C1210C823KARACTM_技术文档

SurfaceꢀMountꢀMultilayerꢀCeramicꢀChipꢀCapacitorsꢀ(SMDꢀMLCCs)

Telecom “Tip and Ring” X7R Dielectric, 250 VDC

(Commercial Grade)

Overview

KEMET’s 250 V DC Tip and Ring MLCCs in X7R dielectric are

designedꢀandꢀratedꢀforꢀtelecommunicationꢀringerꢀcircuitsꢀwhereꢀ

theꢀcapacitorꢀisꢀusedꢀtoꢀblockꢀ-48ꢀVꢀtoꢀ-52ꢀVꢀDCꢀofꢀlineꢀvoltageꢀ

material.ꢀComponentsꢀofꢀthisꢀclassiﬁcationꢀareꢀﬁxed,ꢀceramicꢀ

dielectric capacitors suited for bypass and decoupling applications

orꢀforꢀfrequencyꢀdiscriminatingꢀcircuitsꢀwhereꢀQꢀandꢀstabilityꢀ

and pass a 16 – 25 Hz AC signal pulse of 70 VRMs to 90 VRMs. ofꢀcapacitanceꢀcharacteristicsꢀareꢀnotꢀcritical.ꢀX7Rꢀdielectricꢀ

Servingꢀasꢀanꢀexcellentꢀreplacementꢀforꢀhighꢀvoltageꢀleadedꢀ

ﬁlmꢀdevices,ꢀtheseꢀsmallerꢀsurfaceꢀmountꢀtechnologyꢀfootprintsꢀ

saveꢀvaluableꢀboardꢀspaceꢀwhichꢀisꢀcriticalꢀwhenꢀcreatingꢀnewꢀ

designs.

exhibitsꢀaꢀpredictableꢀchangeꢀinꢀcapacitanceꢀwithꢀrespectꢀtoꢀtimeꢀ

andꢀvoltageꢀandꢀboastsꢀaꢀminimalꢀchangeꢀinꢀcapacitanceꢀwithꢀ

referenceꢀtoꢀambientꢀtemperature.ꢀCapacitanceꢀchangeꢀisꢀlimitedꢀ

to ±15% from -55°C to +125°C.

KEMET Tip and Ring capacitors feature a 125°C maximum

operating temperature and are considered “temperature

stable.”ꢀTheꢀElectronicsꢀComponents,ꢀAssembliesꢀ&ꢀMaterialsꢀ

Associationꢀ(EIA)ꢀcharacterizesꢀX7RꢀdielectricꢀasꢀaꢀClassꢀIIꢀ

Theseꢀdevicesꢀareꢀableꢀtoꢀwithstandꢀtoday’sꢀhigherꢀlead-freeꢀreﬂowꢀ

processingꢀtemperaturesꢀandꢀofferꢀsuperiorꢀhighꢀfrequencyꢀﬁlteringꢀ

characteristicsꢀandꢀlowꢀESR.

Beneﬁts

• -55°C to +125°C operating temperature range

• Pb-Free and RoHS Compliant

•ꢀ SnPbꢀterminationꢀﬁnishꢀoptionꢀavailableꢀuponꢀrequestꢀ(5%ꢀ

minimum)

• EIA 0805, 1206, 1210, 1812, 1825, 2220, and 2225 case sizes

• DC voltage rating of 250 V

•ꢀ Flexibleꢀterminationꢀoptionꢀavailableꢀuponꢀrequest

•ꢀ Capacitanceꢀofferingsꢀrangingꢀfromꢀ1,000ꢀpFꢀtoꢀ6.8ꢀμF

• Available capacitance tolerances of ±10% and ±20%

• Non-polar device, minimizing installation concerns

•ꢀ 100%ꢀpureꢀmatteꢀtin-platedꢀterminationꢀﬁnishꢀthatꢀallowsꢀforꢀ

excellent solderability

Ordering Information

C

1825

C

105

K

A

R

A

C

TU

Case Size Speciﬁcation/

Capacitance

Code (pF)

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

(C-Spec)²

Ceramic

Voltage

Dielectric

TerminationꢀFinish¹

(L" x W")

Series

0805

1206

1210

1812

1825

2220

2225

C = Standard 2ꢀSigniﬁcantꢀDigitsꢀ+ꢀ J = ±5%

A = 250 V R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

X = Flexible

Termination

Number of Zeros

K = ±10%

M = ±20%

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

TM = 7" Reel

Marked

¹Additional termination ﬁnish options may be available. Contact KEMET for details.

²Additional reeling or packaging options may be available. Contact KEMET for details.

One world. One KEMET

C1011_X7R_TIP_RING_SMD • 5/30/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Dimensions – Millimeters (Inches) – Standard Termination

100% Tin or SnPb Plate

L

W

B

T

Nickel Plate

S

Conductive Metalization

Electrodes

EIA

Size

Code

Metric

Size

Code

S

L

W

Width

T

B

Mounting

Technique

Separation

Minimum

Length

Thickness

Bandwidth

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 1.60 (.063) ± 0.20 (.008)

3.20 (.126) ± 0.20 (.008) 2.50 (.098) ± 0.20 (.008)

4.50 (.177) ± 0.30 (.012) 3.20 (.126) ± 0.30 (.012)

4.50 (.177) ± 0.30 (.012) 6.40 (.252) ± 0.40 (.016)

5.70 (.224) ± 0.40 (.016) 5.00 (.197) ± 0.40 (.016)

5.60 (.220) ± 0.40 (.016) 6.40 (.248) ± 0.40 (.016)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

SolderꢀReﬂow

See Table 2 for

Thickness

N/A

SolderꢀReﬂowꢀOnly

Dimensions – Millimeters (Inches) – Flexible Termination

L

W

B

T

S

EIA

Size

Code

Metric

Size

Code

Mounting

Technique

T

L Length

Separation

Minimum

W Width

B Bandwidth

Thickness

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

2.00 (.079) ± 0.20 (.008) 1.25 (.049) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 1.60 (.063) ± 0.20 (.008)

3.30 (.130) ± 0.40 (.016) 2.50 (.098) ± 0.20 (.008)

