongꢀtermꢀstorage.ꢀInꢀaddition,ꢀpackagingꢀmaterialsꢀwillꢀbeꢀdegradedꢀbyꢀhighꢀtemperature–reelsꢀmayꢀsoftenꢀorꢀwarpꢀ

andꢀtapeꢀpeelꢀforceꢀmayꢀincrease.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀ

storageꢀhumidityꢀnotꢀexceedꢀ70%ꢀrelativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀ

theꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀchlorineꢀandꢀsulfurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀ

shouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀ1.5ꢀyearsꢀofꢀreceipt.

C1011_X7R_TIP_RING_SMD • 11/29/2017 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Construction – Standard Termination

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Dielectric

Material (BaTiO₃)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

End Termination/

External Electrode

(Cu)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

Construction – Flexible Termination

Detailed Cross Section

Dielectric Material

(BaTiO₃)

Barrier Layer

(Ni)

End Termination/

External Electrode

(Cu)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Epoxy Layer

(Ag)

Dielectric

Material (BaTiO₃)

Inner Electrodes

(Ni)

End Termination/

External Electrode

(Cu)

Epoxy Layer

(Ag)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn /

SnPb - 5% Pb min)

Inner Electrodes

(Ni)

C1011_X7R_TIP_RING_SMD • 11/29/2017 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Capacitor Marking (Optional):

Theseꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀareꢀ

normallyꢀsuppliedꢀunmarked.ꢀIfꢀrequired,ꢀtheyꢀcanꢀbeꢀ

markedꢀasꢀanꢀextraꢀcostꢀoption.ꢀMarkingꢀisꢀavailableꢀ

onꢀmostꢀKEMETꢀdevicesꢀbutꢀmustꢀbeꢀrequestedꢀusingꢀ

theꢀcorrectꢀorderingꢀcodeꢀidenti ꢀer(s).ꢀIfꢀthisꢀoptionꢀisꢀ

requested,ꢀtwoꢀsidesꢀofꢀtheꢀceramicꢀbodyꢀwillꢀbeꢀlaserꢀ

markedꢀwithꢀaꢀ“K”ꢀtoꢀidentifyꢀKEMET,ꢀfollowedꢀbyꢀtwoꢀ

charactersꢀ(perꢀEIA–198ꢀ-ꢀseeꢀtableꢀbelow)ꢀtoꢀidentifyꢀtheꢀ

capacitanceꢀvalue.ꢀEIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀareꢀlimitedꢀ

toꢀtheꢀ“K”ꢀcharacterꢀonly.

Markingꢀappearsꢀinꢀlegibleꢀcontrast.ꢀIllustratedꢀbelowꢀ

isꢀanꢀexampleꢀofꢀanꢀMLCCꢀwithꢀlaserꢀmarkingꢀofꢀ“KA8”,ꢀ

whichꢀdesignatesꢀaꢀKEMETꢀdeviceꢀwithꢀratedꢀcapacitanceꢀ

ofꢀ100ꢀµF.ꢀOrientationꢀofꢀmarkingꢀisꢀvendorꢀoptional.ꢀ

2-Digit

KEMET

Capacitance

ID

Code

Laserꢀmarkingꢀoptionꢀisꢀnot available on:

•ꢀ C0G,ꢀUltraꢀStableꢀX8RꢀandꢀY5Vꢀdielectricꢀdevices.ꢀ

• EIA 0402 case size devices.

•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀFlexibleꢀTerminationꢀ

option.

•ꢀ KPSꢀCommercialꢀandꢀAutomotiveꢀGradeꢀstackedꢀ

devices.

•ꢀ X7Rꢀdielectricꢀproductsꢀinꢀcapacitanceꢀvaluesꢀoutlinedꢀ

below.

