IXTK210P10T
更新时间:2024-09-18 14:17:11
品牌:IXYS
描述:Power Field-Effect Transistor, 210A I(D), 100V, 0.0075ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, PLASTIC PACKAGE-3
IXTK210P10T 概述
Power Field-Effect Transistor, 210A I(D), 100V, 0.0075ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, PLASTIC PACKAGE-3 功率场效应晶体管
IXTK210P10T 规格参数
是否Rohs认证: | 符合 | 生命周期: | Transferred |
零件包装代码: | TO-264AA | 包装说明: | FLANGE MOUNT, R-PSFM-T3 |
针数: | 3 | Reach Compliance Code: | compliant |
ECCN代码: | EAR99 | 风险等级: | 8.53 |
Is Samacsys: | N | 其他特性: | AVALANCHE RATED |
雪崩能效等级(Eas): | 3000 mJ | 外壳连接: | DRAIN |
配置: | SINGLE WITH BUILT-IN DIODE | 最小漏源击穿电压: | 100 V |
最大漏极电流 (Abs) (ID): | 210 A | 最大漏极电流 (ID): | 210 A |
最大漏源导通电阻: | 0.0075 Ω | FET 技术: | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码: | TO-264AA | JESD-30 代码: | R-PSFM-T3 |
元件数量: | 1 | 端子数量: | 3 |
工作模式: | ENHANCEMENT MODE | 最高工作温度: | 150 °C |
封装主体材料: | PLASTIC/EPOXY | 封装形状: | RECTANGULAR |
封装形式: | FLANGE MOUNT | 极性/信道类型: | P-CHANNEL |
最大功率耗散 (Abs): | 1040 W | 最大脉冲漏极电流 (IDM): | 800 A |
子类别: | Other Transistors | 表面贴装: | NO |
端子形式: | THROUGH-HOLE | 端子位置: | SINGLE |
晶体管应用: | SWITCHING | 晶体管元件材料: | SILICON |
Base Number Matches: | 1 |
IXTK210P10T 数据手册
通过下载IXTK210P10T数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。
PDF下载Preliminary Technical Information
TrenchPTM
Power MOSFETs
VDSS = - 100V
ID25 = - 210A
IXTK210P10T
IXTX210P10T
RDS(on)
≤
7.5mΩ
trr
≤
200ns
P-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Rectifier
TO-264 (IXTK)
Symbol
VDSS
Test Conditions
Maximum Ratings
G
D
S
TJ = 25°C to 150°C
TJ = 25°C to 150°C, RGS = 1MΩ
-100
-100
V
V
VDGR
Tab
VGSS
VGSM
Continuous
Transient
±15
±25
V
V
PLUS247 (IXTX)
ID25
TC = 25°C (Chip Capability)
- 210
A
ILRMS
IDM
Lead Current Limit, RMS
TC = 25°C, Pulse Width Limited by TJM
-160
- 800
A
A
IA
EAS
TC = 25°C
TC = 25°C
-100
3
A
J
G
D
S
Tab
dv/dt
PD
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C
TC = 25°C
10
V/ns
W
G = Gate
S = Source
D
= Drain
1040
Tab = Drain
TJ
TJM
Tstg
-55 ... +150
150
-55 ... +150
°C
°C
°C
Features
z
International Standard Packages
High Current Handling Capability
Avalanche Rated
Extended FBSOA
Fast Intrinsic Recitifier
Low RDS(ON) and QG
TL
TSOLD
1.6mm (0.062 in.) from Case for 10s
Plastic Body for 10s
300
260
°C
°C
z
z
z
Md
FC
Mounting Torque (TO-264)
Mounting Force (PLUS247)
1.13/10
Nm/lb.in.
N/lb.
z
z
20..120 /4.5..27
Weight
TO-264
PLUS247
10
6
g
g
Advantages
z
Easy to Mount
Space Savings
High Power Density
z
Symbol
Test Conditions
Characteristic Values
z
(TJ = 25°C Unless Otherwise Specified)
Min.
-100
- 2.5
Typ.
Max.
BVDSS
VGS(th)
IGSS
VGS = 0V, ID = - 250μA
VDS = VGS, ID = - 250μA
VGS = ±15V, VDS = 0V
VDS = VDSS, VGS = 0V
V
V
Applications
- 4.5
z
High-Side Switching
Push Pull Amplifiers
DC Choppers
Automatic Test Equipment
Current Regulators
Battery Charger Applications
±200 nA
z
z
IDSS
- 25 μA
z
TJ = 125°C
- 300 μA
z
RDS(on)
VGS = -10V, ID = 0.5 • ID25, Note 1
7.5 mΩ
z
DS100397A(01/13)
© 2013 IXYS CORPORATION, All Rights Reserved
IXTK210P10T
IXTX210P10T
Symbol
Test Conditions
Characteristic Values
TO-264 AA Outline
(TJ = 25°C Unless Otherwise Specified)
Min.