4.50 (.178) ± 0.40 (.016) 3.20 (.126) ± 0.30 (.012)

4.60 (.181) ± 0.40 (.016) 6.40 (.252) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 5.00 (.197) ± 0.40 (.016)

5.90 (.232) ± 0.75 (.030) 6.40 (.248) ± 0.40 (.016)

0.50 (0.02) ± 0.25 (.010)

0.60 (.024) ± 0.25 (.010)

0.70 (.028) ± 0.35 (.014)

0.75 (.030)

Solder Wave or

SolderꢀReﬂow

See Table 2 for

Thickness

N/A

SolderꢀReﬂowꢀOnly

C1011_X7R_TIP_RING_SMD • 5/30/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Applications

Typicalꢀapplicationsꢀincludeꢀtelecommunicationꢀringingꢀcircuits,ꢀswitchꢀmodeꢀpowerꢀsupplyꢀsnubberꢀcircuits,ꢀhighꢀvoltageꢀDCꢀblockingꢀ

andꢀhighꢀvoltageꢀcoupling.ꢀMarketsꢀincludeꢀtelephoneꢀlines,ꢀanalogꢀandꢀdigitalꢀmodems,ꢀfacsimileꢀmachines,ꢀwirelessꢀbaseꢀstations,ꢀ

cableꢀandꢀdigitalꢀvideoꢀrecordingꢀset-topꢀboxes,ꢀsatelliteꢀdishes,ꢀhighꢀvoltageꢀpowerꢀsupply,ꢀDC/DCꢀconverters,ꢀandꢀEthernet,ꢀPOSꢀandꢀ

ATMꢀhardware.

Qualiﬁcation/Certiﬁcation

CommercialꢀGradeꢀproductsꢀareꢀsubjectꢀtoꢀinternalꢀqualiﬁcation.ꢀDetailsꢀregardingꢀtestꢀmethodsꢀandꢀconditionsꢀareꢀreferencedꢀinꢀ

Tableꢀ4,ꢀPerformanceꢀ&ꢀReliability.

Environmental Compliance

Pb-FreeꢀandꢀRoHSꢀCompliantꢀ(excludingꢀSnPbꢀterminationꢀﬁnishꢀoption).

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range

-55°C to +125°C

±15%

CapacitanceꢀChangeꢀwithꢀReferenceꢀtoꢀ+25°Cꢀandꢀ0ꢀVDCꢀAppliedꢀ(TCC)

Aging Rate (Maximum % Capacitance Loss/Decade Hour)

3.0%

250% of rated voltage

DielectricꢀWithstandingꢀVoltageꢀ(DWV)

Dissipation Factor (DF) Maximum Limit @ 25ºC

Insulation Resistance (IR) Limit @ 25°C

(5ꢀ±1ꢀsecondsꢀandꢀcharge/dischargeꢀnotꢀexceedingꢀ50ꢀmA)

5% (6.3 and 10 V), 3.5% (16 and 25 V) and 2.5% (50 to 250 V)

See Insulation Resistance Limit Table

(Rated voltage applied for 120 ±5 seconds @ 25°C)

Regarding aging rate: Capacitance measurements (including tolerance) are indexed to a referee time of 1,000 hours.

To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Capacitance and dissipation factor (DF) measured under the following conditions:

1 kHz ±50 Hz and 1.0 ±0.2 Vrms if capacitance ≤ 10 µF

120 Hz ±10 Hz and 0.5 ±0.1 Vrms if capacitance >10 µF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

C1011_X7R_TIP_RING_SMD • 5/30/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Post Environmental Limits

High Temperature Life, Biased Humidity, Moisture Resistance

Rated DC

Voltage

Capacitance

Value

Dissipation Factor

(Maximum %)

Capacitance

Insulation

Resistance

Dielectric

X7R

Shiftꢀ

> 25

16/25

< 16

3.0

5.0

7.5

All

±20%

10% of Initial Limit

Insulation Resistance Limit Table

1,000 Megohm

Microfarads or 100 GΩ

500 Megohm

Microfarads or 10 GΩ

EIA Case Size

0201

0402

0603

0805

1206

1210

1808

1812

1825

2220

2225

N/A

< 0.012 µF

< 0.047 µF

< 0.22 µF

< 0.39 µF

ALL

≥ꢀ0.012ꢀµF

≥ꢀ0.047ꢀµF

≥ꢀ0.22ꢀµF

≥ꢀ0.39ꢀµF

N/A

< 2.2 µF

ALL

≥ꢀ2.2ꢀµF

N/A

< 10 µF

ALL

≥ꢀ10ꢀµF

N/A

C1011_X7R_TIP_RING_SMD • 5/30/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 1 – Capacitance Range/Selection Waterfall (0805 – 2225 Case Sizes)

Series

Voltage Code

Voltage DC

C0805

C1206

C1210

C1812

C1825

C2220

C2225

A

Capacitance

Code

Capacitance

250

Capacitance

Tolerance

Product Availability and Chip Thickness Codes

See Table 2 for Chip Thickness Dimensions

180 pF

220 pF

270 pF

330 pF

390 pF

470 pF

560 pF

680 pF

820 pF

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

392

472

562

682

822

103

123

153

183

223

273

333

393

473

563

683

823

104

124

154

184

224

274

334

394

474

564

684

824

105

125

J

K

M

DC

J

M

1000 pF

1200 pF

1500 pF

1800 pF

2200 pF

2700 pF

3300 pF

3900 pF

4700 pF

5600 pF

6800 pF

8200 pF

10000 pF

12000 pF

15000 pF

18000 pF

22000 pF

27000 pF

33000 pF

39000 pF

47000 pF

56000 pF

68000 pF

82000 pF

0.1 µF

0.12 µF

0.15 µF

0.18 µF

0.22 µF

0.27 µF

0.33 µF

0.39 µF

0.47 µF

0.56 µF

0.68 µF

0.82 µF

1 µF

EB

ED

EM

FB

FC

FF

FG

GB

GE

GG

GJ

HB

HD

HF

JC

JD

JF

KC

KD

KE

1.2 µF

250

C

1825

C

^Voltage1^D0^C5

K

²⁵⁰A

R

A²⁵⁰

C

TU

Capacitance

Code

Voltage Code

A

Capacitance

Case Size Speci ꢀcation/

(L" x W")