EIA Case Size

Metric Size Code

Capacitance

0603

0805

1206

1210

1808

1812

1825

2220

2225

1608

2012

3216

3225

4520

4532

4564

5650

5664

≤ꢀ170ꢀpF

≤ꢀ150ꢀpF

≤ꢀ910ꢀpF

≤ꢀ2,000ꢀpF

≤ꢀ3,900ꢀpF

≤ꢀ6,700ꢀpF

≤ꢀ0.018ꢀµF

≤ꢀ0.027ꢀµF

≤ꢀ0.033ꢀµF

C1011_X7R_TIP_RING_SMD • 11/29/2017 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Capacitor Marking (Optional) cont’d

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

0.10

0.11

0.12

0.13

0.15

0.16

0.18

0.20

0.22

0.24

0.27

0.30

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.40

0.45

0.50

0.60

0.70

0.80

0.90

1.0

1.1

1.2

1.3

1.5

1.6

1.8

2.0

2.2

2.4

2.7

3.0

3.3

3.6

3.9

4.3

4.7

5.1

5.6

6.2

6.8

7.5

8.2

9.1

2.5

3.5

4.0

4.5

5.0

6.0

7.0

8.0

9.0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000 100,000 1,000,000 10,000,000

11,000 110,000 1,100,000 11,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

12,000 120,000 1,200,000 12,000,000

13,000 130,000 1,300,000 13,000,000

15,000 150,000 1,500,000 15,000,000

16,000 160,000 1,600,000 16,000,000

18,000 180,000 1,800,000 18,000,000

20,000 200,000 2,000,000 20,000,000

22,000 220,000 2,200,000 22,000,000

24,000 240,000 2,400,000 24,000,000

27,000 270,000 2,700,000 27,000,000

30,000 300,000 3,000,000 30,000,000

33,000 330,000 3,300,000 33,000,000

36,000 360,000 3,600,000 36,000,000

39,000 390,000 3,900,000 39,000,000

43,000 430,000 4,300,000 43,000,000

47,000 470,000 4,700,000 47,000,000

51,000 510,000 5,100,000 51,000,000

56,000 560,000 5,600,000 56,000,000

62,000 620,000 6,200,000 62,000,000

68,000 680,000 6,800,000 68,000,000

75,000 750,000 7,500,000 75,000,000

82,000 820,000 8,200,000 82,000,000

91,000 910,000 9,100,000 91,000,000

25,000 250,000 2,500,000 25,000,000

35,000 350,000 3,500,000 35,000,000

40,000 400,000 4,000,000 40,000,000

45,000 450,000 4,500,000 45,000,000

50,000 500,000 5,000,000 50,000,000

60,000 600,000 6,000,000 60,000,000

70,000 700,000 7,000,000 70,000,000

80,000 800,000 8,000,000 80,000,000

90,000 900,000 9,000,000 90,000,000

Fꢀ

G

H

J

K

L

M

N

P

Qꢀ

R

S

T

Uꢀ

Vꢀ

W

X

Yꢀ

Zꢀ

a

b

d

e

f

m

n

t

y

C1011_X7R_TIP_RING_SMD • 11/29/2017 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Tape & Reel Packaging Information

KEMETꢀoffersꢀmultilayerꢀceramicꢀchipꢀcapacitorsꢀpackagedꢀinꢀ8,ꢀ12ꢀandꢀ16ꢀmmꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀ

EIAꢀStandardꢀ481.ꢀThisꢀpackagingꢀsystemꢀisꢀcompatibleꢀwithꢀallꢀtape-fedꢀautomaticꢀpickꢀandꢀplaceꢀsystems.ꢀSeeꢀTableꢀ2ꢀforꢀ

detailsꢀonꢀreelingꢀquantitiesꢀforꢀcommercialꢀchips.

ꢒar code laꢈel

ꢅntiꢆstatic reel

®

ꢇmꢈossed plasticꢉ or

punched paper carrierꢃ

Chip and ꢎꢏS orientation in pocꢍet

(eꢌcept ꢁꢀ25 commercial, and ꢁꢀ25 and 2225 Military)

KEMET

Sprocꢍet holes

ꢇmꢈossment or punched caꢊity

ꢀ mm, ꢁ2 mm

or ꢁꢂ mm carrier tape

ꢅntiꢆstatic coꢊer tape

(0ꢃꢁ0 mm (0ꢃ00ꢋ") maꢌimum thicꢍness)