Typ.
Max.
gfs
VDS = -10V, ID = - 60A, Note 1
VGS = 0V, VDS = - 25V, f = 1MHz
90
150
S
Ciss
Coss
Crss
69.5
4070
1100
nF
pF
pF
td(on)
90
ns
Resistive Switching Times
VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
RG = 1Ω (External)
: 1 - Gate
2 - Drain
tr
98
ns
ns
3 - Source
4 - Drain
td(off)
165
Dim.
Millimeter
Inches
tf
55
ns
Min.
Max.
Min.
Max.
A
A1
A2
b
b1
b2
4.82
2.54
2.00
1.12
2.39
2.90
5.13
2.89
2.10
1.42
2.69
3.09
.190
.100
.079
.044
.094
.114
.202
.114
.083
.056
.106
.122
Qg(on)
Qgs
740
200
155
nC
nC
nC
VGS = -10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25
Qgd
c
D
E
e
0.53
25.91 26.16
19.81 19.96
5.46 BSC
0.83
.021
1.020
.780
.033
1.030
.786
RthJC
RthCS
0.12 °C/W
°C/W
0.15
.215 BSC
J
K
0.00
0.00
0.25
0.25
.000
.000
.010
.010
L
L1
20.32 20.83
.800
.090
.820
.102
2.29
2.59
P
Q
Q1
3.17
6.07
8.38
3.66
6.27
8.69
.125
.239
.330
.144
.247
.342
Source-Drain Diode
R
R1
S
T
3.81
1.78
6.04
1.57
4.32
2.29
6.30
1.83
.150
.070
.238
.062
.170
.090
.248
.072
Symbol
Test Conditions
Characteristic Values
(TJ = 25°C Unless Otherwise Specified)
Min.
Typ.
Max.
- 210
- 840
-1.4
IS
VGS = 0V
A
A
V
PLUS247TM Outline
ISM
VSD
Repetitive, Pulse Width Limited by TJM
IF = -100A, VGS = 0V, Note 1
trr
QRM
IRM
200 ns
IF = -105A, -di/dt = -100A/μs
930
12.4
nC
A
VR = -100V, VGS = 0V
Note
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
Terminals: 1 - Gate
2 - Drain
3 - Source
Dim.
Millimeter
Min. Max.
Inches
Min. Max.
A
A1
A2
4.83
2.29
1.91
5.21
2.54
2.16
.190 .205
.090 .100
.075 .085
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.
b
b1
b2
1.14
1.91
2.92
1.40
2.13
3.12
.045 .055
.075 .084
.115 .123
C
D
E
0.61
20.80 21.34
15.75 16.13
0.80
.024 .031
.819 .840
.620 .635
e
5.45 BSC
.215 BSC
L
L1
19.81 20.32
.780 .800
.150 .170
3.81
4.32
Q
R
5.59
4.32
6.20
4.83
.220 0.244
.170 .190
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS MOSFETs and IGBTs are covered
by one or more of the following U.S. patents: 4,860,072 5,017,508
4,881,106 5,034,796
4,835,592 4,931,844
5,049,961
5,063,307
5,187,117
5,237,481
5,381,025
5,486,715
6,162,665
6,259,123 B1
6,306,728 B1
6,404,065 B1 6,683,344
6,534,343
6,583,505
6,727,585
6,710,405 B2 6,759,692
6,710,463
7,005,734 B2 7,157,338B2
7,063,975 B2
6,771,478 B2 7,071,537
IXTK210P10T
IXTX210P10T
Fig. 2. Extended Output Characteristics @ TJ = 25ºC
Fig. 1. Output Characteristics @ TJ = 25ºC
-220
-200
-180
-160
-140
-120
-100
-80
-400
-350
-300
-250
-200
-150
-100
-50
VGS = -10V
VGS = -10V
- 7V
- 8V
- 7V
- 6V
- 6V
- 5V
- 4V
-60
- 5V
- 4V
-40
-20
0
0
0
0
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-1.4
-2.4
-350
0
-1
-2
-3
-4
-5
-6
-7
-8
-9
-10
VDS - Volts
VDS - Volts
Fig. 4. RDS(on) Normalized to ID = -105A Value vs.
Junction Temperature
Fig. 3. Output Characteristics @ TJ = 125ºC
-220
-200
-180
-160
-140
-120
-100
-80
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
VGS = -10V
VGS = -10V
- 8V
- 7V
I D = - 210A
- 6V
- 5V
I D = -105A
-60
-40
- 4V
-20
0
-0.4
-0.8
-1.2
-1.6
-2
-50
-25
0
25
50
75
100
125
150
VDS - Volts
TJ - Degrees Centigrade
Fig. 5. RDS(on) Normalized to ID = -105A Value vs.