Capacitance

Series

Capacitance

Tolerance

Failure Rate/

Design

Packaging/Grade

C2220 C2225

1

C0805

C1206

Voltage

C1210

Dielectric

C1812

C1825

TerminationꢀFinish

Ceramic

Series

Code (pF)

(C-Spec)²

0805

1206

1210

1812

1825

2220

2225

C = Standard 2ꢀSigni ꢀcantꢀDigitsꢀ+ꢀ J = ±5%

A = 250 V R = X7R A = N/A

C = 100% Matte Sn Blank = Bulk

X = Flexible

Termination

Number of Zeros

K = ±10%

M = ±20%

L = SnPb (5%

minimum)

TU = 7" Reel

Unmarked

TM = 7" Reel

Marked

C1011_X7R_TIP_RING_SMD • 5/30/2013

5

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 2 – Chip Thickness/Packaging Quantities

Paper Quantity

Plastic Quantity

7" Reel 13" Reel

Thickness Case Thickness ±

Code

Size

Range (mm)

7" Reel

13" Reel

DC

EB

ED

EM

FB

FC

FF

FG

GB

GE

GG

GJ

HB

HD

HF

JC

0805

1206

1210

1812

1825

2220

2225

0.78 ± 0.10

1.00 ± 0.10

1.25 ± 0.15

0.78 ± 0.10

0.90 ± 0.10

1.10 ± 0.10

1.25 ± 0.15

1.00 ± 0.10

1.30 ± 0.10

1.55 ± 0.10

1.70 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.50 ± 0.15

1.10 ± 0.15

1.30 ± 0.15

1.40 ± 0.15

4,000

10,000

0

4,000

2,500

4,000

2,500

1,000

10,000

4,000

0

JD

JF

KC

KD

KE

7" Reel

13" Reel

7" Reel

13" Reel

Thickness

Code

Case

Size

Thickness ±

Range (mm)

Paper Quantity

Plastic Quantity

Package quantity based on ﬁnished chip thickness speciﬁcations.

Table 3A – Land Pattern Design Recommendations per IPC–7351 – Standard Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1210¹

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.75

0.95

1.35

2.80

1.70

1.60

1.50

2.15

2.75

2.70

1.35

1.60

1.70

1.90

2.80

2.90

3.60

6.90

5.50

6.90

5.60

5.65

5.60

6.90

8.20

8.10

2.90

3.80

3.90

4.60

7.90

6.50

7.90

1.50

1.40

2.05

2.65

2.60

1.15

1.40

1.50

1.80

2.70

2.80

3.50

6.80

5.40

6.80

4.70

6.00

7.30

7.20

2.30

3.20

3.30

4.00

7.30

5.90

7.30

1.40

1.30

1.95

2.55

2.50

0.95

1.20

1.30

1.70

2.60

2.70

3.40

6.70

5.30

6.70

4.00

5.30

6.60

6.50

2.00

2.90

3.00

3.70

7.00

5.60

7.00

¹Only for capacitance values ≥ 22 µF

C1011_X7R_TIP_RING_SMD • 5/30/2013

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Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 3B – Land Pattern Design Recommendations per IPC–7351 – Flexible Termination

Density Level A:

Maximum (Most)

Land Protrusion (mm)

Density Level B:

Median (Nominal)

Land Protrusion (mm)

Density Level C:

Minimum (Least)

Land Protrusion (mm)

EIA

Size

Code

Metric

Size

Code

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0805

1206

1210

1812

1825

2220

2225

2012

3216

3225

4532

4564

5650

5664

1.00

1.35

1.55

4.40

2.60

0.90

1.15

1.45

3.50

2.00

0.80

0.95

1.35

2.80

1.70

1.60

2.10

2.15

2.85

1.65

1.80

2.10

1.90

2.80

3.60

6.90

5.50

6.90

5.90

7.00

7.10

2.90

3.80

4.60

7.90

6.50

7.90

1.50

2.00

2.05

2.75

1.45

1.60

1.90

1.80

2.70

3.50

6.80

5.40

6.80

5.00

6.10

6.20

7.90

2.30

3.20

4.00

7.30

5.90

7.30

1.40

1.90

1.95

2.65

1.25

1.40

1.70

2.60

3.40

6.70

5.30

6.70

4.30

5.40

5.50

7.20

2.00

2.90

3.70

7.00

5.60

7.00

8.80

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reﬂow solder

processes. KEMET only recommends wave soldering of EIA 0603, 0805 and 1206 case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reﬂow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualiﬁcation

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Soldering Process

RecommendedꢀSolderingꢀTechnique:

ꢀ •ꢀSolderꢀwaveꢀorꢀsolderꢀreﬂowꢀforꢀEIAꢀcaseꢀsizesꢀ0603,ꢀ0805ꢀandꢀ1206

ꢀ •ꢀAllꢀotherꢀEIAꢀcaseꢀsizesꢀareꢀlimitedꢀtoꢀsolderꢀreﬂowꢀonly

RecommendedꢀSolderingꢀProﬁle:

ꢀ •ꢀKEMETꢀrecommendsꢀfollowingꢀtheꢀguidelinesꢀoutlinedꢀinꢀIPC/JEDECꢀJ–STD–020

C1011_X7R_TIP_RING_SMD • 5/30/2013

7

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Table 4 – Performance & Reliability: Test Methods and Conditions

Stress

Reference

Test or Inspection Method

TerminalꢀStrength

JIS–C–6429

Appendixꢀ1,ꢀNote:ꢀForceꢀofꢀ1.8ꢀkgꢀforꢀ60ꢀseconds.

Appendixꢀ2,ꢀNote:ꢀStandardꢀterminationꢀsystemꢀ–ꢀ2.0ꢀmmꢀ(minimum)ꢀforꢀallꢀexceptꢀ3ꢀmmꢀforꢀC0G.ꢀ

Flexible termination system – 3.0 mm (minimum).