ꢁ7ꢀ mm (7ꢃ00")

or

ꢄꢄ0 mm (ꢁꢄꢃ00")

ꢉꢇꢐꢅ 0ꢁ005, 020ꢁ, 0ꢋ02 and 0ꢂ0ꢄ case siꢑes aꢊailaꢈle on punched paper carrier onlyꢃ

Table 5 – Carrier Tape Conﬁguration, Embossed Plastic & Punched Paper (mm)

New 2 mm Pitch Reel Options*

Embossed Plastic Punched Paper

Tape

Packaging

Ordering Code

(C-Spec)

C-3190

7" Reel 13" Reel 7" Reel 13" Reel

EIA Case Size Size

(W)*

Packaging Type/Options

Pitchꢀ(P₁)* Pitchꢀ(P₁)*

01005 – 0402

0603

8

2

2/4

4

Automotiveꢀgradeꢀ7"ꢀreelꢀunmarked

Automotiveꢀgradeꢀ13"ꢀreelꢀunmarked

Commercialꢀgradeꢀ7"ꢀreelꢀunmarked

Commercialꢀgradeꢀ13"ꢀreelꢀunmarked

C-3191

2/4

4

C-7081

0805

8

4

C-7082

1206 – 1210

1805 – 1808

≥ꢀ1812

8

4

* 2 mm pitch reel only available for 0603 EIA case size.

2 mm pitch reel for 0805 EIA case size under development.

12

16

8

4

8

Beneﬁts of Changing from 4 mm to 2 mm Pitching Spacing

• Lower placement costs.

•ꢀ Doubleꢀtheꢀpartsꢀonꢀeachꢀreelꢀresultsꢀinꢀfewerꢀreelꢀ

changesꢀandꢀincreasedꢀe ꢀꢀciency.

•ꢀ Fewerꢀreelsꢀresultꢀinꢀlowerꢀpackaging,ꢀshippingꢀandꢀ

storageꢀcosts,ꢀreducingꢀwaste.

KPS 1210

8

KPS 1812

and 2220

12

4

12

4

Array 0612

*Refer to Figures 1 and 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 and 7 for tolerance speciﬁcations.

C1011_X7R_TIP_RING_SMD • 11/29/2017 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

ꢀ 2

ꢏꢇ0 pitches cumulatiꢃe

tolerance on tape ꢐ0ꢉ2 mmꢑ

2

ꢋ

ꢇ

ꢀo

ꢊDo

ꢄo

ꢁ

ꢆo

ꢂ

ꢋ

2

ꢅ

ꢇ

ꢅo

S

ꢇ

ꢀ

ꢇ

T

ꢇ

ꢋmꢈossment

ꢁor caꢃity siꢌe,

see ꢍote ꢇ Taꢈle ꢎ

Center Lines of Caꢃity

ꢊD

ꢇ

Coꢃer Tape

is for tape feeder reference only,

including draft concentric aꢈout ꢅoꢉ

ꢅ

ꢇ

Uꢀer ꢁirecꢂion of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metricꢀwillꢀgovern

Constant Dimensions — Millimeters (Inches)

D₁ꢀMinimum

Note 1

1.0

(0.039)

R Reference S₁ꢀMinimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum Maximum

25.0

(0.984)

1.5ꢀ+0.10/−0.0ꢀ

(0.059ꢀ+0.004/−0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁ꢀMaximum

E₂

T₂

W

Tape Size

8 mm

Pitchꢀ

Fꢀ

P₁

A₀,B₀& K₀

Note 4

4.35

(0.171)

Minimum

6.25

(0.246)

Maximum Maximum

2.5

(0.098)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

8.3

(0.327)

Singleꢀ(4ꢀmm)

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

andꢀDoubleꢀ(8ꢀmm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment

location and hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with suﬃcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see

Figure 4).