Drain Current
Fig. 6. Maximum Drain Current vs.
Case Temperature
-180
-160
-140
-120
-100
-80
2.0
1.8
1.6
1.4
1.2
1.0
0.8
VGS = -10V
External Lead Current Limit
TJ = 125ºC
-60
TJ = 25ºC
-40
-20
0
-50
-25
0
25
50
75
100
125
150
-50
-100
-150
-200
-250
-300
TC - Degrees Centigrade
ID - Amperes
© 2013 IXYS CORPORATION, All Rights Reserved
IXTK210P10T
IXTX210P10T
Fig. 8. Transconductance
Fig. 7. Input Admittance
-300
-250
-200
-150
-100
-50
300
250
200
150
100
50
TJ = - 40ºC
25ºC
125ºC
TJ = 125ºC
25ºC
- 40ºC
0
0
-3.0
-3.5
-4.0
-4.5
-5.0
-5.5
-6.0
0
-50
-100
-150
ID - Amperes
-200
-250
-300
VGS - Volts
Fig. 9. Forward Voltage Drop of Intrinsic Diode
Fig. 10. Gate Charge
-350
-300
-250
-200
-150
-100
-50
-10
-9
-8
-7
-6
-5
-4
-3
-2
-1
0
VDS = - 50V
I D = -105A
I G = -1mA
TJ = 125ºC
TJ = 25ºC
0
-0.3
-0.4
-0.5
-0.6
-0.7
-0.8
-0.9
-1.0
-1.1
-1.2
-1.3
-1.4
0
100
200
300
400
500
600
700
VSD - Volts
QG - NanoCoulombs
Fig. 12. Forward-Bias Safe Operating Area
Fig. 11. Capacitance
100,000
10,000
1,000
-
1,000
RDS(on) Limit
100µs
C
iss
= 1 MHz
f
1ms
100
-
External Lead Current Limit
10ms
C
C
oss
10
-
100ms
TJ = 150ºC
DC
TC = 25ºC
Single Pulse
rss
-
1
1
10
-
100
-
-
0
-5
-10
-15
-20
-25
-30
-35
-40
VDS - Volts
VDS - Volts
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTK210P10T
IXTX210P10T
Fig. 14. Resistive Turn-on Rise Time vs.
Fig. 13. Resistive Turn-on Rise Time vs.
Junction Temperature
Drain Current
120
110
100
90
120
110
100
90
RG = 1Ω, VGS = -10V
DS = - 50V
RG = 1Ω, VGS = -10V
V
VDS = - 50V
I D = -100A
TJ = 125ºC
I D = - 50A
TJ = 25ºC
80
70
80
25
35
45
55
65
75
85
95
105
115
125
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
ID - Amperes
TJ - Degrees Centigrade
Fig. 15. Resistive Turn-on Switching Times vs.
Gate Resistance
Fig. 16. Resistive Turn-off Switching Times vs.
Junction Temperature
350
300
250
200
150
100
50
700
90
85
80
75
70
65
60
55
50
45
40
320
300
280
260
240
220
200
180
160
140
120
tf
t
d(off) - - - -
TJ = 125ºC, VGS = -10V
DS = - 50V
tf
t
d(off) - - - -
RG = 1Ω, VGS = -10V
DS = - 50V
600
500
400
300
200
100
0
V
V
I D = -100A
I D = - 50A
I D = -100A
I D = - 50A
0
25
35
45
55
65
75
85
95
105
115
125
1
2
3
4
5
6
7
8
9
10
RG - Ohms
TJ - Degrees Centigrade
Fig. 17. Resistive Turn-off Switching Times vs.
Drain Current
Fig. 18. Resistive Turn-off Switching Times vs.
Gate Resistance
90
80
70
60
50
40
300
260
220
180
140
100
500
400
300
200
100
0
1000
tf
t
d(off) - - - -
RG = 1Ω, VGS = -10V
DS = - 50V
tf
t
d(off) - - - -
TJ = 125ºC, VGS = -10V
VDS = - 50V
800
600
400
200
0
V
TJ = 125ºC
I D = - 50A
I D = -100A
TJ = 25ºC
-50
-55
-60
-65
-70
-75
-80
-85
-90
-95
-100
1
2
3
4
5
6
7
8
9
10
ID - Amperes
RG - Ohms
© 2013 IXYS CORPORATION, All Rights Reserved
IXTK210P10T
IXTX210P10T
Fig. 19. Maximum Transient Thermal Impedance
1
0.1
0.01
0.001
0.0001
0.00001
0.0001
0.001
0.01
0.1
1
10
Pulse Width - Seconds
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXYS REF: T_210P10T(A9) 10-18-11
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