Board Flex

JIS–C–6429

Magniﬁcationꢀ50ꢀX.ꢀConditions:

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀa)ꢀMethodꢀB,ꢀ4ꢀhoursꢀ@ꢀ155°C,ꢀdryꢀheatꢀ@ꢀ235°C

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀb)ꢀMethodꢀBꢀ@ꢀ215°Cꢀcategoryꢀ3

Solderability

J–STD–002

ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀc)ꢀMethodꢀD,ꢀcategoryꢀ3ꢀ@ꢀ260°C

Temperature Cycling

Biased Humidity

JESD22ꢀMethodꢀJA–104

MIL–STD–202ꢀMethodꢀ103

1,000ꢀCyclesꢀ(-55°Cꢀtoꢀ+125°C).ꢀMeasurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

LoadꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀratedꢀvoltage.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀMeasurementꢀ

atꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

LowꢀVoltꢀHumidity:ꢀ1,000ꢀhoursꢀ85°C/85%ꢀRHꢀandꢀ1.5ꢀV.ꢀAddꢀ100ꢀKꢀohmꢀresistor.ꢀ

Measurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

tꢀ=ꢀ24ꢀhours/cycle.ꢀStepsꢀ7aꢀandꢀ7bꢀnotꢀrequired.ꢀUnpowered.

Measurementꢀatꢀ24ꢀhoursꢀ+/-ꢀ2ꢀhoursꢀafterꢀtestꢀconclusion.

-55°C/+125°C.ꢀNote:ꢀNumberꢀofꢀcyclesꢀrequiredꢀ–ꢀ300,ꢀmaximumꢀtransferꢀtimeꢀ–ꢀ20ꢀseconds,ꢀdwellꢀ

time – 15 minutes. Air – Air.

Moisture Resistance

ThermalꢀShock

MIL–STD–202ꢀMethodꢀ106

MIL–STD–202ꢀMethodꢀ107

MIL–STD–202ꢀMethodꢀ108

HighꢀTemperatureꢀLife

Storage Life

1,000ꢀhoursꢀatꢀ125°Cꢀ(85°CꢀforꢀX5R,ꢀZ5UꢀandꢀY5V)ꢀwithꢀ2ꢀXꢀratedꢀvoltageꢀapplied.

/EIA–198

MIL–STD–202ꢀMethodꢀ108 150°C,ꢀ0ꢀVDCꢀforꢀ1,000ꢀhours.

5ꢀg'sꢀforꢀ20ꢀmin.,ꢀ12ꢀcyclesꢀeachꢀofꢀ3ꢀorientations.ꢀNote:ꢀUseꢀ8"ꢀXꢀ5"ꢀPCBꢀ0.031"ꢀthickꢀ7ꢀsecureꢀ

Vibration

MIL–STD–202ꢀMethodꢀ204 pointsꢀonꢀoneꢀlongꢀsideꢀandꢀ2ꢀsecureꢀpointsꢀatꢀcornersꢀofꢀoppositeꢀsides.ꢀPartsꢀmountedꢀwithinꢀ2"ꢀ

from any secure point. Test from 10 – 2,000 Hz

MechanicalꢀShock

MIL–STD–202ꢀMethodꢀ213 Figureꢀ1ꢀofꢀMethodꢀ213,ꢀConditionꢀF.

Resistance to Solvents MIL–STD–202ꢀMethodꢀ215 Addꢀaqueousꢀwashꢀchemical,ꢀOKEMꢀCleanꢀorꢀequivalent.

Storage and Handling

Ceramicꢀchipꢀcapacitorsꢀshouldꢀbeꢀstoredꢀinꢀnormalꢀworkingꢀenvironments.ꢀWhileꢀtheꢀchipsꢀthemselvesꢀareꢀquiteꢀrobustꢀinꢀotherꢀ

environments,ꢀsolderabilityꢀwillꢀbeꢀdegradedꢀbyꢀexposureꢀtoꢀhighꢀtemperatures,ꢀhighꢀhumidity,ꢀcorrosiveꢀatmospheres,ꢀandꢀlongꢀtermꢀ

storage.ꢀInꢀaddition,ꢀpackagingꢀmaterialsꢀwillꢀbeꢀdegradedꢀbyꢀhighꢀtemperature–ꢀreelsꢀmayꢀsoftenꢀorꢀwarpꢀandꢀtapeꢀpeelꢀforceꢀmayꢀ

increase.ꢀKEMETꢀrecommendsꢀthatꢀmaximumꢀstorageꢀtemperatureꢀnotꢀexceedꢀ40ºCꢀandꢀmaximumꢀstorageꢀhumidityꢀnotꢀexceedꢀ70%ꢀ

relativeꢀhumidity.ꢀTemperatureꢀﬂuctuationsꢀshouldꢀbeꢀminimizedꢀtoꢀavoidꢀcondensationꢀonꢀtheꢀpartsꢀandꢀatmospheresꢀshouldꢀbeꢀfreeꢀofꢀ

chlorineꢀandꢀsulfurꢀbearingꢀcompounds.ꢀForꢀoptimizedꢀsolderabilityꢀchipꢀstockꢀshouldꢀbeꢀusedꢀpromptly,ꢀpreferablyꢀwithinꢀ1.5ꢀyearsꢀofꢀ

receipt.

C1011_X7R_TIP_RING_SMD • 5/30/2013

8

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Construction – Standard Termination

Reference

Item

Material

A

B

C

D

E

Finish

100% Matte Sn SnPb (5% min)

Termination

System

Barrier Layer

Base Metal

Ni

Cu

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

Construction – Flexible Termination

Reference

Item

Material

A

B

C

D

E

F

Finish

100% Matte Sn SnPb (5% min)

Barrier Layer

Epoxy Layer

Base Metal

Ni

Ag

Termination

System

Cu

Inner Electrode

Dielectric Material

Ni

BaTiO₃

Note: Image is exaggerated in order to clearly identify all components of construction.