(e) for KPS product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1011_X7R_TIP_RING_SMD • 11/29/2017 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

ꢌꢂ0 pitches cumulatiꢀe

tolerance on tape ꢍ0ꢎ2 mmꢏ

ꢄ_ꢂ

ꢁo

ꢃDo

ꢇ₀

ꢅ

ꢆ

ꢄ₂

ꢈ₀

ꢁ^ꢂ

ꢈottom Coꢀer Tape

G

Caꢀity Siꢉe,

See

T^ꢂ

Center Lines of Caꢀity

Top Coꢀer Tape

ꢊote ꢂ, Taꢋle 7

ꢈottom Coꢀer Tape

Uꢀer ꢁirecꢂion of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metricꢀwillꢀgovern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

GꢀMinimum

0.10

1.5ꢀ+0.10ꢀ-0.0ꢀ

(0.059ꢀ+0.004ꢀ-0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

0.75

(0.030)

25

(0.984)

(0.004)

Maximum

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2ꢀMinimum

Fꢀ

P₁

TꢀMaximum

WꢀMaximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

8.3

(0.327)

8.3

(0.327)

Half (2 mm)

Singleꢀ(4ꢀmm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

1. The cavity deﬁned by A₀, B₀and T shall surround the component with suﬃcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1011_X7R_TIP_RING_SMD • 11/29/2017 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force:ꢀ1.0ꢀkgꢀminimum.

2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ

Tape Width

8 mm

Peel Strength

0.1ꢀtoꢀ1.0ꢀNewtonꢀ(10ꢀtoꢀ100ꢀgf)

0.1ꢀtoꢀ1.3ꢀNewtonꢀ(10ꢀtoꢀ130ꢀgf)

12 and 16 mm

Theꢀdirectionꢀofꢀtheꢀpullꢀshallꢀbeꢀoppositeꢀtheꢀdirectionꢀofꢀtheꢀcarrierꢀtapeꢀtravel.ꢀTheꢀpullꢀangleꢀofꢀtheꢀcarrierꢀtapeꢀshallꢀbeꢀ

165°ꢀtoꢀ180°ꢀfromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ

300ꢀ±10ꢀmm/minute.

3. Labeling:ꢀBarꢀcodeꢀlabelingꢀ(standardꢀorꢀcustom)ꢀshallꢀbeꢀonꢀtheꢀsideꢀofꢀtheꢀreelꢀoppositeꢀtheꢀsprocketꢀholes.ꢀRefer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1011_X7R_TIP_RING_SMD • 11/29/2017 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Figure 6 – Reel Dimensions

ꢂull Radius,

See ꢁote

ꢍꢎ (ꢇncludes

flange distortion

at outer edge)

ꢀccess ꢄole at

Slot Location

(ꢅ ꢆ0 mm minimum)

ꢍ2 (Measured at huꢏ)

D

(See ꢁote)

ꢀ

ꢁ

C

(ꢀrꢏor hole

ꢍꢌ (Measured at huꢏ)

diameter)

ꢇf present,

tape slot in core

for tape startꢈ

2ꢉ5 mm minimum ꢊidth ꢋ

ꢌ0ꢉ0 mm minimum depth

ꢃ

(see ꢁote)

ꢁoteꢈ Driꢐe spoꢑes optionalꢒ if used, dimensions ꢃ and D shall applyꢉ

Table 8 – Reel Dimensions

Metricꢀwillꢀgovern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

BꢀMinimum

C

DꢀMinimum

178 ±0.20

(7.008 ±0.008)

or

1.5

(0.059)

13.0ꢀ+0.5/−0.2ꢀ

(0.521ꢀ+0.02/−0.008)

20.2

(0.795)

12 mm

16 mm

330 ±0.20

(13.000 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

NꢀMinimum

W₁

W₂ꢀMaximum

W₃

8.4ꢀ+1.5/−0.0

(0.331ꢀ+0.059/−0.0)

14.4

(0.567)

50

(1.969)

12.4ꢀ+2.0/−0.0

18.4

Shallꢀaccommodateꢀtapeꢀ

widthꢀwithoutꢀinterference

12 mm

16 mm

(0.488ꢀ+0.078/−0.0)ꢀꢀ

(0.724)

16.4ꢀ+2.0/−0.0

(0.646ꢀ+0.078/−0.0)

22.4

(0.882)