C1011_X7R_TIP_RING_SMD • 5/30/2013

9

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Capacitor Marking (Optional):

Theseꢀsurfaceꢀmountꢀmultilayerꢀceramicꢀcapacitorsꢀareꢀ

normallyꢀsuppliedꢀunmarked.ꢀIfꢀrequired,ꢀtheyꢀcanꢀbeꢀmarkedꢀ

as an extra cost option. Marking is available on most KEMET

devicesꢀbutꢀmustꢀbeꢀrequestedꢀusingꢀtheꢀcorrectꢀorderingꢀ

codeꢀidenti ꢀer(s).ꢀIfꢀthisꢀoptionꢀisꢀrequested,ꢀtwoꢀsidesꢀofꢀtheꢀ

ceramicꢀbodyꢀwillꢀbeꢀlaserꢀmarkedꢀwithꢀaꢀ“K”ꢀtoꢀidentifyꢀKEMET,ꢀ

followedꢀbyꢀtwoꢀcharactersꢀ(perꢀEIA–198ꢀ-ꢀseeꢀtableꢀbelow)ꢀtoꢀ

identifyꢀtheꢀcapacitanceꢀvalue.ꢀEIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀareꢀ

limitedꢀtoꢀtheꢀ“K”ꢀcharacterꢀonly.

Marking appears in legible contrast. Illustrated below is an

exampleꢀofꢀanꢀMLCCꢀwithꢀlaserꢀmarkingꢀofꢀ“KA8”,ꢀwhichꢀ

designatesꢀaꢀKEMETꢀdeviceꢀwithꢀratedꢀcapacitanceꢀofꢀ100ꢀµF.ꢀ

Orientation of marking is vendor optional.

_

KA8

Laser marking option is notꢀavailableꢀon:

•ꢀ C0G,ꢀUltraꢀStableꢀX8RꢀandꢀY5Vꢀdielectricꢀdevicesꢀ

• EIA 0402 case size devices

•ꢀ EIAꢀ0603ꢀcaseꢀsizeꢀdevicesꢀwithꢀFlexibleꢀTerminationꢀoption.

• KPS Commercial and Automotive Grade stacked devices.

Capacitance (pF) For Various Alpha/Numeral Identiﬁers

Numeral

Alpha

Character

9

0

1

2

3

4

5

6

7

8

Capacitance (pF)

A

B

C

D

E

F

G

H

J

0.1

0.11

0.12

0.13

0.15

0.16

0.18

0.2

1 0

1.1

1 2

1 3

1 5

1 6

1 8

2 0

2 2

2.4

2.7

3 0

3 3

3 6

3 9

4 3

4.7

5.1

5 6

6 2

6 8

7 5

8 2

9.1

2 5

3 5

4 0

4 5

5 0

6 0

7 0

8 0

9 0

10

11

12

13

15

16

18

20

22

24

27

30

33

36

39

43

47

51

56

62

68

75

82

91

25

35

40

45

50

60

70

80

90

100

110

120

130

150

160

180

200

220

240

270

300

330

360

390

430

470

510

560

620

680

750

820

910

250

350

400

450

500

600

700

800

900

1,000

1,100

1,200

1,300

1,500

1,600

1,800

2,000

2,200

2,400

2,700

3,000

3,300

3,600

3,900

4,300

4,700

5,100

5,600

6,200

6,800

7,500

8,200

9,100

2,500

3,500

4,000

4,500

5,000

6,000

7,000

8,000

9,000

10,000

11,000

12,000

13,000

15,000

16,000

18,000

20,000

22,000

24,000

27,000

30,000

33,000

36,000

39,000

43,000

47,000

51,000

56,000

62,000

68,000

75,000

82,000

91,000

25,000

35,000

40,000

45,000

50,000

60,000

70,000

80,000

90,000

100,000 1,000,000

110,000 1,100,000

120,000 1,200,000

130,000 1,300,000

150,000 1,500,000

160,000 1,600,000

180,000 1,800,000

200,000 2,000,000

220,000 2,200,000

240,000 2,400,000

270,000 2,700,000

300,000 3,000,000

330,000 3,300,000

360,000 3,600,000

390,000 3,900,000

430,000 4,300,000

470,000 4,700,000

510,000 5,100,000

560,000 5,600,000

620,000 6,200,000

680,000 6,800,000

750,000 7,500,000

820,000 8,200,000

910,000 9,100,000

250,000 2,500,000

350,000 3,500,000

400,000 4,000,000

450,000 4,500,000

500,000 5,000,000

600,000 6,000,000

700,000 7,000,000

800,000 8,000,000

900,000 9,000,000

10,000,000

11,000,000

12,000,000

13,000,000

15,000,000

16,000,000

18,000,000

20,000,000

22,000,000

24,000,000

27,000,000

30,000,000

33,000,000

36,000,000

39,000,000

43,000,000

47,000,000

51,000,000

56,000,000

62,000,000

68,000,000

75,000,000

82,000,000

91,000,000

25,000,000

35,000,000

40,000,000

45,000,000

50,000,000

60,000,000

70,000,000

80,000,000

90,000,000

100,000,000

110,000,000

120,000,000

130,000,000

150,000,000

160,000,000

180,000,000

200,000,000

220,000,000

240,000,000

270,000,000

300,000,000

330,000,000

360,000,000

390,000,000

430,000,000

470,000,000

510,000,000

560,000,000

620,000,000

680,000,000

750,000,000

820,000,000

910,000,000

250,000,000

350,000,000

400,000,000

450,000,000

500,000,000

600,000,000

700,000,000

800,000,000

900,000,000

0.22

0.24

0.27

0.3

K

L

M

N

P

Qꢀ

R

S

T

U

V

W

X

Yꢀ

Z

a

0.33

0.36

0.39

0.43

0.47

0.51

0.56

0.62

0.68

0.75

0.82

0.91

0.25

0.35

0.4

b

d

e

0.45

0.5

f

m

n

0.6

0.7

t

0.8

y

0.9

C1011_X7R_TIP_RING_SMD • 5/30/2013 10

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Tape & Reel Packaging Information

KEMETꢀoffersꢀmultilayerꢀceramicꢀchipꢀcapacitorsꢀpackagedꢀinꢀ8,ꢀ12ꢀandꢀ16ꢀmmꢀtapeꢀonꢀ7"ꢀandꢀ13"ꢀreelsꢀinꢀaccordanceꢀwithꢀEIAꢀ

Standardꢀ481.ꢀThisꢀpackagingꢀsystemꢀisꢀcompatibleꢀwithꢀallꢀtape-fedꢀautomaticꢀpickꢀandꢀplaceꢀsystems.ꢀSeeꢀTableꢀ2ꢀforꢀdetailsꢀonꢀ

reelingꢀquantitiesꢀforꢀcommercialꢀchips.

Bar Code Label

Anti-Static Reel

®

Embossed Plastic* or

Punched Paper Carrier.

Chip and KPS Orientation in Pocket

(except 1825 Commercial, and 1825 and 2225 Military)

KEMET

Sprocket Holes

Embossment or Punched Cavity

8 mm, 12 mm

or 16 mm Carrier Tape

Anti-Static Cover Tape

(.10 mm (.004") Maximum Thickness)

178 mm (7.00")

or

330 mm (13.00")

*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.

Table 5 – Carrier Tape Conﬁguration – Embossed Plastic & Punched Paper (mm)

EIA Case Size

01005 – 0402

0603 – 1210

Tape Size (W)*

Pitch (P₁)*

8

2

4

1805 – 1808

12

16

8

4

≥ꢀ1812

8

KPS 1210

8

KPSꢀ1812ꢀ&ꢀ2220

Arrayꢀ0508ꢀ&ꢀ0612

12

4

*Refer to Figures 1 & 2 for W and P₁carrier tape reference locations.

*Refer to Tables 6 & 7 for tolerance speciﬁcations.

C1011_X7R_TIP_RING_SMD • 5/30/2013 11

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 1 – Embossed (Plastic) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

2

E

1

Po

ØDo

Ao

F

Ko

W

E

2

B

1

Bo

S

1

P

1

T

1

Embossment

For cavity size,

see Note 1 Table 4

Center Lines of Cavity

ØD

1

Cover Tape

is for tape feeder reference only,

including draft concentric about B

B

1

o

.

User Direction of Unreeling

Table 6 – Embossed (Plastic) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

D₁Minimum

Note 1

1.0

(0.039)

R Reference S₁Minimum

T

T₁

Tape Size

8 mm

D₀

E₁

P₀

P₂

Note 2

Note 3

Maximum

25.0

(0.984)

1.5 +0.10/-0.0

(0.059 +0.004/-0.0)

1.75 ±0.10

4.0 ±0.10

2.0 ±0.05

0.600

(0.024)

0.600

(0.024)

0.100

(0.004)

12 mm

16 mm

(0.069 ±0.004) (0.157 ±0.004) (0.079 ±0.002)

1.5

(0.059)

30

(1.181)

Variable Dimensions — Millimeters (Inches)

B₁Maximum

Note 4

4.35

(0.171)

E₂

T₂

W

Tape Size

8 mm

Pitchꢀ

F

P₁

A₀,B₀ꢀ&ꢀK₀

Minimum

6.25

(0.246)

Maximum

2.5

(0.098)

Maximum

8.3

(0.327)

3.5 ±0.05

(0.138 ±0.002) (0.157 ±0.004)

4.0 ±0.10

Single (4 mm)

Singleꢀ(4ꢀmm)ꢀ&ꢀ

8.2

10.25

5.5 ±0.05

8.0 ±0.10

4.6

12.3

12 mm

16 mm

Note 5

Double (8 mm)

(0.323)

(0.404)

(0.217 ±0.002) (0.315 ±0.004)

(0.181)

(0.484)

12.1

(0.476)

14.25

(0.561)

7.5 ±0.05 12.0 ±0.10

(0.138 ±0.002) (0.157 ±0.004)

4.6

(0.181)

16.3

(0.642)

Triple (12 mm)

1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and

hole location shall be applied independent of each other.

2. The tape with or without components shall pass around R without damage (see Figure 6).

3. If S₁< 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481 paragraph 4.3 section b).

4. B₁dimension is a reference dimension for tape feeder clearance only.

5. The cavity deﬁned by A₀, B₀and K₀shall surround the component with sufﬁcient clearance that:

(a) the component does not protrude above the top surface of the carrier tape.

(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3).

(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 4).

(e) for KPS Series product, A₀and B₀are measured on a plane 0.3 mm above the bottom of the pocket.

(f) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

C1011_X7R_TIP_RING_SMD • 5/30/2013 12

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 2 – Punched (Paper) Carrier Tape Dimensions

T

P2

[10 pitches cumulative

tolerance on tape ± 0.2 mm]

E

1

Po

ØDo

0

A

F

W

2

E

0

B

Bottom Cover Tape

P

1

G

Cavity Size,

See

1

T

1

T

Top Cover Tape

Center Lines of Cavity

Note 1, Table 7

Bottom Cover Tape

User Direction of Unreeling

Table 7 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

R Reference

Note 2

Tape Size

8 mm

D₀

E₁

P₀

P₂

T₁Maximum

0.10

G Minimum

1.5 +0.10 -0.0

(0.059 +0.004 -0.0)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002) (0.004) Maximum

0.75

(0.030)

25

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

Pitch

E2 Minimum

F

P₁

T Maximum

W Maximum

A₀B₀

2.0 ±0.05

(0.079 ±0.002)

4.0 ±0.10

8.3

(0.327)

8.3

Half (2 mm)

Single (4 mm)

6.25

(0.246)

3.5 ±0.05

(0.138 ±0.002)

1.1

(0.098)

Note 1

8 mm

(0.157 ±0.004)

(0.327)

1. The cavity deﬁned by A₀, B₀and T shall surround the component with sufﬁcient clearance that:

a) the component does not protrude beyond either surface of the carrier tape.

b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed.

c) rotation of the component is limited to 20° maximum (see Figure 3).

d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4).

e) see Addendum in EIA Standard 481 for standards relating to more precise taping requirements.