C1011_X7R_TIP_RING_SMD • 11/29/2017 19

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

ꢄmꢋossed Carrier

Carrier Tape

ꢈunched Carrier

ꢉ mm ꢊ ꢀ2 mm only

Round Sprocꢂet ꢃoles

ꢂTART

Eꢀꢁ

Top Coꢇer Tape

ꢄlongated Sprocꢂet ꢃoles

(ꢅ2 mm tape and ꢆider)

ꢀ00 mm

minimum Leader

ꢌ00 mm minimum

Trailer

Components

ꢀꢁ0 mm minimum

Top Coꢇer Tape

Figure 8 – Maximum Camber

ꢄlongated Sprocꢀet ꢁoles

(ꢅ2 mm ꢆ ꢇider tapes)

Carrier Tape

Round Sprocꢀet ꢁoles

ꢂ mm maꢃimum, either direction

Straight ꢄdge

250 mm

C1011_X7R_TIP_RING_SMD • 11/29/2017 20

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC (Commercial Grade)

KEMET Electronics Corporation Sales Oﬃces

Forꢀaꢀcompleteꢀlistꢀofꢀourꢀglobalꢀsalesꢀo ꢀꢀces,ꢀpleaseꢀvisitꢀwww.kemet.com/sales.

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀ

checkingꢀandꢀverifyingꢀtheꢀextentꢀtoꢀwhichꢀtheꢀInformationꢀcontainedꢀinꢀthisꢀpublicationꢀisꢀapplicableꢀtoꢀanꢀorderꢀatꢀtheꢀtimeꢀtheꢀorderꢀisꢀplaced.

AllꢀInformationꢀgivenꢀhereinꢀisꢀbelievedꢀtoꢀbeꢀaccurateꢀandꢀreliable,ꢀbutꢀitꢀisꢀpresentedꢀwithoutꢀguarantee,ꢀwarranty,ꢀorꢀresponsibilityꢀofꢀanyꢀkind,ꢀexpressedꢀorꢀimplied.

StatementsꢀofꢀsuitabilityꢀforꢀcertainꢀapplicationsꢀareꢀbasedꢀonꢀKEMETꢀElectronicsꢀCorporation’sꢀ(“KEMET”)ꢀknowledgeꢀofꢀtypicalꢀoperatingꢀconditionsꢀforꢀsuchꢀ

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technicalꢀadviceꢀinferredꢀfromꢀthisꢀInformationꢀorꢀotherwiseꢀprovidedꢀbyꢀKEMETꢀwithꢀreferenceꢀtoꢀtheꢀuseꢀofꢀKEMET’sꢀproductsꢀisꢀgivenꢀgratis,ꢀandꢀKEMETꢀassumesꢀnoꢀ

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failuresꢀmayꢀstillꢀoccur.ꢀAccordingly,ꢀcustomerꢀapplicationsꢀwhichꢀrequireꢀaꢀhighꢀdegreeꢀofꢀreliabilityꢀorꢀsafetyꢀshouldꢀemployꢀsuitableꢀdesignsꢀorꢀotherꢀsafeguardsꢀ

(suchꢀasꢀinstallationꢀofꢀprotectiveꢀcircuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀ

propertyꢀdamage.

Althoughꢀallꢀproduct–relatedꢀwarnings,ꢀcautionsꢀandꢀnotesꢀmustꢀbeꢀobserved,ꢀtheꢀcustomerꢀshouldꢀnotꢀassumeꢀthatꢀallꢀsafetyꢀmeasuresꢀareꢀindictedꢀorꢀthatꢀotherꢀ

measuresꢀmayꢀnotꢀbeꢀrequired.

KEMET is a registered trademark of KEMET Electronics Corporation.

C1011_X7R_TIP_RING_SMD • 11/29/2017 21


型号：	C1210C823KARACTU
厂家：	KEMET CORPORATION
描述：	Capacitor, Ceramic, Chip, General Purpose, 0.082uF, 250V, ±10%, X7R, 1210 (3225 mm), Sn/NiBar, -55º ~ +125ºC, 7" Reel/Unmarked 电容器
文件：	总21页 (文件大小：1517K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210C823KARACTU [KEMET]

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