2. The tape with or without components shall pass around R without damage (see Figure 6).

C1011_X7R_TIP_RING_SMD • 5/30/2013 13

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: Theꢀtotalꢀpeelꢀstrengthꢀofꢀtheꢀcoverꢀtapeꢀfromꢀtheꢀcarrierꢀtapeꢀshallꢀbe:ꢀ

Tape Width

8 mm

Peel Strength

0.1 to 1.0 Newton (10 to 100 gf)

0.1 to 1.3 Newton (10 to 130 gf)

12 and 16 mm

Theꢀdirectionꢀofꢀtheꢀpullꢀshallꢀbeꢀoppositeꢀtheꢀdirectionꢀofꢀtheꢀcarrierꢀtapeꢀtravel.ꢀTheꢀpullꢀangleꢀofꢀtheꢀcarrierꢀtapeꢀshallꢀbeꢀ165°ꢀtoꢀ180°ꢀ

fromꢀtheꢀplaneꢀofꢀtheꢀcarrierꢀtape.ꢀDuringꢀpeeling,ꢀtheꢀcarrierꢀand/orꢀcoverꢀtapeꢀshallꢀbeꢀpulledꢀatꢀaꢀvelocityꢀofꢀ300ꢀ±10ꢀmm/minute.

3. Labeling:ꢀBarꢀcodeꢀlabelingꢀ(standardꢀorꢀcustom)ꢀshallꢀbeꢀonꢀtheꢀsideꢀofꢀtheꢀreelꢀoppositeꢀtheꢀsprocketꢀholes.ꢀRefer to EIA

Standards 556 and 624.

Figure 3 – Maximum Component Rotation

°

T

Maximum Component Rotation

Top View

Maximum Component Rotation

Side View

Typical Pocket Centerline

Tape

Maximum

°

T

s

Width (mm) Rotation (

)

8,12

16 – 200

20

10

Bo

Tape

Maximum

°

S

Width (mm) Rotation (

)

8,12

16 – 56

72 – 200

20

10

5

Typical Component Centerline

Ao

Figure 4 – Maximum Lateral Movement

Figure 5 – Bending Radius

Embossed

Carrier

Punched

Carrier

8 mm & 12 mm Tape

16 mm Tape

0.5 mm maximum

1.0 mm maximum

R

Bending

Radius

R

C1011_X7R_TIP_RING_SMD • 5/30/2013 14

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 6 – Reel Dimensions

Full Radius,

See Note

W3 (Includes

flange distortion

at outer edge)

Access Hole at

Slot Location

(Ø 40 mm minimum)

W

2 (Measured at hub)

D

(See Note)

A

N

C

(Arbor hole

W

1 (Measured at hub)

diameter)

If present,

tape slot in core

for tape start:

2.5 mm minimum width x

10.0 mm minimum depth

B

(see Note)

Note: Drive spokes optional; if used, dimensions B and D shall apply.

Table 8 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size

8 mm

A

B Minimum

C

D Minimum

178 ±0.20

(7.008 ±0.008)

or

330 ±0.20

(13.000 ±0.008)

1.5

(0.059)

13.0 +0.5/-0.2

(0.521 +0.02/-0.008)

20.2

(0.795)

12 mm

16 mm

Variable Dimensions — Millimeters (Inches)

Tape Size

8 mm

N Minimum

W₁

W₂Maximum

W₃

8.4 +1.5/-0.0

(0.331 +0.059/-0.0)

14.4

(0.567)

50

(1.969)

12.4 +2.0/-0.0

18.4

Shallꢀaccommodateꢀtapeꢀwidthꢀ

withoutꢀinterference

12 mm

16 mm

(0.488 +0.078/-0.0)

(0.724)

16.4 +2.0/-0.0

(0.646 +0.078/-0.0)

22.4

(0.882)

C1011_X7R_TIP_RING_SMD • 5/30/2013 15

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Figure 7 – Tape Leader & Trailer Dimensions

Embossed Carrier

Carrier Tape

Round Sprocket Holes

Punched Carrier

8 mm & 12 mm only

START

END

Top Cover Tape

Elongated Sprocket Holes

(32 mm tape and wider)

100 mm

Minimum Leader

400 mm Minimum

Trailer

160 mm Minimum

Components

Top Cover Tape

Figure 8 – Maximum Camber

Elongated sprocket holes

(32 mm & wider tapes)

Carrier Tape

Round Sprocket Holes

1 mm Maximum, either direction

Straight Edge

250 mm

C1011_X7R_TIP_RING_SMD • 5/30/2013 16

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

KEMET Corporation

World Headquarters

Europe

Asia

Southern Europe

Paris, France

Tel:ꢀ33-1-4646-1006ꢀ

Northeast Asia

Hong Kong

Tel:ꢀ852-2305-1168

2835 KEMET Way

Simpsonville, SC 29681

Sasso Marconi, Italy

Tel:ꢀ39-051-939111

Shenzhen,ꢀChina

Tel:ꢀ86-755-2518-1306

MailingꢀAddress:

P.O. Box 5928

Greenville, SC 29606

Beijing,ꢀChina

Central Europe

Tel:ꢀ86-10-5829-1711

www.kemet.com

Landsberg, Germany

Tel:ꢀ49-8191-3350800ꢀꢀ

Tel:ꢀ864-963-6300ꢀ

Fax:ꢀ864-963-6521

Shanghai,ꢀChina

Tel:ꢀ86-21-6447-0707

Kamen, Germany

Tel:ꢀ49-2307-438110

Corporate Ofﬁces

Fort Lauderdale, FL

Tel:ꢀ954-766-2800

Taipei, Taiwan

Tel:ꢀ886-2-27528585

Northern Europe

Bishop’sꢀStortford,ꢀUnitedꢀKingdomꢀ

Tel:ꢀ44-1279-460122ꢀ

North America

Southeast Asia

Singapore

Southeast

Tel:ꢀ65-6586-1900

Lake Mary, FL

Tel:ꢀ407-855-8886

Espoo, Finland

Tel:ꢀ358-9-5406-5000

Penang, Malaysia

Tel:ꢀ60-4-6430200

Northeast

Wilmington, MA

Tel:ꢀ978-658-1663ꢀ

Bangalore, India

Tel:ꢀ91-806-53-76817

Central

Novi, MI

Tel:ꢀ248-994-1030

West

Milpitas, CA

Tel:ꢀ408-433-9950

Mexico

Guadalajara, Jalisco

Tel:ꢀ52-33-3123-2141ꢀꢀ

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

C1011_X7R_TIP_RING_SMD • 5/30/2013 17

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Other KEMET Resources

Tools

Resource

Location

Con ꢀgureꢀAꢀPart:ꢀCapEdge

SPICEꢀ&ꢀFITꢀSoftware

http://capacitoredge.kemet.com

http://www.kemet.com/spice

http://www.kemet.com/keask

http://www.kemet.com:8080/elc

SearchꢀOurꢀFAQs:ꢀKnowledgeEdge

Electrolytic LifeCalculator

Product Information

Resource

Location

Products

TechnicalꢀResourcesꢀ(IncludingꢀSolderingꢀTechniques)

RoHS Statement

http://www.kemet.com/products

http://www.kemet.com/technicalpapers

http://www.kemet.com/rohs

QualityꢀDocuments

http://www.kemet.com/qualitydocuments

Product Request

Resource

Location

http://www.kemet.com/sample

http://www.kemet.com/kits

SampleꢀRequest

EngineeringꢀKitꢀRequest

Contact

Location

Website

Contact Us

Investor Relations

Call Us

www.kemet.com

http://www.kemet.com/contact

http://www.kemet.com/ir

1-877-MyKEMET

Twitter

http://twitter.com/kemetcapacitors

Disclaimer

Allꢀproductꢀspeci ꢀcations,ꢀstatements,ꢀinformationꢀandꢀdataꢀ(collectively,ꢀtheꢀ“Information”)ꢀinꢀthisꢀdatasheetꢀareꢀsubjectꢀtoꢀchange.ꢀTheꢀcustomerꢀisꢀresponsibleꢀforꢀcheckingꢀandꢀ

verifyingꢀtheꢀextentꢀtoꢀwhichꢀtheꢀInformationꢀcontainedꢀinꢀthisꢀpublicationꢀisꢀapplicableꢀtoꢀanꢀorderꢀatꢀtheꢀtimeꢀtheꢀorderꢀisꢀplaced.

AllꢀInformationꢀgivenꢀhereinꢀisꢀbelievedꢀtoꢀbeꢀaccurateꢀandꢀreliable,ꢀbutꢀitꢀisꢀpresentedꢀwithoutꢀguarantee,ꢀwarranty,ꢀorꢀresponsibilityꢀofꢀanyꢀkind,ꢀexpressedꢀorꢀimplied.

StatementsꢀofꢀsuitabilityꢀforꢀcertainꢀapplicationsꢀareꢀbasedꢀonꢀKEMETꢀElectronicsꢀCorporation’sꢀ(“KEMET”)ꢀknowledgeꢀofꢀtypicalꢀoperatingꢀconditionsꢀforꢀsuchꢀapplications,ꢀbutꢀareꢀ

notꢀintendedꢀtoꢀconstituteꢀ–ꢀandꢀKEMETꢀspeci ꢀcallyꢀdisclaimsꢀ–ꢀanyꢀwarrantyꢀconcerningꢀsuitabilityꢀforꢀaꢀspeci ꢀcꢀcustomerꢀapplicationꢀorꢀuse.ꢀTheꢀInformationꢀisꢀintendedꢀforꢀuseꢀonlyꢀ

byꢀcustomersꢀwhoꢀhaveꢀtheꢀrequisiteꢀexperienceꢀandꢀcapabilityꢀtoꢀdetermineꢀtheꢀcorrectꢀproductsꢀforꢀtheirꢀapplication.ꢀAnyꢀtechnicalꢀadviceꢀinferredꢀfromꢀthisꢀInformationꢀorꢀotherwiseꢀ

providedꢀbyꢀKEMETꢀwithꢀreferenceꢀtoꢀtheꢀuseꢀofꢀKEMET’sꢀproductsꢀisꢀgivenꢀgratis,ꢀandꢀKEMETꢀassumesꢀnoꢀobligationꢀorꢀliabilityꢀforꢀtheꢀadviceꢀgivenꢀorꢀresultsꢀobtained.

AlthoughꢀKEMETꢀdesignsꢀandꢀmanufacturesꢀitsꢀproductsꢀtoꢀtheꢀmostꢀstringentꢀqualityꢀandꢀsafetyꢀstandards,ꢀgivenꢀtheꢀcurrentꢀstateꢀofꢀtheꢀart,ꢀisolatedꢀcomponentꢀfailuresꢀmayꢀstillꢀ

occur.ꢀAccordingly,ꢀcustomerꢀapplicationsꢀwhichꢀrequireꢀaꢀhighꢀdegreeꢀofꢀreliabilityꢀorꢀsafetyꢀshouldꢀemployꢀsuitableꢀdesignsꢀorꢀotherꢀsafeguardsꢀ(suchꢀasꢀinstallationꢀofꢀprotectiveꢀ

circuitryꢀorꢀredundancies)ꢀinꢀorderꢀtoꢀensureꢀthatꢀtheꢀfailureꢀofꢀanꢀelectricalꢀcomponentꢀdoesꢀnotꢀresultꢀinꢀaꢀriskꢀofꢀpersonalꢀinjuryꢀorꢀpropertyꢀdamage.

Althoughꢀallꢀproduct–relatedꢀwarnings,ꢀcautionsꢀandꢀnotesꢀmustꢀbeꢀobserved,ꢀtheꢀcustomerꢀshouldꢀnotꢀassumeꢀthatꢀallꢀsafetyꢀmeasuresꢀareꢀindictedꢀorꢀthatꢀotherꢀmeasuresꢀmayꢀnotꢀ

beꢀrequired.

C1011_X7R_TIP_RING_SMD • 5/30/2013 18

Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – Telecom "Tip and Ring,” X7R Dielectric, 250 VDC, (Commercial Grade)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.06.07 14:35:04 -04'00'

C1011_X7R_TIP_RING_SMD • 5/30/2013 19


型号：	C1210C823KARACTM
厂家：	KEMET CORPORATION
描述：	Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, X7R, 15% TC, 0.082uF, Surface Mount, 1210, CHIP, ROHS COMPLIANT 电容器
文件：	总19页 (文件大小：769K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

C1210C823KARACTM [KEMET]

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